JP2020149878A - Analyzer and image processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an analyzer and an image processing method for improving the work efficiency of an analyst with a simple configuration.
SOLUTION: A charged particle beam irradiating unit irradiates an observation region of a sample with a charged particle beam and detects a plurality of types of signals emitted from the observation region. The processing unit is configured to be communicable with each of the charged particle beam irradiation unit, the input unit, and the display 22, and a plurality of observation images 1 to 6 of the sample are obtained based on the detection signals of the plurality of types of the charged particle beam irradiation unit. Generate. The processing unit is configured so that a plurality of observation images 1 to 6 can be displayed side by side on the display 22. When the first region of the first observation image 2 of the plurality of observation images 1 to 6 on the display 22 is designated by the input unit, the processing unit makes the first observation of the plurality of observation images. The marks 24a to 24e are configured to be displayed in the second region corresponding to the first region on the second observation images 1, 3 to 6 other than the image.
[Selection diagram] Fig. 4

Description

The present invention relates to an analyzer and an image processing method.

An analyzer such as an electron probe microanalyzer (EPMA) and a scanning electron microscope (SEM) irradiates a sample with a charged particle beam such as an electron beam and an ion beam, and the irradiation is performed from the sample. By detecting the generated signals (secondary electrons, reflected electrons, characteristic X-rays, etc.), it is possible to observe and analyze the sample.

In such an analyzer, the X-ray image by the characteristic X-ray, the secondary electron image by the secondary electrons, and the backscattered electron image by the backscattered electrons have different characteristics, and different aspects of the sample can be observed. For example, the X-ray image has a weak signal intensity, but the atomic number can be specified. On the other hand, the secondary electron image and the backscattered electron image have strong signal strength, but the atomic number cannot be specified. The secondary electron image reflects the shape of the sample surface, and the backscattered electron image reflects the distribution of average atomic numbers. Therefore, by observing the same point of the sample with each of the X-ray image, the secondary electron image, and the backscattered electron image, the observation point can be observed from various viewpoints.

Therefore, a configuration is disclosed in which an X-ray image, a secondary electron image, and a backscattered electron image are displayed side by side at the same time. Further, in Japanese Patent Application Laid-Open No. 8-320298 (Patent Document 1), a reflected electron image displayed in black and white multi-gradation and an X-ray image displayed in color are superposed in an X-ray analyzer such as an electron microanalyzer. The display method to be displayed is presented.

Japanese Unexamined Patent Publication No. 8-320298

However, in the configuration in which the X-ray image, the secondary electron image, and the backscattered electron image are displayed side by side at the same time, it is visually determined which region of the other image the region of interest in one image is while comparing each image. It is necessary to do so, and it may be difficult to make an accurate judgment. Further, in the display method disclosed in Patent Document 1, considering the actual visibility, the number of superimposed images cannot be increased, so that the same point may be observed only in a small number of images.

The present invention has been made to solve such a problem, and an object of the present invention is to provide an analyzer and an image processing method capable of improving the work efficiency of an analyst with a simple configuration.

A first aspect of the present invention relates to an analyzer including a charged particle beam irradiation unit and a processing unit. The charged particle beam irradiation unit is configured to irradiate the observation region of the sample with the charged particle beam and detect a plurality of types of signals emitted from the observation region. The processing unit is configured to be communicable with each of the charged particle beam irradiation unit, the input unit, and the display so as to generate a plurality of observation images of the sample based on the detection signals of the plurality of types of the charged particle beam irradiation unit. It is composed. The processing unit is configured so that a plurality of observation images can be displayed side by side on the display. When the first region on the first observation image of the plurality of observation images on the display is designated by the input unit, the processing unit is the second of the plurality of observation images other than the first observation image. The mark is displayed in the second area corresponding to the first area on the observation image of.

According to the present invention, it is possible to provide an analyzer and an image processing method capable of improving the work efficiency of an analyst with a simple configuration.

It is the schematic explaining the structural example of the analyzer according to embodiment of this invention. It is a figure which shows roughly the structure of a computer. It is a figure which shows an example of the image display in the analyzer which follows the comparative example. It is a figure which shows an example of the image display in the analyzer according to the embodiment of this invention. It is a figure which shows another example of the image display in the analyzer according to the Embodiment of this invention. It is a flowchart explaining the control of image acquisition according to embodiment of this invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The same or corresponding parts in the drawings are designated by the same reference numerals, and the description thereof will not be repeated.

