JP2013167001A - Vacuum deposition system and vacuum deposition method - Google Patents

Abstract

A system and method for reducing material loss in a vacuum deposition system in which a vacuum transfer chamber and a vacuum deposition chamber are arranged in series are provided.
Vacuum conveying chambers HA1 to HA3, HB1 to HB4 for horizontally conveying a workpiece W and vacuum deposition chambers CA, CB, and CC for depositing a deposition material on the workpiece are alternately arranged in series to form a plurality of vacuum depositions. In the vacuum deposition system 100 composed of lines LA and LB having chambers, N (N is 2 or more) lines are provided in parallel with each other, and the vacuum deposition chamber is provided with N lines straddling the N lines. The N-line vacuum deposition chamber has a deposition position for depositing a work for each line, and the first line is the first line during the deposition of the first work among the N lines. The second workpiece is carried out to the downstream vacuum transfer chamber on another different line, and the third workpiece is carried from the upstream vacuum transfer chamber.
[Selection] Figure 1

Description

  The present invention relates to a vacuum vapor deposition system and a vacuum vapor deposition method having a plurality of vacuum vapor deposition chambers arranged in series and a vacuum conveyance chamber for conveying a workpiece for vapor deposition between the mounting chambers in series. The present invention relates to a vacuum deposition system and a vacuum deposition method suitable for manufacturing.

  There is a vacuum deposition method in which organic EL or the like is deposited on a workpiece such as a vacuum substrate. In a general vacuum deposition method, in order to maintain stable deposition, it is necessary to control the material evaporation rate from the evaporation source so as to be kept constant. When physical vapor deposition (PVC) is performed by heating the vapor deposition material using a method such as resistance heating or induction heating, a certain amount of time is required to stabilize the evaporation rate, and it is necessary to constantly evaporate while keeping the material evaporation rate constant. is there. For this reason, when the workpieces are put into the vacuum deposition chamber one by one and processed, the material that evaporates from the evaporation source while the workpiece is unloaded after the workpiece is deposited and the new workpiece is loaded is the deposition process. It was a material loss as it was.

  As a method for solving the problem of reducing the material loss, there is Patent Document 1. Patent Document 1 discloses a method of carrying in, carrying out, and depositing two workpieces alternately in the vacuum deposition chamber in a cluster type vacuum deposition system in which a vacuum deposition chamber is provided around a vacuum transfer chamber. Yes.

JP 2008-227477 A

  However, even in a vacuum deposition system in which a vacuum transfer chamber and a vacuum deposition chamber are arranged in series as shown in FIG. 1, it is desired to reduce material loss when a workpiece is loaded.

  Accordingly, an object of the present invention is to provide an economical vacuum deposition system and a vacuum deposition method that can reduce material loss in a vacuum deposition system in which a vacuum transfer chamber and a vacuum deposition chamber are arranged in series.

In order to achieve the above object, the present invention has at least the following features.
The present invention provides a vacuum deposition system comprising a plurality of vacuum deposition chambers in which vacuum conveyance chambers for horizontally conveying a workpiece and vacuum deposition chambers for depositing a deposition material on the workpiece are alternately arranged in series. The N lines (N is 2 or more) are provided in parallel with each other, and the vacuum deposition chamber is an N line vacuum deposition chamber provided across the N lines, and the N line vacuum deposition chamber Has a deposition position for depositing a workpiece for each line, and during the deposition of the first workpiece on the first line among the N lines, the second on another line different from the first line. The first feature is that the work is carried out to the vacuum transfer chamber on the downstream side, and the third work is carried in from the vacuum transfer chamber on the upstream side.

  In the present invention, a vacuum transfer chamber for horizontally transferring a workpiece and a vacuum evaporation chamber for depositing a deposition material on the workpiece are alternately arranged in series, and a plurality of lines having the vacuum deposition chambers are arranged in parallel with each other. N (N is 2 or more) lines, wherein the vacuum deposition chamber deposits the workpiece in an N line vacuum deposition chamber provided across the N lines. During the deposition of the first workpiece on one line, the second workpiece is carried out to the vacuum transfer chamber on the downstream side in another line different from the first line, and the third workpiece is placed on the upstream side. Carrying in from the said vacuum conveyance chamber makes it 2nd characteristic.

