JP2009016124A - IC socket - Google Patents

Abstract

An electrical connection between a contact and an electrode is reliably maintained and contact resistance is stabilized.
[Solution]
IC socket for inspecting IC packages. A frame having an opening for accommodating the IC package; a housing disposed at a lower portion of the frame and facing the IC package accommodated in the opening; and housed in the housing and on the IC package side And a contact that is electrically connected to the electrode. The contact is formed in an annular shape having elasticity, and one or a plurality of slits are formed in at least a part of the annular surface, and the slit and the electrode on the IC package side face each other. The wiring board side is electrically connected.
[Selection] Figure 1

Description

  The present invention relates to a measuring device that performs an electrical characteristic test of an IC package, and relates to an IC socket for electrically connecting the 1C package and the measuring device by mounting the IC package.

  Examples of IC sockets used when conducting an electrical characteristic test of an IC package include those described in Patent Documents 1 to 4.

In the IC sockets described in these patent documents, in order to electrically connect between the lead of the IC package to be tested and the wiring (electrode) provided in the IC socket, as shown in FIG. Many contactors 1 are arranged. These O-ring type contacts 1 are in contact with the leads (electrodes) of the IC package on their curved surfaces and are electrically connected.
Japanese Patent Laid-Open No. 03-246879 JP 09-148019 A Japanese Patent Laid-Open No. 03-249573 JP 2002-75570 A

  However, in the case of these conventional O-ring type contacts 1, as shown in FIG. 16, if a foreign object 3 is caught between the contact 2 and the electrode 2 such as an IC package lead, a contact failure occurs. There is. Specifically, if the foreign material 3 is sandwiched between the contact 1 and the electrode 2, the contact area between them will fluctuate and become smaller, resulting in unstable contact resistance and electrical connection. There is a problem that it will disappear.

  In addition, as shown in FIG. 17, since the contact between the contact 1 and the electrode 2 is performed on the surface, if an insulator such as an oxide film is present on the surface of the electrode 2, a contact failure is caused. There's a problem.

  The object of the present invention is to propose an IC socket that solves the problems of these conventional IC sockets using an O-ring type contact and ensures electrical connection with the IC package to be measured. There is to do.

  In order to solve the above problems, an IC socket according to the present invention is an IC socket for inspecting an IC package, and includes a contactor that is in contact with and electrically connected to an electrode on the IC package side. The contact is formed in an annular shape having elasticity, and one or more slits are formed in at least a part of the annular surface, and the slit and the electrode on the IC package face each other so that the electrode and the wiring The substrate side is electrically connected. And a housing having an opening for accommodating the IC package; and a housing disposed at a lower portion of the frame and facing the IC package accommodated in the opening, wherein the contact is It is housed in a housing and is in contact with and electrically connected to the electrode on the IC package side, and in the housing, at a position corresponding to each electrode on the IC package side housed in the opening of the frame. A slot for holding the contact is formed.

  As described above, if a foreign object is caught between the contact and the electrode on the IC package side, a contact failure occurs between them. Among them, since there is a slit in the part facing the electrode on the IC package side, even if any of the parts separated by this slit becomes poor contact, the other part comes into contact.

  It is preferable that the slit of the contact is formed linearly or spirally along the circumferential direction on the annular surface of the contact. It is desirable that the slit of the contactor be formed so as to face the electrode on the IC package side and the wiring board side. It is preferable that at least two slits of the contact are formed in parallel. It is desirable to fill an elastic body inside the annular contact. The annular contact is preferably a perfect circle or an ellipse.

  According to the IC socket according to the present invention, even if a foreign object is sandwiched between the contact and the electrode on the IC package side, any one of the parts separated by the slit comes into contact. The electrical connection with the electrode on the IC package side is securely maintained, and the contact resistance is stabilized.

  Further, even if an insulator such as an oxide film is present on the electrode, the insulator is broken by the edge portion of the slit, and an electrical connection between the contact and the electrode on the IC package side is made. Connection is securely maintained.

