JP2601225B2 - How to dismantle components from a printed circuit board with components - Google Patents
How to dismantle components from a printed circuit board with componentsInfo
- Publication number
- JP2601225B2 JP2601225B2 JP6273817A JP27381794A JP2601225B2 JP 2601225 B2 JP2601225 B2 JP 2601225B2 JP 6273817 A JP6273817 A JP 6273817A JP 27381794 A JP27381794 A JP 27381794A JP 2601225 B2 JP2601225 B2 JP 2601225B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- printed circuit
- circuit board
- components
- mounting surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電気機器に用いられる
電子部品を搭載したプリント基板から、電子部品を解体
する方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of disassembling an electronic component from a printed circuit board on which the electronic component used for an electric device is mounted.
【０００２】[0002]
【従来の技術】従来、部品を搭載したプリント基板（以
下、部品搭載プリント基板と称す）から部品を解体する
方法としては、はんだを溶融させた後、ピンセット等を
用いて手選によって解体する方法、あるいは、はんだを
溶融させた後、アーム型のロボット等を用いて自動的に
特定の部品のみを解体する方法がある。これらの方法は
不良部品を正常な部品と交換することを目的としてお
り、部品搭載プリント基板の品質管理工程において、部
品のリペア方法と呼ばれている。2. Description of the Related Art Conventionally, as a method of disassembling a component from a printed circuit board on which the component is mounted (hereinafter, referred to as a component mounted printed circuit board), a method of melting solder and then manually disassembling it using tweezers or the like is known. Alternatively, after melting the solder, there is a method of automatically disassembling only a specific part by using an arm type robot or the like. These methods aim at replacing a defective component with a normal component, and are called a component repair method in a quality control process of a component mounted printed circuit board.
【０００３】[0003]
【発明が解決しようとする課題】部品搭載プリント基板
を再資源化しようとする場合、同じ種類の部品やプリン
ト基板ごとに回収すれば、回収物の構成成分が同じであ
るので、その後の有価物回収等の再資源化工程が効率よ
く実施できる。しかし、従来の手選やロボットによる解
体方法では、不良部品の交換を目的としているため、全
ての部品を一度に効率よく解体することができない。し
かも、ロボットによる方法では、特定の部品搭載基板上
の特定の部品の解体のみに有効であるが、廃材となった
多種多様の部品搭載プリント基板上の全ての部品を一度
に解体することは困難である。When a component-mounted printed circuit board is to be recycled, if the same type of component or printed circuit board is collected, the components of the collected material are the same. Recycling processes such as recovery can be performed efficiently. However, in the conventional manual dismantling method or the dismantling method using a robot, since the purpose is to replace defective parts, all parts cannot be efficiently dismantled at once. In addition, the robot method is effective only for disassembly of specific components on a specific component mounting board, but it is difficult to dismantle all components on a wide variety of discarded printed circuit boards. It is.
【０００４】以上のように、再資源化の目的で、部品搭
載プリント基板から部品を効率よく解体する方法を確立
することは、大きな課題であった。As described above, it has been a major challenge to establish a method for efficiently dismantling components from a component-mounted printed circuit board for the purpose of recycling.
【０００５】[0005]
【課題を解決するための手段】上述した問題点を解決す
るため、本発明による部品を搭載したプリント基板から
の部品の解体方法の第１の発明は、特定の温度以上で溶
融または分解する接着剤により接着された部品を搭載し
たプリント基板を加熱して接着剤を溶融または分解させ
る加熱工程と、前記加熱工程により接着剤が溶融された
状態のプリント基板の部品搭載面、またはその反対面、
または前記部品搭載面の側面の少なくともいずれかに衝
撃力、または板あるいはブラシなどで前記部品搭載面上
を掃引し前記部品をかき取るせん断力、または前記衝撃
力と前記せん断力の組合せを加えて、部品をプリント基
板から取り外す除去工程を有することを特徴とする。To solve the above problems SUMMARY OF THE INVENTION The first invention of the method of disassembling the parts from a printed board mounted with components according to the invention, soluble above a certain temperature
Heating the printed circuit board mounted with the bonded parts to melt or decompose the glue by fusion or degrade adhesive
That a heating step, the component mounting surface of the printed circuit board in a state where the adhesive is melted by the heating step, or the opposite surface thereof,
Alternatively , at least one of the side surfaces of the component mounting surface
On the component mounting surface with impact, or a plate or brush
Sweeping and scraping the part, or the impact
A removing step of applying a combination of the force and the shearing force to remove the component from the printed circuit board.
