JP2023138347A - Mounting device and mounting method - Google Patents

Abstract

To provide a mounting device and a mounting method that can reduce differences in bonding strength between electronic components.SOLUTION: A mounting device 1 according to an embodiment includes a mounting device 30 that mounts an electronic component 2 on a substrate 3 by aligning a mounting surface 2a of the electronic component 2 and a mounting surface 3a of the substrate 3, and a gas supply device 60 that includes a spraying portion 610 that can be inserted between the mounting surface 2a of the electronic component 2 and the mounting surface 3a of the substrate 3, which are arranged facing each other before mounting the electronic component 2 on the substrate 3, and sprays gas containing active species generated by plasma toward the mounting surface 2a of the electronic component 2 and the mounting surface 3a of the substrate 3 from the spraying portion 610 in a direction perpendicular to each of the mounting surfaces 2a and 3a.SELECTED DRAWING: Figure 7

Description

The present invention relates to a mounting apparatus and a mounting method.

Electronic components such as semiconductor chips are picked up from wafers or trays, transported onto a substrate, and mounted by pressing them against the substrate.

Here, in so-called direct bonding, in which electronic components are directly bonded to a substrate, the bonding surfaces of the substrate or electronic components are cleaned and activated, and then they are bonded by bringing them into contact with each other. For example, as shown in Patent Document 1, by performing reactive ion etching or irradiation with N ₂ or O ₂ radicals on the board or electronic component in a reduced pressure chamber, the mounting surface of the board or electronic component is removed. Hydrophilic treatment is performed to activate the In addition, in the following description, such hydrophilization may be expressed as activation.

Japanese Patent Application Publication No. 2020-68379

For example, hydroxyl groups added to make substrates and electronic components hydrophilic affect bonding strength. However, the hydroxyl groups once attached to the bonding surface decrease over time due to desorption, etc. In the conventional technology described above, the substrate is made hydrophilic in a hydrophilic device, and the wafer is individually attached to a wafer sheet or electronic components placed on a tray are subjected to hydrophilic treatment at once. Then, each is transported to a bonding device, and the electronic components are mounted on the board one by one. As a result, the time required from providing the hydroxyl group to mounting the electronic component on the substrate differs depending on the electronic component. For this reason, the amount of hydroxyl groups once applied differs from electronic component to electronic component, resulting in a difference in bonding strength between electronic components. In particular, in bonding equipment, there is a large time difference between the first electronic component and the last electronic component supplied from a wafer sheet or tray, from the addition of hydroxyl groups to the time of bonding, resulting in a large difference in the bonding strength of the electronic components. . This situation is similar for all activations that result in hydrophilization.

Embodiments of the present invention aim to provide a mounting apparatus and a mounting method that can reduce differences in bonding strength between electronic components.

In order to achieve the above object, the mounting apparatus of the embodiment includes a mounting apparatus that mounts the electronic component on the board by aligning the mounting surface of the electronic component with the mounting surface of the board; Before mounting on the board, a blowing section is provided that can be inserted between the mounting surface of the electronic component and the mounting surface of the board, which are arranged to face each other, and a gas containing active species generated by plasma is supplied to the board. A gas supply device is provided that sprays a gas from a spraying unit toward each of the mounting surface of the electronic component and the mounting surface of the substrate in a direction perpendicular to each mounting surface.

In the mounting method of the embodiment, a nozzle is inserted between the mounting surface of the electronic component and the mounting surface of the board, which are arranged to face each other, and a gas containing active species generated by plasma is supplied from the nozzle to the mounting surface of the electronic component. The electronic component is mounted on the board by spraying in a direction perpendicular to each mounting surface toward each of the mounting surfaces of the electronic component and the mounting surface of the board, and aligning the mounting surface of the electronic component with the mounting surface of the board. .

In embodiments of the present invention, differences in bonding strength between electronic components can be reduced.

It is a front view showing a mounting device of an embodiment. FIG. 1 is a plan view showing a mounting apparatus according to an embodiment. FIG. 2 is a cross-sectional view taken along the line AA in FIG. 1, showing a state in which an electronic component and a board are placed facing each other. FIG. 2 is a sectional view taken along the line AA in FIG. 1, showing a state in which the imaging section has entered between the bonding head and the substrate stage in order to image the mounting surface of the electronic component and the board. FIG. 2 is a sectional view taken along the line AA in FIG. 1, showing a state in which the spraying section has entered between the bonding head and the substrate stage in order to spray gas onto the mounting surface of the electronic component and the substrate. 2 is a sectional view taken along the line AA in FIG. 1, showing a state in which electronic components held by a bonding head are mounted on a substrate. FIG. FIG. 2 is a partially transparent side view showing the configuration of the gas supply device. It is a flowchart showing the implementation procedure according to the embodiment. FIG. 7 is an explanatory diagram showing a modification in which gas flow paths and electrodes are provided separately on the electronic component side and the substrate side. It is an explanatory view showing a modification in which an electrode is provided in the spray section. It is an explanatory view showing a modification using an air curtain. It is a side view (A) and a top view (B) which show the modification of the spray part without a nozzle. FIG. 7 is a side view showing a modification of the spraying section whose distance from the mounting surface is variable.

