JP5192999B2 - Ionized air supply program - Google Patents

Description

The present invention relates to an ionized air supply program applied to a processing apparatus that performs an operation of transporting and processing a plate-shaped workpiece such as a semiconductor wafer stored in a cassette to a processing means and returning the processed workpiece to the cassette.

  For example, in the semiconductor device manufacturing process, a large number of rectangular regions are defined on the surface of a disk-shaped semiconductor wafer by grid-like division lines, and electronic circuits such as IC and LSI are formed on the surface of these rectangular regions, and then After performing necessary processing such as polishing after the back surface is ground, all the divided lines are cut, that is, diced to obtain a large number of semiconductor chips. The semiconductor chip thus obtained is packaged by resin sealing and widely used in various electric / electronic devices such as mobile phones and PCs (personal computers).

  As a device for dicing a semiconductor wafer, a blade-type cutting device is known in which a thin disc-shaped cutting blade rotated at a high speed is cut into a semiconductor wafer adsorbed and held on a chuck table. (For example, patent document 1).

  In such a cutting device or a processing device such as a grinding device that performs grinding, the workpiece is processed while jetting a predetermined processing water onto the semiconductor wafer held on the chuck table, and further cleaning water is jetted onto the processed workpiece. And washed. By the way, there is a problem that static electricity is generated and charged when the workpiece is processed and cleaned, and the electronic circuit formed on the workpiece is damaged due to the static electricity to deteriorate the quality. Therefore, in order to solve this problem, a nozzle for ejecting ionized air is arranged on the transfer path of the semiconductor wafer and the moving path of the chuck table, and ionized from the nozzle to the semiconductor wafer being transferred or moving. A technique has been proposed for removing static electricity charged on a semiconductor wafer by blowing air (Patent Document 2).

JP-A-8-25209 Japanese Patent Laid-Open No. 2002-66865

  According to the technique disclosed in Patent Document 2, static electricity charged during processing or cleaning can be removed by sufficiently supplying ionized air to the semiconductor wafer after processing or cleaning. However, in the form in which ionized air is blown only from the upper surface of the workpiece as in Patent Document 2, the removal of static electricity is insufficient. Accordingly, there has been a demand for the development of an effective static eliminating means for loading / unloading workpieces to / from the cassette.

The present invention has been made in view of the above circumstances, and can be applied to a processing apparatus that can sufficiently blow ionized air at the time of loading / unloading a workpiece with respect to a cassette and, as a result, can reliably remove static electricity. The purpose is to provide an ionized air supply program .

The present invention includes a cassette stage on which a cassette in which a plate-like workpiece is stored is placed;
A conveying means for carrying a work into a cassette placed on the cassette stage, and a work housed in the cassette being taken out from the cassette, a holding means for holding the work, and a holding means held by the holding means Processing means for processing the workpiece, and the conveying means has a holding portion for holding the workpiece in a state where at least a portion of one surface of the workpiece and at least a portion of the other surface of the workpiece are exposed. The conveying means includes a first blow nozzle that blows ionized air on one side, a second blow nozzle that blows ionized air on the other side , a cassette, and a conveying means for the work housed in the cassette. A moving means for relatively moving in the thickness direction, and the direction in which the ionized air blown out from the first blow nozzle and the second blow nozzle blows out is a cassette. An ionized air supply program for control applied to a processing apparatus directed to the machine, wherein the cassette and the conveying means are stored in the cassette by the step of bringing the conveying means close to the cassette and the moving means. Moving the workpiece relative to the thickness direction of the workpiece to position the workpiece on the first blow nozzle and the second blow nozzle, and moving the workpiece toward the workpiece from the first blow nozzle and the second blow nozzle. And a step of ejecting ionized air .

  According to the present invention, since the conveying means for carrying in / out the work with respect to the cassette for storing the work has the blow nozzle for blowing ionized air to the work in the conveying means having the holding unit for holding the work, At the time of loading / unloading a workpiece, ionized air can be constantly blown onto the workpiece. Since the blow nozzle includes the first blow nozzle and the second blow nozzle that blow ionized air on one surface and the other surface of the workpiece, the ionized air can be sufficiently distributed on both surfaces of the plate-shaped workpiece. it can. As a result, it is possible to reliably remove static electricity generated when the work is carried in / out of the cassette.

