JP2013078757A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method for forming a line on the substrate and solidifying the same.SOLUTION: The substrate processing apparatus 100 includes: a stage 1100 for placing the substrate S; a discharge unit 1200 discharging ink I and forming a plurality of lines on the substrate S placed on the stage 1100; a solidifying unit 1400 for solidifying the discharged ink I; and a transferring unit 1500 moving the stage 1100 or moving the discharge unit 1200 and solidifying unit 1400.

Description

  The present invention relates to a substrate processing apparatus and a substrate processing method, and more particularly to a substrate processing apparatus and a substrate processing method for performing a direct writing printing process.

  In recent years, in the manufacture of circuit wiring that enters a printed circuit board (PCB), a flat panel display (FPD), etc., the direct writing printing process gradually replaces the conventional photolithographic process. Have been used.

  Since the direct writing method prints the circuit wiring on the substrate by the direct writing method, the process is very simple and not only has a high substrate throughput but also a chemical agent unlike the photo etching step. Therefore, the present invention has an advantage that it is very advantageous in terms of prevention of environmental pollution. On the other hand, it is not easy to finely adjust the thickness of the ink, and its utilization is limited.

  Recently, the electrohydraulic method is used to control the ink into the shape of a liquid column with a fine thickness, so that it can be used not only for the manufacture of existing printed circuit boards and flat panel displays, but also for the manufacture of semiconductor devices in the future. It is also expected that a direct writing printing process will be used.

Korean Registered Patent No. 10-100715

  An object of the present invention is to provide a substrate processing apparatus and a substrate processing method for forming a line on a substrate and solidifying the line.

  The problem to be solved by the present invention is not limited to the problem described above. Problems not mentioned can be clearly understood by those skilled in the art to which the present invention pertains from the present specification and the accompanying drawings.

  The present invention provides a substrate processing apparatus.

  A substrate processing apparatus according to the present invention includes a stage on which a substrate is placed, an ejection unit that ejects ink to form a plurality of lines on the substrate placed on the stage, and solidifies the ejected ink. A solidification unit; and a transfer unit that moves the stage or moves the discharge unit and the solidification unit.

  The discharge unit and the solidification unit may be arranged in a line along the movement direction above the stage.

  The solidification unit may include a light irradiation member that emits light. Moreover, the said light irradiation member is plurality, and the said several light irradiation member can irradiate the said light so that it may respond | correspond to the said several line one to one, respectively.

  The light irradiation member is provided in a slit shape having a width corresponding to a width of a region where the plurality of lines are formed, and can irradiate the region where the plurality of lines are formed with the light.

  The said light irradiation member can irradiate the said light so that only a predetermined angle may incline in the said moving direction from the perpendicular downward direction.

  The said light irradiation member can irradiate a laser or an ultraviolet-ray. The solidification unit may include a heat generating member that generates heat.

  The solidification unit may include an injection member that injects high-temperature gas or high-temperature gas. The ejection unit may include a plurality of nozzles that eject the ink.

  The substrate processing apparatus includes a power supply unit that applies a high voltage to the discharge unit, and the plurality of nozzles are provided in the form of fine needle bars, and the high voltage causes the ink to form a liquid column. It can be discharged.

  The substrate processing apparatus may further include a rotation unit that rotates the stage. The ink may be a conductive ink.

  The present invention provides a substrate processing method.

  One embodiment of the substrate processing method according to the present invention includes a step of placing a substrate on a stage, and a discharge unit that moves horizontally above the stage to discharge ink and discharge the ink over the substrate placed above. Forming a plurality of first lines, and a solidifying unit following the discharge unit to solidify the discharged ink.

  In the solidifying step, the discharged ink may be irradiated with light to solidify the ink.

  In the solidifying step, the light can be irradiated so as to correspond one-to-one to the plurality of first lines.

  In the solidifying step, the light can be irradiated to a region corresponding to the width of the plurality of first lines.

  In the solidification step, the light can be irradiated so as to be inclined at a predetermined angle in the moving direction from vertically below.

  The substrate processing method further includes a step of applying a high voltage to the discharge unit, and in the step of forming the first line, a plurality of fine needle bar-shaped nozzles included in the discharge unit are electrically connected by the high voltage. The ink can be ejected hydraulically in the form of a liquid column.

