JP2019009165A - Heat diffusion structure and electronic device including the same - Google Patents

Abstract

To provide a heat diffusion structure which can inhibit occurrence of hot spots on a surface of a housing of an electronic device, and to provide the electronic device including the same.SOLUTION: A heat diffusion structure includes: an exhaust port 101A provided at a housing body part 101 which exhausts air in a housing of a communication control unit 100; and a heat conductor 105 which is disposed on a passage, in which air around an IC 104 heated by the IC 104 flows toward the exhaust port 101A, within the housing in a direction which is not parallel to a direction in which the air moves. Gaps G1 and G3 for allowing the air flowing to the exhaust port 101A within the housing to pass are formed between a back surface and a front surface of the housing and an edge part of the heat conductor 105.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a heat diffusion structure and an electronic apparatus including the same.

  Conventionally, in an electronic device such as a communication control device, an exhaust port is provided on an upper surface of a housing. Then, the heat released from the heat generating component in the electronic device warms the surrounding air, and the warmed air rises linearly in the direction opposite to the gravity and is exhausted from the exhaust port to the outside of the housing. . At this time, a portion of the housing located above the heat generating component is locally heated, and a hot spot is generated on the surface of the housing.

  For example, the safety standard for communication control devices defines the maximum temperature of the outer surface of the housing of the device. For example, in IEC 60950, it is specified at 85 ° C. for short-time contact. On the other hand, since the amount of heat generated by the components has increased with the recent high functionality of ICs, improvement of the heat dissipation of the surface of the housing has become an important issue.

  Japanese Patent Application Laid-Open No. 2004-151561 describes a silencer that is mounted on an exhaust port formed in a projector housing, and includes a plurality of plate members provided with punching holes that are opposed to each other. Specifically, Patent Document 1 discloses that a projector composite is obtained by two actions of a perforated tube resonance type silencing mechanism at an outer edge portion of a plurality of through holes provided in a plate material by punching and a plate-like sound absorption mechanism by the plate material. It reduces the typical operating noise.

JP 2007-163685 A

  In Patent Document 1, an exhaust fan for forced air cooling is provided in the casing of the projector, and an exhaust port is provided on the side of the casing in order to exhaust the air blown by the exhaust fan to the outside of the casing. Yes. In this case, the air heated by the heat-generating component of the electronic device is blown by the exhaust fan and reaches the side surface of the housing. And the said hot air will produce a hot spot on the side surface of a housing | casing. Further, when no exhaust fan is used, the air heated by the heat generating component rises in the direction opposite to the gravity, and a hot spot is generated on the upper surface of the housing.

  The objective of this invention is providing the thermal diffusion structure which can suppress that a hot spot generate | occur | produces on the surface of the housing | casing of an electronic device, and an electronic device provided with the same.

  The heat diffusion structure according to the first aspect of the present invention is warmed by the electronic parts of the electronic device in the housing, and the exhaust port provided in the housing for exhausting the air in the housing of the electronic device. A heat conductor disposed in a direction non-parallel to the direction in which the air moves on a flow path in which air around the electronic component flows toward the exhaust port, and the housing and the heat conductor A gap is formed between the edge of the heat sink and the air in the housing flowing toward the exhaust port, or the air in the housing flowing toward the exhaust port in the heat conductor. A vent for passing through is formed.

  An electronic device according to a second aspect of the present invention includes an electronic component and a casing that surrounds the electronic component, and an exhaust port provided in the casing for exhausting air in the casing; and the casing A heat conductor disposed in a direction non-parallel to a direction in which the air moves on a flow path in the body in which air around the electronic component heated by the electronic component flows toward the exhaust port; A gap is formed between the casing and the edge of the heat conductor for allowing air in the casing to flow toward the exhaust port, or the exhaust port is provided in the heat conductor. It further includes a heat diffusion structure in which a vent for allowing the air in the housing flowing toward the air to pass therethrough is formed.

  It is possible to provide a heat diffusion structure that can suppress the occurrence of hot spots on the surface of a casing of an electronic device and an electronic device including the same.

