JP2014122831A - Microfluidic device - Google Patents
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Abstract
Description
本発明は、マイクロ流路デバイスに関する。 The present invention relates to a microchannel device.
近年、マイクロリアクターやマイクロアナリシスシステムと呼ばれる化学反応システムや分析システムの微小化の研究が盛んに行われている。システムの微小化の利点として、微量の検体量で試験が可能となること、廃液の排出量が軽減されることなどが挙げられる。また、省スペースで持ち運びが可能であり、かつ、安価なシステムを構築することができる。 In recent years, research on miniaturization of chemical reaction systems and analysis systems called microreactors and microanalysis systems has been actively conducted. Advantages of miniaturization of the system include that a test can be performed with a very small amount of specimen and that the amount of discharged waste liquid is reduced. In addition, it is possible to carry a space-saving and inexpensive system.
このようなシステムは、核酸、タンパク質、糖鎖などの分析や合成、微量化学物質の迅速分析、医薬品・薬物のハイスループットスクリーニングへの応用が期待されている。また、体積に対する表面積の比率が向上することにより、熱移動・物質移動の高速化が実現できるため、反応や分離の精密な制御、高速・高効率化、副反応の抑制が期待される。 Such a system is expected to be applied to analysis and synthesis of nucleic acids, proteins, sugar chains and the like, rapid analysis of trace chemical substances, and high-throughput screening of pharmaceuticals and drugs. Further, since the ratio of the surface area to the volume is improved, heat transfer and mass transfer can be speeded up, so that precise control of reaction and separation, high speed and high efficiency, and suppression of side reactions are expected.
具体的なシステムとして、マイクロ流路を持つマイクロ流路デバイスを用いる検討がなされている。一般にマイクロ流路デバイスは微細加工によりマイクロ流路を形成した基板に他の基板又は膜を貼り合わせること等により製造されている。 As a specific system, studies using a microchannel device having a microchannel have been made. In general, a microchannel device is manufactured by attaching another substrate or film to a substrate on which a microchannel is formed by microfabrication.
樹脂基板同士を溶着する場合、超音波を用いた溶着が一般的である。このとき双方の基板の接合面が共に平坦であると溶着の効率が低下するため、基板の一方に山形のリブを設けることが一般的である（例えば特許文献１を参照）。 When the resin substrates are welded together, welding using ultrasonic waves is common. At this time, if the joint surfaces of both the substrates are flat, the efficiency of welding is lowered. Therefore, it is common to provide a chevron rib on one of the substrates (see, for example, Patent Document 1).
しかしながら、マイクロ流路デバイスのように高い寸法精度が要求される場合、溶着も高度に制御することが必要となる。すなわち、超音波溶着においては特にリブの先端を振動させるが、この際にリブ全体が大きく撓んだり折れたりすると高い精度を達成することは難しい。 However, when high dimensional accuracy is required like a microchannel device, it is necessary to control the welding to a high degree. That is, in ultrasonic welding, the tip of the rib is vibrated, but it is difficult to achieve high accuracy if the entire rib is greatly bent or broken at this time.
本発明は上記の課題に鑑みてなされたものであり、高い寸法精度を達成した溶着を可能とするマイクロ流路デバイスを提供する。 The present invention has been made in view of the above problems, and provides a microchannel device that enables welding with high dimensional accuracy.
このような目的は、下記（１）〜（３）に記載の本発明により達成される。
（１）第１基板及び第２基板を接合してなるマイクロ流路デバイスであって、
前記第１基板又は前記第２基板の少なくとも一方には流路溝が形成されており、かつ、前記第１基板又は前記第２基板の一方の周囲には他方と接合する突条を備え、
前記突条は接合前の状態で、横断面が三角形または台形をなし、三角形の頂角又は台形の２つの脚のなす角が４５度以上６０度以下、かつ、三角形又は台形の高さが０．２ｍｍ以上０．３ｍｍ以下であり、
前記第１基板及び前記第２基板を接合した状態で、前記突条を除く部分では前記第１基板と前記第２基板は非接触状態に保たれることを特徴とするマイクロ流路デバイス。
（２）前記第１基板及び前記第２基板は熱可塑性樹脂からなる（１）に記載のマイクロ流路デバイス。
（３）前記第１基板又は前記第２基板の他方の周囲には、前記突条と対応する凹溝が形成されており、前記突条の先端が前記凹溝に陥入して溶着する（１）又は（２）に記載のマイクロ流路デバイス。
Such an object is achieved by the present invention described in the following (1) to (3).