  The substrate processing method includes a step of rotating the stage by 90 degrees, and a plurality of second units formed on the substrate by discharging the ink by moving the discharge unit in the horizontal direction above the stage. Further comprising: forming a plurality of second lines perpendicular to one line; and solidifying the solidification unit following the discharge unit to solidify the ink forming the plurality of second lines. Can be included.

  According to the present invention, the substrate processing rate is improved by printing a line directly on the substrate using the direct write method, and the amount of chemical agent used can be significantly reduced.

  According to the present invention, a line is formed in a single process, and the solidification unit subsequent to the discharge unit solidifies this, so that the substrate can be processed quickly even without another solidification step.

  According to the present invention, the solidification is performed almost simultaneously with the line formation. Therefore, the delay time is minimized to prevent the circuit wiring density and the like from deviating from the density of the circuit wiring due to natural drying or the like. Is improved.

  The effects of the present invention are not limited to the effects described above, and effects not mentioned can be clearly understood by those skilled in the art to which the present invention belongs from the present specification and the accompanying drawings.

It is a block diagram of one Embodiment of a substrate processing apparatus. It is a perspective view of the discharge unit of FIG. It is an operation | movement diagram of the discharge unit of FIG. It is a perspective view of one Embodiment of the solidification unit of FIG. It is a rear view of the solidification unit of FIG. It is an operation | movement figure of the solidification unit of FIG. It is a perspective view of other embodiment of the solidification unit of FIG. It is a rear view of the solidification unit of FIG. It is an operation | movement figure of the solidification unit of FIG. It is an operation | movement figure of the solidification unit of FIG. It is a flowchart of one Embodiment of a substrate processing method. FIG. 12 is an operation diagram of the substrate processing method of FIG. 11. FIG. 12 is an operation diagram of the substrate processing method of FIG. 11. FIG. 12 is an operation diagram of a subsequent stage of the substrate processing method of FIG. 11. FIG. 12 is an operation diagram of a subsequent stage of the substrate processing method of FIG. 11.

  The terminology used in the present specification and the accompanying drawings are for explaining the present invention easily, and the present invention is not limited by the terms and the drawings.

  Detailed descriptions of known techniques that are not closely related to the concept of the present invention will be omitted.

  Hereinafter, the substrate processing apparatus 100 according to the present invention will be described.

  The substrate processing apparatus 100 directly writes a pattern on the substrate S by performing a direct writing method. The substrate processing apparatus 100 can process not only a transparent substrate used for a flat display including a printed circuit board and a glass substrate, but also various wafers used for manufacturing semiconductor elements. For example, the substrate processing apparatus 100 can form transparent electrode wiring of a flat panel display by writing conductive (electrically conductive) ink on a glass substrate in a line form.

  Hereinafter, an embodiment of the substrate processing apparatus 100 according to the present invention will be described.

  FIG. 1 is a configuration diagram of an embodiment of a substrate processing apparatus 100. Referring to FIG. 1, the substrate processing apparatus 100 may include a stage 1100, a discharge unit 1200, a solidification unit 1400, and a transfer unit 1500.

  The stage 1100 supports the substrate S. The substrate S can be transported from the outside, placed on the stage 1100, and seated.

  The upper surface of the stage 1100 may be provided in the same or similar shape as the substrate S, and the area thereof may be provided larger than that of the substrate S. For example, when processing a glass substrate used to manufacture a flat panel display, the stage 1100 may be provided as a quadrangle having a larger area than the glass substrate to be processed.

  The ejection unit 1200 ejects ink I. Here, the ink I may be a conductive ink. The type and components of the ink I can be appropriately changed according to the process in which the present invention is used.

  The discharge unit 1200 is disposed on the upper part of the stage 1100. The discharge unit 1200 can discharge the ink I onto the upper surface of the substrate S placed on the stage 1100.

  The discharge unit 1200 can move in the horizontal direction. If the ink I is discharged while the discharge unit 1200 moves in the horizontal direction above the stage 1100, a line can be formed along the movement direction on the upper surface of the substrate S placed on the stage 1100. Lines can be various circuit wiring. For example, a line formed of conductive ink may be a transparent electrode wiring of a flat panel display.

