JP2011249496A - Cooling structure of electronic apparatus - Google Patents

Abstract

An electronic device cooling structure having an excellent cooling effect is provided.
A cooling structure for an electronic device includes a casing provided with an intake port 1c and an exhaust port, and a circuit board disposed in the casing and mounted with a heat generating component 3 on one surface. Between the one surface of the circuit board and the facing wall 12 facing the one surface of the circuit board in the housing, a heat radiating member is disposed so as to contact both the heat generating component 3 and the facing wall 12. The heat dissipating member includes a fin 45 that is arranged in a predetermined direction on the opposing wall 12 and that forms openings that open on both sides of the ventilation direction orthogonal to the predetermined direction, and a plate 41 that transfers heat generated in the heat generating component 3 to the fin 45 . Between the fins 45, an air flow from the intake port 1c to the exhaust port is generated by the fan. The intake port 1c is provided on a line at an appropriate position.
[Selection] Figure 4

Description

  The present invention relates to a cooling structure for an electronic device incorporating a heat-generating component.

  In general, a circuit board mounted on an electronic device is mounted with a heat generating component such as a so-called LSI, a large-scale integrated circuit, and a microprocessor. In recent years, with the increase in operating frequency of electronic devices, the amount of heat generated by heat-generating components tends to increase. In addition, with the miniaturization of electronic devices, it is difficult to cool the heat generating components. Therefore, there is a need for means that can efficiently cool the heat generating components.

  For example, Patent Document 1 discloses a cooling structure for an electronic device as shown in FIG. The cooling structure shown in FIG. 9 includes a housing 104 having a bottom wall 104b in which an air inlet 108 is formed. Housed in the housing 104 are a circuit board 116, a heat-generating component 117 mounted on the circuit board 116 and facing the air inlet 108, and a fan 130 that sucks air in the housing 104 and discharges it out of the housing 104. Has been. A sealing material 136 capable of elastic deformation is interposed between the circuit board 116 and the bottom wall 104b. The sealing material 136 surrounds the heat generating component 117, and forms an air guide path 138 from the heat generating component 117 to the fan 130 in cooperation with the circuit board 116 and the bottom wall 104 b inside the housing 104. Further, a heat diffusion plate 123 whose back surface is thermally connected to the heat generating component 117 and whose front surface faces the air guide path 138 is installed in the housing 104. The air sucked into the air guide path 138 from the air inlet 108 is directly blown to the heat diffusion plate 123, and the heat diffusion plate 123 is uniformly cooled. Thereby, the heat-generating component 117 can be cooled.

JP 2006-301715 A

  If the required cooling performance increases as the amount of heat generated in the heat generating component increases, the cooling performance of the electronic device cooling structure shown in FIG. 9 of Patent Document 1 may be insufficient. In addition, when the electronic device having a cooling structure in which the heat generating component is cooled by heat exchange with the air passing through the air guide path 138 as in the electronic apparatus of Patent Document 1, the air guide path 138 is also reduced in size. Therefore, the amount of heat exchange between the air and the heat diffusing plate 123 is reduced. That is, the problem that cooling performance falls arises.

  The present invention has been made in view of such circumstances, and can ensure sufficient cooling performance even for electronic devices with a large amount of heat generation, and good cooling performance also for miniaturized electronic devices. It is an object of the present invention to provide a cooling structure for an electronic device that can ensure the above.

  In order to solve the above-described problems, the present invention provides a cooling structure for an electronic device incorporating a heat-generating component, and a housing provided with an air inlet and an air outlet, and one side disposed in the housing. Arranged between the circuit board on which the heat generating component is mounted and the one surface of the circuit board and the opposing wall facing the one surface of the housing so as to contact both the heat generating component and the opposing wall. A heat dissipating member that is arranged in a predetermined direction on the opposing wall and that forms openings that open on both sides of the ventilation direction orthogonal to the predetermined direction, and heat generated by the heat-generating component to the fin A heat dissipating member including a transmitting plate, and a fan for generating an air flow from the air inlet to the exhaust through the fins, the air inlet being provided on the opposing wall on a line extending in the predetermined direction. And the position of the air inlet in the ventilation direction is a second opening that is the other of the openings from the first opening with respect to the first opening that is the opening of the opening that has the larger amount of outflow of air. A cooling structure for an electronic device, which is a position not less than 0.3 times and not more than 1.3 times the length of the heat dissipation member in the ventilation direction.