【０００６】また、第２の発明は、前記除去工程が、加
熱工程により接着剤が溶融された状態のプリント基板の
部品搭載面、またはその反対面、または部品搭載面の側
面の少なくともいずれかに衝撃力を加えた後、板あるい
はブラシなどで部品搭載面上を掃引し部品をかき取るせ
ん断力を加えて部品をプリント基板から取り外す工程で
あることを特徴とする第１の発明に記載の部品を搭載し
たプリント基板からの部品の解体方法である。According to a second aspect of the present invention, the removing step includes an additional step .
The printed circuit board with the adhesive melted by the heat process
The component mounting surface or its opposite surface, or the component mounting surface side
After applying an impact force to at least one of the surfaces,
Sweeps the parts mounting surface with a brush etc. and scrapes the parts
In the process of removing parts from the printed circuit board by applying shearing force
A method for disassembling a component from a printed circuit board on which the component according to the first aspect is mounted.
【０００７】本発明で対象とする部品搭載プリント基板
は、電子部品が搭載されたプリント基板であって、通常
電気機器に使用されているものを指す。電子部品とは、
ＩＣ、抵抗、コンデンサ、ダイオード、コネクタ、トラ
ンス等の通常電気回路を構成する部品を指す。電子部品
には、プリント基板に貫通して開けられた部品差し込み
穴（以下、スルーホールと称す）に、部品のリード線を
差し込み、はんだ付けする型の部品（以下、スルーホー
ル型部品と称す）、及び、スルーホールを使用せず、プ
リント基板の表面に直接はんだ付けする型の部品（以
下、表面実装型部品と称す）があるが、本発明では、こ
れら両方の型の部品を対象とする。[0007] The component-installed printed circuit board to which the present invention is applied refers to a printed circuit board on which electronic components are mounted, which is usually used for electric equipment. What is an electronic component?
Refers to components that constitute a normal electric circuit such as an IC, a resistor, a capacitor, a diode, a connector, and a transformer. For electronic components, a lead-type component is inserted into a component insertion hole (hereinafter, referred to as a through-hole) formed through the printed circuit board and soldered (hereinafter, referred to as a through-hole type component). , And a type of component that is directly soldered to the surface of a printed circuit board without using a through-hole (hereinafter, referred to as a surface mount type component), and the present invention covers both types of components. .
【０００８】本発明におけるはんだとは、特定の温度以
上で溶融する性質を有し、電子部品とプリント基板とを
接着させるとともに、電子部品とプリント基板に施され
た回路パターンとを電気的に導通させることを目的とし
た電子工業用はんだを指す。電子工業用はんだには、Ｓ
ｎ−Ｐｂ系の合金が通常使用されているが、本発明では
Ｓｎ−Ｐｂ系以外の合金系のはんだも対象とする。更
に、はんだと同じように特定の温度以上で加熱すると溶
融する性質、または特定の温度以上で分解する性質を有
する、樹脂組成物または無機化合物から成る接着剤に対
しても本発明は有効である。[0008] The solder in the present invention has a property of melting at a specific temperature or higher, and bonds an electronic component to a printed circuit board and electrically connects the electronic component to a circuit pattern formed on the printed circuit board. Refers to solder used in the electronics industry for the purpose of S for electronic industry solder
Although an n-Pb-based alloy is generally used, the present invention also covers alloy-based solders other than the Sn-Pb-based alloy. Furthermore, the present invention is also effective for an adhesive composed of a resin composition or an inorganic compound, which has a property of melting when heated at a specific temperature or higher, like a solder, or a property of decomposing at a specific temperature or higher. .
