JP4594041B2 - Component mounting method - Google Patents

Description

  The present invention relates to a component mounting method, and more particularly to a component mounting method used in a component mounter for mounting a component on a board.

  2. Description of the Related Art Conventionally, in a component mounting machine such as a flip chip bonder for mounting a component such as an IC chip on an electronic substrate, the component is mounted by adsorbing the component from a component supply unit and mounting the component on the substrate.

In such a component mounting machine, a single plate is divided into a uniform number of trays and a plurality of component types of trays are placed (for example, see Patent Document 1).
JP-A-3-257895

  However, depending on the number of trays, etc., the ratio of the number of components mounted on the board and the number of parts on the plate are extremely different, so that as the board is produced, the plates are frequently replaced. Thus, there was a problem that the production efficiency was lowered.

  In order to adjust such a problem, even if an empty tray (hereinafter referred to as “empty tray”) in which no parts are stored is provided on the plate, there has been no concept of an empty tray. For this reason, the component mounter performs image recognition on all tray pockets, and determines whether or not an electronic component is stored in the pocket and then sucks the electronic component. For this reason, image recognition is performed even on the pocket of the empty tray, and it has been noticed that no electronic component is stored for the first time. For this reason, useless image recognition processing has occurred, and there has been a problem that production efficiency is lowered.

  Further, conventionally, in order to avoid complication of component mounting processing, there is a restriction that components can be arranged only in units of four trays, for example. For this reason, as the substrate is produced, there is a problem that the plate is frequently exchanged and the production efficiency is lowered.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a component mounting method and the like that can improve production efficiency by a component mounting machine.

In order to achieve the above object, a component mounting method according to the present invention is a component mounting method in a component mounter for mounting a component on a board, and the component mounter includes a component supply unit for storing the component. The component supply unit includes a plate, and a plurality of trays can be placed on the plate. Each of the plurality of trays is a tray or component in which a plurality of components of the same type are stored. Is an empty tray that is not stored, based on the arrangement information receiving step that receives arrangement information indicating the type and arrangement position of the tray arranged on the plate, and the arrangement information received in the arrangement information receiving step A mounting step of mounting the component on the board, and the arrangement information further acquires a component type and number of components mounted on the substrate, and a component type Each time, the number of parts per tray is acquired, and the plate is not changed during the component mounting operation on the board based on the acquired type and number of parts and the number of parts per tray. The ideal tray ratio per plate, which is the ratio of the number of trays of various mounted parts, is calculated, the type and number of trays are calculated based on the ideal tray ratio, and the same based on the calculated tray type and number It is the arrangement information in which the tray arrangement is determined so that the component type trays are arranged adjacent to each other.

  According to this structure, the kind and arrangement position of the tray arrange | positioned on the said plate can be set freely. For this reason, there is no restriction on the arrangement of the tray on the plate, and it becomes possible to arrange the tray so that the plate is not changed as much as possible as the board is produced. Efficiency can be improved.

In addition, the arrangement information includes information indicating the arrangement position of a tray in which a plurality of parts of the same type are stored or an empty tray. In the mounting step, the tray in which a plurality of parts of the same type are stored. There row adsorption operation of parts only with respect to the arrangement position of the may also be characterized by mounting the component on the substrate.

  By storing the arrangement position of the empty tray in advance as arrangement information, it is possible to prevent a wasteful operation of performing image recognition on the pocket of the empty tray when components are mounted. For this reason, the production efficiency by a component mounting machine can be improved.

  In addition, the component mounting method described above further includes the type and number of components mounted on the board, the number of trays that can be placed on the plate, and the type and number of components that can be stored in one tray. And an arrangement information determining step for determining the arrangement information based on the above.

  The ratio of the number of components mounted on the board and the number of components on the plate are not extremely different. For this reason, as the board is produced, the tray can be arranged so that the plate is not changed as much as possible, and the production efficiency by the component mounting machine can be improved.

  Furthermore, the component mounting method described above may further include an arrangement information changing step for changing the determined arrangement information.

  The type and arrangement position of the tray arranged on the plate determined by the above-described method are not always the best. For this reason, the production efficiency by the component mounting machine can be further improved by changing the arrangement position.

