JP2010093303A - Method of manufacturing electronic device - Google Patents

Abstract

Even when a package using a glass lid is mounted, an electronic device that does not cause cracking or peeling in a bonding material that is a bonding portion between a lid and a package base by sandwiching a resin portion. A manufacturing method is provided.
A method of manufacturing a piezoelectric oscillator 10 in which a resin portion 52 is formed around a package 12, wherein a plurality of packages 12 are arranged in a frame, a resin is poured, and the plurality of packages 12 are covered with the resin. A step of scraping out the resin adhering to the upper surface of the lid 16 of the plurality of packages 12 and a part of the resin poured between the lids 16 of the adjacent packages 12 with a squeegee; And the step of separating the piezoelectric oscillator 10 into individual pieces for each of the packages 12 after the resin is cured.
[Selection] Figure 1

Description

  The present invention relates to a method for manufacturing an electronic device, and more particularly to a method for manufacturing an electronic device suitable for a case where a resin lid is used around a package constituting the electronic device and a glass lid is used as the lid of the package. .

  A piezoelectric device as shown in FIG. 19 is known as an example of an electronic device that achieves both a reduction in mounting area and ensuring excellent airtightness. Specifically, a circuit element such as an IC 3 is mounted on the wiring board 2, and a conductive connecting member 5 is interposed between the piezoelectric vibrator 4 disposed on the wiring board 2 and the wiring board 2. The piezoelectric device 1 has a so-called two-story structure. The piezoelectric device 1 covers the upper surface of the wiring substrate 2 to the upper surface of the piezoelectric vibrator 4 excluding the lid 4a with a resin member 6. By covering the circuit element and the electrical connection portion with the resin member 6 in this way, it is possible to suppress the deviation of the resonance frequency due to the influence of humidity and improve the reliability as the piezoelectric device (piezoelectric oscillator) 1. The piezoelectric device 1 having such a configuration is disclosed in Patent Document 1, for example.

Japanese Patent Laid-Open No. 2008-078778

  The piezoelectric device 1 configured as described above can certainly contribute to the reduction of the mounting area and the securing of high airtightness. However, in recent years, in response to a demand for higher accuracy of the piezoelectric vibrator 4, it is required to adopt a glass lid as the lid 4a of the piezoelectric vibrator 4 to be used so that the frequency can be adjusted after the package is sealed. Many.

  However, when a glass lid is employed, the ceramic is fixed to the package base by using a brittle material such as low-melting glass as a bonding material. Unlike metals, glass is not ductile and highly brittle. When the piezoelectric device is clamped by the chucking jig 7 in order to mount the piezoelectric device on the mounting substrate, the jig may come into contact with the corner of the resin portion covering the piezoelectric vibrator depending on the clamping angle. When the clamping jig comes into contact with the corner of the resin part and stress is applied to the corner part, the stress is concentrated on the joint part of the low-melting glass having high brittleness, causing problems such as cracking and peeling. there is a possibility.

  Therefore, in the present invention, even when a package using a glass lid is mounted, an electron that does not cause cracking or peeling in the bonding material, which is a bonding portion between the lid and the package base, by sandwiching the resin portion. It is also an object to provide a method for manufacturing a device.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

A method for manufacturing an electronic device according to a first aspect is a method for manufacturing an electronic device in which a resin portion is formed around a package, wherein a plurality of packages are arranged in a frame and a resin is poured into the plurality of packages. A step of covering with a resin, a step of scraping out the resin adhering to the upper surfaces of the lids of the plurality of packages, and a part of the resin poured between the lids of the adjacent packages with a squeegee, and the resin And a step of separating the electronic device into individual pieces for each of the packages after curing.
By manufacturing an electronic device in such a process, even when a package using a glass lid is mounted without increasing the number of processes compared to the conventional manufacturing process, the lid and the package base are held by sandwiching the resin part. It is possible to manufacture an electronic device that does not cause cracking or peeling in the bonding material that is a bonding portion with the base.

A method for manufacturing an electronic device according to a second aspect is the method for manufacturing an electronic device according to the first aspect, wherein the step of scraping out the resin is performed in only one of the long side direction and the short side direction of the package. The manufacturing method of the electronic device characterized by performing with respect to this.
By adopting such a method, it is possible to manufacture the above-described electronic device if the resin is scraped only in either the long side direction or the short side direction.