  The work referred to in the present invention is not particularly limited. For example, the semiconductor wafer such as a silicon wafer, an adhesive member such as DAF (Die Attach Film) provided on the back surface of the wafer for chip mounting, a package of a semiconductor product, Examples thereof include ceramic, glass, or silicon substrates, and various plate-like processed materials that require micron-order accuracy.

According to the present invention, ionized air supply can be applied to a processing apparatus that can sufficiently blow ionized air at the time of loading / unloading a workpiece with respect to a cassette that stores the workpiece, and as a result, can reliably remove static electricity. There is an effect that a program can be provided.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 shows an entire cutting apparatus 10 according to an embodiment. The cutting device 10 is a dicing device that cuts and dices the semiconductor wafer (hereinafter abbreviated as a wafer) 1 shown in FIG. 2 with a cutting blade (not shown) by automatic control. The operation of the cutting apparatus 10 is controlled by the control means 10A shown in FIG.

(1) Wafer The wafer 1 will be described first with reference to FIG. 2. The wafer 1 is a disc-shaped one made of a single crystal material such as silicon and has a thickness of about 100 to 700 μm, for example, and a part of the outer periphery. Further, an orientation flat 1a is formed as a mark indicating the crystal orientation. A large number of rectangular chips 3 are partitioned on the surface of the wafer 1 by division lines 2 formed in a lattice pattern. On the surface of each chip 3, electronic circuits such as IC and LSI (not shown) are formed. The wafer 1 is diced into individual chips 3 by cutting all the planned division lines 2 by the cutting apparatus 10.

  Since the wafer 1 is difficult to handle by itself, when it is supplied to the cutting apparatus 10, it is disposed concentrically in the opening 4a inside the annular frame 4 as shown in FIG. It is made into the state supported by the flame | frame 4 through this. The adhesive tape 5 has an adhesive surface on one side, and the frame 4 and the wafer 1 are attached to the adhesive surface. The frame 4 has rigidity made of a plate material such as metal, and by supporting the frame 4, the wafer 1 can be safely transported without being damaged.

  A frame 4 (hereinafter referred to as a frame 6 with a wafer) that supports a wafer 1 via an adhesive tape 5 is stored in a wafer storage cassette 9 shown in FIG. 1 with the wafer 1 facing upward. Inside the cassette 9, a large number of paired left and right trays on which the frame 4 is placed are provided in the vertical direction, and a large number of frames 6 with wafers are stacked in the vertical direction with a horizontal gap. And stored.

(2) Cutting Device (2-1) Overall Configuration and Basic Operation Next, the overall configuration of the cutting device 10 will be described in conjunction with the basic operation.
Reference numeral 11 in FIG. 1 denotes a cabinet. Inside the cabinet 11, cutting means (not shown) for dicing the wafer 1 with a cutting blade is disposed. A touch panel type operation display panel 12 is provided on one end side of the cabinet 11 in the Y direction (front side in FIG. 1), and various settings related to automatic operation of the cutting process are used. Done. The operation display panel 12 is also provided with a function for displaying the internal operation status. On the top plate of the cabinet 11 above the operation display panel 12, an indicator lamp 13 for displaying an operation state or issuing a warning is attached.

  A base 14 is provided on the side surface 11 a side of the cabinet 11. The center on the base 14 is set to a wafer attachment / detachment position where the wafer 1 is attached to and detached from the disk-shaped chuck table (holding means) 20. The chuck table 20 is reciprocated in the X direction between a wafer attachment / detachment position on the base 14 and a processing position by the cutting means in the cabinet 11. A cassette stage 15 is disposed on the front side in the Y direction in FIG. 1 at the wafer attaching / detaching position, and a spinner type cleaning device 60 is disposed on the far side in the Y direction on the opposite side.

  The cassette 9 containing a large number of frames 6 with wafers is set on a cassette stage 15. The cassette stage 15 is moved up and down by the moving means 16 shown in FIG. The moving means 16 includes a ball screw 16a extending in the vertical direction (Z direction in FIG. 1) that penetrates and screws into the cassette stage 15, and a motor 16b that rotates the ball screw 16a. When the screw 16a is rotated, the cassette stage 15 is raised or lowered according to the rotation direction.

  The wafer-attached frame 6 in the cassette 9 set on the cassette stage 15 is loaded / carried out after the cassette stage 15 is raised or lowered and positioned at a predetermined height and then opened to the wafer attaching / detaching position side of the cassette 9. It is moved from the outlet to the chuck table 20 and held. The chuck table 20 is of a generally known negative pressure adsorption type, and is supported on a rectangular base table 21 so as to be rotatable about the Z direction (vertical direction) as a rotation axis. It is rotated in one direction or both directions by a rotational drive mechanism (not shown).