(1) A microchannel device formed by bonding a first substrate and a second substrate,
A channel groove is formed in at least one of the first substrate or the second substrate, and a protrusion that joins the other is provided around one of the first substrate or the second substrate,
The protrusions are in a state before joining, and the cross section is a triangle or trapezoid, the apex angle of the triangle or the angle formed by the two legs of the trapezoid is 45 degrees or more and 60 degrees or less, and the height of the triangle or trapezoid is 0 .2 mm or more and 0.3 mm or less,
In the state where the first substrate and the second substrate are joined, the first substrate and the second substrate are kept in a non-contact state in a portion excluding the protrusions.
(2) The microchannel device according to (1), wherein the first substrate and the second substrate are made of a thermoplastic resin.
(3) A concave groove corresponding to the ridge is formed around the other of the first substrate or the second substrate, and a tip of the ridge is inserted into the concave groove and welded ( The microchannel device according to 1) or (2).
本発明によれば、マイクロ流路デバイスの製造において高い寸法精度を達成した溶着を可能とすることができる。 ADVANTAGE OF THE INVENTION According to this invention, the welding which achieved the high dimensional accuracy in manufacture of a microchannel device can be enabled.
以下、本発明のマイクロ流路デバイスの好適な実施形態について、図面を参照しつつ詳細に説明する。 Hereinafter, preferred embodiments of the microchannel device of the present invention will be described in detail with reference to the drawings.
まず、本実施形態に係るマイクロ流路デバイス１について説明する。
図１は、本発明の実施形態に係るマイクロ流路デバイス１の上面図である。図２は、図１のＩＩ−ＩＩ断面図である。図３は、図２に対応する断面図で第１基板２と第２基板３を接合する前の状態を表した図である。
First, the microchannel device 1 according to the present embodiment will be described.
FIG. 1 is a top view of a microchannel device 1 according to an embodiment of the present invention. 2 is a cross-sectional view taken along the line II-II in FIG. FIG. 3 is a cross-sectional view corresponding to FIG. 2, illustrating a state before the first substrate 2 and the second substrate 3 are joined.
図１に示すように、本実施形態のマイクロ流路デバイス１は、第１基板２と第２基板３とを接合して形成される。マイクロ流路デバイス１は内部に流路溝２２を有し、この流路溝２２を用いて種々の反応や分析を行う。 As shown in FIG. 1, the microchannel device 1 of the present embodiment is formed by bonding a first substrate 2 and a second substrate 3. The microchannel device 1 has a channel groove 22 inside, and performs various reactions and analyzes using the channel groove 22.
第１基板２はマイクロ流路デバイス１を構成する基板の一つである。本実施形態では第１基板２は上面視が長方形の板状をなしている。第１基板２の一方の面は第２基板３と接合する接合面２１である。接合面２１には用途に応じた任意の走行形状をとる流路溝２２が形成されている。さらに、流路溝２２を取り囲むようにして突条２３が形成されている。 The first substrate 2 is one of the substrates constituting the microchannel device 1. In the present embodiment, the first substrate 2 has a plate shape having a rectangular top view. One surface of the first substrate 2 is a bonding surface 21 that is bonded to the second substrate 3. A flow path groove 22 having an arbitrary running shape according to the application is formed on the joint surface 21. Further, a protrusion 23 is formed so as to surround the flow channel groove 22.
流路溝２２は前述のように種々の反応や分析を行う際に試料の供給・排出路や反応の場となる。したがって、流路溝２２の設計は用途に応じて種々になされる。このような用途としては、例えば複数の試料を流路溝２２内で混合・反応させたり、流路溝２２を用いて試料を分離したりするといったことが挙げられる。本実施形態では、単純な例として図１から図３に示すように流路溝２２がマイクロ流路デバイス１（第１基板２）の長手方向に沿って１本形成されたものを挙げる。 As described above, the flow channel 22 serves as a sample supply / discharge channel and a reaction field when various reactions and analyzes are performed. Therefore, the flow channel 22 can be designed in various ways depending on the application. Examples of such applications include mixing and reacting a plurality of samples in the channel groove 22 and separating samples using the channel groove 22. In the present embodiment, as a simple example, as shown in FIGS. 1 to 3, a single channel groove 22 is formed along the longitudinal direction of the microchannel device 1 (first substrate 2).