1 is a perspective view illustrating an appearance of a communication control device according to Embodiment 1. FIG. 1 is a perspective view showing the inside of a communication control device according to Embodiment 1. FIG. 3 is a perspective view showing a heat conductor according to Embodiment 1. FIG. 3 is a top view of the communication control apparatus according to Embodiment 1. FIG. It is a figure which shows the upper part of the XX cross section of the communication control apparatus which concerns on Embodiment 1. FIG. 2 is a front view showing the inside of the communication control apparatus according to Embodiment 1. FIG. 5 is a perspective view showing a heat conductor according to Embodiment 2. FIG. 6 is a top view of a communication control apparatus according to Embodiment 2. FIG. It is a figure which shows the upper part of the XX cross section of the communication control apparatus which concerns on Embodiment 2. FIG. FIG. 6 is a perspective view showing a heat conductor according to a third embodiment. 7 is a top view of a communication control apparatus according to Embodiment 3. FIG. It is a figure which shows the upper part of the XX cross section of the communication control apparatus which concerns on Embodiment 3. FIG.

Embodiment 1
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing an external appearance of a communication control apparatus 100 as an electronic apparatus according to Embodiment 1 of the present invention. FIG. 2 is a perspective view showing the inside of the communication control apparatus 100. FIG. 3 is a perspective view showing thermal conductor 105 (described later) according to the first embodiment. FIG. 4 is a top view of the communication control apparatus 100. FIG. 5 is a diagram illustrating an upper portion of the XX cross section of the communication control device 100. FIG. 6 is a front view showing the inside of the communication control apparatus 100. As shown in FIG. 1, the housing of the communication control device 100 is composed of a housing body 101, a housing cover 102, and the like. As shown in FIG. 2, the communication control apparatus 100 further includes an electronic control unit 103, an IC 104 as an electronic component, a heat conductor 105, and the like.

The housing body 101 has a box shape that forms the upper surface, the lower surface, the side surface, and the back surface of the housing of the communication control apparatus 100. Further, one or more exhaust ports 101A are provided on the upper surface of the housing main body 101 (the upper surface of the communication control device 100). The air inside the communication control device 100 is exhausted through the exhaust port 101A. In the example shown in FIGS. 1 and 2, the exhaust port 101 </ b> A has a substantially rectangular shape that is long in the long side direction of the upper surface of the housing body 101. In addition, three exhaust ports 101A are provided on the upper surface at a predetermined interval toward the short side direction of the upper surface of the housing body 101. Note that the shape and number of the exhaust ports 101A provided on the upper surface of the housing main body 101 are not limited to the examples shown in FIGS.
Moreover, the housing body 101 includes a fixing portion 101B that extends downward from the upper surface by a predetermined distance. A guide rail is formed at the lower end of the fixed portion 101B, and the heat conductor 105 is slidably sandwiched between the guide rails.

  The housing cover 102 has a lid shape that covers the opening of the housing main body 101, and constitutes the front surface of the housing of the communication control device 100. One or more air inlets 102 </ b> A are provided on the front surface of the housing cover 102 (the front surface of the communication control device 100). Outside air is sucked into the communication control apparatus 100 through the air inlet 102A.

  The electronic control unit 103 is erected so as to be substantially parallel to the back surface at a position away from the back surface of the housing body 101 by a predetermined distance. An IC 104 is mounted on the surface of the electronic control unit 103 on the housing cover 102 side.

  As shown in FIG. 3, the heat conductor 105 is a sheet metal having a substantially rectangular planar shape. The heat conductor 105 is made of a metal having high heat conductivity such as aluminum or copper. Further, it is preferable that a ceramic paint is applied to the surface of the heat conductor 105. Thereby, the heat dissipation of the thermal conductor 105 can be further improved.

  As shown in FIGS. 2 and 6, the end portion of the heat conductor 105 is sandwiched between the guide rails of the fixing portion 101 </ b> B of the housing body 101. Thereby, the heat conductor 105 is disposed in the vicinity of the exhaust port 101 </ b> A of the housing body 101. In addition, the upper surface of the housing body 101 provided with the exhaust port 101A and the heat conductor 105 are opposed to each other. Further, as shown in FIG. 6, the heat conductor 105 is in a direction substantially perpendicular to the direction in which the air around the IC 104 heated by the IC 104 as the electronic component moves (the direction of the arrow shown in FIG. 6). Be placed. In the first embodiment, the direction in which the heat conductor 105 is arranged may be a direction that is not parallel to the direction in which the air heated by the IC 104 moves. In the first embodiment, the air heated by the IC 104 rises substantially along the vertical direction. Therefore, the direction in which the heat conductor 105 is disposed may be a direction that is not parallel to the vertical direction. The heat conductor 105 is disposed on the flow path of the air heated by the IC 104. By arranging the heat conductor 105 in such a direction, the air heated by the IC 104 once hits the lower surface of the heat conductor 105 and spreads along the lower surface of the heat conductor 105. Thereby, the heat of the air warmed by the IC 104 is dispersed and conducted to the heat conductor 105, and the temperature of the air can be lowered.