An embodiment of the present invention (hereinafter referred to as the present embodiment) will be specifically described with reference to the drawings. Note that the drawings are schematic diagrams, and the sizes, proportions, etc. of each part include parts that are exaggerated for easy understanding.

[overview]
As shown in FIGS. 1 to 3, the mounting apparatus 1 of this embodiment includes a supply device 10 for electronic components 2, a pickup device 20, a mounting device 30, a substrate stage 40, a detection device 50, a gas supply device 60, and a control device. It has 70. The mounting device 1 picks up an electronic component 2 from a supply device 10 with a pickup device 20, inverts it, delivers it to a mounting device 30, and mounts it on a substrate 3 supported by a substrate stage 40 by the mounting device 30. do. Before this mounting, a gas containing active species generated by plasma is sprayed by the gas supply device 60 onto the respective mounting surfaces of the electronic component 2 and the substrate 3, which are positioned and arranged to face each other.

The electronic component 2 is, for example, a rectangular thin piece component. In this embodiment, the electronic component 2 is a semiconductor chip obtained by dividing a wafer into individual pieces. A semiconductor chip has a functional surface that functions as a semiconductor element on one of the front and back sides. The functional surface of this electronic component 2 is a mounting surface 2a that includes an electrode portion and an insulating portion within the same plane and is mounted on a mounting surface 3a of a substrate 3 (see FIG. 3). The substrate 3 is, for example, a plate body in which a plurality of areas on which the electronic components 2 are mounted are provided in a matrix. Each region includes a conductive part and an insulating part in the same plane, and is a mounting surface 3a on which the mounting surface 2a of the electronic component 2 is mounted.

[Feeding device]
The supply device 10 is a device that supplies the electronic component 2 to the pickup device 20. The supply device 10 moves the electronic component 2 to be picked up to the supply position P1. The supply position P1 is a position where the pickup device 20 picks up the electronic component 2 to be picked up. The supply device 10 includes a supply stage 12 that supports a sheet 11 to which a plurality of electronic components 2 are attached, and a stage movement mechanism 13 that moves the supply stage 12. As this stage moving mechanism 13, for example, a linear guide in which a slider moves on a rail by a ball screw mechanism driven by a servo motor can be used. The supply device 10 uses the stage moving mechanism 13 to move the electronic component 2 to be picked up from among the plurality of electronic components 2 supported by the supply stage 12 via the sheet 11 to the supply position P1.

The sheet 11 to which the electronic component 2 is attached is here an adhesive wafer sheet attached to a wafer ring (not shown). On the sheet 11, a plurality of electronic components 2 obtained by dividing a wafer into individual pieces are arranged in a matrix. In this embodiment, it is assumed that the electronic component 2 is placed face-up with the mounting surface 2a exposed upward.

The supply stage 12 is a table that horizontally supports the wafer ring to which the sheet 11 is attached. That is, the supply stage 12 supports the sheet 11 to which the electronic component 2 is attached via the wafer ring. The supply stage 12 is provided so as to be movable in the horizontal direction by a stage moving mechanism 13. Since the sheet 11 is supported horizontally by the stage moving mechanism 13 together with the supply stage 12, the sheet 11 and the electronic component 2 placed on the sheet 11 are also provided so as to be movable in the horizontal direction. Further, instead of the sheet 11, the supply stage 12 can also support a tray on which a plurality of electronic components 2 are placed. Therefore, the electronic component 2 to be picked up can also be placed on this tray at the supply position P1.

As shown in FIG. 1, in the horizontal direction, the direction in which the supply device 10 and the mounting device 30 are lined up is called the X-axis direction, and the direction perpendicular to the X-axis is called the Y-axis direction. Further, the direction perpendicular to the plane of the sheet 11 is defined as the Z-axis direction or the up-down direction. However, these directions do not limit the installation direction of the mounting apparatus 1.

[Pickup device]
The pickup device 20 is a device that picks up the electronic component 2 from the supply device 10 and delivers the picked-up electronic component 2 to the mounting device 30. This pickup device 20 includes a pickup nozzle 21, a moving mechanism 22, a reversing mechanism 23, and a pushing up mechanism 24.

(Pickup nozzle)
The pickup nozzle 21 is a mechanism that sucks and holds the electronic component 2 and releases the electronic component 2 by releasing the suction. The pickup nozzle 21 includes a nozzle hole. The nozzle hole opens at the suction surface at the tip of the pickup nozzle 21. The nozzle hole communicates with a negative pressure generation circuit (not shown) including a vacuum pump, etc., and by generating negative pressure, the electronic component 2 is attracted and held on the suction surface of the pickup nozzle 21. . Further, by releasing the negative pressure, the holding state of the electronic component 2 from the suction surface is released.