Further, N may be 2, and the other line may be a second line.
The vacuum transfer chamber may have a feed mechanism having a multistage linear motion shaft that expands and contracts back and forth in the transfer direction of the workpiece.

Furthermore, the work may be carried out from the upstream N line vacuum vapor deposition chamber or load chamber, and the work may be carried into the downstream N line vacuum vapor deposition chamber or unload chamber.
The carry-in or carry-out may be performed via a delivery mechanism that is provided above the vapor deposition position and moves up and down between the vapor deposition position and the carry-in / out position.

Further, the N-line vacuum deposition chamber may have evaporation source driving means for moving the evaporation source two-dimensionally in a region below the deposition position.
Further, the vacuum part of the vacuum transfer chamber may be provided at a position higher than the vapor deposition position, and the N line vacuum vapor deposition chamber may have a structure protruding below the vacuum part of the vacuum transfer chamber.

Further, each of the vacuum transfer chambers is an N-line vacuum transfer chamber provided across the N lines, and the N-line vacuum transfer chamber is a means for moving the feed mechanism between the N lines, or a single horizontal line. An articulated transfer robot may be included.
The vacuum transfer chamber may transfer only the workpiece or the workpiece integrated with a workpiece transfer body or mask that holds the workpiece.

  ADVANTAGE OF THE INVENTION According to this invention, in the vacuum evaporation system which arrange | positions a vacuum conveyance chamber and a vacuum evaporation chamber in series, the economical vacuum evaporation system and vacuum evaporation method which can reduce material loss can be provided.

It is a figure which shows the vacuum evaporation system in embodiment of this invention. It is a side view which shows the structure of a vacuum evaporation chamber and a vacuum conveyance chamber. It is explanatory drawing of the feed mechanism in a vacuum conveyance chamber. It is a figure which shows the structure of the evaporation source drive means which moves an evaporation source across two lines, and vapor-deposits the workpiece | work of two lines. It is a figure which shows the vapor deposition processing flow performed across two lines, and the operation | movement flow of an evaporation source. It is a figure which shows typically operation | movement of an evaporation source.

  An embodiment of the present invention will be described with reference to FIGS. FIG. 1 shows a vacuum deposition system 100 in an embodiment of the present invention. The vacuum deposition system 100 includes two parallel lines LA and LB, and a control device 40 that manages the whole and controls each unit. The vacuum deposition system 100 includes three vacuum deposition chambers CA, CB, and CC that straddle both lines, load chambers IA and IB that carry workpieces W into the respective lines, and unload that carries processed workpieces W from the respective lines. And chambers EA and EB. Further, the vacuum deposition system 100 is provided between each vacuum deposition chamber C (only C is shown as a representative), or between the load chambers IA and IB or the unload chambers EA and EB and the corresponding vacuum deposition chamber C. There are vacuum transfer chambers HA1 to HA4 and HB1 to HA4 (represented only as KA when representatively shown) having feed mechanisms (to be described later) for transferring the workpiece W. An arrow KA indicates the conveyance range of the workpiece W of each feed mechanism. For example, the arrow KA1 indicates the transport range of the feed mechanism of the vacuum transport chamber HA1. In addition, the small arrow shown to load chamber IA, IB and unload chamber EA, EB of each line shows the conveyance direction of the workpiece | work W. FIG. That is, the left side is the upstream side and the right side is the downstream side.

With this configuration, this embodiment can configure an apparatus for uniformly depositing the lower surface of the workpiece W. The same deposition material may be deposited between the vacuum deposition chambers C, or different deposition materials may be deposited. Further, the number of vacuum deposition chambers C is not limited to three but may be plural.
Further, a pre-process or a post-process may be connected instead of the load chamber or the unload chamber.