  Hereinafter, an IC socket according to an embodiment of the present invention will be described with reference to the accompanying drawings. Since the present invention is particularly characterized by the contact of the IC socket, it can be applied to all existing IC sockets to which this contact can be attached. An IC socket according to this embodiment is shown in FIGS.

  The IC socket 10 mainly includes a frame 11, a housing 12, and a contact 13.

  The frame 11 is a member for accommodating the IC package 14. The frame 11 is formed in a rectangular thick plate shape as a whole. In the center of the frame 11, an opening 15 for accommodating the IC package 14 is formed. The opening 15 is provided to be inclined so as to open toward the outside (upper side in FIG. 4). The inclined surface 16 of the opening 15 is an inclined surface for facilitating accommodation of the IC package 14. Screw holes 17 are provided at four corners of the frame 11.

  The housing 12 is a member that is disposed at the lower part of the frame 11 and faces the lower part of the IC package 14 accommodated in the opening 15. The housing 12 is formed in a rectangular thick plate shape as a whole. Slots 20 for holding the contacts 13 are formed at positions corresponding to the respective electrodes 19 on the IC package 14 side accommodated in the openings 15 of the frame 11 in the housing 12. A plurality of the slots 20 are provided along each side of the opening 15 of the frame 11 in the housing 12. Specifically, 11 slots 20 are arranged in parallel along each side of the rectangular opening 15. Each slot 20 is for holding the contact 13 as shown in FIGS. For this reason, the slot 20 is set to have substantially the same width as the contact 13 and a length larger than the diameter of the contact 13 (dimension in the left-right direction in FIG. 7). The depth of the slot 20 (the vertical dimension in FIG. 7) is set to a dimension slightly smaller than the diameter of the contact 13 so that the top and bottom of the contact 13 protrude from the slot 20. A contact receiving portion 21 is provided at the lower portion of the slot 20. The contact receiving part 21 is configured by a flange in which the size of the slot 20 is reduced to a size smaller than the diameter of the contact 13. The contact receiving portion 21 supports the contact 13 so that the contact 13 does not fall downward. Note that the IC package 14 may be provided with leads that protrude greatly from both sides of the IC package 14 instead of the electrode 19. In this case, the slot 20 is provided corresponding to the tip position of the lead.

  A plate 23 is provided between the frame 11 and the housing 12. The plate 23 is a plate material that covers the upper side of the housing 12. The plate 23 is provided with an opening 24 having the same size as the contact receiving part 21 of the slot 20 at a position aligned with the slot 20 of the housing 12. The opening 24 is an opening for extending the upper portion of the contact 13. The upper part of the contact 13 extends upward from the opening 24 and contacts the electrode 19 of the IC package 14.

  A wiring board 26 is provided on the lower surface of the housing 12. The wiring board 26 is a plate material provided with wirings 27 that are electrically connected to the contacts 13. The wiring 27 is disposed so that a contact portion with the contact 13 is located at a position corresponding to the slot 20 of the housing 12, and each contact 13 comes into contact with each other to transmit and receive an electrical signal.

  The contact 13 is a member for electrically connecting the wiring 27 on the wiring board 26 and the electrode 19 of the IC package 14. The contact 13 is formed in an annular shape having elasticity. Here, the contact 13 is formed in a perfect circle (O-ring type). The contact 13 is formed with a slit 30 along the circumferential direction in at least a part of its annular surface (outer surface), and the contact 13 becomes two ring pieces 13A and 13B in this portion. 1 and 2, the slit 30 is formed large (about 3/4 of the whole) along the circumferential direction of the annular contact 13. Further, as shown in FIG. 6, the slits 30 may be formed in about a half of the whole along the circumferential direction of the annular contactor 13. Furthermore, in the case of the contact 13 of FIG. 6, the width is narrow. The diameter, the lateral width, the length of the slit 30 and the like of the contact 13 are appropriately set according to the usage mode. The slit 30 is disposed so as to face the electrode 19 of the IC package 14. When the slit 30 is long, it is disposed so as to face the electrode 19 of the IC package 14 and the wiring 27 of the wiring board 26. As a result, the contact 13 is accommodated in the slot 20 of the housing 12 so as to contact the electrode 19 on the IC package 14 side facing the contact 13 and the wiring 27 of the wiring board 26 respectively. The electrodes 19 and the wiring 27 are electrically connected. Further, the slit 30 portion of the contact 13 is in contact with the electrode 19 of the IC package 14 (the electrode 19 of the IC package 14 and the wiring 27 of the wiring board 26 when the slit 30 is long).

