JP2019146307A - Power conversion device - Google Patents

Abstract

To provide a power conversion device in which loss can be reduced while the connection reliability is ensured.SOLUTION: A power conversion device 1 includes a semiconductor module 2 having a switching element installed therein, a control substrate 3 to which a signal terminal 21 of the semiconductor module 2 is connected, an electronic component 4 provided with a connection terminal 41 which is connected to the control substrate 3, and a casing 5 accommodating the semiconductor module 2, the control substrate 3, and the electronic component 4. A connection portion between the signal terminal 21 and the control substrate 3 is a welding bonding portion 11 where bonding is performed by welding, and a connection portion between the connection terminal 41 and the control substrate 3 is a connector connection portion 12 where connection is performed by a connector 120. The connector connection portion 12 is a connection portion for allowing relative displacement of the connection terminal 41 and the control substrate 3 along the normal direction Z of the control substrate 3.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a power conversion device.

  For example, a power conversion device mounted on an electric vehicle, a hybrid vehicle, or the like includes a semiconductor module and a control board. And the signal terminal of a semiconductor module is connected to a control board.

  Here, when relative displacement of the semiconductor module with respect to the control board occurs due to vibration applied to the power conversion device, there is a concern that a load is applied to a connection portion between the signal terminal of the semiconductor module and the control board. Therefore, for example, as disclosed in Patent Document 1, a configuration in which a signal terminal of a semiconductor module is connected to a connector mounted on a control board has been proposed. Thereby, the load applied to the connecting portion can be reduced by absorbing the relative displacement between the signal terminal and the control board in the connector.

JP, 2006-207337, A

  However, when a connector is used to connect the semiconductor module and the control board, there is a problem that the electrical resistance of the connection portion tends to increase and loss tends to increase. Further, when a connection structure using a connector is adopted, the length of the signal terminal tends to be long. Therefore, the current path between the semiconductor module and the control board becomes long, and the inductance tends to increase. Therefore, it is necessary to suppress the switching speed in order to suppress the surge voltage. As a result, there may be a problem that loss tends to increase.

  On the other hand, it is also required to secure connection reliability by reducing the load on the connecting portion due to the relative displacement between the signal terminal and the control board. Note that a load on the connection portion between the signal terminal and the control board is largely generated when an electronic component other than the semiconductor module connected to the control board is relatively displaced with respect to the semiconductor module.

  This invention is made | formed in view of this subject, and it aims at providing the power converter device which can reduce a loss, ensuring connection reliability.

One aspect of the present invention is a semiconductor module (2) incorporating a switching element;
A control board (3) to which the signal terminal (21) of the semiconductor module is connected;
An electronic component (4) having a connection terminal (41) connected to the control board;
A housing (5) containing the semiconductor module, the control board, and the electronic component;
The connection portion between the signal terminal and the control board is a welded joint (11) joined by welding,
The connection portion between the connection terminal and the control board is a connector connection portion (12) connected by a connector (120),
The connector connecting portion is in the power conversion device (1), which is a connecting portion that allows relative displacement of the connecting terminal and the control board along the normal direction of the control board.

  In the power converter, the connection portion between the signal terminal and the control board is the welded joint portion, and the connection portion between the connection terminal and the control board is the connector connection portion. Thereby, in a power converter, loss can be reduced, ensuring connection reliability.

  First, the connection portion between the connection terminal and the control board is a connector connection portion. And a connector connection part accept | permits the relative displacement along the normal line direction of a control board to a connection terminal and a control board. Thereby, even if a relative displacement arises mutually with an electronic component and a control board, the load concerning a connection part can be reduced. Therefore, connection reliability between the electronic component and the control board can be ensured.

  As a result, even if a relative displacement between the electronic component and the semiconductor module occurs, the relative displacement is absorbed by the connector connecting portion, so that the connecting portion between the signal terminal and the control board has a load. It is hard to take. Thereby, the connection reliability between a signal terminal and a control board is also securable.

  And the connection part of a signal terminal and a control board is a welding junction part. Thereby, the electrical resistance between the signal terminal and the control board can be reduced. In addition, the length of the signal terminal can be made relatively short. Therefore, the current path between the semiconductor module and the control board can be shortened, and the inductance can be easily reduced. As a result, the loss of the power conversion device can be reduced.

