JP2757049B2 - Substrate clamping device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board clamping device that clamps a board such as a printed wiring board and performs soldering.

(Prior art)

Generally, in a soldering operation on a printed wiring board, a pretreatment for applying a flux or the like to a portion of the board to be soldered is first performed. Thereafter, the substrate is immersed in a solder bath. Thus, the solder adheres to the portion to be soldered, and the soldering operation is completed.

By the way, when the substrate is immersed in a flux bath or a solder bath, it is necessary to hold the substrate by a holding means such as a clamp.

Conventionally, as shown in FIGS. 8 to 11, a soldering operation involves sandwiching a substrate 6 between a clamp plate 2 and a back plate 4.
This is performed using a clamping device.

The clamping device includes a back plate 4 provided below the support plate 3.
A clamp plate 2 rotatably supported by the back plate 4;
A wedge 5 is inserted between the back surface of the clamp plate 2 and the support plate 4.

In addition, on the left side of FIG.
4, a clamp plate 2 and a wedge 5 are provided, and the substrate 6 is sandwiched between the pair of back plates and the like provided on one support plate 3.

The rotation of the clamp plate 2 is performed using the biasing force of the spring 9. Here, the spring 9
As shown in FIG. 8 and FIG.
Is biased by a torsional rotational force so that the lower end contact portion 21 is opened in the F direction.

Then, as shown in FIG. 10, the fitting portion 51 of the wedge 5 is inserted between the back surface of the clamp plate 2 and the support plate 3 from the G direction by an air cylinder (not shown) or the like, whereby the clamp plate Is pushed in the direction of the front end receiving portion 41 of the back plate 41.

Therefore, as shown in FIG. 11, the substrate 6 is sandwiched between the lower end contact portion 21 of the clamp plate 2 and the front end receiving portion 41 of the upper back plate 4 by a force acting in the L direction.

That is, the fitting plate 51 of the wedge 5 is inserted into the clamp plate 2 at the upper end 23 thereof, and a force to be pushed outward K acts. As a result, an L-direction force pressing the substrate 6 acts on the lower end contact portion 21.

Then, with the substrate 6 held therebetween, as shown in FIG. 11, the whole is lowered and the substrate 6 is immersed in the molten solder to perform soldering.

On the other hand, after soldering is completed,
As shown in the figure, the wedge 5 is moved upward in the H direction.
As a result, the biasing force of the spring 9 rotates the clamp plate 2 about the rotation shaft 20 as a fulcrum, and pushes the lower end contact portion 21 in the forward F direction. Therefore, the space between the lower end contact portion 21 and the front end receiving portion 41 is opened, and the substrate 6 can be removed.

[Problem to be solved]

However, the above prior art has the following problems.

That is, as shown in FIG. 11, the soldering operation is performed by immersing the substrate 6 held by the clamp device in the molten solder 8 in the solder bath.

However, when the substrate 6 is immersed, the solution 81 of the molten solder 8 scatters and adheres to the spring 9. Further, the adhesion of the molten solder 8 is particularly remarkable when the surface of the substrate 6 is blown with compressed air in order to remove excess molten solder 8 after the substrate 6 is pulled out of the solder bath. Therefore, the spring 9 loses the urging force due to the adhesion of the solder, and the rotation of the clamp plate 2 becomes insufficient.

As a result, the clamping device has a reduced holding force for the substrate 6 and cannot be used for soldering.

SUMMARY OF THE INVENTION The present invention has been made in view of such a conventional problem, and an object of the present invention is to provide a substrate clamping device capable of maintaining the turning force of a clamp plate.

[Solutions to solve the problem]

The present invention comprises a concave back plate provided below a support plate, a clamp plate rotatably supported by the back plate, and a wedge inserted between the clamp plate and the support plate. In a board clamping apparatus for performing soldering by sandwiching a board such as a printed wiring board between a lower side of a clamp plate and a back plate, the clamp plate is provided between the upper side of the clamp plate and the support plate. A substrate clamping device is provided with a resilient material that urges the lower portion to open.

The most remarkable feature of the present invention is that a resilient material is provided between the upper side of the clamp plate and the support plate to urge the clamp plate in the opening direction.

The expression “above the clamp plate” means, for example, above the rotation shaft of the clamp plate.

