JPH0758828B2 - Chip parts removing device - Google Patents

Description

The present invention relates to a chip component removing device mounted on a substrate.

(Prior Art) First, a conventional device of this type will be described.

FIG. 5 (A) is a perspective view schematically showing a conventional chip component removing device, and FIG. 5 (B) is an enlarged view of a main part of the conventional chip component removing device. 11 is a gas inlet 12 and a gas jet 13
A gas heater having a gas passage therebetween, and 14 is a sample fixing base. The substrate 16 on which the chip parts 15 are mounted is used as the sample holder.
It is fixed on 14 by means of vise. Reference numeral 17 is a claw for peeling off a chip component, which is fixed to a claw fixing base 18 and can be operated by a claw moving knob 19.

According to this conventional chip component removing device, the gas inlet 12
For example, N ₂ gas is introduced, and this gas is passed from the gas outlet 13 through the gas passage of the gas heater 11 to the chip component on the substrate 16.
Eject toward 15. During this, N ₂ gas is, for example, 300 to 5
It is heated to 00 ° C. Normally, the substrate 16 is preheated on the sample fixing base 14, and the gas jet port is placed on the chip component 15 to be removed.
When high-temperature N ₂ gas is jetted from 13 and applied, the temperature of, for example, the Ag adhesive 20 bonded to the substrate 16 and the chip component 15 rises to the softening point, and at the same time, the chip component 15 is pushed by the tab 17. The chip component 15 was removed.

(Problems to be Solved by the Invention) However, in the device having the conventional configuration as described above, since the chip component is pushed and removed by the claw, another portion that does not need to be removed is provided near the pushed side of the chip component to be removed. If a part is placed or another part is also installed in the movement path of the claw, the part removed by the claw or the claw itself is formed on another part or the substrate. There were problems such as damage to the circuit pattern.

Further, in the above-described conventional apparatus, the gas outlet of the gas heater is formed in a nozzle shape, and therefore, high temperature gas is ejected from the nozzle-shaped gas outlet to heat the chip component. The heating efficiency of parts is not always good. As a result, there has been a problem that the efficiency of the chip component removing work is reduced. When the lower surface of the chip component is adhered to the substrate with an adhesive, it is desirable to increase the heating efficiency of the chip component in order to shorten the time required to soften the adhesive on the lower surface of the chip component.

An object of the present invention is to eliminate the above-mentioned conventional problems, to easily perform chip component removal of a high-density component mounting board without damaging other components or circuit patterns, and to remove chip components. It is an object of the present invention to provide a chip component removing device configured so that the above can be performed more efficiently.

(Means for Solving the Problems) In order to achieve this object, according to the present invention, an object for fixing a substrate to which the lower surface of a chip component is bonded by using an adhesive that is softened by heating A sample stage having a heater for preheating the substrate and a recess for accommodating the chip component, and a high-temperature gas whose temperature is controlled so as to raise the adhesive to the softening point temperature are supplied from the recess. It is characterized in that it is provided with a housing heating means having a gas passage for jetting, and a vibrating means for peeling the chip component by vibrating the substrate and the chip component relatively after the adhesive is softened.

In a preferred embodiment of the present invention, the vibrating means is ultrasonic vibrating means for ultrasonically vibrating the housing heating means.

Alternatively, since the chip parts are peeled off after the adhesive has been raised to the softening point temperature, it is preferable to vibrate the sample stage by vibrating means.

Alternatively, in carrying out the present invention, a gas passage is provided in the housing heating means, one end of the gas passage is connected to a suction device, and the peeled chip component is adsorbed by the housing heating means and removed from the substrate. It is suitable.

(Operation) According to this structure, heat is supplied to the chip component to be removed by the housing heating means to raise the adhesive for bonding the chip component and the substrate to the softening point, and after the adhesive is softened, the vibrating means is used. Since the chip component and the substrate can be vibrated relatively with each other, the chip component can be easily separated from the substrate. Therefore, the peeled chip component may be pinched with tweezers. Alternatively, a negative pressure may be formed in the concave portion of the housing heating means by a suction device via the gas passage of the housing heating means, and the negative pressure may adsorb and remove the chip component.