  FIG. 2 is a side view showing the structure of the vacuum deposition chamber C and the vacuum transfer chamber H (only H is shown as a representative), and is a view of HA2, CB and HA3 of the line LA as seen from the direction of the arrow D. FIG. Basically, the structures of the vacuum deposition chamber C and the vacuum transfer chamber H are the same, and therefore, the reference numerals indicating the locations of CB, HA2, HA3, etc. are not shown in each structure.

  The vacuum deposition chamber C is roughly divided into a delivery unit 2 that delivers a workpiece W to and from the feed mechanism F, and a deposition unit 1 that deposits a deposition material on the workpiece W. Further, the vacuum deposition chamber C includes a gate valve 10 provided between the cryopump 9 that maintains a predetermined degree of vacuum in the vacuum deposition chamber and the vacuum transfer chamber H. The gate valve is not necessarily provided in every vacuum transfer chamber H. At least the gate valves related to the lines LA and LB may be provided so as not to be open to the atmosphere. For example, a gate valve may be provided at the loading / unloading port of the vacuum transfer chamber or load chamber or unload chamber on the most upstream side and the most downstream side. In addition, the workpiece | work W is hold | maintained and conveyed by the workpiece conveyance body 4 which has the opening part for vapor deposition in a center part. Of course, you may convey a workpiece | work directly. In that case, it is desirable to hold the surface opposite to the vapor deposition surface.

  The delivery unit 2 receives the workpiece carrier 4 from the upstream feed mechanism F at the delivery position UP, moves to the vapor deposition position JP indicated by the broken line, returns to the original delivery position UP after vapor deposition, and returns to the downstream feed mechanism F. A delivery mechanism 20 for delivering the workpiece carrier 4 is provided. The delivery mechanism 20 shown in FIG. 2 is for the line LA, but there is a delivery mechanism 20 for the line LB having the same structure on the back side of the sheet.

  The delivery mechanism 20 has a delivery body 21 having an opening on the vapor deposition side, like the work transport body 4, and four tips of the delivery body 21 (only two corners are shown in FIG. 2). And a support rod 22 that moves in a sheath 23 provided through an upper vacuum seal 25. The delivery body 21 is moved up and down by a ball screw shaft 25b whose tip is fixed at the center of two opposite sides (only one side is shown in FIG. 2). At this time, the ball screw shaft 25b is driven by a nut 25n that is driven by a magnetic fluid seal (not shown) to drive the motor, and moves within the sheath 24.

Next, before describing the vapor deposition section 1, the feed mechanism F in the vacuum transfer chamber H will be described with reference to FIG. 3A shows a neutral state in which the feed mechanism F is not extended at all, and FIG. 3B shows a state in which the feed mechanism F has moved to the rightmost side in the conveyance direction of the workpiece W and extended. The left side also moves and extends in the same manner as in FIG.
The feed mechanism F includes a moving base 31b, two orbital shafts 32 (only one on the paper side shown in FIG. 3) provided in parallel with the moving direction of the workpiece W on the moving base 31b, A one-stage linear motion shaft composed of a total of four linear motion bearings 33 (only two of the track shafts shown in FIG. 3 are shown) moving on a drive shaft 32 that is a predetermined position X away from both ends. The linear motion bearing 33 is fixed to the upper movement base 31b to have a multi-stage linear motion shaft. A portion on which the workpiece transfer body 4 of the uppermost linear motion shaft is placed is called a table 34, and the fixed base 31 a is fixed to the bottom of the vacuum transfer chamber H.

  FIG. 3B shows a state in which the linear motion bearings 33 of the respective stages of the feed mechanism F configured as described above are moved to the right side, and FIG. 3B shows the most contracted state. FIG. The feed mechanism can transport the workpiece W within the range of the arrow KA shown in FIG.

