JP2018137436A - Air-cooled heat radiation device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To apply heat to an electronic element inside an electronic device, enhance the heat dissipation effect, suppress noise, stabilize the performance of the electronic element inside the electronic device, and extend the service life, which can be applied to various electronic devices. Providing an air-cooled heat dissipation device that can be used. SOLUTION: The air-cooled heat radiating device of the present invention is used for heat dissipation of an electronic element, includes a loading board, an air pump, and a radiator, and the loading board includes a gas introduction side opening and a heat conduction plate, among which the above-mentioned The heat conductive plate is installed on the upper surface, corresponds to the gas introduction side opening, the electronic element is installed on the heat conductive plate, the air pump is installed on the lower surface of the loading substrate, and the gas. It is closed corresponding to the opening on the introduction side, the radiator is installed on the electronic element, and the air pump is driven to allow the air flow to flow into the opening on the gas introduction side to exchange heat with the heat conduction plate. As a result, heat dissipation of the electronic element is realized. [Selection diagram] Fig. 3

Description

  The present invention relates to an air-cooling heat dissipation device, and more particularly to an air-cooling heat dissipation device that performs heat dissipation by driving an airflow with an air pump.

  With the advancement of science and technology, various electronic devices such as mobile computers, tablets, industrial computers, mobile communication devices, and video playback devices have already been developed toward the trend of lighter, thinner, more mobile, and higher performance. Since the internal space of electronic devices is limited, it is necessary to arrange various highly integrated or high power electronic devices. If the calculation speed of the electronic device is made faster and the function is made more powerful, more heat energy is generated during operation of the electronic elements inside the electronic device, resulting in a high temperature. In addition, most of these electronic devices are lightweight, thin and compact in appearance, and there is no internal space used for heat dissipation cooling, so the electronic elements in the electronic devices are easily affected by thermal energy and high temperature, causing interference and damage. Such problems are caused.

  Generally, the heat dissipation method inside an electronic device can be divided into active heat dissipation and passive heat dissipation. Active heat dissipation usually uses an axial fan or centrifugal fan, installed inside the electronic device, drives the airflow by the axial fan or centrifugal fan, transfers the thermal energy generated by the electronic elements inside the electronic device, Realize heat dissipation. However, axial fans and centrifugal fans are relatively noisy during operation, and their volume is relatively large, making it difficult to reduce the thickness and size. Further, since the service life of the axial flow fan and the centrifugal fan is relatively short, the conventional axial flow fan and the centrifugal fan are light and thin, and are not suitable for heat radiation in the mobile electronic device.

  In addition, many electronic devices are soldered onto a printed circuit board (PCB) using techniques such as surface mount technology (SMT) and selective soldering (Selective Soldering). However, electronic devices soldered by the above-described soldering method tend to be detached from the printed circuit board when placed in a high thermal energy and high temperature environment for a long time, and most electronic devices Since the electronic device is not resistant to high temperatures, when the electronic device is placed in a high thermal energy and high temperature environment for a long period of time, the performance stability of the electronic device is lowered and the life is likely to be shortened.

  FIG. 1 shows the structure of a conventional heat dissipation mechanism. As shown in FIG. 1, the conventional heat dissipation mechanism is a passive heat dissipation mechanism, which includes a heat conductive plate 12, and the heat conductive plate 12 interacts with an electronic element 11 that is dissipated through a heat conductive paste 13. Through the heat conduction path formed by the heat conduction paste 13 and the heat conduction plate 12, the electronic element 11 utilizes heat conduction to achieve heat dissipation by a natural convection method. However, the heat dissipation efficiency of the heat dissipation mechanism described above is not excellent, and the demand for application cannot be satisfied.

  In view of this, there is a need to develop an air-cooling heat dissipation device that can solve the problems faced by existing technologies.

  The object of the present invention can be applied to various electronic devices, radiates heat to the electronic elements inside the electronic equipment, enhances the heat dissipation effect, suppresses noise, stabilizes the performance of the electronic elements inside the electronic equipment, and uses the service life. The object is to provide an air-cooling heat dissipating device that can be extended.

