[go: up one dir, main page]

KR20160118796A - A test socket - Google Patents

A test socket Download PDF

Info

Publication number
KR20160118796A
KR20160118796A KR1020150047520A KR20150047520A KR20160118796A KR 20160118796 A KR20160118796 A KR 20160118796A KR 1020150047520 A KR1020150047520 A KR 1020150047520A KR 20150047520 A KR20150047520 A KR 20150047520A KR 20160118796 A KR20160118796 A KR 20160118796A
Authority
KR
South Korea
Prior art keywords
floating member
socket body
socket
floating
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020150047520A
Other languages
Korean (ko)
Inventor
박상덕
Original Assignee
리노공업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 리노공업주식회사 filed Critical 리노공업주식회사
Priority to KR1020150047520A priority Critical patent/KR20160118796A/en
Priority to PCT/KR2016/002799 priority patent/WO2016159548A1/en
Priority to TW105108926A priority patent/TW201637312A/en
Publication of KR20160118796A publication Critical patent/KR20160118796A/en
Ceased legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433Sockets for IC's or transistors
    • G01R1/0441Details
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433Sockets for IC's or transistors
    • G01R1/0441Details
    • G01R1/0466Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2853Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H01R33/76Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • General Engineering & Computer Science (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The present invention relates to a test socket for preventing a floating member which accommodates an object for a test from being separated from a socket body. The separation prevention part of the test socket includes a holding protrusion which protrudes toward one side of the socket body and the floating member, can be elastically deformed in a horizontal direction to a protrusion direction, and has a holding jaw protruding from a free terminal part region in the horizontal direction; a gear jaw which is prepared in the other side of the socket body and the floating member and is geared with the holding jaw to allow the floating member to be floated in a range of a upper and lower width with regard to the socket body. So, the test socket with a simple floating member separation prevention structure can be provided.

Description

테스트 소켓{A TEST SOCKET}Test Socket {A TEST SOCKET}

본 발명은 피검사체의 전기적 특성을 검사하기 위한 테스트 소켓에 관한 것이다.
The present invention relates to a test socket for inspecting an electrical characteristic of a test object.

반도체 칩은 미세한 전자회로가 고밀도로 집적되어 형성되어 있으며, 제조공정 중에 각 전자회로의 정상 여부를 테스트한다.Semiconductor chips are formed by accumulating fine electronic circuits at high density and test whether each electronic circuit is normal during the manufacturing process.

반도체 칩의 테스트는 반도체 칩의 단자와 테스트 신호를 인가하는 검사회로기판의 접점(패드)을 전기적으로 연결하는 반도체 검사용 프로브가 사용된다. 프로브는 소켓 본체에 지지된다. 반도체칩은 소켓본체에 수용되어 탄성적으로 플로팅 상태를 유지하는 플로팅부재에 수용된 상태에서 검사가 이루어진다. 특히, 반도체칩은 검사 시에 플로팅부재에 장착된 상태에서 푸셔에 의해 가압되어 반도체칩의 범프 단자와 소켓본체의 프로브와 접촉이 이루어진다. 이때, 플로팅부재는 소켓본체에 대해 플로팅 상태에서 요동할 때 탄성 복원력에 의해 소켓본체로부터 이탈되지 않도록 하여야 한다.In the test of the semiconductor chip, a semiconductor inspection probe for electrically connecting the terminals of the semiconductor chip and the contacts (pads) of the inspection circuit board for applying the test signal is used. The probe is supported on the socket body. The semiconductor chip is accommodated in the socket body and is inspected while being accommodated in a floating member which is elastically held in a floating state. Particularly, the semiconductor chip is pressed by the pusher in a state of being mounted on the floating member at the time of inspection, and is brought into contact with the probe of the socket body and the bump terminal of the semiconductor chip. At this time, the floating member should be prevented from being detached from the socket body by the elastic restoring force when swinging in the floating state with respect to the socket body.

이러한 플로팅부재의 소켓본체에 대한 이탈방지구조가 한국등록특허 제10-1032348호에 개시된 바 있다. 개시된 이탈방지구조는 소켓본체의 플로팅부재 수용부의 마주보는 양 내측벽에 탄성적으로 돌출된 2쌍의 돌기와, 상기에 맞물리는 플로팅부재의 양 외측벽에 형성된 2쌍의 홈으로 구성되어 있다.Such a detachment preventing structure of the floating member with respect to the socket body is disclosed in Korean Patent No. 10-1032348. The disclosed release preventing structure is constituted by two pairs of projections elastically projecting on opposite inner side walls of the socket holding portion of the socket body and two pairs of grooves formed on both outer side walls of the floating member engaged with the socket.