流路溝２２の断面形状も用途に応じて種々に設計されるものである。本実施形態では流路溝２２は断面形状が正方形となるように形成されている。しかしながら流路溝２２の断面形状はこれに限られず長方形や半円形、半長円形等としてもよい。 The cross-sectional shape of the flow channel 22 is also designed in various ways depending on the application. In the present embodiment, the channel groove 22 is formed so that the cross-sectional shape is a square. However, the cross-sectional shape of the channel groove 22 is not limited to this, and may be a rectangle, a semicircle, a semi-oval, or the like.
流路溝２２の表面は、親水化処理や表面処置官能基の形成処理等の表面処理を施してもよい。このような表面処理として、含酸素官能基を導入する処理が行われる。含酸素官能基を導入することにより、樹脂表面の親水性が向上し、スムーズな試料の送液が可能になる。導入される含酸素官能基としては例えば、アルデヒド基やケトン基などのカルボニル基、カルボキシル基、水酸基、エーテル基、パーオキサイト基、エポキシ基などの極性を有した官能基群が挙げられる。また、その導入処理としては例えば、プラズマ処理、コロナ放電処理、エキシマレーザー処理、フレーム処理などを用いることができる。 The surface of the channel groove 22 may be subjected to a surface treatment such as a hydrophilization treatment or a surface treatment functional group formation treatment. As such a surface treatment, a treatment for introducing an oxygen-containing functional group is performed. By introducing the oxygen-containing functional group, the hydrophilicity of the resin surface is improved, and smooth sample feeding becomes possible. Examples of the oxygen-containing functional group to be introduced include functional groups having polarity such as carbonyl groups such as aldehyde groups and ketone groups, carboxyl groups, hydroxyl groups, ether groups, peroxide groups, and epoxy groups. As the introduction process, for example, plasma process, corona discharge process, excimer laser process, flame process, or the like can be used.
突条２３は、第１基板２と第２基板３とを接合する際に接合しろとなる。突条２３がない場合、接合が非効率となり接着が不十分となることがありうるが、突条２３を形成すると応力が突条に集中するため十分な接着を達成することができる。本実施形態の突条２３は図３に示すように、断面形状が三角形をなしている。また、突条２３は流路溝２２を取り囲むように第１基板２の全周にわたって形成されている。 The ridges 23 are joined when the first substrate 2 and the second substrate 3 are joined. When there is no ridge 23, joining may be inefficient and adhesion may be insufficient. However, when the ridge 23 is formed, stress is concentrated on the ridge, so that sufficient adhesion can be achieved. As shown in FIG. 3, the protrusion 23 of the present embodiment has a triangular cross-sectional shape. Further, the protrusion 23 is formed over the entire circumference of the first substrate 2 so as to surround the flow path groove 22.
なお、本発明における突条２３の横断面が「三角形」とは、数学的な三角形だけでなく、例えば、頂角がＲ加工されているものや辺が湾曲しているもの等の略三角形のものも含む。 The cross section of the ridge 23 in the present invention is not only a mathematical triangle but also a substantially triangular shape such as one whose apex angle is R processed or one whose side is curved. Including things.
突条２３の断面形状は超音波溶着の精度に大きく影響する。例えば突条が高すぎると溶着の際に突条が折れてしまうといったことが生じうる。また、突条の頂角が鋭角すぎると溶着の際に突条が折れたり撓んだりしてしまうことがありうる。さらに、突条の頂角が鈍角すぎると接合効率が低下する。これらは第１基板２と第２基板３の接合時に高い精度の溶着を阻害することになる。 The cross-sectional shape of the ridge 23 greatly affects the accuracy of ultrasonic welding. For example, if the ridge is too high, the ridge may break during welding. Moreover, if the apex angle of the ridge is too acute, the ridge may break or bend during welding. Furthermore, if the apex angle of the ridge is too obtuse, the joining efficiency is lowered. These obstruct high-precision welding at the time of joining the first substrate 2 and the second substrate 3.