  The discharge unit 1200 can discharge the ink I according to various methods. For example, the discharge unit 1200 may be a continuous jetting (CJ) method, a piezo ink jet, a DOD (drop on demand) type ink jet method such as a thermal ink jet, or an electrohydraulic dynamic. Ink I can be discharged in a system. However, in the following, in order to simplify the description, the electrohydraulic discharge unit 1200 will be mainly described. Of course, since the discharge unit 1200 is not limited to the electrohydraulic method, the discharge unit 1200 can discharge the ink I in the above-described examples and other methods.

  FIG. 2 is a perspective view of the discharge unit 1200 of FIG.

  Referring to FIG. 2, the discharge unit 1200 may include a main body 1210 and a nozzle 1220.

  The main body 1210 is disposed above the stage 1100. The main body 1210 is coupled to the transfer unit 1500 and can be moved in the horizontal direction by the transfer unit 1500. The main body 1210 is placed on the stage 1100 or the stage 1100 with a width in the direction perpendicular to the moving direction (eg, the X direction in FIG. 1) (eg, the Y direction in FIG. 1). The width of the substrate S may be the same as or substantially the same.

  Ink I can be supplied to the main body 1210 from the ink supply unit 1250. The ink supply unit 1250 may be provided as a component of the substrate processing apparatus 100 or may be provided as an external device.

  The ink supply unit 1250 can include an ink storage tank 1253, a pump 1252, and a supply line 1251. Ink I is stored in the ink storage tank 1253. The supply line 1251 connects the ink storage tank 1253 and the main body 1210. The pump 1252 is installed on the supply line 1251 and can adjust the flow rate of the ink I supplied from the ink storage tank 1253 to the main body 1210 through the supply line 1251. The main body 1210 may be provided in the form of a tank having a space therein. The ink I supplied from the ink supply unit 1250 may be stored in the internal space of the main body 1210 and provided to the nozzle 1220.

  The nozzle 1220 ejects ink I. The nozzle 1220 can eject the ink I supplied from the ink supply unit 1250 to the main body 1210.

  The nozzle 1220 is installed on the lower surface of the main body 1210 and ejects ink I onto the upper surface of the substrate S placed on the stage 1100. If the main body 1210 moves and the nozzle 1220 ejects ink I, a line can be formed by the ink I ejected on the upper surface of the substrate S.

  There may be one or more nozzles 1220. The plurality of nozzles 1220 are arranged at regular intervals along a direction (for example, the Y direction in FIG. 1) perpendicular to the moving direction (for example, the X direction in FIG. 1) on the lower surface of the main body 1210. Can be connected in series. A discharge unit 1200 having a plurality of nozzles 1220 arranged in such a structure can form a plurality of lines on the upper surface of the substrate S.

  When the ink I is ejected by the electrohydraulic method, the substrate processing apparatus 100 can further include a power supply unit 1300.

  FIG. 3 is an operation diagram of the discharge unit 1200 of FIG.

  Referring to FIG. 3, the power supply unit 1300 generates a high voltage. The power supply unit 1300 may have one end connected to the main body 1210 and the other end connected to the stage 1100. The power supply unit 1300 can apply a high voltage to the main body 1210. The power supply unit 1300 can apply a negative voltage to the stage 1100 or ground the stage 1100. Here, the stage 1100 may be provided with a conductive material, for example, a metal material. Accordingly, an electric field due to a high voltage can be formed between the main body 1210 and the stage 1100.

  The nozzle 1220 may be provided in the form of a hollow needle having a tube structure in which a through hole having a fine inner diameter is hollow. The through hole may be provided in a cylindrical shape in which the inner diameter in the vertical direction is kept constant, or may be provided in a conical shape or a hemispherical shape in which the inner diameter decreases from the top to the bottom of the nozzle 1220.

  A high voltage may be applied to the nozzle 1220 through the main body 1210. Here, the main body 1210 and the nozzle 1220 may be provided with a material having excellent electrical conductivity. For example, the body 1210 and the nozzle 1220 can be metallic materials.

  If a high voltage is applied to the nozzle 1220, the ink I ejected through the nozzle 1220 can be charged by the high voltage. If the ink I is charged by a high voltage, the repulsive force of the charge between the particles of the ink I acts, and the ink 12 is ejected into a conical droplet having a smaller inner diameter from the top to the bottom at the tip of the nozzle 1220. The If an electric field acts on the ink I ejected onto the conical droplet, the ink I in the lower region of the cone stably maintains a liquid column shape having a fine diameter and is provided on the substrate S. As a result, the discharge unit 1200 can discharge the ink I in the form of a liquid column having a fine diameter and form a line with a fine thickness on the upper surface of the substrate S.

