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JP3154027U - Boundary pile reclamation equipment - Google Patents

Boundary pile reclamation equipment Download PDF

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Publication number
JP3154027U
JP3154027U JP2009001369U JP2009001369U JP3154027U JP 3154027 U JP3154027 U JP 3154027U JP 2009001369 U JP2009001369 U JP 2009001369U JP 2009001369 U JP2009001369 U JP 2009001369U JP 3154027 U JP3154027 U JP 3154027U
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semiconductor laser
boundary pile
irradiation point
arm
light source
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JP2009001369U
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Japanese (ja)
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久米男 青山
久米男 青山
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株式会社青山測量
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Abstract

【課題】従来の風による錘重の揺れに関係なく、半導体レーザーの光源からの光線の照射点のため位置決めに難点がなく、境界杭の先端部と地表面側を同時に照射できる埋立て器具を提供する。【解決手段】台座5と柱7と腕13および半導体レーザー1の固定治具16からの構成である。半導体レーザー1の光源2の光線の直進性と照射点3を利用して境界杭4の埋立て作業時の位置決めに使用する考案である。あらかじめ定められている位置に半導体レーザー1の光線の照射点3を合わせ、境界杭4の埋立てのために地面に穴13を掘り、穴13の底に照射された照射点3に境界杭4の先端を当て、土を穴に埋める。埋立ての後、境界杭4の地表面側に半導体レーザー1の光線の照射点3の照射があることを確認することにより境界杭4が垂直に埋められていることを確認できる。【選択図】図1[PROBLEMS] To provide a reclamation device capable of simultaneously irradiating the front end portion of the boundary pile and the ground surface side without any difficulty in positioning because of the irradiation point of the light from the light source of the semiconductor laser, regardless of the fluctuation of the weight due to the conventional wind. provide. The structure includes a pedestal, a column, an arm, and a fixing jig for a semiconductor laser. It is a device that is used for positioning of the boundary pile 4 during reclamation work by using the straightness of the light beam 2 of the light source 2 of the semiconductor laser 1 and the irradiation point 3. The irradiation point 3 of the light beam of the semiconductor laser 1 is aligned with a predetermined position, a hole 13 is dug in the ground for reclamation of the boundary pile 4, and the boundary pile 4 is irradiated to the irradiation point 3 irradiated to the bottom of the hole 13. Hit the tip of the and fill the hole with soil. After the landfill, it can be confirmed that the boundary pile 4 is vertically buried by confirming that the irradiation point 3 of the semiconductor laser 1 is irradiated on the ground surface side of the boundary pile 4. [Selection] Figure 1

Description

本考案は、土木工事等での境界杭4の埋立て設置作業時に使用する器具である。The present invention is an instrument used during landfill installation work of the boundary pile 4 in civil engineering work or the like.

従来は、三脚を介して糸および錘重により位置決めをし、境界杭4を埋立てていた。Conventionally, the boundary pile 4 is landfilled by positioning with a thread and weight through a tripod.

風などによる錘重の揺れで位置決めに難点があり、境界杭4を垂直に埋立てが出来ずに傾斜して埋立てることもあった。There was a difficulty in positioning due to the shaking of the weight due to wind or the like, and the boundary pile 4 could not be landed vertically but was inclined and landed.

半導体レーザー1の光源2による照射点3で境界杭4の埋立て位置決めをする。境界杭4の埋立て作業時に照射点3は光源2からの光線は直線上であり、境界杭4の先端部も地表面側も同一の照射点3を有することになる。The landfill pile 4 is positioned at the irradiation point 3 by the light source 2 of the semiconductor laser 1. At the time of reclamation work of the boundary pile 4, the irradiation point 3 has a light beam from the light source 2 on a straight line, and the distal end portion and the ground surface side of the boundary pile 4 have the same irradiation point 3.

