JP2014127701A - Wiring board and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress warpage of a wiring board.SOLUTION: The wiring board comprises: a substrate 100 (core substrate) which has a surface F11 and a surface F12 opposite thereto and in which a through-hole 100c is formed; a conductor layer 100a (including a first conductor pattern) formed on the surface F11 of the substrate 100; a conductor layer 100b (including a second conductor pattern) formed on the surface F12 of the substrate 100; and a through-hole conductor 100d which is constituted of a conductor filling the through-hole 100c of the substrate 100 and connects the first conductor pattern and the second conductor pattern. The substrate 100 comprises: a glass layer 1010 (core layer) having a surface F1 and a surface F2 opposite thereto; a resin layer 1011 (first resin layer) provided on the surface F1 of the glass layer 1010 and having the surface F11; and a resin layer 1012 (second resin layer) provided on the surface F2 of the glass layer 1010 and having the surface F12.

Description

  The present invention relates to a wiring board and a manufacturing method thereof.

  Patent Document 1 discloses a wiring board having a core substrate made of a resin.

JP 2011-210795 A

  When the wiring board is warped, the electrical reliability tends to be lowered. In addition, a reduction in the electrical reliability of the wiring board can lead to a reduction in the yield of the wiring board.

  Therefore, in the wiring board described in Patent Document 1, the thermal expansion coefficient (CTE) of the core substrate is reduced by impregnating the inorganic fiber base material with a resin or adding an inorganic filler to the resin. The warping of the board is suppressed. However, since the wiring board is likely to be warped when the wiring board is thinned, it is required to make the wiring board more difficult to warp.

  This invention is made | formed in view of such a situation, and it aims at suppressing the curvature of a wiring board. Another object of the present invention is to reduce the thickness of the wiring board. Another object of the present invention is to improve the yield of wiring boards.

The wiring board according to the present invention is
A core substrate having a first surface and a second surface opposite to the first surface, wherein a through hole is formed;
A first conductor pattern formed on the first surface of the core substrate;
A second conductor pattern formed on the second surface of the core substrate;
A through-hole conductor composed of a conductor filled in the through hole of the core substrate, connecting the first conductor pattern and the second conductor pattern;
A wiring board comprising:
The core substrate has a third surface and a fourth surface opposite to the third surface, the core layer including a glass plate, and the first surface provided on the third surface of the core layer. And a second resin layer provided on the fourth surface of the core layer and having the second surface.

A method for manufacturing a wiring board according to the present invention includes:
A method of manufacturing a wiring board having a core substrate having a first surface and a second surface opposite to the first surface and having a through hole formed thereon,
A core layer having a third surface and a fourth surface opposite to the third surface, including a glass plate, and a first resin layer provided on the third surface of the core layer and having the first surface And preparing a core substrate composed of a second resin layer provided on the fourth surface of the core layer and having the second surface;
Forming a through hole in the core substrate;
Forming a first conductor pattern on the first surface of the core substrate;
Forming a second conductor pattern on the second surface of the core substrate;
Forming a through-hole conductor connecting the first conductor pattern and the second conductor pattern by filling the through-hole with a conductor; and
including.

A method for manufacturing a wiring board according to the present invention includes:
Providing a glass plate having a first surface and a second surface opposite the first surface;
Providing a resin plate having a third surface and a fourth surface opposite to the third surface, the first through hole being formed;
Disposing the glass plate in the first through hole of the resin plate;
Forming a first resin layer over the first surface of the glass plate and the third surface of the resin plate;
Forming a second resin layer over the second surface of the glass plate and the fourth surface of the resin plate;
Forming a second through hole penetrating the glass plate, the first resin layer, and the second resin layer;
Forming a first conductor pattern on the first resin layer;
Forming a second conductor pattern on the second resin layer;
Forming a through-hole conductor connecting the first conductor pattern and the second conductor pattern by filling the second through hole with a conductor;
including.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to suppress the curvature of a wiring board, maintaining the impact resistance of a wiring board highly. Further, according to the present invention, in addition to the above effect or instead of the above effect, there may be an effect that the wiring board can be thinned. Further, according to the present invention, in addition to the above effect or instead of the above effect, there may be an effect that the yield of the wiring board can be improved.

It is sectional drawing of the wiring board which concerns on Embodiment 1 of this invention. It is a top view which expands and shows the through-hole conductor of the wiring board shown by FIG. 1, and its periphery. It is sectional drawing which expands and shows the through-hole conductor and its periphery in the wiring board shown by FIG. It is a figure for demonstrating the process of preparing the board | substrate which comprises the core part of a wiring board in the manufacturing method of the wiring board which concerns on Embodiment 1 of this invention. In the manufacturing method of the wiring board which concerns on Embodiment 1 of this invention, it is a figure for demonstrating the process of providing metal foil on both surfaces of the board | substrate prepared at the process of FIG. It is a figure for demonstrating the 1st process of forming the through hole which penetrates the board | substrate and the metal foil formed in the both surfaces in the manufacturing method of the wiring board which concerns on Embodiment 1 of this invention. It is a figure for demonstrating the 2nd process after the process of FIG. It is a figure for demonstrating the 3rd process after the process of FIG. In the method for manufacturing a wiring board according to Embodiment 1 of the present invention, a first step of forming a through-hole conductor in the through-hole formed by the steps of FIGS. 6 to 8 and forming a conductor layer on both sides of the substrate. It is a figure for demonstrating. It is a figure for demonstrating the 2nd process after the process of FIG. It is a figure for demonstrating the 3rd process after the process of FIG. It is a figure which shows the core layer of the wiring board which concerns on Embodiment 2 of this invention. It is sectional drawing which expands and shows the through-hole conductor of the wiring board which concerns on Embodiment 2 of this invention, and its periphery. It is a graph which shows the simulation result about the curvature of a wiring board. It is a figure for demonstrating the process of preparing the resin board which comprises the core part of a wiring board in the manufacturing method of the wiring board which concerns on Embodiment 2 of this invention. It is a figure for demonstrating the process of forming a cavity in the resin board prepared at the process of FIG. It is a figure which shows the cavity formed at the process of FIG. It is a figure for demonstrating the process of arrange | positioning a glass plate in the cavity shown by FIG. It is a figure for demonstrating the process of providing a 1st resin layer and 1st metal foil on the resin board and glass plate which were prepared at the process of FIGS. It is a figure which shows a mode that the resin which flowed out from the 1st resin layer provided at the process of FIG. 19 is filled in the clearance gap between the resin plate and glass plate in a core layer. It is a figure for demonstrating the process of removing a carrier in the manufacturing method of the wiring board which concerns on Embodiment 2 of this invention. It is a figure for demonstrating the process of providing a 2nd resin layer and a 2nd metal foil on the resin board and glass plate from which the carrier was removed at the process of FIG. It is a figure for demonstrating the process of forming a through-hole conductor in the manufacturing method of the wiring board which concerns on Embodiment 2 of this invention. It is sectional drawing which shows the core part of the wiring board which concerns on Embodiment 3 of this invention. FIG. 24B is a partially enlarged view of FIG. 24A. In other embodiment of this invention, it is a figure which shows the example by which resin is provided between a through-hole conductor and a glass plate. In other embodiment of this invention, it is a figure which shows the example by which the glass plate is arrange | positioned at each of the several cavity (opening part) formed in the grid | lattice-like arrangement | sequence on the resin plate. In other embodiment of this invention, it is a figure which shows the example from which the resin layer formed on a glass layer in the core board | substrate of a wiring board is comprised from several layers from which content of an inorganic filler mutually differs.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the figure, arrows Z1 and Z2 indicate the stacking direction of the wiring boards (or the thickness direction of the wiring boards) corresponding to the normal direction of the main surface (front and back surfaces) of the wiring boards. On the other hand, arrows X1 and X2 and Y1 and Y2 respectively indicate directions orthogonal to the stacking direction (or sides of each layer). The main surface of the wiring board is an XY plane. The side surface of the wiring board is an XZ plane or a YZ plane. In the stacking direction, the side closer to the core is called the lower layer, and the side far from the core is called the upper layer.