As shown in FIGS. 1 and 2, the moving mechanism 22 reciprocates the pickup nozzle 21 between the supply position P1 and the delivery position P2, and also raises and lowers the pickup nozzle 21 between the supply position P1 and the delivery position P2. It is a mechanism. Note that the delivery position P2 is a position where the pickup device 20 delivers the electronic component 2 picked up at the supply position P1 to a bonding head 31 functioning as a receiving section, which will be described later. The supply position P1 and the delivery position P2 mainly mean positions in the XY direction, and do not necessarily mean positions in the Z-axis direction.

(Moving mechanism)
The moving mechanism 22 has an arm 22a to which the pickup nozzle 21 is attached, and moves the pickup nozzle 21 by moving the arm 22a. The moving mechanism 22 includes a slide mechanism 22b and a lifting mechanism 22f. The slide mechanism 22b moves the pickup nozzle 21 back and forth between the supply position P1 and the delivery position P2 by moving the arm 22a to which the pickup nozzle 21 is attached. Here, the slide mechanism 22b includes a rail 22d that extends parallel to the X-axis direction and is fixed to a support frame 22c, and a slider 22e that runs on the rail 22d. Although not shown, the slider 22e is driven by a ball screw driven by a rotary motor, a linear motor, or the like.

The lifting mechanism 22f moves the pickup nozzle 21 in the vertical direction by moving the arm 22a to which the pickup nozzle 21 is attached. Specifically, the elevating mechanism 22f can use a linear guide in which a slider moves on a rail by a ball screw mechanism driven by a servo motor. That is, the pickup nozzle 21 moves up and down along the Z-axis direction by driving the servo motor.

(Reversing mechanism)
The reversing mechanism 23 is provided between the pickup nozzle 21 and the moving mechanism 22. The reversing mechanism 23 is an actuator that includes a drive source such as a motor that changes the direction of the pickup nozzle 21, and a rotation guide such as a ball bearing. Changing the direction means rotating it vertically from 0° to 180°.

(Pushing up mechanism)
The push-up mechanism 24 is provided below the sheet 11 of the supply device 10. The push-up mechanism 24 includes a push-up body 24a, a backup body 24b, and a drive mechanism (not shown). The push-up body 24a is a member consisting of a plurality of blocks. The backup body 24b is provided such that the push-up body 24a has a length direction parallel to the Z-axis direction. The drive mechanism is provided in the backup body 24b, and advances or retracts the block of the push-up body 24a from inside the backup body 24b. This advance or retreat is performed in the vertical direction. This drive mechanism includes, for example, a slider that moves while being guided by vertical rails, and an air cylinder and a cam mechanism that drive the slider.

[Installed equipment]
The mounting device 30 is a device that carries the electronic component 2 received from the pickup device 20 to the mounting position P3, and mounts the electronic component 2 on the board 3. The mounting position P3 is a position where the electronic component 2 is mounted on the board 3. The mounting device 30 includes a bonding head 31, a head moving mechanism 32, and a substrate stage 40.

(bonding head)
The bonding head 31 is a device that has a function as a receiving section that receives the electronic component 2 from the pickup nozzle 21 at the delivery position P2, and also mounts the electronic component 2 on the substrate 3 at the mounting position P3. The bonding head 31 holds the electronic component 2, and releases the holding state to release the electronic component 2 after mounting.

Specifically, the bonding head 31 includes a nozzle 31a. The nozzle 31a holds the electronic component 2 and releases the electronic component 2 by releasing the holding state. The nozzle 31a includes a nozzle hole. The nozzle hole opens at the suction surface at the tip of the nozzle 31a. The nozzle hole communicates with a negative pressure generation circuit (not shown) including a vacuum pump, etc., and the circuit generates negative pressure to attract and hold the electronic component 2 on the suction surface of the nozzle 31a. Further, by releasing the negative pressure, the holding state of the electronic component 2 from the suction surface is released.

(Head movement mechanism)
The head moving mechanism 32 is a mechanism that moves the bonding head 31 back and forth between the delivery position P2 and the mounting position P3, and also raises and lowers the bonding head 31 between the delivery position P2 and the mounting position P3. The head moving mechanism 32 of this embodiment functions as a positioning mechanism that positions the mounting surface 2a of the electronic component 2 with respect to the mounting surface 3a of the board 3. Specifically, the head moving mechanism 32 includes a slide mechanism 321 and a lifting mechanism 322.

The slide mechanism 321 reciprocates the bonding head 31 between the transfer position P2 and the mounting position P3. Here, the slide mechanism 321 includes two rails 321b that extend parallel to the X-axis direction and are fixed to a support frame 321a, and a slider 321c that runs on the rails 321b. Although not shown, the slider 321c is driven by a ball screw driven by a rotary motor, a linear motor, or the like.

Although not shown, the slide mechanism 321 includes a slide mechanism that slides the bonding head 31 in the Y-axis direction. This slide mechanism can also be configured by a rail in the Y-axis direction and a slider running on the rail. The slider is driven by a ball screw driven by a rotary motor, a linear motor, or the like. The elevating mechanism 322 moves the bonding head 31 in the vertical direction. Specifically, the elevating mechanism 322 can use a linear guide in which a slider moves on a rail by a ball screw mechanism driven by a servo motor. That is, the bonding head 31 moves up and down along the Z-axis direction by driving the servo motor.

