JP3122482B2 - Plasma display panel and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a plasma display panel and a method for manufacturing the same.

[0002] Plasma display panel (PDP)
Are widely used as display means for OA equipment, because they are excellent in terms of display brightness and contrast. It is desired to further improve the visibility of the display in such a PDP.

[0003]

2. Description of the Related Art A PDP is composed of a pair of glass substrates facing each other via a discharge space, an electrode group defining a discharge cell, and the like, and performs display by gas discharge generated in the discharge cell.

In particular, in a high-definition PDP, a thin film method is used in forming an electrode in order to obtain a highly accurate pattern. That is, the electrode is formed by patterning a deposited film (thin film) formed by sputtering deposition or the like using a photolithography method.

In general, a metal thin film having a three-layer structure of chromium-copper-chromium, which is excellent in electrical characteristics and adhesion to a glass substrate or the like, is used as an electrode.

In some cases, a transparent electrode made of a Nesa film, an ITO film, or the like is provided as an electrode on the glass substrate on the display surface side. In such a case, an auxiliary electrode (for supplementing the conductivity of the transparent electrode) is used. As a bus electrode), a metal evaporation film having a small width is provided so as to overlap the transparent electrode.

[0007]

As described above, the electrode (including the bus electrode) formed of a metal deposition film has a glossy mirror surface.

Therefore, in a PDP having an electrode on the inner surface of the glass substrate on the display surface side, the electrode is disposed directly below the glass substrate as viewed from the display surface, and therefore, reflection of external light on the surface of the electrode causes reflection of external light. In the display surface, the electrode portion shines irrespective of the light emission due to the discharge, which causes a problem that display visibility is impaired.

The present invention has been made in view of the above problems, and has as its object to prevent a reduction in display visibility due to reflection of external light.

It is another object of the present invention to efficiently manufacture a PDP in which a reduction in display visibility is prevented.

[0011]

Means for Solving the Problems The P according to the first aspect of the present invention.
DP has a structure in which a light absorbing layer made of chromium oxide is provided on the inner surface of the substrate on the display surface side, and an electrode having a laminated structure based on chromium is provided on the light absorbing layer. According to a second aspect of the present invention, in the manufacturing method, a chromium oxide thin film and a metal thin film having a multilayer structure having a chromium layer as a lowermost layer are sequentially and sequentially formed on a substrate on a display surface side, and the metal thin film and the oxidation A method of manufacturing a PDP in which the electrode and the light absorbing layer are formed by partially removing a chromium thin film.

According to a third aspect of the present invention, there is provided a method of manufacturing a plasma display panel having an electrode made of a metal thin film on an inner surface of a substrate on a display surface side, wherein the electrode material is formed on the substrate. A step of sequentially and sequentially forming a dark color thin film made of a certain metal oxide and a metal thin film which is a material of the electrode, and by partially removing the metal thin film and the dark color thin film, the electrodes and Patterning step of forming a light absorbing layer covering the surface.

[0013]

The surface of the electrode 13 on the display surface side is made of chromium.
This surface is covered with the light absorbing layer 40 on the display surface H, whereby reflection of external light on the electrode 13 is prevented.

The electrode 13 and the light absorbing layer 40 are formed by patterning a dark thin film 40a and a metal thin film 13a which are continuously formed.

[0015]

FIG. 1 is a sectional view schematically showing the structure of a PDP 1 according to the present invention.

The PDP 1 is a glass substrate 1 on the display surface H side.
1, rear glass substrate 21, glass substrates 11 and 21
13, 23, dielectric layers 15, 25 made of low-melting glass, protective film 1 made of MgO
7, 27, a sealing glass 31 for sealing the periphery of the glass substrates 11 and 21, and a matrix display system including a light absorbing layer 40 provided on each electrode 13 on the display surface H side of the electrode 13 and the like. Is a facing discharge type PDP.

A discharge gas in which xenon and neon are mixed is sealed in an inner discharge space 30 in which a gap size is defined by a spacer (not shown). In addition, at the intersection of the electrodes 13 and 23 arranged in a lattice shape, discharge cells corresponding to display dots are defined.

The electrodes 13 and 23 are formed of a metal thin film having a three-layer structure of chromium-copper-chromium and have a thickness of about 10,000 °. The chromium layer has a white silver color, and its surface is a glossy mirror surface.

However, in the PDP 1, a light absorbing layer 40 made of, for example, chromium oxide or silicon oxide, which is darker than the chromium layer, is provided between the electrode 13 on the display surface H side and the glass substrate 11. As a result, external light is absorbed, and reflection of the external light on the uppermost layer (chrome layer) of the electrode 13 is prevented.

Next, a method of manufacturing the PDP 1 will be described.

FIG. 2 is a partial sectional view showing each manufacturing step of the PDP 1 according to the present invention.

In order to form a film by vapor deposition, the glass substrate 1
1 is placed in a chamber of a sputtering deposition apparatus (not shown). The sputtering deposition apparatus used here can load a plurality of targets made of different deposition materials into the chamber, and continuously deposits a plurality of layers by transporting the glass substrate 11 and sequentially facing each target. A film can be formed.

After the chamber is evacuated, oxygen is introduced. First, a chromium target (Cr) is sputtered in an oxygen atmosphere. As a result, the evaporated chromium and oxygen are combined and deposited, so that a dark deposited film 40a made of chromium oxide is formed on the glass substrate 11 (FIG. 2A). Sputtering time is 40 minutes
The thickness a is selected to be about 1000 °.