  The conductor layer is a layer composed of one or more conductor patterns. The conductor layer may include a conductor pattern that constitutes an electric circuit, for example, a wiring (including a ground), a pad, a land, or the like, or a planar conductor pattern that does not constitute an electric circuit.

  The opening means a space formed by partially removing material, and the opening includes notches and cuts in addition to holes and grooves.

(Embodiment 1)
The wiring board 10 according to the present embodiment is, for example, a multilayer printed wiring board (double-sided rigid wiring board) as shown in FIG. The wiring board 10 includes a substrate 100, insulating layers 101, 102, 103, 104, conductor layers 100a, 100b, 110, 120, 130, 140, a through-hole conductor 100d, and via conductors 101b, 102b, 103b, 104b. And solder resist layers 11 and 12. The wiring board 10 is formed with a through hole 10 a that penetrates the entire wiring board 10. The wiring board 10 of this embodiment is a rigid wiring board having a rectangular plate shape, for example. However, the present invention is not limited to this, and the wiring board 10 may have a shape other than a rectangular plate shape, or may be a flexible wiring board. The wiring board 10 includes, for example, a circuit of an electronic device. Electronic components may be mounted on the surface or inside of the wiring board 10. Hereinafter, one (Z1 side) of the front and back surfaces (two main surfaces) of the substrate 100 is referred to as a surface F11, and the other (Z2 side) is referred to as a surface F12.

  The substrate 100 corresponds to the core substrate of the wiring board 10. A conductor layer 100a is formed on the surface F11 of the substrate 100, and a conductor layer 100b is formed on the surface F12 of the substrate 100. The conductor layers 100a and 100b are electrically connected to each other by a conductor (through-hole conductor 100d) in a hole formed in the substrate 100. In the wiring board 10 of the present embodiment, the substrate 100, the through-hole conductor 100d, and the conductor layers 100a and 100b correspond to the core portion.

  In the wiring board 10 according to the present embodiment, the insulating layers 101 and 103 (interlayer insulating layers, respectively) and the conductor layers 110 and 130 are alternately formed on the surface F11 of the substrate 100 and the conductor layer 100a. Further, the insulating layers 102 and 104 (interlayer insulating layers) and the conductor layers 120 and 140 are alternately formed on the surface F12 of the substrate 100 and the conductor layer 100b. The respective conductor layers are electrically connected to each other by conductors (for example, via conductors 101b, 102b, 103b, 104b) in holes formed in the interlayer insulating layer.

  The conductor layer, the interlayer insulating layer, and the via conductor laminated on the core part correspond to the build-up part. Hereinafter, the buildup part located in the lowest layer is referred to as a lower layer buildup part, and the buildup part higher than the lower layer buildup part is referred to as an upper layer buildup part. In the present embodiment, the lower layer build-up portion includes insulating layers 101 and 102, conductor layers 110 and 120, and via conductors 101b and 102b. Further, the upper layer build-up portion is composed of insulating layers 103 and 104, conductor layers 130 and 140, and via conductors 103b and 104b.

  The solder resist layer 11 is provided on the outermost insulating layer 103 and the conductor layer 130, and the solder resist layer 12 is provided on the outermost insulating layer 104 and the conductor layer 140. Openings 11a and 12a are formed in the solder resist layers 11 and 12, respectively, and the conductor layers 130 and 140 exposed through the openings 11a and 12a are pads P1 and P2 (external connection terminals). By mounting other wiring boards, electronic components, or the like on one or both surfaces of the wiring board 10, the wiring board 10 can be used as a circuit board of, for example, a portable device (such as a mobile phone). The wiring board 10 of the present embodiment is a package substrate (PKG substrate) in which, for example, an electronic component (IC chip or the like) is mounted on one surface, and bumps for mounting on a mother boat are formed on the opposite surface. Further, PoP (Package on Package) technology may be applied to the wiring board 10.

  Each conductor (conductor layer, via conductor, etc.) constituting the wiring board 10 is made of, for example, copper. Each via conductor is made of, for example, a filled conductor. However, the present invention is not limited to this, and each via conductor may be made of a conformal conductor, for example. Each insulating layer (excluding the substrate 100) constituting the wiring board 10 is made by impregnating a base material such as glass cloth, an aramid fiber nonwoven fabric, or paper with an epoxy resin, a polyimide resin, a phenol resin, or the like. Consists of. Moreover, each insulating layer (except for the substrate 100) constituting the wiring board 10 includes, for example, an inorganic filler. However, the material of the conductor and the insulating layer constituting the wiring board 10 is arbitrary. For example, each insulating layer (excluding the substrate 100) may be made of only a resin without a base material (glass cloth or the like) or may not contain an inorganic filler.

  Each of the solder resist layers 11 and 12 is made of, for example, a photosensitive resin using an acrylic-epoxy resin, a thermosetting resin mainly composed of an epoxy resin, an ultraviolet curable resin, or the like.

  The thickness of the wiring board 10 is 400 μm, for example. The thickness of each conductor layer (excluding the conductor layers 100a and 100b) is, for example, 15 μm. Each insulating layer (excluding the substrate 100) has a thickness of 40 μm, for example. Each of the solder resist layers 11 and 12 has a thickness in the range of, for example, 13 to 35 μm.

  Hereinafter, with reference to FIG.2 and FIG.3, the core part of the wiring board 10 which concerns on this embodiment is explained in full detail.

  FIG. 2 is an enlarged plan view showing the through-hole conductor 100d and its periphery of the wiring board 10 shown in FIG. FIG. 2 shows the conductor layer 100 a on the surface F <b> 11 of the substrate 100.

  As shown in FIG. 2, in this embodiment, the conductor layer 100a includes a disk-shaped land P11 and a line-shaped wiring P12 connected to the land P11.

  FIG. 3 is an enlarged cross-sectional view showing the through-hole conductor 100d and its periphery in the wiring board 10 shown in FIG.

  As shown in FIG. 3, the core portion of the wiring board 10 according to the present embodiment includes a substrate 100, a through-hole conductor 100d, and conductor layers 100a and 100b. The conductor layer 100b includes a land P21 of the through-hole conductor 100d and a line-shaped wiring P22 connected to the land P21. For example, the land P21 and the wiring P22 included in the conductor layer 100b have the same form as the land P11 and the wiring P12 (see FIG. 2), respectively.

  As illustrated in FIG. 3, the substrate 100 includes a glass layer 1010 (core layer), a resin layer 1011, and a resin layer 1012. In the present embodiment, one (Z1 side) of the front and back surfaces (two main surfaces) of the glass layer 1010 is referred to as a surface F1, and the other (Z2 side) is referred to as a surface F2. The resin layer 1011 is formed on the surface F1 of the glass layer 1010, and the resin layer 1012 is formed on the surface F2 of the glass layer 1010. In the present embodiment, the upper surface of the resin layer 1011 corresponds to the surface F11 of the substrate 100, and the upper surface of the resin layer 1012 corresponds to the surface F12 of the substrate 100.

  In the wiring board 10 of the present embodiment, the glass layer 1010 corresponds to a core layer and is made only of a glass plate. In the present embodiment, since the core layer is composed of only one glass plate, only the glass region exists on the main surface (XY plane) of the core layer. In the present embodiment, the entire glass layer 1010 is made of a single glass material, such as quartz glass. However, the material of the glass layer 1010 is not limited thereto, and any material can be used as long as it is glass. For example, the glass layer 1010 may be made of multicomponent glass or soda glass. Further, the entire glass layer 1010 may have a structure (for example, a two-layer structure) in which a plurality of glass plates are bonded together. The glass layer 1010 (glass substrate) may be provided with a through-hole through which a through-hole conductor is to be formed.

  Each of the resin layers 1011 and 1012 is made of, for example, an epoxy resin that does not include inorganic fibers but includes an inorganic filler. The epoxy resin has thermosetting properties. The resin constituting each of the resin layers 1011 and 1012 is, for example, polyimide resin, BT resin, allylated phenylene ether resin (A-PPE resin), aramid resin, liquid crystal polymer (LCP), PEEK resin, or PTFE resin (fluorine resin). ). As the inorganic filler, for example, a silica-based filler (dissolved quartz, isotropic silica, silica, talc, mica, kaolin, calcium silicate, or the like) can be used. However, the present invention is not limited to this, and each of the resin layers 1011 and 1012 may be obtained by impregnating a resin into an inorganic fiber.