  The present invention can be realized not only as such a component mounting method, but also as a program for causing a computer to execute the steps included in the component mounting method. Needless to say, such a program can be distributed via a recording medium such as a CD-ROM or a communication network such as the Internet.

  According to the present invention, the production efficiency by the component mounter can be improved.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is an external view of a flip chip bonder according to the present embodiment.

  The flip chip bonder of the present embodiment is held by the reversing head unit 110 and the reversing head unit 110, which take out the electronic components from the plate 160 and then hold the electronic components upside down so that they can be mounted. A mounting head unit 120 that sucks the electronic component and mounts the electronic component on the substrate; a recognition unit 130 that is an imaging device that recognizes the state of the sucked electronic component and the state of the substrate on which the electronic component is mounted; A stage unit 140 that holds and positions the substrate, a substrate transport unit 150 that transports the substrate to the stage unit 140, and a component storage unit 170 that stores a plurality of plates 160 are provided.

FIG. 2 is an external view showing an example of the component storage unit 170.
FIG. 2 shows the component storage unit 170 with the lid 172 opened. A plurality of plates 160 are stacked and arranged inside the component storage unit 170. Each plate 160 is provided with a rail (not shown) between the plates 160 so that they do not contact each other. The plate 160 slides on the rails one by one and is transported to the transport position of the plate 160 shown in FIG. 1, the electronic components are sucked from the plate 160, and the electronic components are mounted on the substrate. .

  When the electronic component is mounted at the transport position of the plate 160, the plate 160 is again returned to the predetermined position of the component storage unit 170, and the other plate 160 slides on the rail as shown in FIG. The plate 160 is conveyed to the conveyance position, and the electronic component mounting process is continued.

FIG. 3 is an external view showing an example of the plate 160.
On the plate 160, a plurality of (here, four) trays 162 are placed and fixed. The sizes of the trays 162 are all the same.

  The tray 162 is provided with a plurality of pockets 164, and 11 electronic components are accommodated in one pocket. The size of the pocket 164 varies depending on the size of the electronic component. Note that electronic components of the same type are stored in one tray 162. For this reason, the number of electronic components stored in the tray 162 differs for each type of electronic component.

  FIG. 4 is a block diagram showing the configuration of the component supply setting processing apparatus in the flip chip bonder according to the embodiment of the present invention. This component supply setting processing apparatus may be inside the flip chip bonder or may be provided separately from the flip chip bonder.

  The component supply setting processing device is a processing device that sets the arrangement of the trays 162 on each plate 160. The input unit 210, the tray arrangement calculation unit 220, the component information storage unit 230, the display unit 240, the tray arrangement reconfiguration unit, and the like. A setting unit 250 and a tray arrangement storage unit 260 are provided.

  The input unit 210 is a processing unit for inputting various data to the component supply setting processing device, and includes a keyboard, a mouse, and the like.

  The component information storage unit 230 is a storage device that stores the mounted component information 232 and the tray information 234.

  FIG. 5 is a diagram illustrating an example of the mounted component information 232. The mounted component information 232 indicates a set of the types of components mounted on one electronic board and the number of components. For example, there are three, two, and four parts of types A, B, and C (hereinafter referred to as “part A”, “part B”, and “part C”, respectively) on one electronic board. Shown to be implemented.

  FIG. 6 is a diagram illustrating an example of the tray information 234. The tray information 234 indicates the number of parts included in one tray 162. For example, the tray 162 in which the part A is stored indicates that 100 parts are stored. Further, it is shown that 200 parts are stored in the tray 162 in which the part C is stored.

Referring to FIG. 4 again, the configuration of the component supply setting processing device will be described.
The tray arrangement calculation unit 220 is a processing unit that calculates the arrangement of the tray 162 on the plate 160 based on the mounted component information 232 and the tray information 234 stored in the component information storage unit 230.

  The tray arrangement resetting unit 250 is a processing unit that resets the arrangement of the trays 162 calculated by the tray arrangement calculating unit 220.

  The display unit 240 is a display device for displaying various data, and includes a CRT (Cathode Ray Tube), a liquid crystal display device, or the like.