  A rectangular recess 17 extending in the X direction is provided as a moving space for the base table 21 from the wafer attachment / detachment position on the base 14 to the processing position by the cutting processing means in the cabinet 11. The base table 21 is reciprocated in the X direction by a reciprocating means (not shown) provided on the bottom surface of the recess 17, so that the chuck table 20 is reciprocated in the X direction together with the base table 21. . Bellows-shaped covers 18 are attached to both ends of the base table 21 in the X direction. These covers 18 prevent cutting chips and the like from falling into the recess 17 and extend and contract following the movement of the base table 21.

  An air suction means (not shown) is connected to the chuck table 20, and when this air suction means is operated, the air above the chuck table 20 is sucked and becomes a negative pressure, and the wafer 1 is placed on the upper surface of the chuck table 20. It is adsorbed to and held. The outer diameter of the chuck table 20 is substantially the same as that of the wafer 1, and the entire wafer 1 is concentrically held on the upper surface of the chuck table 20 via the adhesive tape 5. The frame 4 around the wafer 1 is held by a plurality of clamps 22 attached to the outer peripheral surface of the chuck table 20.

  The cleaning device 60 includes a spinner table 61 that holds the frame 6 with a wafer and a clamp 62 that holds the frame 4. The spinner table 61 is of a negative pressure adsorption type similar to the chuck table 20, and adsorbs and holds the frame 6 with a wafer on the upper surface. The spinner table 61 in FIG. 1 is positioned at the wafer delivery position, and descends from this position to the wafer cleaning position in the base 14. According to the cleaning device 60, the spinner table 61 holding the wafer 1 rotates at the wafer cleaning position, and cleaning water is jetted from a cleaning water nozzle (not shown) to the rotating wafer 1 to clean the wafer 1.

  Next, the cutting process by this apparatus 10 will be described together with the conveyance system for conveying the frame 6 with a wafer with reference to FIG.

  The single frame 6 with a wafer housed in the cassette 9 is unloaded horizontally by the first transfer means 30 to the back side in the Y direction, in front of the cassette stage 15 (back side in the Y direction), and at the wafer attachment / detachment position. Is received by a pair of frame guide rails 34 extending in the Y direction. The first transport means 30 is provided with a clamp (clamping part) 33 for gripping the frame 4 at the tip of an arm 32 that is reciprocated in the Y direction by a linear guide 31 provided on the side surface 11 a of the cabinet 11. is there. The pair of frame guide rails 34 operate so as to approach and separate from each other in synchronization with the X direction, and the intermediate position between them is always coincident with the center of the chuck table 20.

  The frame 6 with the wafer is held by the clamp 33 of the first transfer means 30, and the entire upper and lower surfaces of the wafer 1 are exposed in this state. The wafer-mounted frame 6 gripped by the clamp 33 is placed in a state of being spanned between the two frame guide rails 34 by the movement of the arm 32. Then, the frame guide rails 34 come close to each other and come into contact with the outer peripheral edge of the frame 4, thereby positioning the frame 6 with a wafer in the X direction. The positioning in the Y direction is performed by moving the arm 32. As a result, the wafer 1 is centered (positioned in the X and Y directions) concentrically with the chuck table 20. The first conveying means 30 is according to the present invention and will be described in detail later.

  Next, the frame 4 placed on the frame guide rail 34 is held by the upper second transfer means 40. Thereafter, the frame guide rail 34 is separated, and the frame 6 with a wafer is only the second transfer means 40. Held in. A plurality of second conveying means 40 hold the frame 4 by adsorbing to the upper surface of the frame 4 at the tip of the telescopic arm 42 reciprocated in the Y direction along the linear guide 41 provided on the side surface 11 a of the cabinet 11. The negative pressure suction type suction pad 43 is provided.

  The telescopic arm 42 of the second transfer means 40 operates so as to expand and contract in the Z direction, the telescopic arm 42 extends downward, and the suction of the suction pad 43 is released, so that the wafer 1 is positioned at the wafer attachment / detachment position. Is placed on the chuck table 20.

