JP2011091126A - Light emitting device (cob module) - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting diode display panel device by developing an LED package having sufficient heat resistance and thermal conductivity. <P>SOLUTION: A LED chip is accommodated in a recess of a package body together with a (circuit) base and a (circuit) cover which are unified including a circuit pattern, and they are set on an element substrate. The (circuit) base and (circuit) cover are made preferably of PEEK (polyether ether ketone), and a reflector and a sealing material may be added. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a light emitting device (COB module), and more particularly to a light emitting device (COB module) using a newly developed package.

2. Description of the Related Art Light emitting diodes (LEDs) have been widely used as display light sources (see Patent Document 1) and light emitting devices (see Patent Document 2), as well as lighting fixtures, displays, backlight light sources for liquid crystal displays, and the like. ing.
In order to extract light from an LED, a diode element and a conducting wire for energizing the diode are required. However, a reflecting material for preventing wasted light and a light transmitting material that does not attenuate the light, and further desired. Concentrators (lenses, etc.) for directing in the direction of light, fluorescent materials for adjusting the hue of the extracted light, etc. are used, and measures are taken to conduct and dissipate heat generated when converting electricity into light It is indispensable.

One example of a light emitting device using LEDs is described in Patent Document 2 as follows based on FIG.
“The light emitting device (COB module) 21 includes a package substrate, for example, a device substrate 22, a blue LED chip 24 on the device substrate 23, which is a plurality of preferably a plurality of semiconductor light emitting devices mounted on the device substrate 22, A circuit pattern 25, a phosphor-containing resin layer 26, a reflective layer 27, an adhesive layer 28, a light diffusing member 29, and a reflector 30. The phosphor-containing resin layer 26 also functions as a sealing member. To do. "

Furthermore, “the device substrate 22 is made of a flat plate made of metal or an insulating material such as synthetic resin, and has a predetermined shape, for example, a rectangular shape, in order to obtain a light emitting area required for the light emitting device 21. When 1 is made of synthetic resin, it can be formed of, for example, an epoxy resin containing glass powder. "
“A phosphor layer is a layer that holds a phosphor, and can be formed as a layer in which one or more phosphors are mixed and dispersed in a transparent resin such as a silicone resin or an epoxy resin. The phosphor layer can be formed so as to directly cover the outside of the light-emitting element, but a transparent resin layer may be formed so as to directly cover the light-emitting element, and a layer containing the above-described phosphor may be provided thereon. Furthermore, a phosphor sheet obtained by forming a phosphor-containing resin into a sheet shape and heat-curing it can be disposed on a transparent resin layer formed so as to directly cover the light emitting element.

  In general, epoxy resin (nonwoven glass fiber impregnated with epoxy resin) has been mainly used as a substrate for LED, a protective member having a lens action, and an insulating material. With the rise, the mainstream has begun to shift to silicone resin. Silicone resin is based on the fact that light transmittance in a short wavelength region is remarkably superior to epoxy resin.

LEDs are not limited to image display, but are also widely used for high power such as illumination. However, when it comes to high power products, defects have been noticeable in the packages that have been used in the past.
Conventional packages mainly consist of plastic resin (mainly polyphthalamide (A)) molded with a metal thin layer (thin plate) circuit pattern, and copper is used for the circuit pattern. In general, silver plating is applied in consideration of reflectance. When it started to be used for high power products, the problem of sulfidation of silver plating became noticeable.

The sulfurization of silver plating is the result of reaction with sulfur from the outside, and sulfur penetrates through the gap between the circuit pattern and the insulating resin (A is often used) surrounding it in the package. It is thought to be caused by
The circuit pattern and the insulating resin are not adhered to the circuit pattern and the insulating resin because they do not obstruct the heat conduction when an adhesive or the like is interposed, and are only stuck. ing. When the sealing material is an epoxy resin, the infiltration of sulfur was suppressed, but when the sealing material shifted to the silicone resin, the permeation of sulfur through the silicone resin emerged as a factor of sulfurization. Yes.

  In addition, with the increase in power, the problem of heat generation from LEDs has become an urgent issue. In the LED, 90% of the input energy is consumed as heat. Conventionally, as the heat resistance of the synthetic resin used, the heat resistance at the reflow temperature (about 270 ° C.) has been required because the reflow process is used for incorporating the LED. Although it has been said that the requirement is satisfied even if it is slightly softened, the heat generated from the LED in use lasts for a long time, so there is a risk of yellowing of the resin used and continuous deformation due to softening There is a need to consider it, and the need to enhance heat conduction and heat dissipation is beginning to be realized.

Japanese Patent Laid-Open No. 10-242523 JP 2009-111273 A

  The present invention solves the above problems, and an object of the present invention is to develop an LED package having sufficient heat resistance and thermal conductivity and to provide a light emitting diode display panel device.

The light emitting device (COB module) of the present invention combines an (circuit) base and a (circuit) cover, which are integrated by incorporating a circuit pattern, and receives an LED chip in a recess of the package body. It is provided above.
The (circuit) base and the (circuit) cover are preferably made of PEEK (polyetheretherketone), and a reflector and a sealing material can be added.

