CN104051603B - A kind of manufacturing process of the LED light bar of double-side - Google Patents

Abstract

The invention provides a manufacturing process of a double-sided LED light bar, which includes the following steps: providing a double-sided substrate, which includes a first layer, a second layer on both sides of the first layer, and a second layer on both sides of the first layer. The third layer is arranged on the outer side of the second layer at equal intervals, and several crystal bonding grooves are formed on the double-sided substrate. Compared with the prior art, the invention has simple process and better and more uniform luminous effect.

Description

A kind of manufacturing process of double-sided LED light bar

technical field

The invention relates to the lighting field, in particular to a manufacturing process of a double-sided LED light bar.

Background technique

With the rapid development of the LED (Light-Emitting Diode, light-emitting diode) industry, many LED manufacturing enterprises have emerged in the world. The manufacturing process of the existing LED light bar is complicated, and needs to go through two processes, one is LED packaging, and the other is SMT (surface mount technology, SMT for short) patching. Moreover, most of the LED light bars in the prior art emit light from one side, and each LED chip on the light bar is cut into an independent light-emitting particle after packaging.

There are following defects in the prior art: (1) the existing production process is many and complicated, not only greatly improves the production cost in the production process, and in the semiconductor industry, too many technological processes in the production will also cause huge environmental impact (2) each LED particle on the existing LED strip is independent, and there will be a grainy feeling when lit, and the luminous effect is not good, and the luminescence is uneven; (3) the LED made by the prior art The light bar only emits light from one side, and the luminous effect is not good, and the light bar that emits light from one side has a low utilization rate of substrate resources.

Therefore, it is necessary to further improve the defects in the prior art.

Contents of the invention

The object of the present invention is to provide a manufacturing process of a double-sided LED light bar with simple process and good luminous effect.

In order to achieve the aforementioned purpose, the present invention provides a manufacturing process for a double-sided LED light bar, which includes the following steps:

A double-sided substrate is provided, which includes a first layer, a second layer positioned on both sides of the first layer, and a third layer positioned outside the second layer and arranged at equal intervals, and a plurality of layers are formed on the double-sided substrate. a solid crystal slot;

Solid crystal, installing LED chips in the solid crystal tank;

Welding wires, electrically connecting the positive and negative poles on the surface of the LED chip to the third layer through conductive wires;

Compression molding, pressing the mixture of packaging glue and phosphor on the surface of the LED chip by molding;

Die cutting, cutting the double-sided substrate into several LED light strips.

As a preferred embodiment of the present invention, the third layer includes fixing parts and mold clamping parts, and the fixing parts and mold clamping parts are arranged alternately on the surface of the second layer.

As a preferred embodiment of the present invention, the crystal-bonding groove is formed by extending from the surface of the fixing portion of the third layer through the second layer to the surface of the first layer, and the LED chip is mounted on on the first layer in the crystal-bonding tank.

As a preferred embodiment of the present invention, the bonding wires are electrically connected to the positive and negative electrodes on the surface of the LED chip and the fixing part of the third layer through conductive wires.

As a preferred embodiment of the present invention, the pressing mold is integrally pressing the mixture of encapsulating glue and phosphor powder onto the surface of the LED chip on the fixing part through molding.

As a preferred embodiment of the present invention, the die-cutting is to cut the double-sided substrate into several LED light strips along the middle position in the longitudinal direction of the clamping part.

As a preferred embodiment of the present invention, each LED light bar includes an encapsulation part and exposed parts on both sides of the encapsulation part, and the encapsulation part is covered with several LED chips.

As a preferred embodiment of the present invention, the first layer of the double-sided substrate is an aluminum plate, the second layer is a thermally conductive insulating layer, and the third layer is a circuit layer.

As a preferred embodiment of the present invention, the thermally conductive insulating layer is epoxy resin, and the circuit layer is copper foil.

As a preferred embodiment of the present invention, the LED chips on both sides of the double-sided substrate are arranged symmetrically based on the double-sided substrate.

