JP2009029841A - Film adhesive, micro coaxial cable, and method of manufacturing micro coaxial cable - Google Patents

Abstract

The present invention provides a film adhesive, a micro coaxial cable, and a method for manufacturing a micro coaxial cable that reduce connection resistance and suppress decrease in flexibility.
A micro coaxial cable includes a film adhesive, a micro coaxial cable, and a ground bar. The film adhesive 10 includes a resin 11 and solder particles dispersed in the resin 11. The ultrafine coaxial line includes a center conductor 111, an insulator 112 disposed on the outer periphery side of the center conductor 111, an outer conductor 113 including a plurality of conductors disposed on the outer periphery side of the insulator 112, and an outer periphery of the outer conductor 113. The center conductor 111 and the outer conductor 113 are exposed at one end portion. The ground bar 120 is electrically connected to the exposed external conductor 113 through the film adhesive 10.
[Selection] Figure 5

Description

  More particularly, the present invention relates to a film adhesive, a micro coaxial cable, and a method for manufacturing a micro coaxial cable that can reduce connection resistance and suppress a decrease in flexibility.

  In recent years, in the field of electronic devices, for example, notebook computers and mobile phones have been widely used, so that these information communication devices have been required to be reduced in size and weight. For this reason, an ultra-fine coaxial cable is used for connection between the device body and the liquid crystal display unit, wiring in the device, and the like. The micro coaxial cable includes a central conductor, an insulator disposed on the outer peripheral side of the central conductor, an outer conductor composed of a plurality of conductors disposed on the outer peripheral side of the insulator, and a coating disposed on the outer peripheral side of the outer conductor. It has an ultra-fine coaxial line including a material.

  In order to ground the outer conductor of the micro coaxial cable in the micro coaxial cable, it is necessary to electrically connect the outer conductor and the ground bar. As a method of connecting such an external conductor and a ground bar, for example, Japanese Patent No. 3719693 (Patent Document 1) discloses a method of connecting an external conductor and two ground bars with solder. In Patent Document 1, in order to connect with solder, solder is installed between the outer conductor and the ground bar, and the solder is melted by heating from the ground bar side, thereby fixing the outer conductor and the ground bar. Are listed. However, when connecting using solder, the melted solder travels through the gaps between the outer conductors and protrudes from the ground bar installation portion, so that the root portion of the ground bar may be hardened with the solder. If the base portion of the ground bar becomes hard, problems such as disconnection occur when passing through the hinge portion of a folding cellular phone or the like.

In order to solve the problem that the base portion of the ground bar is hardened, there is a method of connecting with an ACF (Anisotropic Conductive Film) or a conductive adhesive. However, since the outer conductor and the ground bar are connected via the conductive component contained in the ACF or the conductive adhesive, the number of outer conductors in contact with the ground bar is usually two to three. Therefore, there is a problem that the resistance value (connection resistance) between the ground bars becomes high.
Japanese Patent No. 3719693

  The object of the present invention has been made to solve the above-described problems, and it is possible to manufacture a film adhesive, a micro coaxial cable, and a micro coaxial cable that reduce connection resistance and suppress decrease in flexibility. Is to provide a method.

The film adhesive of the present invention contains a resin and solder particles dispersed in the resin.
According to the film adhesive of the present invention, when heat is applied at the time of connection, the solder particles are melted and the shape thereof is deformed. For this reason, the solder formed by melting and solidifying the solder particles covers at least a part of the object to be connected or enters the gap, so that the connection can be stably made stably, thereby reducing the connection resistance. be able to. Moreover, since it contains a resin having a higher viscosity than solder or the like, it is possible to suppress a decrease in the flexibility of the portion where the film adhesive is disposed.

  In the film adhesive, the content of solder particles is preferably 50% vol.

  When the content of the solder particles is 50 vol% or more, the portion to be connected can be increased in the portion covered by the solder formed by melting and solidifying the solder particles, so that the conductivity can be improved. When the solder particle content is 90 vol% or less, it is possible to prevent the viscosity when the solder particles are melted from being lowered, so that a decrease in flexibility due to leakage of solder particles to other than the target to be connected is prevented. it can.