FIG. 1 is a schematic view illustrating a configuration example of an analyzer according to an embodiment of the present invention. The analyzer 100 according to the present embodiment is configured to irradiate the sample with a charged particle beam, detect a signal generated from the sample, and observe and analyze the sample. The analyzer 100 is, for example, an electron probe microanalyzer (EPMA).

The EPMA 100 according to the present embodiment with reference to FIG. 1 includes an electron beam irradiation unit 50, a computer 20, an input device 21, and a display 22.

The electron beam irradiation unit 50 includes an electron gun 10, a deflection coil 11, an objective lens 30, a sample stage 40, a sample stage drive unit 51, a plurality of spectroscopes 60a and 60b, and a deflection coil control unit 7. A backscattered electron detector 8 and a secondary electron detector 9 are provided. The electron gun 10, the deflection coil 11, the objective lens 30, the sample stage 40, the spectroscopes 60a and 60b, the backscattered electron detector 8 and the secondary electron detector 9 are provided in a measurement chamber (not shown). During X-ray measurement, the measurement chamber is exhausted to a state close to vacuum. The electron beam irradiation unit corresponds to an embodiment of the “charged particle beam irradiation unit”.

The electron gun 10 is an excitation source that generates an electron beam E that irradiates the observation region of the sample S on the sample stage 40, and adjusts the beam current of the electron beam E by controlling a condensing lens (not shown). can do. The deflection coil 11 forms a magnetic field by the drive current supplied from the deflection coil control unit 7. The electron beam E can be deflected by the magnetic field formed by the deflection coil 11.

The objective lens 30 is provided between the deflection coil 11 and the sample S placed on the sample stage 40, and narrows the electron beam E that has passed through the deflection coil 11 to a minute diameter. The sample stage 40 is a stage on which the sample S is placed, and is configured to be movable in a horizontal plane by the sample stage driving unit 51.

In the electron beam irradiation unit 50, the irradiation position of the electron beam E on the sample S is two-dimensionally determined by driving the sample stage 40 by the sample stage driving unit 51 and / or driving the deflection coil 11 by the deflection coil control unit 7. Can be scanned. Normally, when the scanning range is relatively narrow, scanning by the deflection coil 11 is performed, and when the scanning range is relatively wide, scanning is performed by moving the sample stage 40.

The spectroscopes 60a and 60b are devices for detecting characteristic X-rays emitted from the observation region of the sample S irradiated with the electron beam E. Although only two spectroscopes 60a and 60b are shown in FIG. 1, in reality, the electron beam irradiation unit 50 is provided with a total of four spectroscopes so as to surround the sample S. .. The configuration of each spectroscope is the same except for the spectroscopic crystal, and in the following, each spectroscope may be simply referred to as "spectrometer 60".

The spectroscope 60a includes a spectroscopic crystal 61a, a detector 63a, and a slit 64a. The irradiation position of the electron beam E on the sample S, the spectroscopic crystal 61a, and the detector 63a are arranged on a Roland circle (not shown). The spectroscopic crystal 61a is tilted while moving on the straight line 62a by a drive mechanism (not shown). The detector 63a is as shown in the drawing according to the movement of the spectroscopic crystal 61a so that the incident angle of the characteristic X-ray and the emission angle of the diffracted X-ray with respect to the spectroscopic crystal 61a satisfy the diffraction condition of Bragg by a driving mechanism (not shown). Rotates to. As a result, wavelength scanning of the characteristic X-rays emitted from the sample S can be performed. The detection signal of the spectroscope 60a is sent to the computer 20.

The spectroscope 60b includes a spectroscopic crystal 61b, a detector 63b, and a slit 64b. Since the configurations of the spectroscope 60b and the spectroscope not shown are the same as those of the spectroscope 60a except for the spectroscopic crystals, the description will not be repeated. The configuration of each spectroscope is not limited to the above configuration, and various conventionally known configurations can be adopted.