  Another object of the present invention is to provide a temperature control function, control the operation of the air pump based on the temperature change of the electronic elements inside the electronic equipment, enhance the heat dissipation effect, and extend the service life of the air-cooling heat dissipation device. An object is to provide an air-cooling heat dissipation device.

  In order to achieve the above object, an air-cooling heat dissipation device provided by a broader embodiment of the present invention is used for heat dissipation of an electronic element, and the air-cooling heat dissipation device includes a loading board, an air pump, and a radiator. The loading board includes an upper surface, a lower surface, a gas introduction side opening, and a heat conduction plate, of which the heat conduction plate is installed on the upper surface and corresponds to the gas introduction side opening. The electronic element is installed on the heat conducting plate, the air pump is a piezoelectric drive air pump, installed on the lower surface of the loading board, and sealed in correspondence with the gas introduction side opening, The air pump includes a resonance piece having a hollow hole, a piezoelectric actuator installed corresponding to the resonance piece, and a cover plate, the cover plate including a side wall, a bottom plate, and an opening, and the side wall is a periphery of the bottom plate On the bottom plate An accommodation space is formed by the bottom plate, the resonance piece and the piezoelectric actuator are installed in the accommodation space, the opening is provided on the side wall, and the resonance piece and the side wall of the lid plate Jointly define one merging chamber, and when the piezoelectric actuator is driven to perform a gas collecting operation, gas is collected from the opening of the cover plate into the merging chamber, and further from the hollow hole of the resonance piece to the first. When the piezoelectric actuator is driven and exhausted by flowing into the chamber and temporarily stored, the gas flows from the first chamber through the hollow hole of the resonance piece into the gas introduction side opening, Perform heat exchange.

It is sectional drawing which shows the structure of the conventional heat radiating mechanism. It is a three-dimensional view of the air-cooling heat dissipation device of the best embodiment of the present invention. It is the three-dimensional view which looked at the air-cooling heat radiating device of FIG. 2A from another angle. It is sectional drawing in the AA line of the air-cooling heat radiating device of FIG. 2A. It is a three-dimensional exploded view from different angles of the air pump of the best embodiment of the present invention. It is a three-dimensional exploded view from different angles of the air pump of the best embodiment of the present invention. It is a three-dimensional perspective view which shows the front structure of the piezoelectric actuator of the best example of this invention. It is a three-dimensional perspective view which shows the back surface structure of the piezoelectric actuator of the best example of this invention. It is sectional drawing which shows the cross-section of the piezoelectric actuator of the best example of this invention. It is sectional drawing in the BB line of the air-cooling heat radiating device of FIG. 2B. It is sectional drawing in CC line of the air-cooling heat radiating device of FIG. 2B. It is sectional drawing which shows the operation | movement process of the air pump of the best example of this invention. It is sectional drawing which shows the operation | movement process of the air pump of the best example of this invention. It is sectional drawing which shows the operation | movement process of the air pump of the best example of this invention. It is a control system block diagram of the air-cooling heat radiating device of the best example of this invention.

  Several exemplary embodiments embodying the features and advantages of the invention are described in detail below. The invention is capable of various modifications in different embodiments, none of which depart from the scope of the invention, and that the description and drawings of the invention are essentially used for illustration and to limit the invention. It should be understood that this is not the case.