【０００９】[0009]
【作用】本発明は、部品搭載プリント基板を加熱して、
はんだを溶融させる加熱工程と、加熱によりはんだが溶
融された状態のプリント基板の部品搭載面、またはその
反対面、または部品搭載面の側面の少なくともいずれか
に衝撃力、または部品搭載面上を掃引し部品をかき取る
せん断力、または衝撃力とせん断力の組合せを加えて部
品をプリント基板から取り外す除去工程から構成され
る。なお、本発明における解体方法には、加熱工程と除
去工程を必須とするが、各工程の前工程または後工程
に、他の工程を組み入れてもよい。また、加熱工程中に
除去工程を組み入れることも可能である。According to the present invention, a component-mounted printed board is heated,
A heating process to melt the solder, and the impact force is applied to the component mounting surface of the printed circuit board where the solder is melted by heating, or the opposite surface, or the side surface of the component mounting surface, or sweeping over the component mounting surface Scraping parts
It consists of a removing step in which a component is removed from the printed circuit board by applying a shearing force or a combination of an impact force and a shearing force . In the disassembly method of the present invention, a heating step and a removing step are indispensable, but other steps may be incorporated in a step before or after each step. It is also possible to incorporate a removal step into the heating step.
【００１０】本発明における加熱工程では、部品搭載プ
リント基板を加熱して、はんだを溶融させる。加熱方法
としては、赤外線ヒータを熱源とする方法、熱風を熱源
とする方法、不活性有機溶剤の上記の凝縮熱を熱源とす
る方法、高周波によって引き起こされるうず電流を熱源
とする方法が挙げられるが、赤外線ヒータを熱源とする
方法が好ましい。加熱温度は、はんだを十分に溶融させ
るために、はんだの融点以上に設定することが適切であ
り、通常の部品搭載プリント基板では、１９０℃から２
５０℃が好ましい。In the heating step of the present invention, the component-mounted printed board is heated to melt the solder. Examples of the heating method include a method using an infrared heater as a heat source, a method using hot air as a heat source, a method using the above-mentioned heat of condensation of an inert organic solvent as a heat source, and a method using eddy current caused by high frequency as a heat source. A method using an infrared heater as a heat source is preferred. It is appropriate to set the heating temperature to be equal to or higher than the melting point of the solder in order to sufficiently melt the solder.
50 ° C. is preferred.
【００１１】本発明における除去工程では、プリント基
板の部品搭載面とその側面の少なくともいずれかに衝撃
力、または部品搭載面上を掃引し部品をかき取るせん断
力、または衝撃力とせん断力の組合せを加えて、プリン
ト基板から一度に多数の部品を取り外す。なお、衝撃力
やせん断力を同時に部品に加えても、衝撃力及びせん断
力を交互に部品に加えても、または、衝撃力またはせん
断力を単独に加えてもよい。外力を加える方向として
は、プリント基板の部品搭載面に垂直あるいは平行であ
ることが好ましい。外力を加える方法としては、衝撃力
の場合は、部品搭載プリント基板を自由落下させる方法
や、回転羽根、ハンマー等によって、部品搭載基板の部
品搭載面、またはその反対面、または側面を打撃する方
法が挙げられる。なお、部品搭載プリント基板を自由落
下させる場合、落下面と部品搭載面が垂直となるように
設定することが適切であり、回転羽根、ハンマー等によ
って部品搭載プリント基板を打撃する場合は、回転羽
根、ハンマー等の打撃方向と部品搭載面、またはその反
対面、または側面とが垂直になるように設定することが
適切である。せん断力を加える場合は、金属の板やブラ
シ等で部品搭載面を掃引し、部品をかき取る方法が挙げ
られる。なお、除去工程による部品の取り外しは、加熱
工程によるはんだ溶融後に速やかに行う必要がある。こ
のため、加熱炉内でプリント基板を自由落下させるなど
して、加熱工程中に除去工程を組み込むと、より効率的
である。In the removing step according to the present invention, an impact force is applied to at least one of the component mounting surface and the side surface of the printed circuit board, or a shear force for sweeping the component on the component mounting surface to scrape the component.