Beneficial effects of the present invention: compared with the prior art, the manufacturing process of the double-sided LED light bar of the present invention is simple, and the production efficiency is greatly improved; and the LED light bar manufactured by the process of the present invention is double-sided Lighting not only has a good luminous effect, but also greatly improves the utilization rate of the substrate. The luminous surface of the present invention is strip-shaped, and several luminous LED particles are connected together, so that the luminous effect is better and more uniform.

Description of drawings

Fig. 1 is the manufacturing process flow of the double-sided LED light bar of the present invention;

Fig. 2A(1) is a schematic structural view of the double-sided substrate used in the double-sided LED light bar of the present invention;

Figure 2A(2) is a partial structural schematic diagram of the double-sided substrate in Figure 2A(1)

Fig. 2A (3) is the A-direction sectional view of Fig. 2A (2);

Fig. 2B is a schematic structural diagram of the die-bonding step in the manufacturing process flow of the double-sided LED light bar of the present invention;

Fig. 2C is a structural schematic diagram of the wire bonding step in the manufacturing process flow of the double-sided LED light bar of the present invention;

Fig. 2D (1) is a schematic structural view of the double-sided substrate of the present invention located in the mold;

FIG. 2D (2) is a schematic structural view of the double-sided substrate after compression molding;

FIG. 2E is a schematic structural view of the double-sided LED light bar of the present invention.

detailed description

The present invention will be described in further detail below in conjunction with the accompanying drawings.

Reference herein to "one embodiment" or "an embodiment" refers to a particular feature, structure or characteristic that can be included in at least one implementation of the present invention. "In one embodiment" appearing in different places in this specification does not all refer to the same embodiment, nor is it a separate or selective embodiment that is mutually exclusive with other embodiments.

Please refer to Fig. 1 and Fig. 2A-2E, Fig. 1 is a manufacturing process flow of the double-sided LED light bar of the present invention. The manufacturing process of the double-sided LED light bar specifically includes the following steps:

Step S310: providing a double-sided substrate. Please refer to Figure 2A(1)-2A(3), Figure 2A(1) is a schematic structural view of the double-sided substrate used in the double-sided LED light bar of the present invention, and Figure 2A(2) is Figure 2A(1) Partial structural schematic diagram of the double-sided substrate, FIG. 2A(3) is a cross-sectional view along the line A of FIG. 2A(2). As shown in Figure 2A(1)-2A(3), the double-sided substrate 300 includes a first layer 301, a second layer 302 located on both sides of the first layer 301, and two layers located outside the second layer 302 and arranged at equal intervals. Several third layers 303 . Several die-bonding grooves 304 are formed on the double-sided substrate 300 .

The third layer 303 includes fixing parts 3031 and mold clamping parts 3032 , and the fixing parts 3031 and mold clamping parts 3032 are arranged alternately on the surface of the second layer 302 . In this embodiment, the crystal bonding groove 304 is formed extending from the surface of the fixing portion 3031 of the third layer 303 through the second layer 302 to the surface of the first layer 301 . Wherein, the first layer 301 of the double-sided substrate 300 is an aluminum plate, the second layer 302 is a thermally conductive insulating layer with high thermal conductivity; the third layer 303 is a circuit layer, and in this embodiment, the The heat-conducting insulating layer is epoxy resin with high heat-conducting performance, and the circuit layer is copper foil. The present invention does not limit the thicknesses of the first layer 301 , the second layer 302 and the third layer 303 , which can be specifically designed according to actual conditions.