A method for manufacturing an electronic device according to a third aspect is a method for manufacturing an electronic device in which a resin portion is formed around a package, wherein a plurality of packages are arranged in a frame and a resin is poured into the plurality of packages. A step of covering with a resin, a step of scraping the resin adhering to the upper surfaces of the lids of the plurality of packages with a squeegee, and a step of separating the electronic device with a first blade after the resin is cured Half-cutting the resin along the cutting line, and after the half-cutting process, the second blade having a width narrower than the first blade is used to cut the resin along the cutting line. And a step of cutting and separating the electronic device into individual pieces.
By manufacturing an electronic device in such a process, the sagging portion can be formed by machining. Therefore, the shape of the sag portion can be manufactured without variation, and individual differences in resistance to lid cracking and peeling can be eliminated.

A method for manufacturing an electronic device according to a fourth aspect is the method for manufacturing an electronic device according to the third aspect, wherein the half-cut process is performed only in one of the long side direction and the short side direction of the package. A method for manufacturing an electronic device, which is performed on the electronic device.
By performing half-cutting on only one of the sides, the half-cut process time can be shortened.

Application Example 1 An electronic device having a package configured by bonding a lid to a bonding surface of a package base with a bonding material, and a resin portion covering the periphery of the package, wherein the resin portion includes at least the resin portion Of the resin portion covering the package base and the bonding material, and covering the periphery of the package, at least a part of the cross-sectional outline is the cross-sectional outline in the direction parallel to the mounting surface of the electronic device. An electronic device having an outermost part located outside, wherein the outermost part is located below a lower surface of the lid in a direction perpendicular to the mounting surface of the electronic device.
In the case of an electronic device having such a configuration, even when a brittle material is used as a bonding material for bonding the package base and the lid, stress on the resin portion may be concentrated on the lid or the bonding material. Disappear. For this reason, it can suppress that a crack and peeling arise in a lid by clamping of a resin part.

Application Example 2 In the electronic device according to Application Example 1, the outermost portion is located below the bonding surface of the package base in a direction perpendicular to the mounting surface of the electronic device. A featured electronic device.
By setting it as such a structure, it can suppress more effectively that the stress added to a resin part acts on a joining material. Therefore, cracking and peeling of the lid can be prevented.

[Application Example 3] In the electronic device according to Application Example 1 or Application Example 2, the cross-sectional outline includes a sag portion that connects between the outermost upper end and the surface of the lid, An electronic device characterized in that the sag portion is formed in a fillet shape.
By setting it as such a structure, it can suppress more reliably that the stress added to a resin part acts on a lid. Moreover, even when stress is applied to the sag portion, an effect of diffusing it can be exhibited.

Application Example 4 In the electronic device according to Application Example 1 or Application Example 2, the formation outside the cross section includes a sag portion that connects between the outermost upper end and the surface of the lid, An electronic device characterized in that the sagging portion is formed in a chamfered shape.
The sag portion having such a configuration can be formed by machining. For this reason, there is no individual difference in the shape and depth of the sag portion, and cracking and peeling of the lid and cracking of the bonding material can be suppressed.

Application Example 5 In the electronic device according to any one of Application Examples 1 to 4, the package is a piezoelectric vibrator that houses a piezoelectric vibrating piece, and is mounted on the lower surface of the package. An electronic device, wherein a circuit board including a circuit element is connected to the electrode via a conductive connection member, and the resin portion covers the circuit element and the connection member.
By adopting such a configuration, it is possible to protect the bonding member, circuit element, etc., and to have various roles such as ensuring the mechanical bonding strength between the circuit board and the package, and preventing cracking and peeling of the lid. Can do.

Application Example 6 An electronic device manufacturing method in which a resin portion is formed around a package, the step of placing a plurality of packages in a frame, pouring resin, and covering the plurality of packages with the resin, Scraping out the resin adhering to the upper surface of the lid of a plurality of packages and a part of the resin poured between the lids of adjacent packages with a squeegee, and after the resin is cured, the package And a step of separating the electronic device into individual pieces.
By manufacturing an electronic device by such a process, it becomes possible to manufacture the electronic device mentioned above, without increasing the number of processes compared with the conventional manufacturing process.

