CN102074557A - Light emitting device - Google Patents
Light emitting device Download PDFInfo
- Publication number
- CN102074557A CN102074557A CN 201010511601 CN201010511601A CN102074557A CN 102074557 A CN102074557 A CN 102074557A CN 201010511601 CN201010511601 CN 201010511601 CN 201010511601 A CN201010511601 A CN 201010511601A CN 102074557 A CN102074557 A CN 102074557A
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- CN
- China
- Prior art keywords
- circuit
- light
- emitting device
- led
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims abstract description 20
- 238000004806 packaging method and process Methods 0.000 claims abstract description 14
- 239000004696 Poly ether ether ketone Substances 0.000 claims abstract description 12
- 229920002530 polyetherether ketone Polymers 0.000 claims abstract description 12
- 239000011159 matrix material Substances 0.000 claims description 9
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 5
- 239000005864 Sulphur Substances 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 208000003351 Melanosis Diseases 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000005987 sulfurization reaction Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 241001025261 Neoraja caerulea Species 0.000 description 1
- 239000004954 Polyphthalamide Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- NWFNSTOSIVLCJA-UHFFFAOYSA-L copper;diacetate;hydrate Chemical compound O.[Cu+2].CC([O-])=O.CC([O-])=O NWFNSTOSIVLCJA-UHFFFAOYSA-L 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920006375 polyphtalamide Polymers 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 150000003378 silver Chemical class 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Led Device Packages (AREA)
Abstract
The invention provides a LED packaging light emitting diode display panel device with sufficient heat resistance and heat conductivity. The light emitting device is characterized in that, combine a (circuit) basic body containing and integrating with circuit patterns with a (circuit) housing to form a packaging body, the packaging body receives LED chips in a concave part of the packaging body, the LED chips are configured on an element substrate. The (circuit) basic body and the (circuit) housing are formed via preferably selecting PEEK. What's more, a reflector and a sealing body can be added.
Description
Technical field
The present invention relates to light-emitting device (COB module), particularly relate to the light-emitting device (COB module) that uses packaging body newly developed.
Background technology
Light-emitting diode (LED:Light Emitting Diode) is its representative with display unit (referring to patent documentation 1) and light-emitting device (referring to patent documentation 2), is used as ligthing paraphernalia, display, Backlight For Liquid Crystal Display Panels etc. and extensive use.
To from diode, obtain light, the lead that diode element must be arranged and switch on to diode, but, also need to use and do not allow the light that sent produce the reflecting material of waste and the light transmissive material that reduces optical attenuation, allow light invest the condensing body (lens etc.) of desirable direction in addition and regulate the fluorescent material of color of the light of taking-up.The measure that the heat that is produced when changing for electric light in addition, conducts with heat release also is absolutely necessary.
Patent documentation 2, according to the example of Fig. 3, done following description to the LED light-emitting device: " light-emitting device (COB module) 21 have base plate for packaging for example device substrate 22, be loaded into a plurality of, preferably a large amount of on this device substrate 22 as the blue-light LED chip 24 on the device substrate 23 of semiconductor light-emitting elements, circuit pattern 25, the resin bed 26 that contains fluorophor, reflector 27, tack coat 28, light diffusing member 29 and reflector 30.The resin bed 26 that contains fluorophor also plays seal member simultaneously.”
Further describe for: " device substrate 22 is made by the flat board of metal or insulating material (for example synthetic resin), and for obtaining the required light-emitting area of light-emitting device 21, the shape of substrate will have the shape of regulation, for example rectangle.If device substrate 1 is plastic words, can uses the epoxy resin that for example mixes glass dust to wait and form.”
" luminescent coating is the layer that keeps fluorophor, and this layer can be scattered in the transparent resin of for example silicones, epoxy resin and so on stratification by the fluorophor mixing with above-mentioned one or more and make.Though luminescent coating can form with the outside that directly is covered in light-emitting component, also can form transparent resin layer by direct earlier covering luminous element, the layer that contains above-mentioned fluorophor is set then in the above.In addition, can also will contain the process of resin flakiness shape of fluorophor earlier, the fluorescence thin section with heat hardening is configured on the transparent resin layer that forms by direct covering luminous element again.”