이와 같은 종래의 프로팅부재 이탈방지구조는 구조가 복잡하고 플로팅부재와 소켓본체의 플로팅부재 수용부의 오차에 따른 반도체칩의 범프단자와 소켓본체의 프로브가 정확하게 정렬되지 않는 문제가 발생할 수 있다.
Such a conventional floating member separation prevention structure may have a complicated structure and may cause a problem that the bump terminals of the semiconductor chip and the probes of the socket body are not aligned accurately due to errors of the floating member and the floating member accommodating portion of the socket body.

본 발명의 목적은 간단한 플로팅부재 이탈방지구조를 가진 테스트 소켓을 제공함에 있다.It is an object of the present invention to provide a test socket having a simple floating member separation prevention structure.

본 발명의 다른 목적은 플로팅부재에 장착된 피검사체의 단자와 소켓본체의 프로브의 정렬을 보다 정확하게 할 수 있는 테스트 소켓을 제공함에 있다.
Another object of the present invention is to provide a test socket that can more accurately align the terminals of the test object mounted on the floating member and the probe of the socket body.

상술한 본 발명의 과제를 해결하기 위한 테스트 소켓은, 다수 프로브의 각 양단부가 상하 노출되도록 장착되며, 상면으로부터 함몰형성된 플로팅부재 수용캐비티를 갖는 소켓본체와; 상기 피검사체가 장착되는 피검사체 장착부를 가지고 상기 피검사체가 수용되는 플로팅부재 수용캐비티 내에 수용되는 플로우팅부재와; 상기 플로우팅부재가 상기 소켓본체의 플로팅부재 수용캐비티에 수용된 상태에서 상기 플로우팅부재가 상기 소켓본체로부터 이탈하는 것을 방지하는 이탈방지부를 포함하며, 상기 이탈방지부는, 상기 플로우팅부재와 상기 소켓본체의 어느 일측에서 타측을 향해 돌출되며, 상기 돌출방향에 가로방향으로 단성변형 가능하며, 자유단부영역에 가로방향으로 돌출된 걸림턱을 가진 걸림돌기와; 상기 플로우팅부재와 상기 소켓본체 중 타측에 마련되어 상기 플로팅부재가 상기 소켓본체에 대해 소정의 상하폭의 범위 내에서 플로팅 가능하도록 상기 걸림턱과 맞물리는 물림턱을 포함하는 것을 특징으로 한다.A test socket for solving the above-mentioned problems of the present invention includes: a socket body having a plurality of probes, both ends of which are vertically exposed; A floating member accommodated in the floating member receiving cavity in which the object to be inspected is accommodated with the object mounting portion to which the object to be inspected is mounted; And a separation preventing portion for preventing the floating member from being detached from the socket body when the floating member is accommodated in the floating member receiving cavity of the socket body, A locking protrusion protruding from one side toward the other side and being deformed in the transverse direction in the protruding direction and having a locking protrusion protruding in the lateral direction in the free end region; And a locking protrusion provided on the other side of the floating body and the socket body so that the floating member engages with the locking protrusion so as to be floating within a predetermined upper and lower width range with respect to the socket body.

상기 플로우팅부재와 상기 소켓본체 중 타측은 상기 걸림돌기를 수용하는 걸림돌기 수용공을 가지며, 상기 물림턱은 상기 걸림돌기 수용공의 내벽에 형성될 수 있다.And the other side of the float member and the socket body has a latching protrusion receiving hole for receiving the latching protrusion, and the latching protrusion may be formed on an inner wall of the latching protrusion receiving hole.

상기 자유단부는 길이방향의 절개홈에 의해 분리된 2 이상의 걸림돌기를 가질 수 있다.
The free end portion may have two or more locking protrusions separated by a longitudinal incision groove.

본 발명에 의하면 테스트 소켓에 있어서 플로팅 소켓의 이탈방지구조를 간단하게 함으로써 제조비용을 감소시킬 수 있다.According to the present invention, the manufacturing cost can be reduced by simplifying the structure for preventing the floating socket from separating from the test socket.

또한, 플로팅부재의 이탈방지 구조를 이용하여 플로팅부재에 장착된 피검사체의 단자와 소켓본체의 프로브의 정렬을 보다 정확하게 할 수 있다.
Further, the alignment of the probe of the socket body and the terminal of the object to be inspected mounted on the floating member can be made more accurate by using the separation prevention structure of the floating member.

도 1은 본 발명에 따른 테스트 소켓을 나타내는 사시도,
도 2는 플로팅부재의 저면도,
도 3 내지 5는 소켓본체에 대한 플로팅 부재의 이탈방지 동작을 나타낸 부분 단면도이다.
1 is a perspective view showing a test socket according to the present invention,
2 is a bottom view of the floating member,
Figs. 3 to 5 are partial cross-sectional views illustrating a departure-preventing operation of the floating member with respect to the socket body.