  Please refer to FIG. 2A, FIG. 2B, and FIG. 2A is a three-dimensional view of the air-cooling heat dissipation device of the best embodiment of the present invention, FIG. 2B is a three-dimensional view of the air-cooling heat dissipation device of FIG. 2A from another angle, and FIG. 3 is a line AA of the air-cooling heat dissipation device of FIG. FIG. As shown in the figure, the air-cooling heat dissipation device 2 of the present invention can be applied to, for example, a mobile computer, a tablet, an industrial computer, a mobile communication device, a video playback device, etc. The electronic device 3 that needs to radiate heat is radiated. The air-cooling heat dissipating device 2 of the present invention includes a stacking board 20, an air pump 21, and a radiator 26. Of these, the stacking board 20 includes an upper surface 20a, a lower surface 20b, a gas introduction side opening 23, and a heat. A conductive plate 25 is included. The loading board 20 can be a printed wiring board, but is not limited to this, and is used for loading and installing the electronic element 3 and the air pump 21. The gas introduction side opening 23 of the loading substrate 20 penetrates the upper surface 20a and the lower surface 20b. The air pump 21 is installed on the lower surface 20 b of the stacking substrate 20, is assembled at a position corresponding to the gas introduction side opening 23, and seals the gas introduction side opening 23. The heat conductive plate 25 is installed on the upper surface 20a of the stacking substrate 20 and is positioned and assembled on the gas introduction side opening 23 to form a gap G between the heat conductive plate 25 and the stacking substrate 20. And used for gas flow. In this embodiment, the heat conducting plate 25 further includes a plurality of heat dissipating pieces 25a, and the heat dissipating pieces 25a are installed on the surface of the heat conducting plate 25 near the gas introduction side opening 23. Not limited to this, it is used to increase the heat dissipation area and increase the thermal efficiency. The electronic element 3 is installed on the heat conduction plate 25, and one surface of the electronic element 3 is attached to the heat conduction plate 25, and heat is radiated through the heat conduction path of the heat conduction plate 25. The radiator 26 is installed on the electronic element 3 and attached to another surface of the electronic element 3. Among them, the air pump 21 is driven to introduce an air flow into the gas introduction side opening 23 to exchange heat with the heat conducting plate 25, thereby realizing heat dissipation of the electronic element 3.

  In the present embodiment, the radiator 26 includes a base portion 261 and a plurality of heat dissipation pieces 262, the base portion 261 is attached to the other surface of the electronic element 3, and the plurality of heat dissipation pieces 262 are the The base portion 261 is vertically connected. By installing the radiator 26, the heat radiation area can be increased, and the heat energy generated by the electronic device 3 can be released from the heat conduction path of the radiator 26.

  In this embodiment, the air pump 21 is a piezoelectric drive air pump, and is used to flow a gas, and introduces the gas into the gas introduction side opening 23 from the outside of the air-cooling heat radiating device 2. In some embodiments, the stacking substrate 20 further includes at least one circulation groove 24, which is penetrated by the upper surface 20 a and the lower surface 20 b and adjacent to the periphery of the heat conducting plate 25. Installed. When the air pump 21 introduces gas into the gas introduction side opening 23, the introduced air flow exchanges heat with the heat conduction plate 25 installed on the upper surface 20a of the stacking substrate 20, and the stacking substrate 20 and the heat The gas in the gap G between the conductive plates 25 is moved to quickly flow, and the heat energy is discharged from the gap G to the airflow after heat exchange. Among them, a part of the airflow circulates from the circulatory groove 24 to the lower surface 20b of the stacking substrate 20 and is used for the air pump 21 after cooling. In addition, a part of the airflow flows in the direction of the radiator 26 along the peripheral edge of the heat conducting plate 25, and after cooling, passes through the radiation piece 261 of the radiator 26 to accelerate the heat radiation of the electronic element 3. To do. The air pump 21 continuously operates to introduce gas, exchange heat with the gas continuously introduced into the electronic element 3, and simultaneously discharge the gas after heat exchange, thereby realizing heat dissipation of the electronic element 3 and heat dissipation. Efficiency can be improved and the performance stability and lifetime of the electronic element 3 can be improved.