  The power supply unit 1300 can adjust a high voltage applied to the main body 1210. If the magnitude of the voltage is increased, the electric field becomes stronger and the diameter of the liquid column is further reduced. Conversely, if the voltage is reduced, the diameter can be further increased. On the other hand, if the magnitude of the voltage exceeds a critical value, the repulsive force between the charges is increased in the charged ink I, and the nozzle 1220 can electrospray the ink I into units of microparticles or nanoparticles. . The high voltage is adjusted so as to increase in proportion to the distance between the nozzle 1220 and the substrate S, and is preferably about 0.1 to 50,000 V / CM.

  The solidification unit 1400 can solidify the ink I. Solidification means that the solvent is dried from the ink I to solidify the ink I and fix it on the substrate S. Such solidification should be interpreted as a comprehensive concept that includes all drying or sintering of ink I.

  The ink I may change its array of particles according to the solidification speed, temperature, and the like. For example, when solidification progresses slowly, voids are not formed inside the particles, and the particles are arranged at a uniform density. On the other hand, when solidification proceeds rapidly, the internal particles are irregularly arranged, voids are formed inside the particles, the porosity is increased, and the density of the solidified ink I is locally increased. Deviation occurs. In particular, in the case of conductive ink, the internal gap acts as a resistance value, so that if the solidification progresses rapidly, there may be a problem that the performance of the circuit wiring formed of the conductive ink deteriorates.

  The solidification unit 1400 is disposed above the stage 1100. The solidification unit 1400 may be arranged to be separated from the discharge unit 1200 in a line along the moving direction. At this time, the discharge unit 1200 may be disposed in front of the moving direction, and the solidification unit 1400 may be disposed behind.

  The solidification unit 1400 can move in the same direction as the discharge unit 1200. Since the solidification unit 1400 is disposed behind the discharge unit 1200, the solidification unit 1400 can move behind the discharge unit 1200. The solidification unit 1400 can solidify the ink I ejected by the ejection unit 1200 while following the ejection unit 1200.

  The solidification unit 1400 can solidify the ink I according to various methods. For example, the solidification unit 1400 may have a heat generating member that generates heat, such as a heater. The heater applies heat to the ink I ejected onto the substrate S. The heated ink I can be solidified by evaporation of its solvent. In another example, the solidification unit 1400 may include an injection member that injects a high-temperature non-dissolved spray or a high-temperature gas, such as a nozzle. The spray member sprays the ink I discharged from the outside toward the ink I supplied with the high-temperature non-dissolved spray or the high-temperature gas, or is supplied with the non-dissolved spray or the gas from the outside. The ink I can be ejected toward the ink I heated and discharged onto the substrate S. As a result, heat is transferred to the ink I, the solvent is evaporated, and the ink I can be solidified. Here, the temperature range is 5 to 250 ° C., and the boiling point at 1 atm to a temperature higher by 50 ° C. than this temperature is suitable. In addition, the solidification unit 1400 may irradiate light to solidify the ink I. Hereinafter, in order to simplify the description, the solidification unit 1400 that irradiates light will be mainly described. Of course, since the solidification unit 1400 is not limited to the method of irradiating light, the solidification unit 1400 can solidify the ink I by the above-described example or other methods.

  4 is a perspective view of an embodiment of the solidification unit 1400 of FIG. 1, and FIG. 5 is a rear view of the solidification unit 1400 of FIG.

  According to one embodiment, the solidification unit 1400 may include a main body 1410 and a light irradiation member 1420a.

  Referring to FIGS. 1, 4, and 5, the main body 1410 is disposed above the stage 1100. The main body 1410 may be disposed at a predetermined distance behind the main body 1210 of the discharge unit 1200 along the moving direction. The main body 1410 is coupled to the transfer unit 1500 and can be moved in the horizontal direction by the transfer unit 1500. Here, the moving direction of the main body 1410 may be the same as the moving direction of the main body 1210. This allows the main body 1410 to be followed according to the main body 1210.