  Next, the process proceeds to a dicing process for the wafer 1. First, the chuck table 20 that sucks and holds the frame 6 with a wafer is moved to a processing position in the cabinet 11 by moving the base table 21. At this processing position, a cutting blade is cut into the division line 2 of the wafer 1 by the above-mentioned cutting means, the cutting process is performed, and the wafer 1 is diced.

  The dicing of the wafer 1 includes, for example, an operation of cutting the cutting blade into the division line 2 while feeding the chuck table 20 in the X direction, and an index for adjusting the cutting position to the division line 2 by moving the cutting blade in the Y direction. This is accomplished by an operation in which feeding and feeding are repeated alternately. In addition, the chuck table 20 is rotated in order to match the extending direction of the division line 2 with the cutting direction. When all the division lines 2 are cut and the dicing of the wafer 1 is completed, the chuck table 20 returns to the wafer attaching / detaching position, and then the wafer 1 is transferred to the cleaning device 60 by the second transfer means 40 and cleaned. Moved to the process.

  First, with respect to the wafer 1 on the chuck table 20, the telescopic arm 42 of the second transfer means 40 extends downward, the suction pad 43 is attracted to the frame 6, and the negative pressure suction operation of the chuck table 20 is released. , Held by the suction pad 43. Then, the telescopic arm 42 contracts to raise the wafer 1 and then moves to the back in the Y direction. The telescopic arm 42 extends downward again and the suction pad 43 is released from the suction, so that the frame 6 with a wafer is The spinner device 60 is placed concentrically on a spinner table 61 positioned at the wafer delivery.

  The spinner table 61 is previously operated for negative pressure adsorption, and the frame 6 with a wafer is adsorbed and held on the spinner table 61. Subsequently, the spinner table 61 is lowered and rotated to the wafer cleaning position, and the frame 4 is held by the clamp 62. Next, the cleaning water is ejected from the cleaning water nozzle onto the rotating wafer 1 to clean the wafer 1. After cleaning, the wafer 1 is subjected to a drying process such as blowing dry air.

  When the cleaning and drying of the wafer 1 is completed, the spinner table 61 is raised to the wafer delivery position, and the wafer-attached frame 6 on the spinner table 61 is returned to the frame guide rail 34 by the third transport means 50. The third transport unit 50 has the same configuration as the second transport unit 40, and is an extendable arm that is reciprocated in the Y direction along a linear guide 51 provided below the linear guide 41 on the side surface 11a of the cabinet 11. A plurality of negative-pressure suction-type suction pads 53 that are sucked onto the upper surface of the frame 4 and hold the frame 4 are provided at the front end of the frame 52.

  After finishing the cleaning process, the telescopic arm 52 of the third transport means 50 extends downward, the suction pad 53 is sucked onto the frame 4, and the operation of the negative pressure suction of the spinner table 61 is released, whereby the suction pad is released. 53. Then, after the telescopic arm 52 is contracted and moved to the front side in the Y direction, the telescopic arm 52 is extended again and the suction of the suction pad 53 is released, so that the frame 6 with a wafer is placed on the pair of frame guide rails 34. Placed. The frame 6 with a wafer placed on the frame guide rail 34 is held in the cassette 9 by the first conveying means 30 holding the frame 4 and moving the arm 32 forward in the Y direction.

  As described above, the wafer 1 is unloaded from the cassette 9, subjected to the dicing process and the cleaning process, and returned to the cassette 9. Next, the first transfer means 30 for unloading the wafer 1 housed in the cassette 9 from the cassette 9 and loading the wafer 1 into the cassette 9 will be described in detail.

(2-2) Configuration of First Conveying Unit As shown in FIG. 3A, a holding portion 35 that holds the frame 6 with a wafer is provided at the tip of the arm 32. The holding portion 35 includes a rectangular parallelepiped block 36 fixed to the tip of the arm 32 and a pair of upper and lower blow nozzles 37A and 37B attached to the block 36.

  The block 36 is disposed at a position in the X direction in FIG. 1 between the frame guide rails 34 and corresponding to the center in the X direction of the cassette 9 placed on the cassette stage 15. The clamp 33 for holding the frame of the frame 6 with a wafer is disposed below the facing surface 36a. The opposing surface 36 a of the block 36 to the cassette 9 is configured as an abutting portion that pushes the frame 4 when the frame 6 with a wafer is carried into the cassette 9.

