JP4534025B2 - Appearance inspection apparatus and conveyance section for appearance inspection apparatus - Google Patents

Description

  The present invention relates to an appearance inspection apparatus and a conveyance section for an appearance inspection apparatus.

  Recent electronic parts such as semiconductor devices have been miniaturized. For example, the diameter and pitch of solder bumps have also been miniaturized like electronic parts such as semiconductor devices such as BGA, CSP, and WLCSP. Since the main body of the device has been downsized as represented by a mobile phone, the downsizing of the semiconductor device will be further advanced, and accordingly, the measurement capability of the visual inspection device and the expansion of inspection items are required. On the other hand, there is a strong demand for cost reduction of electronic parts such as semiconductor devices, and it is important for cost reduction and construction of an optimal production line for semiconductor manufacturing equipment and semiconductor inspection equipment related to the cost of electronic parts such as semiconductor devices. There is also a need for downsizing that can reduce the installation area.

  Against the background as described above, the configuration of the handler of the conventional visual inspection apparatus is as shown in FIGS.

  The configuration of the handler of the conventional appearance inspection apparatus will be described with reference to FIGS. 4 and 5. 4 shows a top view of a conventional appearance inspection apparatus, and FIG. 5 shows a perspective view of the conventional appearance inspection apparatus.

  The appearance inspection apparatus 200 includes a supply tray 203, a supply-side intermediate stage 217, a first hand unit 213 that conveys the supply tray 203 to the supply-side intermediate stage 217, a top surface imaging camera 207, an X direction, A three-dimensional moving stage 202 that can move in three directions, Y direction and Z direction, a three-dimensional inspection unit intermediate stage 218, and a second hand that conveys from the supply-side intermediate stage 217 to the three-dimensional inspection unit intermediate stage 218 Unit 214, front / back reversing unit 201, three-dimensional inspection unit 206, storage-side intermediate stage 219, third hand 215 for transporting from the three-dimensional inspection unit intermediate stage 218 to the storage-side intermediate stage 219, and storage A fourth hand 216 that conveys from the side intermediate stage 219 to the storage unit, a lower surface imaging camera 208, a non-defective storage tray 204, The non-defective product storage tray 205, the first XY stage 209 that supports the first hand unit 213, the second X stage 210 that supports the second hand unit 214, and the third hand unit 215 that supports the third hand unit 215. 3 X stages 211, a fourth XY stage 212 that supports the fourth hand part 216, and a suction part 220 provided at the tip of each hand part.

  Hereinafter, the operation of transporting the inspection object (for example, an electronic component such as a BGA type semiconductor device) 221 of the conventional appearance inspection apparatus 200 will be described with reference to FIGS.

  First, an inspection object (for example, a BGA type semiconductor) is stored by the first hand unit 213 from a state in which the inspection object is stored in the supply tray 203 with the upper surface (for example, a marking surface of an electronic component such as a BGA type semiconductor device) facing upward. (Electronic component such as a device) 221 is taken out.

  Next, the inspection object 221 is transported to the supply-side intermediate stage 217 by the first transport hand 213.

  Next, a two-dimensional inspection of the upper surface (for example, the marking surface) of the inspection object 221 is performed by the upper surface imaging camera 207 on the supply side intermediate stage 217.

  Next, the inspection object 221 is transported to the three-dimensional inspection unit intermediate stage 218 by the second hand unit 214.

  Next, the lower surface (the ball surface in the case of an electronic component such as a BGA type semiconductor device) 221 on the inspection object (for example, an electronic component such as a BGA type semiconductor device) 221 on the intermediate stage 218 of the three-dimensional inspection unit 218 Then, the inspection object 221 is placed on the three-dimensional moving stage 202.

  Next, the lower surface (BGA type semiconductor device) of the inspection object (for example, an electronic component such as a BGA type semiconductor device) 221 at a height necessary for the three-dimensional moving stage 202 to move upward and perform three-dimensional measurement. In the case of an electronic component, the ball surface) is positioned.