LED substrate and the guard block with lensing as insulating material, mainly are to use epoxy resin (having soaked into the glass nonwoven fabrics of epoxy resin) usually.But, along with the emergence of blue-ray LED, main flow is just beginning to shift to silicones recently.Its reason is that the light transmission rate in shortwave band territory is especially superior because silicones is compared with epoxy resin.
The purposes of LED not only is confined to image and shows, also is widely used at powerful lighting field.But, one is applied on the high-power product, and employed in the past encapsulation is broken down just to begin to become and surfaced.
Encapsulation in the past is normally toward the middle thin metal layer (thin plate) that inserts circuit pattern of moldable resin (mainly being polyphthalamide resin (A)).Owing to used copper in the circuit pattern, consider the relation of reflectivity, generally to implement silver-plated.But one is applied to high-power product, and the sulfuration problem of this silver coating just can become and surface.
The sulfuration of silver coating is the result who reacts with the sulphur that comes from the outside.Its reason is considered to circuit pattern from encapsulation and the slit between the insulating resin (using A usually) of loop circuit capable pattern and has invaded sulphur and cause.
Between circuit pattern and the insulating resin,,, have the slit thus unavoidably so they only fit together if use binding agent can hinder heat conduction.But this slit can be sealed in the stage that is embedded to encapsulant.When encapsulant was epoxy resin, the intrusion meeting of sulphur was controlled, but after encapsulant changes silicones into, and the infiltration of the sulphur that produces through silicones has just become to cause the main cause vulcanized.
In addition, the heating problem that is accompanied by high-power thing followed LED has also become an important problem.In LED, input 9 one-tenth of the energy is consumed as heat energy.In the past, about the thermal endurance of employed resin,, required that Reflow Soldering temperature (about 270 ℃) was had thermal endurance owing to when embedding LED, adopt reflow process.At this moment, as long as can in the short time of reflow process, sustain, even a bit softening requirement of also having satisfied at last takes place for what.But for the heating of the LED in using, because long-time continuing, thus just must consider because the flavescence of the resin that uses, and the softening and danger of being out of shape in time that cause, thus come to realise the necessity of reinforcement heat conduction and heat release measure.
Patent documentation 1: the spy opens flat 10-242523 communique
Patent documentation 2: the spy opens the 2009-111273 communique
Summary of the invention
The objective of the invention is to solve above-mentioned problem, exploitation has the LED encapsulation of sufficient thermal endurance and conductivity of heat, and a kind of light-emitting diode display panel device is provided thus.
The feature of light-emitting device of the present invention (COB module) is, (circuit) matrix and (circuit) case that contains circuit pattern and form one lumped together, and forms packaging body, accommodates the recess of led chip in described packaging body, and these are configured on the device substrate.
Above-mentioned (circuit) matrix and above-mentioned (circuit) case preferably are made of PEEK (polyether-ether-ketone).In addition, can additional reflector and seal.
According to the present invention,, can realize high-fire resistance, particularly discoloration-resistant by using the patterned layer PEEK (polyether-ether-ketone) that keeps Wiring pattern (circuit pattern).In addition, because covering the patterned layer and the case spare of its both sides, the clamping circuit pattern all thinks PEEK, and because PEEK and metal have compatibility, thus can not produce the slit between circuit pattern and the PEEK, thus avoided sulphur to permeate thus and the melanism of the silver coating that causes.In addition, because patterned layer and case spare use commaterial, thus between them, there is not the intervention of tack coat, and form as one by directly fusing mutually, thereby can reduce thickness, bring into play its usefulness by the heat transfer heat release.
In addition, owing to use " the aluminum metal substrate " of surperficial mirror-polishing, LED element and " aluminum metal substrate " be in abutting connection with configuration, thereby can bring into play the light that LED is sent effectively simultaneously and up reflect, and the heat that LED sends is down conducted the function of heat release.