이하, 첨부한 도면을 참조하여 본 발명의 실시예들에 대하여 상세히 설명한다. 설명의 편의상 본 발명의 이해를 위해 관련된 부분들만을 설명하였고, 발명과 직접적으로 관련이 없는 부분은 도면 또는 설명에서 배제하였으며, 명세서 전체를 통하여 동일 또는 유사한 구성요소에 대해서는 동일한 참조부호를 부여하였다. Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. For convenience of explanation, only relevant portions are described for the understanding of the present invention, and portions not directly related to the invention are excluded from the drawings or description, and the same or similar components are given the same reference numerals throughout the specification.

도 1 및 2에 나타낸 바와 같이, 예를 들면 반도체칩과 같은 피검사체의 전기적 특성을 검사하기 위한 테스트 소켓(1)은 소켓본체(100)와 플로팅부재(200)를 포함한다. 여기서, 플로팅부재(200)는 피검사체를 수용한 상태에서 소켓본체(100)의 플로팅부재 수용 캐비티(101) 내에 수용된다. 1 and 2, a test socket 1 for inspecting an electrical characteristic of a test object, such as a semiconductor chip, for example, includes a socket body 100 and a floating member 200. Here, the floating member 200 is accommodated in the floating member accommodating cavity 101 of the socket body 100 while accommodating the test object.

소켓본체(100)는 상면으로부터 함몰형성된 플로팅부재 수용캐비티(101)를 가진다. The socket body 100 has a floating member receiving cavity 101 which is recessed from the upper surface.

플로팅부재 수용캐비티(101)는 바닥(140)의 중앙에 다수 프로브(120)의 각 양단부가 상하 노출되도록 장착된다. The floating member receiving cavity 101 is mounted such that both ends of the plurality of probes 120 are vertically exposed at the center of the bottom 140.

프로브(120)는 상하단이 돌출된 상태로 소켓본체(100)에 지지되며, 도 1에서는 돌출된 프로브(120)의 상단만을 나타낸 것이다. 프로브(120)의 상단은 플로팅부재(100)에 장착되는 피검사체의 단자, 예를 들면 범프에 접촉한다. 프로브(120)의 하단은 검사회로기판(미도시)의 패드에 접촉한다. 이때, 프로브(120)의 상단과 하단 중 적어도 하나는 탄성적으로 길이방향을 따라 신축가능하다. 본 발명에 따른 소켓본체(100)는 다양한 형태의 구조를 가진 프로브(120)들이 적용될 수 있음로, 특정 구조로 한정되지 않는다.The probe 120 is supported on the socket body 100 with the upper and lower ends thereof protruded. In FIG. 1, only the upper end of the protruded probe 120 is shown. The upper end of the probe 120 is in contact with a terminal of the object to be inspected mounted on the floating member 100, for example, a bump. The lower end of the probe 120 contacts the pad of the inspection circuit board (not shown). At this time, at least one of the upper end and the lower end of the probe 120 is elastically stretchable along the longitudinal direction. Since the probes 120 having various types of structures can be applied to the socket body 100 according to the present invention, the socket body 100 is not limited to a specific structure.

플로팅부재 수용캐비티(101)는 바닥(140)에 상향 돌출된 플로팅부재(100)의 탄성적 플로팅을 위한 4개의 볼 플런저(110)가 배치되어 있다. 볼 플런저(110)는 상부의 입구가 좁은 원통 형태의 용기(112) 내에 배치된 스프링(비도시)에 의해 이탈되지 않으면서 탄성적으로 요동할 수 있다. 따라서, 4개의 볼 플런저(110) 상에 올려진 플로팅부재(100)는 볼 플런저(110)의 탄성적 요동에 따라 탄성적인 플로팅이 이루어질 수 있다. 플로팅부재(200)는 볼 플런저(110)가 도 2의 플로팅부재(200)의 바닥(220) 하부에 형성된 제1개공(210)를 포함한다. 볼 플런저(110)는 상기 제1개공(210)에 삽입된 상태에서 플로팅부재(200)를 지지한다. 여기서, 플로팅부재(200)를 플로팅시키기 위한 구조는 도 1 및 2에 도시한 것으로만 제한되지 않는다.The floating member receiving cavity 101 is provided with four ball plungers 110 for resiliently floating the floating member 100 protruding upward from the bottom 140. The ball plunger 110 can be resiliently swung without being dislodged by a spring (not shown) disposed in a narrow cylindrical cylindrical container 112 at the top. Therefore, the floating member 100 placed on the four ball plungers 110 can be subjected to elastic floating according to the elastic fluctuation of the ball plunger 110. The floating member 200 includes a first aperture 210 formed in the bottom of the bottom 220 of the floating member 200 of FIG. The ball plunger 110 supports the floating member 200 in a state of being inserted into the first opening 210. Here, the structure for floating the floating member 200 is not limited to that shown in Figs.

