KR100857580B1 - Visual inspection apparatus and carrier for visual inspection apparatus - Google Patents

Abstract

The present invention provides a visual inspection apparatus and a conveyance section for a visual inspection apparatus with a small number of parts, a low manufacturing cost, and a compact installation area.

In the visual inspection apparatus 100 of the present invention, the arms 120 and 121 are arranged at both ends of the horizontal rotation conveyance unit 101 rotating on the rotation stage 103 and constitute the horizontal rotation conveyance unit 101. By 180 degrees, the three-dimensional movement at the time of movement, inversion and measurement can be efficiently performed, and the number of stages and hands required for conveyance can be reduced. In addition, a two-dimensional stamp surface inspection function and two-dimensional surface measurement (a case of an electronic component such as a BGA type semiconductor device, a surface of an electronic component such as a BFP type semiconductor device and a lead if an electronic component such as a QFP type semiconductor device) are inspected around the rotation stage 103. Since the functions are arranged, a compact installation area as a whole can be realized.

Visual inspection, conveying unit, semiconductor device, stage, hand

Description

Visual inspection apparatus and carrier for visual inspection apparatus

1 is a plan view of an appearance inspection apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of an essential part of the appearance inspection apparatus shown in FIG.

3 is a perspective view of an essential part of the appearance inspection apparatus shown in FIG.

4 is a plan view of a conveying system of a conventional appearance inspection apparatus.

FIG. 5 is a perspective view of a conveying system of the appearance inspection apparatus shown in FIG.

* Description of the symbols for the main parts of the drawings *

100 Appearance Inspection Device 101 Horizontal Rotation Carrier

102 Front and back reverse 103 3D moving stage (1st stage)

104 Supply Tray 105 Consumables Storage Tray

106 Defective product storage tray 107 Three-dimensional inspection

108 Image Camera (First 2D Inspection Unit)

109 Bottom image pickup camera (2nd 2D inspection part)

110 XY stage for supply hand 111 XY stage for storage hand

112 Supply Hand Section 113 Storage Hand Section

114 Supply Side Intermediate Stage (Second Stage)

115 Storage Side Intermediate Stage (3rd Stage)

116 First adsorption part 117 Second adsorption part

120 First arm 121 Second arm

122, 122a, 122b, 122c, 122d

200 Appearance Inspection System 201

202 3D Moving Stage 203 Feed Tray

204 Consumables storage tray 205 Defective product storage tray

206 3D Inspection Department

207 Top View Camera 208 Bottom View Camera

209 XY stage for the first hand 210 XY stage for the second hand

211 XY stage for third hand 212 XY stage for fourth hand

213 First hand part 214 Second hand part

215 Third Hand 216 Fourth Hand

217 Intermediate Stage for Supply Side 218 Intermediate Stage for 3D Inspection

219 Storage Stage Intermediate Stage 220 Adsorption Section

221 Objects to be inspected

The present invention relates to an external appearance inspection apparatus and a conveyance section for an external appearance inspection apparatus.

In recent years, electronic components such as semiconductor devices have been miniaturized. For example, solder bumps, such as semiconductor devices such as ball grid array (BGA), chip size package (CSP), and wafer level chip size package (WLCSP), may be used. Diameter and pitch are also becoming finer. As the mobile phone is miniaturized, as represented by a mobile phone, the miniaturization of semiconductor devices is also progressing more and more, and accordingly, the measurement capability of the external appearance inspection apparatus, the expansion of inspection items, etc. are demanded. On the other hand, there is also a strong demand for lowering the cost of electronic components such as semiconductor devices, and the reduction of the installation area, which is important for cost reduction and optimal production line construction, for semiconductor manufacturing equipment and semiconductor inspection equipment related to the cost of electronic components such as semiconductor devices. Miniaturization is also required.

Against the background as mentioned above, the structure of the handler of the conventional visual inspection apparatus was as shown in FIG.4 and FIG.5.

4 and 5, the configuration of the handler of the conventional visual inspection apparatus will be described. 4 shows a plan view of a conventional appearance inspection apparatus, and FIG. 5 shows a perspective view of a conventional appearance inspection apparatus.

