JP2014044099A - Electric connecting device - Google Patents

Abstract

An object of the present invention is to solve a problem caused by wear of a probe by ensuring vertical movement of a tip portion of a probe of a vertical probe card and ensuring stable electrical connection with an electrode pad of an object to be inspected.
[Solution]
The probe support body includes upper, middle, and lower guide portions each provided with a guide hole for the probe. Each probe has a probe body that is disposed through the corresponding guide hole of each guide portion in sequence. The tip end portion of the probe main body protruding from the guide hole of the lower guide portion is associated with the corresponding electrode pad of the object to be inspected. The probe body is positioned between the upper guide part and the intermediate guide part in order to prevent interference between the elastic deformation parts of the probe body when the tip part of the probe body is pressed against the corresponding electrode pad. The music part to control is introduced. Each probe has a protective part for enhancing wear resistance against sliding with the intermediate guide part.
[Selection] Figure 2

Description

  The present invention relates to an electrical connection device such as a vertically-operated probe card used for an electrical test of a flat test object such as an integrated circuit.

  In the vertical operation type probe card, each probe is made of a linear metal material such as tungsten extending from the probe substrate, and each probe passes through a probe support held on the probe substrate and is directed to a lower inspection object. Guided. The probe support serves to control the posture of each probe in order to prevent an electrical short circuit due to contact between adjacent probes, and guides the tip of each probe to the corresponding electrode pad of the object to be inspected. (See Patent Documents 1 to 4).

  As shown in FIGS. 4 (a) and 4 (b), the probe support 1 is a plate-like upper guide portion 3 which is disposed close to the probe substrate 2 and below and parallel to the probe substrate. And plate-like intermediate and lower guide portions 4 and 5 that are held in parallel with the guide portion, and the intermediate guide portion 4 is disposed closer to the lower guide portion 5 than the upper guide portion 3. (See Patent Documents 3 and 4).

  As shown in FIG. 4 (a), guide holes 3a, 4a and 5a for the probe 6 made of a linear metal material are provided in each guide portion 3, 4 and 5 so as to penetrate therethrough. . Each probe 6 is disposed through each guide hole 3a, 4a and 5a. The guide hole 3 a of the upper guide portion 3 guides the upper end portion of each probe 6 to a corresponding connection pad (not shown) of the probe substrate 2.

  The guide holes 4 a and 5 a of the intermediate guide portion 4 and the lower guide portion 5 are aligned with each other, but are arranged at positions shifted in one direction from the corresponding probe guide holes 3 a of the upper guide portion 3. As a result, a curved portion 6a as shown in FIG. 4 (a) is introduced into each probe 6 between the upper guide portion 3 and the intermediate guide portion 4 by elastic deformation. Further, the tip portion of each probe 6 protruding from the lower guide portion 5 of each probe 6 corresponds to the corresponding electrode of the object 7 to be inspected by the joint of the probe guide holes 4 a and 5 a of the intermediate guide portion 4 and the lower guide portion 5. It is oriented vertically towards the pad 7a.

  For example, when the inspection object 7 is moved toward the probe substrate 2 for electrical inspection of the inspection object 7, each probe 6 is moved from the corresponding electrode 7a to the arrow 8 in FIG. Receives the pushing force indicated by. When the tip of each probe 6 is pushed up toward the probe substrate 2 by the above-described pushing force, the tip portion guided by the probe guide holes 4a and 5a of each probe 6 moves upward. To do. At this time, the guide holes 4a and 5a that are aligned with each other of the intermediate guide portion 4 and the lower guide portion 5 hold the tip portions of the probes 6 vertically, thereby ensuring the vertical movement of the tip portions.

  Further, the movement of the base end of each probe 6 is restricted by the probe substrate 2. Therefore, when the tip portion of each probe 6 is pushed up toward the probe substrate 2, the curved portion introduced into each probe 6 between the intermediate guide portion 4 and the lower guide portion 5 shown in FIG. 6a produces a large curve due to the bending deformation as shown in FIG. The posture including the magnitude and direction of the curve is suitably controlled by the probe support 1 so as to be the same.