Applying force, or a combination of impact and shear forces , removes many components at once from the printed circuit board. The impact force
Be added to and parts shearing force simultaneously, impact and shearing
Forces may be applied alternately to parts, or impact or
The shear force may be applied alone. The direction in which the external force is applied is preferably perpendicular or parallel to the component mounting surface of the printed circuit board. As a method of applying an external force, in the case of an impact force, a method of free-falling the component mounting printed circuit board, a method of hitting the component mounting surface of the component mounting substrate, or the opposite surface or side surface thereof with a rotating blade, a hammer, etc. Is mentioned. When the component-mounted printed circuit board is allowed to fall freely, it is appropriate to set the falling surface and the component-mounted surface to be perpendicular to each other. When the component-mounted printed circuit board is hit with a rotating blade, a hammer, or the like, the rotating blade is required. It is appropriate that the direction of impact of a hammer or the like is set perpendicular to the component mounting surface or the opposite surface or side surface. When a shearing force is applied, a method of sweeping the component mounting surface with a metal plate, a brush, or the like to scrape the component may be used. The removal of the components in the removing step needs to be performed promptly after the solder is melted in the heating step. For this reason, it is more efficient to incorporate the removal step into the heating step by free-falling the printed circuit board in the heating furnace.
【００１２】上記のような方法を用いると、部品搭載プ
リント基板の種類及び部品の種類を問わず、部品搭載プ
リント基板から一度に多くの部品を効率的に解体でき
る。By using the above-described method, many components can be efficiently dismantled at once from the component-mounted printed board, regardless of the type of the component-mounted printed board and the type of the component.
【００１３】このようにして解体された部品は、磁力や
形状の違いを利用して、同種の構成成分を含んだ部品ご
とに回収できるので、その後、粉砕工程及び分離工程を
用いれば、特定の有価物を容易に回収できる。また、回
収した部品を再利用することも可能である。更に、部品
が取り外されたプリント基板からは、これに粉砕工程及
び分離工程を行うことで、プリント基板の回路パターン
の銅が回収でき、残ったガラス繊維等の充填材と樹脂の
粉砕物は、建材等の充填材として再利用することができ
る。なお、この際、プリント基板とは構成成分の異なる
部品があらかじめ本発明により取り外されているので、
プリント基板から回収される銅や、ガラス繊維と樹脂の
粉砕物中にそれら部品の構成成分は含まれず、それぞれ
純度の高い回収物が得られる。The parts dismantled in this way can be recovered for each part containing the same kind of constituents by utilizing the difference in magnetic force and shape, and if a pulverizing step and a separating step are used thereafter, a specific part can be obtained. Valuables can be easily collected. It is also possible to reuse the collected parts. Furthermore, by performing a crushing step and a separating step on the printed circuit board from which the components have been removed, copper of the circuit pattern of the printed circuit board can be recovered, and the remaining filler such as glass fiber and the crushed resin are: It can be reused as a filler for building materials. At this time, since components having different components from the printed circuit board have been removed in advance according to the present invention,
The components recovered from the printed circuit board, such as copper and the crushed product of glass fiber and resin, do not contain the components of these components, and thus a recovered product of high purity can be obtained.
【００１４】[0014]
【実施例】以下、本発明の一実施例について説明する。An embodiment of the present invention will be described below.
【００１５】サンプルとしては、銅パターン付きガラス
繊維強化エポキシ樹脂製のプリント基板に、電子部品を
はんだ付けしたものを用いた。電子部品として、スルー
ホール型部品と表面実装型部品を用いた。スルーホール
型部品としては、リードピン数２４０本のＰＧＡ（ピン
グリッドアレイパッケージ）、リードピン数１６本のＤ
ＩＰ（デュアルインラインパッケージ）、及び、リード
ピン数２本の抵抗を用い、これらをプリント基板にはん
だ付けした。表面実装型部品としては、リードピン数６
４本のＱＦＰ（クワッドフラットパッケージ）、チップ
コンデンサ、及び、チップ抵抗を用い、これらをプリン
ト基板にはんだ付けした。使用した部品の数は、スルー
ホール型部品が３０個、表面実装型部品が３０個であ
り、部品の総数は６０個とした。尚、使用したはんだの
組成はＳｎ６０ｗｔ％、Ｐｂ４０ｗｔ％である。As a sample, an electronic component was soldered to a printed circuit board made of glass fiber reinforced epoxy resin with a copper pattern. Through-hole type components and surface mount type components were used as electronic components. As through-hole type components, PGA (pin grid array package) having 240 lead pins and DGA having 16 lead pins are used.
These were soldered to a printed circuit board using an IP (dual inline package) and a resistor having two lead pins. Six lead pins for surface mount components
Using four QFPs (quad flat packages), chip capacitors, and chip resistors, these were soldered to a printed circuit board. The number of components used was thirty through-hole type components, thirty surface mount type components, and the total number of components was 60. The composition of the solder used was Sn 60 wt% and Pb 40 wt%.