  Please refer to FIG. 4A and FIG. 4B. 4A is a three-dimensional exploded view showing the front structure of the air pump according to the best embodiment of the present invention, and FIG. 4B is a three-dimensional perspective view showing the rear structure of the piezoelectric actuator according to the best embodiment of the present invention. In the present embodiment, the air pump 21 is a piezoelectric drive air pump and is used for flowing gas. As shown in the figure, the air pump 21 of the present invention includes members such as a resonance piece 212, a piezoelectric actuator 213, a cover plate 216, and the like. The resonance piece 212 is provided corresponding to the piezoelectric actuator 213 and includes a hollow hole 2120 provided in the central area (but not limited to) of the resonance piece 212. The piezoelectric actuator 213 includes a suspension plate 2131, an outer frame 2132, and a piezoelectric ceramic plate 2133. Among them, the suspension plate 2131 includes a central portion 2131c and an outer peripheral portion 2131d. When the piezoelectric ceramic plate 2133 is driven by receiving a voltage, the suspension plate 2131 can bend and vibrate from the central portion 2131c to the outer peripheral portion 2131d. The outer frame 2132 is provided around the outside of the suspension plate 2131 and includes at least one support portion 2132a and conductive pins 2132b, but is not limited thereto. Each support portion 2132a is installed between the suspension plate 2131 and the outer frame 2132, and both ends of each support portion 2132a are connected to the suspension plate 2131 and the outer frame 2132 to provide elastic support. The conductive pin 2132b protrudes outward on the outer frame 2132 and is used for power supply connection. The piezoelectric ceramic plate 2133 is affixed to the second surface 2131b of the suspension plate 2131, receives a voltage applied from the outside, causes deformation, and is used to drive the bending vibration of the suspension plate 2131. The cover plate 216 includes a side wall 2161, a bottom plate 2162, and an opening 2163. The side wall 2161 surrounds the periphery of the bottom plate 2162 and protrudes on the bottom plate 2162, and forms an accommodation space 216a for accommodating and installing the resonance piece 212 and the piezoelectric actuator 213 in cooperation with the bottom plate 2162. The opening 2163 is installed on the side wall 2161, and the conductive pin 2132b of the outer frame 2132 and the conductive pin 2151 of the conductive piece 215 are protruded outside the cover plate 216 through the opening 2163 toward the outside. It is possible to connect, but it is not limited to this.

  In this embodiment, the air pump 21 of the present invention further includes two insulating pieces 2141 and 2142 and a conductive piece 215, but is not limited thereto. Among them, the two insulating pieces 2141 and 2142 are respectively installed on the upper and lower sides of the conductive piece 215, and the form thereof substantially corresponds to the form of the outer frame 2132 of the piezoelectric actuator 213 and is made of an insulating material such as plastic. Used for insulation, but is not limited thereto. The conductive piece 215 is made of a conductive material such as metal and is used for power conduction, and its shape substantially corresponds to the shape of the outer frame 2132 of the piezoelectric actuator 213, but is not limited thereto. In this embodiment, a conductive pin 2151 may be installed on the conductive piece 215 and used for electrical conduction.

  Please refer to FIG. 5A, FIG. 5B, and FIG. 5C. FIG. 5A is a three-dimensional perspective view showing the front structure of the piezoelectric actuator of the best embodiment of the present invention, FIG. 5B is a three-dimensional perspective view showing the rear structure of the piezoelectric actuator of the best embodiment of the present invention, and FIG. Cross-sectional views showing the cross-sectional structure of the piezoelectric actuator of the best embodiment are shown. As shown in these drawings, in this embodiment, the suspension plate 2131 of the present invention has a structure having a stepped surface, that is, a convex portion 2131e is provided on the central portion 2131c of the first surface 2131a of the suspension plate 2131. The convex portion 2131e can have a circular protruding structure, but is not limited thereto. In some embodiments, the suspension plate 2131 may have a plate-like square structure with flat sides. 5C, the convex portion 2131e of the suspension plate 2131 is coplanar with the first surface 2132c of the outer frame 2132, and the first surface 2131a of the suspension plate 2131 and the first surface 2132a ′ of the support portion 2132a. Is also coplanar. Further, there is a certain depth between the convex portion 2131e of the suspension plate 2131 and the first surface 2132c of the outer frame 2132 and the first surface 2131a of the suspension plate 2131 and the first surface 2132a 'of the support portion 2132a. As shown in FIGS. 5B and 5C, the second surface 2131b of the suspension plate 2131 has a flat coplanar structure with the second surface 2132d of the outer frame 2132 and the second surface 2132a ″ of the support portion 2132a, and the piezoelectric ceramic A plate 2133 is affixed to the second surface 2131b of the flat suspension plate 2131. In some other embodiments, the suspension plate 2131 may have a plate-like square structure with flat sides. However, in some embodiments, the suspension plate 2131, the outer frame 2132, and the support portion 2132a may be formed as a single-piece structure and may be formed of a metal plate. However, the present invention is not limited to this, and in the present embodiment, the air pump 21 of the present invention is connected to the suspension plate 2131 and the outside. And 2132, includes at least one void 2134 is used to pass the further gas between the support portion 2132a.