The external appearance inspection apparatus 200 includes a supply tray 203, a supply side intermediate stage 217, a first hand part 213 for conveying the supply tray 203 from the supply tray 203 to the supply side intermediate stage 217. , An image pickup camera 207, a three-dimensional moving stage 202 that is movable in three directions in the X, Y, and Z directions, an intermediate stage 218 for the three-dimensional inspection unit, and a supply-side intermediate stage. 2nd hand part 214, front and back inversion part 201, 3D inspection part 206, storage side intermediate stage 219, which conveys from 217 to 3D inspection part intermediate stage 218, 3rd hand part 215 which conveys from the 3-dimensional inspection part intermediate stage 218 to the storage side intermediate stage 219, and the 4th hand part which conveys from the storage side intermediate stage 219 to a storage part ( 216, the lower surface image pickup camera 208, the non-defective product storage tray 204, the defective article storage tray 205, and the first hand part 213. The first hand shock Y stage 209, the second hand shock Y stage 210 for supporting the second hand part 214, and the third hand shock Y stage 211 for supporting the third hand part 215. ), A fourth hand-shaped Y stage 212 supporting the fourth hand part 216, and an adsorption part 220 provided at the end of each hand part.

4 and 5, the operation of conveying the inspection object (electronic component such as a BGA type semiconductor device) 221 of the conventional appearance inspection apparatus 200 will be described.

First, with the first hand part 213, the upper surface of the inspection object (for example, a seal surface of an electronic component such as a BGA type semiconductor device) is placed on the supply tray 203 with its top facing upward. The inspection object (electronic component such as a BGA type semiconductor device) 221 is taken out.

Next, the first hand part 213 conveys the inspection object 221 to the supply side intermediate stage 217.

Next, the two-dimensional inspection of the upper surface (for example, the stamping surface) of the inspection object 221 is performed on the supply-side intermediate stage 217 by the upper surface imaging camera 207.

Next, the second hand part 214 conveys the inspection object 221 to the three-dimensional inspection part intermediate stage 218.

Next, the lower surface of the inspection object (for example, an electronic component such as a BGA type semiconductor device) on the three-dimensional inspection section intermediate stage 218 (a ball surface in the case of an electronic component such as a BGA type semiconductor device) After positioning up by the whole 201, the inspection object 221 is placed on the three-dimensional moving stage 202.

Next, the three-dimensional moving stage 202 moves upward, and the lower surface (BGA-type semiconductor) of the inspection object (electronic component such as a BGA-type semiconductor device) at the height required to perform three-dimensional measurement. In the case of electronic parts such as devices, the ball surface) is positioned.

Next, the three-dimensional moving stage 202 moves to move all of the lower surfaces of the inspection object (for example, an electronic component such as a BGA type semiconductor device) 221 (a viewing surface in the case of an electronic component such as a BGA type semiconductor device). Three-dimensional measurement is performed by measuring the height distribution (the height distribution of the ball surface, that is, the three-dimensional surface shape of the ball surface) while moving the position in the y-direction to measure.

After the three-dimensional measurement, the lower surface of the inspection object (for example, an electronic component such as a BGA type semiconductor device) on the three-dimensional moving stage 202 (a ball surface in the case of an electronic component such as a BGA type semiconductor device) is placed. It is positioned downward by the front and rear inversion unit 201 and then placed on the intermediate stage 218 of the three-dimensional inspection unit.

Next, the inspection object 221 is conveyed to the storage side intermediate stage 219 by the third hand part 215.

Next, the inspection object 221 is conveyed to the storage unit by the fourth hand unit 216.

The inspection object (for example, an electronic component of a BGA type semiconductor device) 221 adsorbed by the fourth hand part 216 has a lower surface (a ball surface in the case of an electronic component such as a BGA type semiconductor device). When the two-dimensional inspection is performed, the imaging camera 208 is used.

Reflecting all the inspection results, the inspection object (for example, an electronic component such as a BGA type semiconductor device) 221 is moved to the good storage tray 204 or the defective product storage tray 205 and stored therein.

However, the conveying system of the conventional visual inspection apparatus shown in Figs. 4 and 5 is configured to perform two-dimensional upper surface measurement (IC stamp measurement), two-dimensional lower surface measurement (IC lower surface or ball surface measurement), and three-dimensional measurement. Since a large number of hands are required, the number of components is high and the apparatus manufacturing cost becomes expensive.