  Accordingly, each probe 6 is pressed against the corresponding electrode pad 7a by an appropriate spring force by its own elastic deformation without being electrically short-circuited with each other.

  By the way, as shown in FIG. 4B, when the tip of each probe 6 is pushed toward the probe support 1, or when the push is released, each probe 6 is elastically shaped into the shape shown in FIG. When returning, the edge portion of the probe guide hole 4a of the intermediate guide portion 4 is such that the curved portion of each probe 6 is surrounded by a broken-line circle in FIG. It will slide in a state where it is strongly pressed against.

  When tungsten metal having high hardness is used as the material of this type of probe 6, each guide portion 3, 4 and 5 is made of a hard synthetic resin material such as high-strength ceramic or glass epoxy resin, for example. However, the wear of each probe 6 does not become a problem.

  However, tungsten may be too hard to obtain a stable electrical connection with the electrode pad 7a. In order to provide a stable electrical connection between the electrode pad 7a and each probe 6, it is desirable to use a metal material having a hardness lower than that of tungsten in order to give each probe 6 an appropriate flexibility. However, in the probe 6 made of a metal material having a hardness lower than that of tungsten, a stable electrical connection with the electrode pad 7a can be obtained, but on the other hand, the edge of the probe guide hole 4a of the intermediate guide portion 4 described above. Wear of each probe 6 due to sliding is a problem.

  As this wear progresses, the smooth linear movement of the tip of the probe 6 is hindered, and reliable electrical connection with the corresponding electrode pad 7a is impaired. Further, this wear reduces the durability of the probe 6, and the metal powder of the probe 6 caused by the wear may cause an electrical short circuit problem.

JP 2004-138576 A JP 2009-162483 A International Publication No. WO2004 / 072661 JP 2006-3191 A

  Accordingly, the object of the present invention is to ensure the vertical movement of the tip of the probe in the vertical probe card and to ensure a stable electrical connection with the electrode pad of the object to be inspected, resulting from the wear of the probe. It is to solve the problem.

  The electrical connection device according to the present invention prevents interference between the probes when the probe substrate provided with a plurality of probes and the tip of each probe are pressed against the object to be inspected. And a probe support supported by the probe substrate to maintain vertical movement. The probe support includes plate-shaped upper, middle and lower guide portions arranged in parallel to the probe substrate, and each guide portion is provided with a guide hole for the probe. The probe has a probe main body that is sequentially disposed through the corresponding guide hole of each guide portion, and the probe main body includes the probe between the upper guide portion and the intermediate guide portion. In order to prevent interference between the elastically deforming portions of the probe main body which would occur when the lower end of the main body is pressed, a curved portion for controlling the posture is introduced. The probe has a portion corresponding to the guide hole of the intermediate guide portion of the probe main body against sliding of the probe main body to the intermediate plate-shaped guide portion as the bending elastic deformation of the curved portion increases. It has a protective part for enhancing wear resistance.

  According to the present invention, the probe support ensures the vertical movement of the tip of each probe, and the portion corresponding to the guide hole of the intermediate guide portion of the probe main body is connected to the intermediate plate-shaped guide portion. By providing a protective part for enhancing the wear resistance against sliding, it is possible to prevent wear of each probe, thereby preventing a decrease in durability due to the wear, and to prevent the electric power of the metal powder generated by the wear. Can solve the short circuit problem.

  The protective part may be made of a metal material having a Vickers hardness higher than that of the metal material constituting the probe body.

  The intermediate plate-shaped guide portion has a Vickers hardness higher than a Vickers hardness of a metal material constituting the probe body, and has a Vickers hardness lower than a Vickers hardness of a metal material constituting the protection portion. Can be configured.

  In order to obtain a probe having an appropriate flexibility, it is preferable that the probe main body is made of any one metal material of a palladium alloy or a copper alloy.

  The protective part may be formed of any one metal tube or layer selected from nickel, titanium, rhodium or tungsten that partially covers the probe body.