Further, as shown in FIG. 4, the short side width of the heat conductor 105 has a sufficient width so that air heated by the IC 104 can collide with it. On the other hand, as shown in FIG. 5, the air heated by the IC 104 is thermally conducted between the edge of the long side of the heat conductor 105 sandwiched between the fixed portions 101 </ b> B and the back surface of the housing main body 101. A gap G1 is formed to flow toward the exhaust port 101A after hitting the lower surface of the body 105. In other words, the short side width of the heat conductor 105 has a length obtained by subtracting the width of the gap G1 from the short side width of the upper surface of the housing body 101.
Further, as shown in FIG. 5, the air heated by the IC 104 hits the lower surface of the heat conductor 105 between the upper end of the electronic control unit 103 and the edge of the long side of the heat conductor 105 and then exhausted. A gap G2 for flowing toward the mouth 101A is formed.
Furthermore, after the air heated by the IC 104 hits the lower surface of the heat conductor 105 between the edge of the long side of the heat conductor 105 sandwiched between the fixed portions 101 </ b> B and the front surface of the housing cover 102. A gap G3 for flowing toward the exhaust port 101A is formed.
Accordingly, as shown in FIG. 6, the air heated by the IC 104 rises substantially along the vertical direction, hits the lower surface of the heat conductor 105, and then moves along the lower surface of the heat conductor 105. spread. Next, the air spread on the lower surface of the heat conductor 105 flows toward the exhaust port 101A through the gap G2, the gaps G1 and G3, and is exhausted out of the communication control apparatus 100 from the exhaust port 101A.

  The air heated by the IC 104 collides with the lower surface of the heat conductor 105 and spreads along the lower surface of the heat conductor 105, whereby the heat of the air is dispersed and conducted to the heat conductor 105, Air temperature can be lowered. As a result, it is possible to suppress the occurrence of hot spots on the surface of the casing body 101 by the air heated by the IC 104 directly hitting the upper surface of the casing body 101. In other words, the heat diffusion structure for diffusing the heat of the air before the air heated by the IC 104 reaches the exhaust port 101A can be formed by the exhaust port 101A and the heat conductor 105.

That is, the heat diffusion structure according to Embodiment 1 includes the exhaust port 101A provided in the housing body 101 for exhausting the air in the housing of the communication control device 100, and the IC 104 heated by the IC 104 in the housing. And a heat conductor 105 disposed in a direction non-parallel to the direction in which the air moves, on a flow path in which air around the air flows toward the exhaust port 101A. In addition, a gap G1 is formed between the back surface of the casing main body 101 and the edge of the long side of the heat conductor 105 so that air in the casing flowing toward the exhaust port 101A passes through the electronic control unit. A gap G2 is formed between the upper end of 103 and the edge of the long side of the heat conductor 105 so that air heated by the IC 104 hits the lower surface of the heat conductor 105 and then flows toward the exhaust port 101A. Has been.
Further, a gap G <b> 3 is formed between the front surface of the housing cover 102 and the edge of the long side of the heat conductor 105 for allowing the air in the housing flowing toward the exhaust port 101 </ b> A to pass.

  In the heat diffusion structure and communication control apparatus 100 according to the first embodiment described above, the air around the IC 104 heated by the IC 104 flows in a direction in which the air moves on the flow path flowing toward the exhaust port 101A. A heat conductor 105 is arranged in a non-parallel direction. Therefore, the air around the IC 104 heated by the IC 104 collides with the lower surface of the heat conductor 105 and spreads along the lower surface of the heat conductor 105, so that the heat of the air is dispersed into the heat conductor 105. The temperature of the air can be lowered. Thus, the heat of the air can be diffused by the heat conductor 105 before the air heated by the IC 104 reaches the exhaust port 101A. Therefore, it is possible to suppress the occurrence of hot spots on the surface of the casing main body 101 when the air heated by the IC 104 directly hits the upper surface of the casing main body 101. Therefore, it is possible to provide a heat diffusion structure capable of suppressing the occurrence of hot spots on the surface of the housing and the communication control device 100 including the heat diffusion structure.