In addition, as described above, the number of components, and in the flow of the supply unit, two-dimensional top measurement, front and back inversion, three-dimensional measurement and three-dimensional stage movement, front and back inversion, two-dimensional bottom surface measurement, measurement unit, Since a large number of hand parts and a large number of intermediate stages are required, there is a problem that the installation area becomes large.

According to the present invention, in the visual inspection apparatus having a three-dimensional inspection portion, the first stage portion movable in the X-direction, the Y-direction and the Z-direction, and two arm portions extending in opposite directions to each other, the first A horizontal rotation conveying part fixed to the stage part so as to be rotatable in the horizontal direction, and an adsorbing part provided at each end of the arm part to adsorb the test object individually, wherein the arm part has its extension direction as the axis; Rotatable by 180 degrees, and the horizontal rotation conveying unit conveys the inspection object to the three-dimensional inspection unit and conveys the inspection object inspected by the three-dimensional inspection unit from the three-dimensional inspection unit. The device is obtained.

According to the present invention, there is also provided a conveyance unit for an external inspection apparatus having a three-dimensional inspection unit, comprising: a first stage unit capable of moving in the X direction, the Y direction and the Z direction, and two arm portions extending in opposite directions to each other; And a horizontal rotation conveying part which is rotatably fixed in the horizontal direction on the first stage part, and an adsorption part which is provided at each end of the arm part to adsorb the test object individually, and the arm part is extended It is rotatable 180 degrees around a direction, and the said horizontal rotation conveyance part conveys the said inspection object to the said three-dimensional inspection part, and conveys the said inspection object examined by the said three-dimensional inspection part from the said three-dimensional inspection part. The conveyance part for external appearance inspection apparatuses is obtained.

EMBODIMENT OF THE INVENTION Hereinafter, the Example of this invention is described using drawing. In addition, in all drawings, the same code | symbol is attached | subjected to the same component, and description is abbreviate | omitted suitably.

1 to 3, the configuration of the appearance inspection apparatus 100 according to an embodiment of the present invention will be described.

Fig. 1 shows a plan view of the appearance inspection apparatus 100, and Figs. 2 and 3 show perspective views of the main part of the appearance inspection apparatus 100. Figs.

In Fig. 2, the visual inspection apparatus 100 includes a three-dimensional moving stage (first stage) 103 that can move in the X-direction, Y-direction, and Z-direction, and an inspection object (for example, a BGA type semiconductor device). The supply side intermediate stage (second stage) 114 on which the electronic components such as back) 122 are placed, and the inspection object 122 from the supply tray 104 (FIG. 1) to the supply side intermediate stage (second stage) 114. The image pickup camera 108, which is a two-dimensional inspection unit that captures a two-dimensional image of the inspection object 122a on the supply hand intermediate portion 112 and the supply-side intermediate stage (second stage) 114, Have.

The appearance inspection apparatus 100 has a horizontal rotation conveyance part 101 further. The horizontal rotation conveyance part 101 has the 1st arm 120, the 2nd arm 121, and the front and back inversion part 102, and is arrange | positioned on the three-dimensional moving stage (first stage) 103. As shown in FIG.

The visual inspection apparatus 100 is further provided on the first arm 120 and the second arm 121, respectively, and includes a first adsorption portion 116 and a second adsorption portion (116) for adsorbing the inspection object 122. 117, a three-dimensional inspection unit 107 for performing three-dimensional inspection of the inspection object 122b at a predetermined position, and a storage-side intermediate stage for placing the inspection object 122c conveyed from the three-dimensional inspection unit 107 ( 3rd stage) 115, the storage hand part 113 which conveys the test | inspection object 122d from the storage side intermediate stage (third stage) 115 to a storage part, and the conveyance by the storage hand part 113 A lower surface image pickup camera 109, a supply hand X-Y stage 110 (FIG. 1) that supports the supply hand section 112, which is a two-dimensional inspection section for imaging a two-dimensional image of the inspection target object 122d; The storage hand 핸드 Y stage 111 (FIG. 1) which supports the storage hand part 113 is provided.

The horizontal rotation conveyer 101 has a structure capable of rotating in the horizontal direction on the three-dimensional moving stage (first stage) 103, and the first arm 120 and the second arm 121 are the same. It has a structure which can be rotated 180 degrees around the extending direction.