  The main body 1410 has a width in the direction (for example, the Y direction in FIG. 1) perpendicular to the moving direction (for example, the X direction in FIG. 1), or the substrate S placed on the stage 1100. Can be provided with the same or substantially the same width. The width of the body 1410 can be the same as the width of the body 1210.

  The light irradiation member 1420a emits light. Here, the light may be a laser or ultraviolet (UV). The light irradiation member 1420 a is installed on the lower surface of the main body 1410 and can irradiate light toward the substrate S placed on the stage 1100.

  If the ink I discharged on the upper surface of the substrate S is irradiated with light, the solvent of the ink I evaporates and the ink I can be sintered. Specifically, when the ink I is irradiated with light such as a laser, heat is transmitted to the ink I. In the case of conductive (electrical conduction and thermal conduction) ink, heat is transferred from light to evaporate the solvent, and the solute provided in metal particles such as silver is sintered. obtain. The metal particles are heated to a high temperature by the heat transmitted from the light, temporarily melted into a liquid phase, and then solidified while solidifying. Therefore, if solidification is performed using light, a line having a relatively uniform density can be formed.

  There may be a plurality of light irradiation members 1420a. The plurality of light irradiating members 1420a can be arranged on the lower surface of the main body 1410 at regular intervals along a direction perpendicular to the moving direction. Here, the separation interval between the light irradiation members 1420 a may be the same as the separation interval between the plurality of nozzles 1220 in the discharge unit 1200. In addition, each of the plurality of light irradiation members 1420a may be arranged to have a one-to-one correspondence with each of the plurality of nozzles 1220. For example, when viewed from above, each of the light irradiation member 1420a and the nozzle 1220 may be installed on the same straight line along the moving direction. As a result, the movement path of the nozzle 1220 and the movement path of the light irradiation member 1420a can be superimposed one-to-one.

  FIG. 6 is an operation diagram of the solidification unit 1400 of FIG.

  Referring to FIG. 6, the plurality of light irradiating members 1420 can irradiate the plurality of lines formed by the ejected ink I on a one-to-one basis by the plurality of nozzles 1220. If light is irradiated corresponding to a plurality of lines on a one-to-one basis, energy is transmitted by the light irradiated with the ink I that forms each line, and it can be dried or sintered to be solidified. According to such a system, since light is irradiated only on the line and not directly on the surface of the substrate S, the light is formed on the substrate S other than the line formed according to the substrate S or the ejected ink I. Other patterns can be prevented from being damaged by light.

  7 is a perspective view of another embodiment of the solidification unit 1400 of FIG. 1, and FIG. 8 is a rear view of the solidification unit 1400 of FIG.

  According to another embodiment, the solidification unit 1400 may be provided with a slit-type light irradiation member 1420.

  Referring to FIGS. 7 and 8, the light irradiation member 1420 has a direction (for example, the Y direction in FIG. 1) perpendicular to the moving direction (for example, the X direction in FIG. 1) on the lower surface of the main body 1410. Can be provided in the form of a slit extending along. The slit-type light irradiation member 1420 can irradiate light through the entire slit surface.

  Such a slit may have a width that is substantially the same as the width of the body 1410. Alternatively, the width of the slit can be provided to correspond to the width of the plurality of nozzles 1220. That is, the width of the light irradiation member 1420 may be provided so as to correspond to two intervals of the outermost nozzle 1220 among the plurality of nozzles 1220. As a result, the light irradiation member 1420 can irradiate the entire region where a plurality of lines are formed on the substrate S, and solidify the ink I forming all the lines formed on the substrate S. .

  However, in the present embodiment, only one slit-type light irradiation member 1420 is not necessarily provided, and a plurality of slit-type light irradiation members 1420 may be provided. For example, in the main body 1410 illustrated in FIGS. 7 and 8, two slit type light irradiation members 1420 having a length ½ of the length of the light irradiation member 1420 illustrated may be installed.

  On the other hand, the solidification unit 1400 can irradiate light so as to incline toward the front in the moving direction from vertically downward or vertically downward.

  9 and 10 are operation diagrams of the solidification unit 1400 of FIG.

  Referring to FIG. 9, the light irradiation member 1420 can irradiate light vertically downward. As a result, the ink I ejected onto the substrate S can be solidified by receiving light irradiation.