In FIG. 2, the center distance in the transfer direction between the vacuum transfer chamber H and the vacuum deposition chamber C, that is, the work transfer distance on one side is KA / 2. When the length L of the fixed base 31a and the moving base 31b in FIG. 3 is L = KA / 2, and the width of the linear motion bearing 33 supporting the table 34 is L / 2, the track shaft 32 and the linear motion bearing 33 The one-side movement amount X for one axis of the linear motion guide 35 is equal to L / 4. Since the necessary one-side stroke of the feed mechanism F only needs to be equal to or longer than the transport distance KA / 2 = L, the number of necessary linear motion guides 35 is four. Considering that the gate valve 10 exists between the chambers and that some gap is required between the inner wall and the mechanism of each chamber, the length L of the fixed base 31a and the moving base 31b is set to L = 2 / If the width of the linear motion bearing 33 supporting the table 34 is L / 2, then X = L / 4 = 1/10 KA and the transport distance is KA / 2. do it.
FIG. 2 shows a three-stage arm feed mechanism F in order to avoid the complexity of the drawing. The feed mechanism F is specifically driven by, for example, arranging a link mechanism so that each stage of the moving base 31b and the table 34 move the same distance if the lowermost moving base 31b moves. Further, a ball screw is installed on the fixed base 31a, and a rotational drive such as a motor is introduced from the outside of the chamber to be transmitted to the ball screw. By fixing the ball screw nut to the lowermost moving base 31b, each moving base 31b and the table 34 can move at a constant speed. As a result, the absolute movement distance of the table 34 is (N + 1) times greater than the movement distance X of the lowermost movement base 31b according to the number N of movement bases 31b.

  Next, returning to FIG. 2, the vapor deposition section 1 will be described. The vapor deposition section 1 is provided at a vapor deposition position JP with a two-link hollow arm mechanism 51 for connecting wiring / piping and the like for supplying various utilities to the moving evaporation source 71 without being exposed in vacuum. And an adhesion preventing plate 11. The moving end side of the hollow arm mechanism 51 is connected to the atmospheric box 51k, and the fixed side is fixed to the bottom wall of the vacuum deposition chamber C via a vacuum seal 51s. The evaporation source 71 is fixed to the atmospheric box 51k. The connecting portions of the atmospheric box 51k and the two links 51a and 51b are vacuum-sealed so as to be rotatable, and the inside of them is an atmospheric atmosphere. Therefore, the piping such as a power supply line and a signal line necessary for the evaporation source 71 is isolated from the vacuum atmosphere, and it is possible to prevent the outgas from the wiring and the resin piping that adversely affect the vapor deposition from being released into the vacuum. Highly vapor deposition can be performed.

  As shown in FIG. 2, the vacuum part Hp of the vacuum transfer chamber H is provided at a position higher than the deposition position JP, and a delivery mechanism 20 that can move the workpiece up and down from the deposition position is provided in the delivery part 2. The length in the transport direction is shortened. As a result, the length of the vacuum deposition chamber C in the transport direction can be shortened, the stroke of the feed mechanism F can be shortened, and the length of the vacuum transport chamber H in the transport direction can be shortened. The vacuum transfer chamber H may have an accessory such as a cryopump (not shown), and the portion may be provided at a position lower than the deposition position JP, such as between the deposition sections 1 of the vacuum deposition chamber C.

  On the other hand, in the vapor deposition part 1, the area | region where the evaporation source 71 which exists under the vapor deposition position JP moves two-dimensionally is made into the protrusion structure which protruded to the lower part of the vacuum conveyance chamber H. FIG. As a result, it is possible to provide the projecting structure with a standby region when no vapor deposition is performed. In the present embodiment, the cryopump 9 is also provided below the vacuum transfer chamber H.

  As a result, according to the present embodiment, the line lengths of the lines LA and LB of the vacuum deposition system 100 shown in FIG. 1 can be shortened.

  FIG. 4 is a diagram showing the structure of the evaporation source driving means that moves across the lines LA and LB of the evaporation source 71 and deposits the workpieces W of the two lines LA and LB. 4A is a plan cross-sectional view of the chamber C viewed from the vapor deposition surface of the workpiece W, and FIG. 4B is a front cross-sectional view cut so that the inside can be seen from the lower side of FIG. . The evaporation source driving means includes an AB interline moving means 60 for moving the evaporation source and wiring piping section 72 between the lines LA and LB, and an in-line scanning means 80 for scanning the evaporation source 71 within the lines LA and LB.