  In the present embodiment, the coefficient of thermal expansion of the substrate 100 composed of the resin layer 1011, the glass layer 1010, and the resin layer 1012 is in the range of 1 to 10 ppm / K. In order to suitably suppress the warpage of the wiring board 10, it is considered that the thermal expansion coefficient of the substrate 100 is preferably in the range of 1 to 5 ppm / K.

  A through hole 100c is formed in the substrate 100, and a conductor (for example, copper plating) is filled in the through hole 100c, whereby a through hole conductor 100d (for example, a filled conductor) is formed. The shape of the through-hole conductor 100d is, for example, an hourglass shape (a drum shape). Specifically, the through-hole conductor 100d includes a constricted portion 100e, a first end portion 100f, and a second end portion 100g. The shape of the constricted portion 100e is, for example, a columnar shape, and the shape of the first end portion 100f is, for example, a tapered columnar (conical frustum) tapered so as to be reduced in diameter from the surface F11 toward the constricted portion 100e. The shape of the two end portions 100g is, for example, a tapered cylinder (conical frustum) tapered so as to be reduced in diameter from the surface F12 toward the constricted portion 100e.

  The conductor layer 100a is configured by laminating a metal foil 2001 (for example, copper foil), an electroless plating film 2003 of copper, and an electrolytic plating 2004 of copper, for example, in this order on the surface F11 of the substrate 100. The The conductor layer 100b is configured by laminating a metal foil 2002 (for example, copper foil), an electroless plating film 2003 of copper, and an electrolytic plating 2004 of copper, for example, in this order on the surface F12 of the substrate 100. The In the present embodiment, the metal foil 2001 is located in the bottom layer of the conductor layer 100a, and the metal foil 2002 is located in the bottom layer of the conductor layer 100b. The metal foil 2001 is in contact with the resin layer 1011, and the metal foil 2002 is in contact with the resin layer 1012.

  The through-hole conductor 100d is configured by laminating, for example, a copper electroless plating film 2003 and a copper electrolytic plating 2004 in this order on the wall surface of the through-hole 100c. The through-hole conductor 100d is formed together with the conductor layers 100a and 100b on both sides of the substrate 100 (insulating layer) by plating. For this reason, the through-hole conductor 100d and the conductor layers 100a and 100b on both sides of the substrate 100 are at least partially continuous. Specifically, as shown in FIG. 3, an electroless plating film 2003 and an electrolytic plating 2004 are formed over the through-hole conductor 100d and the conductor layers 100a and 100b at both ends thereof, and the electroless plating film 2003 and the electrolytic plating 2004 are formed. Each is formed continuously (integrally) without a seam.

  In FIG. 3, the thickness D10 of the glass layer 1010 is in the range of, for example, 40 to 100 μm, the thickness D11 of the resin layer 1011 is in the range of, for example, 5 to 30 μm, and the thickness D12 of the resin layer 1012 is, for example, It exists in the range of 5-30 micrometers.

  Each of the conductor layers 100a and 100b has a thickness in the range of, for example, 15 to 20 μm. Each of the metal foils 2001 and 2002 has a thickness in the range of, for example, 10 to 15 μm. The thickness of the electroless plating film 2003 constituting the conductor layer 100a and the thickness of the electroless plating film 2003 constituting the conductor layer 100b are each 1 μm, for example. In the present embodiment, the conductor layer 100a (metal foil 2001, electroless plating film 2003, electrolytic plating 2004) and the conductor layer 100b (metal foil 2002, electroless plating film 2003, electrolytic plating 2004) have the same thickness. Have. However, the present invention is not limited to this, and the conductor layer 100a and the conductor layer 100b may have different thicknesses.

  2 and 3, the diameters D101 of the openings at both ends of the through hole 100c are each 80 μm, for example. A diameter D102 of the constricted portion 100e of the through hole 100c is, for example, 50 μm.

  The wiring board 10 of the present embodiment has a surface F11 and a surface F12 on the opposite side thereof, and is formed on the substrate 100 (core substrate) on which the through hole 100c (through hole) is formed, and the surface F11 of the substrate 100. The conductor layer 100a (including the first conductor pattern), the conductor layer 100b (including the second conductor pattern) formed on the surface F12 of the substrate 100, and the through hole 100c of the substrate 100 are filled. And a through-hole conductor 100d connecting the first conductor pattern included in the conductor layer 100a and the second conductor pattern included in the conductor layer 100b. And the board | substrate 100 has the surface F1 and the surface F2 of the other side, the glass layer 1010 (core layer) containing a glass plate, and the resin layer 1011 which is provided on the surface F1 of the glass layer 1010, and has the surface F11. (First resin layer) and a resin layer 1012 (second resin layer) provided on the surface F2 of the glass layer 1010 and having the surface F12.

  In the wiring board 10 of this embodiment, the thermal expansion coefficient (CTE) of the board | substrate 100 (core board | substrate) is reduced with a glass plate (glass layer 1010), and it becomes easy to suppress the curvature of the wiring board 10. FIG. As a result, the wiring board 10 can be easily thinned. In addition, the yield of the wiring board 10 can be improved. When a through hole (see FIG. 25 described later) in which a through-hole conductor is to be formed is provided in the glass layer 1010 (glass substrate) in advance, resin layers 1011 and 1012 (first and second resin layers) are provided in the through hole. ) Resin and the through-hole conductor 100d can be formed in the through hole filled with the resin. In such a configuration, the stress is relieved by the through-hole, and it is easy to suppress peeling of the through-hole conductor 100d. Further, by providing the glass layer 1010 with a through-hole in which through-hole conductors are to be formed in advance, the adhesion between the glass layer 1010 and the resin layers 1011 and 1012 (first resin layer and second resin layer) is increased.

  In the present embodiment, the through-hole conductor 100d has a first end portion 100f that decreases in diameter as it moves away from the surface F11, and a second end portion 100g that decreases in diameter as it moves away from the surface F12. Of the through-hole conductor 100d, the cylindrical constricted portion 100e has a constant diameter. In such a structure, stress is almost uniformly applied to the entire constricted portion 100e, and it is difficult for stress to concentrate on a part of the constricted portion 100e. As a result, high reliability with respect to strength is easily obtained.

  In this embodiment, the thickness D10 of the glass layer 1010 (core layer) is the sum of the thickness of the substrate 100 (the thickness D11 of the resin layer 1011, the thickness D10 of the glass layer 1010, and the thickness D12 of the resin layer 1012). ) Of 25 to 80%. If the ratio of the glass layer 1010 (core layer) in the board | substrate 100 becomes large, it will be thought that the thermal expansion coefficient of the board | substrate 100 will become small and the curvature of the wiring board 10 will be suppressed. However, when the ratio of the glass layer 1010 (core layer) in the substrate 100 becomes too large, the substrate 100 becomes weak against impact, and there is a concern about a decrease in reliability related to strength. In this respect, in this embodiment, since the ratio of the glass layer 1010 (core layer) in the substrate 100 is in the above range, it is possible to suppress warping of the wiring board 10 while maintaining high reliability with respect to strength. Become.

  In the present embodiment, the substrate 100 is not composed of only the glass layer 1010, but the resin layer 1011 or 1012 is provided on both surfaces of the glass layer 1010 in the substrate 100. As a result, the conductor layers 100a and 100b are formed on the resin layer 1011 or 1012, and the substrate 100 and the conductor layer 100a are formed more than when the conductor layers 100a and 100b are directly formed on the glass layer 1010. , 100b is considered to increase the adhesive strength.

  Hereinafter, the manufacturing method of the wiring board 10 (especially the core part) which concerns on this embodiment is demonstrated.

  First, as shown in FIG. 4, a substrate 100 is prepared. Specifically, for example, a glass layer 1010 (eg, quartz glass) is prepared, a semi-cured (B stage) resin layer 1011 is applied on the surface F1 of the glass layer 1010, and the surface F2 of the glass layer 1010 is applied. Then, a semi-cured state (B stage) resin layer 1012 is applied. Each of the resin layers 1011 and 1012 is formed by impregnating a glass cloth (inorganic fiber) with an uncured epoxy resin. An inorganic filler may be included in the resin before impregnation. An adhesive layer (adhesive) may be provided between the glass layer 1010 and the resin layers 1011 and 1012.