As mentioned above, according to the said aspect, the power converter device which can reduce a loss can be provided, ensuring connection reliability.
In addition, the code | symbol in the parenthesis described in the means to solve a claim and a subject shows the correspondence with the specific means as described in embodiment mentioned later, and limits the technical scope of this invention. It is not a thing.

Sectional explanatory drawing of the power converter device in Embodiment 1. FIG. Explanatory drawing equivalent to the II arrow of FIG. Sectional explanatory drawing of the welding junction part in Embodiment 1. FIG. Sectional explanatory drawing of the connector connection part in Embodiment 1. FIG. Cross-sectional explanatory drawing of the power converter device in Embodiment 2. FIG. Explanatory drawing equivalent to VI arrow of FIG. Plane explanatory drawing of the power converter device in Embodiment 3. FIG. Explanatory drawing equivalent to the VIII-VIII arrow directional cross section of FIG. Plane | planar explanatory drawing of the power converter device in Embodiment 4. FIG. Explanatory drawing equivalent to the XX arrow cross section of FIG. Plane explanatory drawing of the power converter device in Embodiment 5. FIG. Plane explanatory drawing of the power converter device in Embodiment 6. FIG. Plane explanatory drawing of the power converter device in Embodiment 7. FIG.

(Embodiment 1)
An embodiment according to a power conversion device will be described with reference to FIGS.
As shown in FIGS. 1 and 2, the power conversion device 1 of this embodiment includes a semiconductor module 2, a control board 3, a capacitor 4 as an electronic component, and a housing 5. The semiconductor module 2 includes a switching element. A signal terminal 21 of the semiconductor module 2 is connected to the control board 3. The capacitor 4 includes a connection terminal 41 connected to the control board 3. The housing 5 accommodates the semiconductor module 2, the control board 3, and the capacitor 4.

A connection part between the signal terminal 21 and the control board 3 is a welded joint part 11 joined by welding.
The connection portion between the connection terminal 41 and the control board 3 is the connector connection portion 12 connected by the connector 120.
The connector connecting portion 12 is a connecting portion that allows the connection terminal 41 and the control board 3 to be relatively displaced along the normal direction Z of the control board 3.

  In this embodiment, the weld joint 11 is a solder joint joined by the solder 110. That is, in this embodiment, as shown in FIG. 3, the weld joint 11 is a joint where the signal terminal 21 and the control board 3 are joined by welding the solder 110 to the signal terminal 21 and the control board 3. is there.

  As shown in FIGS. 1 and 2, the semiconductor module 2 and the capacitor 4 are disposed on the same main surface side of the control board 3. The signal terminal 21 and the connection terminal 41 are erected in the normal direction Z of the control board 3. Hereinafter, the side on which the main body 20 of the semiconductor module 2 and the main body 40 of the capacitor 4 are disposed with respect to the control board 3 is referred to as a lower side, and the opposite side is referred to as an upper side. However, the upper and lower expressions are for convenience, and the arrangement posture of the power conversion device 1 is not particularly limited.

  The semiconductor module 2 has a plurality of signal terminals 21 protruding above the main body 20. The plurality of signal terminals 21 stand substantially parallel to each other. The signal terminal 21 is inserted through a through hole 32 formed in the control board 3. The signal terminal 21 is joined to the wiring conductor of the control board 3 with solder 110 in the through hole 32.

  The semiconductor module 2 incorporates a switching element such as an IGBT (abbreviation for insulated gate bipolar transistor) in the main body 20. A part of the plurality of signal terminals 21 is a terminal connected to the gate or the like of the switching element. A part of the plurality of signal terminals 21 is connected to, for example, a sensor or the like built in the main body 20 together with the switching element. Although not shown, the semiconductor module 2 has a power terminal protruding in addition to the signal terminal 21.

  In this embodiment, the capacitor 4 is formed by projecting one connection terminal 41 upward from the main body 40. However, the number of connection terminals 41 is not particularly limited, and a plurality of connection terminals 41 may protrude.