  Next, the internal and external structures of the air pump 21 of the present invention after the assembly is completed will be described. Please refer to FIG. 6 and FIG. 7A. 6 is a cross-sectional view taken along line BB of the air-cooling heat dissipation device shown in FIG. 2A, and FIG. 7A is a cross-sectional view taken along line CC of the air-cooling heat dissipation device shown in FIG. 2B. As shown in the figure, the air pump 21 of the present invention has a cover plate 216, an insulating piece 2142, a conductive piece 215, an insulating piece 2141, a piezoelectric actuator 213, a resonance piece 212 and the like stacked in order from the top, and The colloid 218 is applied to the four circumferences of the piezoelectric actuator 213, the insulating piece 2141, the conductive piece 215, and the other insulating piece 2142 after the laminated assembly, and the periphery of the accommodation space 216a of the lid plate 216 is filled to complete the sealing. The air pump 21 after the assembly is a quadrilateral structure, but is not limited thereto, and the shape thereof can be changed according to actual needs. In addition, in this embodiment, only the conductive pin 2151 (not shown) of the conductive piece 215 and the conductive pin 2132b (see FIG. 6) of the piezoelectric actuator 213 are protruded outside the cover plate 216 for connection to an external power source. However, it is not limited to this. In the assembled air pump 21, a first chamber 217 b is formed between the cover plate 216 and the resonance piece 212.

  After the assembly of the air pump 21 and the loading substrate 20 is completed, as shown in FIG. 3, the side wall 2161 of the cover plate 216 is brought into contact with the lower surface 20b of the loading substrate 20 to seal the gas introduction side opening 23, Further, a merge chamber 217a is defined jointly by the side wall 2161 of the cover plate 216 and the resonance piece 212, and further communicates with the outside through the opening 2163 of the cover plate 216 to collect gas from the external environment as shown in FIG. be able to. Further, in this embodiment, there is a gap g0 between the resonance piece 212 of the air pump 21 of the present invention and the piezoelectric actuator 213, and the gap g0 is filled with a conductive material such as, but not limited to, conductive paste. Thus, the depth of the gap g0 is maintained between the resonance piece 212 and the convex portion 2131e of the suspension plate 2131 of the piezoelectric actuator 213, and the airflow can be guided and flowed more quickly. In addition, since the protrusion 2131e of the suspension plate 2131 and the resonance piece 212 maintain an appropriate distance to reduce mutual contact interference, generation of noise can be suppressed. In some other embodiments, the height of the outer frame 2132 of the piezoelectric actuator 213 may be increased to increase the gap during assembly with the resonance piece 212, but this is not a limitation. Thus, when the piezoelectric actuator 213 is driven to perform gas collection work, gas is collected from the opening 2163 of the cover plate 216 into the merge chamber 217a, and further flows from the hollow hole 2120 of the resonance piece 212 to the first chamber 217b. Stored temporarily. When the piezoelectric actuator 213 is driven to perform an exhaust operation, gas flows from the first chamber 217b through the hollow hole 2120 of the resonance piece 212 to the merge chamber 217a, flows into the gas introduction side opening 23, and conducts heat. Heat exchange with the plate 25 is performed.