  Next, the three-dimensional moving stage 202 moves to measure all of the lower surface of the inspection object (for example, an electronic component such as a BGA type semiconductor device) 221 (or a ball surface in the case of an electronic component such as a BGA type semiconductor device). 3D measurement is performed while moving the position in the XY direction.

  After the three-dimensional measurement, the bottom surface of the inspection object (for example, an electronic component such as a BGA type semiconductor device) 221 on the three-dimensional moving stage 202 (the ball surface in the case of an electronic component such as a BGA type semiconductor device) 221 is turned upside down. And then placed on the intermediate stage 218 of the three-dimensional inspection unit.

  Next, the inspection object 221 is transferred to the storage-side intermediate stage 219 by the third transfer hand 215.

  Next, the inspection object 221 is transferred to the storage unit by the fourth transfer hand 216.

  Two-dimensional lower surface (ball surface in the case of electronic parts such as BGA type semiconductor devices) 221 with respect to the inspection object (for example, electronic parts such as BGA type semiconductor devices) 221 in the state of being attracted by the fourth hand 216 The inspection is performed by the lower surface imaging camera 208.

  Reflecting all inspection results, the inspection object (for example, an electronic component such as a BGA type semiconductor device) 221 is moved to and stored in the non-defective product storage tray 204 or the defective product storage tray 205.

  However, the transport system of the conventional visual inspection apparatus shown in FIGS. 4 and 5 performs two-dimensional upper surface measurement (IC marking measurement), two-dimensional lower surface measurement (IC lower surface or ball surface measurement), and three-dimensional measurement. Since this is a configuration and requires a large number of hands, there are problems that the number of components is large and the manufacturing cost of the apparatus is high.

  In addition, as described above, the number of components is large, and the supply unit → two-dimensional top surface measurement → front / reverse inversion → three-dimensional measurement and three-dimensional stage movement → front / back reversal → two-dimensional bottom surface measurement → to pass in the flow of the measurement unit In addition, since a plurality of hand units and a plurality of intermediate stages are required, there is a problem that an installation area becomes large.

According to the present invention,
An appearance inspection apparatus having a three-dimensional inspection unit,
A first stage unit capable of moving in the X, Y and Z directions;
A horizontal rotary transport unit having two arm portions extending in opposite directions and fixed to the first stage unit so as to be rotatable in a horizontal direction;
An adsorption part provided at each of the tips of the arm parts, each of which adsorbs an inspection object individually;
Including
The arm portion can be rotated 180 degrees around the extending direction;
The horizontal rotation conveyance unit conveys the inspection object to the three-dimensional inspection unit, and conveys the inspection object inspected by the three-dimensional inspection unit from the three-dimensional inspection unit. An inspection device is provided.

  According to the present invention, the horizontal rotation conveyance unit conveys the inspection object to the first stage while reversing the front and back, and conveys the inspection object after completion of the three-dimensional inspection from the first stage while reversing the front and back. Therefore, it is possible to provide an appearance inspection apparatus with a small number of parts, a low manufacturing cost, and a compact and small installation area.

Moreover, according to the present invention,
A conveyance unit for an appearance inspection apparatus having a three-dimensional inspection unit,
A first stage unit capable of moving in the X, Y and Z directions;
A horizontal rotary transport unit having two arm portions extending in opposite directions and fixed to the first stage unit so as to be rotatable in a horizontal direction;
An adsorption part provided at each of the tips of the arm parts, each of which adsorbs an inspection object individually;
Including
The arm portion can be rotated 180 degrees around the extending direction;
The horizontal rotation conveyance unit conveys the inspection object to the three-dimensional inspection unit, and conveys the inspection object inspected by the three-dimensional inspection unit from the three-dimensional inspection unit. An inspection apparatus transport unit is provided.

  According to the present invention, the horizontal rotation conveyance unit conveys the inspection object to the first stage while reversing the front and back, and conveys the inspection object after completion of the three-dimensional inspection from the first stage while reversing the front and back. Therefore, it is possible to provide a conveyance unit for an appearance inspection apparatus that has a small number of parts, a low manufacturing cost, and is compact and has a small installation area.