  Here, the “heat generating component” refers to an electronic component that generates a relatively large amount of heat (for example, an electronic component that generates 4 W or more), and a specific example thereof is a semiconductor in which a semiconductor chip is covered with a sealing resin. Package.

  According to said structure, the heat which generate | occur | produces in a heat-emitting component can be efficiently thermally radiated from the fin of a heat radiating member with respect to the air which flows from an inlet port to an exhaust port. Furthermore, according to the above configuration, since the heat radiating member functions as a heat conduction path that transmits heat generated by the heat-generating component to the housing, heat can be radiated from the housing to the outside air. . In particular, since the intake port in this configuration has the appropriate shape as described above and is provided at an appropriate position, the fins can be air-cooled by fresh air taken from the intake port, and the heat conduction from the housing can be performed. Heat dissipation can be maintained sufficiently. Thereby, since both the effects of air cooling and heat radiation from the housing can be effectively used, an excellent cooling effect can be obtained.

The perspective view which shows the cooling structure of the electronic device which concerns on Embodiment 1 of this invention. The top view which shows the cooling structure of the electronic device which concerns on Embodiment 1 of this invention Schematic cross-sectional view along path a shown in FIG. The perspective view of the cooling structure of the electronic device which concerns on Embodiment 1 of this invention, and the principal part expansion perspective view of a heat radiating member The perspective view of the cooling structure of the electronic device which concerns on Embodiment 2 of this invention The perspective view of the cooling structure of the electronic device which concerns on Embodiment 3 of this invention The perspective view of the cooling structure of the electronic device which concerns on Embodiment 4 of this invention Sectional drawing of the cooling structure of the electronic device which concerns on Embodiment 5 of this invention Sectional drawing which shows the cooling structure of other conventional electronic devices

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. The following description relates to an example of the present invention, and the present invention is not limited to these.

(Embodiment 1)
1 and 2 show a cooling structure for an electronic device according to Embodiment 1 of the present invention. In the present embodiment, a form in which the present invention is applied to a Blu-ray player including the storage device 6 and the drive mechanism 7 will be described. However, the present invention can also be applied to other electronic devices such as a DVD player or a CD player. is there.

  Specifically, the cooling structure of the present embodiment includes a box-shaped housing 1 that is flat in the vertical direction and accommodates the storage device 6 and the drive mechanism 7. The housing 1 has a rectangular cylindrical peripheral wall 13 extending in the vertical direction, and a ceiling wall 11 and a bottom wall (corresponding to the opposing wall of the present invention) 12 that block the space surrounded by the peripheral wall 13 from above and below. . In FIG. 1, the housing 1 is drawn with a two-dot chain line in order to clarify the internal configuration of the electronic device.

  The peripheral wall 13 has a rectangular frame shape in plan view, and a pair of long side portions 13a and 13b constituting the front surface and the back surface of the housing 1, and a pair of short sides constituting the right side surface and the left side surface of the housing 1. And a side portion 13c. The ceiling wall 11 constitutes the upper surface of the housing 1, and the bottom wall 12 constitutes the lower surface of the housing 1.

  The drive mechanism 7 is disposed on the left side in the housing 1, and a Blu-ray disc can be inserted into the drive mechanism 7 from the front surface of the housing 1. In addition, the storage device 6 is disposed at a right position in the housing 1 and spaced from the bottom wall 12 (see FIG. 3).

  Further, in the housing 1, the circuit board 2 is substantially arranged so that a predetermined gap (for example, about 4 to 8 mm) is formed between the drive mechanism 7 and the storage device 6 and the bottom wall 12. It is arranged horizontally. The circuit board 2 is located below the storage device 6 and partly overlaps the storage device 6. The heat generating component 3 is mounted on the lower surface of the circuit board 2 facing the bottom wall 12.

  The short side portion 13c of the peripheral wall 13 constituting the right side surface of the housing 1 is used to cool the entire equipment in the housing 1 by taking outside air into the housing 1 at the right position of the storage device 6. An intake port (corresponding to a second intake port of the present invention) 1a is provided. Further, an exhaust port 1b for exhausting the air in the housing 1 to the outside is provided at a position behind the storage device 6 in the long side portion 13b of the peripheral wall 13 constituting the back surface of the housing 1. . The intake port 1a and the exhaust port 1b are actually composed of a plurality of ventilation holes, but are represented by one square in the drawing for the sake of simplicity.