The connection terminal 41 of the capacitor 4 can be, for example, a terminal connected to a temperature sensor, a current sensor, or the like built in the main body 40 together with the capacitor element. In addition, although illustration is abbreviate | omitted, the capacitor | condenser 4 protrudes the capacitor | condenser terminal connected to the capacitor | condenser element other than the connection terminal 41. FIG.
The capacitor 4 has a larger mass than the semiconductor module 2.

  As shown in FIG. 4, the connector 120 is mounted on the control board 3. The connector 120 is fixed to the upper surface of the control board 3 and is electrically connected to a wiring conductor formed on the control board 3. In the connector 120, an insertion space 121 for inserting the connection terminal 41 of the capacitor 4 is opened downward. The insertion space 121 communicates with the through hole 34 in the control board 3.

  A guide member 13 is fixed to the lower surface of the control board 3 at the position where the connector 120 is disposed. The guide member 13 has a through hole 131 that communicates with the through hole 34 and a guide surface 132 that expands in a tapered shape at the lower end of the through hole 131. The connection terminal 41 is configured to be inserted into the insertion space 121 of the connector 120 through the through hole 34 while being guided by the guide surface 132.

  A terminal member 122 that is pressed against the connection terminal 41 is disposed in the insertion space 121. The terminal member 122 is electrically connected to the wiring of the control board 3. The terminal member 122 can be elastically deformed in a direction orthogonal to the insertion direction of the connection terminal 41. The terminal member 122 is elastically pressed against the connection terminal 41 inserted into the insertion space 121 of the connector 120 from a direction orthogonal to the insertion direction of the connection terminal 41.

  In this way, the connection terminal 41 is held so as to be slidable in the insertion direction, that is, the vertical direction with respect to the terminal member 122. That is, the connection terminal 41 is held so as to be able to advance and retract in the vertical direction with respect to the connector 120. Thereby, relative displacement between the capacitor 4 and the control board 3 in the normal direction Z of the control board 3 is allowed.

The main body 20 of the semiconductor module 2 and the main body 40 of the capacitor 4 are fixed to the housing 5 directly or indirectly, respectively. The main body 20 of the semiconductor module 2 can be configured to be indirectly fixed to the housing 5 via a cooler (not shown), for example. The main body 40 of the capacitor 4 can be configured to be fixed to the housing 5 by, for example, a fastening member (not shown).
The housing 5 has an opening 51 on the upper side. The opening 51 is closed by a lid that is not shown. The control board 3 is arranged near the opening 51 in the housing 5.

Next, the effect of this embodiment is demonstrated.
In the power conversion device 1, the connection part between the signal terminal 21 and the control board 3 is the welded joint part 11, and the connection part between the connection terminal 41 and the control board is the connector connection part 12. Thereby, in power converter 1, loss can be reduced, ensuring connection reliability.

  First, the connection portion between the connection terminal 41 and the control board 3 is the connector connection portion 12. The connector connecting portion 12 allows the connection terminal 41 and the control board 3 to be relatively displaced along the normal direction Z of the control board 3. Thereby, even if the capacitor | condenser 4 and the control board 3 produce relative displacement mutually, the load concerning a connection part can be reduced. Therefore, connection reliability between the capacitor 4 and the control board 3 can be ensured.

  As a result, even if a relative displacement between the capacitor 4 and the semiconductor module 2 occurs, the connector connector 12 absorbs the relative displacement, so that the connection between the signal terminal 21 and the control board 3 Is difficult to load. Thereby, the connection reliability between the signal terminal 21 and the control board 3 can also be ensured.

  The connection portion between the signal terminal 21 and the control board 3 is the welded joint portion 11. Thereby, the electrical resistance between the signal terminal 21 and the control board 3 can be reduced. In addition, the length of the signal terminal 21 can be made relatively short. Therefore, the current path between the semiconductor module 2 and the control board 3 can be shortened, and the inductance can be easily reduced. As a result, the loss of the power conversion device 1 can be reduced.

  The semiconductor module 2 and the capacitor 4 are arranged on the same main surface side (that is, the lower surface side) of the control board 3, and the signal terminal 21 and the connection terminal 41 are erected in the normal direction Z of the control board 3. ing. Thereby, the connector connector 12 can be configured to absorb the relative displacement between the capacitor 4 and the control board 3 and the relative displacement between the capacitor 4 and the semiconductor module 2 more easily. Moreover, it is easy to save space in the housing 5 and to easily reduce the size of the power converter 1.