  The tray arrangement storage unit 260 is a storage device that stores the tray arrangement information 262. The tray arrangement information 262 is information indicating whether or not to place a tray of the component type at each tray arrangement position on the plate.

  Next, processing for setting the arrangement of the tray 162 on each plate 160 using the component supply setting processing device will be described. In the following description, as shown in FIG. 7, it is assumed that three components A, two components B, and four components C are mounted on one board. Further, as shown in FIG. 8, it is assumed that 16 trays 162 are arranged on one plate 160. Further, it is assumed that the number of parts A stored in one tray 162 is 100, the number of parts B is 100, and the number of parts C is 200.

FIG. 9 is a flowchart of processing executed by the component supply setting processing device.
The tray arrangement calculation unit 220 acquires the type and number of components mounted on the board (S2). For example, the user uses the input unit 210 to input the type and number of parts to the tray arrangement calculation unit 220. The input data is stored in the component information storage unit 230 as mounting component information 232 as shown in FIG. Instead of the user inputting data, the mounted component information 232 may be stored in advance in the component information storage unit 230, and the tray arrangement calculation unit 220 may read it out.

  Next, the tray arrangement calculation unit 220 acquires the number of components stored in one tray 162 for each type of component mounted on the board (S4). For example, the user inputs the number of components stored in one tray 162 using the input unit 210. The input data is stored in the component information storage unit 230 as tray information 234 as shown in FIG. Instead of the user inputting data, the tray information 234 may be stored in advance in the component information storage unit 230, and the tray arrangement calculation unit 220 may read it.

  Next, the tray arrangement calculation unit 220 calculates an ideal tray ratio per plate based on the mounted component information 232 and the tray information 234 (S6). Here, the “ideal tray ratio per plate” means that when an arbitrary number of trays 162 can be placed in one plate 160, the plate 160 can be replaced in the middle of component mounting on the board. This refers to the ratio of the number of trays 162 of mounting parts that do not occur.

  The ideal tray ratio is calculated as follows. Let X (A) be the number of components A mounted on the substrate, X (B) be the number of components B, and X (C) be the number of components C. Further, the number of parts A stored in one tray 162 is Y (A), the number of parts B is Y (B), and the number of parts C is Y (C). Then, the ideal tray ratio is expressed by the following equation.

(X (A) / Y (A)): (X (B) / Y (B)): (X (C) / Y (C))
Here, from the mounting component information 232 and the tray information 234 shown in FIGS. 5 and 6, respectively,
X (A) = 3
X (B) = 2
X (C) = 4
Y (A) = 100
Y (B) = 100
Y (C) = 200
It is.

For this reason, the ideal tray ratio is
(3/100): (2/100): (4/200)
= 3: 2: 2
Is required.

  Next, the tray arrangement calculating unit 220 calculates the type and number of trays arranged on the plate 160 based on the obtained ideal tray ratio (S8). The above calculation is performed as follows. That is, the ideal tray ratio is R (A): R (B): R (C), and the number of trays for parts A, B, and C is T (A), T (B), and T (C). To do. In addition, when the total number of trays 162 that can be arranged on one plate 160 is TN, the number of trays arranged for each component is obtained by the following equation.

T (A) = TN × R (A) / (R (A) + R (B) + R (C))
T (B) = TN × R (B) / (R (A) + R (B) + R (C))
T (C) = TN × R (C) / (R (A) + R (B) + R (C))
According to this formula:
T (A) = 16 × 3 / (3 + 2 + 2) = 6.86
T (B) = 16 × 2 / (3 + 2 + 2) = 4.57
T (C) = 16 × 2 / (3 + 2 + 2) = 4.57
It becomes. Therefore, if the number of trays arranged on the plate 160 is set to T (A) to T (C) for each component type, it is not necessary to replace the plate 160 during the mounting of the component on the substrate. However, the number of trays that can be arranged on the plate 160 must be an integer value. For this reason, the decimal places of T (A) to T (C) are rounded down,
T (A) = 6
T (B) = 4
T (C) = 4
And In addition, an empty tray that does not store electronic components can be disposed on the plate 160. The number of empty trays ETN is calculated as follows.