  As a material for the resin layers 1011 and 1012, for example, ABF (Ajinomoto Build-up Film: manufactured by Ajinomoto Fine Techno Co., Ltd.) can be used. ABF is a film in which an insulating material is sandwiched between two protective sheets. However, the present invention is not limited to this, and a prepreg may be used instead of ABF.

  Thereafter, the resin layers 1011 and 1012 are dried by, for example, heat treatment. As a result, the resin is cured and resin layers 1011 and 1012 in a completely cured state (C stage) are formed.

  Subsequently, as shown in FIG. 5, a metal foil 2001 (for example, copper foil) is pasted on the upper surface (surface F11) of the resin layer 1011 and a metal foil 2002 (for example, copper) is applied on the upper surface (surface F12) of the resin layer 1012. Paste the foil. The metal foils 2001 and 2002 may be attached after the resin layers 1011 and 1012 are completely cured, or may be attached when the resin layers 1011 and 1012 are in a semi-cured state to enhance adhesion. An adhesive layer (adhesive) may be provided between the metal foil 2001 or 2002 and the resin layer 1011 or 1012.

Subsequently, a through hole 100c (FIG. 3) is formed using, for example, a CO ₂ laser. The adjustment of the laser intensity (light quantity) is performed by pulse control, for example. Specifically, for example, when changing the laser intensity, the number of shots (number of irradiations) is changed without changing the laser intensity per shot (one irradiation). That is, when a desired laser intensity cannot be obtained with one shot, the same irradiation position is irradiated with laser light again. According to such a control method, the time for changing the irradiation condition can be omitted, so that it is considered that the throughput is improved. However, the method is not limited to this, and the laser intensity adjustment method is arbitrary. For example, the irradiation conditions may be determined for each irradiation position, and the number of irradiations may be fixed (for example, one shot for one irradiation position). Further, in the case of performing laser irradiation a plurality of times at the same irradiation position, the laser intensity may be changed for each shot.

  In this embodiment, the through hole 100c (FIG. 3) is formed by three-shot laser irradiation. Specifically, first, as shown in FIG. 6, one shot of laser is performed on the metal foil 2001. Thereby, the hole 100h (first opening) is formed. The hole 100h penetrates the metal foil 2001, for example, and forms a recess in the surface (surface F11) of the substrate 100. In the present embodiment, the hole 100h penetrates through the resin layer 1011 and reaches a position substantially in the middle of the glass layer 1010 (a depth of about half the thickness) or deeper than that.

  Subsequently, as shown in FIG. 7, one shot of laser is performed on the metal foil 2002. Thereby, the hole 100i (second opening) is formed. The hole 100i communicates with the hole 100h. As a result, a hole penetrating the substrate 100 is formed by the hole 100h and the hole 100i. The hole 100h and the hole 100i are formed at substantially the same position in the XY plane.

  Subsequently, as shown in FIG. 8, one more shot of laser is shot into the hole 100i. Thereby, a cylindrical opening (third opening) that connects the hole 100h and the hole 100i is formed between the hole 100h and the hole 100i, and the through hole 100c is formed by the opening, the hole 100h, and the hole 100i. Is configured. The hole 100h and the hole 100i do not communicate with each other or the hole 100h and the hole 100i do not communicate with each other because the formation positions of the hole 100h tapered from the surface F11 toward the surface F12 and the hole 100i tapered from the surface F12 toward the surface F11 are shifted. Even when the diameter of the through hole 100c in the communication portion with the laser beam is small, it is easy to form the through hole 100c having a sufficiently large diameter through the substrate 100 by performing laser irradiation of the third shot as described above. Become.

  The shape of the through hole 100c is, for example, the hourglass shape (the drum shape) described above. This laser irradiation may be performed on the hole 100h. Further, the laser irradiation for forming the hole 100h and the laser irradiation for forming the hole 100i may be performed simultaneously or one side at a time. Further, in order to increase the absorption efficiency of laser light, the surfaces of the metal foils 2001 and 2002 may be blackened prior to laser irradiation. If necessary, it is preferable to perform desmearing on the through hole 100c after the through hole 100c is formed. Further, the number of laser irradiations is not limited to three shots and is arbitrary. The through hole 100c may be formed by a method other than laser, such as drilling or etching. However, fine processing is easy with laser processing.

  Subsequently, as shown in FIG. 9, for example, an electroless plating film 2003 of copper is formed on the metal foils 2001 and 2002 and in the through hole 100 c by, for example, plating. The plating method is, for example, a chemical plating method. As the plating solution, for example, a copper sulfate solution to which a reducing agent or the like is added can be used.

  Subsequently, as shown in FIG. 10, plating resists 2005 and 2006 having openings (for example, through holes) at predetermined positions are formed on both surfaces (on the electroless plating film 2003) of the substrate 100. In the opening portions of the plating resists 2005 and 2006, the electroless plating film 2003 is exposed. The openings of the plating resists 2005 and 2006 are disposed corresponding to the conductor layers 100a and 100b (FIG. 3), respectively.

  Subsequently, as shown in FIG. 11, for example, electrolytic plating 2004 of copper is formed in the openings of the plating resists 2005 and 2006 by plating, for example. As a result, the electroplating 2004 is filled inside the electroless plating film 2003 in the through hole 100c, and the through hole conductor 100d is formed. In addition, a conductive layer made of a metal foil, an electroless plating film, and electrolytic plating is formed on the resin layer 1011 and the resin layer 1012, respectively. As the plating solution, for example, a copper sulfate solution, a copper pyrophosphate solution, a blue (cyanide) copper solution, or a copper borofluoride solution can be used. The seed layer for electrolytic plating is not limited to the electroless plating film, and a sputtered film or the like may be used as the seed layer instead of the electroless plating film.

  Subsequently, for example, the plating resists 2005 and 2006 are removed with a predetermined stripping solution, and further, the unnecessary electroless plating film 2003 and the metal foils 2001 and 2002 are removed. Thereby, the conductor layers 100a and 100b (refer FIG. 3) are formed. As a result, the core part of the wiring board 10 according to the present embodiment is completed.

  Subsequently, build-up portions are formed on both surfaces of the core portion of the wiring board 10. A buildup part can be manufactured with the general manufacturing method of a laminated wiring board, such as the process using the plating method and the copper foil with resin, for example. Each conductor layer may be any one of, for example, a panel plating method, a pattern plating method, a full additive method, a semi-additive (SAP) method, a subtractive method, a transfer method, and a tenting method. It can be formed by a combined method. Each insulating layer can be formed using, for example, prepreg or ABF.

  Thereby, the wiring board 10 (FIG. 1) according to the present embodiment is completed. The manufacturing method of this embodiment is suitable for manufacturing the wiring board 10. With such a manufacturing method, a good wiring board 10 can be obtained at low cost.

(Embodiment 2)
The second embodiment of the present invention will be described focusing on the differences from the first embodiment. Here, the same elements as those shown in FIG. 1 and the like are denoted by the same reference numerals, and the description of common parts already described is omitted or simplified.

  As shown in FIGS. 12 and 13, the wiring board of the present embodiment (Embodiment 2) is different from the wiring board 10 of Embodiment 1 in the configuration of the substrate 100 (core substrate). Specifically, in the wiring board of the present embodiment, the substrate 100 (core substrate) includes a core layer 200, a resin layer 1011, and a resin layer 1012. Among these, the core layer 200 is comprised from the resin plate 1010a in which cavity R100 (for example, through-hole) was formed, and the glass plate 1010b (glass block) arrange | positioned in cavity R100. In the core layer 200, the gap between the resin plate 1010a and the glass plate 1010b is filled with the resin 1010c flowing out from the resin layer 1011 (see FIG. 20). However, the present invention is not limited thereto, and the resin 1010c may be separately prepared and filled in the gap. The resin 1010c is preferably made of the same material as the surrounding insulator (resin plate 1010a, resin layers 1011 and 1012) (and hence the same thermal expansion coefficient).