[Substrate stage]
The board stage 40 is a stand that supports the board 3 on which the electronic component 2 is mounted. The substrate stage 40 is provided on a stage moving mechanism 41. The stage moving mechanism 41 is a moving mechanism that slides the board stage 40 on the XY plane and positions the scheduled mounting position of the electronic component 2 on the board 3 at the mounting position P3. The stage moving mechanism 41 can use, for example, a linear guide in which a slider moves on a rail by a ball screw mechanism driven by a servo motor.

[Detection device]
The detection device 50 detects the position of the mounting surface 2a of the electronic component 2 before mounting and the position of the mounting surface 3a of the board 3 at the mounting position P3 (see FIGS. 3 and 4). The detection device 50 of this embodiment includes an imaging unit 50a that images the mounting surface 2a of the electronic component 2 and the mounting surface 3a of the board 3 at the mounting position P3. Although not shown, the detection device 50 also includes an image processing unit that processes an image captured by the imaging unit 50a to extract the shapes of the alignment marks on the mounting surfaces 2a and 3a, and an image processing unit that processes the image captured by the imaging unit 50a to extract the shapes of the alignment marks on the mounting surfaces 2a and 3a. It has a position recognition unit that recognizes the positional relationship between the two by detecting points such as the center of gravity and corners of the two. Based on this positional relationship, the mounting device 30 aligns the mounting surface 2a of the electronic component 2 with the mounting surface 3a of the board 3 before mounting. Detection of the predetermined position may be performed by a circuit included in the imaging unit 50a, or may be performed by the control device 70 described later. When the control device 70 performs the detection, the control device 70 takes charge of a part of the function of the detection device 50.

The imaging unit 50a of this embodiment is a two-view camera capable of simultaneously capturing images of the electronic component 2 and the board 3. The imaging unit 50a enters between the bonding head 31 and the substrate stage 40 before mounting the electronic component 2 (see FIG. 4), and does not interfere with the bonding head 31 during mounting by the bonding head 31. (See Figure 3). Note that the imaging unit 50a may be a camera that separately images the electronic component 2 and the board 3.

[Gas supply device]
As shown in FIG. 7, the gas supply device 60 is a so-called atmospheric pressure plasma plasma generation device that generates plasma at atmospheric pressure. The gas supply device 60 includes a blowing section 610, a body section 620, a supply section 630, an electrode section 640, a power source 650, and an arm 660. Note that the spray section 610 and the body section 620 in FIG. 7 are perspective views. As described above, active species generated in atmospheric pressure plasma are sprayed from the spray section 610 onto the mounting surface 2a of the electronic component 2 and the mounting surface 3a of the substrate 3 to clean and activate the surfaces. The active species is sprayed onto the mounting surfaces 2a, 3a while blowing out the gas. As the gas, in addition to rare gases such as Ar and He, N ₂ , O ₂ , H ₂ O (water vapor), and the like can be used.

(Spraying section)
The spraying section 610 is a linear tube extending in the vertical direction, with a first nozzle 611 extending in the direction perpendicular to the mounting surface 2a at the top and a second nozzle 611 extending in the direction perpendicular to the mounting surface 3a at the bottom. A nozzle 612 is configured. The tip of the first nozzle 611 is an opening 611a, and faces the mounting surface 2a. The tip of the second nozzle 612 is an opening 612a, which faces the mounting surface 3a. The cross section or the shape of the opening 611a of the first nozzle 611 and the cross section or the shape of the opening 611a of the second nozzle 612 may be rectangular or circular to match the mounting surfaces 2a and 3a. In addition, from the viewpoint of equalizing the processing on the mounting surfaces 2a and 3a, the lengths of the first nozzle 611 and the second nozzle 612, the distance between the opening 611a and the mounting surface 2a, and the distance between the opening 612a and the mounting surface 3a are set to be equal. With this configuration, the distances of the openings 611a and 612a from a plasma region Z of plasma generated by an electrode section 640, which will be described later, are equalized, making it possible to equalize the supply amount of active species. Furthermore, since the distances between the openings 611a, 612a and the mounting surfaces 2a, 3a are equal, it is possible to equalize the amounts of active species supplied to the mounting surfaces 2a, 3a.

(torso)
The body portion 620 is a tubular member in which a gas flow path (hereinafter referred to as gas flow path R) is formed. The body portion 620 is made of glass or alumina, for example. Further, the body portion 620 is also a discharge tube in which a discharge is generated to generate plasma in the gas. In this embodiment, the axial direction of the body portion 620 is parallel to the mounting surfaces 2a and 3a.

The plasma region Z, which is a region where plasma is generated, is a region where gas is ionized by discharge and products such as ions, electrons, and active species (radicals) are generated. The active species here refers to molecules or atoms with unpaired electrons. In this way, the plasma region Z is a region that serves as a generation source of products.