Moreover, the supply hand part 112 has the adsorption | suction part 1121 for adsorb | sucking the test | inspection object 122. As shown in FIG. The storage hand part 113 has an adsorption part 1131 for adsorb | sucking the test | inspection object 122d. The supply hand part 112 and the accommodating hand part 113 have a structure which can move to a X direction, a Y direction, and a Z direction.

3 shows the configuration (only necessary portions are displayed) when performing the three-dimensional inspection of the inspection object 122b.

Fig. 3 rotates the first arm 120 and the second arm 121 by 180 degrees from the state of Fig. 2 as the axis, and rotates the horizontal rotation carrier 101 by 90 degrees. The back of the inspection object 122b is to face upward. After the inspection object 122b is transported to a predetermined place and set in a predetermined direction, the three-dimensional moving stage (first stage) 103 performs a number of movements in the Z direction and inspection necessary for the three-dimensional inspection. The three-dimensional inspection of the inspection object 122b causes the three-dimensional inspection unit 107 to move in the X-direction and Y-direction, which are necessary when divided into the field of view (eg, 4 o'clock, 9 o'clock or 25 o'clock). It is done using.

Next, referring to Fig. 2, the operation of the visual inspection apparatus of the present invention will be described.

1) First, from the state in which the surface of the object to be inspected (for example, a stamping surface of an electronic component such as a BGA type semiconductor device) is placed in the supply tray 104 (FIG. 1), the supply hand portion 112 The inspection object (electronic component, such as a BGA type semiconductor device) 122 is taken out by this.

2) Next, it is conveyed to the supply side intermediate stage (2nd stage) 114 by the supply hand part 112. FIG.

3) Next, on the supply side intermediate stage (second stage) 114, two-dimensional inspection of the upper surface (e.g., stamping surface) of the inspection object (e.g., an electronic component such as a BGA type semiconductor device) 122a is performed. The image pickup camera 108 as a dimensional inspection unit is used.

4) Next, the horizontal rotation conveyance unit 101 faces the first adsorption unit 116 downward, and stops rotating on the inspection object (for example, an electronic component such as a BGA type semiconductor device) 122a.

5) Next, the three-dimensional moving stage (first stage) 103 below the horizontal rotation conveying unit 101 moves downward, and the inspection object (for example, an electronic component such as a BGA type semiconductor device) ( The first adsorption part 116 moves to a position where the aperture 122a) can be adsorbed.

6) Next, the inspection object (for example, an electronic component such as a BGA type semiconductor device) 122a is sucked by the first adsorption portion 116.

7) Next, the three-dimensional moving stage (first stage) 103 is moved upward, and the inspection object (for example, an electronic component such as a BGA type semiconductor device) is moved from the supply side intermediate stage (second stage) 114. Lift up 122a.

8) Next, the horizontal rotation conveyance part 101 rotates and moves to the position where the obstacle does not exist around the 1st adsorption part 116. FIG.

9) Next, the first arm 120 is inverted by 180 degrees at the position where there is no obstacle, and the back side of the inspection object (for example, an electronic component such as a BGA type semiconductor device) 122a (such as a BGA type semiconductor device) In the case of electronic components, the ball surface) is placed upward.

10) Moreover, the horizontal rotation conveyance part 101 rotates and moves to the position which rotated 90 degrees from the position which adsorb | sucked the test | inspection object 122a in the supply side intermediate stage (2nd stage) 114. FIG.

At the same time, the three-dimensional moving stage (first stage) 103 moves upward, and the lower surface of the inspection object (electronic component such as a BGA type semiconductor device, etc.) 122b at the height necessary for performing three-dimensional measurement. (A ball surface in the case of an electronic component such as a BGA type semiconductor device) is placed.

11) Next, above the portion where the inspection object (e.g., an electronic component such as a BGA type semiconductor device) 122b is located, a three-dimensional inspection unit 107 having a measurement window is located below, and a three-dimensional inspection unit ( While the 107 is fixed, the three-dimensional moving stage (first stage) 103 is moved, and the back side of the inspection object (for example, an electronic component such as a BGA type semiconductor device) 122b (a BGA type semiconductor device or the like). In the case of electronic components, the three-dimensional measurement is performed while moving the position in the y-direction so as to measure all of the viewing surfaces.