The chromium oxide target may be sputtered in an inert gas atmosphere to form the dark deposited film 40a made of chromium oxide. Further, instead of forming the dark deposited film 40a of chromium oxide, a deposited film made of silicon oxide may be formed using a silicon oxide target.

Subsequently, after the chamber is evacuated again, an inert gas such as argon is introduced. A chromium target and a copper target are sputtered in an inert gas atmosphere, and a chromium layer 131, a copper layer 132, and a chromium layer 133 are sequentially vapor-deposited to form a three-layer metal vapor-deposited film 13a (thickness: about 10,000 °) in dark color. It is formed on the film 40a [FIG. 2 (b)].

After completing the above-described vapor deposition process, the process proceeds to a patterning process. In the patterning step, a series of photolithography processes of photosensitive resist application, pattern exposure, and resist development are performed, and a resist pattern 60 having a predetermined pattern is provided as an etching mask on the metal deposition film 13a [FIG. 2 (c)]. .

Next, the metal deposition film 13a is partially removed (etched) using, for example, hydrochloric acid (chromium etchant) and ferric chloride (copper etchant). Then, using the resist layer 60 as an etching mask, the dark color deposition film 40a is etched using, for example, a mixed solution of potassium ferricyanide and sodium hydroxide.

By etching the metal deposition film 13a and the dark deposition film 40a in this manner, the dark deposition film 40a is etched.
The light absorption layer 40 made of a and the electrode 13 made of the metal deposition film 13a are formed on the glass substrate 11 in the same plane pattern [FIG. 2 (d)].

Thereafter, the dielectric layer 15 covering the electrode 13
And a glass substrate 11 provided with a protective film 17 and a separate electrode 2
Back side glass substrate 2 provided with dielectric layer 3 and dielectric layer 25
The PDP 1 is disposed so as to face the electrodes 13 and 23 so that the electrodes 13 and 23 are orthogonal to each other, and the PDP 1 is completed through sealing with a sealing glass 31 and sealing of a discharge gas.

According to the above-described embodiment, since the light absorption layer 40 is a vapor-deposited film, in the vapor-deposition step for forming the electrode 13, only one layer is vapor-deposited before the vapor-deposition of the metal vapor-deposited film 13a. Since the light absorbing layer 40 can be provided, and a separate step for providing the light absorbing layer 40 is not required, the PDP 1 can be efficiently manufactured. Furthermore, since the dark vapor deposition film 40a to be the light absorbing layer 40 is formed by the oxide (chromium oxide) of the metal material of the electrode 13, the dark vapor deposition film 40a and the metal vapor deposition film 13a can be formed only by changing the vapor deposition atmosphere. Can be formed continuously.

In the above embodiment, a vacuum deposition method may be used as a vapor deposition method, and dry etching may be used instead of wet etching as an etching method.

In the above embodiment, the light absorbing layer 40 made of chromium oxide or silicon oxide is provided.
As the material of 0, a material that is darker than the surface layer of the electrode 13 and has good adhesion to the glass substrate 11 and the electrode 13 can be appropriately selected. For example, low melting point glass colored with a dark pigment may be used.

In the above-described embodiment, the electrode 13 composed of the metal deposition film 13a having a three-layer structure is exemplified.
May be a single-layer thin film. The present invention can also be applied to a PDP in which a thin-film bus electrode is provided on a glass substrate 11 on the display surface H side so as to overlap a transparent electrode.

According to the present invention, it is possible to prevent a decrease in visibility of a display due to reflection of external light on the surface of the electrode while suppressing an increase in the number of manufacturing steps.

According to the second or third aspect of the present invention, it is possible to efficiently manufacture a PDP in which a reduction in display visibility is prevented.

[Brief description of the drawings]

FIG. 1 is a sectional view schematically showing a structure of a PDP according to the present invention.

FIG. 2 is a partial cross-sectional view showing each manufacturing step of the PDP according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 PDPH display surface 11 Glass substrate (substrate) 13 Electrode 40 Light absorption layer 13a Metal vapor deposition film 40a Dark color vapor deposition film

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-63-252338 (JP, A) JP-A-2-284333 (JP, A) JP-A-48-77760 (JP, A) 49530 (JP, U) (58) Field surveyed (Int. Cl. ⁷ , DB name) H01J 11/00-11/02 H01J 9/02

Claims (3)

(57) [Claims] 1. A chromium oxide is formed on an inner surface of a substrate on a display surface side.
Light absorbing layer is provided, and chromium is superposed on the light absorbing layer.
A plasma display panel characterized by comprising an electrode having a laminated structure with a base as a base . 2. The plasma display panel according to claim 1,
A chromium oxide thin film and a chromium layer on the display side substrate.
A metal thin film stacked structure in which continuously formed in this order, by removing the metal thin film and the chromium oxide film partially, this <br/> and forming the electrode and the light-absorbing layer and A method for manufacturing a plasma display panel, comprising: (3) A thin metal film is placed on the inner surface of the display side substrate.
Of manufacturing plasma display panel having electrodes
And The substrate is made of a metal oxide as a material of the electrode.
A dark thin film and a metal thin film that is a material of the electrode in order.
A step of continuously forming a film; Partially removing the metal thin film and the dark thin film
Forming a light absorbing layer covering the electrode and its surface
Patterning step Plastic
A method for manufacturing a zuma display panel.