  The upper and lower blow nozzles 37A and 37B are formed of pipes, and the upper blow nozzle (first blow nozzle) 37A extends upward from the fixing portion to the upper surface of the block 36 and then bends toward the front side in the Y direction. The shape is inclined while descending. Further, the lower blow nozzle (second blow nozzle) 37B extends downward from the fixing portion to the lower surface of the block 36, then bends toward the front side in the Y direction, and has an inclined shape while rising. The tips of the blow nozzles 37A and 37B have a length that does not protrude from the abutting portion 36a of the block 36 toward the cassette 9 side.

  As shown in FIG. 4, each of the blow nozzles 37A and 37B is connected to an air supply means 72 such as an air pump via an air pipe 71, and air is ejected from the blow nozzles 37A and 37B. . The air pipe 71 is connected to the air supply means 72 from the inside of the arm 32 through the inside of the cabinet 11. Air blown from the upper blow nozzle 37 </ b> A is blown over the entire upper surface (front surface) of the wafer 1 of the frame 6 with a wafer held by the clamp 33. The air blown from the lower blow nozzle 37B is attached to the lower surface of the wafer 1 of the frame 6 with a wafer held by the clamp 33 (the back surface of the wafer 1, in this case, strictly speaking, the back surface of the wafer 1). The back surface of the adhesive tape 5 is sprayed on the entire surface.

  In the block 36, ionized air generating means 73 for ionizing air sent from the air pipe 71 to the upper and lower blow nozzles 37A and 37B is provided. As the ionized air generating means 73, for example, a device that applies voltage to a needle-like electrode to cause corona discharge and ionizes air passing around the electrode is suitably used. In such ionized air generating means 73, positive ions and negative ions can be appropriately generated by controlling the applied voltage. When air is supplied from the air supply means 72 to the blow nozzles 37A and 37B while operating the ionized air generation means 73, the blow nozzles 37A and 37B are formed on the upper and lower surfaces of the wafer 1 of the frame 6 with a wafer held by the clamp 33. Ionized air is blown from 37B.

(2-3) Operation and Effect of First Conveying Unit As described above, the first conveying unit 30 carries out the wafer-attached frame 6 including the wafer 1 before the cutting process from the cassette 9 or performs the cutting process. Then, the wafer-mounted frame 6 including the cleaned wafer 1 is carried into the cassette 9.

  As shown in FIGS. 5A and 5B, the frame 6 with a wafer is unloaded from the cassette 9, as shown in FIGS. 5A and 5B, the holding unit 35 positioned on the cleaning device 60 side (right side in FIG. 5). Advances in the direction of the cassette 9, the frame 4 of the frame 6 with wafer is held by the clamp 33, and then the holding portion 35 is retracted as shown in FIG. 34 Pull out on top. Then, the holding by the clamp 33 is released, and the frame 6 with a wafer is placed on the frame guide rail 34. Advancement / retraction of the holding portion 35 relative to the cassette 9 is caused by movement of the arm 32 in the Y direction.

  Here, at least from the time when the frame 6 with a wafer is held by the clamp 33 until the frame 6 with a wafer is placed on the frame guide rail 34, the air supply means 72 operates while the ionized air generation means 73 is operated. Air is supplied to the upper and lower blow nozzles 37A and 37B. As a result, ionized air is blown from the upper and lower blow nozzles 37A and 37B onto the upper and lower surfaces of the wafer 1 of the frame 6 with a wafer.

  On the other hand, as shown in FIGS. 6A to 6C, the wafer 6 with the wafer 6 that has been cleaned and placed on the frame guide rail 34 is loaded into the cassette 9 as shown in FIGS. The abutting portion 36 a is abutted against the frame 4 and the holding portion 35 is advanced in the direction of the cassette 9. Thereby, the frame 6 with a wafer is pushed by the block 36 and carried into the cassette 9. At the time of loading, air is supplied from the air supply means 72 to the upper and lower blow nozzles 37A and 37B while operating the ionized air generating means 73, and ionized air is supplied to the upper and lower surfaces of the wafer 1 from these blow nozzles 37A and 37B. Do spraying.

  In the present embodiment, during the operation of loading the wafer 1 from the frame guide rail 34 into the cassette 9 and during the operation of unloading the wafer 1 from the cassette 9 and placing the wafer 1 on the frame guide rail 34, It is always possible to blow ionized air onto the wafer 1. This is possible because the blow nozzles 37 </ b> A and 37 </ b> B are provided in the holding unit 35 close to the wafer 1. The blow nozzles 37 </ b> A and 37 </ b> B that blow ionized air onto the wafer 1 blow ionized air onto the upper surface and the lower surface of the wafer 1, respectively, so that the ionized air can be sufficiently distributed on both surfaces of the wafer 1. As a result, static electricity generated on the wafer 1 during loading / unloading with respect to the cassette 9 can be reliably removed.