Application Example 7 In the electronic device manufacturing method according to Application Example 6, the step of scraping out the resin is performed only in one of the long side direction and the short side direction of the package. A method for manufacturing an electronic device.
By adopting such a method, it is possible to manufacture the above-described electronic device if the resin is scraped only in either the long side direction or the short side direction.

Application Example 8 An electronic device manufacturing method in which a resin portion is formed around a package, the step of placing a plurality of packages in a frame, pouring resin, and covering the plurality of packages with the resin, Scraping the resin adhering to the upper surfaces of the lids of a plurality of packages with a squeegee; and after the resin is cured, the resin along a cutting line for separating the electronic device by a first blade After the half-cut step and the half-cut step, the resin is cut along the cutting line by a second blade having a width smaller than that of the first blade, and the electronic device is A method of manufacturing an electronic device, comprising the step of:
By manufacturing an electronic device in such a process, it is possible to form the sag portion by machining. Therefore, the shape of the sag portion can be manufactured without variation, and individual differences in resistance to lid cracking and peeling can be eliminated.

Application Example 9 In the electronic device manufacturing method according to Application Example 8, the half-cut process is performed only in one of the long side direction and the short side direction of the package. Electronic device manufacturing method.
By performing half-cutting on only one of the sides, the half-cut process time can be shortened.

It is a figure which shows the structure of the electronic device which concerns on 1st Embodiment. It is the elements on larger scale of an electronic device. It is a 1st figure which shows the manufacturing process of the electronic device which concerns on 1st Embodiment. It is a figure which shows the process of arrange | positioning a connection member to the arrange | positioned sheet-like board | substrate. It is a figure which shows the process of mounting IC in a sheet-like board | substrate. It is a figure which shows the process of performing wire bonding to mounted IC. It is a figure which shows the process of mounting a piezoelectric vibrator via a connection member. It is a figure which shows the process of covering the whole piezoelectric oscillator with a resin member. It is a figure which shows the mode of resin part scraping with a squeegee. It is a figure which shows a mode that the concave groove | channel was formed between piezoelectric vibrators. It is a figure which shows the process of separating an electronic device into pieces. It is a figure which shows the structure of the electronic device which concerns on 2nd Embodiment. It is a figure which shows a common point with the manufacturing method of the electronic device which concerns on 1st Embodiment. It is a figure which shows the mode of resin part scraping with a squeegee. It is a figure which shows the mode of a half cut process. It is a figure which shows the process of separating an electronic device into pieces. It is a figure which shows the application form of a dripping part. It is a figure which shows the application form of the electronic device which concerns on this invention. It is a figure which shows the structure of the conventional electronic device.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of an electronic device manufacturing method of the invention will be described in detail with reference to the drawings. In the following embodiments, a piezoelectric device including a piezoelectric vibrator as an example of an electronic device, specifically, a piezoelectric oscillator will be described as an example.

First, a first embodiment relating to an electronic device manufactured by an electronic device manufacturing method of the present invention will be described with reference to FIG. 1A is a schematic diagram showing a side cross section of the piezoelectric oscillator, FIG. 1B is a plan view, and FIG. 1C is an AA arrow view in FIG. It is a figure which shows a cross section.
The piezoelectric oscillator 10 of the present embodiment basically includes the piezoelectric vibrator 11, an integrated circuit (IC) 42 as a circuit element, and a wiring board 30 on which the IC 42 is mounted. The piezoelectric vibrator 11, the IC 42, and The wiring boards 30 are arranged so as to overlap each other in the thickness direction.

  The piezoelectric vibrator 11 is basically configured of a piezoelectric vibrating piece 18 that is a vibrating element and a package 12 that accommodates the piezoelectric vibrating piece 18. Examples of the constituent member of the piezoelectric vibrating piece 18 include various piezoelectric materials such as quartz, lithium tantalate, and lithium niobate. From the viewpoint of temperature characteristics and the like, those composed of quartz are excellent. It is said that. Specific examples of the piezoelectric vibrating piece 18 using a quartz material include an AT cut piezoelectric vibrating piece, a BT cut piezoelectric vibrating piece, a tuning fork type piezoelectric vibrating piece, and a SAW element piece. The package 12 is basically composed of a package base 14 for mounting the piezoelectric vibrating reed 18 and a lid 16 that is a lid for sealing the upper opening of the package base 14.

