JP6892235B2 - Electrical connection device and manufacturing method of electrical connection device - Google Patents

Description

The present invention is a technique relating to an electrical connection device used for electrical inspection of an object to be inspected.

An object to be inspected, such as a semiconductor device, is subjected to an electrical inspection to see if its internal circuit operates according to the specifications. As a device used for such an electrical inspection, there is an electrical connection device such as a probe card including a plurality of probes.

In this type of electrical connection device, the base end (upper end) of a plurality of probes made of thin metal wires is assembled vertically to the substrate, and the tip (lower end) of the probe is pressed against the electrode of the object to be inspected. There is a vertically operating type electrical connection device (see, for example, Patent Document 1).

A vertically operating electrical connection device is a probe support having a lower guide plate and an upper guide plate arranged at intervals in the vertical direction, and an intermediate guide plate arranged between the lower guide plate and the upper guide plate. To be equipped. For example, in such an electrical connection device, the probe is passed through the upper guide plate, the intermediate guide plate, and the upper guide plate, the probe is assembled to the probe support, and the upper guide plate, the intermediate guide plate, and the lower guide plate are attached to each other. In some cases, the probes are curved in the same direction by different positions in the left-right direction (see, for example, Patent Document 2).

Japanese Unexamined Patent Publication No. 6-308163 JP-A-11-248745

By the way, in the electrical connection device according to the prior art, each probe penetrates the lower guide plate, the intermediate guide plate, and the upper guide plate so as to be movable in the vertical direction. There is a problem that the pressing force acting between the substrate and the probe is transmitted to the tip of the probe, and the contact point between the tip of the probe and the object to be inspected becomes unstable.

As a result, in the electrical connection device according to the prior art, it is difficult for the contact pressure acting between the electrode of the probe to be inspected and the tip of the probe to be uniform. There was a problem of causing contact failure.

The present invention has been made in view of such a situation, and an object of the present invention is to provide an electrical connection device and a method for manufacturing an electrical connection device capable of suppressing contact failure of a probe.

In order to achieve the above object, the first feature of the electrical connection device according to the present invention includes an intermediate guide plate having an intermediate guide hole penetrating in the vertical direction, and a probe inserted through the intermediate guide hole. An electrical connection device, the probe includes a linear main body portion and a locking portion that locks the movement of the main body portion in the vertical direction in the intermediate guide plate, and the intermediate guide plate is a first. It has a first plate member in which one opening hole is formed and a second plate member in which a second opening hole is formed and is laminated on the first plate member, and the first plate member and the second plate At least one of the members is configured to be movable in the left-right direction orthogonal to the up-down direction, and the intermediate guide hole is formed in the left-right direction of a part of the first opening hole and a part of the second opening hole. The overlapping portion is formed to be narrower than the locking portion.

The second feature of the electrical connection device according to the present invention relates to the above feature, and the locking portion is arranged above the intermediate guide plate and is wider than the intermediate guide hole. It is to have a locking portion and a second locking portion which is arranged below the intermediate guide plate and is wider than the intermediate guide hole.

The third feature of the electrical connection device according to the present invention is related to the above-mentioned features, that is, an upper guide plate which is arranged above the intermediate guide plate at intervals and has an upper guide hole penetrating in the vertical direction, and the above-mentioned The probe is provided with a lower guide plate that is spaced below the intermediate guide plate and has a lower guide hole that penetrates in the vertical direction, and the probe includes the upper guide hole, the intermediate guide hole, and the lower guide hole. It is intended to have a curved portion that is inserted into and curved between the upper guide plate and the lower guide plate.

The fourth feature of the electrical connection device according to the present invention relates to the above feature, and the second plate member is formed with a third opening hole that opens wider than the locking portion in the intermediate guide plate. The first plate member, the second plate member, and at least one of the third plate members are configured to be movable in the left-right direction orthogonal to the vertical direction. The intermediate guide hole is formed to be narrower than the locking portion as a part of the first opening hole, a part of the second opening hole, and a part of the third opening hole overlapping in the left-right direction. To be done.

A fifth feature of the electrical connection device according to the present invention is related to the above feature, that the locking portion is formed by a locking member fixed to the main body portion.

The sixth feature of the electrical connection device according to the present invention is related to the above feature, and the locking portion is formed by thickening a part of the main body portion.