  In addition, the control board 3 is fixed to the plurality of signal terminals 21 of the semiconductor module 2 by the welding joints 11. Thereby, it is possible to reduce the number of fixing portions of the control board 3 with respect to the housing 5 in the vicinity of the connection portion with the semiconductor module 2. As a result, the power conversion device 1 can be easily reduced in size and cost.

  As mentioned above, according to the said aspect, the power converter device which can reduce a loss can be provided, ensuring connection reliability.

(Embodiment 2)
In the present embodiment, as shown in FIGS. 5 and 6, the control substrate 3 is formed by penetrating the inspection opening 33 in the thickness direction. The inspection opening 33 is formed so that an inspection tool for visually inspecting the weld joint 11 can be inserted.

  The weld joint 11 is formed not only on the upper side surface of the control board 3 but also on the lower side surface. The state of the upper side surface of the control board 3 can be easily inspected by visual observation or the like. That is, in the welded joint portion 11, for example, the appearance of the solder 110 (see FIG. 3) may be visually inspected. In such a case, even if the inspection from the upper surface side of the control board 3 is easy, the inspection from the lower surface side may be difficult. For example, when the control board 3 covers the opening surface of the housing 5 in a wide range, for example, it becomes difficult to pass an inspection tool such as a fiberscope from the outer peripheral side of the control board 3 downward. There is a case. In particular, with the downsizing of the power conversion device 1 and the integration of components, the inspection of the weld joint 11 on the lower surface side of the control board 3 tends to be difficult.

  Therefore, in this embodiment, the inspection opening 33 is provided in the control board 3. In particular, in this embodiment, an inspection opening 33 is provided in the vicinity of the weld joint 11. More specifically, as shown in FIG. 6, an inspection opening 33 is provided at a position between the plurality of signal terminals 21 of the semiconductor module 2 when viewed from the normal direction Z of the control board 3.

The semiconductor module 2 is provided with a plurality of signal terminals 21 arranged in a line in a direction parallel to the main surface of the control board 3. Correspondingly, a plurality of through holes 32 into which a plurality of signal terminals 21 of the semiconductor module 2 are inserted are formed in the control board 3 in a line. The arrangement group of these through-holes 32 in one row has a portion having a larger interval than the other portions in the central portion. An inspection opening 33 is formed in this portion.
For example, the diameter of the detection opening 33 may be larger than the diameter of the through hole 32.

  Other configurations are the same as those of the first embodiment. Of the reference numerals used in the second and subsequent embodiments, the same reference numerals as those used in the above-described embodiments represent the same components as those in the above-described embodiments unless otherwise indicated.

In the present embodiment, as described above, since the control substrate 3 has the inspection opening 33, the welding joint 11 can be easily and reliably inspected. In addition, since the welded joint portion 11 can be inspected using the inspection opening 33, restrictions such as the arrangement of components in the housing 5 are reduced. As a result, the power conversion device 1 can be easily downsized.
In addition, the same effects as those of the first embodiment are obtained.

(Embodiment 3)
As shown in FIGS. 7 and 8, the power conversion device 1 according to the present embodiment includes a stacked body 200 in which a plurality of semiconductor modules 2 are stacked in a direction along the main surface of the control board 3.

In this embodiment, the plurality of semiconductor modules 2 are stacked and arranged in a row with the same posture. The main body 20 of the semiconductor module 2 has a substantially rectangular parallelepiped shape. The semiconductor module 2 is stacked with the pair of main surfaces, which are the widest surfaces of the main body 20, facing the stacking direction X.
Although illustration is omitted, the semiconductor module 2 can constitute the stacked body 200 together with the cooling pipes arranged on both main surfaces.

  As shown in FIG. 7, the control substrate 3 has a length L1 in the stacking direction X of the stacked body 200 longer than a length L2 in the direction orthogonal to the stacking direction X in the shape viewed from the normal direction Z. The shape of the control substrate 3 viewed from the normal direction Z is a substantially rectangular shape, and its long side is along the stacking direction X. The capacitor 4 has a long shape in the stacking direction X. Then, when viewed from the normal direction Z of the control board 3, the capacitor 4 is arranged side by side in a direction orthogonal to the stacking direction X with respect to the stacked body 200.