  In the present embodiment, the thickness of the resin plate 1010a and the thickness of the glass plate 1010b are substantially the same. Further, in the present embodiment, the thickness of the cavity R100 and the thickness of the glass plate 1010b are substantially the same. Hereinafter, the common thickness of the resin plate 1010a and the glass plate 1010b is referred to as the thickness D10 of the core layer 200. However, the present invention is not limited to this, and the thickness of the resin plate 1010a and the thickness of the glass plate 1010b may be different from each other.

  The wiring board of this embodiment incorporates a glass plate 1010b having a size smaller than the size of the wiring board. Specifically, in the wiring board of the present embodiment, the core layer 200 includes a resin plate 1010a, a glass plate 1010b, and a resin 1010c. For this reason, as shown in FIG. 12, a glass region (glass plate 1010b) and a resin region (resin plate 1010a and resin 1010c) exist on the main surface (XY plane) of the core layer 200. . Note that the number of cavities R100 and the number of glass plates 1010b disposed therein are arbitrary. The cavity R100 may be provided at one location of the core layer 200, or the cavity R100 may be provided at a plurality of locations of the core layer 200. A plurality of glass plates may be disposed in one cavity R100. The plurality of glass plates in one cavity R100 may be arranged in the Z direction, or may be arranged in the X direction or the Y direction.

  In the present embodiment, one (Z1 side) of the front and back surfaces (two main surfaces) of the glass plate 1010b is referred to as a surface F13, and the other (Z2 side) is referred to as a surface F14. One (Z1 side) of the front and back surfaces (two main surfaces) of the resin plate 1010a is referred to as a surface F15, and the other (Z2 side) is referred to as a surface F16. The resin layer 1011 is formed on the surface F13 of the glass plate 1010b and the surface F15 of the resin plate 1010a, and the resin layer 1012 is formed on the surface F14 of the glass plate 1010b and the surface F16 of the resin plate 1010a. The resin layer 1011 and the resin layer 1012 are formed over both the resin plate 1010a and the glass plate 1010b, respectively. In the present embodiment, the upper surface of the resin layer 1011 corresponds to the surface F11 of the substrate 100, and the upper surface of the resin layer 1012 corresponds to the surface F12 of the substrate 100.

  The resin plate 1010a is formed, for example, by impregnating an inorganic fiber with a resin. In the present embodiment, the resin plate 1010a is formed by impregnating a glass cloth with an epoxy resin. The epoxy resin has thermosetting properties. However, the present invention is not limited to this, and the resin plate 1010a may be formed by impregnating an inorganic fiber such as an aramid fiber non-woven fabric with a polyimide resin or a phenol resin. The resin plate 1010a may contain an inorganic filler or may not contain an inorganic filler.

  In the present embodiment, the entire glass plate 1010b is made of a single glass material, such as quartz glass. However, the material of the glass plate 1010b is not limited thereto, and any material may be used as long as it is glass. For example, the glass plate 1010b may be made of multicomponent glass or soda glass. Further, instead of the glass plate 1010b, a structure in which a plurality of glass plates are bonded together (for example, a two-layer structure) may be used.

  Each of the resin layers 1011 and 1012 is made of an epoxy resin that does not include inorganic fibers but includes an inorganic filler. The epoxy resin has thermosetting properties. The resin constituting each of the resin layers 1011 and 1012 is, for example, polyimide resin, BT resin, allylated phenylene ether resin (A-PPE resin), aramid resin, liquid crystal polymer (LCP), PEEK resin, or PTFE resin (fluorine resin). ). As the inorganic filler, for example, a silica-based filler (dissolved quartz, isotropic silica, silica, talc, mica, kaolin, calcium silicate, or the like) can be used. However, the present invention is not limited to this, and each of the resin layers 1011 and 1012 may be obtained by impregnating a resin into an inorganic fiber.

  In the present embodiment, the coefficient of thermal expansion of the substrate 100 is in the range of 1 to 10 ppm / K. In order to suitably suppress the warpage of the wiring board, it is considered that the thermal expansion coefficient of the substrate 100 is preferably in the range of 1 to 5 ppm / K.

  Each of the cavity R100 and the glass plate 1010b has, for example, an outer shape of about 14 mm square (about 14 mm × about 14 mm). However, in this embodiment, a clearance of, for example, about 80 μm is provided for each of the X direction and the Y direction. That is, in FIG. 12, the width D201 of the cavity R100 in the X direction is about 80 μm larger than the width D203 of the glass plate 1010b in the X direction, and the width D202 of the cavity R100 in the Y direction is the Y direction of the glass plate 1010b. About 80 μm larger than the width D204.

  In FIG. 13, the thickness D11 of the resin layer 1011 is in the range of, for example, 5 to 30 μm, the thickness D10 of the core layer 200 is in the range of, for example, 40 to 100 μm, and the thickness D12 of the resin layer 1012 is, for example, It exists in the range of 5-30 micrometers.

  According to the configuration of the wiring board according to the present embodiment, it is possible to suppress warping of the wiring board. Hereinafter, this will be further described with reference to FIG.

  In the graph of FIG. 14, the vertical axis indicates the warpage of the wiring board at room temperature, and the horizontal axis indicates the thickness of the wiring board (or core substrate). In FIG. 14, lines L1 to L5 indicate simulation results for samples A to E, respectively. The configurations of the samples A to E are the same as those of the wiring board of the present embodiment (see FIGS. 12 and 13) except for the following points.

  Each of the samples A to E is an approximately 14 mm square wiring board having 6 conductor layers on which a 10 mm square die is mounted. In each of Samples A to E, the thickness of the conductor layer is 8 μm, and the thickness of the interlayer insulating layer is 12.5 μm. However, in each of Sample A and Sample B, the thickness of the conductor layer in the core (the conductor layer on the core substrate) is 12 μm, and the thickness of the conductor layer in the build-up portion is 8 μm. Each of the conductor layers in each sample is made of copper and has a conductor (copper) at a ratio of 65%.

  In each of sample A (line L1), sample B (line L2), and sample C (line L3), the core substrate is made of a prepreg and does not include a glass plate. However, the glass fibers contained in the core substrates of these samples A, B, and C have different coefficients of thermal expansion.

  In each of the sample D (line L4) and the sample E (line L5), the core substrate was formed on both the core layer and the core layer as in the wiring board of the present embodiment (see FIGS. 12 and 13). The first resin layer and the second resin layer are included, and the core layer includes a glass plate. In the core layer, the glass plate is disposed in a cavity formed in the resin plate. The core layer of sample D (line L4) includes a glass plate made of multicomponent glass, and the core layer of sample E (line L5) includes a glass plate made of quartz glass.

  As shown in FIG. 14, the warping of the wiring board starts from the larger sample A (line L1), sample B (line L2), sample C (line L3), sample D (line L4), and sample E ( The order was line L5).

  As shown in FIG. 14, each of sample D (line L4) and sample E (line L5) is more than any of sample A (line L1), sample B (line L2), and sample C (line L3). The warping of the wiring board was small. From this, it can be inferred that warpage of the wiring board can be suppressed by including a glass plate in the core substrate.

  As shown in FIG. 14, in the sample D (line L4), the warping of the wiring board was smaller than in the sample E (line L5). From this, it can be inferred that including a glass plate made of quartz glass in the core substrate is particularly effective in suppressing warpage of the wiring board.

  In the wiring board of the present embodiment, the core layer 200 includes a resin plate 1010a in which a cavity R100 (specifically, a through hole) is formed, and a glass plate 1010b disposed in the cavity R100. In such a configuration, it is considered that the glass plate 1010b can reduce the coefficient of thermal expansion (CTE) of the substrate 100 (core substrate) and suppress warping of the wiring board. Further, since the glass plate 1010b is partially provided on the core layer 200 instead of the entire core layer 200, the reliability of the wiring board is higher than that when the entire core layer 200 is made of a glass plate. Easy to maintain. For this reason, the wiring board of this embodiment has high rigidity and is excellent in fracture toughness against a drop impact. As a result, the yield of the wiring board can be improved. Moreover, it becomes easy to make a wiring board thin. Further, in the case where a through-hole (see FIG. 25 described later) in which a through-hole conductor is to be formed is provided in the glass plate 1010b in advance, the resin of the resin layers 1011 and 1012 (first and second resin layers) is put in the through-hole. The through-hole conductor 100d can be formed in the through hole filled with the resin. In such a configuration, the stress is relieved by the through-hole, and it is easy to suppress peeling of the through-hole conductor 100d. Further, by providing the glass plate 1010b with a through-hole in which through-hole conductors are to be formed in advance, the adhesion between the glass plate 1010b and the resin layers 1011 and 1012 (first resin layer and second resin layer) is increased.