The reflected electron detector 8 is a device for detecting reflected electrons emitted from the observation region of the sample S irradiated with the electron beam E. The detection signal of the backscattered electron detector 8 is sent to the computer 20.

The secondary electron detector 9 is a device for detecting secondary electrons emitted from the observation region of the sample S irradiated with the electron beam E. The detection signal of the secondary electron detector 9 is sent to the computer 20.

The deflection coil control unit 7 controls the drive current supplied to the deflection coil 11 according to an instruction from the computer 20. By controlling the drive current according to a predetermined drive current pattern (magnitude and change speed), the irradiation position of the electron beam E can be scanned at a desired scanning speed on the sample S.

The computer 20 is communicably connected to the electron beam irradiation unit 50. The computer 20 generates a control signal for controlling the operation of each part of the electron beam irradiation unit 50 according to the built-in program and table, and outputs the generated control signal to the electron beam irradiation unit 50.

Further, the computer 20 generates an image of the observation region according to the position scan of the electron beam E in the observation region on the sample S. Specifically, the computer 20 generates a reflected electron image in the observation region of the sample S based on the detected signal of the reflected electrons detected by the reflected electron detector 8. Further, a secondary electron image of the observation region of the sample S is generated based on the detection signal of the secondary electrons detected by the secondary electron detector 9.

The computer 20 further generates a distribution image (X-ray image) of the element to be analyzed in the observation region of the sample S based on the detection signals of the characteristic X-rays detected by the four spectroscopes 60. Further, when the computer 20 receives the wavelength scan of the X-ray to be analyzed, the computer 20 creates an X-ray spectrum based on the received wavelength scan. The computer 20 performs qualitative analysis and / or quantitative analysis based on the X-ray spectrum. Hereinafter, the observation area for performing such qualitative analysis and / or quantitative analysis is also referred to as an analysis area.

The EPMA 100 has a display as an output device for providing various information such as the generated observation image and the analysis result to the analyst. The display 22 is configured to be communicable with the computer 20. The display 22 constitutes a display unit for controlling the electron beam irradiation unit 50 and displaying processing information related to the data obtained by the electron beam irradiation unit 50. A plurality of displays 22 are based on a plurality of types of detection signals (characteristic X-rays, backscattered electrons, secondary electrons, etc.) of the observation region observed by the analyst when setting the analysis region of the sample S by a command of the computer 20. Images (X-ray image, backscattered electron image, secondary electron image, etc.) can be displayed. In addition, the display 22 may be configured to display information on processing related to analysis of backscattered electrons, secondary electrons, and characteristic X-rays. In such a configuration, for example, the display 22 displays an X-ray spectrum and the results of qualitative analysis and quantitative analysis based on the X-ray spectrum.

Therefore, the analyst can give various instructions to the computer 20 for controlling the electron beam irradiation unit 50 based on the display of the display 22. In addition, the analyst can analyze the data detected by the electron beam irradiation unit 50 using the computer 20 based on the display of the display 22. That is, the analyst has a numerical value indicating the observation conditions in the electron beam irradiation unit 50 on the display 22, an observation image (X-ray image, secondary electron image, backscattered electron image, etc.), the obtained characteristic X-ray, and two. Display such as a graph showing the analysis results of secondary electrons and backscattered electrons can be used.

The input device 21 is connected to the computer 20 and is configured to be able to communicate with the computer 20. The input device 21 is used to input an analyst's command to the computer 20. The input device 21 is, for example, a pointing device such as a mouse (hereinafter, also referred to as PD), a keyboard, a touch panel, or the like.

As described above, the EPMA 100 is configured to irradiate the sample surface with an electron beam and detect a signal emitted from the sample surface. The detection signal includes characteristic X-rays, backscattered electrons, secondary electrons and the like having energy peculiar to the element contained in the sample surface. In EPMA100, the element existing at the analysis position on the sample surface can be identified and quantified by analyzing the energy and intensity of the detected characteristic X-ray.

Further, in EPMA100, the shape and composition of the sample surface can be observed by the detected secondary electrons and backscattered electrons. The analyst can search for the analysis position on the sample surface while observing the secondary electron image or the backscattered electron image in the observation area. Specifically, the analyst sets the observation area (that is, the irradiation area of the electron beam E on the sample surface and the measurement area of the X-ray, the electron beam, etc.) while observing the electron image, and also on the sample surface. The area of analysis (ie, the area of qualitative and quantitative analysis) can be selected.