本実施形態では第１基板２と第２基板３の接合前の状態において突条２３の断面形状は頂角が４５度以上６０度以下、高さが０．２ｍｍ以上０．３ｍｍ以下となるように形成されている。頂角及び高さをこの範囲とすると前述したような突条２３の折れや撓みを効果的に抑止することができ、高精度の接着を達成することができる。 In the present embodiment, before the first substrate 2 and the second substrate 3 are joined, the cross-sectional shape of the ridge 23 is such that the apex angle is not less than 45 degrees and not more than 60 degrees, and the height is not less than 0.2 mm and not more than 0.3 mm. Is formed. When the apex angle and the height are within this range, the bending and bending of the protrusion 23 as described above can be effectively suppressed, and high-accuracy adhesion can be achieved.
さらに、本実施形態では図２に示すように第１基板２と第２基板３を接合した状態において、突条２３を除く部分では第１基板と第２基板は非接触状態に保たれる。すなわち、第１基板２と第２基板３は突条２３を支点として橋渡しされるように形成されている。このように第１基板２と第２基板３とを離間して接合すると、流路の密閉性が保てないなどの基板間接触による溶着不良、突条以外の箇所が溶けて白化するなどの外観不良が良好に防止できる。 Furthermore, in the present embodiment, as shown in FIG. 2, in the state where the first substrate 2 and the second substrate 3 are joined, the first substrate and the second substrate are kept in a non-contact state except for the protrusions 23. That is, the first substrate 2 and the second substrate 3 are formed so as to be bridged with the ridge 23 as a fulcrum. If the first substrate 2 and the second substrate 3 are separated and joined in this manner, the poor sealing due to contact between the substrates, such as the inability to maintain the sealing property of the flow path, and the portions other than the protrusions melt and whiten. Appearance defects can be prevented well.
なお、本実施形態では突条２３は断面形状が三角形である例を説明したが、断面形状を台形とすることもできる。このとき第１基板２と第２基板３の接合前の状態において突条２３の２つの脚のなす角が４５度以上６０度以下、高さが０．２ｍｍ以上０．３ｍｍ以下となるように形成されている。角及び高さをこの範囲とすると前述したような突条２３の折れや撓みを効果的に抑止することができ、高精度の接着を達成することができる。また、本発明における突条２３の横断面が「台形」とは、数学的な台形だけでなく、例えば、頂角がＲ加工されているものや辺が湾曲しているもの等の略台形のものも含む。 In the present embodiment, the protrusion 23 has an example in which the cross-sectional shape is a triangle, but the cross-sectional shape may be a trapezoid. At this time, in a state before the first substrate 2 and the second substrate 3 are joined, the angle formed by the two legs of the ridge 23 is not less than 45 degrees and not more than 60 degrees, and the height is not less than 0.2 mm and not more than 0.3 mm. Is formed. When the angle and the height are in this range, the bending and bending of the protrusion 23 as described above can be effectively suppressed, and high-precision bonding can be achieved. Further, the cross section of the ridge 23 in the present invention is not only a mathematical trapezoid, but also a substantially trapezoidal shape such as one whose apex angle is R processed or one whose side is curved. Including things.
第１基板２の樹脂材料としては、熱可塑性樹脂を用いることができ、例えば、ポリエチレン、ポリプロピレン（ＰＰ）、ポリメチルペンテン（ＰＭＰ）などのポリオレフィン、ポリスチレンなどのポリビニル、ポリカーボネート（ＰＣ）、ポリメチルメタクリレート（ＰＭＭＡ）などのポリアクリル、シクロオレフィンポリマー（ＣＯＰ）やシクロオレフィンコポリマー（ＣＯＣ）などを用いることができる。特に、成形性や成形した基板の硬度、耐薬液性の点からＣＯＰや、ＣＯＣを用いることが好ましい。 As the resin material of the first substrate 2, a thermoplastic resin can be used. For example, polyolefin such as polyethylene, polypropylene (PP) and polymethylpentene (PMP), polyvinyl such as polystyrene, polycarbonate (PC) and polymethyl. Polyacryl such as methacrylate (PMMA), cycloolefin polymer (COP), cycloolefin copolymer (COC), and the like can be used. In particular, it is preferable to use COP or COC in terms of moldability, hardness of the molded substrate, and chemical resistance.
