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JPS59141576U - plating jig - Google Patents

plating jig

Info

Publication number
JPS59141576U
JPS59141576U JP3437983U JP3437983U JPS59141576U JP S59141576 U JPS59141576 U JP S59141576U JP 3437983 U JP3437983 U JP 3437983U JP 3437983 U JP3437983 U JP 3437983U JP S59141576 U JPS59141576 U JP S59141576U
Authority
JP
Japan
Prior art keywords
metal film
plating jig
surface area
substrate
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3437983U
Other languages
Japanese (ja)
Inventor
磯田 陽一
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP3437983U priority Critical patent/JPS59141576U/en
Publication of JPS59141576U publication Critical patent/JPS59141576U/en
Pending legal-status Critical Current

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  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のメッキ治具の正面図、第2図は第1図の
治具を用いたメ゛シキ装置の断面図、第3図は本案によ
るメッキ治具の正面図である。 1・・・・・・基板、2・・・・・・クリップ、3・曲
・ねじ、4・・・・・・支持体、6・・・・・・直流電
源、7・・・・・・電極片、9・・・・・・容器、10
・・・・・・メッキ液、14・・・・・・金属板。
FIG. 1 is a front view of a conventional plating jig, FIG. 2 is a sectional view of a plating device using the jig shown in FIG. 1, and FIG. 3 is a front view of a plating jig according to the present invention. 1... Board, 2... Clip, 3... Bent screw, 4... Support, 6... DC power supply, 7...・Electrode piece, 9...Container, 10
...Plating liquid, 14...Metal plate.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 表面に金属膜を有する半導体等よりなる基板上にAu等
の膜を付着させるメッキ工程におけるメッキ液中に、陰
極として前記金属膜を有する基板とともに、該基板の金
属膜の表面積に比べて充分大きな表面積を有する金属板
を浸漬させたことを・   特徴とするメッキ治具。
In a plating process in which a film of Au or the like is deposited on a substrate made of a semiconductor or the like having a metal film on its surface, a metal film having a surface area sufficiently large compared to the surface area of the metal film of the substrate is used as a cathode together with the substrate having the metal film. A plating jig characterized in that a metal plate having a surface area is immersed.
JP3437983U 1983-03-10 1983-03-10 plating jig Pending JPS59141576U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3437983U JPS59141576U (en) 1983-03-10 1983-03-10 plating jig

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3437983U JPS59141576U (en) 1983-03-10 1983-03-10 plating jig

Publications (1)

Publication Number Publication Date
JPS59141576U true JPS59141576U (en) 1984-09-21

Family

ID=30165145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3437983U Pending JPS59141576U (en) 1983-03-10 1983-03-10 plating jig

Country Status (1)

Country Link
JP (1) JPS59141576U (en)

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