KR101485433B1 - Insert and Apparatus for testing semiconductor package including the same - Google Patents

Abstract

The present invention improves alignment problems during testing of a semiconductor package and prevents stable test progress and damage to the solder balls even if the alignment is somewhat distorted. The insert of the present invention includes a housing portion in which a semiconductor package to be inspected is mounted And a first socket coupled to a lower portion of the insert body.
Wherein the first socket comprises at least one plunger provided so as to be freely movable up and down within a predetermined interval, wherein the plunger is mounted on the insert so that when the semiconductor package is tested, And is in contact with the solder balls of the semiconductor package.

Description

≪ Desc / Clms Page number 1 > INSERT AND APPARATUS FOR TESTING SEMICONDUCTOR PACKAGE INCLUDING THE SAME

The present invention relates to a semiconductor package test apparatus for testing a semiconductor package and an insert which is a component thereof. More particularly, the present invention relates to a semiconductor package test for preventing damage of a solder ball during testing and for performing a complete test even when the semiconductor package is slightly misaligned And an insert which is a component thereof.

Generally, a semiconductor package manufactured by a semiconductor package manufacturing process is subjected to reliability tests such as electrical die sorting (EDS) and function test before shipment. The test connects all the input and output terminals of the semiconductor package with the test signal generating circuit to check the normal operation and disconnection and connect the input and output terminals of the semiconductor package such as the power supply input terminal to the test signal generating circuit. There is a burn-in test in which stress is applied by high temperature, voltage, and current to check the lifetime of the semiconductor package and the occurrence of the coupling.

Normally, the above reliability test is carried out with the semiconductor package mounted on the test socket. The shape of the test socket is basically determined according to the shape of the semiconductor package. The test socket serves as a medium for connecting the test substrate by the mechanical contact between the external connection terminal of the semiconductor package and the socket lead (or solder ball) do.

In a ball grid array (BGA) package using a solder ball as an external connection terminal in a semiconductor package, the test socket has a structure in which a socket pin is inserted into a socket body of a plastic material and is manufactured by a molding die method. A pogo pin with its own elasticity is used as the socket pin.

A handler is mainly used as a device for transferring the manufactured semiconductor package to a test apparatus and classifying the tested semiconductor package. The handler typically has a test tray in which one or more semiconductor packages are received. A large number of semiconductor packages can be transported and tested while being accommodated in a test tray. An insert module is used to fix the semiconductor package in such a test tray.

The handler transports a plurality of semiconductor packages into the test apparatus and makes each semiconductor package electrically connected to the tester to test whether the semiconductor package is operating in the tester. Each tested semiconductor package is removed from the test head and classified according to the test result.

At this time, the handler transports a test tray having an insert, in which a plurality of semiconductor packages are housed, to a test apparatus so that a test process can be performed.

Japanese Patent Application Laid-Open No. 10-1149759 (Test Apparatus for Semiconductor Device)

1 is a perspective view illustrating a method for testing a conventional semiconductor. 2 is a cross-sectional view illustrating a conventional semiconductor test process.

An apparatus for testing a semiconductor package 3 includes an insert 4 for inserting a semiconductor package 3, a ball guide 4a for guiding and guiding a solder ball 3a of the semiconductor package 3, A pusher 2 for pushing the semiconductor package 3 mounted on the guide 4a, a socket 6 for accommodating a pogo pin 7 and a socket guide 5 for guiding the position of the socket .

According to the conventional technique, in order to test the semiconductor package 3, the pogo pin 7 housed in the socket 6 is directly contacted with the solder ball 3a of the semiconductor package 3, which is an object to be inspected, . At this time, the solder ball 3a is mounted on the ball guide 4a to prevent the solder ball 3a from being separated.

3 is a sectional view for explaining the alignment of the pogo pin 7 in the conventional semiconductor testing process. 4 and 5 are cross-sectional views for explaining the misalignment state of the pogo pin 7 in the conventional semiconductor test process.