  The package base 14 is formed by stacking a plurality of substrates formed by molding an insulating material, for example, an aluminum oxide ceramic green sheet, and sintering the substrates. In the case of the package base 14 configured as described above, at least two substrates are required to manufacture the package base of the form shown in FIG. 1A, that is, a substrate that forms the bottom plate and a substrate that forms the side wall. Is done. In the case of the package base 14 of this embodiment, a terminal (mounting pad) 20 for mounting the piezoelectric vibrating reed 18 is provided on one surface of a substrate constituting the bottom plate, and the other surface, that is, the bottom surface of the package base 14. Is provided with mounting external terminals 22 (22a, 22b). The mounting external terminal 22 a among the mounting external terminals 22 is electrically connected to the mounting pad 20 through the via hole 24.

  The lid 16 is composed of a translucent member having a thermal expansion coefficient close to that of the package base 14 described above, such as soda glass, as a base material, and is packaged through a bonding material 17 (see FIG. 2) such as low-melting glass not shown. Bonded to the bonding surface 14 a of the base 14.

  The piezoelectric vibrating reed 18 is mounted on the package base 14 configured as described above via the conductive adhesive 26. The outline of the mounting process is as follows. That is, the conductive adhesive 26 is applied onto the mounting pad 20 in the package base 14, and the piezoelectric vibrating reed so that the input / output electrodes (not shown) of the piezoelectric vibrating reed 18 are positioned above the applied conductive adhesive 26. 18 is installed. After the mounting of the piezoelectric vibrating piece 18 is completed, the upper opening of the package base 14 is sealed with the lid 16. The inside of the cavity 15 of the package 12 is preferably evacuated.

  One surface of the wiring board 30 is provided with a metal pattern for electrically connecting the piezoelectric vibrator 11 and the IC 42, and the IC 42 and the mounting external terminal 36. The mounting surface 31 which is the other surface (bottom surface) of the wiring substrate 30 is provided with a mounting external terminal 36 for mounting the piezoelectric oscillator 10 on a substrate (not shown) of an electronic device. Note that an adjustment terminal (not shown) may be provided on the other surface of the wiring board 30 for performing IC characteristic inspection and rewriting of information in the IC (characteristic adjustment) as necessary. .

  A coating 40 made of an insulating coating material such as a resist is formed on one surface of the wiring board 30, and bonding is electrically connected to the surface of the wiring board 30 via an IC 42 and a metal wire. Only the pad 34 and the connection pad 32 for arranging the connection member 50 whose details will be described later are exposed. The bonding pad 34 and the mounting external terminal 36 are electrically connected through a via hole 38 as shown in a part of the figure. In addition to the function as an oscillation circuit, the IC 42 may have a function for compensating frequency-temperature characteristics. The circuit element referred to in the present invention is not limited to an IC, and may be constituted by electronic components such as a resistor and a capacitor.

  The IC 42 of the present embodiment is mounted in the vicinity of the center of one surface of the wiring board 30 described above with the active surface facing upward. For mounting the IC 42, it is desirable to use a non-conductive adhesive or an adhesive member 44 such as an adhesive sheet. Further, the IC 42 and the wiring substrate 30 are mounted by so-called wire bonding via a metal wire 48, specifically, a gold wire. Wire bonding in manufacturing the piezoelectric oscillator 10 of the present embodiment is performed by a pad disposed on the active surface of the IC 42 after the first bonding step of bonding to the bonding pad 34 disposed on the wiring substrate 30 side. A so-called reverse bonding method having a second bonding step for bonding to 46 is desirable. This is because, by performing bonding in this order, bonding is possible even when the linear distance between the bonding pad 34 on the wiring board 30 side and the pad 46 on the IC 42 side is short. In addition, with such a bonding method, the loop height of the metal wire 48 formed above the pad 46 on the IC 42 side can be suppressed. In the piezoelectric oscillator 10 of the present embodiment, the bonding pads 34 arranged on the wiring board 30 are arranged between the connection pads 32 to increase the distance between the pads 46 on the IC 42 side and the bonding pads 34, and The space on the surface of the wiring board 30 is effectively used.