소켓본체(100)는 플로팅부재 수용캐비티(101)의 바닥(140)에 상향으로 돌출 배치된 4개의 이탈방지핀(130)이 배치된다. 물론 이탈방지핀(130)은 4개로 제한되지 않고 설계에 따라 단일 또는 복수로 배치될 수 있다. The socket body 100 is provided with four release prevention pins 130 protruding upward from the bottom 140 of the floating member accommodation cavity 101. [ Of course, the departure prevention pins 130 are not limited to four, and may be arranged singly or plurally according to the design.

이탈방지핀(130)은 상기 플로우팅부재가 상기 소켓본체의 플로팅부재 수용캐비티에 수용된 상태에서 상기 플로우팅부재가 상기 소켓본체로부터 이탈하는 것을 방지하는 역할을 한다. 물론 교체나 세척을 위해 적정한 힘을 가할 경우 강제 이탈될 수 있어야 한다. The separation preventing pin 130 serves to prevent the floating member from being detached from the socket body when the floating member is accommodated in the floating member accommodating cavity of the socket body. Of course, if force is applied for replacement or cleaning, it must be able to be forcibly released.

이탈방지핀(130)은 도 3에 나타낸 바와 같이 상기 플로우팅부재(200)을 향해 돌출된다.The release prevention pin 130 protrudes toward the floating member 200 as shown in FIG.

이탈방지핀(130)은 기둥부(133)로부터 횡방향으로 확장된 플랜지 단부(131)와 플랜지 단부(1310의 반대측 자유단부영역에 가로방향으로 돌출된 걸림턱(134)을 가진 걸림돌기(132-1,132-2)를 포함한다. The release prevention pin 130 has a flange end 131 extending transversely from the column portion 133 and a latching protrusion 132 having a latching protrusion 134 protruding laterally from the opposite free end region of the flange end portion 1310 -1,132-2).

걸림돌기(132-1,132-2)는 길이방향의 절개홈(136)에 의해 2개로 분리된다. 물론 절개홈(136)의 형태에 따라 3개 이상으로 분리될 수 있다. 또한 걸림돌기(132-1,132-2)는 절개홈(136)를 형성하지 않고 하나로 제작될 수도 있다. 걸림돌기(132-1,132-2)는 절개홈(136)을 중심으로 탄성변형될 수 있다.The engaging projections 132-1 and 132-2 are separated into two by the incision grooves 136 in the longitudinal direction. Of course, three or more can be separated depending on the shape of the incision groove 136. The latching protrusions 132-1 and 132-2 may be formed as one without forming the cutout grooves 136. [ The engaging projections 132-1 and 132-2 can be elastically deformed about the incision groove 136. [

걸림돌기(132-1,132-2)의 자유단은 점차 단면적이 좁아지는 테이퍼 형상을 가진다. 이는 플로팅부재(200)의 걸림돌기 수용공(230)에 용이하게 삽입될 수 있도록 하기 위한 것이다.The free ends of the engaging projections 132-1 and 132-2 have a tapered shape in which the cross-sectional area is gradually narrowed. This is for facilitating insertion into the locking projection receiving hole 230 of the floating member 200.

이탈방지핀(130)은 플로팅부재 수용캐비티(101)의 바닥(140)에 형성된 이탈방지핀 수용공(142)에 걸림돌기(132-1,132-2)가 돌출되도록 수용된다. 이탈방지핀 수용공(142)은 수용된 이탈방지핀(130)이 상하 요동이 가능하되, 플랜지 단부(131)에 의해 이탈이 방지되도록 설계된다. 물론 걸림돌기(132-1,132-2)의 돌출 높이를 높이면 이탈방지핀(130)은 요동하지 않게 고정될 수 있다.The release prevention pin 130 is received in the release prevention pin receiving hole 142 formed in the bottom 140 of the floating member receiving cavity 101 so as to protrude from the engagement protrusions 132-1 and 132-2. The detachment pin receiving hole 142 is designed such that the received detachment prevention pin 130 can swing up and down, but is prevented from being separated by the flange end 131. Of course, when the protruding height of the locking protrusions 132-1 and 132-2 is increased, the detachment prevention pin 130 can be fixed so as not to rock.

플로팅부재(200)는 상방으로 개방된 피검사체 수용부(201)를 가진다. 피검사체 수용부(201)의 바닥에는 예를 들면 반도체칩의 범프 단자가 삽입되는 단자공(222)을 가진다. 단자공(222)은 완전 관통형성되는 것이 일반적이나 도전체로 일부가 채워질 수 있다.The floating member 200 has a test object accommodating portion 201 which is opened upward. The bottom of the test object accommodating portion 201 has a terminal hole 222 into which, for example, a bump terminal of a semiconductor chip is inserted. The terminal hole 222 is generally formed to be completely penetrated, but it may be partially filled with a conductor.