(2-4) Static elimination of wafers in cassette According to this embodiment, in addition to loading / unloading of wafers 1 to / from cassette 9, ionization air is blown onto a large number of wafers 1 accommodated in cassette 9 to discharge static electricity. Can be removed. FIG. 7 shows an example of the operation. By moving the holding unit 35 close to the cassette 9 and ejecting ionized air from the upper and lower blow nozzles 37A and 37B, the cassette 9 is lifted and lowered intermittently by the moving means 16. The ionized air can be blown onto the upper and lower surfaces of each wafer 1 stored in the cassette 9 in a stacked state. In this manner, by blowing ionized air into the cassette 9 from the blow nozzles 37A and 37B of the holding unit 35, it is possible to remove electricity from the wafer 1 in the cassette 9 without providing any electricity removing means.

  Here, the blowing of ionized air onto the wafer 1 in the cassette 9 is executed by an ionized air supply program shown in FIG. That is, the ionized air is blown onto the wafer 1 by the program by moving the holding portion 35 forward in the direction of the cassette 9 (step S1), and then moving the cassette 9 up and down by the moving means 16 to move the wafer in the cassette 9 1 is positioned on the upper and lower blow nozzles 37A and 37B (step S2), and ionized air is ejected from the blow nozzles 37A and 37B toward the wafer 1 (step S3).

  Also, the timing at which ionized air is blown onto the wafer 1 in the cassette 9 is arbitrary. For example, it is performed on all the unprocessed wafers 1 immediately after the cassette 9 containing the wafer 1 is placed on the cassette stage 15, or the cassette 9 A timing may be considered in which the wafer 1 unloaded from the wafer 1 is being cut or washed. Alternatively, it may be performed after all the wafers 1 are processed and stored in the cassette 9.

(3) Other Embodiments of Holding Unit FIG. 9 shows another embodiment of the holding unit 35 in the first transport unit 30. The holding unit 35 directly holds the wafer 1 alone, not the wafer 1 supported by the frame 4 via the adhesive tape 5 as shown in FIG. 2, by a horizontal tray 38 formed at the tip of the arm 32. Is. The cassette 1 stores the wafer 1 in a single state. In this case, the frame guide rail 34 is not used. A U-shaped notch 38a is formed on the cassette stage 15 side of the tray 38, and receiving portions 38b are formed on both sides of the notch 38a. On the upper surface of the pair of left and right receiving portions 38b, an adsorption portion 39 is provided that adsorbs to the back surface of the outer peripheral portion of the wafer 1 by the action of negative pressure. According to the holding part 35, the wafer 1 is received on the receiving part 38 b of the tray 38, and the wafer 1 is held by adsorbing the outer peripheral part of the wafer 1 by the adsorbing part 39. In the wafer 1 held by the receiving portion 38 b, the entire upper surface is exposed, and the lower surface is in a state where most of the portion other than the outer peripheral portion covered with the tray 38 is exposed.

  The same block 36 and upper and lower blow nozzles 37A and 37B are provided at the end of the tray 38 on the cleaning device 60 side. The block 36 is fixed in a state of penetrating the tray 38, protrudes from the upper and lower surfaces of the tray 38, the upper blow nozzle 37A is attached to the upper surface of the block 36, and the lower blow nozzle 37B is attached to the lower surface. According to the holding unit 35, the wafer 1 is received on the tray 38 and adsorbed to the left and right adsorbing units 39, and the ionized air generating unit 73 is operated to the blow nozzles 37 </ b> A and 37 </ b> B from the air supply unit 72. When air is supplied, ionized air is blown onto the upper and lower surfaces of the wafer 1 from the blow nozzles 37A and 37B.