  The heat conductor 105 is made of a sheet metal to which a ceramic paint is applied. Therefore, the heat of the air around the IC 104 heated by the IC 104 can be more efficiently conducted to the heat conductor 105.

  Further, the air hitting the heat conductor 105 flows through the gap G2, the gaps G1 and G3 toward the exhaust port 101A, and is exhausted from the exhaust port 101A to the outside of the communication control device 100. Therefore, the air heated by the IC 104 does not have to stay in the housing of the communication control device 100.

Embodiment 2
Next, a second embodiment of the present invention will be described with reference to FIGS. FIG. 7 is a perspective view showing a heat conductor 106 according to Embodiment 2 of the present invention. FIG. 8 is a top view of communication control apparatus 100A according to the second embodiment. FIG. 9 is a diagram illustrating an upper portion of the XX cross section of the communication control apparatus 100A. As shown in FIGS. 7 to 9, the communication control apparatus 100A and the heat diffusion structure according to the second embodiment use the heat conductor 106 in place of the heat conductor 105, so that the communication according to the first embodiment is performed. Different from the control device 100 and the thermal diffusion structure. Accordingly, the same components are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 7, the heat conductor 106 is formed with a vent 106 </ b> A through which air in the housing that flows toward the exhaust 101 </ b> A passes. It differs from the heat conductor 105 which concerns on this. Therefore, the description of the same points of the heat conductor 106 as the heat conductor 105 is omitted.

  As shown in FIG. 8, the short side width of the heat conductor 106 has a sufficient width so that air heated by the IC 104 can collide with it. In the second embodiment, the edge of the long side of the heat conductor 106 sandwiched between the fixed portions 101B is in contact with the back surface of the housing body 101. In other words, the short side width of the heat conductor 106 has substantially the same length as the short side width of the upper surface of the housing main body 101. As with the heat conductor 105 according to the first embodiment, the IC 104 is heated between the edge of the long side of the heat conductor 106 sandwiched between the fixed portions 101B and the back surface of the housing body 101. A gap may be formed to flow toward the exhaust port 101 </ b> A after the generated air hits the lower surface of the heat conductor 106.

As shown in FIGS. 8 and 9, the vent 106 </ b> A provided in the heat conductor 106 is provided at a position different from the position corresponding to the exhaust port 101 </ b> A of the heat conductor 106. In other words, the position of the vent 106A in the top view of the communication control device 100A is different from the position of the exhaust port 101A in the top view of the communication control device 100A. Specifically, in the example illustrated in FIGS. 8 and 9, the vent 106 </ b> A is provided at a position corresponding to between the adjacent exhaust ports 101 </ b> A of the housing main body 101 in the heat conductor 106.
In the example shown in FIGS. 8 and 9, the vent 106 </ b> A has a substantially rectangular shape that is long in the long side direction of the heat conductor 106. Specifically, the long side width of the vent hole 106A has substantially the same length as the long side width of the exhaust port 101A. Further, the two air vents 106A are provided in the heat conductor 106 at a predetermined distance from each other in the short side direction of the heat conductor 106. Note that the shape and number of the vent holes 106A provided in the heat conductor 106 are not limited to the examples shown in FIGS.

  As a result, as shown in FIG. 9, the air heated by the IC 104 rises substantially along the vertical direction, hits the lower surface of the heat conductor 106, and then moves along the lower surface of the heat conductor 106. spread. Next, the air spread on the lower surface of the heat conductor 106 flows toward the exhaust port 101A through the vent 106A, and is exhausted out of the communication control apparatus 100 from the exhaust port 101A.

  Then, the air heated by the IC 104 collides with the lower surface of the heat conductor 106 and spreads along the lower surface of the heat conductor 106, whereby the heat of the air is dispersed and conducted to the heat conductor 106, Air temperature can be lowered. As a result, it is possible to suppress the occurrence of hot spots on the surface of the casing body 101 by the air heated by the IC 104 directly hitting the upper surface of the casing body 101. In other words, the exhaust port 101A and the heat conductor 106 can form a heat diffusion structure for diffusing the heat of the air before the air heated by the IC 104 reaches the exhaust port 101A.