The above-mentioned spray section 610 is connected to one end of the body section 620. The products generated in the plasma region Z within the body section 620 are sprayed from the first nozzle 611 of the spray section 610 onto the mounting surface 2a, and from the second nozzle 612 onto the mounting surface 3a. Note that ions and electrons are also generated in the plasma region Z. When ions and electrons reach the mounting surfaces 2a and 3a, they will damage the mounting surfaces 2a and 3a. Ions and electrons generated in the plasma region Z have shorter lifetimes than active species, and therefore disappear before reaching 611a of the first nozzle 611 and the opening 612a of the second nozzle 612. Further, the flow path is divided into upper and lower sections from the body section 620 at the spray section 610, and is bent at a right angle at this branching point, and ions and electrons disappear even if they collide with the wall surface of the flow path at this branch point. Therefore, only active species are blown onto the mounting surfaces 2a, 3a along with the gas.

The spraying section 610 may be configured to be continuous with the body section 620, or may be configured to be detachably attached to the body section 620 so that it can be replaced. Further, the body portion 620 is provided with a gas inlet 620a on the side opposite to the blowing portion 610.

(Supply Department)
The supply section 630 is a device that supplies gas to the gas flow path R within the body section 620. The gas may be any gas that turns into plasma due to discharge, as described above. The supply section 630 includes a gas source 631, a pressure reducing valve 632, and an adjustment section 633. The gas source 631 is a cylinder that stores gas. The pressure reducing valve 632 is a valve that reduces the pressure of gas, that is, a regulator. The adjustment unit 633 is a device that adjusts the flow rate of gas. The adjustment unit 633 includes a mass flow meter that measures the flow rate of fluid and a mass flow controller (MFC) that has a solenoid valve that controls the flow rate.

The gas source 631 is connected to a pressure reducing valve 632 and a regulating section 633 through piping, and the piping is connected to an inlet 620a of the body section 620. That is, gas from the gas source 631 is introduced into the body 620 and becomes a gas stream. The gap between the inlet 620a of the body 620 and the pipe is hermetically sealed.

(electrode part)
The electrode section 640 generates plasma in the gas within the gas flow path R when a voltage is applied thereto. That is, the electrode section 640 causes discharge to occur in the gas flow path R by applying a voltage, and ionizes the gas. The electrode section 640 has a first electrode 640a and a second electrode 640b. The first electrode 640a and the second electrode 640b are electrically conductive members arranged at opposite positions with the body 620 interposed therebetween. The first electrode 640a and the second electrode 640b are formed of, for example, Ni-plated SUS. The gas flow path R sandwiched between the first electrode 640a and the second electrode 640b becomes the center of the plasma region Z.

(power supply)
A power source 650 applies voltage to the first electrode 640a and the second electrode 640b. As the power source 650, for example, a high frequency power source or a pulse wave power source for plasma generation is used. Note that in this embodiment, the second electrode 640b is on the ground side.

(arm)
As shown in FIGS. 2 and 7, the arm 660 is provided with a body 620 at its tip, and the opening 611a of the first nozzle 611 and the opening 612a of the second nozzle 612 of the spraying section 610 are mounted This is a moving mechanism that swings between a position between the surfaces 2a and 3a and a position retracted from the mounting surfaces 2a and 3a. This arm 660 positions the first nozzle 611 directly below the mounting surface 2a and the second nozzle 612 directly above the mounting surface 3a.

[Control device]
The control device 70 controls starting, stopping, speed, operation timing, etc. of the supply device 10, pickup device 20, mounting device 30, substrate stage 40, detection device 50, and gas supply device 60. The control device 70 includes a processor that executes programs, a memory that stores various information such as programs and operating conditions, and a drive circuit that drives each element, in order to realize various functions of the mounting device 1. Further, connected to the control device 70 are an input device through which an operator inputs instructions and information necessary for control, and an output device through which the operator confirms the status of the device.

[motion]
In the mounting apparatus 1 as described above, the pickup apparatus 20 picks up the electronic component 2 from the supply apparatus 10, transfers the electronic component 2 to the mounting apparatus 30, and the mounting apparatus 30 mounts the electronic component 2 on the board 3. , will be explained with reference to the flowcharts of FIGS. 5, 6 and 8 in addition to the above-described FIGS. 1 to 4 and 7. In this embodiment, immediately before mounting, the surfaces are cleaned and activated by spraying active species onto the mounting surfaces 2a and 3a from the gas supply device 60.

First, the pickup device 20 moves the pickup nozzle 21 to the supply position P1 where the push-up body 24a is located, and the tip of the pickup nozzle 21 and the push-up body 24a are made to face each other. On the other hand, the supply device 10 moves the supply stage 12 and positions the electronic component 2 to be picked up at the supply position P1. After this, the pickup nozzle 21 descends and approaches the electronic component 2. At this time, the push-up body 24a rises and waits at the push-up reference position.