  Further, the bottom wall 12 constituting the lower surface of the housing 1 is provided with a local air inlet 1c for taking outside air into the housing 1 and cooling the heat radiation component 3 in particular. The local air inlet 1c in the present embodiment is configured by arranging a plurality of rectangular slits on a line (see FIG. 4A). As will be described later, the local intake port 1 c functions as an intake port that guides air between the fins 45.

  A fan 5 is attached to the inner side surface of the long side portion 13b of the peripheral wall 13 so as to overlap the exhaust port 1b. When the fan 5 is activated, a flow of air that is sucked from the intake port 1a and the local intake port 1c and exhausted from the exhaust port 1b is generated.

  Between the lower surface of the circuit board 2 and the bottom wall 12 of the housing 1, the heat radiating member 4 is disposed so as to contact both the heat generating component 3 mounted on the lower surface of the circuit board 2 and the bottom wall 12. The heat dissipating member 4 has a rectangular shape in plan view, and has a structure that allows air to blow through in the short direction perpendicular to the longitudinal direction.

  Specifically, as shown in FIG. 4A, the heat dissipation member 4 includes fins 45 arranged in a predetermined direction on the bottom wall 12, and a plate 41 that sandwiches the fins 45 in cooperation with the bottom wall 12. have. And the direction (x direction of Fig.4 (a)) in which the fin 45 was arranged is a longitudinal direction of the thermal radiation member 4, and the ventilation direction orthogonal to the direction in which the fin 45 was arranged on the horizontal surface (Fig.4 (a)) (Y direction) is the short direction of the heat radiating member 4. That is, the plate 41 has a rectangular plate shape extending in the direction in which the fins 45 are arranged. Moreover, the fin 45 forms the 1st opening 45a and the 2nd opening 45b which are opened on the both sides of a ventilation direction.

  The length of the heat dissipating member 4 is set to be sufficiently larger than the width of the heat generating component 3, and the heat dissipating member 4 protrudes on both sides of the heat generating component 3 in the direction in which the fins 45 are arranged (see FIG. 2). .

  In the present embodiment, as shown in FIG. 4 (b), in the present embodiment, upper ends and lower ends of adjacent fins 45 are alternately connected, and peak portions 46A and valley portions 46B are alternately connected. A repeating corrugated fin 46 is formed. The peak portions 46A and the valley portions 46B of the corrugated fins 46 may be sharp.

  The corrugated fins 46 are joined to the plate 41 and the housing 1 by plating at the peaks 46A and valleys 46B. However, they may be joined by brazing, electrodeposition coating, an adhesive with high thermal conductivity, mechanical caulking, or the like. Further, the valley portion 46 </ b> B and the housing 1 may be connected via a plate similar to the plate 41.

  For example, a flat plate made of aluminum having a thickness of 0.08 to 0.2 mm can be suitably used as the material constituting the corrugated fin 46, but any metal material having a high thermal conductivity can be adopted. It is. The corrugated fins 46 are preferably coated such that the emissivity is increased on the surface of, for example, black alumite treatment in order to promote heat transfer by radiation.

  The plate 41 is in surface contact with the heat generating component 3 at the center. From the viewpoint of reducing the contact thermal resistance, it is preferable to apply grease having high thermal conductivity between the heat generating component 3 and the plate 41.

  Next, the positional relationship between the local intake port 1c, the fin 45, and the exhaust port 1b and the air flow in the housing 1 formed by the fan 5 will be described.

  In the present embodiment, the local intake port 1c is provided on the bottom wall 12 on a line extending in the direction in which the fins 45 are arranged (the x direction in FIG. 4A). The local intake port 1c is sucked from the local intake port 1c, flows from the second opening 45b toward the first opening 45a, and then the fan 5 can form a flow of air exhausted from the exhaust port 1b. (That is, the first opening 45a is the opening having the larger amount of air outflow). The first opening 45a is an opening farther from the local intake port 1c, and the second opening 45b is an opening closer to the local intake port 1c. In particular, in the present embodiment, the position of the local intake port 1c in the ventilation direction (the y direction in FIG. 4A) is from the first opening 45a toward the second opening 45b with respect to the first opening 45a. In other words, the position is 1.0 to 1.3 times the length of the fin 45 in the ventilation direction (in the −y direction).