플로팅부재(200)는 도 2에 나타낸 바와같이 바닥(220) 하부에 소켓본체(100)에 지지된 볼 플런저(110)에 상응하는 위치에 배치된 4개의 제1개공(210) 및 이탈방지핀(130)의 걸림돌기(132-1,132-2)가 삽입되는 4개의 걸림돌기 수용공(230)을 포함한다.2, the floating member 200 includes four first openings 210 disposed at positions corresponding to the ball plungers 110 supported by the socket body 100 at the bottom of the bottom 220, And four locking protrusions receiving holes 230 into which the locking protrusions 132-1 and 132-2 of the locking protrusion 130 are inserted.

걸림돌기 수용공(230)은 상기 걸림돌기(132-1,132-2)의 걸림턱(134)에 맞물리는 물림턱(234)이 내벽에 형성되어 있다. 따라서, 걸림돌기(132-1, 132-2)가 삽입될 때 4개의 볼 플런저(110)와 제1개공(210)의 정렬과 더불어 4개의 이탈방지핀(130)과 걸림돌기 수용공(230)의 정렬에 의해 플로팅부재(200)에 탑재된 피검사체의 단자와 소켓본체(100)에 지지된 프로브(120)가 더욱 정확하게 정렬될 수도 있다.The engaging projection receiving hole 230 is formed on the inner wall with an engaging protrusion 234 engaging with the engaging protrusion 134 of the engaging protrusions 132-1 and 132-2. Accordingly, when the engaging protrusions 132-1 and 132-2 are inserted, the four ball plungers 110 and the first holes 210 are aligned with each other, and the four escape prevention pins 130 and the engagement protrusions 230 The terminals of the object to be inspected mounted on the floating member 200 and the probes 120 supported on the socket body 100 may be more accurately aligned.

도 3 내지 도 5를 참조하여 소켓본체(100)에 대한 플로팅 부재(200)의 이탈방지 동작을 설명하면 다음과 같다.3 to 5, the operation of preventing the floating member 200 from being separated from the socket body 100 will be described below.

도 3은 플로팅부재(200)가 소켓본체(100)의 플로팅부재 수용캐비티(101)에 수용되기 전 상태는 나타낸다. 이때, 이탈방지핀(130)은 하중에 의해 이탈방지핀 수용공(142)의 바닥에 놓여진다.3 shows a state before the floating member 200 is received in the floating member accommodation cavity 101 of the socket body 100. As shown in Fig. At this time, the separation prevention pin 130 is placed on the bottom of the separation prevention pin receiving hole 142 by the load.

도 4는 플로팅부재(200)가 소켓본체(100)의 플로팅부재 수용캐비티(101)에 수용됨으로써, 이탈방지핀(130)의 걸림돌기(132-1, 132-2)가 걸림돌기 수용공(230)에 수용된다. 여기서, 걸림돌기(132-1, 132-2)의 걸림턱(134)은 걸림돌기 수용공(230)의 물림턱(234)에 맞물린다. 이때, 돌출된 볼 플런저들(110)은 제1개공(210)에 삽입되고, 플로팅부재(200)는 볼 플런저(110)를 탄성적으로 가압된 상태이다.4 shows a state in which the floating member 200 is accommodated in the floating member accommodating cavity 101 of the socket body 100 so that the engagement protrusions 132-1 and 132-2 of the disengagement prevention pin 130 are engaged with the engaging recessed- 230). Here, the engagement protrusions 134 of the engagement protrusions 132-1 and 132-2 are engaged with the engagement protrusions 234 of the engagement protrusion receiving holes 230. [ At this time, the protruded ball plungers 110 are inserted into the first opening 210, and the floating member 200 is in a state where the ball plunger 110 is elastically pressed.

