JP4800770B2 - 硬化性組成物 - Google Patents
硬化性組成物 Download PDFInfo
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- JP4800770B2 JP4800770B2 JP2005516297A JP2005516297A JP4800770B2 JP 4800770 B2 JP4800770 B2 JP 4800770B2 JP 2005516297 A JP2005516297 A JP 2005516297A JP 2005516297 A JP2005516297 A JP 2005516297A JP 4800770 B2 JP4800770 B2 JP 4800770B2
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- 239000002253 acid Substances 0.000 description 2
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- 125000003710 aryl alkyl group Chemical group 0.000 description 2
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- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
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- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 2
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- 239000011701 zinc Substances 0.000 description 1
- UMVAHUBFIVIZAX-UHFFFAOYSA-N zinc cobalt(2+) 1,2-dimethoxyethane tetracyanide Chemical compound C(OC)COC.[C-]#N.[Zn+2].[Co+2].[C-]#N.[C-]#N.[C-]#N UMVAHUBFIVIZAX-UHFFFAOYSA-N 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/32—Polymers modified by chemical after-treatment
- C08G65/329—Polymers modified by chemical after-treatment with organic compounds
- C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Sealing Material Composition (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
- Confectionery (AREA)
- Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
- Glass Compositions (AREA)
Description
−Si(R1 3−a)Xa (1)
(R1は炭素数1から20のアルキル基、炭素数6から20のアリール基または炭素数7から20のアラルキル基を示し、Xは水酸基または加水分解性基を示す。aは1、2または3を示す。)
上記Xの例としては水素原子、ハロゲン原子、アルコキシ基、アシルオキシ基、ケトキシメート基、アミノ基、アミド基、酸アミド基、アミノオキシ基、メルカプト基、アルケニルオキシ基等が挙げられるが、加水分解性が穏やかで取り扱い易いという点からメトキシ基、エトキシ基、プロポキシ基、イソプロポキシ基等のアルコキシ基が特に好ましい。
CH2=C(R4)−R3−O− (2)
(式中R3は炭素数1から20の2価の有機基、R4は水素原子または炭素数10以下の炭化水素基)で示される不飽和基を末端に有するポリオキシプロピレン系重合体と、一般式(3):
H−Si(R1 3−a)Xa (3)
(式中R1,X,aは前記に同じ。)で示される反応性ケイ素基含有化合物とを、VIII族遷移金属触媒の存在下で反応させる方法が好ましい。
CH2=−C(R4)−R3−X2 (4)
(式中R3,R4は前記に同じ。X2はハロゲン原子)で示される不飽和基含有化合物を反応させる方法が挙げられる。
平均分子量約3,000のポリプロピレントリオールを開始剤とし、亜鉛ヘキサシアノコバルテートグライム錯体触媒にてプロピレンオキサイドの重合を行い、平均分子量12,000のポリオキシプロピレントリオールを得た。続いてこの水酸基末端ポリオキシプロピレンの水酸基に対して1.2倍当量のNaOMeのメタノール溶液を添加してメタノールを留去し、更に3−クロロ−1−プロペンを添加して末端の水酸基をアリル基に変換した。続いて、得られた重合体500gに対しヘキサン10gを加えて90℃で共沸脱水を行い、ヘキサンを減圧下留去した後、窒素置換した。これに対して白金ジビニルジシロキサン錯体(白金換算で3重量%のキシレン溶液)30μlを加え、撹拌しながら、ジメトキシメチルシラン(DMS)9.25gをゆっくりと滴下した。その混合溶液を90℃で2時間反応させた後、未反応のDMSを減圧下留去し反応性ケイ素基含有ポリオキシプロピレン重合体を得た。得られた重合体の1H−NMR分析より、末端への反応性ケイ素基導入率は83%であることを確認した(ポリマーA)。
表1に示す組成で配合物を作製し、塗布作業性、表面タック、ダンベル引張り物性、接着性の評価を実施した。
(1)塗布作業性:BH形粘度計を使用し、2rpmと20rpmでの粘度を測定した(7号ローター、温度23℃)。また、2rpmで測定した粘度値を20rpmで測定した粘度値で除し、構造粘性指数を算出した。