  The probe board has a plurality of tester lands connected to a tester, and the guide holes of both the middle and lower guide portions are arranged in alignment with each other, and the upper plate shape corresponding to the probe guide holes The probe guide holes of the guide portion can be arranged shifted in one direction. Accordingly, the base end portion of the probe body is associated with the connection position of the probe substrate to the corresponding tester land, and the tip end portion of the probe body protruding from the guide hole of the lower guide portion is the object to be inspected. The curved portion can be formed between the upper guide portion and the intermediate guide portion in the probe body.

  The probe main body can be made of a linear dissimilar metal material arranged with its end faces in contact with each other. In this case, the protection portion can be formed of a protection cylinder that is attached to the probe main body and surrounds the contact portion of the dissimilar metal material. The joint function of the contact portion can be taken.

  The intermediate guide portion may be disposed closer to the lower guide portion than the upper guide portion. Thereby, the vertical movement of the tip of the probe can be made more reliable by the joint of the middle and lower guide portions.

  The intermediate plate-shaped guide portion can be integrally formed with the lower plate-shaped guide portion so as to be joined to the lower plate-shaped guide portion. However, in order to stabilize and ensure the vertical movement of the tip of the probe, it is desirable that the intermediate plate-shaped guide portion is formed at a distance from the lower plate-shaped guide portion.

  According to the present invention, as described above, the probe support ensures the vertical movement of the tip of each probe, and the protection portion prevents wear of each probe, thereby ensuring durability due to the wear. Can be prevented, and the problem of electrical short circuit of metal powder caused by abrasion can be solved.

1 is a front view schematically showing an electrical connection device according to the present invention. FIG. 1 schematically shows an enlarged main part of the electrical connection apparatus shown in FIG. 1, (a) shows a state in which the probe is not pressed by the electrode of the object to be inspected, and (b) shows the probe being inspected. The state where it is pressed by the electrode is shown. The other embodiment of the electrical connection device according to the present invention is shown and is the same drawing as FIG. It is a front view which shows the conventional electrical connection apparatus, (a) shows the state by which the probe is not pressed by the electrode of a to-be-inspected object, (b) is the state by which the probe is pressed by the electrode of to-be-inspected object Indicates.

  The electrical connection device 10 according to the present invention is generally called a vertically-operated probe card, and is held by a frame (not shown) above a vertically movable chuck 12 as is well known. On the chuck 12, in the illustrated example, a semiconductor wafer 14 that is an object to be inspected is held. A large number of integrated circuits are incorporated in the semiconductor wafer 14.

  For electrical inspection of the integrated circuit, the semiconductor wafer 14 is disposed on the chuck 12 with a large number of electrode pads 14a of the integrated circuit facing upward.

  The electrical connection device, that is, the vertical operation type probe card 10 is supported by the probe substrate 16 formed of, for example, a circular rigid wiring substrate, a probe support 18 that is entirely held by the probe substrate, and the probe support. And a large number of probes 20.

  A large number of tester lands 22 serving as connection ends to a tester (not shown) are provided at the peripheral edge of one surface of the probe board 16, and each tester land 22 is probed via a wiring path 16 a provided in the probe board 16. It is connected to a corresponding connection pad (not shown) provided on the other surface of the substrate 16.

  In the illustrated example, a space transformer 24 that is a well-known connector is provided on the other surface of the probe substrate 16. Therefore, the probe support 18 is supported on the probe substrate 16 via the space transformer 24. In addition, a reinforcing plate 26 made of, for example, metal that reinforces the probe substrate 16 is provided on the one surface of the probe substrate 16, and the reinforcing plate covers the periphery of the probe substrate 16 where the tester lands 22 are provided. It is arranged in the central part except.

  In the illustrated example, the upper end, that is, the base end of each probe 20 is connected to the corresponding wiring path 16 a of the probe substrate 16 via the corresponding wiring path 24 a of the space transformer 24. Thereby, each probe 20 is connected to the corresponding tester land 22 via the wiring path 16a.