  Next, a mechanism for cooling the electronic device in this embodiment will be described. According to the cooling structure of the present embodiment, the fin 45 can efficiently dissipate the heat generated by the heat generating component 3 to the air flowing from the local intake port 1c to the exhaust port 1b.

  Further, according to the cooling structure of the present embodiment, the heat radiating member 4 functions as a heat conduction path that transfers heat generated in the heat generating component 3 to the housing 1. Therefore, according to this configuration, the heat generated in the heat generating component 3 can be transmitted to the bottom wall 12 through the heat radiating member 4 and radiated from the bottom wall 12 to the outside air.

  In particular, according to the cooling structure of the present embodiment, since the local air inlet 1c is provided at the appropriate position as described above, the fins 45 can be air-cooled by fresh air taken from the local air inlet 1c, The heat dissipation from the housing 1 due to heat conduction can also be maintained.

  Moreover, since the heat radiating member 4 projects to both sides of the heat generating component 3 in the direction in which the fins 45 are arranged, the heat generated in the heat generating component 3 can be guided to the bottom wall 12 while widely diffusing. For this reason, heat dissipation by convection of air flowing from the local intake port 1c to the exhaust port 1b and radiation by radiation from the lower surface of the housing 1 after heat conduction from the heat generating component 3 to the housing 1 can be made more efficient. it can.

  From another viewpoint, in the cooling structure according to the present embodiment, the contact surface with the heat radiating member 4 of the bottom wall 12 where heat generated by the heat generating component 3 is most transmitted by heat conduction is drawn from the local air intake port 1c. It is cooled by fresh air immediately after it has been applied. That is, according to the present embodiment, heat concentration in the housing 1 can be suppressed.

  In the present embodiment, in order to efficiently inhale air between the fins 45, the length in the x direction of the region where the local air inlet 1c is provided is the same as the length in the x direction of the heat dissipation member 4. I have to. However, from the viewpoint of the cooling effect, there is no problem even if the length in the x direction of the region where the local air inlet 1c is provided is larger than the length of the heat radiating member 4 in the x direction. What is necessary is just to determine suitably based on the intensity | strength etc. of the housing | casing 1. FIG. The length in the y direction of the local air inlet 1c may be appropriately determined based on the strength of the housing 1 and the like, similarly to the length in the x direction.

  In the present embodiment, the position of the local intake port 1c in the x direction is such that the x coordinate at the center of the local intake port 1c is equal to the x coordinate at the center of the heat dissipation member 4. The position of 1c in the x direction is not limited to this. What is necessary is just to determine suitably so that the air inhaled from the local inlet 1c may flow in between the fins 45 easily.

  In the present embodiment, from the viewpoint of ease of processing, the local air inlet 1c is configured by arranging a plurality of rectangular slits extending in the y direction on a line. However, the local air inlet 1c may be configured by one continuous elongated rectangular slit extending in the x direction. However, according to the present embodiment, the portion on the heat radiating member 4 side and the portion on the opposite side of the bottom wall 12 of the housing 1 as viewed from the local air inlet 1c are not thermally divided. Therefore, from the viewpoint of heat diffusion, it is preferable that the local intake port 1c has the shape of the present embodiment.

  Moreover, it is preferable that the opening area of the inlet port 1a is larger than the opening area of the local inlet port 1c. As a result, heat generated from a heat source (such as a power supply circuit) other than the heat generating component 3 in the housing 1 can be efficiently transferred to the air sucked from the intake port 1a, and the entire electronic device can be efficiently Can be cooled.

  Here, a simulation result performed for confirming the effect of the present embodiment will be specifically described. For example, when the length of the heat radiating member 4 in the ventilation direction (y direction) is 30 mm and the heat generation amount of the heat generating component 3 is 15 W, the position of the local intake port 1c in the y direction is changed from the second opening 45b to the −y direction. When the position was 11 mm, the temperature of the hottest portion of the bottom wall 12 of the casing 1 was 67 degrees, and the temperature of the hottest portion of the heat generating component 3 was 111 degrees. When the position of the local intake port 1c in the y direction is in contact with the second opening under the same conditions, the temperature of the hottest portion of the bottom wall 12 of the housing 1 is 69 degrees, and the heat generating component 3 The temperature of the hottest part of was 111 degrees. In this way, the heat dissipating member 4 having a large number of fins 45 is used, and the position of the local intake port 1c in the y direction is the same position as the second opening 45b or a predetermined position upstream of the second opening 45b. In this case, the surface temperature of the bottom wall 12 of the housing 1 can be maintained at a predetermined temperature (for example, 70 ° C.) or lower and the temperature of the heat generating component 3 can be maintained at a predetermined temperature (for example, 120 ° C.) or lower.