  First, the AB line moving means 60 will be described. The AB line moving means 60 has a function of moving the atmospheric box 51k on which the evaporation source 71 is mounted up and down as shown in FIG. 4A to move to the vapor deposition scanning line where the workpiece WA or WB is present.

  In order to fulfill the above-mentioned role, the AB line moving means 60 includes an AB line moving table 62 supported by an AB line moving linear guide 61 fixed to the chamber bottom 1a, and the AB line moving table between the AB lines. The roller-type rack and pinion 65 including a roller pinion 65p and a rack 65r for converting the rotational motion into a linear motion for movement in the above-described manner, the AB-line inter-line drive transmission unit 64 for transmitting the drive to the pinion, The drive transmission section has a drive introduction section 63 for introducing rotational motion from the outside of the chamber C, that is, from the atmosphere side. As the roller pinion 65p rotates, the AB line moving table 62 to which the rack 65r is fixed moves linearly as guided by the AB line moving linear guide 61.

  The AB line moving motor 63m is installed outside the vacuum deposition chamber in order to suppress heat generation and dust generation in the vacuum deposition chamber C. Therefore, the rotation of the AB line drive motor 63m is transmitted to the AB line drive transmission section 64 in a vacuum atmosphere, and the magnetic fluid seal 63s capable of sealing the vacuum is connected to the magnetic fluid seal and the AB line drive motor 63m. In addition, a coupling 63c that absorbs misalignment and declination during assembly is required. The AB line drive transmission unit 64 connects the magnetic fluid seal 63s and the pinion shaft 64s, and is a rotating shaft of the coupling 64c and the roller pinion 65p that absorbs misalignment and declination during assembly. The bearing 64b supports the pinion shaft 64s.

On the other hand, the in-line scanning means 80 is installed inside the chamber C.
The in-line scanning means 80 includes an in-line scanning linear motion guide 81 installed on the AB inter-line movement table 62 for linearly guiding the atmospheric box 51k, and an in-line installed in the atmospheric atmosphere inside the atmospheric box 51k. An in-line drive comprising a drive motor 82m, a magnetic fluid seal 82s that is a rotary seal for vacuum, and a coupling 82c that connects the in-line drive motor and the magnetic fluid seal and absorbs misalignment and declination during assembly. It has an introduction part 82, a roller pinion 83p for converting from a rotational motion to a linear motion, and a roller rack and pinion 83 comprising a rack 83r.

  The movement relationship by converting the rotational movement of the roller pinion 83p and the rack 83r of the in-line scanning means 80 into a linear movement is relatively opposite to that of the AB line moving means 60, and the rack 83r moves between the AB lines. The roller pinion 83p rotates and moves while being fixed to the table. In other words, the atmospheric box 51k and the evaporation source 71 are scanned by being guided by the in-line scanning linear motion guide 81 while holding the in-line drive introducing portion 82, and moving by themselves.

  In the above embodiment, the case of having two lines has been described. For example, in FIG. 4A, the chamber is expanded in the moving direction, and the AB line drive introducing portion 63, the AB line drive transmission portion 64, and the roller pinion 65p are set in accordance with the stroke of the AB line moving table 62. By adding the above to an appropriate position, a vacuum deposition chamber extending over three or more lines can be configured.

Next, the vapor deposition processing flow in the embodiment will be described with reference to FIG. FIG. 5 shows an evaporation process flow performed across the lines LA and LB and an operation flow of the evaporation source 71. FIG. 6 is a diagram schematically showing the operation of the evaporation source 71 at this time. The solid line or broken line of the two-link hollow arm mechanism 51 in FIG. 6 indicates the posture at the right end or the left end of the lines LA and LB.
The processing or operation of each vacuum vapor deposition chamber C and each vacuum transfer chamber H constituting each line described below is performed in synchronism with each line.