  As shown in FIGS. 2A and 2B, the probe support 18 includes flat plates 28, 30, and 32 that are parallel to the space transformer 24, that is, flat, parallel to the probe substrate 16. And a plurality of spacer members 34 for holding the plates in parallel with each other. Each of the plates 28, 30 and 32 is formed of, for example, a ceramic plate or a polyimide synthetic resin plate.

  The upper guide plate 28 is disposed close to the space transformer 24. In the upper guide plate 28, an upper guide hole 28 a that guides the base end of each probe 20 to the connection position to the corresponding wiring path 24 a of the space transformer 24 is formed so as to penetrate in the thickness direction of the guide plate 28. Has been. Therefore, the guide portion 28 constitutes a guide portion above the probe support 18.

  In the middle and lower guide plates 30 and 32, guide holes 30a and 32a penetrating in the plate thickness direction are formed corresponding to the upper guide holes 28a of the upper guide portion 28, respectively. Each guide hole 30a and 32a allows the probe 20 to be inserted so as to allow the corresponding probe 20 to move in the axial direction. Accordingly, the middle and lower guide plates 30 and 32 constitute the middle and lower guide portions of the probe support 18 similar to the conventional one.

  The intermediate guide portion 30 is disposed closer to the lower guide portion 32 than the upper guide portion 28. The guide holes 30a and 32a corresponding to each other provided in the middle and lower guide portions 30 and 32 are arranged in alignment with each other. These guide holes 30a and 32a aligned with each other are arranged at positions shifted in one direction from the alignment positions of the corresponding guide holes 28a of the upper guide portion 28.

  Each probe 20 includes a probe main body 36 made of a linear metal member, and a protection portion 38 provided on the probe main body. The probe body 36 is made of a metal wire such as a palladium alloy or a copper alloy having a Vickers hardness lower than that of tungsten. The probe main body 36 is held in a straight line in a free state where no external force is applied to the probe main body, and has an elasticity that returns to the original straight line in a state in which the external force that gives a bending deformation is removed.

  Each probe main body 36 is disposed through the guide holes 28a, 30a and 32a of the respective guide portions 28, 30 and 32. As a result, as described above, the upper end of the probe main body 36 is guided to the connection position to the corresponding wiring path 24a, and is fixed to the corresponding connection pad (not shown) of the wiring path using, for example, solder. Yes. The probe body 36 is guided toward the corresponding electrode pad 14a of the device under test 14 through the guide holes 30a and 32a. Thereby, each probe main body 36 is associated with the corresponding electrode pad 14a of the device under test 14.

  As described above, there is a shift in one direction between the guide hole 28a of the upper guide portion 28 and the corresponding guide holes 30a and 32a of the middle and lower guide portions 30 and 32. From this, each probe main body 36 passing through the guide holes 28a, 30a and 32a of the respective guide portions 28, 30 and 32 has substantially the same shape and posture between the upper guide portion 28 and the intermediate guide portion 30. A curved portion 36a by elastic deformation is introduced. Thereby, each probe main body 36 is arranged in the vertical direction as a whole so as to draw a smooth crank state by the probe support 18, and each probe main body 36 is in the same posture and has a distal end portion of the probe main body 36. Is protruded downward from the probe support 18 in a substantially vertical direction.

  As shown in FIG. 2A, the protection portion 38 corresponds to the guide hole 30a of the intermediate guide portion 30 of the probe body 36 in a state where the probe body 36 is not subjected to the pressing force by the electrode pad 14a. It is formed so as to cover the straight line portion. The protection part 38 is formed in the probe main body 36 with a metal material higher than the Vickers hardness of the probe main body.

  For example, when the probe main body 36 is made of a palladium alloy, the protective portion 38 can be formed of a plated layer of nickel, titanium, rhodium, tungsten, or an alloy material thereof having a higher Vickers hardness. For example, when the probe main bodies 36 having a diameter of 30 μm are arranged at a pitch of 50 μm, the thickness of the plating layer of the protection portion 38 is set to 3 μm to 5 μm, thereby maintaining a space of 10 μm or more between the probes 20. be able to.