Step S320: Die bonding. Please refer to FIG. 2B , which is a schematic structural diagram of the die-bonding step in the manufacturing process flow of the double-sided LED light bar of the present invention. Several LED chips 305 are installed in the crystal bonding tank 304 . Please refer to FIGS. 2A and 2B. Firstly, the double-sided substrate 300 is placed on the bottom plate carrier 400 with one side facing up, and the solder paste is dipped from the glue tray with a dispensing head, and then the solder paste taken out is dispensed. Attached to the crystal-bonding tank 304 on the upward side of the double-sided substrate 300, then place the LED chip 305 on the aluminum plate of the first layer 301 in the crystal-bonding tank 304 dotted with solder paste, heat up to eutectic after compaction temperature, so that the metal on the bottom surface of the LED chip 305 and the first layer of aluminum plate are eutectically welded by solder paste, and then the LED chip 305 on one side of the double-sided substrate is fixed; the double-sided substrate is turned over so that the other side is facing up, repeat In the above-mentioned die-bonding step S320, the die-bonding process on the other side is completed. In this embodiment, the LED chip 305 is fixed on the aluminum plate of the first layer 301 in the crystal bonding groove 304, and the bottom of the LED chip 305 is directly in contact with the aluminum plate of the first layer 301, thus A part of the heat generated by the LED chip 305 will be directly conducted to the aluminum plate of the first layer 301, and then the heat will be conducted out through the aluminum plate of the first layer 301, and the other part of the heat generated by the LED chip 305 will pass through the aluminum plate of the first layer 301. The heat-conducting insulating layer of the second layer 302 is also rapidly conducted to the aluminum plate of the first layer 301, and then radiated out through the aluminum plate of the first layer 301. Therefore, it can play a good heat dissipation effect and greatly prolong the life of the LED. chip lifetime. In other embodiments, the LED chip 305 can also be fixed on the surface of the second layer 302 on the fixing part 3031, and the heat dissipation of the LED chip is directly conducted to the The aluminum plate of the first layer 301 achieves the effect of heat dissipation. In this embodiment, in order to make the LED light bar emit light evenly, the LED chips 305 on both sides of the double-sided substrate 300 are arranged symmetrically based on the double-sided substrate 300 . In other embodiments, the double-sided substrate 300 The LED chips on both sides can also be set arbitrarily according to the actual situation.

Step S330: wire bonding. Please refer to FIG. 2C , which is a structural schematic diagram of the wire bonding step in the manufacturing process flow of the double-sided LED light bar of the present invention. First, place the double-sided substrate 300 on the base carrier 500 with one side facing up, and connect the positive and negative poles on the surface of the LED chip 305 to the wires on the third layer 303 through conductive wires 306. Connection; turn over the double-sided substrate 300 so that the other side faces up, and connect the positive and negative poles on the surface of the LED chip 305 on the other side of the double-sided substrate 300 to the third electrode on the other side of the double-sided substrate 300 through conductive wires 306. The wires on layer 303 are electrically connected, completing the wire bonding. Wherein, the wires on the third layer 303 are electrically connected to an external power source, and the LED chip is lit by the external power source.

Step S340: Stamping. The mixture of encapsulating glue and fluorescent powder is pressed on the surface of the LED chip by molding. Please refer to FIG. 2D(1), which is a schematic diagram of the structure of the double-sided substrate of the present invention located in the mold. Please refer to FIG. 2D ( 2 ), which is a partial schematic cross-sectional view of the double-sided substrate after compression molding. Firstly, the encapsulant and fluorescent powder are fully stirred and mixed uniformly as the encapsulant 307, and the double-sided substrate 300 with the conductive wires welded is sent into the cavity of the upper mold 501 and the lower mold 502 of the molding machine, and the encapsulant 307 is placed After entering the mold, the encapsulation compound 307 is cured after the mold is heated by the equipment, and then the equipment automatically transfers the molded double-sided substrate 300 out to complete the molding. The present invention does not limit the mixing ratio of the encapsulant and the fluorescent powder, which can be determined according to actual conditions. Please refer to FIG. 2D (2), in this embodiment, the packaging material 307 is integrally pressed on the surface of the LED chip on the fixing part 3031 by molding.

