JP2007227002A - Wiring member - Google Patents

Abstract

The present invention provides a wiring structure for a wiring member that stabilizes quality by eliminating variations in processing due to soldering between a ground bar and a grounding pattern of a substrate.
A wiring structure of a wiring member includes a wiring member composed of a plurality of coaxial wires 1, a substrate 3 for connecting the wiring members, and a ground bar 20 (connected to an outer conductor 1c of each coaxial wire 1). 20 '). Protrusions (a grounding part 21a and an extension part 21b) are provided in the vicinity of both ends of the ground bar 20 along the longitudinal direction of the coaxial cable 1, and the grounding part 21a of the projecting part is soldered to the grounding pattern of the substrate 3 with solder S4. Has been.
[Selection] Figure 2

Description

  The present invention relates to a wiring member in which a plurality of coaxial electric wires are connected to a substrate.

  In recent years, with the spread of notebook computers, mobile phones, small video cameras, and the like, in addition to the reduction in size and weight of these information communication devices, high speed and high image quality are required. In order to cope with this, an extremely thin coaxial cable (sometimes called a coaxial cable or a shielded cable) is used for the connection between the device main body and the liquid crystal display unit or the wiring in the device. A harness-shaped wiring member in which a plurality of coaxial electric wires are assembled and integrated is used.

  FIG. 4 is a diagram illustrating an example of a coaxial wire used for the wiring member. In the figure, reference numeral 1 denotes a coaxial electric wire, and the coaxial electric wire 1 is formed by sequentially arranging a central conductor 1a, an inner insulator 1b, an outer conductor 1c, and an outer sheath 1d in a coaxial shape from the inside. The central conductor 1a is formed, for example, by twisting seven copper alloy wires having an outer diameter of about 0.025 mm, and the outer surface is covered with an insulating material such as Teflon (registered trademark) resin to a thickness of about 0.06 mm. The internal insulator 1b is used.

  The outer conductor 1c disposed on the outer peripheral surface of the inner insulator 1b is formed, for example, by winding a copper alloy wire having an outer diameter of about 0.03 mm in a horizontal winding, and a polyester tape having a thickness of about 0.004 mm on the outer surface. Are wound together and fused together to form a jacket 1d, and the coaxial cable 1 has an outer diameter of about 0.3 mm. Note that a copper vapor-deposited tape (not shown) may be wound around the outer surface of the outer conductor 1c with the copper vapor-deposited surface inside, and the outer conductor 1c has two layers with the winding direction of the copper alloy wire opposite. It may be a wound structure, or may be a braided structure.

  A plurality of coaxial wires as shown in FIG. 4 are assembled and integrated to form a wiring member. The terminal portion of the wiring member is soldered to a connector terminal or a substrate having a predetermined pitch and connected and fixed. As a wiring member at this time, one shown in FIG. 5 is known (see, for example, Patent Document 1).

  FIG. 5A is a view of a conventional wiring member as viewed from above. FIG. 5B is a partial view of the vicinity of one end of the wiring member shown in FIG. In the figure, 2 and 2 'are ground bars for grounding, and 3 is a board such as a connector terminal or FPC.

  In FIG. 5, ground bars 2 and 2 '(hereinafter referred to as ground bar 2) are integrated with solder S3 on the upper and lower surfaces of the outer conductor 1c by terminal processing.

  Then, as shown in FIG. 5, the terminal processed wiring members (coaxial wire 1 and ground bar 2) are connected and fixed to the substrate 3 by soldering. That is, the center conductor 1a of each coaxial cable 1 is soldered to the substrate 3 with the solder S1, and both ends of the ground bar 2 are soldered to the ground pattern of the substrate 3 with the solder S2.