Examples of the resilient material include a leaf spring (refer to the first and second embodiments, FIGS. 1 and 4) and a coil spring (refer to a third embodiment, FIG. 7).

Further, as the substrate, for example, a printed wiring board,
There are lead frames and chip carriers.

The clamp plate is attached to the back plate so as to be rotatable around a rotation shaft. The back plate has a concave shape, and holds the substrate between the clamp plate and the back plate.

[Action and effect]

In the substrate clamping apparatus according to the present invention, a resilient material is provided between the upper side of the clamp plate and the support plate to urge the clamp plate in the opening direction. Therefore, even if the substrate below the clamp plate and the substrate are immersed in the molten solder solution, the molten solder solution does not scatter and adhere to the resilient material, and the excess molten solder on the substrate is compressed by compressed air. Even when it is removed, the molten solder does not scatter to the resilient material.

Also, even if solder is attached to the above-mentioned resilient material and the urging force is reduced due to long-term use, the resilient material can be easily replaced or easily cleaned and returned. .
However, conventionally, since the spring is provided on the rotating shaft of the clamp plate, the above replacement and cleaning are not easy.

Therefore, according to the present invention, it is possible to provide a substrate clamping device that can maintain the rotating force of the clamp plate without reducing the urging force of the resilient material.

〔Example〕

First Embodiment A clamp device according to the present embodiment will be described with reference to FIGS.

That is, as shown in FIG.
A concave back plate 4 provided below the support plate 3, a clamp plate 2 rotatably supported by the back plate 4, and a wedge 5 inserted between the back surface of the clamp plate 2 and the support plate 3; And

A resilient material 1 is provided between the upper part of the clamp plate 2 and the support plate 3 to urge the lower end contact portion 21 of the clamp plate 2 in the opening direction.

As shown in FIGS. 1 and 2, the resilient material 1 comprises a semi-arcuate leaf spring. The resilient material 1 is attached and fixed to the support plate 3 at the upper end thereof with screws 10. The lower end of the resilient material 1 is brought into contact with the clamp plate 2 as shown in FIG.
Energize 21 in the opening direction.

The clamp plate 2 is made of a substantially rectangular plate-like titanium plate. The clamp plate 2 has a rotating shaft 20 at the center.
Having.

The support plate 3 is made of a substantially rectangular plate-like stainless steel plate (SUS304). As shown in FIG. 1, the support plate 3 has a locking plate 31 for suspending the robot from the upper center thereof.
Having. The support plate 3 has a substantially concave back plate 4 below, as shown in FIG.

As shown in FIG. 3, the back plate 4 is made of a titanium plate and has a pair of locking plates 40 at both ends. The locking plate 40 has a locking hole 401 for fitting the rotating shaft portion 20 of the clamp plate 2. In addition, the back plate 4 has a tip receiving portion 41 below.

The support plate 3 has an aluminum wedge 5 that moves up and down substantially in the center. The wedge 5 has a fitting portion 51 made of stainless steel at the tip. The fitting portion 51 has a substantially triangular shape, and has a sharp tip portion 511 inserted between the back surface of the clamp plate 2 and the support plate 3. The wedge 5 has a vertically movable connecting portion 52 connected to an air cylinder (not shown) above.

 Next, the function and effect will be described.

First, before clamping the substrate, as shown in FIG.
The tip contact portion 11 of the resilient material 1 urges the upper end 23 of the clamp plate 2 in the direction of the support plate 3. Therefore, the lower end contact part
There is an open state between 21 and the distal end receiving portion 41.

Next, when using the clamp device of this example,
As shown in FIG. 1, the wedge 5 is first moved downward P by an air cylinder. Thereby, the clamp plate 2
And the back plate 4 is closed, and a substrate 6 such as a printed wiring board is sandwiched between the two.

That is, the wedge 5 is inserted between the rear surface of the upper end 23 of the clamp plate 2 and the lower end 32 of the support plate 3. As a result, a force acting in the front R direction is applied to the upper end portion 23 of the clamp plate 2 against the urging force of the resilient material 1 as shown in FIG.

Thus, a force S is applied to the clamp plate 2 such that the lower end contact portion 21 on the opposite side is pressed against the substrate 6 with the rotation shaft portion 20 as a center. Thereby, the substrate 6 is connected to the lower end contact portion.
It is sandwiched between the end receiving portion 41 and the tip receiving portion 41. Next, the substrate 6 is immersed in molten solder 8 (see FIG. 11) in a solder bath. Thus, the board 6 is soldered.