Step S350: punching. Please continue to refer to FIG. 2D ( 2 ), the molded double-sided substrate 300 is cut into several LED light strips 310 along the middle position in the longitudinal direction of the clamping part 3032 . Please refer to FIG. 2E , which is a schematic structural diagram of the double-sided LED light bar of the present invention. As shown in Figures 2D(2) and 2E, each LED light bar 310 includes an encapsulation portion 311 and exposed portions 312 on both sides of the encapsulation portion 311, and the encapsulation portion 311 is covered with several LED chips. In this embodiment, the packaging part of the LED light bar 310 is a mixture of packaging glue and phosphor powder in the present invention, and part of the heat generated by the LED chip is dissipated through the covering part 311. In the present invention, The exposed part 312 is a part of the double-sided substrate 300, the exposed part 312 can prevent the operator from touching the covering part 311 when picking up the LED light bar, and avoid artificial impurities appearing on the covering part 311, thereby affecting the light emission Effect.

In the present invention, there is no limitation on the size and shape of the double-sided substrate, which can be determined according to the actual number of required light bars and LED chips under the premise of ensuring the maximum utilization rate of the double-sided substrate.

It should be noted that the manufacturing process of the LED light bar of the present invention is also suitable for the manufacture of a single LED chip.

The manufacturing process of the double-sided light-emitting LED light bar of the present invention has a simple process and greatly improves production efficiency; and the LED light bar manufactured by the process of the present invention is double-sided light-emitting, which not only has a good luminous effect, but also makes the utilization rate of the substrate Greatly improved, the light-emitting surface of the present invention is strip-shaped, and several light-emitting LED particles are connected together, so that the light-emitting effect is better and more uniform.

The above description has fully disclosed the specific implementation manners of the present invention. It should be pointed out that any changes made by those skilled in the art to the specific embodiments of the present invention will not depart from the scope of the claims of the present invention. Accordingly, the scope of the claims of the present invention is not limited only to the foregoing specific embodiments.

Claims (6)

1. a kind of manufacturing process of the LED light bar of double-side, it is characterised in that：It comprises the following steps：

A double-sided substrate is provided, it includes ground floor, the second layer positioned at the ground floor both sides and positioned at the second layer Outside and the third layer for setting at equal intervals, are formed with several die bond grooves, the first of the double-sided substrate on the double-sided substrate Layer is aluminium sheet, and the second layer is thermally conductive insulating layer, and the third layer is circuit layer；

Die bond, installs LED chip in the die bond groove, and the LED chip is affixed on the ground floor in the die bond groove；

Bonding wire, is electrically connected the both positive and negative polarity on the LED chip surface with the third layer by conductor wire；

Pressing mold, the LED chip surface is pressed in by packaging plastic and phosphor mixture by molding；

Punching, some LED light bars are cut into by the double-sided substrate,

The third layer includes fixed part and matched moulds portion, and the fixed part and matched moulds portion alternate on the surface of the second layer Arrangement,

The die bond groove is that the surface from the surface of the third layer fixed part through the second layer to the ground floor extends Formed, the LED chip is installed on the ground floor in the die bond groove,

The bonding wire is that the both positive and negative polarity on the LED chip surface and the fixed part of the third layer are electrically connected by conductor wire Connect.

2. the manufacturing process of the LED light bar of double-side according to claim 1, it is characterised in that：The pressing mold be by Packaging plastic and phosphor mixture are by being molded the overall LED chip surface being pressed on the fixed part.

3. the manufacturing process of the LED light bar of double-side according to claim 1, it is characterised in that：The punching is edge The double-sided substrate is cut into some LED light bars by the centre position of the matched moulds portion longitudinal direction.

4. the manufacturing process of the LED light bar of double-side according to claim 1, it is characterised in that：In every LED light bar Including encapsulation part and the exposed portion positioned at encapsulation part both sides, the encapsulation part is coated with several LED chips.

5. the manufacturing process of the LED light bar of double-side according to claim 1, it is characterised in that：The heat conductive insulating Layer is epoxy resin, and the circuit layer is Copper Foil.

6. the manufacturing process of the LED light bar of double-side according to claim 1, it is characterised in that：The double-sided substrate The LED chip on two sides is symmetrical set based on the double-sided substrate.