本考案は、半導体レーザー1の光源2を揺れることなく保持する台座5と柱7と腕13及び半導体レーザー固定治具16を有する器具である。The present invention is an instrument having a base 5, a column 7, an arm 13, and a semiconductor laser fixing jig 16 that holds the light source 2 of the semiconductor laser 1 without shaking.

台座5に垂直に立てた柱7、台座5に水平に設置された腕13、腕13にレーザーポインターなどの半導体レーザー1及び半導体レーザー固定治具16からなる構成である。The structure is composed of a column 7 standing vertically on a pedestal 5, an arm 13 installed horizontally on the pedestal 5, and a semiconductor laser 1 such as a laser pointer and a semiconductor laser fixing jig 16 on the arm 13.

従来の風による錘重の揺れに関係なく、半導体レーザー1の光源2からの光線の照射点3のため位置決めに難点がなく、境界杭4の先端部と地表面側を同時に照射できる。Regardless of the fluctuation of the weight due to the conventional wind, there is no difficulty in positioning because of the irradiation point 3 of the light beam from the light source 2 of the semiconductor laser 1, and the tip and the ground surface side of the boundary pile 4 can be irradiated simultaneously.

先ずスコップで穴18を掘り、穴18の底の照射点3の位置に境界杭4の先端部を挿入し土を埋める。土を埋め続け境界杭4の地表面側に照射点3の照射を有することを確認し、作業の終了である。この時、境界杭4は地面に垂直に埋立てられている。First, the hole 18 is dug with a scoop, and the tip of the boundary pile 4 is inserted into the position of the irradiation point 3 at the bottom of the hole 18 to fill the soil. It is confirmed that the soil is continuously buried and the irradiation of the irradiation point 3 is performed on the ground surface side of the boundary pile 4. At this time, the boundary pile 4 is buried vertically on the ground.

地面にスコップなどで穴18を掘る時、光源2の半導体レーザー固定治具16や腕13が邪魔な時は、柱7を中心にして腕13を邪魔にならない位置に旋回しておく。When the semiconductor laser fixing jig 16 and the arm 13 of the light source 2 are obstructed when the hole 18 is dug in the ground with a scoop or the like, the arm 13 is swung around the pillar 7 to a position where it does not get in the way.

は本考案の斜視図。Is a perspective view of the present invention. は本考案の実施例を示す斜視図。FIG. 1 is a perspective view showing an embodiment of the present invention. は本考案の実施を示す斜視図。FIG. 3 is a perspective view showing the implementation of the present invention.

本考案は、台座5に取付けた柱7と腕13と半導体レーザー固定治具16及び半導体レーザー1に三分割されている。The present invention is divided into a pillar 7, an arm 13, a semiconductor laser fixing jig 16, and a semiconductor laser 1 attached to the base 5.

現地作業場において、それぞれ図1の様に組み立てをする。Assemble as shown in Fig. 1 at the local workshop.

この時に、台座5に水準器をあてて水平調整ネジ6で水平を保持する。At this time, a level is applied to the pedestal 5 and the level is maintained with the leveling screw 6.

以下、図面により説明する。地面に位置決めされているマーク位置に向けて腕13を旋回し柱の旋回停止ネジ9で締める。腕13と溝15に接する半導体レーザー固定治具16をスライドさせてマーク位置に半導体レーザー1の光源2の照射点3を合わせ治具固定ネジ17を締める。Hereinafter, it demonstrates with drawing. The arm 13 is turned toward the mark position positioned on the ground, and is tightened with the column turning stop screw 9. The semiconductor laser fixing jig 16 in contact with the arm 13 and the groove 15 is slid, the irradiation point 3 of the light source 2 of the semiconductor laser 1 is aligned with the mark position, and the jig fixing screw 17 is tightened.

腕13に取付けた旋回用の柱8に有する腕の位置決め板10のストッパー12に、腕13に接続する腕の旋回停止板14を合わせ、腕の位置決めネジ11で固定する。An arm turning stop plate 14 connected to the arm 13 is aligned with the stopper 12 of the arm positioning plate 10 of the turning column 8 attached to the arm 13 and fixed with the arm positioning screw 11.