  In the wiring board of the present embodiment (see FIGS. 12 and 13), the ratio of the glass plate 1010b in the core layer 200 is preferably in the range of 50 to 80% of the core layer 200 by volume ratio. When the ratio of the glass plate 1010b in the core layer 200 is in the above range, it is considered that the warpage of the wiring board 10 can be suppressed while maintaining high reliability with respect to strength.

  In the present embodiment, the resin 1010c flowing out from the resin layer 1011 is filled in the gap between the resin plate 1010a and the glass plate 1010b in the core layer 200 (see FIG. 20). Thereby, integration of the core layer 200 and the resin layer 1011 is achieved.

  Hereinafter, a method for manufacturing the wiring board according to the present embodiment, particularly a method for forming the substrate 100 (core substrate) will be described.

  First, as shown in FIG. 15, a resin plate 1010a is prepared. In this embodiment, the resin plate 1010a is obtained by impregnating a glass cloth with an epoxy resin, and at this stage, it is in a completely cured state (C stage).

Subsequently, as shown in FIG. 16, a predetermined portion of the resin plate 1010a is cut out by using, for example, a CO ₂ laser to form a cavity R100 in the resin plate 1010a as shown in FIG. In the present embodiment, the cavity R100 includes a hole that penetrates the resin plate 1010a. The wall surface F10 of the resin plate 1010a facing the cavity R100 is substantially perpendicular to the main surfaces (surfaces F1 and F2) of the resin plate 1010a, for example. The laser beam may be applied to one side of the resin plate 1010a or may be applied to both sides. The cavity R100 may be formed by a method other than laser, such as drilling or etching.

  When one side of the resin plate 1010a is irradiated with laser light, the processing amount by the laser decreases as the depth increases, and the cut surface of the resin plate 1010a tends to be a tapered surface. However, when the resin plate 1010a is thinned, a cut surface substantially perpendicular to the main surface of the resin plate 1010a is easily obtained.

  Subsequently, as shown in FIG. 18, a carrier 1001 made of, for example, PET (polyethylene terephthalate) is provided on one side (for example, the surface F2) of the resin plate 1010a. Thereby, one opening of the cavity R100 (hole) is closed by the carrier 1001. In this embodiment, the carrier 1001 is made of an adhesive sheet (for example, a tape), and has adhesiveness on the resin plate 1010a side. The carrier 1001 is bonded to the resin plate 1010a by lamination, for example.

  Subsequently, as shown in FIG. 18, a glass plate 1010b is put into the cavity R100 from the side opposite to the opening where the cavity R100 (hole) is blocked (Z1 side). The glass plate 1010b is made of, for example, quartz glass.

  As shown in FIG. 19, the glass plate 1010 b is placed in the cavity R <b> 100 and placed on the carrier 1001. In the present embodiment, one main surface (surface F2) of the resin plate 1010a and one main surface (surface F2) of the glass plate 1010b are respectively placed on the flat surface of the carrier 1001. For this reason, these have the mutually same height (Z coordinate), and comprise the same plane.

  Subsequently, as shown in FIG. 19, a resin layer 1011 and a metal foil 2001 (for example, a copper foil with resin) are provided on the resin plate 1010a and the glass plate 1010b (on the surface F1). In the present embodiment, the resin layer 1011 is made of an epoxy resin containing an inorganic filler, and is in a semi-cured state (B stage) at this stage.

  In this embodiment, the resin layer 1011 is provided by lamination. As a result, as shown in FIG. 20, the resin flows out from the resin layer 1011 and flows into the cavity R100. As a result, the gap between the resin plate 1010a and the glass plate 1010b in the core layer 200 is filled with the resin 1010c (resin constituting the resin layer 1011).

  When the cavity R100 is filled with the resin 1010c, the filling resin (resin 1010c) and the glass plate 1010b are temporarily welded. Specifically, the holding resin is developed to a degree that can support the glass plate 1010b on the filled resin by heating. Thereby, the glass plate 1010b supported by the carrier 1001 is supported by the filling resin. Thereafter, as shown in FIG. 21, the carrier 1001 is removed.

  At this stage, the resin layer 1011 and the resin 1010c are only semi-cured and not completely cured. However, the present invention is not limited to this. For example, the resin layer 1011 and the resin 1010c may be completely cured at this stage.

  Subsequently, as shown in FIG. 22, a resin layer 1012 and a metal foil 2002 (for example, a copper foil with resin) are provided on the resin plate 1010a and the glass plate 1010b (on the surface F2). In the present embodiment, the resin layer 1012 is made of an epoxy resin containing an inorganic filler, and is in a semi-cured state (B stage) at this stage.

  In the present embodiment, the resin layer 1012 is provided by lamination. Then, after the resin layer 1012 is bonded to the resin plate 1010a and the glass plate 1010b in a semi-cured state (B stage), each of the resin layers 1011 and 1012 is cured by heating. Thereby, resin layers 1011 and 1012 in a completely cured state (C stage) are formed on both surfaces (on the surfaces F1 and F2) of the resin plate 1010a, the glass plate 1010b, and the resin 1010c.

  In this embodiment, the resin layers 1011 and 1012 are cured simultaneously. By simultaneously curing the resin layers 1011 and 1012 formed on both surfaces of the glass plate 1010b, warpage of the substrate 100 is suppressed. As a result, the substrate 100 can be easily thinned.

  In addition, the formation method (adhesion method) of the resin layers 1011 and 1012 is not limited to lamination and is arbitrary. For example, when the strength of the glass plate 1010b is sufficiently high, the resin layers 1011 and 1012 may be bonded to the resin plate 1010a and the glass plate 1010b by pressing. Further, as the material of the resin layers 1011 and 1012, ABF, prepreg, or the like can be used.

  Subsequently, as shown in FIG. 23, the through-hole conductor 100d penetrating the substrate 100 and the conductor layers 100a and 100b are formed by, for example, the same method as that of the first embodiment (see FIGS. 6 to 11). As a result, the core part of the wiring board according to the present embodiment is completed. In the present embodiment, the plurality of through-hole conductors 100d penetrate the glass plate 1010b. In the present embodiment, there is no through-hole conductor 100d penetrating the resin plate 1010a. However, the present invention is not limited to this, and a through-hole conductor 100d that penetrates the resin plate 1010a may be formed as necessary.

  Thereafter, the wiring board according to the present embodiment can be completed by the same method as that of the first embodiment. The manufacturing method of the present embodiment is suitable for manufacturing the wiring board (see FIGS. 12 and 13) according to the present embodiment. With such a manufacturing method, a good wiring board can be obtained at low cost.

The manufacturing method of the wiring board according to the present embodiment is as follows:
Having a surface F13 and an opposite surface F14, and preparing a glass plate 1010b (see FIG. 18);
Preparing a resin plate 1010a having a surface F15 and an opposite surface F16 and having a cavity R100 (first through hole) formed thereon (see FIG. 17);
Placing the glass plate 1010b in the cavity R100 of the resin plate 1010a (see FIG. 18);
Forming a resin layer 1011 (first resin layer) having a surface F11 over the surface F13 of the glass plate 1010b and the surface F15 of the resin plate 1010a (see FIGS. 19 to 21);
Forming a resin layer 1012 (second resin layer) having a surface F12 over the surface F14 of the glass plate 1010b and the surface F16 of the resin plate 1010a (see FIG. 22);
Forming a through hole 100c (second through hole) penetrating the glass plate 1010b and the resin layers 1011 and 1012 (see FIGS. 6 to 8);
Forming the conductor layer 100a (including the first conductor pattern) on the surface F11 of the resin layer 1011 (see FIGS. 9 to 11);
Forming the conductor layer 100b (including the second conductor pattern) on the surface F12 of the resin layer 1012 (see FIGS. 9 to 11);
By filling a conductor in the through hole 100c, a through hole conductor 100d that connects the first conductor pattern included in the conductor layer 100a and the second conductor pattern included in the conductor layer 100b is formed (FIGS. 9 to 9). FIG. 11)
including.