According to the electrical connection device according to the present invention, it is possible to provide an electrical connection device and a method for manufacturing the electrical connection device capable of suppressing contact failure between the tip of the probe and the object to be inspected.

It is a schematic side view which shows the electrical connection apparatus which concerns on Embodiment 1 of this invention. It is a partially enlarged sectional view schematically showing a part of the electrical connection device which concerns on Embodiment 1 of this invention. It is a partially enlarged sectional view schematically showing a part of the probe which concerns on Embodiment 1 of this invention. (A) It is a schematic cross-sectional view for demonstrating the manufacturing method which concerns on Embodiment 1 of this invention. (B) It is a schematic plan view for demonstrating the manufacturing method which concerns on Embodiment 1 of this invention. (A) It is a schematic cross-sectional view for demonstrating the manufacturing method which concerns on Embodiment 1 of this invention. (B) It is a schematic plan view for demonstrating the manufacturing method which concerns on Embodiment 1 of this invention. It is a partially enlarged sectional view schematically showing a part of the electrical connection device which concerns on another embodiment of this invention. It is a partially enlarged sectional view schematically showing a part of the electrical connection device which concerns on another embodiment of this invention. It is a partially enlarged sectional view schematically showing a part of the electrical connection device which concerns on another embodiment of this invention.

Hereinafter, the electrical connection device according to the embodiment of the present invention will be described in detail with reference to the drawings. Further, the embodiments shown below exemplify an apparatus or the like for embodying the technical idea of the present invention, and the technical idea of the present invention describes the arrangement of each component as follows. Not specific. The technical idea of the present invention can be modified in various ways within the scope of claims.

(Embodiment 1)
FIG. 1 is a side view showing a schematic configuration of an electrical connection device 1 according to a first embodiment of the present invention.

As shown in FIG. 1, the electrical connection device 1 according to the first embodiment of the present invention is referred to as a vertically operating probe card, and is held by a frame (not shown) above a chuck 12 that can be raised and lowered. A semiconductor wafer 14 is held on the chuck 12 as an example of the object to be inspected. A large number of integrated circuits are incorporated in the semiconductor wafer 14.

The semiconductor wafer 14 is arranged on the chuck 12 with a large number of electrode pads 14a of the integrated circuit facing upward for electrical inspection of the integrated circuit.

The electrical connection device 1 includes a probe substrate 16 and a probe support 18.

The probe substrate 16 is made of, for example, a circular rigid wiring board. The lower end of the probe substrate 16 is connected to the base end 20b (upper end) of the probe 20.

A large number of tester lands 16b serving as connection ends to testers (not shown) are provided on the peripheral edge of one surface (upper surface shown in FIG. 1) of the probe substrate 16. Each tester land 16b is connected to a wiring 16a provided on the probe substrate 16.

Further, on one surface (upper surface shown in FIG. 1) of the probe substrate 16, for example, a metal reinforcing plate 26 for reinforcing the probe substrate 16 is provided. The reinforcing plate is arranged at the central portion of the probe substrate 16 excluding the peripheral portion where the tester land 16b is provided. A probe support 18 is arranged on the other surface (lower surface shown in FIG. 1) of the probe substrate 16.

The probe support 18 is held on the probe substrate 16. The probe support 18 has a plurality of probes 20. The probe support 18 prevents the probes 20 from interfering with each other when the tip portion 20a (lower end portion) of the probe 20 is pressed against the semiconductor wafer 14.

The probe 20 has a tip portion 20a and a proximal end portion 20b. The tip portion 20a of the probe 20 is arranged so as to face the electrode pad 14a provided corresponding to the semiconductor wafer 14.

The base end portion 20b of the probe 20 is in contact with the connection pad 16c (see FIG. 2 described later) provided corresponding to the probe substrate 16 in a pressure-welded state. As a result, the base end portion 20b of the probe 20 is electrically connected to the probe substrate 16.

Next, the configuration of the probe support 18 and the probe 20 will be described in detail with reference to FIGS. FIG. 2 is a partially enlarged cross-sectional view of a part of the electrical connection device 1 according to the first embodiment of the present invention. FIG. 3 is a partially enlarged cross-sectional view of a part of the probe 20 according to the first embodiment of the present invention.

For the sake of explanation, the vertical direction Z, the horizontal direction X orthogonal to the vertical direction Z, and the front-rear direction Y orthogonal to the vertical direction Z and the horizontal direction X are defined in the drawings. Further, the vertical direction Z can be rephrased as the thickness direction of the electrical connection device 1.