  The operation flow of the air pump 21 of the present invention will be described below. Please refer to FIG. 7A to FIG. 7D simultaneously. 7B to 7D are sectional views showing an operation process of the air pump according to the best embodiment of the present invention. First, as shown in FIG. 7A, the structure of the air pump 21 is as described above, and the cover plate 216, another insulating piece 2142, the conductive piece 215, the insulating piece 2141, the piezoelectric actuator 213, and the resonance piece 212 are assembled in this order. , And a gap g0 is provided between the resonance piece 212 and the piezoelectric actuator 213, and the side wall 2161 of the resonance piece 212 and the cover plate 216 jointly defines the merging chamber 217a. The first chamber 217b is provided between the two. When the air pump 21 is not driven by voltage, the position of each member is as shown in FIG. 7A.

  Subsequently, as shown in FIG. 7B, when the piezoelectric actuator 213 of the air pump 21 is actuated by receiving a voltage and vibrates upward, the gas enters the air pump 21 from the opening 2163 of the cover plate 216, and the merge chamber 217a. And then flows upward into the first chamber 217b via the hollow hole 2120 on the resonator element 212. At the same time, the resonance piece 212 reciprocally vibrates under the influence of the resonance of the suspension plate 2131 of the piezoelectric actuator 213, that is, the resonance piece 212 is deformed upward and slightly protrudes upward at the hollow hole 2120. It becomes a state.

  Thereafter, as shown in FIG. 7C, at this time, the piezoelectric actuator 213 vibrates downward and returns to the initial position. At this time, the convex portion 2131e on the suspension plate 2131 of the piezoelectric actuator 213 approaches a portion slightly projecting upward from the hollow hole 2120 portion of the resonance piece 212, and the gas in the air pump 21 is moved to the first chamber of the upper half layer. Firstly stored in 217b.

  Subsequently, as shown in FIG. 7D, when the piezoelectric actuator 213 further vibrates downward, the resonance piece 212 receives the resonance effect of the vibration of the piezoelectric actuator 213, and the resonance piece 212 also vibrates downward. Due to the downward deformation, the volume of the first chamber 217b is compressed, the gas in the first chamber 217b of the upper half layer is pushed and flows toward both sides, and passes through the gap 2134 of the piezoelectric actuator 213. , And is discharged by pressing the hollow holes 2120 of the resonance piece 212, forming a compressed air flow, flowing toward the gas introduction side opening 23 of the loading substrate 20, and radiating heat to the heat conduction plate 25. I do. As can be seen from this embodiment, when the resonance piece 212 reciprocates vertically, the maximum distance of the vertical movement is increased in the gap g0 between the resonance piece 212 and the piezoelectric actuator 213. That is, the gap g <b> 0 installed between the cooperating piece 212 and the piezoelectric actuator 213 can generate a larger vertical movement when the resonant piece 212 resonates.

  Finally, the resonance piece 212 returns to the initial position shown in FIG. 7A. After the aforementioned operation flow, the gas is continuously circulated in the order shown in FIGS. 7A to 7D, and the gas is continuously flowed from the opening 2163 of the cover plate 216 into the merge chamber 217a and further into the first chamber 217b. Subsequently, the first chamber 217b is caused to flow into the merge chamber 217a, and the airflow is continuously allowed to flow into the gas introduction side opening 23, thereby enabling stable gas transport. That is, during the operation of the air pump 21 of the present invention, gas flows in the order of the opening 2163 of the cover plate 216, the merge chamber 217a, the first chamber 217b, the merge chamber 217a, and the gas introduction side opening 23. Can achieve the effect of reducing the number of members of the air pump 21 and simplifying the entire process through a single member, that is, through the cover plate 216 and using the structural design of the opening 2163 of the cover plate 216.

  In response to the above, through the operation of the air pump 21 described above, the gas is introduced into the gas introduction side opening 23 of the stacking substrate 20, the air flow is introduced into the gap G, and the heat connected to the electronic element 3 to the introduced gas. Heat exchange with the conductive plate 25 is performed, and the gas in the gap G is allowed to flow quickly so that the heat exchanged gas can discharge the heat energy to the outside of the gap G. Thereby, the efficiency of heat radiation cooling can be improved, and the performance stability and lifetime of the electronic element 3 can be improved. In addition, by discharging the gas to the outside of the rapid flow discharge gap G, the convection of the gas around the radiator 26 can be indirectly increased, and the heat radiation cooling efficiency can be enhanced.