  In the film adhesive, the particle size of the solder particles is preferably 6 μm or more and 30 μm or less.

  When the particle size of the solder particles is 6 μm or more, the target to which the molten and solidified solder particles are connected can be sufficiently covered. In addition, since an increase in the filling amount of solder particles can be suppressed, it is possible to suppress a decrease in flexibility of a portion where solder formed by melting and solidifying solder particles is suppressed by suppressing an increase in resin. When the particle size of the solder particles is 30 μm or less, it is possible to prevent the number of solder particles with respect to the resin from being reduced. Therefore, it is possible to improve the conductivity by preventing the amount of solder particles from being reduced.

  In the film adhesive, the resin is preferably a thermosetting resin. Thereby, connection reliability can be improved.

  The micro coaxial cable of the present invention includes the film adhesive, the micro coaxial cable, and a ground bar. The micro coaxial line includes a center conductor, an insulator disposed on the outer periphery of the center conductor, an outer conductor composed of a plurality of conductors disposed on the outer periphery of the insulator, and a coating disposed on the outer periphery of the outer conductor. The center conductor and the outer conductor are exposed at one end. The ground bar is electrically connected to the exposed external conductor via a film adhesive.

  The manufacturing method of the micro coaxial cable of the present invention includes a step of preparing the film adhesive, a step of preparing a micro coaxial cable, and a step of electrical connection. In the step of preparing the micro coaxial line, the center conductor, the insulator disposed on the outer periphery side of the center conductor, the outer conductor composed of a plurality of conductors disposed on the outer periphery side of the insulator, and the outer periphery side of the outer conductor An ultrafine coaxial line including a covering material to be disposed and having a central conductor and an outer conductor exposed at one end is prepared. In the electrically connecting step, the exposed external conductor and the ground bar are electrically connected with a film adhesive.

  According to the micro coaxial cable and the method of manufacturing the micro coaxial cable of the present invention, the exposed external conductor and the ground bar are electrically connected by the film adhesive containing solder particles that change shape when heat is applied. Connected to. Therefore, by heating the film adhesive, the solder particles in the film adhesive are melted so as to cover between the adjacent conductors in the plurality of conductors constituting the outer conductor or the outer periphery of the adjacent conductors. Flowing. When the solder particles are solidified with the solder particles entering between the conductor that is in contact with the ground bar directly or via the solder particles and the adjacent conductor, the current between the ground bar and the external conductor is caused by the solidified solder. The route can be increased. Therefore, connection resistance can be reduced.

  Even if the film adhesive leaks between the conductors constituting the outer conductor arranged inside the covering material (sucked by the outer conductor arranged inside the covering material), the film shape The adhesive contains a resin having a higher viscosity than solder. For this reason, the elution distance is suppressed as compared with the case of only the solder, so that it is possible to suppress the lowering of the flexibility of the ground bar base portion (the portion on the covering material side in the ground bar connected to the ultrafine coaxial line). .

  Preferably, in the micro coaxial cable, at least two of the plurality of conductors are covered with solder formed by melting and solidifying solder particles.

  Thereby, the conductors which comprise an external conductor can be electrically connected with solder. Therefore, the current path can be increased, and the connection resistance can be reduced.

  Preferably, in the method for manufacturing the micro coaxial cable, the step of electrically connecting includes a step of heating to a temperature equal to or higher than the melting point of the solder particles of the film adhesive. Thereby, an external conductor and a ground bar can be electrically connected easily.

  According to the method for producing a film adhesive, a micro coaxial cable, and a micro coaxial cable of the present invention, it is possible to reduce connection resistance and to suppress a decrease in flexibility.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the same or corresponding parts are denoted by the same reference numerals, and description thereof will not be repeated.

(Embodiment 1)
FIG. 1 is a schematic cross-sectional view showing a film adhesive according to Embodiment 1 of the present invention. With reference to FIG. 1, the film adhesive in Embodiment 1 of this invention is demonstrated. As shown in FIG. 1, the film adhesive 10 in the present embodiment includes a resin 11 and solder particles 13 dispersed in the resin 11.