As shown in FIG. 2, the probe support 18 is arranged below the probe substrate 16. The probe support 18 includes a guide plate 100 having a plurality of guide holes for inserting the plurality of probes 20. The guide plate 100 is configured to guide the probe 20 inserted into the guide hole to a predetermined position.

The guide plate 100 has an upper guide plate 110, a lower guide plate 120, and an intermediate guide plate 130 arranged between the upper guide plate 110 and the lower guide plate 120.

Each of the upper guide plate 110, the intermediate guide plate 130, and the lower guide plate 120 is formed of an insulating material such as a ceramic plate or a polyimide synthetic resin plate. The upper guide plate 110, the intermediate guide plate 130, and the lower guide plate 120 are arranged so as to be parallel to each other by a member such as a spacer member 34, and are connected to each other by a screw member (not shown). There is.

The upper guide plate 110 is arranged close to the probe substrate 16. The upper guide plate 110 has an upper guide hole 110a penetrating in the vertical direction Z. A plurality of upper guide holes 110a are formed corresponding to each of the plurality of probes 20. The probe 20 is inserted into the upper guide hole 110a so as to allow the probe 20 to move in the vertical direction Z.

The lower guide plate 120 is arranged at intervals in the vertical direction Z from the upper guide plate 110. The lower guide plate 120 has a lower guide hole 120a penetrating in the vertical direction Z. A plurality of lower guide holes 120a are formed corresponding to each of the plurality of probes 20. The probe 20 is inserted into the lower guide hole 120a so as to allow the probe 20 to move in the vertical direction Z.

The intermediate guide plate 130 is arranged between the upper guide plate 110 and the lower guide plate 120. The intermediate guide plate 130 has an intermediate guide hole 130a penetrating in the vertical direction Z. A plurality of intermediate guide holes 130a are formed corresponding to each of the plurality of probes 20. The probe 20 is inserted into the intermediate guide hole 130a. The probe 20 inserted through the intermediate guide hole 130a is restricted from moving in the vertical direction Z by the locking portion 40 described later.

The intermediate guide plate 130 has a first plate member 131 and a second plate member 132 laminated on the first plate member 131. The first plate member 131 is formed with a first opening hole 131a, and the second plate member 132 is formed with a second opening hole 132a. At least one of the first plate member 131 and the second plate member 132 is configured to be movable in the left-right direction X. Further, the intermediate guide hole 130a of the intermediate guide plate 130 is formed by an overlapping portion of a part of the first opening hole 131a and a part of the second opening hole 132a.

The probe 20 is inserted into the upper guide hole 110a of the upper guide plate 110, the intermediate guide hole 130a of the intermediate guide plate 130, and the lower guide hole 120a of the lower guide plate 120. As a result, the base end portion 20b of the probe 20 is guided toward the connection pad 16c formed at a predetermined position on the probe substrate 16. The base end portion 20b of the probe 20 projects from the upper guide plate 110 by a predetermined length. The base end portion 20b of the probe 20 may be fixed to the connection pad 16c of the probe substrate 16 by using, for example, solder.

Further, the tip portion 20a of the probe 20 is guided toward the electrode pad 14a of the semiconductor wafer 14. The tip portion 20a of the probe 20 projects downward from the probe support 18 in the vertical direction Z with a predetermined length. The tip portion 20a of the probe 20 is arranged from the lower guide plate 120 at a position corresponding to the electrode pad 14a to be connected to the semiconductor wafer 14.

The probe 20 includes a linear main body portion 21 and a locking portion 40. The main body 21 is made of a linear metal member. The metal member may be, for example, tungsten. The upper end of the main body 21 in the vertical direction Z is the base end 20b of the probe 20, and the lower end is the tip 20a of the probe 20.

In the probe 20, the main body 21 is configured to be curved between the upper guide plate 110 and the lower guide plate 120. Specifically, the main body portion 21 is formed between the first curved portion 20x formed between the upper guide plate 110 and the intermediate guide plate 130, and between the intermediate guide plate 130 and the lower guide plate 120. It has a second curved portion 20y.

The first curved portion 20x and the second curved portion 20y are formed by shifting the upper guide hole 110a, the intermediate guide hole 130a, and the lower guide hole 120a by a predetermined amount in the left-right direction X with the probe 20 inserted. ..