FIG. 2 is a diagram schematically showing the configuration of the computer 20. The computer 20 corresponds to an embodiment of the "processing unit".

With reference to FIG. 2, the computer 20 includes a CPU 28, a memory 29, an input interface (hereinafter, also referred to as an input I / F) 25, a display controller 26, and a communication interface (hereinafter, also referred to as a communication I / F). It includes 27.

The computer 20 is configured to operate according to a program stored in the memory 29. The memory 29 includes a ROM (Read Only Memory), a RAM (Random Access Memory), and an HDD (Hard Disk Drive) (not shown).

The ROM can store a program executed by the CPU 28. The program includes a program related to control of the electron beam irradiation unit 50 and processing of data detected by the electron beam irradiation unit 50. The RAM can temporarily store data used during the execution of the program in the CPU 28, and can function as a temporary data memory used as a work area. The HDD is a non-volatile storage device, and can store information such as a detection signal by the electron beam irradiation unit 50 and an analysis result thereof. In addition to the HDD, or instead of the HDD, a semiconductor storage device such as a flash memory may be adopted.

The CPU 28 controls the EPMA100. The CPU 28 expands the program stored in the ROM of the memory 29 into a RAM or the like and executes it.

The input I / F 25 is connected to the input device 21. The input I / F 25 is an interface for the computer 20 to communicate with the input device 21, and receives various signals from the input device 21.

The display controller 26 is connected to the display 22. The display controller 26 outputs a signal instructing the display contents of the display 22 to the display 22. When the display 22 is a display including a touch panel, the display controller 26 receives a signal from the display 22 indicating an analyst's touch operation on the display 22.

The communication I / F 27 is connected to the electron beam irradiation unit 50. The communication I / F 27 is an interface for the computer 20 to communicate with the electron beam irradiation unit 50, and inputs and outputs various signals to and from the electron beam irradiation unit 50.

The computer 20 installs software related to the control of the electron beam irradiating unit 50 and the processing of the data detected by the electron beam irradiating unit 50 on a computer having general functions, and stores a dedicated program and data in the memory 29. It can be realized by storing it. Specifically, a basic software program called an OS is always running on the computer 20. This basic software program is in charge of displaying on the display 22, processing the operation input to the input device 21, accessing the memory 29, and the like, and can process in parallel.

On the other hand, the software program related to the control of the electron beam irradiation unit 50 and the processing of the data detected by the electron beam irradiation unit 50 is executed on the basic software program. The software program related to the control of the electron beam irradiation unit 50 is supplied to the memory 29 of the computer 20 from the outside, and is realized by the CPU 28 reading and executing the supplied program code.

As described above, in an analyzer having such a configuration, when it is desired to observe a sample containing a desired element, an X-ray image generated from a characteristic X-ray detection signal, a backscattered electron image composed of backscattered electron detection signals, A secondary electron image or the like composed of a secondary electron detection signal is used.

Since the X-ray image detects characteristic X-rays having a wavelength peculiar to an element, only a desired element can be observed. However, since the detection signal of the characteristic X-ray is relatively low, it takes time to acquire a clear X-ray image. On the other hand, the backscattered electron image and the secondary electron image cannot specify the type of the element, while the backscattered electron image reflects the magnitude of the atomic number, and the secondary electron image has the advantage of reflecting the shape of the surface of the sample. ..

In this way, different aspects of the sample can be observed in the backscattered electron image, the secondary electron image, and the X-ray image. Therefore, in a charged particle beam irradiation device such as EPAM, a configuration is known in which a plurality of images such as a backscattered electron image, a secondary electron image, and an X-ray image are displayed side by side using a display unit such as a display.

FIG. 3 is a diagram showing an example of image display in an analyzer according to a comparative example. With reference to FIG. 3, images 1 to 6 based on secondary electron beams, backscattered electron beams, and four types of characteristic X-rays in a certain observation region are displayed side by side on the display 22. Image 1 is a secondary electron image, image 2 is a backscattered electron image, and images 3 to 6 are X-ray images based on four characteristic X-rays.