  As shown in FIGS. 10A to 10B, the holding unit 35 carries the wafer 1 out of the cassette 9 and is waiting from the cassette 9 on the cleaning device 60 side (right side in FIG. 10). Advances in the direction of the cassette 9, and the tray 38 enters the cassette 9 along the lower surface of one wafer 1. Then, the wafer 1 is adsorbed to the adsorbing part 39 that has generated the adsorbing action due to the negative pressure, and then the holding part 35 is retracted as shown in FIG. Thereafter, the suction by the suction unit 39 is released, and at the same time, the wafer 1 on the tray 38 is held by the second transport unit 40 or another transport unit, and the wafer 1 is transferred to the dicing process. Further, after the cleaning process, the wafer 1 is placed on the tray 38 by the second transfer means 40 or other transfer means, and is sucked and held by the suction portion 39, and then the wafers 1A to 10C are used. ) Is carried into the cassette 9 by performing the reverse operation.

  The holding unit 35 generates ionized air while the wafer 1 is received by the tray 38 and then transported, and during the time when the wafer 1 is separated from the tray 38 after the adsorption by the adsorption unit 39 is released. While operating the means 73, air is supplied from the air supply means 72 to the upper and lower blow nozzles 37A, 37B. Thereby, ionized air is blown onto the upper and lower surfaces of the wafer 1 from the upper and lower blow nozzles 37A and 37B, and static electricity generated on the wafer 1 during loading / unloading with respect to the cassette 9 is reliably removed. In addition, peeling electrification is likely to occur when the wafer 1 is separated from the tray 38, but the peeling electrification can be surely removed by blowing ionized air at the time of separation.

  The above is the embodiment of the present invention. However, the present invention is not limited to the above-described cutting apparatus, but is an apparatus for performing dicing by laser light irradiation, drilling using laser light, grinding, polishing, expanded division, and the like. It can be applied to various processing apparatuses.

It is a perspective view which shows the cutting apparatus which concerns on one Embodiment of this invention. It is a perspective view which shows the state by which the semiconductor wafer cut by the same apparatus is supported by the flame | frame via the adhesive tape. It is (a) perspective view and (b) side view which show the holding | maintenance part of one Embodiment applied to the apparatus. It is a figure which shows typically the connection state of the blow nozzle of an holding | maintenance part, and an air supply means. It is a side view which shows typically the operation | movement which carries a wafer out of a cassette by the holding part of the 1st conveyance means of one Embodiment. It is a side view which shows typically the operation | movement which carries a wafer in a cassette by the holding part of the 1st conveyance means of one Embodiment. It is a side view which shows typically the operation | movement which sprays ionized air on the wafer in a cassette by the holding | maintenance part of the 1st conveyance means of one Embodiment. It is a flowchart of the ionization air supply program into the cassette which a control means has. It is the (a) perspective view and (b) side view which show other embodiment of the holding | maintenance part in a 1st conveyance means. It is a side view which shows typically operation | movement which carries out a wafer from a cassette by the holding part of the 1st conveyance means of other embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Semiconductor wafer (workpiece), 4 ... Frame, 4a ... Frame opening, 5 ... Adhesive tape, 9 ... Cassette, 10 ... Cutting device, 10A ... Control means, 15 ... Cassette stage, 16 ... Moving means, 20 ... chuck table (holding means), 30 ... first conveying means, 33 ... clamp (clamping part), 34 ... frame guide rail, 35 ... holding part, 36a ... abutment part, 37A ... upper blow nozzle (first blower) Nozzle), 37B ... Lower blow nozzle (second blow nozzle), 72 ... Air supply means, 73 ... Ionized air generation means.

Claims (1)

A cassette stage on which a cassette storing plate-like workpieces is placed;
Conveying means for loading a workpiece into the cassette placed on the cassette stage, or unloading the workpiece stored in the cassette;
Holding means for holding the workpiece;
Machining means for machining the workpiece held by the holding means ,
The transport means includes a holding portion that holds the work in a state where at least a part of one surface of the work and at least a part of the other surface of the work are exposed. A first blow nozzle that blows ionized air; a second blow nozzle that blows ionized air to the other surface ;
Moving means for relatively moving the cassette and the transport means in the thickness direction of the workpieces stored in the cassette;
An ionized air supply program for control applied to a processing apparatus in which the blowing direction of the ionized air blown out from the first blow nozzle and the second blow nozzle is a direction toward the cassette,
Bringing the transport means close to the cassette;
A step of positioning the work on the first blow nozzle and the second blow nozzle by moving the cassette and the transport means relative to each other in the thickness direction of the work housed in the cassette by the moving means; When,
Ejecting ionized air from the first blow nozzle and the second blow nozzle toward the workpiece;
An ionized air supply program comprising:

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