12) After the three-dimensional measurement, the horizontal rotation carrier 101 is rotated again to move to a position where no obstacle is around the first suction unit 116.

13) Next, the first arm 120 is inverted 180 degrees at the position where there is no obstacle, and the lower surface of the inspection object (for example, an electronic component such as a BGA type semiconductor device) 122b (a BGA type semiconductor device or the like). In the case of electronic components, place the ball face down.

14) Moreover, the horizontal rotation conveyance part 101 rotates and moves to the position which rotated 180 degrees from the position which adsorb | sucked the to-be-tested object 122a by the supply side intermediate stage (2nd stage) 114. FIG.

15) Next, the three-dimensional moving stage (first stage) 103 below the horizontal rotation conveying unit 101 moves downward, and the inspection object (for example, an electronic component such as a BGA type semiconductor device) ( The first adsorption portion 116 moves to a position where the 122c) can be placed on the storage-side intermediate stage (third stage) 115.

16) Next, suction of the first adsorption portion 116 is opened, and the inspection object (e.g., an electronic component such as a BGA type semiconductor device) 122c is placed on the storage-side intermediate stage (third stage) 115. Release.

17) The inspection object (for example, an electronic component such as a BGA type semiconductor device) 122 is placed on the storage side in the first adsorption part 116 provided on the first arm 120 of the horizontal rotation conveyance part 101. At the same time as the conveyance, the second adsorption portion 117 provided on the second arm 121 of the horizontal rotation conveyance portion 101 is located on the supply side intermediate stage (second stage) 114 and the next inspection object (eg For example, an electronic component such as a BGA type semiconductor device) 122a is attracted, and the above operations 6 to 16 are repeated while rotating the horizontal rotation transfer section 101.

18) Next, the inspection object (electronic component such as a BGA type semiconductor device) 122c placed on the storage-side intermediate stage (third stage) 115 is sucked and conveyed by the storage hand portion 113.

19) In the case of an electronic component such as a BGA type semiconductor device, the lower surface (e.g., an electronic part such as a BGA type semiconductor device) 122d of the inspection object (e.g., an electronic part such as a BGA type semiconductor device) adsorbed by the receiving hand 113 2D inspection of the viewing surface) is performed with the lower surface imaging camera 109 serving as the 2D inspection unit.

20) The inspection results of all of them are reflected, and the inspection object (e.g., an electronic component such as a BGA type semiconductor device) 122d is a good storage tray 105 (FIG. 1) or a defective storage tray 106 (FIG. 1). ) Is stored.

2 and 3, the inspection object is exemplified by an electronic component such as a BGA type semiconductor device, but may be an electronic component such as a semiconductor device of a QFP (Quad Flat Package) type and a Small Outline Package (SOP) type. In this case, the upper surface may be a seal, and the lower surface may be a lead.

In addition, in the above-described embodiment, the case where the three-dimensional inspection unit 107 performs the three-dimensional inspection of the inspection object by the plane has been described. However, even when the three-dimensional inspection unit 107 performs the three-dimensional inspection of the inspection object by lines or dots, do.

The conveying system of the above-described external appearance inspection apparatus according to the present invention arranges inspection objects on both ends of the rotating horizontal rotating conveying unit 101 as compared with the conventional conveying system, and constitutes the horizontal rotating conveying unit 101. By inverting the arms 120 and 121 back and forth, the three-dimensional movement at the time of movement, inversion and measurement can be efficiently performed, so that the number of stages and hands required for conveyance can be reduced. In addition, a two-dimensional stamp surface inspection function and a two-dimensional surface measurement function (when an electronic component such as a BGA type semiconductor device is seen, and an electronic component such as a QFP type semiconductor device) are arranged around the rotating stage. As a result, the overall compact installation area can be realized.

Since the external appearance inspection apparatus and the conveyance part for external appearance inspection apparatus of this invention have the structure mentioned above, compared with the conventional external appearance inspection apparatus, a structure can be arrange | positioned compactly and the installation area of an apparatus can be reduced. In addition, by adopting the above-described configuration, since the number of components required for the transfer mechanism can be reduced, the manufacturing cost can be reduced.