  The manufacturing method as described above is suitable for manufacturing a wiring board in which the glass plate 1010b is disposed in the cavity R100 of the resin plate 1010a in the core portion.

  Moreover, about the structure and process similar to Embodiment 1, the effect similar to the effect of Embodiment 1 mentioned above or the effect according to it is acquired.

(Embodiment 3)
The third embodiment of the present invention will be described focusing on the differences from the first and second embodiments. Here, the same elements as those shown in the above drawings are denoted by the same reference numerals, and the description of common parts that have already been described is omitted or simplified.

As shown in FIGS. 24A and 24B, the wiring board of the present embodiment (Embodiment 3) is obtained by dividing the resin board 301 in which the cavity R200 is formed and the wiring board according to Embodiment 1 into pieces (hereinafter, referred to as “the board”). Wiring board 302) and resin layers 1013 and 1014. Cavity R200 consists of a through hole. The wiring board 302 is disposed in the cavity R200 of the resin board 301. In the present embodiment, one (Z1 side) of the front and back surfaces (two main surfaces) of the resin plate 301 is referred to as a surface F21, and the other (Z2 side) is referred to as a surface F22. Further, one (Z1 side) of the front and back surfaces (two main surfaces) of the wiring board 302 is referred to as a surface F23, and the other (Z2 side) is referred to as a surface F24.
A resin layer 1013 is formed on the surface F21 of the resin board 301 and the surface F23 of the wiring board 302, and a resin layer 1014 is formed on the surface F22 of the resin board 301 and the surface F24 of the wiring board 302. . The resin layer 1013 and the resin layer 1014 are formed over both the resin board 301 and the wiring board 302, respectively.

  The gap between the resin board 301 and the wiring board 302 is filled with the resin 303 that has flowed out of the resin layer 1013. However, the present invention is not limited to this, and the resin 303 may be separately prepared and filled in the gap. The dimension of the wiring board 302 is the same as that of the glass plate 1010b in the second embodiment, for example.

  A conductor layer 300 a is formed on the resin layer 1013, and a conductor layer 300 b is formed on the resin layer 1014. A via conductor 311 is formed in the resin layer 1013, and a via conductor 312 is formed in the resin layer 1014. The conductor layer 100 a of the wiring board 302 is electrically connected to the conductor layer 300 a on the resin layer 1013 via the via conductor 311, and the conductor layer 100 b of the wiring board 302 is connected to the resin layer 1014 via the via conductor 312. It is electrically connected to the upper conductor layer 300b.

  The material of each of the resin layers 1013 and 1014 is the same as that of the resin layers 1011 and 1012, for example. The material of each of the conductor layers 300a and 300b is the same as that of the conductor layers 100a and 100b, for example. The shape and material of each of the via conductors 311 and 312 are the same as, for example, the via conductors 101b to 104b (see FIG. 1) in the build-up portion.

  The wiring board 302 can be manufactured, for example, in the same manner as in the first embodiment (see FIGS. 4 to 11). At this time, for example, it can be separated into pieces by a dicing saw. Thereafter, for example, the wiring board of this embodiment can be completed in the same manner as in Embodiment 2 (see FIGS. 15 to 22).

  The wiring board of this embodiment includes a resin plate 301 having a surface F21 and a surface F22 on the opposite side, and having a cavity R200 (through hole) formed therein. And the wiring board 302 which has the surface F23 and the surface F24 on the opposite side to the cavity R200 of the resin plate 301 is arrange | positioned. Furthermore, the wiring board of this embodiment includes a resin layer 1013 (third resin layer) formed over both the surface F21 of the resin board 301 and the surface F23 of the wiring board 302, and the surface of the resin board 301. A resin layer 1014 (fourth resin layer) formed across both F22 and the surface F24 of the wiring board 302. According to the wiring board of the present embodiment, high-density wiring is possible by arranging the wiring board 302 in the cavity R200.

  Moreover, about the structure and process similar to Embodiment 1, 2, the effect similar to the effect of Embodiment 1, 2 mentioned above or the effect according to it is acquired.

(Other embodiments)
In each of the above embodiments, a through hole is formed in a portion (glass layer 1010 or resin plate 1010a) sandwiched between the resin layer 1011 and the resin layer 1012, and the resin of the resin layer 1011 or 1012 is filled in the through hole. The resin layer 1011 and the resin layer 1012 may be connected. In such a configuration, the stress is easily relieved by forming the through hole. Further, since the resin layer 1011 and the resin layer 1012 are connected to each other, the resin layers 1011 and 1012 and the substrate 100 can be easily integrated.

  In each of the above embodiments, a resin may be provided between the through-hole conductor 100d and the glass plate so that the through-hole conductor 100d and the glass plate do not directly touch each other. For example, as shown in FIG. 25, in the third embodiment, a hole 304a (through hole scheduled to form a through-hole conductor) that penetrates the glass layer 1010 is formed, and the resin 304 is filled in the hole 304a. A through hole 100c having a smaller diameter than the hole 304a may be formed in the resin 304. The through-hole conductor 100d can be formed by filling the through-hole 100c with a conductor. In such a configuration, the through-hole conductor 100d is connected to the glass layer 1010 through the resin 304. The stress is relieved by the hole 304a, and the through-hole conductor 100d and the glass layer 1010 are not in direct contact with each other, so that adhesion is enhanced. The resin 304 may be a resin from which the resin layer 1011 or 1012 has flowed out, or may be prepared separately. The same applies to the first and second embodiments.

  In the second embodiment, when the resin layer 1011 is formed, the resin flowing out of the resin layer 1011 is not completely filled with the resin plate 1010a and the glass plate 1010b, and the resin layer 1012 is formed. The resin that has flowed out of the resin layer 1012 may also form the resin 1010c together with the resin that has flowed out of the resin layer 1011 by causing the resin to flow out of the resin layer 1012. In this case, the core layer 200 and the resin layers 1011 and 1012 are integrated. The same applies to the third embodiment.

  In the second embodiment, a plurality of cavities R100 (openings) may be formed in the resin plate 1010a. For example, as shown in FIG. 26 (the figure corresponding to FIG. 12), a plurality of cavities R100 (openings) formed in the resin plate 1010a are arranged in a lattice shape, and a glass plate 1010b is arranged in each of the cavities R100. May be. However, the arrangement is not limited to this, and the arrangement of the plurality of cavities R100 (and thus the glass plate 1010b arranged there) is arbitrary. The same applies to the third embodiment.

  In the second embodiment, it is not essential that the cavity R100 penetrates the resin plate 1010a. The cavity R100 may include a hole that does not penetrate the resin plate 1010a. Further, the glass plate 1010b disposed in the cavity R100 may be thinner than the resin plate 1010a. The same applies to the third embodiment.

  In each of the above embodiments, each of the resin layer 1011 (first resin layer) and the resin layer 1012 (second resin layer) may be made of only a resin (a resin containing neither inorganic fillers nor inorganic fibers) or inorganic fibers. It may be made of a resin containing an inorganic filler, not containing an inorganic filler, or impregnating an inorganic fiber with a resin containing no inorganic filler, or impregnating an inorganic fiber with a resin containing an inorganic filler. There may be. However, each of the resin layer 1011 and the resin layer 1012 is preferably made of a resin containing at least one of an inorganic filler and an inorganic fiber. In addition, the resin layer which impregnated the resin containing an inorganic filler in the inorganic fiber can be easily formed by using a prepreg. Moreover, the resin layer which consists of resin which does not contain an inorganic fiber but contains an inorganic filler can be easily formed by using ABF. In order to reduce the coefficient of thermal expansion (CTE) of the resin layer, it is preferable to include an inorganic filler in the resin layer. On the other hand, in order to prevent deterioration of the surface properties (flatness, stability, etc.) of the resin layer due to protrusion or degranulation of the inorganic filler, it is preferable not to include the inorganic filler in the resin layer.