3, the solder ball 3a of the semiconductor package 3 mounted on the insert 4 is aligned by the ball guide 4a and the solder ball 3a is aligned with the pogo pin 7 of the socket 6 ). However, errors such as the size of the through hole 4b of the ball guide 4a and the apparatus for guiding the insert 4 with respect to the socket 6 are inevitably generated when the socket 6 and the ball guide 4a are manufactured do. Due to such an error, when the pogo pin 7 and the solder ball 3a are not brought into contact with each other, or when the solder ball 3a and the pogo pin 7 are misaligned as shown in Fig. 4, . At this time, the pogo pin 7 may irregularly contact the outer periphery of the solder ball 3a, as shown at point A in FIG. 4, so that the solder ball 3a may be damaged. In some cases, There was a problem of bending. That is, the solder ball 3a and the pogo pin 7 are not aligned correctly, and various problems have occurred.

A method has been proposed in which the thickness of the ball guide 4a is made thicker than the thickness of the solder ball 3a in order to accurately contact the solder ball 3a and the pogo pin 7 as shown in FIG. At this time, the upper portion of the pogo pin 7 is guided by the through hole 4b formed by the ball guide 4a, and can be brought into contact with the solder ball 3a accurately aligned. That is, the problem of preventing the solder ball 3a from being damaged can be solved. This modification is such that when the through hole 4b and the pogo pin 7 are misaligned, the upper portion of the pogo pin 7 comes into contact with the lower surface of the ball guide 4a, and the solder ball 3a and the pogo pin 7, (Point B). ≪ / RTI > That is, there is a problem that the damage of the solder ball 3a and the contact stability can not be solved at the same time.

The present invention improves the alignment problem during testing of the semiconductor package (3), and aims at stable test progress and damage to the solder ball (3a) even if alignment is somewhat changed.

In order to attain the above object, an insert of the present invention includes an insert body including a housing portion on which a semiconductor package to be inspected is mounted, and a first socket coupled to a lower portion of the insert body.

Wherein the first socket comprises at least one plunger provided so as to be freely movable up and down within a predetermined interval, wherein the plunger is mounted on the insert so that when the semiconductor package is tested, And is in contact with the solder balls of the semiconductor package.

The plunger is composed of an upper portion which is brought into contact with the solder ball, a lower end portion which can protrude from the lower end of the first socket, and a middle portion formed at the upper end portion and the lower end portion and has a maximum outer diameter.

The first socket includes an upper housing including at least one upper hole formed corresponding to at least one solder ball formed in the semiconductor package, and at least one or more second contacts formed in contact with a lower surface of the upper housing, And a lower housing including a lower hole, wherein the plunger is installed in each of the upper hole and the lower hole corresponding to the upper hole.

At least one of the upper hole and the lower hole may include a diameter enlarged portion having an inner diameter expanded at a portion where the upper hole and the lower hole are in contact with each other, And the intermediate portion is free to move upward and downward in the enlarged diameter portion.

A semiconductor package test apparatus according to the present invention includes a pusher which includes the insert and is located at an upper portion of the insert and presses the semiconductor package to prevent the semiconductor package from being vertically separated from the insert, And a second socket coupled to the inside of the socket guide, the socket guide including a pogo pin capable of electrical signal transmission and capable of increasing and decreasing its length by elastic means.

Wherein the insert body further includes at least one guide groove formed on an outer side of the receiving part and below the insert body, and the socket guide includes at least one guide protrusion formed at a position corresponding to the guide groove, Is prevented from being laterally spaced from the insert when the insert is engaged with the guide groove.

In testing the semiconductor package, the solder ball, the plunger, the pogo pin, and the tester are electrically connected to each other in order.

The plunger and the pogo pin are each at least two, and the distance between the center axes of the adjacent plungers is smaller than the diameter of the contact pin.

According to the insert semiconductor package testing apparatus of the present invention, it is possible to allow an error occurring in alignment, thereby solving the conventional problem that the solder ball of the semiconductor is broken by the contact pin at the time of testing, It is possible to obtain an advantage that the tester can be stably energized.