(Embodiment 2)
FIG. 5 shows a cooling structure for an electronic device according to Embodiment 2 of the present invention. In the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted. The same applies to the following embodiments.

  In the present embodiment, the heat radiating member 4 has a cover portion 42 connected to the end portion of the plate 41 on the second opening 45 b side. The cover 42 extends to the bottom wall 12 of the housing 1 so as to cover the local air inlet 1c, and forms an air guide path.

  Since the cover 42 is provided so as to cover the local air inlet 1 c provided on the bottom wall 12 of the housing 1, the air introduced from the local air inlet 1 c surely flows between the fins 45. For this reason, compared with the cooling structure of the first embodiment, the cooling structure of the present embodiment makes the convection between the fins 45 more effective. That is, the heat generated by the heat generating component 3 can be radiated more efficiently by the fins 45 to the air flowing from the local intake port 1c to the exhaust port 1b. Moreover, since the cover part 42 is provided, the danger of the foreign material mixing from the local inlet 1c to the inside of the housing | casing 1 can be suppressed.

  In the present embodiment, the cover portion 42 is formed integrally with the plate 41 by bending a single metal plate, but may be formed of a member separate from the plate. Moreover, the cover part 42 may have other shapes in consideration of mass production.

(Embodiment 3)
FIG. 6 shows a cooling structure for an electronic device according to Embodiment 3 of the present invention. In the present embodiment, the cover portion 42 connected to the plate 41 extends to the bottom wall 12 of the housing 1 so as to cover the local air inlet 1c, and the contact portion 43 connected to the cover portion 42 further includes the housing 1. It is thermally connected by making a surface contact with the bottom wall 12.

  As in the present embodiment, the heat generated in the heat generating component 3 is transferred to the contact portion 43 of the cover portion 42 by heat conduction by thermally bonding the contact portion 43 and the bottom wall 12 of the housing 1. In addition, a new heat conduction path that is transmitted to the bottom wall 12 of the housing 1 is formed. As a result, the absolute amount of heat conduction from the heat generating component 3 to the bottom wall 12 of the housing 1 becomes larger than the absolute amount of the same heat conduction amount in the second embodiment, and the absolute amount of heat radiation from the housing 1. Will increase. That is, the cooling structure according to the present embodiment has superior cooling performance than the cooling structure according to the second embodiment. Further, in the present embodiment, since there is a new heat conduction path as described above, it is separated from the portion of the bottom wall 12 of the housing 1 that is in contact with the heat radiating member 4 by the local air inlet 1c. Heat can also be transmitted to the part. Therefore, the heat in the housing 1 of the present embodiment is more easily distributed more uniformly than the heat in the housing 1 of the second embodiment. In other words, the housing 1 of the present embodiment is less likely to concentrate heat than the housing 1 of the second embodiment. Thereby, it can suppress that the housing | casing 1 becomes high temperature locally.

  From the viewpoint of reducing contact thermal resistance, a portion having a contact between the contact portion 43 of the cover portion 42 and the bottom wall 12 of the housing 1 is coated with a highly heat conductive grease or a gel sheet. It is preferable to make it. Moreover, what is necessary is just to fix the contact part 43 of the cover part 42 to the bottom wall 12 with a screw | thread, for example.

  Note that the shape and size of the contact portion 43 may be appropriately determined so that the temperature of the heat generating component 3 and the temperature of the bottom wall 12 of the housing 1 are equal to or lower than the desired temperature, according to the amount of heat generated.

(Embodiment 4)
FIG. 7 shows a cooling structure of an electronic device according to the fourth embodiment. In the present embodiment, the local air inlet 1 c is provided between the first opening 45 a and the second opening 45 b of the heat dissipation member 4 on the bottom wall (opposing wall) 12 in the housing 1.

  In the cooling structure according to the fourth embodiment, all of the air sucked from the local air inlet 1 c flows between the fins 45. That is, compared with the cooling structure of the first embodiment, the convection between the fins 45 is more effective in the cooling structure of the present embodiment. Therefore, the cooling effect by air cooling can be used more effectively while ensuring the cooling effect by heat conduction.