【００１６】表１に本発明の実施例１〜５及び比較例１
〜３を示す。部品の解体性は、部品の解体率で評価し
た。ここで、部品の解体率は、プリント基板に搭載され
た部品の総数に対する解体された部品の数の割合を示
す。Table 1 shows Examples 1 to 5 of the present invention and Comparative Example 1.
3 are shown. The disassembly of the part was evaluated by the disassembly rate of the part. Here, the disassembly ratio of a component indicates a ratio of the number of disassembled components to the total number of components mounted on the printed circuit board.
【００１７】本発明の実施例では、前記の加熱工程後、
除去工程を行った。実施例の加熱工程では、赤外線ヒー
タを加熱機として用い、上記の部品搭載プリント基板を
２１０℃で３分間加熱し、はんだを溶融させた。In an embodiment of the present invention, after the heating step,
A removal step was performed. In the heating step of the example, the above-mentioned component-mounted printed circuit board was heated at 210 ° C. for 3 minutes using an infrared heater as a heater to melt the solder.
【００１８】実施例１の除去工程では、部品搭載プリン
ト基板を自由落下させ、部品に衝撃力を加えた。この
時、落下距離を１ｍに設定し、落下面と部品搭載プリン
ト基板の部品搭載面が垂直となるように設定した。その
後、ステンレスの板を用いて部品搭載面を掃引し、部品
にせん断力を加えた。実施例２では、前記の加熱工程
後、実施例１と同様に部品搭載プリント基板を自由落下
させ、部品に衝撃力のみを加えた。実施例３では、前記
の加熱工程後、ステンレスの板を用いて部品搭載プリン
ト基板の部品搭載面を掃引し、部品にせん断力のみを加
えた。In the removing step of Example 1, the component-mounted printed circuit board was allowed to fall freely, and an impact force was applied to the component. At this time, the falling distance was set to 1 m, and the falling surface was set to be perpendicular to the component mounting surface of the component mounting printed circuit board. Thereafter, the component mounting surface was swept using a stainless steel plate, and a shearing force was applied to the component. In Example 2, after the above-described heating step, the component-mounted printed circuit board was allowed to freely fall in the same manner as in Example 1, and only an impact force was applied to the component. In Example 3, after the heating step, the component mounting surface of the component mounting printed circuit board was swept using a stainless steel plate, and only a shearing force was applied to the component.
【００１９】実施例４では、前記加熱工程後、回転羽根
によって部品搭載プリント基板の部品搭載面の反対面に
垂直に衝撃力を加え、その後、ステンレスの板を用いて
部品搭載面を掃印し、部品にせん断力を加えた。この
時、回転羽根には、回転軸にステンレスの板を４枚設置
したものを使用した。使用した回転羽根において、ステ
ンレスの板の大きさは縦５cm、横５cm、厚さ０．５cm、
回転数は３００ｒｐｍとし、衝撃力を加える時間は５秒
に設定した。In the fourth embodiment, after the heating step, an impact force is applied perpendicularly to the component mounting surface of the component mounting printed circuit board by the rotating blades, and then the component mounting surface is swept using a stainless steel plate. A shear force was applied to the part. At this time, the rotating blade used had four stainless steel plates installed on the rotating shaft. In the rotating blade used, the size of the stainless steel plate is 5 cm long, 5 cm wide, 0.5 cm thick,
The rotation speed was set to 300 rpm, and the time for applying the impact force was set to 5 seconds.
【００２０】実施例５では、前記加熱工程後、ハンマー
によって部品搭載プリント基板の部品搭載面の側面に垂
直に衝撃力を加え、その後、ステンレスの板を用いて部
品搭載面を掃印し、部品にせん断力を加えた。この時、
ハンマーにはシャルピー衝撃試験機を使用した。使用し
たシャルピー衝撃試験機のハンマーの重量は２．２ｋ
ｇ、ハンマーの回転軸中心線から打撃点までの距離は３
６cmであり、ハンマーの持ち上げ角度は４５度に設定し
た。In the fifth embodiment, after the heating step, an impact force is applied vertically to the side surface of the component mounting surface of the component mounting printed board with a hammer, and then the component mounting surface is swept using a stainless steel plate. Was subjected to a shearing force. At this time,
The hammer was a Charpy impact tester. The weight of the Charpy impact tester used was 2.2k
g, the distance from the center line of rotation of the hammer to the strike point is 3
6 cm, and the hammer lifting angle was set to 45 degrees.