  Specifically, the content of the solder particles 13 in the film adhesive 10 is preferably 50 vol% or more and 90 vol% or less. When the content of the solder particles 13 is 50 vol% or more, a portion to be connected can be increased in a portion to be connected and a portion of the solder formed by melting and solidifying the solder particles 13. On the other hand, when the content of the solder particles 13 is 90 vol% or less, the film adhesive 10 can be easily applied or pasted to the object to be connected.

  The particle size D of the solder particles 13 is preferably 6 μm or more and 30 μm or less. When the particle size of the solder particles is 6 μm or more, the target to which the molten and solidified solder particles are connected can be sufficiently covered. In addition, since an increase in the filling amount of solder particles can be suppressed, it is possible to suppress a decrease in flexibility of a portion where solder formed by melting and solidifying solder particles is suppressed by suppressing an increase in resin. When the particle size of the solder particles is 30 μm or less, it is possible to prevent the number of solder particles with respect to the resin from being reduced. Therefore, it is possible to improve the conductivity by preventing the amount of solder particles from being reduced.

  The “particle diameter D” is an average particle diameter when the particle size distribution of the solder powder is measured by a laser diffraction method, and is a value measured according to JIS Z 3284 (1994).

The material of the solder particles 13 is not particularly limited, but lead-free solder is preferable from the viewpoint of environmental problems, and low-melting-point solder having a melting point of 139 ° C. or lower is preferable from the viewpoint of preventing damage to the wire due to heat. As the lead-free solder, Sn _96.5 Ag _3.0 Cu _0.5 is preferably used, and as the low melting point solder, Sn ₄₂ Bi ₅₈ is preferably used.

  The material of the resin 11 is not particularly limited, and a thermosetting resin, a thermoplastic resin, or the like can be used, but a thermosetting resin is preferable, and an epoxy resin is more preferable. Examples of the epoxy resin include bisphenol A type, F type, S type and AD type epoxy resins, naphthalene type epoxy resins, novolac type epoxy resins, biphenyl type epoxy resins, dicyclopentadiene type epoxy resins, and high molecular weight epoxy resins. A phenoxy resin or the like can be used.

  Moreover, the molecular weight of an epoxy resin can be selected suitably. When a relatively high molecular weight epoxy resin (high molecular weight epoxy resin) is used, the film shape can be improved, and the melt viscosity of the resin at the temperature heated for connection can be increased. On the other hand, when an epoxy resin having a relatively low molecular weight (low molecular weight epoxy resin) is used, the crosslink density can be increased to improve the heat resistance, and the cohesive force of the resin can be increased, so that the adhesive force can be improved. Therefore, in order to balance the performance, it is preferable to use as the resin 11 a combination of a high molecular weight epoxy resin having a molecular weight of 15000 or more and a low molecular weight epoxy resin having a molecular weight of 2000 or less. In addition, the compounding quantity with a high molecular weight epoxy resin and a low molecular weight epoxy resin can be selected suitably.

  As described above, the film adhesive 10 according to the first embodiment of the present invention includes the solder particles 13 dispersed in the resin 11. When heat is applied to the film adhesive 10, the solder particles 13 are melted and the shape thereof is deformed. Therefore, since the solder formed by melting and solidifying the solder particles 13 covers at least a part of the object to be connected, it can be electrically connected stably, so that the connection resistance can be reduced. Moreover, since the resin 11 having a higher viscosity than that of solder or the like is included, the flexibility of the portion where the film adhesive 10 is disposed can be improved.

(Embodiment 2)
FIG. 2 is a schematic top view showing the micro coaxial cable according to Embodiment 2 of the present invention. FIG. 3 is a schematic cross-sectional view taken along line III-III in FIG. 4 is a schematic cross-sectional view taken along line IV-IV in FIG. The micro coaxial cable of the present invention will be described with reference to FIGS. As shown in FIGS. 2 to 4, the micro coaxial cable 100 in the present embodiment includes the film adhesive 10, the micro coaxial cable 110, the ground bar 120, and the base 130 in the first embodiment. ing.

  Specifically, as shown in FIGS. 2 and 3, the micro coaxial cable 110 is a coaxial cable having an outer diameter of 1 mm or less, and includes a center conductor 111, an insulator 112, an external conductor 113, and a covering material. 114. A plurality of ultrafine coaxial wires 110 are arranged.