  In the state shown in FIG. 2A, the protection portion 38 projects at least slightly from the intermediate guide portion 30 from the lower position of the intermediate guide portion 30 and slides with the intermediate guide portion 30 described later. It is formed so as to cover the region.

  Instead of the above-described plating layer, a protective member 38 can be formed by fixing a cylindrical member made of nickel, titanium, rhodium, tungsten or an alloy material thereof to the probe body 36. Moreover, the protection part 38 can be provided in the whole area below the curved part except for the curved part 36a of the probe main body 36.

  When the electrode pad 14a of the device under test 14 comes into contact with the tip (lower end) of the probe main body 36 protruding from the probe support 18 as shown in FIG. As the chuck 12 moves up, the electrode pad 14a pushes up the lower end portion of the probe main body 36 to which the electrode pad 14a corresponds in the direction indicated by the arrow 40a. The lower end of the probe main body 36 is displaced upward by this push-up, and at this time, the lower end of the probe main body 36 moves vertically by the guide action of the guide holes 30a and 32b of both the intermediate and lower guide portions 30 and 32. Guaranteed.

  Further, since the base end (upper end) of the probe main body 36 is prevented from moving by the space transformer 24, the bent portion 36a of the probe main body 36 is It is elastically deformed greatly in one direction indicated by 40b. By this attitude control, an electrical short circuit between the probes 20 is prevented. Further, the lower end of each probe 20 is surely pressed in the vertical direction against the corresponding electrode pad 14a and is securely connected to the electrode pad 14a with the appropriate flexibility due to the elasticity of the probe body 36. Thereby, each electrode pad 14a is securely connected to the tester via the corresponding tester land 22 of the probe substrate 16. Therefore, the electrical inspection of the device under test 14 is reliably performed.

  When the lower end of the probe main body 36 is pushed up by the electrode pad 14a and when the curved portion 36a is elastically returned to the state shown in FIG. 2A, the probe main body 36 has an edge of the guide hole 30a of the intermediate guide portion 30. The sliding region is covered with the protective portion 38 that is harder than the probe main body 36 as described above, so that wear of the probe main body 36 is prevented.

  Therefore, the above-described protective action of the protection portion 38 can reliably prevent the deterioration of durability due to wear of the probe main body 36 and the short-circuit problem due to wear powder of the probe main body 36.

  Another embodiment of the present invention is shown in FIG. FIG. 3 is a drawing similar to FIG. 2A, and a part indicated by an ellipse is shown in a sectional view as an enlarged portion indicated by an arrow 42. In the example shown in FIG. 3, the probe main body 36 is configured by joining different kinds of metals. In the illustrated example, the upper half portion 36-1 including the curved portion 36a of the probe main body 36 is made of a metal material having a high hardness such as tungsten. On the other hand, the lower half portion 36-2 is made of the same metal material as that of the probe main body 36, which has a lower hardness than tungsten.

  The upper half part 36-1 and the lower half part 36-2 made of each metal material are joined to each other by a joining means such as welding with the opposed end faces in contact. The protection part 38 consists of a cylindrical member which covers the junction part of the upper half part 36-1 and the lower half part 36-2. The cylindrical member 38 is made of a metal material such as tungsten.

  The protective portion 38 made of this cylindrical member enhances the wear resistance of the probe main body 36 as described above, and covers the joint between the upper half 36-1 and the lower half 36-2 constituting the probe main body. Therefore, it also serves to protect and reinforce the joint.

  Instead of directly connecting the upper half part 36-1 and the lower half part 36-2 to each other by welding as described above, the upper half part 36-1 and the lower half part 36-2 can be connected by the cylindrical member constituting the protection part 38. In this case, the cylindrical member 38 is coupled to each of the upper half 36-1 and the lower half 36-2, for example, by caulking or welding.