  Please refer to FIG. FIG. 8 shows a block diagram of the control system of the air-cooling heat dissipation device of the present invention. As shown in the figure, the air-cooling heat dissipating device 2 of the best embodiment of the present invention has a temperature control function and further includes a control system 5. Among them, the control system 5 further includes a control unit 51 and a temperature sensor 52, of which the control unit 51 is electrically connected to the air pump 21 and controls the operation of the air pump 21. The temperature sensor 52 is electrically connected to the control unit 51 and installed in the vicinity of the electronic element 3 to detect the temperature in the vicinity of the electronic element 3 or directly attached on the electronic element 3 to detect the temperature of the electronic element 3. However, the present invention is not limited to this, and the detection signal can be transmitted to the control unit 51. The control unit 51 determines whether the temperature of the electronic element 3 is higher than a temperature threshold based on the detection signal of the temperature sensor 52. When the control unit 51 determines that the temperature of the electronic element 3 is higher than the temperature threshold, it sends a control signal to the air pump 21 to activate the air pump 21, thereby driving the air pump 21 to flow airflow. The electronic element 3 is radiated and cooled, and the electronic element 3 is radiated and cooled to lower the temperature. When the control unit 51 determines that the temperature of the electronic element 3 is lower than the temperature threshold value, it transmits a control signal to the air pump 21 to stop the operation of the air pump 21, thereby continuing the operation of the air pump 21 and using the service life. Can be shortened and extra energy can be avoided. By installing the control system 5, the air pump 21 of the air-cooling heat dissipating device 2 performs heat radiation cooling when the temperature of the electronic element 3 is overheated, and the operation is stopped after the temperature of the electronic element 3 is lowered. It is possible to avoid the continuous shortening of the service life or the consumption of extra energy, and it is possible to operate the electronic device 3 in a more preferable temperature environment and to improve the stability of the electronic device 3.

  In summary, the air-cooling heat dissipation device of the present invention can be applied to various electronic devices, radiates heat to the electronic elements inside the electronic equipment, enhances the heat dissipation effect, suppresses noise, and reduces the noise of the electronic elements inside the electronic equipment. The performance can be stabilized and the service life can be extended. In addition, the air-cooling heat dissipation device of the present invention has a temperature control function, controls the operation of the air pump based on the temperature change of the electronic elements inside the electronic equipment, enhances the heat dissipation effect, and extends the service life of the air-cooling heat dissipation device. be able to.

  The present invention can be modified in various ways by those skilled in the art, but all fall within the scope of protection of the appended claims.

DESCRIPTION OF SYMBOLS 11 Electronic element 12 Thermal conductive plate 13 Thermal conductive paste 2 Air-cooling heat dissipation device 20 Loading substrate 20a Upper surface 20b Lower surface 21 Air pump 212 Resonant piece 2120 Hollow hole 213 Piezoelectric actuator 2131 Suspension plate 2131a First surface 2131b Second surface 2131c Center part 2131d Outer peripheral part 2131e Convex part 2132 Outer frame 2132a Support part 2132a 'First surface 2132a "Second surface 2132b Conductive pin 2132c First surface 2132d Second surface 2133 Piezoelectric ceramic plate 2134 Air gaps 2141, 1422 Insulating piece 215 Conductive piece 2151 Conductive pin 216 Cover plate 216a Accommodating space 2161 Side wall 2162 Bottom plate 2163 Opening 217b First chamber 217a Merge chamber 218 Colloid 23 Gas introduction side opening 24 Recirculation groove 25 Thermal conduction plate 25a Heat radiation piece 26 Release Heater 261 Base part 262 Heat radiation piece 3 Electronic element 5 Control system 51 Control unit 52 Temperature sensor g0, G Gap

Claims (10)