Description of drawings
Below, with reference to accompanying drawing the present invention is elaborated.
Fig. 1 is the structure key diagram of light-emitting device of the present invention (COB module).
Fig. 2 is that the part of the structure of light-emitting device of the present invention (COB module) is amplified key diagram.
Fig. 3 is the structure key diagram of the light-emitting device (COB module) of prior art.
Embodiment
Light-emitting device among the present invention (COB module) by device substrate 2, luminous element be on the device substrate 3 led chip 4, the conduction road be that (circuit) matrix 6 of circuit pattern 5, holding circuit pattern 5 and (circuit) case 7 of circuit pattern 5 are formed.Be connected with lead 8 between led chip 4 and the circuit pattern 5.
Shown in Figure 2 as unit of the present invention light-emitting device enlarged drawing, its basic comprising is: be provided with (circuit) case 7 and reflector thereon 9, and be provided with the seal 10 that contains led chip 4, circuit pattern 5 and lead 8.
As device substrate 2, for the function that makes up function of reflecting of light that its performance sends luminous element, bring into play again simultaneously heat that luminous element is sent to be conducted effectively, preferred its luminous side of using at least is through the aluminium sheet of mirror finish.
As circuit pattern 5, by convention,, use copper alloy, electroplate in order to obtain electric conductivity.Circuit pattern 5 as with the stacked thin layer of (circuit) matrix, for example can form desirable pattern with etching method etc.Also can form pattern with vapour deposition method etc.
For (circuit) matrix 6, mainly be conceived to thermal endurance and intensity in the past, thus epoxy resin nearly all used, but, pay attention to the associativity with metal material in the present invention, use both to have had thermal endurance simultaneously, also have the confluent PEEK (polyether-ether-ketone) with seal.(circuit) case also is to use PEEK for the same reason.Because (circuit) matrix 6 and (circuit) case 7 use commaterials, therefore can also be implemented in the intervention that does not have tack coat between them simultaneously and directly fuse to mutually combine and become the advantage of one by heat.
(circuit) matrix 6 that contains circuit pattern 5 and form as one and (circuit) case 7 lump together and are also referred to as packaging body.Packaging body is provided with the recess 11 of the led chip 4 of accommodating on the device substrate 3.
Reflector 9 is to allow the light that luminous element sent invest the parts of desirable direction, and as shown in the figure, it is provided with direction and is not limited to keep vertical with device substrate, and suitable angle can tilt.The inclined plane both can be plane combination, also can be the concave surface of the sphere paraboloid of revolution etc. or the suitable face of convex surface.Reflector 9 can use common thing.
Seal 10 contains led chip 4, circuit pattern 5, lead 8, is to be used for protecting them not to be subjected to the parts of external interference, but, owing to disperse to have cooperated fluorescer, so also play a part the light that luminous element sends is adjusted to desirable color.Simultaneously, the sensing for light also plays a part lens.
As seal 10, so long as the good thing of printing opacity is not particularly limited.The permeability of blue light of not associating is considered, preferably uses siloxane resin.
In the present invention, packaging LED chips 4 is inserted into recess, and is configured on the device substrate 2 between device substrate 3.So, device substrate 2 conduction and the heat release rapidly that the heat that produces in packaging LED chips 4 is made by the good aluminium of heat transfer property.
In the above description, particularly in Fig. 1, imagined the ligthing paraphernalia of the led chip that uses a plurality of identical type.Certainly, the present invention is not limited to this, also can be configured to row or leg-of-mutton shape as display unit red and verdigris color as one group.
In the superincumbent explanation, the present invention can provide a kind of melanism that had not both had silver coating, long light-emitting device (COB module) of xanthochromia and life-span also seldom takes place in the resin material of uses such as seal, therefore, we can say that the present invention has the place that is worth attracting attention in the contribution to the LED applied technical field.