  As described above, the example in which the upper end of the probe main body 36 is fixed to the corresponding connection pad of the wiring path 24a of the space transformer 24 is shown. On the other hand, the upper end of the probe main body 36 can be brought into contact with the connection pad in a non-fixed state without being fixed to the corresponding connection pad of the wiring path 24a of the space transformer 24. In this case, as indicated by the phantom line in FIG. 2A, the probe main body 36 is provided with a stopper 44 capable of contacting the upper edge portion of the guide hole 32a of the lower guide portion 32. The probe body 36 can be reliably prevented from falling off.

  In the example described above, the space transformer 24 is disposed between the probe substrate 16 and the probe support 18, but the connector 24 made of the space transformer can be dispensed with. In this case, the probe support 18 is directly supported by the probe substrate 16, and the upper end of each probe 20 is connected to the corresponding wiring path 16a of the probe substrate 16 by the guide hole 28a of the upper guide portion 28. Positioned at the connection position to the pad.

  The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention.

10 Vertically operated probe card (electrical connection device)
14 Semiconductor wafer (inspected object)
14a Electrode pad 16 Probe substrate 18 Probe support 20 Probe 22 Tester land 28, 30, 32 Guide plate (guide portion)
28a, 30a, 32a Guide hole 36 (36-1, 36-2) Probe body 38 Protection part

Claims (10)

When the probe substrate provided with a plurality of probes and the tip of each probe are pressed against the object to be inspected, the probe substrate is prevented from interfering with each other and maintaining the vertical movement of the probe tip. A probe support that is supported and has plate-like upper, middle, and lower guide portions arranged in parallel to the probe substrate, each guide portion having a guide hole for the probe The probe has a probe main body that is sequentially disposed through the corresponding guide hole of each guide part, and the probe main body includes a gap between the upper guide part and the intermediate guide part. In order to prevent interference between the elastically deforming parts of the probe main body that would occur when the lower end of the probe main body is pressed, a curved portion that controls the posture is introduced. A connecting device,
The probe has a portion corresponding to the guide hole of the intermediate guide portion of the probe main body against sliding of the probe main body to the intermediate plate-shaped guide portion as the bending elastic deformation of the curved portion increases. An electrical connection device having a protective portion for enhancing wear resistance.   The electrical connection device according to claim 1, wherein the protection part is made of a metal material having a Vickers hardness higher than that of the metal material constituting the probe body.   The intermediate plate-shaped guide portion has a Vickers hardness higher than a Vickers hardness of a metal material constituting the probe body, and has a Vickers hardness lower than a Vickers hardness of a metal material constituting the protection portion. Item 3. The electrical connection device according to Item 2.   The electrical connection device according to claim 3, wherein the probe main body is made of any one metal material of a palladium alloy or a copper alloy.   5. The electrical connection device according to claim 4, wherein the protection part is made of any one of a cylinder or a layer of metal selected from nickel, titanium, rhodium, or tungsten partially covering the probe body.   The probe main body is made of a linear dissimilar metal material arranged with the end surfaces in contact with each other, and the protection portion is formed of a protection cylinder that surrounds the contact portion of the dissimilar metal material and is attached to the probe main body. The electrical connection device according to claim 1.   The probe board has a plurality of tester lands connected to a tester, and the guide holes of both the middle and lower guide portions are arranged in alignment with each other, and the upper plate shape corresponding to the probe guide holes The probe guide holes of the guide portion are arranged shifted in one direction, whereby the base end portion of the probe body is associated with the connection position of the probe substrate to the corresponding tester land, and the lower guide portion The tip of the probe body protruding from the guide hole is associated with the corresponding electrode pad of the object to be inspected, and the probe body is between the upper guide part and the intermediate guide part, The electrical connection device according to claim 1, wherein the curved portion is formed.   The electrical connection device according to claim 7, wherein the intermediate guide portion is disposed nearer the lower guide portion than the upper guide portion.   The electrical connecting device according to claim 8, wherein the intermediate plate-shaped guide portion is formed at a distance from the lower plate-shaped guide portion.   The electrical connecting device according to claim 8, wherein the intermediate plate-shaped guide portion is integrally formed with the lower plate-shaped guide portion so as to be joined to the lower plate-shaped guide portion.

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