Further, by forming the first curved portion 20x and the second curved portion 20y, the length L1 in the vertical direction Z from the upper surface of the intermediate guide plate 130 to the base end portion 20b of the probe 20 and the intermediate guide plate 130 The length L2 in the vertical direction Z from the lower surface to the base end portion 20b of the probe 20 can be appropriately adjusted.

The first curved portion 20x and the second curved portion 20y are formed so as to be elastically deformed in the same shape and the same posture in the plurality of probes 20. As a result, the probe 20 is arranged on the probe support 18 in a state of drawing a smooth crank.

For example, when the probe support 18 and the probe substrate 16 are connected, the probe support 18 is pressed against the probe substrate 16 (so-called preload is given). Then, the base end portion 20b of the probe 20 is pressed against the connection pad 16c of the probe substrate 16 by this pressing, and is linearly downward in the vertical direction Z while being guided by the upper guide hole 110a of the upper guide plate 110. Moving.

Further, as the base end portion 20b of the probe 20 moves, the first curved portion 20x of the probe 20 is greatly elastically deformed in a bow shape in one of the left-right directions X (for example, the right direction in FIG. 2). After that, the probe support 18 and the probe substrate 16 are connected by, for example, a screw member (not shown).

On the other hand, for example, in the electrical inspection of the semiconductor wafer 14, the rise of the chuck 12 pushes the tip portion 20a of the probe 20 corresponding to the electrode pad 14a upward in the vertical direction Z. Then, by this pushing up, the tip portion 20a of the probe 20 moves linearly upward in the vertical direction Z while being guided by the lower guide hole 120a of the lower guide plate 120.

Further, by pushing up the tip portion 20a of the probe 20, the second curved portion 20y of the probe 20 is greatly elastically deformed in a bow shape in one of the left-right directions X. Further, the tip portion 20a of each probe 20 is pressed against the corresponding electrode pad 14a by the appropriate flexibility due to the elasticity of the probe 20, so that the tip portion 20a is securely connected to the electrode pad 14a.

As a result, the electrode pad 14a is electrically connected to the tester (not shown) via the corresponding tester land 16b of the probe substrate 16, and the semiconductor wafer 14 is electrically inspected.

The locking portion 40 locks the movement of the main body portion 21 in the vertical direction Z on the intermediate guide plate 130. Specifically, the locking portion 40 regulates the movement of the main body portion 21 inserted into the intermediate guide hole 130a.

The locking portion 40 is formed by a locking member fixed to the main body portion 21. That is, the locking portion 40 is composed of a locking member that is separate from the main body portion 21. The locking member may be a metal or a resin.

Further, as shown in FIG. 3, the locking portion 40 includes a first locking portion 41 and a second locking portion 42.

The first locking portion 41 is arranged so as to abut on the upper surface of the intermediate guide plate 130. Specifically, the first locking portion 41 is arranged so as to abut on the upper surface of the first plate member 131.

Further, the first locking portion 41 is arranged above the intermediate guide plate 130 and is wider than the intermediate guide hole 130a. Specifically, the first locking portion 41 is configured by a width W2 larger than the maximum width W1 (diameter) of the intermediate guide hole 130a, and functions as a stopper for preventing the main body portion 21 from moving downward. The term "wide" means that the maximum width (maximum length) in the XY plane parallel to the left-right direction X and the front-back direction Y is large.

The second locking portion 42 is arranged so as to abut on the lower surface of the intermediate guide plate 130. Specifically, the second locking portion 42 is arranged so as to abut on the lower surface of the second plate member 132.

The second locking portion 42 is arranged below the intermediate guide plate 130 and is wider than the intermediate guide hole 130a. Specifically, the second locking portion 42 is configured to have a width W2 larger than the maximum width W1 of the intermediate guide hole 130a, and functions as a stopper for preventing the main body portion 21 from moving upward.

In this way, the first locking portion 41 and the second locking portion 42 lock the main body portion 21 from above and below the intermediate guide plate 130, so that the main body portion 21 is fixed to the intermediate guide plate 130. To.

The first locking portion 41 and the second locking portion 42 both have a cylindrical shape or an elliptical pillar shape. For example, when the first locking portion 41 and the second locking portion 42 have an elliptical pillar shape, the width W2 of the first locking portion 41 and the width W2 of the second locking portion 42 are the width W2 of the main body portion 21. The maximum width in the radial direction orthogonal to the axial direction, that is, the major axis of the elliptical column shape is shown.