According to the present invention, the horizontal rotation conveying unit conveys the inspection object to the first stage while inverting the front and back, and conveys the inspection object after the three-dimensional inspection is completed from the first stage while inverting the front and back, so that the number of parts is low and the manufacturing cost is low. In addition, it is possible to obtain an appearance inspection apparatus which is compact and has a small installation area.

Further, according to the present invention, the horizontal rotation conveying unit conveys the inspection object to the first stage while inverting the front and back, and conveys the inspection object after the three-dimensional inspection is completed from the first stage while inverting the front and back, so that the number of parts is low and the manufacturing cost is low. It is cheap and compact, and the conveyance part for external appearance inspection apparatus with a small installation area can be obtained.

Claims (11)

In the appearance inspection apparatus having a three-dimensional inspection, A first stage part movable in the Ⅹ direction, the Y direction and the Z direction, A horizontal rotation conveying part having two arm parts extending in opposite directions and fixed to the first stage part so as to be rotatable in a horizontal direction; It is provided at each end of the arm portion, and includes an adsorption portion for adsorbing the test object individually, The arm portion is rotatable 180 degrees with its axis of extension as the axis, The horizontal rotation conveyer conveys the inspection object to the three-dimensional inspection part by adsorbing the inspection object to the suction part of the arm part and rotates the arm horizontally, and simultaneously carries out the inspection object inspected by the three-dimensional inspection part to the three-dimensional object. Appearance inspection apparatus characterized by conveying from the inspection unit. The method of claim 1, The second stage, Further comprising a third stage, The horizontal rotation conveyer picks up the inspection object placed on the second stage through the suction part of the arm, and horizontally rotates the arm to convey it to the three-dimensional inspection unit, and inspects the three-dimensional inspection unit. And conveying the inspected object and releasing the adsorption of the arm to place the inspected object on the third stage. The visual inspection apparatus according to claim 2, further comprising a first two-dimensional inspection unit for capturing the inspection object placed on the second stage unit from above. The method of claim 3, A supplying hand part having an adsorption part for absorbing an object to be inspected and conveying the object to be inspected in the second stage; And an accommodating hand portion which has an adsorption portion for adsorbing the inspection object and conveys the inspection object from the third stage portion. 5. The appearance inspection apparatus according to claim 4, further comprising a second two-dimensional inspection portion which captures the inspection object from below while the storing hand portion carries the inspection object. The method of claim 5, The inspection object has a first surface and a second surface opposite to the first surface, The first two-dimensional inspection unit inspects a first surface of the inspection object, The three-dimensional inspection unit inspects a second surface of the inspection object, And the second two-dimensional inspection unit inspects a second surface of the inspection object. The appearance inspection apparatus according to any one of claims 1 to 6, wherein the inspection object is a semiconductor device or an electronic component. In the conveyance part for external appearance inspection apparatus which has a three-dimensional inspection part, A first stage part movable in the Ⅹ direction, the Y direction and the Z direction, A horizontal rotation conveying part having two arm parts extending in opposite directions and fixed to the first stage part so as to be rotatable in a horizontal direction; It is provided at each end of the arm portion, and includes an adsorption portion for adsorbing the test object individually, The arm portion is rotatable 180 degrees with its axis of extension as the axis, The horizontal rotation conveyer conveys the inspection object to the three-dimensional inspection part by adsorbing the inspection object to the suction part of the arm part and rotates the arm horizontally, and simultaneously carries out the inspection object inspected by the three-dimensional inspection part to the three-dimensional object. Carrying part for appearance inspection apparatus characterized by conveying from inspection part. The method of claim 8, The second stage, Further comprising a third stage, The horizontal rotation conveying unit picks up the inspected object placed on the second stage through the adsorption unit of the arm unit, and horizontally rotates the arm unit to convey the inspected object to the three-dimensional inspection unit, and the inspected object inspected by the three-dimensional inspection unit. And a suction part of the arm portion is released to place the inspection object on the third stage portion. The method of claim 9, A supplying hand part having an adsorption part for absorbing an object to be inspected and conveying the object to be inspected in the second stage; And an accommodating hand portion for adsorbing the inspected object from the third stage portion, the conveying portion for absorbing the inspected object. The conveyance unit for an appearance inspection apparatus according to any one of claims 8 to 10, wherein the inspection object is a semiconductor device or an electronic component.

Images