  According to the present invention, there are provided an appearance inspection apparatus and an appearance inspection apparatus transport unit that have a small number of parts, a low manufacturing cost, and are compact and have a small installation area.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

  A configuration of the appearance inspection apparatus 100 according to the present embodiment will be described with reference to FIGS. 1 to 3.

  FIG. 1 shows a top view of the appearance inspection apparatus 100, and FIGS. 2 and 3 show perspective views of main parts of the appearance inspection apparatus 100.

  As shown in FIGS. 1 to 3, the appearance inspection apparatus 100 includes a three-dimensional movement stage (first stage) 103 that can move in the X direction, the Y direction, and the Z direction, and an inspection object (for example, BGA type). A supply-side intermediate stage (second stage) 114 on which an electronic component (such as a semiconductor device) 122 is placed; and a supply hand unit 112 that conveys the inspection object 122 from the supply tray 104 to the supply-side intermediate stage (second stage) 114; , A top imaging camera 108 that is a two-dimensional inspection unit that captures a two-dimensional image of the inspection object 122a on the supply-side intermediate stage (second stage) 114, a first arm 120, a second arm 121, and the like. The horizontal rotation conveyance part 101 which has the front-back inversion part 102 and is arrange | positioned on the three-dimensional movement stage (1st stage) 103, 1st arm 120, and 1st The first suction unit 116 and the second suction unit 117 for sucking the inspection object 122 provided on the respective arms 121 and three-dimensional inspection of the inspection object 122b at a predetermined position 3 From the dimension inspection unit 107, the storage-side intermediate stage (third stage) 115 on which the inspection object 122c conveyed from the three-dimensional inspection unit 122 is placed, and the storage-side intermediate stage (third stage) 115 to the storage unit A storage hand unit 113 that transports the inspection object 122d, a lower surface imaging camera 109 that is a two-dimensional inspection unit that captures a two-dimensional image of the inspection object 122d that is transported by the storage hand unit 113, and a supply hand unit 112. Supply hand XY stage 110 and storage hand XY stage 111 supporting storage hand unit 113.

  The horizontal rotation conveyance unit 101 has a structure capable of rotating in a horizontal direction on a three-dimensional moving stage (first stage) 103, and the first arm 120 and the second arm 121 are extended. It is structured to be able to rotate 180 degrees around the direction in which it moves.

  The supply hand unit 112 and the storage hand 113 have a structure that can move in the X direction, the Y direction, and the Z direction.

  FIG. 3 shows a configuration (only a necessary part is displayed) when a three-dimensional inspection of the inspection object 122b is performed.

  3 shows that the first arm 120 and the second arm 121 are rotated 180 degrees around the extending direction from the state shown in FIG. 2 and the horizontal rotation transport unit 101 is rotated 90 degrees to be inspected. The back surface of the object 122b is directed upward. After the inspection object 122b is transported to a predetermined place and set in a predetermined direction, the three-dimensional movement stage (first stage) 103 performs a plurality of movements in the Z direction necessary for the three-dimensional inspection and a plurality of inspections. The three-dimensional inspection of the inspection object 122b is performed using the three-dimensional inspection unit 107 while moving in the X direction and the Y direction, which are necessary when divided into the visual fields (for example, four visual fields, nine visual fields, or 25 visual fields). Is called.

  Next, the operation of the appearance inspection apparatus of the present invention will be described with reference to FIGS.

  1) First, the inspection object (for example, BGA type semiconductor) is supplied by the supply hand unit 112 from the state in which it is stored in the supply tray 104 with the surface of the inspection object (for example, the marking surface of electronic parts such as BGA type semiconductor devices) facing up. (Electronic parts such as a device) 122 is taken out.

  2) Next, the supply hand unit 112 conveys the supply side intermediate stage (second stage) 114.

  3) Next, on the supply side intermediate stage (second stage) 114, a two-dimensional inspection unit performs a two-dimensional inspection of an upper surface (for example, a marking surface) of an inspection target (for example, an electronic component such as a BGA type semiconductor device) 122a. This is performed by a certain upper surface imaging camera 108.