Further, the width W2 of the first locking portion 41 and the width W2 of the second locking portion 42 do not necessarily have to be the same, and may be different as long as they are larger than the maximum width W1 of the intermediate guide hole 130a. ..

Here, in the intermediate guide plate 130, in the left-right direction X, the first opening hole 131a of the first plate member 131 opens wider than the locking portion 40, and the second opening hole of the second plate member 132. 132a also opens wider than the locking portion 40.

Further, by moving at least one of the first plate member 131 and the second plate member 132 in the left-right direction X, a part of the first opening hole 131a and a part of the second opening hole 132a overlap each other. It is formed as an intermediate guide hole 130a narrower than the width W2 of the first locking portion 41 and the second locking portion 42. The term "narrow" means that the maximum width (maximum length) in the XY plane parallel to the left-right direction X and the front-back direction Y is small.

<Manufacturing method of electrical connection device>
Next, a method of manufacturing the electrical connection device 1 according to the first embodiment will be described. Specifically, a manufacturing method for manufacturing the probe support 18 by inserting the probe 20 through the upper guide plate 110, the intermediate guide plate 130, and the lower guide plate 120 will be described. The manufacturing method includes a insertion step, a hole forming step, and a bending step.

Here, FIGS. 4A to 4B are conceptual diagrams for explaining the insertion process. 5 (a) to 5 (b) are conceptual diagrams for explaining the hole forming process. 4 (a) and 5 (a) are schematic cross-sectional views, and FIGS. 4 (b) and 5 (b) are schematic plan views.

First, in the insertion step, the positions (XY) of the upper guide hole 110a of the upper guide plate 110, the intermediate guide hole 130a of the intermediate guide plate 130, and the lower guide hole 120a of the lower guide plate 120 in the left-right direction X and the front-rear direction Y (XY). Align the position on the plane).

At this time, in the intermediate guide plate 130, the position of the first plate member 131 and the position of the second plate member 132 are adjusted so that the position of the first opening hole 131a and the position of the second opening hole 132a are aligned. ..

Specifically, as shown in FIGS. 4A to 4B, the positions (positions on the XY plane) of the first opening hole 131a and the second opening hole 132a in the left-right direction X and the front-back direction Y are aligned. To do. As a result, the width W0 of the intermediate guide hole 130a formed by the first opening hole 131a and the second opening hole 132a becomes larger than the width W2 of the first locking portion 41 and the second locking portion 42.

Then, the probe 20 is inserted into the upper guide hole 110a, the lower guide hole 120a, and the intermediate guide hole 130a while being parallel to the axial direction CL of the main body 21 of the probe 20 and the vertical direction Z. At this time, as shown in FIGS. 4A to 4B, an intermediate guide hole 130a is arranged between the first locking portion 41 and the second locking portion 42 in the vertical direction Z.

Next, in the hole forming step, at least one of the first plate member 131 and the second plate member 132 is moved in the left-right direction X to form a part of the first opening hole 131a and a part of the second opening hole 132a. The overlapping portion is formed as an intermediate guide hole 130a narrower than the width W2 of the first locking portion 41 and the second locking portion 42.

For example, as shown in FIGS. 5A to 5B, the first plate member 131 is moved to the right and the second plate member 132 is moved to the left. Then, the overlapping portion of the part of the first opening hole 131a and the part of the second opening hole 132a is formed as the intermediate guide hole 130a. At this time, the first plate member 131 and the second plate member 132 are moved in the left-right direction so that the maximum width W1 of the intermediate guide hole 130a is smaller than the width W2 of the first locking portion 41 and the second locking portion 42. Move to X.

In the hole forming step, the first plate member 131 and the second plate member 132 may be moved so as to come into contact with the main body 21 of the probe 20. That is, the main body 21 of the probe 20 may be sandwiched between the first plate member 131 and the second plate member 132.

Next, in the bending forming step, the positions of the upper guide plate 110, the intermediate guide plate 130, and the lower guide plate 120 in the left-right direction X are different, and the first bending portion 20x and the second bending portion 20x and the second bending portion 20x are placed on the main body portion 21 of the probe 20. A portion 20y is formed.

For example, as shown in FIG. 2, the upper guide plate 110 is moved to the left and the lower guide plate 120 is moved to the right with reference to the intermediate guide plate 130, so that the main body 21 of the probe 20 is first moved. The curved portion 20x and the second curved portion 20y may be formed.