The pickup nozzle 21 descends to the contact reference position and stops. At this time, the electronic component 2 is held between the pickup nozzle 21 and the push-up body 24a. Then, with the pickup nozzle 21 stopped, suction is started by exhausting air from the nozzle hole. In this state, the push-up body 24a rises, and the pickup nozzle 21 rises in synchronization with this, and when the pick-up nozzle 21 rises by a preset amount, the push-up body 24a stops. Then, the electronic component 2 sucked by the pickup nozzle 21 that rises further is peeled off from the sheet 11 and picked up.

The pickup device 20 uses a reversing mechanism 23 to reverse the pickup nozzle 21 . The pickup device 20 uses the moving mechanism 22 to move the picked up electronic component 2 to the delivery position P2. At the delivery position P2, the bonding head 31 of the mounting device 30 is on standby and faces the electronic component 2 held by the inverted pickup nozzle 21. After the bonding head 31 is lowered toward the pickup nozzle 21 and the electronic component 2 is sucked and held by the bonding head 31, the pickup nozzle 21 releases the negative pressure to receive the electronic component 2 into the bonding head 31. hand over. Thereafter, the bonding head 31 rises and moves away from the pickup nozzle 21 to the mounting position P3.

In this way, the electronic component 2 moves to the mounting position P3, and as shown in FIG. 3, the mounting surface 2a of the electronic component 2 and the mounting surface 3a of the board 3 face each other (step S101). Next, as shown in FIG. 4, the imaging unit 50a, which is a two-view camera for upper and lower positions, is advanced between the bonding head 31 and the substrate 3 as shown by the arrow, and the mounting surface 2a of the electronic component 2 located above is The alignment mark and the alignment mark on the mounting surface 3a of the substrate 3 located below are imaged to detect the positions of the mounting surfaces 2a and 3a (step S102). According to the detected position, the bonding head 31 positions the mounting surface 2a of the electronic component 2 and the mounting surface 3a of the substrate 3 (step S103). The imaging unit 50a is retracted from between the mounting surfaces 2a and 3a, as shown by the arrow in FIG.

After positioning, as shown in FIG. 5, the arm 660 swings the body 620 to open the opening 611a of the first nozzle 611 and the opening 612a of the second nozzle 612 of the spraying section 610 in the positioned mounting It is moved to a position between surfaces 2a and 3a (step S104). Then, gas from the supply section 630 is introduced into the body section 620 through the introduction port 620a, and a voltage is applied to the electrode section 640 by the power source 650. Then, a discharge occurs in the gas flow path R within the body portion 620, and the gas is ionized. In other words, plasma is generated.

In the plasma region Z where this plasma is generated, products such as ions, electrons, and active species are generated by reaction with the atmosphere. Among these products, ions and electrons disappear in the spraying section 610, and active species are released together with the gas flow from the opening 611a of the first nozzle 611 and the opening 612a of the second nozzle 612, as shown in FIG. , is sprayed in a direction perpendicular to the mounting surfaces 2a and 3a (step S105). For this reason, the mounting surfaces 2a and 3a before mounting are cleaned or hydroxyl groups are added to make them hydrophilic (activated). Then, the arm 660 swings the body section 620 to retract the spray section 610 from the position between the mounting surfaces 2a and 3a to a position that does not affect the mounting (step S106).

Thereafter, as shown by the arrow in FIG. 6, the bonding head 31 is lowered by the lifting mechanism 322, and the cleaned and hydrophilized mounting surface 2a of the electronic component 2 is placed on the cleaned and hydrophilized mounting surface 3a of the substrate 3. By bringing them into contact and aligning them, the electronic component 2 is mounted and mounted on the board 3 (step S107). After mounting, the bonding head 31 releases the holding of the electronic component 2 and returns to the delivery position P2 to receive the next electronic component 2.

[effect]
(1) The mounting apparatus 1 of this embodiment includes a mounting apparatus 30 that mounts the electronic component 2 on the board 3 by bringing the mounting surface 2a of the electronic component 2 and the mounting surface 3a of the board 3 into contact with each other, and Before mounting the component 2 on the board 3, a spray part 610 that can be inserted between the mounting surface 2a of the electronic component 2 and the mounting surface 3a of the board 3, which are arranged opposite to each other, is used to spray active particles generated by plasma. a gas supply device 60 that sprays a gas containing seeds from a spraying section 610 toward each of the mounting surface 2a of the electronic component 2 and the mounting surface 3a of the substrate 3 in a direction perpendicular to each mounting surface 2a, 3a. .

Furthermore, in the mounting method of the present embodiment, a blowing section 610 is inserted between the mounting surface 2a of the electronic component 2 and the mounting surface 3a of the substrate 3, which are arranged to face each other, and a gas containing active species generated by plasma is applied. , from the spray section 610 toward the mounting surface 2a of the electronic component 2 and the mounting surface 3a of the board 3 in a direction perpendicular to each mounting surface 2a, 3a, thereby mounting the mounting surface 2a of the electronic component 2 and the mounting surface 3a of the board 3. Mounting the electronic component 2 on the substrate 3 by bringing it into contact with the surface 3a.