第１基板２の代表的な寸法例について説明する。第１基板２は縦１０〜１００ｍｍ程度、横１０〜１００ｍｍ程度、厚さ０．２〜２ｍｍ程度である。また、流路溝２２は、幅１０〜１０００μｍ程度、深さ１０〜１０００μｍ程度である。ただし、これらの寸法は例示であり、使途に適した寸法設計とすることに差し支えはない。 A typical dimension example of the first substrate 2 will be described. The first substrate 2 has a length of about 10 to 100 mm, a width of about 10 to 100 mm, and a thickness of about 0.2 to 2 mm. The channel groove 22 has a width of about 10 to 1000 μm and a depth of about 10 to 1000 μm. However, these dimensions are merely examples, and there is no problem in designing the dimensions suitable for use.
第２基板３は、第１基板２とともにマイクロ流路デバイス１を構成する。図２、図３に示すように、本実施形態の第２基板３は、第１基板２と同形状をなしている。第２基板３の一方の面には、第１基板２の接合面２１と接合する接合面３１を有する。接合面３１には突条２３と対応する位置に凹溝３２が形成されている。 The second substrate 3 constitutes the microchannel device 1 together with the first substrate 2. As shown in FIGS. 2 and 3, the second substrate 3 of the present embodiment has the same shape as the first substrate 2. One surface of the second substrate 3 has a bonding surface 31 to be bonded to the bonding surface 21 of the first substrate 2. A concave groove 32 is formed in the joint surface 31 at a position corresponding to the protrusion 23.
凹溝３２は、第１基板２と第２基板３とを接合する際に突条２３が突き当たる部分である。したがって、凹溝３２は突条２３と同様に、第１基板２と第２基板３とを接合したときに流路溝２２を取り囲むように第２基板３の全周にわたって形成されている。 The concave groove 32 is a portion where the protrusion 23 abuts when the first substrate 2 and the second substrate 3 are joined. Therefore, the concave groove 32 is formed over the entire circumference of the second substrate 3 so as to surround the flow channel groove 22 when the first substrate 2 and the second substrate 3 are joined, similarly to the protrusion 23.
本実施形態では凹溝３２は底面が曲面をなす樋状に形成されている。凹溝３２の代表的な寸法例は、幅０．２〜０．５ｍｍ程度、深さ０．１〜０．３ｍｍ程度である。なお、凹溝３２の形状はこれに限られず横断面を四角形等としてもよい。 In this embodiment, the concave groove 32 is formed in a bowl shape whose bottom surface forms a curved surface. A typical dimension example of the concave groove 32 is about 0.2 to 0.5 mm in width and about 0.1 to 0.3 mm in depth. The shape of the groove 32 is not limited to this, and the cross section may be a square or the like.
凹溝３２は第１基板２と第２基板３とを接合する際に突条２３の溶融した部分を受け入れる役割を担う。このように凹溝３２を設けると突条２３の溶融した部分が周囲に流れることを効果的に防止できるのでより高精度なマイクロ流路デバイス１を製造することができる。 The concave groove 32 serves to receive a melted portion of the protrusion 23 when the first substrate 2 and the second substrate 3 are joined. Providing the concave groove 32 in this way can effectively prevent the melted portion of the ridge 23 from flowing to the surroundings, so that the microchannel device 1 with higher accuracy can be manufactured.
なお、本実施形態のマイクロ流路デバイス１には、膜体、ポンプ、バルブ、センサー、モーター、ミキサー、ギア、クラッチ、マイクロレンズ、電気回路等を組み合わせて複合化させることも可能であり、種々の用途に用いることができる。 The microchannel device 1 of the present embodiment can be combined with a combination of a membrane body, a pump, a valve, a sensor, a motor, a mixer, a gear, a clutch, a microlens, an electric circuit, and the like. It can be used for
次に、本実施形態のマイクロ流路デバイス１の製造方法について説明する。
まず、第１基板２及び第２基板３を用意する。それぞれの基板は例えば射出成型により作製すればよい。このときあらかじめ流路溝２２に対応する部分を成形型に形成しておくことにより、これらを同時に一体成型することができるので、大量生産に適しする。なお、流路溝２２を後加工する場合は、ドリル等の機械加工、ホットエンボスによる加工、レーザーによる加工、ドライエッチングパターン加工、ウェットエッチングパターン加工等の加工方法を選択すればよい。
Next, a method for manufacturing the microchannel device 1 of the present embodiment will be described.