Consider a case where a specific area in the observation area displayed on each image arranged on the display is focused on and knowledge is obtained from a plurality of aspects of the area. In FIG. 3, it can be seen that the region where the pointer 23 is placed in the image 2 which is a reflected electron image has a large atomic number because the brightness is high. In this case, further, when observing the surface structure of the same region and / or identifying a specific element, the same positions of the input electron image image 1 and the X-ray image images 3 to 6 It is desirable to observe the area.

However, with such a configuration, there is a concern that it is difficult to visually find a region at the same position as the region indicated by the pointer 23 in the images 2 in the images 1 and 3 to 6.

Further, Patent Document 1 presents a display method in which a reflected electron image displayed in black and white multi-gradation and an X-ray image displayed in color are superposed and displayed in an X-ray analyzer such as an electron microanalyzer. .. However, in such a method, images having gradual brightness over the entire field of view, such as a secondary electron image (image 1 in FIG. 3) and a backscattered electron image (image 2 in FIG. 3), are superimposed. Is difficult. Visibility can also be ensured by considering superimposing a plurality of colored and transparent X-ray images (images 3 to 6 in FIG. 3) on either the secondary electron image or the backscattered electron image. There is concern that the number of X-ray images will be limited (a few in FIG. 3).

Therefore, in the analyzer 100 according to the embodiment of the present invention, when an arbitrary region is indicated on an arbitrary image on a display displaying a plurality of images among the reflected electron image, the input electron image, and the characteristic X-ray image, the other By displaying the mark in the same area on the image of, the same area of multiple images can be easily confirmed. This makes it possible to provide an analyzer that improves the work efficiency of the analyst with a simple configuration.

FIG. 4 is a diagram showing an example of image display in the analyzer 100 according to the embodiment of the present invention. In FIG. 4, similarly to FIG. 3, images 1 to 6 based on the secondary electron beam, the backscattered electron beam, and the plurality of four characteristic X-rays in the same observation region are displayed side by side on the display 22. Image 1 is a secondary electron image, image 2 is a backscattered electron image, and images 3 to 6 are X-ray images.

Further, a pointer 23 operated by the input device 21 is also displayed on the display 22. The input device 21 in the embodiment of the present invention is typically a pointing device.

In FIG. 4, the pointer 23 is placed in a region having high brightness (that is, a region having a large atomic number) near the center of the image 2 by the operation of the input device 21, and the region is indicated. The area designated by the pointer 23 is also referred to as a first area. At this time, the region (also referred to as the second region) corresponding to the first region of the observation region of the other images 1, 3 to 6 (also referred to as the second image) on the display 22 is different from the pointer 23. Appearance marks 24a to 24e are displayed.

With this configuration, it is easy to obtain knowledge in another image about the region of interest in one image. For example, in FIG. 4, it can be seen that the region consisting of the element having a large atomic number indicated by the pointer 23 corresponds to a small unevenness on the sample surface when the mark 24a of the image 1 which is a secondary electron image is seen. On the other hand, when the marks 24a to 24e of the images 3 to 6 which are X-ray images are confirmed, the region contains an element that emits the characteristic X-ray corresponding to the image 3 and emits the characteristic X-ray corresponding to the image 5. It can be seen that the elements that emit the characteristic X-rays corresponding to the images 4 and 6 are not contained.

Further, when the pointer 23 is moved to another region of interest in the image 2, the marks 24a to 24e are also moved to the region corresponding to the region. For example, when the pointer 23 moves in the image 2, the marks 24a to 24e may also be realized in a configuration that follows the movement in the images 3 to 6. Further, when the pointer 23 stops in the image 2, the marks 24a to 24e may appear in the area corresponding to the stopped area.

Further, the method of instructing the first region using the input device 21 is not limited to placing the pointer 23 on the image as described above, and may be any method in which the first region is instructed. For example, the input device 21 may be used and configured to be selected by clicking on the first area.

Further, the appearance of the pointer 23 and the appearance of the marks 24a to 24e do not necessarily have to be different as shown in FIG. 4, and may be the same. However, when the appearance of the pointer 23 and the appearance of the marks 24a to 24e are different, there is an advantage that it is easy to understand which of the pointer 23 and the marks 24a to 24e is operated by the input device 21.