Therefore, according to the chip component removing apparatus of the present invention, it is not necessary to use a conventional peeling claw, and therefore, unnecessary chip components can be easily removed without damaging other necessary components or circuit patterns.

Moreover, the housing heating means has a recess for housing the chip component so as to cover the periphery of the chip component, and also has a gas passage for ejecting high temperature gas from the recess. Therefore, when softening the adhesive that intervenes between the lower surface of the chip component and the substrate to bond them, it is possible to spread the high temperature gas evenly around the chip component. The heat transfer to the chip component can be performed more efficiently.

Embodiments Embodiments of the present invention will be described below with reference to the drawings. It should be noted that the drawings schematically show the respective constituents to the extent that the present invention can be understood, and therefore the dimensions, shapes, and positional relationships of the respective constituents are not limited to the illustrated examples. or,
The same components as those shown in FIGS. 6A and 6B are designated by the same reference numerals, and detailed description thereof will be omitted.

FIG. 1 is a perspective view showing the outline of a chip component removing device.

In this figure, reference numeral 21 denotes an accommodation heating means, which is an instrument called collet, for example. In this embodiment, this collet 21 has a gas passage therein, and this gas passage (reference numeral 22 in FIG. 2).
One end of the gas passage (denoted by a symbol) is connected to the gas ejection port 13 of the gas heater 11 as a gas introduction port. The shape of the gas ejection port 13 of the gas heater 11 can be any suitable shape that can guide the high temperature gas to the gas passage 22 of the collet 21.

The sample stage 14 is provided with a heater for preheating it, and therefore the substrate 16 fixed to the sample stage 14 can be preheated by this heater. Reference numeral 23 is a connection line for supplying electric power to this heater. Further, 24 is a part which does not need to be removed.

FIG. 2 is an enlarged cross-sectional view mainly showing the collet 21 as the housing heating means, and 22 is a gas passage formed inside the collet 21. Inside the collet on the other end side of the gas passage 22, a recess is formed as a housing portion for housing the chip component 15. The gas ejection port 25 of the gas passage 22 is provided in this recess.
To provide.

Next, the operation of this embodiment will be described with reference to FIGS.

First, the collet 21 is set on the chip component 15 to be removed, and the chip component 15 is fitted into the containing portion. Next, a gas that is stable at high temperature, such as N ₂ gas or air, is introduced into the gas inlet 12
To the gas heater 11 where it is heated to 300-500 ° C. This heating gas (also referred to as high temperature gas) is passed through the gas passage 22 in the collet 21 and the gas jet port 25 of the collet 21.
It spouts from the chip component 15. This heating gas raises the temperature of the chip part 15 and
The adhesive 20 that is interposed between the lower surface of the substrate and the substrate 16 to bond them together is heated to a temperature at which it is softened. In this case, the adhesive 20 used may be of any type as long as it is an adhesive that is softened by heat (for example, epoxy-based Ag paste, solder, etc.).

When the softening point is reached, the sample stage 14 is vibrated by vibrating means to relatively vibrate the chip component 15 and the substrate 16, and the chip component 15 is separated from the substrate 16. After peeling off the chip component 15, the ejection of heating gas was stopped, and this time the gas passage
Adsorb the chip component 15 that has been peeled off using
Is separated from the substrate 16 and thus the chip component 15 is removed from the substrate 16.

FIGS. 3 (A) and 3 (B) are perspective views showing modified examples of the collet as the housing heating means.

As the collet 21, as shown in FIG. 3 (A), one having a structure in which a part of the chip component 15 is covered and accommodated, or as shown in FIG. It can be formed as a housing structure.

Next, a second embodiment of the present invention will be described.

FIG. 4 is a perspective view of a chip component removing device for explaining a second embodiment of the present invention.