First, the first substrate 2 and the second substrate 3 are prepared. Each substrate may be produced by, for example, injection molding. At this time, by previously forming a portion corresponding to the channel groove 22 in the mold, these can be integrally molded at the same time, which is suitable for mass production. In the case of post-processing the channel groove 22, a processing method such as mechanical processing such as a drill, processing by hot embossing, processing by laser, dry etching pattern processing, wet etching pattern processing may be selected.
次いで、第１基板２と第２基板３とを溶着する。まず、第１基板２の接合面２１と第２基板３の接合面３１とを向かい合わせて接合する。このとき、突条２３が凹溝３２に突き当たるように位置合わせをする。この状態で溶着を行い、第１基板２と第２基板３を一体化してマイクロ流路デバイス１を作製する。 Next, the first substrate 2 and the second substrate 3 are welded. First, the bonding surface 21 of the first substrate 2 and the bonding surface 31 of the second substrate 3 are bonded face to face. At this time, alignment is performed so that the ridges 23 abut against the concave grooves 32. Welding is performed in this state, and the first substrate 2 and the second substrate 3 are integrated to produce the microchannel device 1.
なお、本実施形態では溶着は２０ｋＨｚ、１２００Ｗの超音波溶着機で、圧力０．１〜１ＭＰａ程度、溶着時間０．１〜１秒程度の条件下で行う。この溶着条件は一例であり、基板の材料や必要な溶着強度等により適宜変更してもよい。 In this embodiment, the welding is performed by a 20 kHz, 1200 W ultrasonic welding machine under conditions of a pressure of about 0.1 to 1 MPa and a welding time of about 0.1 to 1 second. This welding condition is an example, and may be appropriately changed depending on the material of the substrate, the required welding strength, and the like.
１ マイクロ流路デバイス
２ 第１基板
２１ 接合面
２２ 流路溝
２３ 突条
３ 第２基板
３１ 接合面
３２ 凹溝
DESCRIPTION OF SYMBOLS 1 Microchannel device 2 1st board | substrate 21 Joint surface 22 Channel groove 23 Projection 3 2nd board | substrate 31 Joint surface 32 Concave groove
Claims (3)
前記第１基板又は前記第２基板の少なくとも一方には流路溝が形成されており、かつ、前記第１基板又は前記第２基板の一方の周囲には他方と接合する突条を備え、
前記突条は接合前の状態で、横断面が三角形又は台形をなし、三角形の頂角又は台形の２つの脚のなす角が４５度以上６０度以下、かつ、三角形又は台形の高さが０．２ｍｍ以上０．３ｍｍ以下であり、
前記第１基板及び前記第２基板を接合した状態で、前記突条を除く部分では前記第１基板と前記第２基板は非接触状態に保たれることを特徴とするマイクロ流路デバイス。 A microchannel device formed by bonding a first substrate and a second substrate,
A channel groove is formed in at least one of the first substrate or the second substrate, and a protrusion that joins the other is provided around one of the first substrate or the second substrate,
The protrusions are in a state before joining, and the cross section is a triangle or trapezoid, the apex angle of the triangle or the angle formed by the two legs of the trapezoid is 45 degrees or more and 60 degrees or less, and the height of the triangle or trapezoid is 0 .2 mm or more and 0.3 mm or less,
In the state where the first substrate and the second substrate are joined, the first substrate and the second substrate are kept in a non-contact state in a portion excluding the protrusions.
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| KR20180004097A (en) * | 2014-12-18 | 2018-01-10 | 스미스 디텍션-워트포드 리미티드 | Detection apparatus and method of manufacture |
| JP2018504591A (en) * | 2014-12-18 | 2018-02-15 | スミスズ ディテクション−ワトフォード リミテッド | Apparatus and method |
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| JP2019078707A (en) * | 2017-10-27 | 2019-05-23 | ウシオ電機株式会社 | Microchip |
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