【００２１】比較例１では、部品搭載プリント基板を赤
外線ヒータを用いて、２１０℃で３分間加熱し、その後
部品搭載面を下に向け、３０秒間保持した。比較例２で
は、加熱工程を行わずに、部品搭載プリント基板を自由
落下させ、部品に衝撃力のみを加えた。比較例３では、
加熱工程を行わずに、ステンレスの板を用いて部品搭載
プリント基板にせん断力のみを加えた。In Comparative Example 1, the component-mounted printed board was heated at 210 ° C. for 3 minutes using an infrared heater, and then held for 30 seconds with the component-mounting surface facing down. In Comparative Example 2, the component-mounted printed circuit board was allowed to fall freely without performing the heating step, and only an impact force was applied to the component. In Comparative Example 3,
Without a heating step, only a shearing force was applied to the component-mounted printed circuit board using a stainless steel plate.
【００２２】[0022]
【表１】 [Table 1]
【００２３】本発明の実施例及び比較例から明らかなよ
うに、本発明によれば、部品搭載プリント基板から、一
度に多くの部品効率的に解体できることが分かる。As is clear from the examples and comparative examples of the present invention, according to the present invention, it can be seen that many components can be efficiently dismantled at once from the component mounted printed circuit board.
【００２４】また、実施例１〜５と比較例１〜３を比較
することにより、加熱工程と除去工程が部品の解体に必
須であることが分かる。比較例１のように加熱工程のみ
でも、比較例２、３のように除去工程のみでも、部品の
解体率は極めて低いが、実施例１〜３のように、加熱工
程と除去工程の両方を用いることで、部品全体の解体効
率は７５％以上と極めて高くなることが分かる。Further, by comparing Examples 1 to 5 and Comparative Examples 1 to 3, it can be seen that the heating step and the removing step are indispensable for dismantling the parts. Even when only the heating step is performed as in Comparative Example 1, or when only the removing step is performed as in Comparative Examples 2 and 3, the disassembly rate of the part is extremely low. It can be seen that the disassembly efficiency of the entire part is extremely high at 75% or more by using it.
【００２５】更に、実施例１、４、５では除去工程で部
品に加える外力は、衝撃力及びせん断力であり、実施例
２では衝撃力のみであり、実施例３ではせん断力のみで
あるが、より効果的な解体を行うには、実施例１、４、
５のように除去工程に衝撃力及びせん断力を用いること
が好ましいことがわかる。Further, in the first, fourth and fifth embodiments, the external force applied to the component in the removing step is an impact force and a shear force. In the second embodiment, only the impact force is applied. In the third embodiment, only the shear force is applied. In order to perform more effective disassembly, the embodiments 1, 4,
As shown in Fig. 5, it is preferable to use an impact force and a shear force in the removing step.
【００２６】[0026]
【発明の効果】本発明によれば、多種多様な部品搭載プ
リント基板から、一度に多数の部品を効率よく解体する
ことができる。このようにして解体された部品は、磁力
や形状の違いを利用して、同種の構成成分を含んだ部品
ごとに回収できるので、その後、粉砕工程及び分離工程
を用いれば、特定の有価物を容易に回収できる。また、
回収した部品を再利用することも可能である。更に、部
品が解体されたプリント基板からは、粉砕工程及び分離
工程を用いることで、プリント基板上の回路パターンの
銅が回収でき、残ったガラス繊維等の充填材と樹脂の粉
砕物は、建材等の充填材として再利用することができ
る。なお、この際、プリント基板とは構成成分の異なる
部品があらかじめ本発明により取り外されているので、
プリント基板から回収される銅や、ガラス繊維と樹脂の
粉砕物の中にそれら部品の構成成分は含まれず、それぞ
れ純度の高い回収物が得られる。According to the present invention, a large number of components can be efficiently dismantled at once from a variety of component-mounted printed boards. The parts dismantled in this way can be recovered for each part containing the same kind of component by utilizing the difference in magnetic force and shape, so that if a pulverizing step and a separating step are used, specific valuable resources can be recovered. Can be easily collected. Also,
It is also possible to reuse the collected parts. Furthermore, by using a pulverizing step and a separating step from the disassembled printed circuit board, copper of the circuit pattern on the printed circuit board can be recovered, and the remaining pulverized filler such as glass fiber and resin are used as building materials. Can be reused as a filler. At this time, since components having different components from the printed circuit board have been removed in advance according to the present invention,
The components recovered from the printed circuit board, such as copper and the crushed product of glass fiber and resin, do not contain the constituent components of the components, and thus a recovered product of high purity can be obtained.