判定では、20rpm粘度が200Pa・s以下でかつ構造粘性指数が4.0以上を満足した場合を○、満足しなかった場合を×とした。
(2)表面タック:配合物を突出した後、経時で配合物表面を指で押さえ、タックが消失するまでの時間を測定した(温度23℃、相対湿度50%)。
判定では、タックが30分以内に消失した場合を○、消失しなかった場合を×とした。
(3)意匠性:配合物を突出した後表面を平滑にし、1晩静置した後の白粉の析出状態を観察した(温度23℃、相対湿度50%)。
硬化物表面を指で触り、白粉が付着しなかった場合を○、付着した場合を×とした。
(4)ダンベル引張り物性:厚さ約2mmの配合物シートを作製し、23℃で3日間、50℃で4日間養生した後、JIS K6251に記載の3号形ダンベル試験片を打ち抜き、引張り試験により強度(TB)と伸び(EB)を求めた。引張り速度200mm/分。
(5)接着性:水中へ一晩浸漬したモルタル(70×70×20mm)の表面を拭き取り、配合物をビード状に塗布し、23℃で7日間養生した。この際水位を約10mmに調整して系を密閉し表面の湿潤状態を保持した。養生後、硬化物を引き剥がして接着状態を観察した。
基材側へ硬化物が残った場合を○、残らなかった場合を×とした。
Claims (6)
- (A)反応性ケイ素基含有ポリオキシプロピレン系重合体100重量部、
(B)シランカップリング剤0.1〜20重量部、
(C)エポキシ基含有化合物0.1〜80重量部、
(D)3級アミン0.1〜60重量部、
(E)融点20℃以上の1級または2級アミン0.1〜30重量部
からなることを特徴とする硬化性組成物。 - (A)反応性ケイ素基含有ポリオキシプロピレン系重合体x重量部、
(B)シランカップリング剤0.1〜20重量部、
(D)3級アミン0.1〜60重量部、
(E)融点20℃以上の1級または2級アミン0.1〜30重量部
を含有するA剤(ただし、0<x≦100)と、
(A)反応性ケイ素基含有ポリオキシプロピレン系重合体100−x重量部、
(C)エポキシ基含有化合物0.1〜80重量部、
(F)水0.1〜5重量部
を含有するB剤
からなることを特徴とする2液型硬化性組成物。 - 組成物の粘度が23℃で50Pa・s以上200Pa・s以下、構造粘性指数が4.0以上10以下であることを特徴とする請求項1または2記載の硬化性組成物。
- (G)無機充填材50〜300重量部
を含有することを特徴とする請求項1〜3のいずれかに記載の硬化性組成物。 - (E)成分が1級アミンであることを特徴とする請求項1〜4のいずれかに記載の硬化性組成物。
- 請求項1〜5のいずれかに記載の硬化性組成物からなるコーティング材。
Priority Applications (1)
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JP2005516297A JP4800770B2 (ja) | 2003-12-18 | 2004-12-09 | 硬化性組成物 |
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JP2003421662 | 2003-12-18 | ||
JP2003421662 | 2003-12-18 | ||
PCT/JP2004/018350 WO2005059000A1 (ja) | 2003-12-18 | 2004-12-09 | 硬化性組成物 |
JP2005516297A JP4800770B2 (ja) | 2003-12-18 | 2004-12-09 | 硬化性組成物 |
Publications (2)
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JPWO2005059000A1 JPWO2005059000A1 (ja) | 2007-12-13 |
JP4800770B2 true JP4800770B2 (ja) | 2011-10-26 |
Family
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JP2005516297A Expired - Lifetime JP4800770B2 (ja) | 2003-12-18 | 2004-12-09 | 硬化性組成物 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7718749B2 (ja) |
EP (1) | EP1695989B1 (ja) |
JP (1) | JP4800770B2 (ja) |
AT (1) | ATE374227T1 (ja) |
DE (1) | DE602004009216T2 (ja) |
WO (1) | WO2005059000A1 (ja) |
Cited By (1)
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JP2019512026A (ja) * | 2016-02-15 | 2019-05-09 | シーカ テクノロジー アクチェンゲゼルシャフト | 建造物シーリングのための低放出性液体フィルム |
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US7647682B2 (en) * | 2004-06-17 | 2010-01-19 | Adams Marve D | Motor mount repair system and methods therefor |
JP2006022142A (ja) * | 2004-07-06 | 2006-01-26 | Yokohama Rubber Co Ltd:The | 硬化性樹脂組成物 |
JP4908775B2 (ja) * | 2004-07-16 | 2012-04-04 | 積水化学工業株式会社 | 室温硬化性組成物 |
DE602005010749D1 (de) * | 2005-01-11 | 2008-12-11 | Kaneka Corp | Härtbare zusammensetzung |