1 is a perspective view illustrating a method for testing a conventional semiconductor.
2 is a cross-sectional view illustrating a conventional semiconductor test process.
3 is a cross-sectional view illustrating alignment of pogo pins in a conventional semiconductor test process.
4 and 5 are cross-sectional views illustrating misalignment states of pogo pins in a conventional semiconductor test process.
6 is a cross-sectional view illustrating a semiconductor test process according to an embodiment of the present invention.
7 is a cross-sectional view of an insert according to an embodiment of the present invention in which a semiconductor package is housed.
8 is a cross-sectional view of a semiconductor package test according to an embodiment of the present invention.
9 is a cross-sectional view showing a misalignment state of the pogo pin in the semiconductor package test according to the embodiment of the present invention.

In the following description, only parts necessary for understanding the operation according to the embodiment of the present invention will be described, and the description of other parts will be omitted so as not to disturb the gist of the present invention.

Furthermore, the terms and words used in the present specification and claims should not be construed to be limited to ordinary or dictionary terms, and the inventor should understand the concept of the term The present invention should be construed as meaning and concept consistent with the technical idea of the present invention. Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely one preferred embodiment of the present invention, and not all of the technical ideas of the present invention are described. Therefore, It is to be understood that equivalents and modifications are possible.

Hereinafter, embodiments of an insert and a semiconductor package testing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 6 is a cross-sectional view illustrating a semiconductor test process according to an embodiment of the present invention. FIG. 7 is a cross-sectional view of a semiconductor package 30 in which an insert 40 according to an embodiment of the present invention is accommodated. 8 is a cross-sectional view of the semiconductor package 30 according to the embodiment of the present invention.

An insert (40) according to the present invention accommodates a semiconductor package (30) which is an object of a semiconductor test and is a movable device. The movement is such that the insert 40 helps the semiconductor package 30 to be tested in a stable state.

The insert (40) includes an insert body (40) forming an outer shape and a receiving portion (43) for accommodating the semiconductor package (30). The accommodating portion 43 is formed to correspond to the type of the semiconductor package 30.

A first socket (80) is positioned below the insert body (40). The first socket 80 may be integrally formed with the insert body, but it may be separately manufactured for convenience of manufacture. When the first socket 80 is separately manufactured, a first socket receiving portion 42 corresponding to the shape of the first socket 80 is formed in the lower portion of the insert body 40.

The first socket 80 is a device for electrically connecting the solder ball 31 of the semiconductor package 30 and the pogo pin 70. Specifically, electrical connection is established by the plunger 86 provided inside the first socket 80. [

The plunger 86 is installed so as to freely move up and down within the first socket 80. Each of the plungers 86 is formed to move within substantially the same interval range. It is also possible to provide elastic means on the plunger 86 so that the plunger 86 is uniformly aligned in a state in which an external force does not act on each plunger 86.

The plunger 86 has an upper end portion 87 which is in contact with the solder ball 31, a lower end portion 88 and an upper end portion 87 protruding from the lower end of the first socket 80 to make contact with the upper end of the pogo pin 70 And a stop portion 89 for connecting the lower end portion 88. The intermediate portion 89 is characterized in that it has a larger diameter than the diameter of the upper end portion 87 and the lower end portion 88. The maximum outer diameter of the plunger 86 is located on the intermediate portion 89.

The first socket 80 includes an upper housing 81 including a plurality of upper holes 83 formed corresponding to a plurality of solder balls 31 formed in the semiconductor package 30, And a lower housing 82 including a lower hole 84 corresponding to the upper hole 83.

At least one of the upper hole 83 and the lower hole 84 at the portion where the upper hole 83 and the lower hole 84 are in contact includes the enlarged diameter portion 85 having an expanded inner diameter. Although the configuration in which the enlarged diameter portion 85 is formed on the lower hole 84 is disclosed in Fig. 7 and the like, the position of the enlarged diameter portion is not limited to the illustration of the drawings. That is, the enlarged diameter portion 85 may be formed in the lower portion of the upper hole 83 and may be formed in the upper hole 83 and the lower hole 84 at the same time. The enlarged diameter portion 85 guides the plunger 86 to move within a certain range. The intermediate portion 89 of the plunger 86 is free to move within the enlarged diameter portion 85 and the plunger 86 can move freely up and down within a certain length.