  In the heat diffusion structure and communication control apparatus 100A according to the second embodiment described above, the same effects as in the first embodiment can be obtained. In addition, since the edge of the long side of the heat conductor 106 sandwiched between the fixed portions 101B is in contact with the back surface of the housing body 101, the air warmed by the IC 104 is more reliably transferred to the heat conductor. It hits the lower surface of 106. Therefore, the heat of the air heated by the IC 104 can be more reliably conducted to the heat conductor 106.

Embodiment 3 FIG.
Next, a third embodiment of the present invention will be described with reference to FIGS. FIG. 10 is a perspective view showing thermal conductor 107 according to Embodiment 3 of the present invention. FIG. 11 is a top view of communication control apparatus 100B according to the third embodiment. FIG. 12 is a diagram illustrating an upper portion of the XX cross section of the communication control apparatus 100B. As shown in FIGS. 10 to 12, the communication control device 100B and the heat diffusion structure according to the third embodiment are arranged such that the position of the vent 107A formed in the heat conductor 107 is the communication control device according to the second embodiment. Different from 100A and thermal diffusion structure. Therefore, the description of the same points as the heat conductor 106 of the heat conductor 107 is omitted.

As shown in FIGS. 11 and 12, the vent 107 </ b> A provided in the thermal conductor 107 is provided at a position corresponding to the exhaust port 101 </ b> A of the thermal conductor 107. In other words, the position of the vent 107A in the top view of the communication control device 100A and the position of the exhaust port 101A in the top view of the communication control device 100A are substantially the same. Specifically, in the example illustrated in FIGS. 11 and 12, the vent 107 </ b> A is the middle exhaust port 101 </ b> A among the three exhaust ports 101 </ b> A provided on the upper surface of the housing body 101 in the heat conductor 107. Is provided at a position corresponding to the other exhaust port 101A. In other words, the vent 107 </ b> A is not provided in the thermal conductor 107 at a position corresponding to the middle exhaust 101 </ b> A among the three exhausts 101 </ b> A provided on the upper surface of the housing body 101. .
In the example shown in FIGS. 11 and 12, the vent 107 </ b> A has a substantially rectangular shape that is long in the long side direction of the heat conductor 107. Specifically, the long side width of the vent hole 107A has substantially the same length as the long side width of the exhaust port 101A. In addition, the short side width of the vent hole 107A is practically the same as the short side width of the exhaust port 101A. In addition, the two air vents 107 </ b> A are provided in the heat conductor 107 at a predetermined interval toward the short side direction of the heat conductor 107. Note that the shape and number of the vents 107A provided in the heat conductor 107 are not limited to the examples shown in FIGS.

  Thus, as shown in FIG. 12, the air heated by the IC 104 rises substantially along the vertical direction, hits the lower surface of the heat conductor 107, and then moves along the lower surface of the heat conductor 107. spread. Next, the air spread on the lower surface of the heat conductor 107 flows toward the exhaust port 101A through the vent 107A, and is exhausted out of the communication control device 100 from the exhaust port 101A.

  In the heat diffusion structure and communication control apparatus 100B according to the third embodiment described above, the same effects as those of the first and second embodiments can be obtained. In addition, the vent 107A is not provided at the position corresponding to the middle exhaust port 101A among the three exhaust ports 101A provided on the upper surface of the housing body 101 in the heat conductor 107. The air heated by the IC 104 strikes the lower surface of the heat conductor 107 more reliably. Therefore, the heat of the air heated by the IC 104 can be more reliably conducted to the heat conductor 107.

  Further, the vent 107A is provided at a position of the heat conductor 107 corresponding to the exhaust port 101A. Specifically, the vent 107 </ b> A is located at a position corresponding to the exhaust port 101 </ b> A other than the middle exhaust port 101 </ b> A among the three exhaust ports 101 </ b> A provided on the upper surface of the housing body 101 in the heat conductor 107. , Provided. Therefore, the air passing through the vent 107A rises as it is, and is exhausted out of the communication control device 100B through the exhaust port 101A. Therefore, the exhaust efficiency of the air in the communication control device 100B can be more reliably maintained.