  In the present embodiment, the air flowing between the local intake port 1c and the fins 45 flows out from both openings formed by the fins 45. Which of the openings has a large amount of outflow of air depends on the local intake port. It varies depending on the position of 1c and the arrangement of elements in the housing 1. In the present embodiment, from the viewpoint of making the convection between the fins 45 effective, the amount of outflow of air from the opening on the side far from the local intake port 1c is increased (that is, from the local intake port 1c). The cooling structure as a whole is configured so that the far opening is the first opening 45a. Note that the cooling structure may be configured such that air flows in from the local intake port 1c and the second opening 45b and flows out only from the first opening 45a. In the present embodiment, the position of the local intake port 1c in the ventilation direction (y direction in FIG. 7) is determined from the first opening 45a toward the second opening 45b with the first opening 45a as a reference (that is, In the -y direction), the position is 1.3 times or more and 1.0 times or less the length of the fin 45 in the ventilation direction.

  Here, a simulation result performed for confirming the effect of the present embodiment will be specifically described. For example, when the length of the heat radiating member 4 in the ventilation direction (y direction) is 30 mm and the heat generation amount of the heat generating component 3 is 15 W, the position of the local intake port 1c in the y direction is 11 mm from the second opening 45b in the + y direction. , The temperature of the hottest portion of the bottom wall 12 of the casing 1 was 61 degrees, and the temperature of the hottest portion of the heat generating component 3 was 101 degrees. Moreover, when the position of the local inlet 1c in the y direction is 22 mm in the + y direction from the second opening 45b under the same conditions, the temperature of the hottest portion of the bottom wall 12 of the housing 1 is 62 degrees. The temperature of the hottest part of the heat generating component 3 was 103 degrees. As described above, when the heat radiating member 4 having a large number of fins 45 is used and the position of the local intake port 1c in the y direction is a position between the first opening 45a and the second opening 45b, It is possible to keep the surface temperature of the bottom wall 12 at a predetermined temperature (for example, 65 ° C.) or lower and the temperature of the heat generating component 3 at a predetermined temperature (for example, 120 ° C.) or lower.

(Embodiment 5)
FIG. 8 shows a cooling structure for an electronic apparatus according to Embodiment 5 of the present invention. In the present embodiment, the arrangement pitch of the fins 45 is set to be larger than the outer arrangement pitch just below the heat generating component 3. In other words, the fins 45 are sparse just below the heat generating component 3 and dense outside.

  Thus, by forming the fins 45 sparsely just below the heat generating component 3 and densely outside the heat generating component 3, the airflow resistance between the fins 45 directly below the heat generating component 3 is more than the airflow resistance between the fins 45 outside the heat generating component 3. Becomes smaller. As a result, the amount of air passing between the fins 45 immediately below the heat generating component 3 is larger than the amount of air passing between the fins 45 on the outside thereof. Therefore, it is possible to intensively air-cool the portion immediately below the heat generating component 3 having the highest temperature.

  Furthermore, since the fins 45 are formed sparsely below the heat generating component 3 and densely outside thereof, the heat conduction path from the heat generating component 3 directly below the heat generating component 3 to the bottom wall 12 of the housing 1 is Narrower than the heat conduction path on the outside. That is, in the present embodiment, compared to the other embodiments, the heat conduction amount from the heat generating component 3 immediately below the heat generating component 3 to the bottom wall 12 of the housing 1 is compared with the heat conduction amount on the outside thereof. The relative amount is small. As a result, the heat transmitted to the bottom wall 12 directly below the heat generating component 3 where heat tends to concentrate can be reduced. That is, heat concentration in the housing 1 can be suppressed.

  In addition, what is necessary is just to determine suitably the concrete space | interval of the fin 45 so that the temperature of the heat-emitting component 3 and the temperature of the bottom wall 12 of the housing | casing 1 may become below desired temperature.

(Other embodiments)
In each of the above embodiments, the heat dissipation member 4 is disposed between the bottom wall 12 of the housing 1 and the bottom wall 12 of the circuit board 2, but the circuit board 2 is close to the ceiling wall 11 of the housing 1. When arranged, the heat generating component 3 is mounted on the upper surface of the circuit board 2, and contacts both the heat generating component 3 and the ceiling wall 11 between the upper surface of the circuit board 2 and the ceiling wall 11 of the housing 1. Thus, the heat radiating member 4 may be arranged.