  4) Next, the horizontal rotation conveyance unit 101 stops the rotation on the inspection object (for example, an electronic component such as a BGA type semiconductor device) 122a with the suction unit 116 facing downward.

  5) Next, a position at which the three-dimensional moving stage (first stage) 103 below the horizontal rotary conveyance unit 101 moves downward and can attract the inspection object (for example, an electronic component such as a BGA type semiconductor device) 122a. The adsorbing part 116 moves.

  6) Next, the object to be inspected (for example, an electronic component such as a BGA type semiconductor device) 122 a is adsorbed by the adsorbing unit 116.

  7) Next, the three-dimensional moving stage (first stage) 103 moves upward, and the inspection object (for example, an electronic component such as a BGA type semiconductor device) 122a is moved from the supply-side intermediate stage (second stage) 114. lift.

  8) Next, the horizontal rotation conveyance unit 101 rotates and moves to a position where no obstacle exists around the adsorption unit 116.

  9) Next, in the case where the first arm 120 is turned 180 degrees at a position where there is no obstacle, the back surface of the inspection object (for example, an electronic component such as a BGA type semiconductor device) 122a (an electronic component such as a BGA type semiconductor device) Position the ball surface).

  10) Further, the horizontal rotary conveyance unit 101 rotates and moves to a position rotated 90 degrees from the position where the inspection object 122a is sucked by the supply side intermediate stage (second stage) 114.

  At the same time, the three-dimensional moving stage (first stage) 103 moves upward, and the bottom surface (for example, an electronic component such as a BGA type semiconductor device) 122b is moved to a height necessary for performing the three-dimensional measurement ( In the case of an electronic component such as a BGA type semiconductor device, the ball surface) is positioned.

  11) Next, a three-dimensional inspection unit 107 having a measurement window portion below is positioned above a portion where an inspection object (for example, an electronic component such as a BGA type semiconductor device) 122b is positioned. The fixed three-dimensional moving stage (first stage) 103 moves, and the back surface of the inspection object (for example, an electronic component such as a BGA type semiconductor device) 122b (ball in the case of an electronic component such as a BGA type semiconductor device) Surface) 3D measurement is performed while moving the position in the XY direction so as to measure all.

  12) After the three-dimensional measurement, the horizontal rotation conveyance unit 101 rotates again and moves around the suction unit 116 to a position where there is no obstacle.

  13) Next, the first arm 120 is inverted 180 degrees at a position free of obstacles, and the lower surface of the inspection object (for example, an electronic component such as a BGA type semiconductor device) 122b (in the case of an electronic component such as a BGA type semiconductor device) Position the ball surface below.

  14) Further, the horizontal rotation conveyance unit 101 rotates and moves to a position rotated 180 degrees from the position where the inspection object 122a is sucked by the supply side intermediate stage (second stage) 114.

  15) Next, the three-dimensional moving stage (first stage) 103 below the horizontal rotary conveyance unit 101 moves downward, and the object to be inspected (for example, an electronic component such as a BGA type semiconductor device) 122c is placed in the middle of the storage side. The suction unit 116 moves to a position where it can be placed on the stage (third stage) 115.

  16) Next, the suction of the suction portion 116 is released, and the inspection object (for example, an electronic component such as a BGA type semiconductor device) 122c is placed on the storage-side intermediate stage (third stage) 115.

  17) The inspection object (for example, an electronic component such as a BGA type semiconductor device) 122 is conveyed to the storage side by the suction unit 116 provided on the first arm 120 of the horizontal rotation conveyance unit 101, and at the same time, the horizontal rotation conveyance unit 101 The suction part 117 provided on the second arm 121 is located on the supply-side intermediate stage (second stage) 114 and sucks the next inspection object (for example, an electronic component such as a BGA type semiconductor device) 122a. The above operations 6) to 16) are repeated while rotating the horizontal rotation conveyance unit 101.

  18) Next, the inspection object (for example, an electronic component such as a BGA type semiconductor device) 122c placed on the storage-side intermediate stage (third stage) 115 is sucked and conveyed by the storage hand unit 113.