【００２７】以上のように、本発明によれば、再資源化
を目的とした部品の解体が効率的に行えるので、その後
の有価物の回収が極めて容易となる。As described above, according to the present invention, parts can be efficiently disassembled for the purpose of recycling, and the subsequent recovery of valuable resources becomes extremely easy.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 生田 優司 東京都港区芝五丁目７番１号 日本電気 株式会社内 (56)参考文献 特開 昭61−295696（ＪＰ，Ａ) 特開 昭62−40795（ＪＰ，Ａ) 特開 昭53−76370（ＪＰ，Ａ) 特開 昭61−196597（ＪＰ，Ａ) 特公 昭57−55316（ＪＰ，Ｂ２) ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Yuji Ikuta 5-7-1 Shiba, Minato-ku, Tokyo NEC Corporation (56) References JP-A-61-295696 (JP, A) JP-A-62 JP-A-40795 (JP, A) JP-A-53-76370 (JP, A) JP-A-61-196597 (JP, A) JP-B-57-55316 (JP, B2)
Claims (3)
着剤により接着された部品を搭載したプリント基板から
前記部品を解体する方法であって、前記部品を搭載した
前記プリント基板を加熱して前記接着剤を溶融または分
解させる加熱工程と、前記加熱工程により接着剤が溶融
された状態の前記プリント基板の部品搭載面、またはそ
の反対面、または前記部品搭載面の側面の少なくともい
ずれかに衝撃力、または板あるいはブラシなどで前記部
品搭載面上を掃引し前記部品をかき取るせん断力、また
は前記衝撃力と前記せん断力の組合せを加えて、前記部
品を前記プリント基板から取り外す除去工程を有するこ
とを特徴とする部品を搭載したプリント基板からの部品
の解体方法。1. A contact which melts or decomposes at a specific temperature or higher.
A method of disassembling the parts from a printed board mounted with the bonded part by Chakuzai, melting or partial the adhesive by heating the printed circuit board mounted with the component
A heating step for dissolving, and an impact force, or a plate or a brush, on at least one of the component mounting surface of the printed circuit board in a state where the adhesive is melted by the heating process, or the opposite surface thereof, or the side surface of the component mounting surface. Such as the part
Shear force that sweeps over the product mounting surface and scrapes the component,
A method for disassembling a component from a printed circuit board on which a component is mounted, comprising: removing the component from the printed circuit board by applying a combination of the impact force and the shearing force .
着剤により接着された部品を搭載したプリント基板から
前記部品を解体する方法であって、前記部品を搭載した
前記プリント基板を加熱して前記接着剤を溶融または分
解させる加熱工程と、前記加熱工程により接着剤が溶融
された状態の前記プリント基板の部品搭載面、またはそ
の反対面、または前記部品搭載面の側面の少なくともい
ずれかに衝撃力を加えた後、板あるいはブラシなどで前
記部品搭載面上を掃引し前記部品をかき取るせん断力を
加えて、前記部品を前記プリント基板から取り外す除去
工程を有することを特徴とする部品を搭載したプリント
基板からの部品の解体方法。2. A contact which melts or decomposes at a specific temperature or higher.
From printed circuit boards with components bonded by adhesive
A method of disassembling the component, wherein the component is mounted
The printed circuit board is heated to melt or disperse the adhesive.
Heating step to dissolve and the adhesive melts by the heating step
Component mounting surface of the printed circuit board
Or at least the side of the component mounting surface
After applying an impact force to the gap, move it forward with a plate or brush.
The shear force that sweeps over the part mounting surface and scrapes the part
In addition, removing the component from the printed circuit board
A method of disassembling a component from a printed circuit board on which the component is mounted, comprising the steps of:
ち、少なくとも一部がスルーホール型部品であることをThat is, at least a part is a through-hole type part.