  Referring to FIG. 10, the light irradiating member 1420 can irradiate light so as to be inclined at a predetermined angle from the vertically lower side to the front side. In this case, as compared with the case where light is irradiated vertically downward, the time interval from the start point where ink I is ejected to the start point where ink I is solidified is irradiated vertically downward. Can be shortened compared to

  The solidification unit 1400 may further include an irradiation direction adjusting member that adjusts the direction in which the light irradiation member 1420 emits light. The irradiation direction adjusting member can adjust the direction of the light irradiation member 1420 to adjust the direction of light irradiation so that the light is tilted forward or backward in the moving direction from vertically below.

  Thus, the angle at which the solidification unit 1400 irradiates light can be determined in consideration of various process conditions such as the type of the ink I and the interval between the ejection unit 1200 and the solidification unit 1400.

  The transfer unit 1500 can move the discharge unit 1200 and the solidification unit 1400 in the horizontal direction. The transfer unit 1500 can include a transfer machine 1510 and a transfer frame 1520. The transfer frame 1520 may be installed on the top of the stage 1100 so as to extend in the horizontal direction. The transfer machine 1510 is coupled to the transfer frame 1520 and can move according to the transfer frame 1520. A discharge unit 1200 and a solidification unit 1400 may be separated from the transfer unit 1510 at a predetermined interval and coupled in a line along the transfer direction. Accordingly, the discharge unit 1200 and the solidification unit 1400 can be moved in the horizontal direction above the stage 1100 by the transfer unit 1500.

  In the above, it has been described that the transfer unit 1500 moves the discharge unit 1200 and the solidification unit 1400, but the transfer unit 1500 can also move the stage 1100 on the contrary. When the transfer unit 1500 moves the stage 1100, the substrate S placed on the stage 1100 can move relative to the discharge unit 1200 and the solidification unit 1400 in the horizontal direction. In some cases, the transfer unit 1500 can move only the substrate S.

  As described above, in the substrate processing apparatus 100, the ink I is discharged onto the substrate S while the transfer unit 1500 moves the discharge unit 1200 and the solidification unit 1400 or moves the stage 1100 and the substrate S. Can be solidified to form a line along the moving direction.

  The substrate processing apparatus 100 can further include a rotating member 1150. The rotating member 1150 can rotate the stage 1100. For example, the rotating member 1150 can include a rotating shaft and a motor. The motor generates a rotational force, and one end of the rotational shaft is coupled to the stage 1100 and the other end is connected to the motor, so that the stage 1100 can be rotated by the rotational force of the motor. If the stage 1100 rotates, the substrate S can rotate. Thus, if the substrate S rotates, the discharge unit 1200 and the solidification unit 1400 can form a line depending on the rotation angle.

  For example, if the rotation member 1150 rotates the stage 1100 by 90 degrees after the substrate processing apparatus 100 forms the first line along the moving direction on the substrate S, the substrate processing apparatus 100 is placed on the substrate S. The second line can be formed in a direction perpendicular to the line. As a result, a lattice pattern can be formed on the substrate S. Here, in the case of a flat panel display, the first line may correspond to the source electrode wiring, and the second line may correspond to the gate electrode wiring.

  Further, the rotating member 1150 may rotate the transfer unit 1500, the discharge unit 1200, and the solidification unit 1400 instead of rotating the stage 1100. Even when the transfer unit 1500, the discharge unit 1200, and the solidification unit 1400 rotate, the substrate processing apparatus 100 can form a line on the substrate S according to the rotation angle.

  The substrate processing apparatus 100 may further include a controller. The controller can control the components of the substrate processing apparatus 100. For example, the controller can control the movement of the transfer unit 1500. In addition, the controller can adjust the magnitude of the voltage applied by the power supply unit 1300. In addition, the controller can adjust the flow rate of the discharge unit 1200 or can control the light irradiation of the light irradiation member 1420 of the solidification unit 1400. In addition, the controller can control the rotating member 1150 to rotate the stage 1100.

  Such a controller may be implemented by a computer or a similar device using hardware, software, or a combination thereof.

  Controller, hardware manner ASICs (application specific integrated circuits), DSPs (digital signal processors), DSPDs (digital signal processing devices), PLDs (programmable logic devices), FPGAs (field programmable gate arrays), processor (pwrsupplies) Further, the present invention may be implemented by microcontrollers, microprocessors, and electrical devices that perform similar control functions.