An air-cooling heat dissipation device used for heat dissipation of an electronic element, the air-cooling heat dissipation device includes a mounting board, an air pump, and a radiator.
The loading board includes an upper surface, a lower surface, a gas introduction side opening, and a heat conduction plate, of which the heat conduction plate is installed on the upper surface and corresponds to the gas introduction side opening. And the electronic element is installed on the heat conducting plate,
The air pump is a piezoelectric air pump, installed on the lower surface of the loading substrate, and sealed in correspondence with the gas introduction side opening, the air pump,
A resonance piece provided with a hollow hole, and a piezoelectric actuator installed corresponding to the resonance piece;
A side wall, a bottom plate, and a lid plate having an opening, the side wall surrounds the periphery of the bottom plate, is projected on the bottom plate, and forms a receiving space with the bottom plate; The piezoelectric actuator is installed in the housing space, the opening is installed on the side wall, and the resonance piece and the side wall of the lid plate jointly define one merging chamber;
The radiator is installed on the electronic element;
Among them, when the piezoelectric actuator is driven to perform a gas collecting operation, the gas is first collected from the opening of the lid plate into the merging chamber, and further flows into the first chamber from the hollow hole of the resonance piece. When the evacuation operation is performed by driving the piezoelectric actuator, the gas first passes from the first chamber through the hollow hole of the resonance piece and flows into the gas introduction side opening, and the heat conduction An air-cooling heat radiating device characterized in that heat exchange is performed on a plate.
  The air-cooling heat radiating device according to claim 1, wherein the gas introduction side opening of the loading board is penetrated by the upper surface and the lower surface.   The air-cooling heat dissipation device according to claim 1, wherein a gap used for flowing a gas is provided between the heat conducting plate and the loading substrate.   The air-cooling heat dissipation device according to claim 1, wherein the heat conducting plate is attached to one surface of the electronic element, and the radiator is attached to another surface of the electronic element.   The load board further includes at least one circulation groove, and the circulation groove penetrates the upper surface and the lower surface, and is installed next to a peripheral edge of the heat conducting plate. The air-cooling heat dissipation device described in 1. The piezoelectric actuator includes a suspension plate, an outer frame, and a piezoelectric ceramic plate,
The suspension plate comprises a first surface and a second surface;
The outer frame includes at least one support portion, the at least one support portion is connected to the suspension plate and the outer frame, and is installed between the suspension plate and the outer frame;
The air-cooling heat dissipation device according to claim 1, wherein the piezoelectric ceramic plate is attached to the first surface of the suspension plate, and is used to apply a voltage to cause the suspension plate to bend and vibrate.   The resonant piece includes a gap with the piezoelectric actuator, and the air pump includes at least one insulating piece and a conductive piece, and the at least one insulating piece and the conductive piece are sequentially below the piezoelectric actuator. The air-cooling heat dissipation device according to claim 6, wherein the air-cooling heat dissipation device is installed.   At least one gap is formed between the support portion, the suspension plate, and the outer frame, and both end points of the support portion are connected to the outer frame and the suspension plate, respectively, and the suspension plate of the air pump is The air-cooling heat dissipation device according to claim 6, further comprising a convex portion on the second surface, wherein the convex portion has a cylindrical structure.   The outer frame of the piezoelectric actuator includes a conductive pin, the conductive piece includes a conductive pin, the opening of the lid plate of the air pump is provided on a side wall, and the conductive pin of the outer frame and the conductive piece The air-cooling heat dissipation device according to claim 7, wherein the air-cooling heat dissipation device is used for penetrating a conductive pin to the outside and projecting it out of the cover plate to connect to an external power source. A control system, the control system including a control unit and a temperature sensor;
The control unit is electrically connected to the air pump and controls the operation of the air pump;
The temperature sensor is electrically connected to the control unit and installed next to the electronic element, detects the temperature of the electronic element, and outputs a detection signal to the control unit;
When the control unit receives the detection signal and determines that the temperature of the electronic element is greater than a temperature threshold, the control unit activates the air pump to drive the flow of airflow, and the control unit The air-cooling heat dissipation device according to claim 1, wherein the control unit stops the operation of the air pump when receiving a detection signal and determining that the temperature of the electronic element is lower than a temperature threshold.