Since the lower end portion 88 of the plunger 86 is exposed to the outside of the first socket 80, the contact with the pogo pin 70 of the second socket 60, even if the alignment with the second socket 60 is broken, And the outer diameter of the plunger 86 and the outer diameter of the contact pin 71 of the pogo pin 70 are set to be equal to each other because the plunger 86 and the pogo pin 70 are brought into contact with each other outside the second socket 60 There is no big problem even if it is different. That is, since the outer diameter of the contact pin 71 can be made larger than the outer diameter of the plunger 86 within a constant pitch, the plunger 86 and the pogo pin 70 can be easily manufactured.

The semiconductor package 30 mounted on the insert 40 is electrically connected to the tester and tested. However, it is inefficient to directly connect the tester and the semiconductor package, since a plurality of semiconductor packages 30 are generally required to be tested within a short time. It is difficult to directly connect the solder ball 31 or the lead pin formed in the semiconductor package 30 to the tester because the formation interval is very narrow and the size is small. Thus, the test proceeds in such a manner that after the semiconductor package 30 is mounted to the insert 40, the solder ball 31 and the tester can be electrically connected by the pogo pin 70.

When the semiconductor package 80 is mounted on the insert 40, the solder balls 31 are inserted into the upper holes 83, respectively. At this time, contact may be made with the upper end 87 of the plunger 86, but it is preferable that there is a gap between the solder ball 31 and the upper end 87. That is, even in this state, the plunger 86 can move up and down. However, the semiconductor package 30 should be formed so as to have a narrower moving range than the case where the semiconductor package 30 is not mounted on the insert 40. When the plunger 86 is moved upward, the upper end portion 87 is brought into contact with the solder ball 31.

The insert 40 is positioned above the second socket 60 and the pusher 20 located at the top of the insert presses against the semiconductor package 30 to prevent the semiconductor package 30 from being vertically spaced.

And a contact pin 71 having upward restoring force by elastic means of the pogo pin 70. During the test, the lower end 88 of the plunger 86 contacts the top of the contact pin 71. Even if the pusher 20 is slightly pressed, the contact pins 71 can be elastically moved up and down, so that the semiconductor package 30 is not damaged. In addition, contact between the lower end portion 88 of the plunger and the contact pin 71 is also performed in a stable state.

The semiconductor package testing apparatus according to the present invention includes a socket guide 50 disposed in the insert 40, the pusher 20 and the insert 40 and capable of being separated from and coupled to the insert 40, And a second socket 60 which includes a pogo pin 70 which can be increased and decreased in length by means of the socket guide 50 and which is coupled to the inside of the socket guide 50.

During testing, the pusher 20, the semiconductor package 30 located in the insert 40, the plunger 86 located within the first socket 80, and the pogo pin 70 located within the second socket 60 Sorting is done in order. At this time, the solder ball 31 of the semiconductor package 30 is electrically connected to the tester through the plunger 86 and the pogo pin 70, and the test is proceeded.

Since the intermediate portion 89 of the plunger 86 is located in the diaphragm 85, the plunger 86 is positioned below the diaphragm 85 until the test is performed. The lower portion of the lower end portion 88 is brought into contact with the upper portion of the contact pin 71 of the pogo pin 70 and the plunger 86 moves upward due to the load transmitted by the pogo pin 70. When the plunger rises, the upper portion of the upper end portion 87 comes into contact with the solder ball 31.

9 is a cross-sectional view showing the misalignment state of the pogo pin 70 at the time of testing the semiconductor package 20 according to the embodiment of the present invention.

As shown in FIG. 8, alignment between the plunger 86 and the pogo pin 70 must be made in a preferred operating condition at the time of testing. This is a preliminary condition for testing the semiconductor package 30 having a small pitch. 9, the alignment of the solder ball 31 and the plunger 86 is not broken even if the alignment between the plunger 86 and the pogo pin 70 is somewhat distorted. When the upper portion of the upper portion 87 is machined into the 'V' shape, the contact with the solder ball 31 is more stable and the breakage of the solder ball 31 is also reduced. In addition, there is an advantage that the electrical contact is made even if the alignment is changed. That is, it is possible to securely test the semiconductor package 30 by increasing the possibility of electrical contact, and also by replacing the portion where the breakage can be made by the replaceable plunger 86.