  In the IC socket 10 configured as described above, the IC package 14 is inspected as follows.

  First, the IC package 14 is attached to the opening 15 of the frame 11 of the IC socket 10. As a result, the electrode 19 of the IC package 14 contacts the contact 13 extending from the opening 24 of the plate 23 as shown in FIG. In this state, the IC package 14 is pushed in, the contact 13 is slightly crushed as shown in FIG. 8, and the electrode 19 of the IC package 14 and the wiring 27 of the wiring board 26 are electrically connected. The

  At this time, the foreign material 31 may be sandwiched between the contact 13 and the electrode 19, and such a foreign material 31 is usually connected to one of the two ring pieces 13 </ b> A and 13 </ b> B of the contact 13. 19 between. It is rare to be sandwiched between both of the two ring pieces 13A and 13B. For example, as shown in FIGS. 9 and 10, the foreign matter 31 is sandwiched between the ring piece 13 </ b> A and the electrode 19, or, contrary to FIGS. 9 and 10, the foreign matter 31 is sandwiched between the ring piece 13 </ b> B and the electrode 19. Or

  In the case of FIGS. 9 and 10, the ring piece 13 </ b> A and the electrode 19 are greatly bent and the contact therebetween becomes poor, but the other ring piece 13 </ b> B is in reliable contact with the electrode 19. That is, even if one of the two ring pieces 13A and 13B causes a contact failure, the other reliably comes into contact.

  In addition, when an insulator such as an oxide film is present on the surface of the spherical or hemispherical electrode 19, the slit 30 is disposed so as to contact the electrode 19 as shown in FIG. 11. Thereby, the edge part of each ring piece 13A, 13B of the contactor 13 contacts the electrode 19, breaks through the insulator, and the contactor 13 and the electrode 19 are electrically connected.

  As described above, even if the foreign matter 31 is sandwiched between the contact 13 and the electrode 19 on the IC package 14 side, one of the two ring pieces 13 </ b> A and 13 </ b> B separated by the slit 30 contacts the electrode 19. Therefore, the electrical connection between the contact 13 and the electrode 19 is reliably maintained, and the contact resistance is stabilized.

  Even if an insulator such as an oxide film is present on the surface of the electrode 19, the insulator is broken by the edge portion of the slit 30, and between the contact 13 and the electrode 19 on the IC package 14 side. The electrical connection is reliably maintained.

[Modification]
In the above embodiment, only one slit 30 is provided in the contactor 13, but a plurality of slits may be provided. For example, as shown in FIG. 12, two slits 30 extending up and down from near the center of the contactor 13 are provided, three slits 30 are provided in parallel as shown in FIG. 13, or as shown in FIG. It is possible to provide three parallel slits 30 extending upward from the vicinity of the center of the child 13 and one slit 30 extending downward. One or two or more slits 30 can be provided on either one or both of the upper and lower sides from the vicinity of the center of the contact 13. When the slits 30 are provided in the vertical direction from the vicinity of the center of the contactor 13, the slits 30 are formed to face the electrode 19 of the IC package 14 and the wiring 27 of the wiring board 26.

  Furthermore, although the slit 30 was linearly formed along the circumferential direction on the annular surface of the contact 13, it may be formed in a spiral shape. The slit 30 may be formed in a continuous spiral shape, and the contact 13 may be formed in a coil spring shape. Further, the slit 30 may be formed in a discontinuous spiral shape.