  According to the present invention, by using a pattern layer PEEK (polyetheretherketone) that holds a conductive wire pattern (circuit pattern), high heat resistance, particularly discoloration resistance can be realized. In addition, since the pattern layer covering both sides with the circuit pattern and the cover material are made the same PEEK, there is no gap between the circuit pattern and PEEK based on the affinity of PEEK with the metal. Sulfur penetration and the resulting blackening of silver (plating) does not occur. Furthermore, by using the same material for the pattern layer and the cover material, they can be integrated directly by mutual fusion without using an adhesive layer, so the thickness can be reduced, and heat transfer and heat dissipation are effective. can do.

  In addition, an “aluminum metal substrate” with a mirror-finished surface is used, and the LED element is disposed adjacent to the “aluminum metal substrate”. The heat transfer and heat dissipation downward can be effectively functioned simultaneously.

It is explanatory drawing which shows the structure of the light-emitting device (COB module) of this invention. It is a partially expanded explanatory view which shows the structure of the light-emitting device (COB module) of this invention. It is explanatory drawing which shows the structure of the light-emitting device (COB module) of a prior art.

Hereinafter, the present invention will be described in detail with reference to the drawings.
A light emitting device (COB module) 1 of the present invention includes a device substrate 2, an LED chip 4 on an element substrate 3 that is a light emitter, a circuit pattern 5 that is a conductive path, and a (circuit) base 6 that holds the circuit pattern 5. The circuit pattern 5 has a (circuit) cover 7, and the LED chip 4 and the circuit pattern 5 are connected by a wire 8.
As shown in FIG. 2 showing the unit light emitting device of the present invention in an enlarged manner, a reflector 9 is provided on the (circuit) cover 7 and encapsulates the LED chip 4, the circuit pattern 5, and the wires 8. Basically, the material 10 is provided.

As the device substrate 2, at least the light emitter side is mirror-finished in order to exhibit the function of reflecting the light emitted from the light emitter upward and also to effectively conduct the heat generated from the light emitter. It is preferable to use an aluminum plate.
As the circuit pattern 5, as usual, a copper alloy is used in order to obtain conductivity, and the surface is plated with silver. The circuit pattern 5 is a thin body laminated with the (circuit) base 6, and a desired pattern is formed by etching or the like, for example. A pattern can also be formed by vapor deposition or the like.

(Circuit) Base 6 has hitherto been focused on heat resistance and strength, and most of the examples use epoxy-based resins. However, in the present invention, emphasis is placed on bondability with metal materials. PEEK (polyetheretherketone), which has heat resistance and fusion with a sealing material, is used. For the (circuit) cover 7, PEEK is used for the same reason. By using the same material for the (circuit) base 6 and the (circuit) cover 7, it is possible to realize the advantage that they can be directly integrated with each other by thermal fusion without using an adhesive layer.
The (circuit) base 6 and the (circuit) cover 7 which are integrated by including the circuit pattern 5 are collectively referred to as a package body. The package body is provided with a recess 11 for receiving the LED chip 4 on the element substrate 3.

  The reflector 9 directs light emitted from the light emitter in a desired direction, and is not limited to being provided perpendicularly to the apparatus substrate as in the illustrated example, but is inclined at an appropriate angle. be able to. Even if the inclined surface is a combination of flat surfaces, it can be an appropriate concave or convex surface such as a spherical surface or a paraboloid of revolution. As the reflector 9, a usual one can be used.

The sealing material 10 includes the LED chip 4, the circuit pattern 5, and the wire 8 to protect it from interference from the outside world. However, the fluorescent material is dispersed and blended, and the color tone of light emitted from the light emitter is desired. It also plays a role in dimming things. Moreover, the role of a lens can also be taken for the direction of emitted light.
Although it will not specifically limit as the sealing material 10 if it is excellent in light transmittance, From the surface of blue transparency, a silicone-type resin is preferable.

  In the present invention, the package LED chip 4 is inserted into the recess 11 and installed on the device substrate 2 via the element substrate 3. Therefore, the heat generated in the package LED chip 4 is aluminum which is a good conductor of heat. Conducted quickly to the device substrate 2 made of heat and dissipated.

  In the above description, particularly in FIG. 1, a plurality of LED chips have been assumed to be used by arranging the same kind of LED chips, but the present invention is not limited thereto, and red, green and blue as a set, It goes without saying that the display device can be arranged in a triangular shape.

  As described above, the present invention can provide a long-life light-emitting device (COB module) without blackening of silver plating and extremely low yellowing of a resin used as a sealing material. It can be said that there is something to be seen in the contribution to the field of utilization technology.

1: Light emitting device (COB module)
2: device substrate 3: element substrate 4: LED chip 5: (light emitting body) LED chip 5: (conductive path) circuit pattern 6: (holds circuit pattern) (circuit) base 7: (circuit pattern) (circuit) cover 8: Wire 9: Reflector 10: Sealing material 11: (Receiving LED chip Q3) Recess 21: Light emitting device (COB module)
22: Device substrate 23: Element substrate 24: Blue LED chip 25: Circuit pattern 26: Phosphor-containing resin layer 27: Reflective layer 28: Adhesive layer 29: Light diffusion member 30: Reflector

Claims (3)

A (circuit) base integrated with a circuit pattern and a (circuit) cover are combined, and an LED chip is received in a recess of the package body, and they are provided on an element substrate. Light emitting device (COB module). The light emitting device (COB module) according to claim 1, wherein the (circuit) base and the (circuit) cover are made of PEEK (polyetheretherketone). The light emitting device (COB module) according to claim 1 or 2, wherein a reflector and a sealing material are added.

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