At least two plungers 86 and pogo pins 70 are formed, respectively. The distance between the center axes of the adjacent plungers 86 is preferably smaller than the diameter of the contact pins 71. [ This is to solve the problem that two adjacent plungers 86 contact one contact pin 71 when misalignment occurs when the distance of the center side of the plunger 86 is larger than the diameter of the contact pin 71 It is for this reason.

Referring to FIG. 6, the insert body 40 includes a guide groove 41 formed on the lower side of the insert body 40 at the outer side of the storage portion 43. The socket guide 50 includes a guide protrusion 51 formed at a position corresponding to the guide groove 41 so as to prevent lateral separation of the insert 40 when the guide protrusion 51 is coupled to the guide groove 41. [ can do. That is, the test can proceed without separating the semiconductor package 30 by the pusher 20 and the guide groove 41.

It should be noted that the embodiments of the present invention disclosed in the present specification and drawings are only illustrative of specific examples for the purpose of understanding and are not intended to limit the scope of the present invention. It will be apparent to those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.

1: semiconductor device 20: pusher
30: semiconductor package 31: solder ball
40: insert body 41: guide groove
42: first socket receiving part 43: semiconductor receiving part
50: socket guide 51: guide projection
60: second socket 70: pogo pin
71: contact pin 80: first socket
81: upper housing 82: lower housing
86: Plunger

Claims (6)

An insert body including a housing portion on which a semiconductor package to be inspected is mounted; And a first socket coupled to a lower portion of the insert body,
The insert
Further comprising a plunger installed at the upper end of the first socket so as to be freely movable up and down at regular intervals and exposed at the lower end of the first socket,
The plunger is characterized in that when the semiconductor package is mounted on the insert, the upper end of the plunger is in contact with the solder ball of the semiconductor package and the lower end of the plunger is in contact with the pogo pin of the semiconductor package test apparatus, insert. The method according to claim 1,
The first socket includes:
An upper housing including at least one upper hole formed corresponding to at least one solder ball formed in the semiconductor package; And
And a lower housing formed in contact with a lower surface of the upper housing and including at least one lower hole formed corresponding to the upper hole,
Wherein the plunger is installed in each of the upper hole and the lower hole corresponding to the upper hole. 3. The method of claim 2,
The plunger,
An upper end portion in contact with the solder ball;
A lower end protruding from a lower end of the first socket; And
And a middle portion formed at the upper end portion and the lower end portion and having a maximum outer diameter,
The first socket includes:
At least one of the upper hole and the lower hole includes a enlarged diameter portion having an inner diameter expanded at a portion where the upper hole and the lower hole are in contact with each other,
Wherein the upper holes are formed such that the solder balls can be inserted into the upper holes, respectively, and the intermediate portions move up and down freely in the enlarged portion. An insert according to any one of claims 1 to 3;
A pusher positioned at an upper portion of the insert and pressing the semiconductor package to prevent the semiconductor package from vertically separating from the insert;
A socket guide disposed at a lower portion of the insert and capable of being separated from and coupled to the insert; And
At least one pogo pin capable of electrical signal transmission and capable of increasing and decreasing its length by elastic means and capable of contacting each corresponding plunger during testing of a semiconductor package, 2. A semiconductor package test apparatus comprising:
The insert body further includes at least one guide groove formed on an outer side of the receiving part and below the insert body,
Wherein the socket guide includes at least one guide protrusion formed at a position corresponding to the guide groove to prevent lateral separation of the insert when the guide protrusion is coupled to the guide groove. 5. The method of claim 4,
Wherein when the semiconductor package is tested, the solder ball, the plunger, the pogo pin, and the tester are electrically connected to each other in order. 6. The method of claim 5,
Wherein the plunger and the pogo pin are each at least two, and the distance between the center axes of the adjacent plungers is smaller than the diameter of the contact pin.

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