Alternatively, the upper guide plate 110 and the lower guide plate 120 are moved to one of the left-right directions (for example, to the right) with the intermediate guide plate 130 as a reference, and the first curved portion 20x and the first curved portion 20x are moved to the main body portion 21 of the probe 20. 2 The curved portion 20y may be formed.

In this way, the probe support 18 is manufactured. After that, the probe support 18 is connected to the probe substrate 16 to manufacture the electrical connection device 1, but detailed description thereof will be omitted.

<Action and effect of Embodiment 1>
As described above, the electrical connection device 1 according to the first embodiment of the present invention includes the upper guide plate 110, the intermediate guide plate 130, the lower guide plate 120, the upper guide plate 110, the intermediate guide plate 130, and the lower guide. A probe 20 to be inserted through the plate 120 is provided. Further, the probe 20 includes a linear main body portion 21 and a locking portion 40 that locks the movement of the main body portion 21 in the vertical direction Z on the intermediate guide plate 130. The intermediate guide plate 130 has a first plate member 131 in which the first opening hole 131a is formed, and a second plate member 132 in which the first plate member 131 is laminated and the second opening hole 132a is formed. At least one of the first plate member 131 and the second plate member 132 is configured to be movable in the left-right direction X. Further, the intermediate guide hole 130a of the intermediate guide plate 130 is formed to be narrower than the locking portion 40 as an overlapping portion of a part of the first opening hole 131a and a part of the second opening hole 132a.

As a result, the locking portion 40 can lock the movement of the probe 20 in the vertical direction Z on the intermediate guide plate 130, so that the pressing force acting on the tip portion 20a of the probe 20 is applied to the base end portion 20b of the probe 20. The transmission can be suppressed, and the pressing force acting on the base end portion 20b of the probe 20 can be suppressed from being transmitted to the tip end portion 20a of the probe 20. That is, it is possible to suppress the pressing force acting on one of both ends of the probe 20 from affecting the other.

Further, since it is possible to adjust the height of the tip portion 20a of the probe 20 and the height of the base end portion 20b of the probe 20 so as to be aligned separately, the height position of the tip portions 20a of the plurality of probes 20 and the height position of the tip portions 20a of the plurality of probes 20 can be adjusted. , The height positions of the base end portions 20b of the plurality of probes 20 can be easily aligned.

As a result, the contact pressure acting between the electrode pad 14a of the semiconductor wafer 14 and the tip portion 20a of the probe 20 can be made uniform, so that contact failure of the probe 20 due to variation in contact pressure during overdrive can be suppressed. be able to. Further, since the contact pressure acting between the connection pad 16c of the probe substrate 16 and the base end portion 20b of the probe 20 can be made uniform, it is possible to suppress the contact failure of the probe 20 due to the variation of the contact pressure at the time of preloading. Can be done.

Further, in the electrical connection device 1 according to the first embodiment of the present invention, the locking portion 40 is located above the intermediate guide plate 130 and below the first locking portion 41 and the intermediate guide plate 130. It includes a second locking portion 42 to be arranged.

As a result, the first locking portion 41 prevents the probe 20 from moving downward from the main body 21 and the second locking portion 42 prevents the probe 20 from moving upward from the main body 21. The movement of the main body 21 of 20 in the vertical direction Z can be prevented more reliably. That is, it is possible to more reliably suppress the pressing force acting on one of both ends of the probe 20 from affecting the other.

Further, in the electrical connection device 1 according to the first embodiment of the present invention, the probe 20 has a curved portion (first curved portion 20x and second curved portion 20y) that is curved between the upper guide plate 110 and the lower guide plate 120. ). As a result, when an upward pressing force is applied to the tip portion 20a of the probe 20 or a downward pressing force is applied to the proximal end portion 20b of the probe 20, the curved portion is elastically deformed. Generates an appropriate repulsive force. This repulsive force acts as a contact pressure at the time of preload and a contact pressure at the time of overdrive, and suppresses a contact failure of the probe 20 at the time of preload and a contact failure of the probe 20 at the time of overdrive.

Further, in the electrical connection device 1 according to the first embodiment of the present invention, in the intermediate guide plate 130, at least one of the first plate member 131 and the second plate member 132 is configured to be movable in the left-right direction X. ..