  In each said embodiment, each (or any one) of the resin layers 1011 and 1012 may be comprised from the layer containing an inorganic fiber, and the layer which does not contain an inorganic fiber. For example, as shown in FIG. 27, in the wiring board of Embodiment 1, the resin layer 1011 is composed of a resin layer 1011a containing inorganic fibers and a resin layer 1011b containing no inorganic fibers, and the resin layer 1012 is inorganic. You may be comprised from the resin layer 1012a containing a fiber, and the resin layer 1012b which does not contain an inorganic fiber. In the example of FIG. 27, the resin layers 1011a and 1012a are formed on the glass layer 1010, respectively, and the resin layers 1011b and 1012b are in contact with the conductor layer 100a or 100b, respectively.

  The configuration of the wiring board of each of the above embodiments, in particular, the type, performance, dimensions, material, shape, number of layers, or arrangement of the components can be arbitrarily changed without departing from the spirit of the present invention. .

  Laser processing may be facilitated by increasing the laser absorptivity by adding a colorant or the like to each glass plate. Moreover, you may add the additive for improving adhesiveness with resin to each glass plate. The surface of each glass plate may be smooth, or may be roughened to improve the adhesion with the resin.

  The material of each conductor layer is not limited to the above, and can be changed according to the application. For example, a metal other than copper or a non-metal conductor may be used as the material of the conductor layer. Similarly, the material of conductors (through-hole conductors, via conductors, etc.) in the openings is also arbitrary.

  For example, in the above embodiment, the number of layers in the buildup unit can be arbitrarily changed. Further, the number of layers of the buildup portion may be different between the surface F11 side of the substrate 100 and the surface F12 side of the substrate 100. However, in order to relieve the stress, it is considered preferable to increase the symmetry of the front and back by making the number of layers of the buildup portion the same on the surface F11 side of the substrate 100 and the surface F12 side of the substrate 100. Moreover, the single-sided wiring board by which a conductor layer and an interlayer insulation layer are laminated | stacked only on the single side | surface of an insulating layer may be sufficient.

  The method for manufacturing a wiring board is not limited to the order and contents shown in the above embodiment, and the order and contents can be arbitrarily changed without departing from the gist of the present invention. Moreover, you may omit the process which is not required according to a use etc.

  The above embodiment and modifications (materials listed for each element) can be arbitrarily combined. It is considered preferable to select an appropriate combination according to the application.

  The embodiment of the present invention has been described above. However, various modifications and combinations required for design reasons and other factors are not limited to the invention described in the “claims” or the “mode for carrying out the invention”. It should be understood that it is included in the scope of the invention corresponding to the specific examples described in the above.

DESCRIPTION OF SYMBOLS 10 Wiring board 10a Through hole 11, 12 Solder resist layer 11a, 12a Opening part 100 Substrate 100a, 100b Conductor layer 100c Through hole 100d Through hole conductor 100e Constriction part 100f 1st edge part 100g 2nd edge part 100h, 100i hole 101, 102, 103, 104 Insulating layer 101b, 102b, 103b, 104b Via conductor 110, 120, 130, 140 Conductor layer 200 Core layer 300a, 300b Conductor layer 301 Resin board 302 Wiring board 303 Resin 304 Resin 304a Hole 311 312 Via conductor 1001 Carrier 1010 Glass layer 1010a Resin plate 1010b Glass plate 1010c Resin 1011, 1011a, 1011b Resin layer 1012, 1012a, 1012b Resin layer 1013, 1014 Tree Oil layer 2001, 2002 Metal foil 2003 Electroless plating film 2004 Electroplating 2005, 2006 Plating resist F1, F2 surface F10 Wall surface F11, F12, F13, F14, F15, F16 surface F21, F22, F23, F24 surface P1, P2 pad P11, P21 Land P12, P22 Wiring R100, R200 Cavity

Claims (13)

A core substrate having a first surface and a second surface opposite to the first surface, wherein a through hole is formed;
A first conductor pattern formed on the first surface of the core substrate;
A second conductor pattern formed on the second surface of the core substrate;
A through-hole conductor composed of a conductor filled in the through hole of the core substrate, connecting the first conductor pattern and the second conductor pattern;
A wiring board comprising:
The core substrate has a third surface and a fourth surface opposite to the third surface, the core layer including a glass plate, and the first surface provided on the third surface of the core layer. A first resin layer having a second resin layer provided on the fourth surface of the core layer and having the second surface;
A wiring board characterized by that. The core layer is composed of a resin plate in which an opening is formed, and the glass plate disposed in the opening,
At least one of the first resin layer and the second resin layer is formed over both the resin plate and the glass plate;
The wiring board according to claim 1. The opening consists of a hole penetrating the resin plate,
Each of the first resin layer and the second resin layer is formed over both the resin plate and the glass plate.
The wiring board according to claim 2. The plurality of openings are arranged in a lattice shape, and the glass plate is disposed in each of the plurality of openings.
The wiring board according to claim 2 or 3, wherein The gap between the resin plate and the glass plate in the core layer is filled with resin that has flowed out from at least one of the first resin layer and the second resin layer.
The wiring board as described in any one of Claims 2 thru | or 4 characterized by these. The ratio of the glass plate in the core layer is in the range of 50 to 80% of the core layer by volume ratio.
The wiring board according to any one of claims 2 to 5, wherein the wiring board is provided. The core layer consists only of the glass plate,
The wiring board according to claim 1. Each of the first resin layer and the second resin layer contains inorganic fibers,
The wiring board according to any one of claims 1 to 7, wherein The through-hole conductor has a first end that decreases in diameter as it moves away from the first surface, and a second end that decreases in diameter as it moves away from the second surface.
The wiring board according to any one of claims 1 to 8, wherein A resin plate having a fifth surface and a sixth surface opposite to the fifth surface, in which a through hole is formed;
The wiring board according to claim 1;
With
The wiring board has a seventh surface and an eighth surface opposite to the seventh surface,
The wiring board is disposed in the through hole of the resin plate,
A third resin layer formed across both the fifth surface of the resin plate and the seventh surface of the wiring board;
A fourth resin layer formed over both the sixth surface of the resin plate and the eighth surface of the wiring board;
Further comprising
A wiring board characterized by that. A method of manufacturing a wiring board having a core substrate having a first surface and a second surface opposite to the first surface and having a through hole formed thereon,
A core layer having a third surface and a fourth surface opposite to the third surface, including a glass plate, and a first resin layer provided on the third surface of the core layer and having the first surface And preparing a core substrate composed of a second resin layer provided on the fourth surface of the core layer and having the second surface;
Forming a through hole in the core substrate;
Forming a first conductor pattern on the first surface of the core substrate;
Forming a second conductor pattern on the second surface of the core substrate;
Forming a through-hole conductor connecting the first conductor pattern and the second conductor pattern by filling the through-hole with a conductor; and
including,
A method for manufacturing a wiring board. Preparing a resin plate having a fifth surface and a sixth surface opposite to the fifth surface and having a through hole;
Manufacturing a wiring board having a seventh surface and an eighth surface opposite to the seventh surface by the method of manufacturing a wiring board according to claim 11;
Disposing the wiring board in the through hole of the resin plate;
Forming a third resin layer over the fifth surface of the resin plate and the seventh surface of the wiring board;
Forming a fourth resin layer over the sixth surface of the resin plate and the eighth surface of the wiring board;
including,
A method for manufacturing a wiring board. Providing a glass plate having a first surface and a second surface opposite the first surface;
Providing a resin plate having a third surface and a fourth surface opposite to the third surface, the first through hole being formed;
Disposing the glass plate in the first through hole of the resin plate;
Forming a first resin layer over the first surface of the glass plate and the third surface of the resin plate;
Forming a second resin layer over the second surface of the glass plate and the fourth surface of the resin plate;
Forming a second through hole penetrating the glass plate, the first resin layer, and the second resin layer;
Forming a first conductor pattern on the first resin layer;
Forming a second conductor pattern on the second resin layer;
Forming a through-hole conductor connecting the first conductor pattern and the second conductor pattern by filling the second through hole with a conductor;
including,
A method for manufacturing a wiring board.

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