  As shown in FIG. 4, the central conductor 111 is a conductive member that is electrically connected to a member that connects the micro coaxial cable 100 such as a connector. The center conductor 111 is formed by twisting seven conductors having an outer diameter of 0.021 mm formed from, for example, a silver-plated copper alloy wire, and has an outer diameter of 0.63 mm.

  The insulator 112 is an insulating member disposed on the outer peripheral side of the center conductor 111. The insulator 112 is made of, for example, a tetrafluoroethylene perfluoroalkyl vinyl ether resin (PFA) having a thickness of 0.05 mm.

  The external conductor 113 is a conductive member composed of a plurality of conductors disposed on the outer peripheral side of the insulator 112. The outer conductor 113 is formed by horizontally winding and shielding 17 conductors formed of a tin-plated copper alloy wire having an outer diameter of 0.025 mm.

  The covering material 114 is an insulating member disposed on the outer peripheral side of the outer conductor 113. The covering material 114 is made of tetrafluoroethylene perfluoroalkyl vinyl ether resin having a thickness of 0.03 mm.

  Further, the shape of the micro coaxial line 110 is not particularly limited as long as the central conductor 111 and the outer conductor 113 are exposed at one end of the micro coaxial line 110. However, as shown in FIG. It is preferable that the body 112 and the outer conductor 113 are exposed in order toward one end. The one end portion is a region having a predetermined length from one end to the other end of the micro coaxial cable 110 (from one end toward the direction in which the micro coaxial cable 110 extends), and is exposed. It means a region (region R in FIG. 3) including the center conductor 111, the exposed insulator 112, and the exposed outer conductor 113.

  The ground bar 120 is electrically connected to the exposed external conductor 113 via the film adhesive 10. The ground bar 120 is mechanically and through the plurality of exposed outer conductors 113 and the film adhesive 10 along the direction (vertical direction in FIG. 2) in which a plurality of micro coaxial wires 110 are arranged. By electrically connecting, the ground bar 120 and the plurality of fine coaxial wires 110 are integrated. By connecting a plurality of fine coaxial wires 110 to the ground bar 120, the outer conductors 113 of the fine coaxial wires 110 are collectively grounded. The ground bar 120 mechanically fixes the micro coaxial cable 100 and obtains conduction with the external conductor 113.

  As shown in FIGS. 3 and 4, the ground bar 120 is disposed on a portion that is in direct contact with the base 130 and on the side opposite to the portion (upward when viewed from the base 130), and the exposed external conductor 113. Is sandwiched between two ground bars 120. Note that the configuration is not particularly limited as long as the film-shaped adhesive 10 is disposed on at least one side of the exposed external conductor 113.

  As the ground bar 120, for example, a metal foil obtained by processing a conductive plate can be used.

  When the film adhesive 10 having a solder particle content of 90 vol% is used, as shown in FIG. 4, the solder 15 formed by melting and solidifying the solder particles (solder particles 13 in FIG. 1). Covers the outer periphery of the plurality of conductors constituting the outer conductor 113. When the content of the solder particles contained in the film adhesive 10 is lower than 90%, for example, as shown in FIG. 5, at least two conductors of a plurality of conductors constituting the outer conductor 113 are used. Are covered with solder 15 formed by melting and solidifying the solder particles. FIG. 5 is a schematic cross-sectional view showing a state in which the external conductor 113 and the ground bar 120 are electrically connected using another film adhesive.

  As shown in FIGS. 4 and 5, the solder 15 covering at least two conductors is preferably in contact with the ground bar 120. Thereby, the external conductor 113 and the ground bar 120 can be electrically connected more stably.

  Next, as shown in FIGS. 1-7, the manufacturing method of the micro coaxial cable 100 in Embodiment 2 of this invention is demonstrated. In addition, FIG. 6 is a flowchart which shows the manufacturing method of the micro coaxial cable in Embodiment 2 of this invention. FIG. 7 is a schematic cross-sectional view showing the step of arranging in the second embodiment of the present invention.

  First, as shown in FIG. 1 and FIG. 6, a step (S10) of preparing the film adhesive 10 in the first embodiment is performed. In this step (S10), in order to easily connect the external conductor 113 and the ground bar 120, it is preferable to prepare a film adhesive 10 having substantially the same shape as the ground bar 120 described later.