As a result, if at least one of the first plate member 131 and the second plate member 132 is moved in the left-right direction X, a part of the first opening hole 131a and a part of the second opening hole 132a can be overlapped with each other. The width of the intermediate guide hole 130a formed can be adjusted. Therefore, at the time of manufacturing the electrical connection device 1, the intermediate guide plate 130 can be easily arranged between the first locking portion 41 and the second locking portion 42, and the intermediate guide hole 130a of the intermediate guide plate 130 can be easily arranged. The maximum width W1 of the above can be easily made smaller than the width W2 of the first locking portion 41 and the width W2 of the second locking portion 42. Therefore, the productivity of the electrical connection device 1 can be increased.

[Other Embodiments of the present invention]
Although the present invention has been described in detail using the above-described embodiments, it is clear to those skilled in the art that the present invention is not limited to the embodiments described in the present specification.

For example, in the above-described embodiment, the locking portion 40 has been described by exemplifying a case where the first locking portion 41 and the second locking portion 42 are separated from each other, but the present invention is not limited to this. .. As shown in FIG. 6, the locking portion 40 may further include a connecting portion 43 that connects the first locking portion 41 and the second locking portion 42.

That is, the locking portion 40 may be integrally configured by the first locking portion 41, the second locking portion 42, and the connecting portion 43. Further, the width of the connecting portion 43 is configured to be smaller than the width W2 of the first locking portion 41 and the width W2 of the second locking portion 42.

Therefore, as shown in FIG. 6, the locking portion 40 has a constricted shape (so-called gourd shape) in which the width of the connecting portion 43 connecting the first locking portion 41 and the second locking portion 42 is narrowed. .. In this way, since the locking portion 40 includes the connecting portion 43, the first locking portion 41 and the second locking portion 42 are connected to each other, so that the first locking portion 41 and the second locking portion 42 are connected. Since the strength of the probe 20 is increased, the movement of the main body 21 of the probe 20 in the vertical direction Z can be prevented more reliably.

Further, for example, in the above-described embodiment, the shape of the locking portion 40 has been described by taking the case of a cylindrical shape or an elliptical column shape as an example, but it may be a polygonal column shape, for example, a square column shape. Or a hexagonal column shape may be used. As described above, various shapes can be applied as long as the shape of the locking portion 40 is wider than the maximum width W1 of the intermediate guide hole 130a.

Further, for example, as shown in FIG. 7, the first locking portion 41 has a first contact surface 41a that abuts on the intermediate guide plate 130, and the second locking portion 42 hits the intermediate guide plate 130. It may have a second contact surface 42a in contact. The first contact surface 41a and the second contact surface 42a may be configured to be inclined with respect to the axial direction of the main body 21 of the probe 20.

As a result, the main body 21 of the probe 20 is more likely to be tilted as compared with the case where the first contact surface 41a and the second contact surface 42a are orthogonal to the axial direction of the main body 21, so that the probe 20 can be tilted. The first curved portion 20x and the second curved portion 20y can be easily formed on the main body portion 21.

Further, as shown in FIG. 7, the first locking portion 41 contacts the intermediate guide plate 130 in a wider range on the first contact surface 41a, and the second locking portion 42 also abuts on the second contact surface 42a. It abuts on the intermediate guide plate 130 in a wider range.

As a result, the first locking portion 41 more reliably prevents the probe 20 from moving downward, and the second locking portion 42 more reliably moves the probe 20 upward from the main body 21. Therefore, the movement of the main body 21 of the probe 20 in the vertical direction Z can be locked more reliably. The separation distance between the first contact surface 41a and the second contact surface 42a is preferably set to be equal to the thickness of the intermediate guide plate 130 in the vertical direction Z.

Further, in the above-described embodiment, the locking portion 40 is formed by fixing the locking member to the main body portion 21, but the locking portion 40 is not limited to this. The locking portion 40 may be formed by thickening a part of the main body portion 21.

In this case, since the locking portion 40 can be formed by a part of the main body portion 21, the manufacturing cost can be suppressed as compared with the case where the locking portion 40 is formed by a locking member different from the main body portion 21. The locking portion 40 may be formed by melting a part of the main body portion 21 or by crushing a part of the main body portion 21.

Further, in the above-described embodiment, the case where the intermediate guide plate 130 is composed of two plates, the first plate member 131 and the second plate member 132, has been described as an example, but the present invention is not limited to this. The intermediate guide plate 130 may be composed of three or more plate members having an opening hole wider than the locking portion 40.