ETN = TN−T (A) −T (B) −T (C)
That is, ETN = 16-6-4-4
= 2
Is calculated.

  Next, the tray arrangement calculation unit 220 determines a recommended tray arrangement based on the number of trays calculated by the tray arrangement calculation unit 220 (S10).

  Here, in order to arrange the trays 162 of the same component type as close as possible, from the upper left corner of the plate 160 toward the lower right corner, the tray 162 for the component A, the tray 162 for the component B, the tray 162 for the component C, and Assume that empty trays will be placed. Note that the arrangement method of the tray 162 is not limited to this.

  FIG. 10 is a diagram illustrating an example of the recommended tray arrangement determined according to the above-described method. That is, three trays 162 from the left in the first row of the trays 162 are arranged with the component 162 trays, and one of the right ends is provided with an empty tray. The tray arrangement in the second row is the same as the tray arrangement in the first row. In addition, a tray 162 for component B is arranged in the third row, and a tray 162 for component C is arranged in the fourth row.

  The tray arrangement calculation unit 220 displays the recommended tray arrangement on the display unit 240 (S12). For example, a recommended tray arrangement as shown in FIG. 11 is displayed on the display unit 240. The recommended tray arrangement shown in FIG. 11 is a recommended tray arrangement for four plates 160.

  The user can change the tray arrangement using the input unit 210 while viewing the recommended tray displayed on the display unit 240 (S14). For example, as shown in FIG. 12, the position of the tray 162 of the part B in the third row and the tray 162 of the part C in the fourth row of each plate 160 are switched, so that the tray 162 of the part B and the tray 162 of the part C are You may make it arrange | position in the vicinity, respectively.

  Further, as shown in FIG. 13, the tray 162 may be exchanged between the plates 160 and the arrangement position may be exchanged. 13 shows a result after the empty tray of the first plate 160 and the tray 162 of the part A of the second plate 160 are exchanged from the recommended tray arrangement shown in FIG.

  When the tray arrangement is reset by the user as described above, the tray arrangement resetting unit 250 stores the reset tray arrangement information 262 in the tray arrangement storage unit 260 (S16).

  FIG. 14 is a diagram illustrating an example of the tray arrangement information 262 created based on the tray arrangement shown in FIG. Here, as shown in FIG. 15, numbers 1 to 16 are assigned to the trays 162 on the plate 160. As illustrated in FIG. 14, the tray arrangement information 262 includes a plate number indicating the number of plates 160, a tray number indicating the position of the tray 162 on the plate 160, and the names of components stored in the tray 162. It shows. For example, it is shown that the tray 162 of the part A is arranged at the first tray position of the first plate.

  As described above, the tray arrangement information 262 is determined. Based on the determined tray arrangement information 262, the plate 160 in which the tray 162 is stored is stored in the component storage unit 170.

  Hereinafter, the flip chip bonder mounts the electronic components on the substrate while taking out the plate 160 arranged in the component storage unit 170. At this time, referring to the tray arrangement information 262, the flip chip bonder is mounted on the substrate. Mount electronic components on In this way, it is not necessary to perform image recognition on the empty tray portion. In addition, it is possible to know in advance which type of component is placed on which tray 162.

  As described above, according to the present embodiment, one plate can be freely divided into arbitrary regions. For this reason, for example, by dividing according to the ratio of components, it is possible to determine the arrangement of trays that minimizes the number of plate replacements. For this reason, the production efficiency of a board | substrate can be improved.

  In addition, an empty area can be created on the plate, and the arrangement position of the empty area can be used for component mounting as tray arrangement information. For this reason, production efficiency can be improved without causing unnecessary movement of the component suction head.

  The present invention can be applied to a component mounter, and in particular, can be applied to a component mounter that mounts a component on a substrate such as a flip chip bonder.