特徴とする請求項１または請求項２記載の部品を搭載しA component according to claim 1 or claim 2 is mounted.
たプリント基板からの部品の解体方法。Of dismantling parts from printed circuit boards.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6273817A JP2601225B2 (en) | 1994-11-08 | 1994-11-08 | How to dismantle components from a printed circuit board with components |
| US08/554,159 US5715592A (en) | 1994-11-08 | 1995-11-06 | Parts disassembling apparatus |
| DE19541678A DE19541678C2 (en) | 1994-11-08 | 1995-11-08 | Method and device for dismantling printed circuit boards with assembled components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6273817A JP2601225B2 (en) | 1994-11-08 | 1994-11-08 | How to dismantle components from a printed circuit board with components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08139446A JPH08139446A (en) | 1996-05-31 |
| JP2601225B2 true JP2601225B2 (en) | 1997-04-16 |
Family
ID=17532978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6273817A Expired - Fee Related JP2601225B2 (en) | 1994-11-08 | 1994-11-08 | How to dismantle components from a printed circuit board with components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2601225B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7190638B2 (en) | 2003-05-09 | 2007-03-13 | Seiko Epson Corporation | Electronic timepiece with radio communication function |
| JP2009253163A (en) * | 2008-04-09 | 2009-10-29 | Fujitsu Ltd | Separation collection method and device for electronic component |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2755225B2 (en) * | 1995-02-10 | 1998-05-20 | 日本電気株式会社 | Separation and disassembly of printed wiring boards with components |
| JP2910719B2 (en) * | 1997-03-04 | 1999-06-23 | 日本電気株式会社 | Method and apparatus for separating components from printed circuit board |
| EP1008395A3 (en) | 1998-12-11 | 2003-05-02 | Matsushita Electric Industrial Co., Ltd. | Method for separating metallic material from waste printed circuit boards, and dry distilation apparatus used for waste treatment |
| JP2002361108A (en) * | 2001-06-06 | 2002-12-17 | Sinto Brator Co Ltd | Recycling method for used fixed tooth plate of jaw crusher |
| WO2013111206A1 (en) * | 2012-01-27 | 2013-08-01 | パナソニック株式会社 | Electronic component separating/collecting method and electronic component separating/collecting apparatus |
| JP6614583B2 (en) * | 2017-01-30 | 2019-12-04 | 株式会社アステック入江 | Electronic component separation method |
| CN108620859B (en) * | 2018-06-20 | 2019-11-12 | 安徽科创新能源科技有限责任公司 | A kind of multi-functional screw-driving machine of maintenance of electromechanical equipment |
| JP7398674B2 (en) * | 2020-09-17 | 2023-12-15 | 株式会社アステック入江 | Substrate stripping equipment and substrate stripping system |
| WO2024134938A1 (en) * | 2022-12-22 | 2024-06-27 | 株式会社村田製作所 | Electronic component, electronic component mounting structure, and method for separating electronic component |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5376370A (en) * | 1976-12-20 | 1978-07-06 | Hitachi Ltd | Method of removing attached part terminal from printed circuit board |
| JPS5637699A (en) * | 1979-09-05 | 1981-04-11 | Mitsui Mining & Smelting Co | Device for separating and recovering solder for printed board |
| JPS5755316A (en) * | 1980-09-22 | 1982-04-02 | Nippon Zeon Co Ltd | Incinerating of thermal decomposing apparatus using fluidized bed |
| JPS61196597A (en) * | 1985-02-27 | 1986-08-30 | 株式会社日立製作所 | Apparatus for removing electronic component |
| JPH0758828B2 (en) * | 1985-06-24 | 1995-06-21 | 沖電気工業株式会社 | Chip parts removing device |
| JPS6240795A (en) * | 1985-08-16 | 1987-02-21 | 富士通株式会社 | Removal of electronic component with flat lead |
-
1994
- 1994-11-08 JP JP6273817A patent/JP2601225B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7190638B2 (en) | 2003-05-09 | 2007-03-13 | Seiko Epson Corporation | Electronic timepiece with radio communication function |
| JP2009253163A (en) * | 2008-04-09 | 2009-10-29 | Fujitsu Ltd | Separation collection method and device for electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08139446A (en) | 1996-05-31 |
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