  Next, as shown in FIG. 2 to FIG. 6, the center conductor 111, the insulator 112 disposed on the outer periphery side of the center conductor 111, and the outer conductor composed of a plurality of conductors disposed on the outer periphery side of the insulator 112. 113 and a coating material 114 disposed on the outer peripheral side of the outer conductor 113, and a step (S20) of preparing a micro coaxial wire 110 in which the central conductor 111 and the outer conductor 113 are exposed at one end portion is performed. . In this step (S20), it is preferable to prepare a micro coaxial line 110 in which the central conductor 111, the insulator 112, and the outer conductor 113 are sequentially exposed at one end. In the present embodiment, a plurality of ultrafine coaxial wires 110 are prepared.

  In the step (S20) of preparing the extra fine coaxial line 110, the extra fine coaxial line 110 may be prepared by obtaining a commercially available extra fine coaxial wire 110, or the extra fine coaxial line 110 is implemented by performing an exposing step described later. May be prepared.

  In the exposing step, the center conductor 111, the insulator 112 disposed on the outer periphery side of the center conductor 111, the outer conductor 113 disposed on the outer periphery side of the insulator 112, and the outer periphery side of the outer conductor 113 are disposed. After preparing the ultra-fine coaxial line including the covering material 114, the center conductor 111 and the outer conductor 113 are exposed at one end. In the exposing step, it is preferable that the central conductor 111, the insulator 112, and the external conductor 113 are sequentially exposed at one end portion toward the one end.

As a method of exposing the central conductor 111 and the outer conductor 113 in the exposing step, any method such as a method using a laser or a mechanical peeling method can be adopted. In the present embodiment, the covering material 114 at one end of the fine coaxial wire 110 is removed by, for example, a laser. Then, a part of the outer conductor 113 in the vicinity of the covering material 114 is left, and the remaining outer conductor 113 is removed by laser. At this time, the width of the exposed outer conductor 113 (W ₁₁₃ in FIG. 3) is preferably substantially the same as the width of the ground bar 120 (W ₁₂₀ in FIG. 3). Then, a part of the insulator 112 in the vicinity of the outer conductor 113 is left, and the remaining insulator 112 is removed by laser. As a result, it is possible to form the fine coaxial wire 110 in which the central conductor 111, the insulator 112, and the outer conductor 113 as shown in FIGS. 2 to 4 are sequentially exposed toward one end.

  When removing the outer conductor 113, instead of the laser, for example, a rotating brush or the like is brought into contact to loosen and loosen the windings of the plurality of conductors constituting the outer conductor 113, and pull the loosened outer conductor 113. Then, the insulator 112 may be exposed by removing a part thereof.

  In addition, when preparing a plurality of micro coaxial cables 110, it is preferable that the lengths of the plurality of micro coaxial cables 110 are substantially the same. For example, in order to align the plurality of ultra-fine coaxial wires 110 to a predetermined length, a step of collectively cutting may be performed.

  Next, as shown in FIGS. 2-7, the process (S30) which electrically connects the exposed external conductor 113 and the ground bar 120 with the film adhesive 10 is implemented. In this step (S30), for example, the following steps are performed.

  First, at least one conductive ground bar 120 is prepared. Then, as shown in FIG. 7, a plurality of exposed external conductors 113 are arranged on the ground bar 120. When two ground bars 120 are prepared, a plurality of exposed external conductors 113 are sandwiched between the ground bars 120.

  And the process heated to the temperature more than melting | fusing point of the solder particle 13 of the film adhesive 10 is implemented. At this time, it is preferable to cover the plurality of conductors in a state where the plurality of solder particles 13 are aggregated. Then, when the step of solidifying the solder particles 13 of the film adhesive 10 is performed, the solder 15 whose shape is changed from the solder particles 13 is formed. When the heating step and the solidifying step are performed, as shown in FIGS. 4 and 5, the solder 15 enters between the plurality of conductors constituting the outer conductor 113 and at least two of the plurality of conductors. Cover the conductor. In addition, you may apply a predetermined pressure as needed at the time of the process to heat.