It is an external view of the flip chip bonder according to the present embodiment. It is an external view which shows an example of a components storage part. It is an external view which shows an example of a plate. It is a block diagram which shows the structure of the components supply setting processing apparatus in the flip chip bonder which concerns on embodiment of this invention. It is a figure which shows an example of mounting component information. It is a figure which shows an example of tray information. It is a figure which shows an example of the board | substrate with which components were mounted. It is the figure which showed typically the relationship between a plate and a tray. It is a flowchart of the process which a components supply setting processing apparatus performs. It is a figure which shows an example of a recommended tray arrangement | positioning. It is a figure which shows an example of the recommended tray arrangement | positioning displayed on a display part. It is a figure which shows an example of the recommended tray arrangement | positioning displayed on the display part after changing the arrangement position of a tray. It is a figure which shows another example of the recommended tray arrangement | positioning displayed on the display part after changing the arrangement position of a tray. It is a figure which shows an example of tray arrangement information. It is a figure explaining the number attached | subjected to the tray on a plate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 110 Reverse head part 120 Mounting head part 130 Recognition part 140 Stage part 150 Substrate conveyance part 160 Plate 162 Tray 164 Pocket 170 Component storage part 172 Lid 210 Input part 220 Tray arrangement | positioning calculation part 230 Component information storage part 232 Mounting part information 234 Tray information 240 Display Unit 250 Tray Arrangement Resetting Unit 260 Tray Arrangement Storage Unit 262 Tray Arrangement Information

Claims (7)

A component mounting method in a component mounter for mounting components on a board,
The component mounter includes a component supply unit that stores the component,
The component supply unit includes a plate,
A plurality of trays can be placed on the plate,
Each of the plurality of trays is a tray in which a plurality of parts of the same type are stored or an empty tray in which no parts are stored,
An arrangement information receiving step for receiving arrangement information indicating a type and an arrangement position of a tray arranged on the plate;
A mounting step of mounting the component on the board based on the placement information received in the placement information receiving step;
The arrangement information further acquires the type and number of components mounted on the board, acquires the number of components per tray for each component type, and acquires the acquired type of components, the number of components, and the number of trays. Based on the number of components, an ideal tray ratio per plate, which is the ratio of the number of trays of mounted components that does not cause plate replacement during the component mounting operation on the substrate, is calculated. Based on the above, the type and number of trays are calculated, and based on the calculated type and number of trays, the tray arrangement is determined so that trays of the same component type are arranged adjacent to each other. Component mounting method. The arrangement information includes information indicating an arrangement position of a tray in which a plurality of parts of the same type are stored or an empty tray,
The component is mounted on the substrate by performing a component suction operation only on a tray arrangement position in which a plurality of components of the same type are stored in the mounting step. Component mounting method. Further, based on the type and number of components mounted on the substrate, the number of trays that can be arranged on the plate, and the type and number of components that can be stored in one tray, the arrangement information is obtained. The component mounting method according to claim 1, further comprising an arrangement information determining step for determining. The component mounting method according to claim 3, further comprising an arrangement information changing step of changing the determined arrangement information. In a component mounter that mounts components on a board, a program for controlling the mounting of components,
A program for causing a computer to execute the steps included in the component mounting method according to any one of claims 1 to 4. In a component mounter for mounting a component on a board, a computer-readable recording medium recording a program for controlling the mounting of the component,
A computer-readable recording medium, wherein the program according to claim 5 is recorded. In a component mounter that mounts components on a board, a supply component arrangement determination method for determining the arrangement of components in a component supply unit in which components to be supplied are arranged,
The component mounter includes a component supply unit that stores the component,
The component supply unit includes a plate,
A plurality of trays can be placed on the plate,
Each of the plurality of trays is a tray in which a plurality of parts of the same type are stored or an empty tray in which no parts are stored,
An arrangement information receiving step for receiving arrangement information indicating a type and an arrangement position of a tray arranged on the plate;
A storage step for storing the arrangement information,
The arrangement information further acquires the type and number of components mounted on the board, acquires the number of components per tray for each component type, and acquires the acquired type of components, the number of components, and the number of trays. Based on the number of components, an ideal tray ratio per plate, which is the ratio of the number of trays of mounted components that does not cause plate replacement during the component mounting operation on the substrate, is calculated. Based on the above, the type and number of trays are calculated, and based on the calculated type and number of trays, the tray arrangement is determined so that trays of the same component type are arranged adjacent to each other. Supply part arrangement determination method.

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