  The capacitor 4 has a plurality of connection terminals 41, which are arranged in the stacking direction X. Correspondingly, the control board 3 is provided with a plurality of through holes 34 through which the connection terminals 41 are inserted. A plurality of connector connecting portions 12 are formed. The plurality of connector connecting portions 12 are constituted by a connector module 120m formed by integrating a plurality of connectors. However, the plurality of connector connecting portions 12 may be configured by a plurality of independent connectors.

  In the present embodiment, the control board 3 is bonded to the signal terminals 21 of the plurality of semiconductor modules 2 constituting the stacked body 200 by the welded bonding portion 11. Therefore, a large number of welded joints 11 can be formed. That is, the fixing points of the control board 3 can be increased, and the vibration resistance of the control board 3 can be improved. And in connection with this, the fastening location of the control board 3 to the housing | casing 5 grade | etc., Can be decreased. As a result, the power conversion device 1 can be easily reduced in size and cost.

In the control board 3, the length L <b> 1 in the stacking direction X of the stacked body 200 is longer than the length L <b> 2 in the direction orthogonal to the stacking direction X. That is, since the laminated body 200 is disposed along the longitudinal direction of the control board 3, it is easy to improve the vibration resistance of the control board 3.
In addition, the same effects as those of the first embodiment are obtained.

(Embodiment 4)
As shown in FIGS. 9 and 10, the present embodiment is a form of the power conversion apparatus 1 that includes the stacked body 200 and the inspection board 33 provided in the control board 3.
That is, as in the third embodiment, the power conversion device 1 according to the present embodiment includes the stacked body 200. The control board 3 is formed with an inspection opening 33 similar to that shown in the second embodiment.

  In the present embodiment, as shown in FIG. 9, the inspection opening 33 is disposed between the plurality of semiconductor modules 2 adjacent in the stacking direction X when viewed from the normal direction Z of the control board 3. That is, the inspection opening 33 is formed between the signal terminals 21 of the adjacent semiconductor modules 2 in the stacking direction X. In other words, the inspection opening 33 is formed at a position shifted in the stacking direction X with respect to the array group of the plurality of through holes 32 into which the plurality of signal terminals 21 of each semiconductor module 2 are inserted.

  When viewed from the normal direction Z, the inspection openings 33 and the semiconductor modules 2 are alternately arranged in the stacking direction X. Accordingly, an array group of a plurality of through holes 32 and a plurality of inspection openings 33 are alternately arranged in the stacking direction X.

In addition, an inspection opening 33 is formed at a position outside the stacking direction X with respect to the semiconductor module 2 arranged at the end in the stacking direction X.
Other configurations are the same as those of the third embodiment.

In the present embodiment, since the plurality of inspection openings 33 are provided in the control board 3, the plurality of welded joint portions 11 can be easily and reliably inspected. Further, when viewed from the normal direction Z of the control substrate 3, the inspection openings 33 are disposed between the plurality of semiconductor modules 2 adjacent to each other in the stacking direction X. Thereby, it becomes easy to inspect a plurality of welded joint portions 11 by inserting an inspection tool (for example, a fiber scope) from one inspection opening 33.
In addition, the same effects as those of the third embodiment are obtained.

(Embodiment 5)
In the present embodiment, as shown in FIG. 11, the number of inspection openings 33 formed in the control board 3 is reduced.
That is, one inspection opening 33 is provided for two semiconductor modules 2 adjacent in the stacking direction X. That is, one inspection opening 33 is provided so as to correspond to two semiconductor modules 2.

Each inspection opening 33 is a central position in the width direction of the semiconductor module 2 when viewed from the normal direction Z of the control substrate 3 and is a position between the two semiconductor modules 2 adjacent to each other in the stacking direction X. Is provided.
Other configurations are the same as those of the first embodiment.

In this embodiment, by reducing the number of inspection openings 33, it is easy to secure a wiring formation region in the control board 3. As a result, the control board 3 can be easily downsized, and the power converter 1 can be easily downsized. In addition, the strength of the control board 3 can be improved.
In addition, the same effects as those of the first embodiment are obtained.