For example, as shown in FIG. 8, the intermediate guide plate 130 may have three plates, a first plate member 131, a second plate member 132, and a third plate member 133. The third plate member 133 is laminated on the second plate member 132. In this case, the third plate member 133 is formed with a third opening hole 133a that opens wider than the locking portion 40 in the left-right direction X. Further, in the intermediate guide plate 130 shown in FIG. 8, at least one of the first plate member 131, the second plate member 132, and the third plate member 133 is configured to be movable in the left-right direction X. The intermediate guide hole 130a is formed to be narrower than the locking portion 40 as an overlapping portion of a part of the first opening hole 131a, a part of the second opening hole 132a, and a part of the third opening hole 133a. To.

Further, in the above-described embodiment, the case where the electrical connection device 1 is a vertically operating probe card has been described as an example, but the present invention is not limited to this, and is applicable to probe cards having various types of needle shapes. it can.

Further, in the above-described embodiment, the case where the electrical connection device 1 includes the probe substrate 16 and the probe support 18 has been described as an example, but the probe substrate 16 does not necessarily have to be provided. That is, the electrical connection device 1 may be configured to include only the probe support 18.

As described above, the present invention is not limited to the above-described embodiment as it is, and at the implementation stage, the components can be modified and embodied within a range that does not deviate from the gist thereof. In addition, various inventions can be formed by an appropriate combination of the plurality of components disclosed in the above-described embodiment. For example, some components may be removed from all the components shown in the embodiments.

1 Electrical connection device 14 Semiconductor wafer 14a Electrode pad 16 Probe substrate 18 Probe support 20 Probe 20a Tip 20b Base end 21 Main body 40 Locking part 41 First locking part 42 Second locking part 100 Guide plate 110 Upper guide plate 110a Upper guide hole 120 Lower guide plate 120a Lower guide hole 130 Intermediate guide plate 130a Intermediate guide hole 131 First plate member 131a First opening hole 132 Second plate member 132a Second opening hole

Claims (4)

An intermediate guide plate with an intermediate guide hole that penetrates in the vertical direction,
The probe inserted into the intermediate guide hole and
It is an electrical connection device equipped with
The probe includes a main body portion formed in a rod shape with a substantially uniform diameter from the tip end portion to the base end portion, and a locking portion that locks the movement of the main body portion in the vertical direction in the intermediate guide plate.
The intermediate guide plate has a first plate member in which a first opening hole is formed and a second plate member in which a second opening hole is formed and laminated on the first plate member.
At least one of the first plate member and the second plate member is configured to be movable in the left-right direction orthogonal to the up-down direction.
The intermediate guide hole is formed narrower than the locking portion as an overlapping portion in the left-right direction of a part of the first opening hole and a part of the second opening hole.
The locking portion is an electrical connection device characterized by being formed by a locking member fixed to the main body portion. An upper guide plate arranged above the intermediate guide plate at intervals and having an upper guide hole penetrating in the vertical direction, and an upper guide plate.
A lower guide plate, which is arranged at a space below the intermediate guide plate and has a lower guide hole penetrating in the vertical direction, is provided.
Claim 1 is characterized in that the probe is inserted through the upper guide hole, the intermediate guide hole, and the lower guide hole, and has a curved portion that is curved between the upper guide plate and the lower guide plate. The electrical connection device described. The intermediate guide plate has a third plate member laminated on the second plate member, in which a third opening hole that opens wider than the locking portion is formed.
At least one of the first plate member, the second plate member, and the third plate member is configured to be movable in the horizontal direction orthogonal to the vertical direction.
The intermediate guide hole is narrower than the locking portion as a part of the first opening hole, a part of the second opening hole, and a part of the third opening hole as overlapping parts in the left-right direction. The electrical connection device according to any one of claims 1 and 2, wherein the electric connection device is formed. The method for manufacturing an electrical connection device according to claim 1.
The probe is inserted into the intermediate guide hole, and the intermediate guide hole is arranged between the first locking portion provided above and the second locking portion provided below the locking portion. Process and
At least one of the first plate member and the second plate member is moved in the left-right direction orthogonal to the vertical direction to form an overlapping portion between a part of the first opening hole and a part of the second opening hole. A method for manufacturing an electrical connection device, which comprises a step of forming the first locking portion and the intermediate guide hole narrower than the width of the second locking portion.

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