JP2007091931A (ja) * | 2005-09-29 | 2007-04-12 | Kaneka Corp | オルガノシロキサン変性ポリオキシアルキレン系重合体、および、該重合体を含有するパネル用接着剤 |
JP5025162B2 (ja) * | 2006-05-10 | 2012-09-12 | 株式会社カネカ | 硬化性組成物 |
DE102006061458B4 (de) | 2006-12-23 | 2014-06-18 | Bostik Gmbh | Verwendung einer selbstverlaufenden, wasserfreien Beschichtungsmasse und Fußboden, mit Laminat- oder Parkettpaneelen |
CN101679577A (zh) * | 2007-06-01 | 2010-03-24 | 建筑研究和技术有限公司 | 地板胶粘剂 |
DE102008043825A1 (de) | 2008-11-18 | 2010-05-20 | Wacker Chemie Ag | Verfahren zum Abdichten von Oberflächen |
US9266778B2 (en) * | 2008-11-21 | 2016-02-23 | Usg Interiors, Llc | Multi-layer acoustical plaster system |
JP5592273B2 (ja) * | 2009-01-16 | 2014-09-17 | 株式会社カネカ | 硬化性組成物およびその硬化物 |
DE102010028143A1 (de) | 2010-04-23 | 2011-10-27 | Wacker Chemie Ag | Beschichtungszusammensetzung zum Abdichten von Oberflächen |
MX2011006417A (es) * | 2010-06-24 | 2012-01-02 | Momentive Specialty Chem Inc | Sistemas de epoxi mejorados para materiales compuestos. |
CN106062083B (zh) * | 2014-01-23 | 2018-01-23 | 株式会社钟化 | 固化性组合物 |
EP3385297A1 (en) | 2017-04-04 | 2018-10-10 | 3M Innovative Properties Company | Epoxy-silicone hybrid sealant composition with low shrinkage and lower postcuring properties with chemical resistance for aerospace applications |
WO2021037349A1 (de) | 2019-08-28 | 2021-03-04 | Wacker Chemie Ag | Mehrkomponentige vernetzbare massen auf basis von organyloxysilanterminierten polymeren und epoxyfunktionellen verbindungen |
WO2024251789A1 (en) * | 2023-06-06 | 2024-12-12 | Sika Technology Ag | Thermally conductive curable composition |
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- 2004-12-09 WO PCT/JP2004/018350 patent/WO2005059000A1/ja active IP Right Grant
- 2004-12-09 JP JP2005516297A patent/JP4800770B2/ja not_active Expired - Lifetime
- 2004-12-09 AT AT04820528T patent/ATE374227T1/de not_active IP Right Cessation
- 2004-12-09 US US10/581,561 patent/US7718749B2/en not_active Expired - Fee Related
- 2004-12-09 DE DE602004009216T patent/DE602004009216T2/de not_active Expired - Lifetime
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JP7007282B2 (ja) | 2016-02-15 | 2022-01-24 | シーカ テクノロジー アクチェンゲゼルシャフト | 建造物シーリングのための低放出性液体フィルム |
Also Published As
Publication number | Publication date |
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US20070112145A1 (en) | 2007-05-17 |
WO2005059000A1 (ja) | 2005-06-30 |
EP1695989B1 (en) | 2007-09-26 |
US7718749B2 (en) | 2010-05-18 |
ATE374227T1 (de) | 2007-10-15 |
JPWO2005059000A1 (ja) | 2007-12-13 |
EP1695989A4 (en) | 2007-02-28 |
EP1695989A1 (en) | 2006-08-30 |
DE602004009216D1 (de) | 2007-11-08 |
DE602004009216T2 (de) | 2008-06-26 |
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