  The piezoelectric vibrator 11 is mounted on the wiring board 30 above the IC 42 via a connection member 50 disposed on the connection pad 32. The connection member 50 electrically and mechanically connects the connection pads 32 disposed on the wiring board 30 and the mounting external terminals 22 disposed outside the package 12 of the piezoelectric vibrator 11. The connection between the mounting external terminal 22b, which is a terminal other than the terminal connected to the piezoelectric vibrating piece 18, and the connection pad 32 is a connection for ensuring the mechanical stability, connection strength, and the like of the piezoelectric vibrator 11. It is.

  Here, the connection member 50 may be a generally known solder ball or the like, but the connection member 50 in the present embodiment preferably has the following configuration. That is, it is composed of two or more members having different melting points, such as coating a conductive member having a low melting point with a member having a high melting point as a core. Specifically, copper or a high melting point resin is used as a spherical core, and solder is coated around this. By using the connection member having such a configuration, the height of the support object (the piezoelectric vibrator 11 in the present embodiment) is supported by the core while being electrically connected by solder coated around the core. Can be determined. In addition, when the core is made of a conductive member such as copper, electrical connection is also made at that portion.

  The piezoelectric oscillator 10 of this embodiment includes a resin portion 52 made of an insulating resin as a protective member in addition to the above-described components. The resin portion 52 is made of a resin member (mold material) formed from the surface of the wiring board 30 on which the IC 42 is mounted to the upper end surface of the lid 16 of the piezoelectric vibrator 11. The resin portion 52 covers the IC 42 mounted on one surface of the wiring substrate 30, the connection member 50, the package base 14 in the piezoelectric vibrator 11, and the bonding material 17. By making the covering form by the resin part 52 in this way, it becomes possible to expose the upper surface of the light-transmitting lid 16 to the outside while increasing the covering part by the resin part 52.

  After the piezoelectric oscillator 10 is configured by exposing the upper surface of the lid 16 to the outside, that is, after the piezoelectric vibrator 11 and the IC 42 (wiring board 30) are combined, the laser is transmitted through the lid 16 from the outside, and the piezoelectric vibrating piece It is possible to adjust the oscillation frequency by irradiating 18 and to reduce the error from the desired oscillation frequency. In addition, when marking is performed on the surface of the lid 16 by printing or the like, it can be confirmed visually.

  That is, various effects such as enhanced resistance to moisture, adjustment of the oscillation frequency after combining the IC 42, and visualization of the marking can be realized. Further, in the reflow process when the piezoelectric oscillator 10 is mounted on the mounting substrate of the electronic device, even if the piezoelectric oscillator 10 is heated and the connection member 50 is melted, the connection member 50 is covered with the resin portion 52. The molten connecting member 50 does not flow out of the piezoelectric oscillator 10. In the piezoelectric oscillator 10 of the present embodiment, the resin portion 52 is formed to the same height as the upper surface of the lid 16. That is, since the resin sealing is performed except for the upper surface of the lid 16, the bottom surface of the wiring substrate 30, and the side surface of the wiring substrate 30, the piezoelectric oscillator 10 can be reduced in height while obtaining the protection effect by the resin portion 52. .

  FIG. 2 is a partially enlarged view of the piezoelectric oscillator 10 of the present embodiment, and is a cross-sectional view of a plane perpendicular to the mounting surface 31 of the piezoelectric oscillator 10. At least a part of the resin portion 52 surrounding the package base 14 has a cross-sectional outline 53 as shown in FIG. The cross-sectional outline 53 connects the outermost part 55 where the cross-sectional outline 53 is located on the outermost side in the direction parallel to the mounting surface 31 of the piezoelectric oscillator 10, and the upper end 54 b of the outermost part 55 and the surface of the lid 16. The outermost portion 55 is positioned below the lower surface of the lid 16 in the direction perpendicular to the mounting surface 31 of the piezoelectric oscillator 10. Specifically, the piezoelectric oscillator 10 is configured to form a sag portion 54 in which the height of the resin portion 52 is reduced in a fillet shape from the outer edge of the lid 16 toward the side surface of the resin portion 52 at the upper end portion of the resin portion 52. ing. More specifically, the horizontal position of the lower end 54 a (see FIG. 2) of the fillet (sagging portion 54) with the upper end 54 b as the outer edge of the upper surface of the lid 16, that is, the horizontal position of the side end is set to the lower surface 16 a of the lid 16. It is located below the horizontal position.