  Next, the process (S40) which connects the exposed center conductor 111 and the base 130 is implemented. In this step, for example, the base 130 as described above is prepared, the exposed central conductor 111 is disposed on the base 130, and the central conductor 111 and the base 130 are fixed with an adhesive or the like.

  By carrying out the above steps (S10 to S40), the micro coaxial cable 100 in the present embodiment shown in FIGS. 2 to 5 can be manufactured.

(Modification)
Next, with reference to FIGS. 1-8, the modification of the manufacturing method of the micro coaxial cable in Embodiment 2 of this invention is demonstrated. The manufacturing method of the micro coaxial cable in the modification is basically the same as that of the second embodiment, but differs in the order of the step of preparing the micro coaxial cable (S20) and the step of electrically connecting (S30). In the modified example, the step of preparing the micro coaxial wire 110 (S20) includes the step of removing the covering material 114 (S21), the step of removing the external conductor 113 (S22), and the step of removing the insulator 112 (S23). ). In addition, FIG. 8 is a flowchart which shows another manufacturing method of the microfine coaxial cable in Embodiment 2 of this invention.

  Specifically, as shown in FIG. 8, first, similarly to the second embodiment, a step (S10) of preparing the film adhesive 10 is performed.

  Next, the center conductor 111, the insulator 112 disposed on the outer periphery side of the center conductor 111, the external conductor 113 disposed on the outer periphery side of the insulator 112, and the covering material disposed on the outer periphery side of the external conductor 113 114 is prepared. And the process (S21) of removing the coating | covering material 114 of one edge part is implemented.

  Next, similarly to the second embodiment, a step (S30) of electrically connecting the exposed external conductor 113 and the ground bar 120 is performed.

  Next, a step (S22) of removing the external conductor 113 that is not connected to the ground bar 120 at one end is performed. Next, the step of removing the insulator 112 at one end (S23) is removed.

  Next, as in the second embodiment, a step (S40) of connecting the central conductor 111 and the base 130 is performed.

  The micro coaxial cable 100 shown in FIGS. 2 to 5 can also be manufactured by performing the above steps (S10 to S40). According to the modification, since the film adhesive 10 leaking to the outer conductor on the outer peripheral side of the insulator 112 can be removed in the step (S22) of removing the outer conductor 113, the side where the outer conductor 113 is exposed. The flexibility is not reduced in the vicinity of the insulator 112.

  In addition, the order of the said process (S10-S40) is not specifically limited to Embodiment 2 and the modification which were mentioned above.

  As described above, according to the micro coaxial cable 100 and the method of manufacturing the micro coaxial cable 100 according to the second embodiment of the present invention, the exposed outer conductor 113 and the ground bar 120 are interposed via the film adhesive 10. Are electrically connected.

  As shown in FIG. 9, the external conductor 113 and the ground bar 120 are electrically connected using an anisotropic conductive film 20 including a resin 21 disclosed in Patent Document 1 and the like and conductive particles 23 dispersed in the resin 21. In the case of connection, the conductive particles 23 are not deformed by heat. Generally, the diameter of the micro coaxial wire 110, the diameter of the conductor constituting the outer conductor, and the thickness of the ground bar 120 vary, so that adjacent conductors are not in contact with each other or the ground bar 120 and the outer conductor are not in contact with each other. 113 may not be in contact. Even when the conductive particles 23 adhere between the conductor directly in contact with the ground bar 120 and the conductor adjacent to the conductor, the contact resistance is hardly lowered. Even if the conductive particles 23 enter between the outer conductor 113 and the ground bar 120, the conductive particles 23, the outer conductor 113, and the ground bar 120 are in point contact. Therefore, the connection resistance can hardly be reduced. FIG. 9 is a schematic cross-sectional view showing a micro coaxial cable in which an external conductor and a ground bar are electrically connected by an anisotropic conductive film in the prior art.