  19) Next, with respect to the inspection object (for example, an electronic component such as a BGA type semiconductor device) 122d attracted by the storage hand unit 113, a ball surface in the case of an electronic component such as a BGA type semiconductor device. 2D inspection is performed by the lower surface imaging camera 109 which is a two-dimensional inspection unit.

  20) Reflecting all inspection results, the inspection object (for example, an electronic component such as a BGA type semiconductor device) 122d is moved to and stored in the non-defective product storage tray 105 or the defective product storage tray 106.

  2 and 3, the inspection object is exemplified as an electronic component such as a BGA type semiconductor device, but may be an electronic component such as a QFP type or SOP type semiconductor device. In this case, The upper surface is the marking surface and the lower surface is the lower surface of the lead.

  In the above-described embodiment, the case where the three-dimensional inspection unit 107 performs a three-dimensional inspection of the inspection object on the surface has been described. However, the three-dimensional inspection unit 107 performs the three-dimensional inspection of the inspection object with a line or a point. It may be a configuration.

  The conveyance system of the appearance inspection apparatus according to the present invention described above has an arm 120, which constitutes the horizontal rotation conveyance unit 101 by arranging inspection objects on both ends of the rotating horizontal rotation conveyance unit 101, as compared with the conventional conveyance system. By reversing the surface 121 and 180 degrees, the movement, inversion, and three-dimensional movement at the time of measurement can be performed efficiently, so that the number of stages and hands necessary for conveyance can be reduced. Also, two-dimensional marking surface inspection function around the rotary stage, and two-dimensional bottom surface measurement (ball surface for electronic components such as BGA type semiconductor devices, lead bottom surface for electronic components such as QFP type semiconductor devices) inspection function Therefore, an overall compact installation area can be realized.

  Since the appearance inspection apparatus and the appearance inspection apparatus transport unit of the present invention have the above-described configuration, the structure can be arranged more compactly and the installation area of the apparatus can be reduced as compared with the conventional appearance inspection apparatus. In addition, by adopting the above-described configuration, it is possible to reduce the number of component parts of the necessary transport mechanism, and thus it is possible to reduce manufacturing costs.

It is a top view which shows the external appearance inspection apparatus which concerns on embodiment. It is a perspective view which shows the external appearance inspection apparatus which concerns on embodiment. It is a perspective view which shows the external appearance inspection apparatus which concerns on embodiment. It is a top view which shows the conveyance system of the conventional external appearance inspection apparatus. It is a perspective view which shows the conveyance system of the conventional external appearance inspection apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Appearance inspection apparatus 101 Horizontal rotation conveyance part 102 Front and back inversion part 103 Three-dimensional movement stage (1st stage)
104 Supply tray 105 Non-defective product storage tray 106 Defective product storage tray 107 Three-dimensional inspection unit 108 Upper surface imaging camera (first two-dimensional inspection unit)
109 Bottom surface imaging camera (second two-dimensional inspection unit)
110 XY stage for supply hand 111 XY stage for storage hand 112 supply hand part 113 storage hand part 114 supply side intermediate stage (second stage)
115 Storage intermediate stage (third stage)
116 1st adsorption | suction part 117 2nd adsorption | suction part 120 1st arm 121 2nd arm 122 Inspection object 122a Inspection object 122b Inspection object 122c Inspection object 122d Inspection object 200 Appearance inspection apparatus 201 Front and back inversion part 202 Three-dimensional moving stage 203 Supply tray 204 Non-defective product storage tray 205 Defective product storage tray 206 Three-dimensional inspection unit 207 Upper surface imaging camera 208 Lower surface imaging camera 209 First hand XY stage 210 Second hand X stage 211 Second 3rd hand X stage 212 4th hand XY stage 213 1st hand part 214 2nd hand part 215 3rd hand part 216 4th hand part 217 Supply side intermediate stage 218 Defective product storage tray 219 3 Dimensional inspection part middle stage 220 Part 221 test object

Claims (12)