Claims (3)
1. light-emitting device is characterized in that: the circuit matrix and the circuit case that will contain circuit pattern and form one lump together, and form packaging body, accommodate the recess of led chip in described packaging body, and these are configured on the device substrate.
2. according to the described light-emitting device of claim 1, it is characterized in that: described circuit matrix and described circuit case are made up of polyether-ether-ketone.
3. according to claim 1 or 2 described light-emitting devices, it is characterized in that: added reflector and seal.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009242030A JP2011091126A (en) | 2009-10-21 | 2009-10-21 | Light emitting device (cob module) |
| JP2009-242030 | 2009-10-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102074557A true CN102074557A (en) | 2011-05-25 |
Family
ID=44033024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010511601 Pending CN102074557A (en) | 2009-10-21 | 2010-10-13 | Light emitting device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2011091126A (en) |
| KR (1) | KR20110043437A (en) |
| CN (1) | CN102074557A (en) |
| TW (1) | TW201143151A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104051603A (en) * | 2014-03-20 | 2014-09-17 | 苏州东山精密制造股份有限公司 | A kind of manufacturing process of double-sided LED light bar |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6486099B2 (en) * | 2014-12-19 | 2019-03-20 | シチズン電子株式会社 | LED light emitting module |
| KR102519814B1 (en) * | 2016-12-15 | 2023-04-10 | 루미리즈 홀딩 비.브이. | LED module with high near-field contrast ratio |
| JP7231832B2 (en) | 2019-12-27 | 2023-03-02 | 日亜化学工業株式会社 | Light-emitting device, liquid crystal display device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1468048A (en) * | 2002-05-30 | 2004-01-14 | ��ʽ�����װ | Enhancement of current-carrying capacity of a multilayer circuit board |
| CN1591924A (en) * | 2003-07-29 | 2005-03-09 | 西铁城电子股份有限公司 | Surface-mounted LED and light emitting device with same |
| CN101047222A (en) * | 2006-03-28 | 2007-10-03 | 东芝照明技术株式会社 | Light emitting device |
| CN101136399A (en) * | 2006-08-29 | 2008-03-05 | 东芝照明技术株式会社 | lighting device |
| CN101213675A (en) * | 2005-06-30 | 2008-07-02 | 松下电工株式会社 | light emitting device |
| CN101361414A (en) * | 2006-04-03 | 2009-02-04 | 松下电器产业株式会社 | Multilayer printed circuit board and its manufacturing method |
-
2009
- 2009-10-21 JP JP2009242030A patent/JP2011091126A/en active Pending
-
2010
- 2010-09-17 KR KR1020100091647A patent/KR20110043437A/en not_active Withdrawn
- 2010-10-13 CN CN 201010511601 patent/CN102074557A/en active Pending
- 2010-10-14 TW TW99135054A patent/TW201143151A/en unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1468048A (en) * | 2002-05-30 | 2004-01-14 | ��ʽ�����װ | Enhancement of current-carrying capacity of a multilayer circuit board |
| CN1591924A (en) * | 2003-07-29 | 2005-03-09 | 西铁城电子股份有限公司 | Surface-mounted LED and light emitting device with same |
| CN101213675A (en) * | 2005-06-30 | 2008-07-02 | 松下电工株式会社 | light emitting device |
| CN101047222A (en) * | 2006-03-28 | 2007-10-03 | 东芝照明技术株式会社 | Light emitting device |
| CN101361414A (en) * | 2006-04-03 | 2009-02-04 | 松下电器产业株式会社 | Multilayer printed circuit board and its manufacturing method |
| CN101136399A (en) * | 2006-08-29 | 2008-03-05 | 东芝照明技术株式会社 | lighting device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104051603A (en) * | 2014-03-20 | 2014-09-17 | 苏州东山精密制造股份有限公司 | A kind of manufacturing process of double-sided LED light bar |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011091126A (en) | 2011-05-06 |
| KR20110043437A (en) | 2011-04-27 |
| TW201143151A (en) | 2011-12-01 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110525 |