  On the other hand, in the present embodiment, by heating the film adhesive 10, the solder particles 13 in the film adhesive 10 are melted, and between the adjacent conductors in the plurality of conductors constituting the external conductor 113. And flows so as to cover the outer periphery of the adjacent conductors. When the solder particles 13 are solidified in a state where the solder particles 13 enter the conductor adjacent to the conductor in contact with the ground bar 120 directly or via the solder particles 13, the ground bar 120 and the external conductor 113 are solidified by the solidified solder 15. Current path can be increased. Further, when the solder particles 13 enter between the outer conductor 113 and the ground bar 120, the shape is changed to the solder 15 by melting and solidification, and the apparent contact area between the outer conductor 113 and the ground bar 120 is increased. Can be increased. Therefore, the electrical connection of a plurality of conductors can be stabilized and the connection resistance can be reduced.

  Further, since the film adhesive 10 includes the resin 11, even if the film adhesive 10 leaks between the conductors constituting the outer conductor 113 arranged inside the covering material 114, the solder The distance at which the film-like adhesive 10 elutes is suppressed as compared with the case where only the connection is made. Moreover, the elution of the solder particles 13 can be suppressed to a region beyond the region where the ground bar 120 is installed. Therefore, it is possible to suppress a decrease in flexibility of the root portion of the ground bar 120 (the right side portion of the ground bar in FIG. 2). Therefore, it is possible to prevent disconnection when using the ultrafine coaxial cable.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above-described embodiment but by the scope of claims, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims.

  According to the film adhesive of the present invention, the micro coaxial cable, and the method of manufacturing the micro coaxial cable, the external conductor and the ground bar are connected by the film adhesive having solder particles dispersed in the resin. Therefore, it is possible to reduce the connection resistance and suppress the decrease in flexibility. Therefore, it can be suitably used for electronic devices and the like.

It is a schematic sectional drawing which shows the film adhesive in Embodiment 1 of this invention. It is a schematic top view which shows the micro coaxial cable in Embodiment 2 of this invention. It is a schematic sectional drawing in line segment III-III in FIG. It is a schematic sectional drawing in line segment IV-IV in FIG. It is a schematic sectional drawing which shows the state which electrically connected the external conductor and the ground bar using another film adhesive. It is a flowchart which shows the manufacturing method of the micro coaxial cable in Embodiment 2 of this invention. It is a schematic sectional drawing which shows the process to arrange | position in Embodiment 2 of this invention. It is a flowchart which shows another manufacturing method of the micro coaxial cable in Embodiment 2 of this invention. It is a schematic sectional drawing which shows the micro coaxial cable which electrically connected the external conductor and the ground bar with the anisotropic conductive film in a prior art.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 Film adhesive, 11 Resin, 13 Solder particle, 15 Solder, 100 Micro coaxial cable, 110 Micro coaxial cable, 111 Center conductor, 112 Insulator, 113 External conductor, 114 Coating material, 120 Ground bar, 130 Base, D particle size, R region.

Claims (7)

Resin,
A film adhesive comprising solder particles dispersed in the resin.   The film adhesive according to claim 1, wherein the content of the solder particles is 50 vol% or more and 90 vol% or less.   The film adhesive according to claim 1 or 2, wherein the solder particles have a particle size of 6 µm or more and 30 µm or less.   The film adhesive according to claim 1, wherein the resin is a thermosetting resin. The film adhesive according to any one of claims 1 to 4,
A central conductor, an insulator disposed on the outer peripheral side of the central conductor, an outer conductor composed of a plurality of conductors disposed on the outer peripheral side of the insulator, and a covering material disposed on the outer peripheral side of the outer conductor; An ultrafine coaxial line in which the central conductor and the outer conductor are exposed at one end, and
A micro coaxial cable comprising a ground bar electrically connected to the exposed external conductor through the film adhesive.   The micro coaxial cable according to claim 5, wherein at least two of the plurality of conductors are covered with solder formed by melting and solidifying the solder particles. Preparing the film adhesive according to any one of claims 1 to 4,
A central conductor, an insulator disposed on the outer peripheral side of the central conductor, an outer conductor composed of a plurality of conductors disposed on the outer peripheral side of the insulator, and a covering material disposed on the outer peripheral side of the outer conductor; Preparing a fine coaxial line in which the central conductor and the outer conductor are exposed at one end, and
A method for manufacturing a micro coaxial cable, comprising: electrically connecting the exposed external conductor and the ground bar with the film adhesive.

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