An appearance inspection apparatus having a three-dimensional inspection unit,
A first stage unit capable of moving in the X, Y and Z directions;
Has two arms extending in opposite directions, and the horizontal rotating part which is rotatably secured in the horizontal direction in the first stage portion on,
An adsorption part provided at each of the tips of the arm parts, each of which adsorbs an inspection object individually;
Including
The arm portion can be rotated 180 degrees around the extending direction;
The horizontal rotation conveyance unit conveys the inspection object to the three-dimensional inspection unit, and moves the inspection object in the X direction, the Y direction, and the Z direction in the three-dimensional inspection unit. performs dimension inspection, appearance inspection apparatus characterized by conveying the object to be examined is examined by the three-dimensional inspection unit from the 3-dimensional inspection unit. The appearance inspection apparatus according to claim 1,
A second stage section;
A third stage part,
The horizontal rotation conveyance unit picks up the inspection object placed on the second stage, conveys it to the three-dimensional inspection unit, and conveys the inspection object inspected by the three-dimensional inspection unit. An appearance inspection apparatus characterized by being placed on the third stage. The appearance inspection apparatus according to claim 2,
An appearance inspection apparatus, further comprising a first two-dimensional inspection unit that images the inspection object placed on the second stage from above. The appearance inspection apparatus according to claim 3,
A supply hand unit that has an adsorption unit that adsorbs an inspection object, and that conveys the inspection object to the second stage;
An appearance inspection apparatus, further comprising: an adsorbing unit that adsorbs an inspection object, and a storage hand unit that conveys the inspection object from the third stage. The appearance inspection apparatus according to claim 4,
A visual inspection apparatus further comprising a second two-dimensional inspection unit that captures an image of the inspection object from below while the storage hand unit is transporting the inspection object. The appearance inspection apparatus according to claim 5,
The inspection object has a first surface and a second surface opposite to the first surface;
The first two-dimensional inspection unit inspects the first surface of the inspection object,
The three-dimensional inspection unit inspects the second surface of the inspection object,
The appearance inspection apparatus, wherein the second two-dimensional inspection unit inspects a second surface of the inspection object. The appearance inspection apparatus according to any one of claims 1 to 6,
The visual inspection apparatus, wherein the inspection object is a semiconductor device or an electronic component. The appearance inspection apparatus according to claim 6,
The inspection object is a BGA type semiconductor component,
The first surface is a marking surface, and the second surface is a ball surface;
An appearance inspection apparatus, wherein a three-dimensional inspection of the second surface is performed with the first surface adsorbed. A conveyance unit for an appearance inspection apparatus having a three-dimensional inspection unit,
A first stage unit capable of moving in the X, Y and Z directions;
Has two arms extending in opposite directions, and the horizontal rotating part which is rotatably secured in the horizontal direction in the first stage portion on,
An adsorption part provided at each of the tips of the arm parts, each of which adsorbs an inspection object individually;
Including
The arm portion can be rotated 180 degrees around the extending direction;
The horizontal rotation conveyance unit conveys the inspection object to the three-dimensional inspection unit, and moves the inspection object in the X direction, the Y direction, and the Z direction in the three-dimensional inspection unit. A visual inspection apparatus transport unit that performs a three-dimensional inspection and transports the inspection object inspected by the three-dimensional inspection unit from the three-dimensional inspection unit. In the conveyance part for appearance inspection devices according to claim 9 ,
A second stage section;
A third stage part,
The horizontal rotation conveyance unit picks up the inspection object placed on the second stage, conveys it to the three-dimensional inspection unit, and conveys the inspection object inspected by the three-dimensional inspection unit. A visual inspection apparatus transport section, wherein the visual inspection apparatus transport section is placed on the third stage. In the conveyance part for appearance inspection apparatuses according to claim 10 ,
A supply hand unit having an adsorption unit for adsorbing an inspection object, and conveying the inspection object to the second stage;
An appearance inspection apparatus transport unit, further comprising: an adsorbing unit that adsorbs the inspection object, and further including a storage hand unit that conveys the inspection object from the third stage. In the conveyance part for external appearance inspection apparatuses in any one of Claims 9 thru | or 11 ,
The appearance inspection apparatus transport unit, wherein the inspection object is a semiconductor device or an electronic component.

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