  The controller may be implemented by software code or software application created in one or more programming languages in terms of software. The software can be executed by a control unit embodied in hardware. The software can be installed by being transmitted from an external device such as a server to a hardware configuration such as the computer described above.

  Hereinafter, a substrate processing method according to the present invention will be described using the substrate processing apparatus 100 described above. However, since this is merely for the sake of simplicity, the substrate processing method may be performed using another apparatus that is the same as or similar to the substrate processing apparatus 100 described above. In addition, the substrate processing method according to the present invention may be stored in a computer-readable recording medium in the form of a code or program for performing the method.

  Hereinafter, an embodiment of the substrate processing method will be described. FIG. 11 is a flowchart of an embodiment of the substrate processing method.

  One embodiment of the substrate processing method may include placing the substrate S on the stage 1100 (S110), ejecting the ink I (S120), and solidifying the ink I (S130). Hereinafter, each stage will be described.

  12 and 13 are operation diagrams of the substrate processing method of FIG.

  Referring to FIG. 12, the substrate S is transferred from the outside and placed on the stage 1100 (S110). For example, the substrate S may be transferred by an external robot, a roller, or other various substrate S transfer means.

  Referring to FIG. 13, when the substrate S is placed on the stage 1100, the discharge unit 1200 discharges the ink I onto the substrate S (S120). The ejection unit 1200 is moved in the horizontal direction by the transfer unit 1500 and can eject the ink I onto the upper surface of the substrate S. Thereby, a line along the transfer direction can be formed on the upper surface of the substrate S.

  Referring to FIG. 13 again, the solidification unit 1400 may solidify the ink I (S130). The solidification unit 1400 can be moved in the same direction as the discharge unit 1200 by the transfer unit 1500. Since the solidification unit 1400 is disposed behind the discharge unit 1200 in the moving direction, the discharge unit 1200 can be followed. The solidification unit 1400 can irradiate light to the line formed by the ejected ink I. The light irradiation member 1420 can irradiate light to each of the plurality of lines in a one-to-one correspondence manner. Alternatively, the light irradiation member 1420 can irradiate light to a region corresponding to the width of a region where a plurality of lines are formed.

  When the ink I is irradiated with light, the solvent of the ink I can be dried, or the ink I can be sintered and solidified. Here, the solidification unit 1400 can solidify the ejected ink I at a predetermined time interval while following in accordance with the ejection unit 1200. As a result, the time interval from the starting point where the ink I is discharged to the starting point where the ink I is solidified is short, so that the ink I is naturally dried or discharged onto the substrate S by an external force applied to the substrate S. The phenomenon that the ink I swings is prevented, and the ink I can be solidified uniformly. If the ink I is solidified uniformly, the quality of the circuit wiring according to the line of the ink I can be improved. Further, the process is simplified by ejecting the ink I onto the substrate S in one process and solidifying it instead of performing the process of solidifying the ink I after the process of ejecting the ink I. The substrate processing rate can be improved.

  On the other hand, in the substrate processing method according to the present embodiment, after the line is formed as described above, the step of rotating the substrate S (S140) and the line formed on the rotated substrate S through steps S120 and S130 (hereinafter referred to as the step S120). The step (S150) of forming a line (hereinafter referred to as a second line) in a direction different from that of the first line can be further performed.

  14 and 15 are operation diagrams of subsequent stages of the substrate processing method of FIG.

  Referring to FIG. 14, after the first line is formed, the rotating member 1150 may rotate the stage 1100 (S140). For example, the stage 1100 can be rotated 90 degrees. If the stage 1100 is rotated, the moving direction of the transfer unit 1500 and the first line formed on the substrate S may be perpendicular to each other when viewed from above.

  Referring to FIG. 15, if the substrate S is rotated, the substrate processing apparatus 100 can form the second line on the substrate S. For example, when the substrate S is rotated 90 degrees, the second line can be formed in a direction perpendicular to the first line. The substrate processing apparatus 100 can eject the ink I onto the substrate S in the same manner as the above-described steps S120 and S130 and solidify the ink I to form a second line.

  Accordingly, the first line and the second line that are perpendicular to each other can be formed on the substrate S. For example, in the case of a flat panel display, two transparent electrode wirings in a direction perpendicular to each other can be manufactured through such a process. Here, one of the first line and the second line may be a gate electrode, and the other one may be a source electrode.