  In the above embodiment, the contact 13 is formed in a hollow annular shape. However, if it is desired to increase the elastic force of the contact 13, an elastic body such as silicon rubber may be filled therein. Furthermore, the elastic force of the contactor 13 may be appropriately adjusted by appropriately changing the material of the elastic body.

  The annular contact 13 is formed in a perfect circle shape, but may be formed in an elliptical shape. For example, when the elliptical contact 13 is disposed horizontally in the slot 20 of FIG. 7, the contact 13 can be stably and reliably brought into contact with the electrode 19 or the like without shifting the position of the slit 30. The slot 20 may be formed in a vertically long rectangular shape, and the elliptical contact 13 may be disposed vertically long. Further, it may be formed in a polygonal ring shape.

  In the above embodiment, the contact 13 that contacts the electrode 19 of the IC package 14 has been described. However, the contact 13 may be used for other parts that need to be electrically connected. Also in this case, the same operation and effect as the above-described embodiment can be obtained.

It is a perspective view which shows the contactor which concerns on embodiment of this invention. It is a side view which shows the contactor which concerns on embodiment of this invention. It is a top view which shows the IC socket which concerns on embodiment of this invention. It is side surface sectional drawing which shows the IC socket which concerns on embodiment of this invention. It is a bottom view which shows the IC socket which concerns on embodiment of this invention. It is a side view which shows the other example of the contactor which concerns on embodiment of this invention. It is principal part sectional drawing which shows the test | inspection state in the IC socket which concerns on embodiment of this invention. It is principal part sectional drawing which shows the test | inspection state in the IC socket which concerns on embodiment of this invention. It is a side view which shows the contact state of the contact and electrode of the IC socket which concerns on embodiment of this invention. It is a side view which shows the contact state of the contact and electrode of the IC socket which concerns on embodiment of this invention. It is a side view which shows the contact state of the contact and electrode of the IC socket which concerns on embodiment of this invention. It is a side view which shows the 1st modification of this invention. It is a side view which shows the 2nd modification of this invention. It is a side view which shows the 3rd modification of this invention. It is a perspective view which shows the contact of the conventional IC socket. It is a side view which shows the contact state of the contact and electrode of the conventional IC socket. It is a side view which shows the contact state of the contact and electrode of the conventional IC socket.

Explanation of symbols

  10: IC socket, 11: frame, 12: housing, 13: contactor, 13A, 13B: ring piece, 14: IC package, 15: opening, 16: inclined surface, 17: screw hole, 19: electrode, 20 : Slot, 21: contact receiving part, 23: plate, 24: opening, 26: wiring board, 27: wiring, 30: slit, 31: foreign matter.

Claims (7)

IC socket for inspecting IC packages,
Comprising a contactor electrically connected in contact with the electrode on the IC package side;
The contactor is formed in an annular shape having elasticity, and one or a plurality of slits are formed in at least a part of the annular surface, and the slit and the electrode on the IC package side face each other, An IC socket characterized by electrically connecting the wiring board side. A frame having an opening for accommodating the IC package; and a housing disposed at a lower portion of the frame and facing the IC package accommodated in the opening;
The contact is housed in the housing and is electrically connected in contact with the electrode on the IC package side,
The slot for holding the contact is formed at a position corresponding to each electrode on the IC package side accommodated in the opening of the frame in the housing. The described IC socket.   3. The IC socket according to claim 1, wherein the slit of the contact is formed linearly or spirally along the circumferential direction on the annular surface of the contact. 4.   4. The IC socket according to claim 1, wherein the slit of the contact is formed to face the electrode on the IC package side and the wiring board side. 5.   5. The IC socket according to claim 1, wherein at least two slits of the contact are formed in parallel. 6.   6. The IC socket according to claim 1, wherein an elastic body is filled in the annular contact.   The IC socket according to claim 1, wherein the annular contact is a perfect circle or an ellipse.

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