도 5는 도 4에서 플로팅부재(200)를 가압하는 힘을 해제함으로써 볼 플런저(110)의 탄성 복원력에 의해 상향 이동된 것을 나타낸다. 이때, 플로팅부재(200)의 상향 이동에 따라 걸림턱(134)와 물림턱(234)의 맞물림으로 플로팅부재(2000에 결합된 이탈방지핀(130)이 같이 딸려 올라가게 된다. 결과적으로, 플로팅부재(200)는 이탈방지핀(130)의 요동 폭 만큼 탄성적으로 요동하면서, 소켓본체(100)로부터 이탈이 방지된다. 여기서, 다소 강한 힘으로 플로팅부재(200)를 들어올리면 걸림돌기(132-1, 132-2)가 절개홈(136)을 중심으로 탄성변형되어 걸림턱(134)와 물림턱(234)의 맞물림이 해제된다. 결과적으로 플로팅부재(200)는 교체, 수선, 및 세척을 위해 소켓본체(100)로부터 분리할 수 있다. 따라서, 걸림돌기(132-1, 132-2)의 탄성변형은 테스트를 위한 상하요동 시에 이탈되지 않으면서 적절한 힘에 의해 강제 분리될 수 있어야 한다. Fig. 5 shows that the ball plunger 110 is moved upward by the resilient restoring force by releasing the force for pressing the floating member 200 in Fig. At this time, due to the upward movement of the floating member 200, the engagement protrusion 134 and the engagement protrusion 234 are engaged with each other, so that the release prevention pin 130 coupled to the floating member 2000 is attached to the floating member 200. As a result, The member 200 is elastically swung by the swinging width of the departure prevention pin 130 and is prevented from being separated from the socket body 100. When the floating member 200 is lifted with a relatively strong force, -1 and 132-2 are elastically deformed about the cutout groove 136 to release the engagement of the engagement protrusion 134 and the engagement protrusion 234. As a result, the floating member 200 can be replaced, The elastic deformation of the latching protrusions 132-1 and 132-2 can be separated from the socket body 100 by the appropriate force without being released during the up-and-down swing for testing do.

테스트 소켓(1)은 크기가 작게는 가로 15.0mm , 세로 15.0mm에서 크게는 가로 100.0mm , 세로 150.0mm 정도이다. 따라서, 걸림돌기(132-1, 132-2)의 탄성변형을 고려할 때, 걸림턱(134)의 가로방향 길이를 0.1mm ~ 0.2mm 범위로 설계하는 것이 바람직하다. 즉, 상기 길이범위보다 작으면 테스트 시에 플로팅부재(200)가 이탈하고, 크면 강제 이탈 시에 걸림턱(134)이나 물림턱(234)이 파손되는 문제가 발생할 수 있다.The test socket (1) has a width of 15.0 mm and a length of 15.0 mm, and a width of 100.0 mm and a length of 150.0 mm. Therefore, in consideration of the elastic deformation of the engagement protrusions 132-1 and 132-2, it is preferable to design the length of the engagement protrusion 134 in the range of 0.1 mm to 0.2 mm. That is, if the length is smaller than the above range, the floating member 200 may be detached at the time of testing, and if it is large, the latching jaw 134 and the latching jaw 234 may be damaged at the time of forced release.

이탈방지구조(130, 230)는 상술한 형태로만 한정되지 않는다. 예를 들면, 이탈방지핀(130)에 플로팅부재(200)에 배치되고, 걸림돌기 수용공(230)이 소켓본체(100)에 배치될 수 있다. The departure prevention structures 130 and 230 are not limited to the above-described forms. For example, the detent pin 130 may be disposed on the floating member 200, and the locking projection receiving hole 230 may be disposed on the socket body 100.

또한, 플로팅부재(200)의 외측면에 물림턱을 가진 홈부가 형성되고, 이 물림턱에 맞물리는 걸림턱을 가진 걸림돌기를 소켓본체의 플로팅부재 수용캐비티의 바닥 외곽에 배치할 수도 있다. 이때, 걸림돌기는 플로팅부재 수용캐비티의 측벽에 걸림돌기를 걸림턱만 돌출하도록 수용하도록 할 수 있다. 물론, 걸림돌기 수용공은 수용된 걸림돌기가 탄성변형 될 수 있도록 설계되어야 한다. It is also possible to arrange a latching protrusion having a latching jaw which engages with the engaging jaw on the outer surface of the bottom of the floating member receiving cavity of the socket body. At this time, the locking protrusion may be configured to receive the locking protrusion protruding from the side wall of the floating member accommodating cavity so as to protrude from the locking protrusion. Of course, the locking hole should be designed so that the received locking projection can be elastically deformed.

앞에 설명한 명세서에서, 본 발명 및 그 장점들이 특정 실시예들을 참조하여 설명되었다. 그러나, 아래의 청구항에서 설명하는 바와 같은 본 발명의 범위에서 벗어나지 않는 한, 다양한 수정 및 변경이 가능함은 이 기술 분야에서 보통의 기술을 가진 자에게 명백할 것이다. 이에 따라, 명세서와 도면은 한정 보다는 본 발명의 예시로서 간주되어야 한다. 모든 이러한 가능한 수정들은 본 발명의 범위 내에서 이루어져야 한다.In the foregoing specification, the invention and its advantages have been described with reference to specific embodiments. However, it will be apparent to those of ordinary skill in the art that various modifications and variations can be made in the present invention without departing from the scope of the invention as set forth in the claims below. Accordingly, the specification and drawings are to be regarded as illustrative of the invention rather than limiting. All such possible modifications should be made within the scope of the invention.