As described above, in the substrate clamping apparatus of the present embodiment, the upper end portion 23 of the clamp plate 2 and the support plate 3
A resilient material 1 is provided for urging the clamp plate 2 in a direction to open a lower portion thereof. Therefore, the molten solder 8
Does not scatter and adhere.

Therefore, according to the present embodiment, it is possible to obtain a substrate clamping device capable of maintaining the rotating power of the clamp plate 2 for a long period of time. Further, since the resilient material 1 has a leaf spring shape and is only attached to the support plate 3, its attachment and cleaning are extremely easy.

Second Embodiment A clamp device according to this embodiment will be described with reference to FIGS.

That is, the clamp device of the present embodiment is provided with the notch 22 at the upper end 23 of the clamp plate 2 in the first embodiment. Other configurations were the same as those in the first embodiment.

As shown in FIG. 4 and FIG. 5, the notch 22 is formed so that the front end contact portion 11 of the resilient material 1 is connected to the front end 23 of the clamp plate 2.
And has a depth substantially the same as the thickness of the resilient material 1.

Therefore, the tip contact portion 11 abuts on the clamp plate 2 in a stable state, and does not protrude from the notch 22.

Therefore, according to this embodiment, in addition to the effects of the first embodiment, it is possible to obtain a clamp device that engages with the upper end of the clamp plate 2 in a state where the resilient material 1 is stable.

Third Embodiment A clamp device according to this embodiment will be described with reference to FIGS. 6 and 7. FIG.

That is, the clamp device of the present embodiment uses a resilient material 12 instead of the resilient material 1 in the first embodiment. Other configurations were the same as those in the first embodiment.

That is, the resilient material 12 includes the spring 121 and the spring holding plate 121. One end of the spring 121 is attached to the upper end 23 of the clamp plate 2, and the other end is disposed in contact with the end back surface 123 of the spring holding plate 122. The spring holding plate 122 has a substantially L shape as shown in FIG. 6, and its base 124 is fixed to the back plate 4.

Thus, in the clamp device of the present embodiment, the spring 121 pushes the distal end portion 23 of the clamp plate 2 in the direction of the support plate 3 and urges the lower end contact portion 21 of the clamp plate 2 in the opening direction.

According to this embodiment, the same effects as in the first embodiment can be obtained.

[Brief description of the drawings]

1 to 3 show a clamp device according to a first embodiment, FIG. 1 is a perspective view thereof, FIG. 2 is a sectional view taken along line AA of FIG. 1, and FIG. 4 and 5 show a clamping device according to a second embodiment, FIG. 4 is a perspective view thereof, FIG. 5 is a sectional view taken along line BB of FIG. 4, and FIG. FIG. 7 and FIG. 7 show a clamping device according to a third embodiment,
6 is a perspective view of the same, FIG. 7 is a sectional view taken along the line CC of FIG. 6, FIGS. 8 to 11 show a conventional clamping device, FIG. FIG. 10 is a perspective view showing a mounted state of the spring, FIG. 10 is a sectional view taken along the line DD in FIG.
FIG. 11 is an explanatory view of use of the clamp device. 1,12 ... elastic material, 2 ... clamp plate, 21 ... lower end contact part, 22 ... cutout part, 3 ... support plate, 4 ... back plate, 41 ... tip receiving part, 5 …… wedge, 6 …… substrate,

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Yoshinori Takasaki 300 Aoyagi-cho, Ogaki-shi, Gifu IBIDEN Inside Aoyagi Plant (72) Inventor Tadashi Inoue 3-128 Asanaka, Ogaki-shi, Gifu Ivy Electronics Industry Co., Ltd. In company

Claims (1)

(57) [Claims] A back plate provided below the support plate, a clamp plate rotatably supported by the back plate, and a wedge inserted between the clamp plate and the support plate. In a board clamping apparatus for performing soldering by sandwiching a board such as a printed wiring board between a lower side of the board and a back board, a lower side of the clamp board is provided between the upper side of the clamp board and the support board. A substrate clamping device provided with a resilient material for urging in a direction to open the substrate.