Also in this embodiment, the collet 21 has a gas passage 22 for ejecting a high temperature gas as in the first embodiment (see FIG. 2). Further, in order to further improve the heating efficiency, a heater 26 capable of controlling the temperature of the collet 21 itself to a high temperature is provided at an appropriate position. Further, an ultrasonic vibration (oscillation) horn 27 that can be connected to an external ultrasonic oscillator for ultrasonically vibrating the collet 21 is provided.

The collet 21 is set on the chip part 15 to be removed, and the collet 21 is heated by the heater 26 to remove the chip part 15.
Supply heat to 15. By doing so, it is possible to raise the temperature of the adhesive 20 that bonds the substrate 16 and the chip component 15 to the softening point.

When the softening point is reached, the collet (21) is ultrasonically vibrated to vibrate the chip component (15) relative to the substrate (16), so that the chip component (15) is separated from the substrate (16). The peeled chip component 15 is pinched with tweezers and removed. In this case, when the collet 21 is provided with a suction means, the chip component 15 may be adsorbed by the collet and removed.

(Effect of the Invention) As is apparent from the above description, according to the chip component removing device of the present invention, since there is no operation of pushing the chip component with the claw, the chip component can be easily removed even on the high-density chip component mounting board.

Moreover, since the housing heating means does not directly touch the substrate pattern, the pattern is not damaged.

Further, since the chip component to be removed is housed in the recess of the housing heating means and the high temperature gas is introduced into the recess to heat the chip component, heat transfer from the high temperature gas to the chip component can be performed more efficiently. . Therefore, the time required to soften the adhesive agent interposed between the lower surface of the chip component to be removed and the substrate can be shortened, and as a result, the work efficiency of the chip component removing operation can be improved. Moreover, since the peeled chip component does not fly to other chip components, there is an effect that other chip components are not damaged, and efficient and safe chip component removal of the high-density chip component mounting board can be expected.

[Brief description of drawings]

FIG. 1 is a perspective view showing the outline of a first embodiment of the present invention, FIG. 2 is an enlarged sectional view of a collet which is an embodiment of the housing heating means of the first embodiment, FIGS. 3 (A) and (A). B) is a perspective view showing a modified example of the collet of the first embodiment, FIG. 4 is a perspective view of a chip component removing device for explaining the second embodiment of the present invention, and FIG. FIG. 5 is a perspective view schematically showing the chip part removing device, and FIG. 5 is an enlarged view of a main part thereof. 11 …… Gas heater, 12 …… Gas inlet 14 …… Sample holder, 15 …… Chip part 16 …… Board, 20 …… Adhesive 21 …… Housing and heating means (collet) 22 …… Gas passage, 23 …… Connecting wire 24 …… Parts that do not need to be removed, 25 …… Gas outlet 26 …… Heater 27 …… Ultrasonic vibration (oscillation) horn

Claims (5)

[Claims] 1. A sample stage for fixing a substrate to which a lower surface of a chip component is adhered by using an adhesive which is hardened by heating, the sample stage having a heater for preheating the substrate. An accommodating and heating means having a concave portion for accommodating the chip component and having a gas passage for ejecting a high-temperature gas whose temperature is controlled to raise the adhesive to a difficult point temperature from the concave portion; A chip part removing device comprising: a vibrating means for vibrating the substrate and the chip part relative to each other after the agent becomes difficult to separate the chip part. 2. The chip component removing apparatus according to claim 1, wherein the housing heating means comprises a heater for supplying heat for raising the adhesive to the temperature of the difficulty point. 3. The chip component removing apparatus according to claim 1, wherein the vibrating means is ultrasonic vibrating means for ultrasonically vibrating the housing heating means. 4. The vibrating means vibrates the sample stage in order to peel off the chip component after raising the adhesive to the softening point temperature, so that the vibrating means vibrates the sample stage. Chip component removing device. 5. The chip component removing device according to claim 1 or 2, wherein the peeled chip component is adsorbed by the housing heating means to be removed from the substrate.