When mounting multiple electronic components 2 or the substrate 3 on which the electronic components 2 are mounted one by one after activating them one by one, there is a difference between the first mounting and the last mounting. Moreover, it takes time to mount the plurality of electronic components 2. That is, as the mounting progresses, the activation state of the mounting surface 2a of the electronic component 2 and the mounting surface 3a of the substrate 3 decreases, and the bonding strength between the electronic component 2 and the substrate 3 decreases. In the mounting in this embodiment, as described above, the mounting surfaces 2a and 3a are activated one by one with the electronic component 2 and the board 3 facing each other before mounting, that is, immediately before mounting. Therefore, differences in the time from activation to mounting are less likely to occur in each electronic component 2, and differences in bonding strength between the electronic components 2 can be reduced.

(2) The spray section 610 includes a first nozzle 611 extending in a direction perpendicular to the mounting surface 2a of the electronic component 2 and a second nozzle 612 extending in a direction perpendicular to the mounting surface 3a of the board 3. have Therefore, the gas flow blown onto the mounting surfaces 2a, 3a can be made perpendicular to the mounting surfaces 2a, 3a.

Since the spray unit 610 sprays from a direction perpendicular to the mounting surfaces 2a and 3a, variations in the activation process within the mounting surfaces 2a and 3a are unlikely to occur. When spraying from a direction horizontally or obliquely to the mounting surfaces 2a, 3a, a difference occurs between the blowing position of the blowing section 610 and the spraying position within the mounting surfaces 2a, 3a. That is, within the planes of the mounting surfaces 2a and 3a, there are parts close to and parts far from the spraying section 610. As a result, a difference occurs in the amount of active species reaching parts of the mounting surfaces 2a and 3a near and far from the spraying section 610, resulting in a difference in the state of cleaning and activation. However, as in this embodiment, by spraying from a direction perpendicular to the mounting surfaces 2a, 3a, the distance from the blowing position to the spraying position becomes uniform within the mounting surfaces 2a, 3a. As a result, within the mounting surfaces 2a and 3a, there are no portions near and far from the spray section 610. Therefore, active species are evenly supplied within the mounting surfaces 2a and 3a, cleaning and activation processes are performed evenly, and sufficient bonding strength can be obtained.

(3) The opening 611a at the tip of the first nozzle 611 and the opening 612a at the tip of the second nozzle 612 are at the same distance from the electrode section 640. Therefore, the distances from the plasma region Z formed by the electrode section 640 to the openings 611a and 612a are equal, and the amount of active species supplied can be made equal to the mounting surface 2a and the mounting surface 3a. Therefore, the cleaning and activation processes of the mounting surfaces 2a and 3a can be performed equally, and sufficient bonding strength can be obtained.

(4) The head moving mechanism 32 is provided to position the mounting surface 2a of the electronic component 2 and the mounting surface 3a of the substrate 3, which are arranged to face each other, before spraying gas from the spraying section 610. Therefore, activation processing can be performed after positioning, which is performed immediately before mounting, so the time between activation processing and mounting can be minimized, suppressing deactivation of active species, and reducing the amount of active species supplied. It is possible to suppress the decrease and prevent a decrease in bonding strength.

[Modified example]
The invention is not limited to the embodiments described above. Although the basic configuration is the same as that of the above embodiment, the following modifications are also applicable.
(1) As shown in FIG. 9(A), the gas supply device 60 has a first gas flow path R1 communicating with the first nozzle 611 and a second gas flow path communicating with the second nozzle 612. R2, and the electrode section 640 may be provided in each of the first gas flow path R1 and the second gas flow path R2. For example, a first body part 621 and a second body part 622 whose gas flow rates can be individually controlled by the adjustment part 633 may be provided, and a first electrode part 641 and a second electrode part 642 may be provided respectively. . As a result, if the ease of activation differs between the electronic component 2 and the board 3, the cleaning and activation states can be adjusted individually by changing the applied power, gas flow rate, and gas supply time. can do.

Note that the degree of activation can also be adjusted by changing the lengths of the first nozzle 611 and the second nozzle 612, the distance between the opening 611a and the mounting surface 2a, and the distance between the opening 612a and the mounting surface 3a. Furthermore, uniformity of in-plane processing may be achieved by moving the spraying section 610 and changing the spraying position on the mounting surfaces 2a, 3a.

Further, as shown in FIG. 9(B), the first body portion 621 and the second body portion 622 may be arranged in opposite directions. This makes it easy to arrange gas piping routes, electrode wiring, and the like. Note that it is only necessary that the piping and wiring be arranged easily, and the directions do not necessarily have to be opposite to each other.

(2) As shown in FIG. 10, the first nozzle 611 and the second nozzle 612 of the spray section 610 may be provided with a first electrode section 641 and a second electrode section 642, respectively. Thereby, the plasma region Z can be brought closer to the mounting surfaces 2a, 3a, suppressing the decrease in active species from generation to the time when they are sprayed onto the mounting surfaces 2a, 3a, and spraying can be performed more efficiently.