  With this configuration, the piezoelectric oscillator 10 is mounted on the mounting substrate even when the bonding material 17 made of a brittle material such as low-melting glass is used for the bonding portion between the package base 14 and the lid 16. At this time, the stress is not concentrated on the bonding material 17 by bringing the chucking jig into contact with the resin portion 52. For this reason, even when the chucking jig is in contact with the resin portion 52 at an angle, it is possible to prevent the joint portion between the package base 14 and the lid 16, the crack of the lid 16, and the separation of the lid 16. .

  The outermost portion 55 is positioned below the bonding surface 14a of the package base 14 in the direction perpendicular to the mounting surface 31 of the piezoelectric oscillator 10, so that the concentration of stress on the bonding material 17 can be more reliably suppressed. .

  A broken line 11 a shown in FIG. 1C indicates the outer shape of the piezoelectric vibrator 11. As described above, the piezoelectric vibrator 11 is disposed inside the outer shape of the wiring board 30 with a predetermined gap. Since the resin member is disposed in the gap and the entire four side surfaces of the piezoelectric vibrator 11 are covered with the resin member, the piezoelectric vibrator 11 is more firmly fixed.

  Further, in the piezoelectric oscillator 10 having the above-described configuration, before mounting the piezoelectric vibrator, the defect is found by mounting the piezoelectric vibrator 11 on the wiring board 30 by performing operation check and frequency adjustment of the piezoelectric vibrator 11. can do. As a result, it is possible to eliminate the waste of finding a defect after mounting the piezoelectric vibrator 11 and discarding the entire piezoelectric oscillator 10 together with the IC 42, thereby reducing the manufacturing cost.

  Next, a method for manufacturing the piezoelectric oscillator having the above configuration will be described. First, a sheet-like wiring board (sheet-like board) 30a is placed on a resin molding frame (not shown) with one surface facing up. Here, the sheet-like substrate 30a refers to a substrate in a state before the wiring substrate 30 in the piezoelectric oscillator 10 whose configuration is described above is separated (see FIG. 3). Next, the connection member 50 is arrange | positioned to each of the connection pad 32 arrange | positioned at the sheet-like board | substrate 30a (refer FIG. 4). Thereafter, the ICs 42 are mounted at predetermined positions on the sheet-like substrate 30a (see FIG. 5). After mounting the IC 42, the pads 46 arranged on the active surface of the IC 42 and the bonding pads 34 (not shown) arranged on the sheet-like substrate 30a are connected by metal wires 48 (see FIG. 6). Thereafter, the piezoelectric vibrator 11 manufactured in advance is mounted on the sheet-like substrate 30a via the connection member 50 (see FIG. 7).

After mounting the piezoelectric vibrator 11, a resin member 52a having fluidity is poured into a frame (not shown) in which the sheet-like substrate 30a is arranged, and the entire piezoelectric oscillator including the piezoelectric vibrator 11 is covered with the resin member 52a (see FIG. 8). Before the poured resin member 52a is cured as the resin portion 52, the surface of the lid 16 of the piezoelectric vibrator 11 is rubbed with a spatula (squeegee) 80 or the like, and the resin member 52a covering the surface of the lid 16 is scraped off. At this time, scraping is performed while pressing the squeegee 80 so that the tip of the squeegee 80 is positioned below the bonding surface 14a (see FIG. 2) of the side wall (frame portion) of the package base 14 constituting the piezoelectric vibrator 11. (See FIG. 9). Thereby, the resin member located between the piezoelectric vibrators 11 can be scraped off excessively. For this reason, the resin member that has flowed between the adjacent piezoelectric vibrators 11 is affected by the surface tension between the adjacent piezoelectric vibrators 11 with the side surface of the lid 16 having wettability as the highest portion (upper end portion 54b). It will take the shape that a center part is dented. In this way, by carrying out the step of scraping the resin member 52a adhering to the exposed portion before the poured resin member 52a is cured, the surface of the lid 16 is easily damaged without damaging the lid 16. It is possible to remove the adhered resin member 52a. In addition, since the gap provided between the piezoelectric vibrators 11 is connected in the vertical and horizontal directions, the resin is applied only from one of the vertical direction (long side direction) or the horizontal direction (short side direction) (for example, the vertical direction). By scraping off the member excessively, the resin member flows from the gap in the remaining direction (for example, the lateral direction), and it is possible to form fillets from the upper surface of the lid in both the vertical and horizontal grooves (see FIG. 10). ).
After the resin member 52a is cured, a portion indicated by a broken line in FIG. 10 is diced and separated into pieces as a piezoelectric oscillator, and the piezoelectric oscillator 10 is completed (see FIG. 10).