(Embodiment 6)
In the present embodiment, as shown in FIG. 12, the power conversion apparatus in which the position of the inspection opening 33 on the control board 3 is located on the side opposite to the capacitor 4 with respect to the plurality of signal terminals 21 of the semiconductor module 2. 1 form.

Similar to the fifth embodiment, one inspection opening 33 is provided for two semiconductor modules 2 adjacent in the stacking direction X.
Other configurations are the same as those of the fifth embodiment.

In the present embodiment, the inspection opening 33 is provided in the vicinity of the end in the width direction with respect to the stacked body 200. Therefore, a space is easily formed below the inspection opening 33. As a result, it is easy to insert the inspection tool from the inspection opening 33 to the lower side of the control board 3. In addition, inspection openings 33 are formed in the vicinity of the ends of the plurality of signal terminals 21 of the semiconductor module 2 in the arrangement direction of the weld joints 11. Therefore, the directions in which the plurality of welded joints 11 exist with respect to the inspection tool inserted from the inspection opening 33 are close to each other. Moreover, it is easy to inspect the plurality of welded joints 11 with an inspection tool.
In addition, the same effects as those of the first embodiment are obtained.

(Embodiment 7)
In the present embodiment, as shown in FIG. 13, the power converter 1 in which the position of the inspection opening 33 on the control board 3 is positioned closer to the capacitor 4 than the plurality of signal terminals 21 of the semiconductor module 2. It is a form.

The point that one inspection opening 33 is provided for two semiconductor modules 2 adjacent in the stacking direction X is the same as in the fifth and sixth embodiments.
Other configurations are the same as those in the fifth and sixth embodiments.
Also in this embodiment, the same effect as that of the sixth embodiment can be obtained.

  In the above-described embodiment, the configuration in which the capacitor is provided as the electronic component is shown, but the present invention is not limited to this. As the electronic component, for example, various electronic components connected to the control board such as a current sensor that detects an output current and an input current, and a sensor that detects a connection between the power conversion device and an external interface can be applied.

  Moreover, although the form which used the solder was shown as a welding junction part, it is not restricted to this, For example, a welding junction part can also be comprised by brazing, welding, etc.

  The present invention is not limited to the above embodiments, and can be applied to various embodiments without departing from the scope of the invention.

DESCRIPTION OF SYMBOLS 1 Power converter 11 Welding junction 12 Connector connection 2 Semiconductor module 21 Signal terminal 3 Control board 4 Capacitor (electronic component)
41 Connection terminal 5 Case

Claims (7)

A semiconductor module (2) incorporating a switching element;
A control board (3) to which the signal terminal (21) of the semiconductor module is connected;
An electronic component (4) having a connection terminal (41) connected to the control board;
A housing (5) containing the semiconductor module, the control board, and the electronic component;
The connection portion between the signal terminal and the control board is a welded joint (11) joined by welding,
The connection portion between the connection terminal and the control board is a connector connection portion (12) connected by a connector (120),
The power converter (1), wherein the connector connecting portion is a connecting portion that allows relative displacement along the normal direction (Z) of the control board to the connection terminal and the control board.   The said semiconductor module and the said electronic component are arrange | positioned at the same main surface side in the said control board, The said signal terminal and the said connection terminal are standingly arranged in the normal line direction of the said control board. The power converter according to 1.   The power converter according to claim 1 or 2, comprising a stacked body (200) in which a plurality of the semiconductor modules are stacked and arranged in a direction along a main surface of the control board.   The shape of the control board as viewed from the normal direction, the length (L1) in the stacking direction (X) of the stacked body is longer than the length (L2) in the direction orthogonal to the stacking direction. 4. The power conversion device according to 3.   5. The control board according to claim 1, wherein an inspection opening (33) through which an inspection tool for visually inspecting the weld joint can be inserted is formed in the thickness direction. The power converter according to item.   A stack (200) in which a plurality of the semiconductor modules are stacked and arranged in a direction along the main surface of the control board, and the inspection opening is in the stacking direction (X) when viewed from the normal direction. The power conversion device according to claim 5, wherein the power conversion device is disposed between the plurality of semiconductor modules adjacent to each other.   The power converter according to claim 6, wherein when viewed from the normal direction, the inspection openings and the semiconductor modules are alternately arranged in the stacking direction.

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