(3) As shown in FIG. 11, a cylindrical part 680 may be provided around the gas sprayed by the spray part 610 to generate a gas curtain by circulating the gas. That is, a cylindrical part 680 surrounding the spray part 610 is provided, and air, _N2 , Ar, He, etc. are flowed into the cylindrical part 680 from a gas supply device (not shown). When surrounded by an air curtain, the concentration of active species in the gas increases as it becomes difficult for the active species to escape to the outside, so that the active species can be efficiently sprayed onto the mounting surfaces 2a and 3a. In addition, although the central axis side of the gas flow path R is generally higher and the outer circumferential side is lower, the active species on the outer circumferential side are enhanced, so that the in-plane distribution of the active species sprayed onto the mounting surfaces 2a and 3a becomes uniform. . Note that the gas for generating the gas curtain here refers to a gas that does not cause any problem even if it reacts with the gas sprayed together with the active species, as exemplified above.

(4) The spray section 610 may be configured to spray perpendicularly to the surface to be sprayed. Therefore, the spray section 610 does not need to have a vertically extending nozzle. For example, as shown in the side view of FIG. 12A and the plan view of FIG. Good too.

(5) The spray section 610 may be provided at a variable distance from the mounting surfaces 2a, 3a. For example, as shown in FIG. 13, the first body part 621 and the second body part 622 are moved up and down by a drive mechanism (not shown), thereby changing the distance between the opening 611a and the mounting surface 2a, and the distance between the opening 612a and the mounting surface 2a. A configuration may be adopted in which the distance to the surface 3a can be changed.

[Other embodiments]
The present invention is not limited to the above-described embodiments, but also includes forms in which all or any of the above-described embodiments are combined. Furthermore, various omissions, substitutions, and changes can be made to these embodiments without departing from the scope of the invention, and such modifications are also included in the present invention.

1 Mounting device 2 Electronic component 2a Mounting surface 3 Board 3a Mounting surface 10 Supply device 11 Sheet 12 Supply stage 13 Stage movement mechanism 20 Pickup device 21 Pickup nozzle 22 Movement mechanism 22a Arm 22b Slide mechanism 22c Support frame 22d Rail 22e Slider 22f Lifting mechanism 23 Reversing mechanism 24 Pushing up mechanism 24a Pushing up body 24b Backup body 30 Mounting device 31 Bonding head 31a Nozzle 32 Head moving mechanism 40 Substrate stage 41 Stage moving mechanism 50 Detecting device 50a Imaging section 60 Gas supply device 70 Control device 321 Slide mechanism 321a Support frame 321b Rail 321c Slider 322 Lifting mechanism 610 Spray section 611 First nozzle 611a Opening 612 Second nozzle 612a Opening 620 Body section 620a Inlet 621 First body section 622 Second body section 630 Supply section 631 Gas source 632 Depressurization Valve 633 Adjustment part 640 Electrode part 640a First electrode 640b Second electrode 641 First electrode part 642 Second electrode part 650 Power supply 660 Arm 680 Cylindrical part

Claims (8)

a mounting device that mounts the electronic component on the board by aligning the mounting surface of the electronic component with the mounting surface of the board;
Before mounting the electronic component on the substrate, a spraying section is provided that can be inserted between the mounting surface of the electronic component and the mounting surface of the substrate, which are arranged to face each other, and the active species generated by plasma is sprayed. a gas supply device that sprays a gas containing gas from the spraying section toward each of the mounting surface of the electronic component and the mounting surface of the substrate in a direction perpendicular to each mounting surface;
A mounting device characterized by having: The spraying section is
a first nozzle extending in a direction perpendicular to the mounting surface of the electronic component;
a second nozzle extending in a direction perpendicular to the mounting surface of the substrate;
The mounting apparatus according to claim 1, characterized in that it has: 3. The mounting apparatus according to claim 2, wherein the first nozzle and the second nozzle are provided with electrode portions that generate plasma in the gas by applying a voltage. The blowing section has a tubular body in which the gas flow path is formed,
2. The mounting apparatus according to claim 1, wherein the body part is provided with an electrode part that generates plasma in the gas by applying a voltage. The gas supply device includes:
a first gas flow path communicating with the first nozzle;
a second gas flow path communicating with the second nozzle;
has
The mounting according to claim 2, wherein an electrode portion that generates plasma in the gas by applying a voltage is provided in each of the first gas flow path and the second gas flow path. Device. 2. The mounting apparatus according to claim 1, further comprising a cylindrical part that causes gas to flow and thereby creates a gas curtain around the gas sprayed by the spraying part. 7. The mounting apparatus according to claim 1, wherein the gas contains at least one of _N2 , _O2 , Ar, He, and _H2O . Insert a nozzle between the mounting surface of the electronic component and the mounting surface of the board, which are arranged opposite to each other,
Spraying a gas containing active species generated by plasma from the nozzle toward each of the mounting surface of the electronic component and the mounting surface of the substrate in a direction perpendicular to each mounting surface,
mounting the electronic component on the board by aligning the mounting surface of the electronic component with the mounting surface of the board;
An implementation method characterized by:

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