  By manufacturing the piezoelectric oscillator 10 in such a process, it is possible to adjust the frequency of the piezoelectric vibrator 11 on the resin member while increasing the resin sealing portion and improving the resistance to moisture and the like. Further, when the lid 16 of the piezoelectric vibrator 11 is marked, a piezoelectric oscillator that can visually check this can be manufactured. Furthermore, since the configuration of the sag portion 54 to the upper end portion of the resin portion 52 is only required to change the pressing depth of the squeegee 80, the piezoelectric oscillator 10 according to the present embodiment has the same number of steps as the conventional piezoelectric oscillator manufacturing method. Can be manufactured.

  Further, the manufactured piezoelectric oscillator 10 can be obtained by chucking the resin portion 52 even when the bonding material 17 made of a brittle material such as low-melting glass is used for the bonding portion between the package base 14 and the lid 16. There is no concentration of stress on the bonding material 17, and no cracks or peeling occurs in the portion.

  Next, a second embodiment of the electronic device manufactured by the electronic device manufacturing method of the present invention will be described with reference to FIG. Most of the configuration of the electronic device according to this embodiment is the same as that of the piezoelectric oscillator 10 according to the first embodiment shown in FIGS. Therefore, portions having the same configuration are denoted by reference numerals obtained by adding 100 to the drawings, and detailed description thereof will be omitted.

  The difference between the piezoelectric oscillator 110 according to the present embodiment and the piezoelectric oscillator 10 according to the first embodiment is in the form of a sag portion in the resin portion. That is, in the piezoelectric oscillator 10 according to the first embodiment, a fillet is formed from the outer edge of the upper surface of the lid 16 toward the side surface of the resin portion 52. On the other hand, in the piezoelectric oscillator 10 according to the present embodiment, a chamfered inclined surface is formed from the outer edge of the lid upper surface toward the side surface of the resin portion 52, and this is used as a sag portion 154.

Even in such a configuration, similar to the piezoelectric oscillator 10 according to the first embodiment described above, stress concentration on the bonding material 17 is avoided, and cracking or peeling of the bonding portion between the package base 14 and the lid 16 is prevented. It becomes possible to suppress. In addition, by forming the sag portion 154 in such a form, the sag portion 154 can be formed by machining. For this reason, there is no difference due to the difference in ease of flow of the resin member. Other configurations, operations, and effects are the same as those of the piezoelectric oscillator 10 according to the first embodiment.
The manufacturing method of the piezoelectric oscillator having such a configuration is as follows.

  First, the steps from mounting the piezoelectric vibrator 111 on the sheet-like substrate 130a, pouring the resin member 152a into a frame (not shown), and covering the entire piezoelectric oscillator with the resin member 152a are the piezoelectric elements according to the first embodiment described above. This is the same as the manufacturing method of the oscillator (see FIG. 13).

  Next, the resin member 152 a attached to the lid 116 of the piezoelectric vibrator 111 is removed using the squeegee 180. At this time, in the piezoelectric oscillator 10 according to the first embodiment, the resin filled between the piezoelectric vibrators 11 by pressing the squeegee 80 so that the tip of the squeegee 80 enters below the frame portion of the package base 14. Although it has been shown that a part of the member 52a is scraped, in this embodiment, it is only necessary to scrape only the resin member adhered to the upper surface of the lid 16, so that the tip of the squeegee 180 contacts the surface of the lid 116. It is only necessary to maintain the height as possible (see FIG. 14).