Further, when the pointer 23 moves onto another image, the pointer 23 functions on the image to which the pointer 23 has moved, and a mark is displayed in the area corresponding to the area designated by the pointer 23 in the image before the movement.

FIG. 5 is a diagram showing another example of image display in the analyzer according to the embodiment of the present invention. In FIG. 5, the pointer 23, which was on the image 2 in FIG. 4, has moved onto the region showing one of the irregularities on the surface of the image 1. At this time, the mark 24a displayed in the image 1 of FIG. 4 disappears, and instead, the mark 24f is displayed in the area corresponding to the area on the image 2. Hereinafter, a part or all of the marks 24a to 24f are collectively referred to as the mark 24.

With this configuration, even if a region to be observed is found in any of the secondary electron image, the backscattered electron image, and the X-ray image, it becomes easy to obtain knowledge about the region in other images. For example, in FIG. 4, after focusing on a region having a large atomic weight near the center of the image 2 which is a reflected electron image, it is possible to confirm the surface structure and the presence / absence of a specific element in the region. On the other hand, in FIG. 5, after focusing on the region having the uneven structure of the sample surface in FIG. 1, which is a secondary electron image, it is possible to confirm the magnitude of the atomic weight and the presence / absence of a specific element in the region. In this way, by manipulating the pointer 23 on the secondary electron image, the backscattered electron image, and the plurality of X-ray images, the analyst can freely obtain knowledge on a plurality of images for the region indicated by the pointer 23. it can.

Hereinafter, the control of the EPMA100 by the computer 20 of the EPMA100 according to the embodiment of the present invention will be described with reference to FIG. FIG. 6 is a flowchart illustrating control of image acquisition according to the embodiment of the present invention. The flowchart of FIG. 6 is repeatedly executed from the time when the sample is stored in the electron beam irradiation unit 50 and the EPMA 100 is started by the analyst until it is stopped.

With reference to FIG. 6, in step 102, the computer 20 commands the electron beam irradiating unit 50 to irradiate the electron beam.

Subsequently, in step 104, the computer 20 receives detection signals such as characteristic X-rays, secondary electrons, and backscattered electrons from the electron beam irradiation unit 50.

In step 108, the computer 20 determines whether or not an instruction to display a plurality of images at the same time has been received from the analyst. When the instruction is received (YES in step 108), in step 110, the computer 20 issues a command for displaying a plurality of images of the electric X-ray image, the secondary electron image, and the backscattered electron image on the display 22. Output. In step 112, the computer 20 outputs a command to move the sample stage 40 to the sample stage driving unit 51 to set the field of view based on the instruction of the analyst until the field of view suitable for observation is included. Further, the computer 20 outputs a command for adjusting settings such as magnification and focus to the electron beam irradiation unit 50 based on the instruction of the analyst.

In step 114, when the pointer points to an arbitrary area of one image (also referred to as a first image) of a plurality of images, which image the pointer points to and the image. The position of the upper pointer, that is, the position of the indicated area on the image is determined. Further, in step 116, the computer 20 displays a mark having a shape different from that of the pointer in the area corresponding to the area indicated by the pointer in the first image on the image other than the first image.

On the other hand, in step 108, when the computer 20 does not receive an instruction to display a plurality of images at the same time from the analyst (NO in step 108), in step 118, the computer displays the display of a single image on the display 22. Outputs the command of. Subsequently, in step 120, the computer 20 outputs a command to move the sample stage 40 to the sample stage driving unit 51 until a field of view suitable for observation is included, and sets the field of view, based on the instruction of the analyst. Further, the computer 20 outputs a command for adjusting settings such as magnification and focus to the electron beam irradiation unit 50 based on the instruction of the analyst.

Following each of steps 116 and 120, in step 122, the computer 20 determines whether or not an instruction to save the image has been received from the analyst. When the computer 20 receives an instruction to save the image from the analyst (YES in step 122), in step 124, the computer 20 saves the image in the memory 29 and returns the process to the main routine.

On the other hand, if the computer 20 has not received an instruction to save the image from the analyst (NO in step 122), the computer 20 returns the process to the main routine without saving the image.