  The embodiments of the present invention mentioned above are described in order to help those who have ordinary knowledge in the technical field to which the present invention belongs to understand the present invention. Therefore, the present invention is limited by the above-described embodiments. Not to be done.

  Therefore, the present invention can be implemented by selectively combining the above-described embodiments and their constituent elements, or by adding known techniques, and further, modifications, substitutions and changes are made without departing from the technical idea of the present invention. All modifications and variations are included.

  Moreover, the protection scope of the present invention must be construed by the following claims, and all inventions within the scope equivalent thereto should be construed as being included in the scope of rights.

100 substrate processing apparatus,
1100 stage,
1150 rotating member,
1200 discharge unit,
1250 ink supply unit,
1300 power supply unit,
1400 solidification unit,
1420 light irradiation member,
1500 transfer unit,
S substrate,
I ink.

Claims (20)

A stage on which the substrate is placed;
A discharge unit that discharges ink to form a plurality of lines on a substrate placed on the stage; and
A solidification unit for solidifying the ejected ink;
A substrate processing apparatus comprising: a transfer unit that moves the stage or moves the discharge unit and the solidification unit.   The substrate processing apparatus according to claim 1, wherein the solidification unit includes a light irradiation member that emits light. The light irradiation member is plural,
The substrate processing apparatus according to claim 2, wherein each of the plurality of light irradiation members irradiates the light so as to correspond to the plurality of lines on a one-to-one basis.   The said light irradiation member is provided in the slit form which has a width | variety corresponding to the width | variety of the area | region in which the said some line is formed, The said light is irradiated to the area | region in which the said several line is formed. Substrate processing equipment.   5. The substrate processing apparatus according to claim 2, wherein the light irradiation member irradiates the light so that the light irradiation member is inclined at a predetermined angle in the moving direction from vertically below.   The substrate processing apparatus according to claim 2, wherein the light irradiation member irradiates a laser or ultraviolet light.   The substrate processing apparatus according to claim 1, wherein the discharge unit and the solidification unit are arranged in a line along a movement direction above the stage.   The substrate processing apparatus according to claim 1, wherein the solidification unit includes a heat generating member that generates heat.   The substrate processing apparatus according to claim 1, wherein the solidification unit includes an injection member that injects high-temperature non-dissolved spray or high-temperature gas.   The substrate processing apparatus according to claim 1, wherein the discharge unit includes a plurality of nozzles that discharge the ink. Including a power supply unit for applying a high voltage to the discharge unit;
The substrate processing apparatus according to claim 10, wherein the plurality of nozzles are provided in the form of a fine needle bar, and discharge the ink in a liquid column form in an electrohydraulic manner by the high voltage.   The substrate processing apparatus according to claim 1, further comprising a rotation unit that rotates the stage.   The substrate processing apparatus according to claim 1, wherein the ink is a conductive ink. Placing the substrate on the stage; and
A step in which the discharge unit moves horizontally above the stage to discharge the ink to form a plurality of first lines on the previously placed substrate;
A substrate processing method comprising: a solidification unit following the discharge unit to solidify the discharged ink.   The substrate processing method according to claim 14, wherein in the solidifying step, the discharged ink is irradiated with light to solidify the ink.   The substrate processing method according to claim 15, wherein in the solidifying step, the light is irradiated so as to correspond one-to-one to the plurality of first lines.   The substrate processing method according to claim 15, wherein, in the solidifying step, the light is irradiated to a region corresponding to a width of the plurality of first lines.   The substrate processing method according to claim 15, wherein in the solidifying step, the light is irradiated so as to be inclined at a predetermined angle in the moving direction from vertically below. Further comprising applying a high voltage to the discharge unit;
18. The method according to claim 14, wherein in forming the first line, a plurality of fine needle bar-shaped nozzles included in the discharge unit discharge the ink into a liquid column form electrohydraulicly by the high voltage. The substrate processing method according to any one of the above. Rotating the stage 90 degrees;
The ejection unit moves in the horizontal direction above the stage and ejects the ink to form a plurality of second lines perpendicular to the plurality of first lines formed on the substrate; ,
The substrate processing method according to claim 14, further comprising: solidifying the ink that forms the plurality of second lines by the solidification unit following the discharge unit. .

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