  After the resin member 152a is cured, the piezoelectric oscillator is half-cut using a blade (first blade) 190 having a thickness (width) that is approximately the same as the interval between the lids of the adjacent piezoelectric vibrators 111. The first blade 190 has an inclined surface at the edge portion and forms a V-shaped groove on the half-cut surface (see FIG. 15).

  After the half cut is completed, the central portion of the V-shaped groove is fully cut by a second blade (not shown) thinner than the first blade 190, and the piezoelectric oscillator 110 is separated into individual pieces ( (See FIG. 16).

  In this way, by performing two-stage cutting using blades having different thicknesses and shapes, the piezoelectric oscillator 110 having an inclined surface at the upper end portion of the resin portion 152 is manufactured as the separated piezoelectric oscillator 110. be able to.

Moreover, the electronic device manufactured by the manufacturing method of the electronic device of this invention is good also as a form which shows the upper end part of a resin part in FIG. The piezoelectric oscillator shown in FIG. 17 is almost the same in configuration as the piezoelectric oscillators shown as the first and second embodiments. Therefore, the same reference numerals shown in FIG. The reference numeral added with 200 is shown in FIG. 17, and detailed description thereof will be omitted. As a difference, a convex R is formed at the corner, and this is used as a sag 254. Even in the case where the sag portion 254 has such a configuration, the central point of the polarity forming R is positioned below the lower surface of the lid 16, preferably the horizontal position of the upper end of the side wall of the package base 14. Is desirable.
Even if it is a case where it is such a structure, there can exist an effect similar to the electronic device which concerns on the 1st, 2nd embodiment mentioned above.

  Further, the sag portion formed in the resin portion of the electronic device of the present invention is not necessarily provided so as to surround the lid, and may be provided at least in a place where stress is applied. It may be provided in a place where That is, as shown in FIGS. 18A and 18B, a sag portion 354 may be provided in the resin portion outside the two opposite sides of the lid 316 outer shape. Even the piezoelectric oscillator 310 having such a configuration can achieve the same effects as those of the electronic devices according to the first and second embodiments described above. Although the sagging portion 354 of the piezoelectric oscillator 310 shown in FIG. 18 is shown in a fillet shape, the sagging portion 354 may be formed by half-cutting. In this case, the shape of the sag portion 354 is chamfered, but there is no difference in the action, and the formation direction of the sag portion 354 is set to only one side forming either one of the long side direction (or the short side direction). As a result, the time required for the half-cut process can be shortened.

10 ......... Piezoelectric oscillator, 11 ......... Piezoelectric vibrator, 12 ......... Package, 14 ......... Package base, 16 ......... Lid, 18 ......... Piezoelectric vibrating piece, 20 ......... Mounting pad, 22 (22a, 22b) ......... External terminals for mounting, 24 ......... via holes, 26 ......... conductive adhesive, 30 ......... wiring substrate, 32 ......... connection pads, 34 .... bonding pads, 36 ..... External terminal for mounting, 38 .... via hole, 40 ..... coating, 42 .... IC, 50 .... connecting member, 52 .... resin part, 54 ..... sagging part.

Claims (4)

An electronic device manufacturing method for forming a resin portion around a package,
Placing a plurality of packages in a frame, pouring resin, and covering the plurality of packages with the resin;
Scraping out the resin adhering to the upper surfaces of the lids of the plurality of packages and a part of the resin poured between the lids of the adjacent packages with a squeegee;
And a step of separating the electronic device for each package after the resin is cured. A method of manufacturing an electronic device according to claim 1,
The method of manufacturing an electronic device, wherein the step of scraping out the resin is performed only in one of a long side direction and a short side direction of the package. An electronic device manufacturing method for forming a resin portion around a package,
Placing a plurality of packages in a frame, pouring resin, and covering the plurality of packages with the resin;
Scraping the resin adhering to the upper surface of the lid of the plurality of packages with a squeegee;
After the resin is cured, a half cut step of performing a half cut of the resin along a cutting line for separating the electronic device by the first blade;
After the half-cutting step, a step of cutting the resin along the cutting line with a second blade narrower than the first blade to separate the electronic device into pieces. An electronic device manufacturing method. A method of manufacturing an electronic device according to claim 3,
The method of manufacturing an electronic device, wherein the half-cut process is performed only on one of a long side direction and a short side direction of the package.

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