1 : 테스트 소켓
100: 소켓본체
110: 볼 플런저
120: 프로브
130: 이탈방지핀
132-1,132-2: 걸림돌기
134: 걸림턱
200: 플로팅부재
230: 걸림돌기 수용공
234: 물림턱
1: Test socket
100: Socket body
110: Ball plunger
120: Probe
130:
132-1, 132-2:
134: hanging jaw
200: Floating member
230: Stuck hole
234: Biting chin

Claims (3)

피검사체의 전기적 특성을 검사하기 위한 테스트용 소켓에 있어서,
다수 프로브의 각 양단부가 상하 노출되도록 장착되며, 상면으로부터 함몰형성된 플로팅부재 수용캐비티를 갖는 소켓본체와;
상기 피검사체가 장착되는 피검사체 장착부를 가지고 상기 피검사체가 수용되는 플로팅부재 수용캐비티 내에 수용되는 플로우팅부재와;
상기 플로우팅부재가 상기 소켓본체의 플로팅부재 수용캐비티에 수용된 상태에서 상기 플로우팅부재가 상기 소켓본체로부터 이탈하는 것을 방지하는 이탈방지부를 포함하며,
상기 이탈방지부는,
상기 플로우팅부재와 상기 소켓본체의 어느 일측에서 타측을 향해 돌출되며, 상기 돌출방향에 가로방향으로 단성변형 가능하며, 자유단부영역에 가로방향으로 돌출된 걸림턱을 가진 걸림돌기와;
상기 플로우팅부재와 상기 소켓본체 중 타측에 마련되어 상기 플로팅부재가 상기 소켓본체에 대해 소정의 상하폭의 범위 내에서 플로팅 가능하도록 상기 걸림턱과 맞물리는 물림턱을 포함하는 것을 특징으로 하는 테스트용 소켓.
A test socket for inspecting an electrical characteristic of a test object,
A socket body which is mounted so that both ends of the plurality of probes are exposed up and down, and has a floating member receiving cavity which is recessed from the upper surface;
A floating member accommodated in the floating member receiving cavity in which the object to be inspected is accommodated with the object mounting portion to which the object to be inspected is mounted;
And a separation preventing portion for preventing the floating member from separating from the socket body while the floating member is accommodated in the floating member accommodating cavity of the socket body,
The departure-
A latching protrusion protruding from one side of the floating member and the socket body toward the other side and being deformed in the lateral direction in the protruding direction and having a latching protrusion projecting in the transverse direction in the free end region;
And a locking protrusion provided on the other side of the floating body and the socket body so as to engage with the locking protrusion so that the floating member can float within a predetermined upper and lower width range with respect to the socket body. .
제 1항에 있어서,
상기 플로우팅부재와 상기 소켓본체 중 타측은 상기 걸림돌기를 수용하는 걸림돌기 수용공을 가지며,
상기 물림턱은 상기 걸림돌기 수용공의 내벽에 형성되는 것을 특징으로 하는 테스트용 소켓.
The method according to claim 1,
And the other side of the floating member and the socket body has an engaging projection receiving hole for receiving the engaging projection,
And the engaging jaw is formed on an inner wall of the engaging projection hole.
제 1항에 있어서,
상기 걸림돌기는 길이방향의 절개홈에 의해 분리된 2 이상의 걸림돌기를 포함하는 것을 특징으로 하는 테스트용 소켓.
The method according to claim 1,
Wherein the engaging protrusion includes at least two engaging protrusions separated by a longitudinal incision notch.
KR1020150047520A 2015-04-03 2015-04-03 A test socket Ceased KR20160118796A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020150047520A KR20160118796A (en) 2015-04-03 2015-04-03 A test socket
PCT/KR2016/002799 WO2016159548A1 (en) 2015-04-03 2016-03-21 A test socket
TW105108926A TW201637312A (en) 2015-04-03 2016-03-23 Test socket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150047520A KR20160118796A (en) 2015-04-03 2015-04-03 A test socket

Publications (1)

Publication Number Publication Date
KR20160118796A true KR20160118796A (en) 2016-10-12

Family

ID=57005204

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150047520A Ceased KR20160118796A (en) 2015-04-03 2015-04-03 A test socket

Country Status (3)