  However, it is desirable that the upper surface of the housing 1 has a low temperature in consideration of contact with the user's hand. Therefore, as in each of the above embodiments, the heat dissipating member 4 is disposed between the bottom wall 12 of the housing 1 and the bottom wall 12 of the circuit board 2 to dissipate heat to the bottom wall 12 of the housing 1. More preferably. Furthermore, since the bottom wall 12 generally has a higher rigidity than the ceiling wall 11 in order to support the component parts, the configuration in the above-described embodiments is more effective in the housing 1. It is preferable in that heat diffusion in the direction is performed satisfactorily.

  The present invention is particularly useful for a cooling structure of an electronic device provided with a heat generating component such as an LSI or a CPU in a housing.

DESCRIPTION OF SYMBOLS 1 Housing | casing 1a Intake port 1b Exhaust port 1c Local intake port 2 Circuit board 3 Heat generating component 4 Heat radiation member 5 Fan 6 Storage device 7 Drive mechanism 11 Ceiling wall 12 Bottom wall 13 Perimeter wall 41 Plate 42 Cover part 43 Contact part 45 Fin 45a 1st 1 opening 45b 2nd opening 46 Corrugated fin 46A Mountain part 46B Valley part

Claims (11)

A cooling structure for an electronic device incorporating a heat-generating component,
A housing provided with an air inlet and an air outlet;
A circuit board disposed in the housing and having the heat generating component mounted on one surface thereof;
A heat dissipating member disposed between one surface of the circuit board and an opposing wall facing the one surface of the housing so as to contact both the heat generating component and the opposing wall, the opposing wall A heat dissipating member including fins that are arranged in a predetermined direction above and that form openings that open on both sides of the ventilation direction orthogonal to the predetermined direction, and a plate that transmits heat generated in the heat-generating component to the fins;
A fan that creates a flow of air from the intake port to the exhaust port through between the fins,
The intake port is provided on the opposing wall on a line extending in the predetermined direction;
The position of the air inlet in the ventilation direction is from the first opening to the second opening, which is the other of the openings, with the first opening being the opening with the larger amount of air outflow of the openings. It is a position not less than 0.3 times and not more than 1.3 times the length of the heat dissipation member in the ventilation direction.
Cooling structure for electronic equipment. A position of the air inlet in the ventilation direction is a position between the first opening and the second opening;
The air sucked from the air inlet flows out of one or both of the first opening and the second opening;
The cooling structure of the electronic device according to claim 1. A position of the air inlet in the ventilation direction is a position opposite to the first opening when viewed from the second opening;
Air sucked from the air inlet flows into the fins from the second opening, and flows out from the first opening.
The cooling structure of the electronic device according to claim 1. The heat dissipating member further includes a cover portion extending so as to cover the intake port from an end portion on the second opening side of the plate to the opposing wall of the housing.
The electronic device cooling structure according to claim 3. The heat dissipating member further includes a contact portion extending along the opposing wall from the tip of the cover portion,
The contact portion and the opposing wall are in surface contact,
The cooling structure of the electronic device according to claim 4.   The electronic device cooling structure according to any one of claims 1 to 5, wherein a length of a region in which the air inlet is provided in the predetermined direction is equal to or longer than a length of the heat radiating member in the predetermined direction. .   The cooling structure for an electronic device according to any one of claims 1 to 6, wherein the heat dissipating member projects to both sides of the heat generating component in the predetermined direction. The housing includes a peripheral wall extending in a vertical direction orthogonal to the predetermined direction and the ventilation direction, and a ceiling wall and a bottom wall that block a space surrounded by the peripheral wall from above and below.
One surface of the circuit board is a lower surface facing the bottom wall,
The opposing wall of the housing is the bottom wall;
The cooling structure of the electronic device as described in any one of Claims 1-7. The peripheral wall is provided with a second intake port having a larger opening area than the intake port.
The cooling structure for an electronic device according to claim 8.   9. The cooling structure for an electronic device according to claim 8, wherein an arrangement pitch of the fins is set to be larger than an arrangement pitch outside the section including a region immediately below the heat generating component.   The fins are corrugated fins in which adjacent ends of the heat generating member side of the adjacent fins or ends of the opposing wall side are alternately connected, and the ridges and valleys are alternately repeated. The cooling structure of the electronic device as described in any one of Claims 1-10.

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