In the vapor deposition processing flow shown in FIG. 5, the evaporation source 71 finishes vapor deposition of the work WB in the line LB, goes to the left end of the LB line, and in the line LA, the work WA is already set at the vapor deposition position JP of each vacuum vapor deposition chamber and is on standby. It is shown from the state (AS0, BS0, JS0) that is in progress.
First, the evaporation source 71 moves from the left end of the line LB to the left end of the line LA as indicated by an arrow J1 in FIG. At this time, on the line LB, the work WB is raised to the delivery position UP (BS1), and unloading to the downstream vacuum transfer chamber H is started. After moving to the left end of the line LA, the evaporation source 71 moves the lower surface of the work WA on the line LA from the left to the right (arrow J2 in FIG. 6) and returns to the left end again (arrow J3 in FIG. 6). As the operation of the evaporation source 71 is performed once to several times, the workpiece WA is deposited on the line LA (AS1).

  On the other hand, in the line LB, the work WB unloading operation is continued during the deposition of the line LA even after the BS1 described above. That is, the work WB is unloaded from the vacuum deposition chamber C to the downstream vacuum transfer chamber H by the downstream feed mechanism F (BS2). Thereafter, a new workpiece WB is carried from the upstream side vacuum transfer chamber H to the delivery position UP of the vacuum deposition chamber C by the upstream side feed mechanism F (BS3). Then, in some cases, after performing an operation such as positioning (BS4), the robot descends to the deposition position JP, sets a new work WB, and waits until the deposition of the line LA is completed (BS5).

Next, when the vapor deposition is completed in the line LA, the evaporation source 71 moves from the left end of the line LA to the left end of the line LB (JS3) as shown by an arrow J4 in FIG. As indicated by arrows J5 and J6, the bottom surface of the work B in the line LB is reciprocated once to several times (JS4) to deposit the work WB (BS6). During this time, in the line LA, the processing shown in steps BS1 to BS5 of the line LB is performed in steps AS2 to AS6.
Thereafter, the above steps are repeated.

  In the above description, the movement between the AB lines is performed on the left end side, but may be performed on the right end side as indicated by arrows J7 and J8 indicated by two-dot chain lines. Further, the scanning of the lower surface of the workpiece was reciprocated once to several times, but without reciprocating, one or more one-way scannings by a loop of arrows J1, J2, J8, J6 or J4, J5, J8, J3 were performed. You may go round.

  According to the present embodiment described above, in each vacuum deposition chamber, while the work is deposited on one line, the work deposited on the other line is carried out, and a new work is carried on, thereby the deposition process. Therefore, it is possible to provide a vapor deposition line or a vacuum vapor deposition method capable of reducing the material that has been lost without contributing to the above.

  In addition, according to the present embodiment described above, in comparison with the vapor deposition line constituted by two independent single lines, in each vacuum vapor deposition chamber, while the workpiece is vapor deposited on one line, the other line is By unloading the vapor-deposited workpiece and loading a new workpiece, it is possible to shorten the time during which the workpiece is not processed, and to provide a high-throughput vapor deposition line or vacuum vapor deposition method.

  In the above embodiment, the mask is not used, but the vapor deposition is uniformly performed on the work surface. However, the mask may be provided on the lower side at the vapor deposition position to perform pattern vapor deposition. In this case, a mechanism for aligning the mask and the workpiece relatively may be provided. For example, in the embodiment described above, alignment may be performed by relatively moving the delivery mechanism. Alternatively, the mask and the workpiece may be conveyed and vapor deposited.

  In the above embodiment, the feed mechanism is provided for each line. However, the vacuum transfer chamber is also provided across two lines similarly to the vacuum deposition chamber, and one feed mechanism is moved and shared between the lines. Also good.

  Furthermore, a vacuum transfer chamber is provided across two lines in the same way as the vacuum evaporation chamber, and a single horizontal articulated transfer robot that carries in and out the workpieces in the two lines at the center is used instead of the feed mechanism. May be provided.