Country Link
KR (1) KR20160118796A (en)
TW (1) TW201637312A (en)
WO (1) WO2016159548A1 (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102043646B1 (en) * 2019-07-02 2019-11-14 주식회사 경성금형 Apparatus for bonding semiconductor chip
KR102105874B1 (en) * 2019-02-21 2020-04-29 주식회사 티에프이 Socket module for testing semiconductor package and semiconductor package docking plate having the same
KR102119862B1 (en) 2019-02-20 2020-06-05 (주)티에스이 Test socket
KR102192764B1 (en) 2019-11-19 2020-12-18 (주)티에스이 Test socket device
KR102192919B1 (en) 2019-11-19 2020-12-18 (주)티에스이 Test socket device and method for manufacturing the same
KR102193447B1 (en) 2019-12-09 2020-12-21 (주)티에스이 Test socket
KR102223445B1 (en) 2020-01-22 2021-03-05 (주)티에스이 Test socket
KR20210120800A (en) 2020-03-26 2021-10-07 (주)티에스이 Test apparatus for semiconductor package
KR20230031636A (en) 2021-08-27 2023-03-07 (주)티에스이 Test apparatus for semiconductor package
US11609244B2 (en) 2020-03-26 2023-03-21 Tse Co., Ltd. Test apparatus for semiconductor package
KR20240045515A (en) 2022-09-30 2024-04-08 (주)티에스이 Burn-in socket

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI669509B (en) * 2016-11-03 2019-08-21 台灣福雷電子股份有限公司 Ic test socket and method for determining esd decay time capability of ic test socket

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002156408A (en) * 2000-11-20 2002-05-31 Advantest Corp Socket connection terminal cleaning kit, socket connection terminal cleaning method, and electronic component test apparatus
KR101094826B1 (en) * 2011-01-14 2011-12-16 하이콘 주식회사 Socket with IC Seat Plate
KR101703688B1 (en) * 2012-05-02 2017-02-07 리노공업주식회사 A Test Socket
KR101490498B1 (en) * 2013-06-18 2015-02-05 주식회사 아이에스시 Insert for test
KR101442704B1 (en) * 2013-10-23 2014-09-23 주식회사 하나엔-텍 Insert socket for semiconductor component inspection

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102119862B1 (en) 2019-02-20 2020-06-05 (주)티에스이 Test socket
KR102105874B1 (en) * 2019-02-21 2020-04-29 주식회사 티에프이 Socket module for testing semiconductor package and semiconductor package docking plate having the same
KR102043646B1 (en) * 2019-07-02 2019-11-14 주식회사 경성금형 Apparatus for bonding semiconductor chip
KR102192764B1 (en) 2019-11-19 2020-12-18 (주)티에스이 Test socket device
KR102192919B1 (en) 2019-11-19 2020-12-18 (주)티에스이 Test socket device and method for manufacturing the same
KR102193447B1 (en) 2019-12-09 2020-12-21 (주)티에스이 Test socket
KR102223445B1 (en) 2020-01-22 2021-03-05 (주)티에스이 Test socket
KR20210120800A (en) 2020-03-26 2021-10-07 (주)티에스이 Test apparatus for semiconductor package
US11609244B2 (en) 2020-03-26 2023-03-21 Tse Co., Ltd. Test apparatus for semiconductor package
KR20230031636A (en) 2021-08-27 2023-03-07 (주)티에스이 Test apparatus for semiconductor package
KR20240045515A (en) 2022-09-30 2024-04-08 (주)티에스이 Burn-in socket

Also Published As

Publication number Publication date
WO2016159548A1 (en) 2016-10-06
TW201637312A (en) 2016-10-16

Similar Documents

Publication Publication Date Title
KR20160118796A (en) A test socket
JP5815759B2 (en) Semiconductor device inspection equipment
US6069481A (en) Socket for measuring a ball grid array semiconductor
CN103311709B (en) For the contact of electronic installation
KR101073400B1 (en) Test probe
KR102520051B1 (en) Test socket and Method for testing semiconductor package
US20020115337A1 (en) Socket for electrical parts
KR101703688B1 (en) A Test Socket
KR101786831B1 (en) Multi-contact test socket
TWI605254B (en) Test device
KR101485433B1 (en) Insert and Apparatus for testing semiconductor package including the same
KR101852794B1 (en) Apparatus for testing semiconductor package
US9653833B2 (en) Contact pin and electrical component socket
KR101004708B1 (en) Probe Device for Semiconductor Package Inspection
US7121858B2 (en) Socket for ball grid array devices
KR101350606B1 (en) Insert assembly
KR102038968B1 (en) Insert, base and test socket for use in testing semiconductor device
KR101051032B1 (en) Test socket for semiconductor chip
JP5015024B2 (en) Contact insert for test sockets in microcircuits
US8366454B2 (en) Socket for electrical component
US6544044B2 (en) Socket for BGA package
KR101446146B1 (en) A Testing Device
KR102287237B1 (en) Insert assembly for receiving semiconductor device and test tray including the same
KR200313240Y1 (en) Test socket for ball grid array package
KR20150139092A (en) A Connector Assembly, A Connector Subassembly And A Connector Pin For Test Apparatus

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20150403

PA0201 Request for examination
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20160421

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20161007

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20160421

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

PG1501 Laying open of application