腕13を旋回し、更に元に戻しても最初に決められているマーク位置に照射点3は元の位置を照射し、境界杭4の埋立て後の確認も容易に出来る。Even if the arm 13 is turned and then returned to its original position, the irradiation point 3 irradiates the original position at the mark position determined first, and the boundary pile 4 can be easily confirmed after being landfilled.

従来の境界杭4の埋立て作業は、二名一組でしていたが本稿案実施おいては、作業者は一人で作業をすることが出来、作業時間も短縮される。The conventional landfill pile 4 work was done by two people, but in the implementation of this draft, the worker can work alone and the work time is shortened.

本考案の器具より半導体レーザー1を取除き、この箇所に測量用のポールやプリズム鏡を取付けることにより、測量機を使って一人で距離の測量なども出来る。By removing the semiconductor laser 1 from the instrument of the present invention and attaching a surveying pole or prism mirror to this location, it is possible to survey the distance by yourself using a surveying instrument.

1 半導体レーザー
2 光源
3 照射点
4 境界杭
5 台座
6 水平調整ネジ
7 柱
8 腕に取付けた旋回用の柱
9 柱の旋回停止ネジ
10 腕の位置決め板
11 腕の位置決めネジ
12 ストッパー
13 腕
14 腕の旋回停止板
15 溝
16 半導体レーザーの固定治具
17 治具固定ネジ
18 穴
DESCRIPTION OF SYMBOLS 1 Semiconductor laser 2 Light source 3 Irradiation point 4 Boundary pile 5 Base 6 Horizontal adjustment screw 7 Pillar 8 Pillar for rotation attached to arm 9 Pillar rotation stop screw 10 Arm positioning plate 11 Arm positioning screw 12 Stopper 13 Arm 14 Arm Rotation stop plate 15 groove 16 semiconductor laser fixing jig 17 jig fixing screw 18 hole

Claims (2)

土木工事等での境界杭4の設置作業に使用する器具で、台座5と柱7と腕13および半導体レーザー1の固定治具16からなる構成であり、光源2の光線の直進性を利用した器具で、半導体レーザー1の光源2による光線の照射点3にて位置決めをする。腕13を旋回することにより穴掘り作業に支障なく、腕7を元に戻すことにより境界杭4を垂直に埋立てをしたことを照射点3にて確認できる構成である。It is an instrument used for the installation work of the boundary pile 4 in civil engineering work, and is composed of a pedestal 5, a pillar 7, an arm 13, and a fixing jig 16 for the semiconductor laser 1, and utilizes the straightness of light from the light source 2. Using an instrument, positioning is performed at a light irradiation point 3 by the light source 2 of the semiconductor laser 1. By turning the arm 13, it is possible to confirm at the irradiation point 3 that the boundary pile 4 has been buried vertically by returning the arm 7 without causing any trouble in the digging work. 半導体レーザー1の光源2を取除き、これに距離測定用のポールを挿入することにより測量機を使用して距離測定なども出来、従来二人一組での作業も一人の作業者で作業が出来るものである。By removing the light source 2 of the semiconductor laser 1 and inserting a distance measuring pole into it, distance measurement can be performed using a surveying instrument. It is possible.
JP2009001369U 2009-02-13 2009-02-13 Boundary pile reclamation equipment Expired - Fee Related JP3154027U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009001369U JP3154027U (en) 2009-02-13 2009-02-13 Boundary pile reclamation equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009001369U JP3154027U (en) 2009-02-13 2009-02-13 Boundary pile reclamation equipment

Publications (1)

Publication Number Publication Date
JP3154027U true JP3154027U (en) 2009-10-08

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JP2009001369U Expired - Fee Related JP3154027U (en) 2009-02-13 2009-02-13 Boundary pile reclamation equipment

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Country Link
JP (1) JP3154027U (en)

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