DESCRIPTION OF SYMBOLS 1: Deposition part 2: Delivery part 4: Work conveyance body 9: Cryo pump 10: Gate valve 11: Deposit board 20: Delivery mechanism 40: Control apparatus 51: Two-link hollow arm mechanism 60: AB line moving means 71 : Evaporation source 80: In-line moving means 100: Vacuum deposition system C, CA, CB, CC: Vacuum deposition chamber EA, EB: Unload chamber F: Feed mechanism
H, HA1 to HA3, HB1 to HB4: Vacuum transfer chamber IA, IB: Load chamber W: Workpiece

Claims (14)

In a vacuum deposition system comprising a plurality of vacuum deposition chambers, wherein a vacuum conveyance chamber for horizontally conveying a workpiece and a vacuum deposition chamber for depositing a deposition material on the workpiece are alternately arranged in series.
N lines (N is 2 or more) are provided in parallel with the lines, and the vacuum deposition chamber is an N line vacuum deposition chamber provided across the N lines, and the N line vacuum deposition chamber is There is a deposition position for depositing a workpiece for each line, and during the deposition of the first workpiece on the first line of the N lines, the second workpiece on another line different from the first line. A vacuum deposition system, wherein the third workpiece is carried out from the vacuum transfer chamber on the upstream side and carried out to the vacuum transfer chamber on the downstream side.   The vacuum deposition system according to claim 1, wherein the N is 2 and the other line is a second line.   The vacuum transfer chamber has a feed mechanism having a multistage linear motion shaft that expands and contracts in the forward and backward directions in the workpiece transfer direction, and unloads the workpiece from the upstream N-line vacuum deposition chamber or load chamber. The vacuum deposition system according to claim 1, wherein the work is carried into the N line vacuum deposition chamber or the unload chamber.   The N-line vacuum deposition chamber has a delivery mechanism for delivering the workpiece above the deposition position, and the delivery mechanism has lifting means for raising and lowering the workpiece. The vacuum deposition system described.   The vacuum deposition system according to claim 1 or 2, wherein the N-line vacuum deposition chamber has evaporation source driving means for moving the evaporation source two-dimensionally in a region below the deposition position.   The vacuum unit of the vacuum transfer chamber is provided at a position higher than the deposition position, and the N-line vacuum deposition chamber has a structure protruding below the vacuum unit of the vacuum transfer chamber. The vacuum deposition system described in 1.   Each of the vacuum transfer chambers is an N-line vacuum transfer chamber provided across the N lines, and the N-line vacuum transfer chamber has means for moving the feed mechanism between the N lines. Item 4. The vacuum evaporation system according to Item 3.   Each of the vacuum transfer chambers is an N-line vacuum transfer chamber provided across the N line, the N-line vacuum transfer chamber has one horizontal articulated transfer robot, and the transfer robot 3. The work according to claim 1, wherein the workpiece is unloaded from the N line vacuum deposition chamber or load chamber on the side, and the work is loaded into the N line vacuum deposition chamber or unload chamber on the downstream side. Vacuum deposition system.   The vacuum deposition system according to claim 1, wherein the vacuum transfer chamber transfers only the work or the work integrated with a work transfer body or a mask that holds the work. A vacuum transfer chamber for transferring a workpiece horizontally and a vacuum evaporation chamber for depositing a deposition material on the workpiece are alternately arranged in series, and a line having a plurality of the vacuum evaporation chambers is arranged in parallel with each other. In the vacuum deposition method of depositing the workpiece in each N line vacuum deposition chamber provided across the vacuum deposition chamber of the N line,
During the deposition of the first workpiece on the first line among the N lines, the second workpiece is carried out to the vacuum transfer chamber on the downstream side by another line different from the first line, and a third The work is carried in from the vacuum transfer chamber on the upstream side.   The vacuum deposition method according to claim 10, wherein the N is 2 and the other line is a second line.   12. The work according to claim 10, wherein the work is unloaded from the N-line vacuum deposition chamber or load chamber on the upstream side, and the work is loaded into the N-line vacuum deposition chamber or unload chamber on the downstream side. Vacuum deposition method.   The vacuum deposition method according to claim 10 or 11, wherein the carry-in or carry-out is performed via a delivery mechanism that is provided above the vapor deposition position and moves up and down between the vapor deposition position and the carry-in / out position. .   The vacuum deposition method according to claim 10 or 11, wherein the vacuum transfer chamber transfers only the workpiece or the workpiece integrated with a workpiece transfer body or a mask that holds the workpiece.

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