In addition, in the instruction of displaying a plurality of images at the same time from the analyst in step 108, the input of whether or not to give an instruction to the analyst may be requested every time at the time of step 108, or at the time of factory shipment or by the analyst It may be configured so that it can be set by default whether or not to give an instruction in advance. Further, when instructed to display a plurality of images at the same time, it may be configured so that it can be specified which of the X-ray image, the secondary electron image, and the backscattered electron image is to be displayed.

Further, the steps in which the analyst gives an instruction in steps 102 to 124 may be configured to be automatically instructed by a program inside and outside the computer 20.

As described above, the computer 20 is the first of the plurality of observation images when the first region on the first observation image of the plurality of observation images on the display 22 is indicated by the input device 21. The mark is displayed in the second region corresponding to the first region on the second observation image other than the observation image of. Therefore, the analyst can confirm how the observation area found in one image is displayed in another image. Therefore, it becomes easy to observe the region of interest from a plurality of aspects such as the magnitude of the atomic number, the unevenness of the surface, and the presence or absence of a specific element. That is, it is possible to provide an analyzer that improves the work efficiency of the analyst with a simple configuration.

Further, the above embodiment is an example, and can be appropriately changed according to the gist of the present invention. Specifically, although EPMA has been exemplified as an analyzer in the above embodiment, an ion beam can be used as an excitation source instead of an electron beam. Further, in the above embodiment, secondary electrons and backscattered electrons are detected to create a secondary electron image and a backscattered electron image, respectively, and characteristic X-rays are detected to obtain a two-dimensional distribution image (X-ray image) of a specific element. However, it is also possible to detect other signals (fluorescence, etc.) as signals used for generating observation images, and the configuration of the present invention can be used in various scanning charged particle microscopes. ..

It should be considered that the embodiments disclosed this time are exemplary in all respects and not restrictive. The scope of the present invention is shown by the scope of claims rather than the above description, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims.

7 Deflection coil control unit, 8 Backscattered electron detector, 9 Secondary electron detector, 10 Electron gun, 11 Deflection coil, 20 Computer, 21 Input device, 22 Display, 23 pointer, 25 Input interface (input I / F), 26 Display controller, 27 Communication interface (communication I / F), 28 CPU, 29 Memory, 30 Objective lens, 40 Sample stage, 50 Electron beam irradiation unit, 51 Sample stage drive unit, 60, 60a, 60b spectrometer, 61a, 61b spectrocrystal, 63a, 63b detector, 64a, 64b slit, 100 analyzer, E electron beam, S sample.

Claims (5)

A charged particle beam irradiation unit configured to detect a plurality of types of signals emitted from the observation region by irradiating the observation region of the sample with a charged particle beam.
A processing unit configured to be communicable with each of the charged particle beam irradiation unit, the input unit, and the display, and to generate a plurality of observation images of the sample based on the plurality of types of detection signals. Prepare,
The processing unit is configured so that the plurality of observation images can be displayed side by side on the display.
When the first region on the first observation image of the plurality of observation images on the display is designated by the input unit, the processing unit may use the first of the plurality of observation images. An analyzer configured to display a mark in a second region corresponding to the first region on a second observation image other than the observation image. The analyzer according to claim 1, wherein the appearance of the mark displayed in the second region is configured to be different from the appearance of the pointer. The input unit is a pointing device.
The instruction of the first region by the input unit is output by placing a pointer whose position on the display is controlled by the pointing device in the first region on the first observation image. Item 2. The analyzer according to item 2. The charged particle beam irradiation unit is configured to detect at least two signals of backscattered electrons, secondary electrons and one or more characteristic X-rays.
The analyzer according to any one of claims 1 to 3, wherein the plurality of observation images include at least two images based on each of the at least two signals. An image processing method performed by an analyzer that is configured to detect a plurality of types of detection signals generated from the observation area by irradiating the observation area of the sample with a charged particle beam.
A step of generating a plurality of observation images of the sample based on the plurality of types of detection signals, and
The step of displaying the plurality of observation images side by side on the display and
When the first region on the first observation image of the plurality of observation images on the display is designated by the input unit, the second of the plurality of observation images other than the first observation image. An image processing method comprising a step of instructing a mark to be displayed in a second region corresponding to the first region on the observation image of the above.