Note that the present invention is not limited to the above-described embodiment, and can be changed as appropriate without departing from the spirit of the present invention. For example, in the first to third embodiments, the communication control devices 100, 100A, and 100B are illustrated as electronic devices, but the electronic device according to the present invention is not limited to the communication control device.
Moreover, in Embodiment 1 thru | or Embodiment 3, although IC104 was illustrated as an electronic component, the electronic component which concerns on this invention is not limited to IC.

In the first to third embodiments, the air heated by the IC 104 flows toward the exhaust port 101A provided on the upper surface of the housing main body 101, and the exhaust port 101A of the housing main body 101 is in the air outlet 101A. Although an example in which the heat conductors 105, 106, and 107 are arranged in the vicinity and the air inlet 102A is arranged on the front surface of the housing cover 102 has been shown, the air inlet may be arranged on the lower surface of the housing.
In addition, similar vents (the upper surface is used as an exhaust port and the lower surface is used as an intake port) are provided on the upper surface and the lower surface of the housing main body 101, and the heat conductors 105, 106, 107 are fixed near the upper surface and the lower surface. By providing the fixing portion 101B, it may be possible to install the casing upside down. In this case, the heat conductors 105, 106, and 107 may be installed on the fixed portion 101B near the exhaust port that is the upper surface.

In the first to third embodiments, the heat conductors 105, 106, and 107 are slidably held by the fixing portion 101B of the housing body 101. 107, the fixing portion 101B, and the housing main body 101 may be integrally formed.
In the first to third embodiments, the planar shape of the thermal conductors 105, 106, and 107 is substantially rectangular, but the planar shape of the thermal conductors 105, 106, and 107 is limited to this. Instead, it may be another shape such as an ellipse. Further, the heat conductors 105, 106, and 107 may not be flat plates but may be corrugated plates.

100, 100A, 100B Communication control device (electronic equipment)
101 Main body (housing)
101A Exhaust port 101B Fixing part 102 Case cover (housing)
102A Intake port 103 Electronic control unit 104 IC (electronic component)
105, 106, 107 Thermal conductors 106A, 107A Gap G1, G2, G3 Gap

Claims (8)

An exhaust port provided in the housing for exhausting air in the housing of the electronic device;
Heat disposed in a direction non-parallel to the direction in which the air moves on a flow path in which air around the electronic component heated by the electronic component of the electronic device flows toward the exhaust port in the casing. A conductor,
With
A gap is formed between the housing and the edge of the heat conductor for allowing air in the housing to flow toward the exhaust port to pass, or the heat conductor is directed to the exhaust port. A heat diffusion structure in which a vent for allowing air in the casing to flow is formed. The portion of the casing provided with the exhaust port and the heat conductor are opposed to each other,
The heat diffusion structure according to claim 1, wherein the vent provided in the heat conductor is provided at a position different from a position corresponding to the exhaust port of the heat conductor. The portion of the casing provided with the exhaust port and the heat conductor are opposed to each other,
The heat diffusion structure according to claim 1, wherein the vent provided in the heat conductor is provided at a position corresponding to the exhaust port of the heat conductor.   The thermal diffusion structure according to any one of claims 1 to 3, wherein the thermal conductor is made of a sheet metal coated with a ceramic paint. An electronic device comprising an electronic component and a housing surrounding the electronic component,
An exhaust port provided in the housing for exhausting air in the housing, and a flow path in which air around the electronic component heated by the electronic component flows toward the exhaust port in the housing. A heat conductor disposed in a direction non-parallel to the direction in which the air moves, and air in the housing that flows toward the exhaust port between the housing and an edge of the heat conductor A heat diffusion structure in which a gap is formed to pass through, or a vent is formed in the heat conductor to allow air in the housing to flow toward the exhaust port.
An electronic device further comprising: The portion of the casing provided with the exhaust port and the heat conductor are opposed to each other,
The electronic device according to claim 5, wherein the vent provided in the heat conductor is provided at a position different from a position corresponding to the exhaust port of the heat conductor. The portion of the casing provided with the exhaust port and the heat conductor are opposed to each other,
The electronic device according to claim 5, wherein a vent provided in the heat conductor is provided at a position corresponding to the exhaust port of the heat conductor.   The electronic device according to claim 5, wherein the heat conductor is made of a sheet metal coated with a ceramic paint.

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