  Conventionally, soldering of both ends of the ground bar 2 and the ground pattern of the substrate 3 (solder S2 portion) has been performed manually. The reason is that the soldering portion between the ground bar 2 and the grounding pattern has a larger amount of solder than the soldering portion (solder S3 portion) between the external conductor 1c and the ground bar 2, and both ends of the ground bar 2 are grounded. When soldering to the pattern is performed by a pulse heater, heat is transmitted to the ground bar 2 for soldering of the portion, and reaches the solder S3 between the external conductor 1c and the ground bar 2, and the solder S3 is It will heat up. As a result, the solder S3 melted by heating is sucked up from the outer conductor 1c to the coaxial cable 1 and causes a lack of strength at the connection portion.

For the above reasons, the soldering between the ground bar and the ground pattern and the soldering between the external conductor and the ground bar are performed separately.
JP 2005-180922 A

  However, by manually soldering the above wiring member, as shown in FIG. 5 (B), as shown in FIG. There was a problem that became unstable.

  In addition, when such a wiring member is used through a hinge of a mobile phone, the hinge diameter is reduced along with the downsizing of the device, and the wiring member is connected to the hinge portion due to the slight difference in height as described above. The problem of being unable to accommodate without passing through can also occur.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a wiring member for eliminating processing variations due to soldering between a ground bar and a ground pattern of a substrate and stabilizing the quality.

  The wiring member by this invention has the board | substrate for connecting the wiring member which consists of a several coaxial electric wire, and the ground bar connected to the outer conductor of each coaxial electric wire. Protrusions are provided in the vicinity of both ends of the ground bar along the longitudinal direction of the coaxial cable, and the protrusions are soldered to the ground pattern of the substrate. With this structure, the heating location during the soldering process between the ground bar and the ground pattern of the substrate becomes a location (protrusion) away from the soldered portion between the external conductor and the ground bar. Heat can hardly be transmitted to the solder part between the ground bar and the solder can be prevented from sucking up from the external conductor.

  ADVANTAGE OF THE INVENTION According to this invention, the wiring member for eliminating the process variation by soldering with a ground bar and the grounding pattern of a board | substrate, and stabilizing quality can be provided.

  Hereinafter, a wiring member according to the present invention will be described with reference to the accompanying drawings. Note that portions having the same function are denoted by the same reference numerals, and repeated description is omitted.

  FIG. 1 is a diagram showing a configuration example of a ground bar according to the present invention. In the figure, the grounding ground bar 20 includes a main body 22 connected to the outer conductor 1 c of the plurality of coaxial cables 1, and protrusions 21 provided near both ends of the main body 22. The projecting portion 21 includes a ground portion 21 a for grounding to the ground pattern of the substrate 3 and an extension portion 21 b extending from the ground portion 21 a to the main body portion 22. Note that the position where the protrusion 21 is provided may be in the vicinity of both ends of the main body 22 and may be a position slightly inward from both ends or both ends.

  FIG. 2 is a view showing a wiring member according to an embodiment of the present invention. FIG. 2A is a view of the wiring member as viewed from above. FIG. 2B is a partial view of the vicinity of one end of the wiring member shown in FIG. FIG. 2C is a view of the vicinity of one end of the wiring member shown in FIG.

  The wiring member shown in FIG. 2 includes the ground bar 20 shown in FIG. In addition, the shape of the projection part 21 which consists of the grounding part 21a and the extension part 21b is not specifically limited.

  As shown in FIG. 2, the wiring member according to the present embodiment includes a substrate 3 for connecting a plurality of coaxial cables 1, ground bars 20 connected to the upper and lower surfaces of the outer conductor 1 c of each coaxial cable 1, and 20 '(hereinafter referred to as ground bar 20). Protrusions 21 are provided in the vicinity of both ends of the main body 22 of the ground bar 20 along the longitudinal direction of the coaxial cable 1.

  The ground bar 20 is soldered to the upper and lower surfaces of the external conductor 1c with solder S3, and the grounding portion 21a is soldered to the ground pattern of the substrate 3 with solder S4. Further, the center conductor 1a of each coaxial cable 1 is soldered to the substrate 3 with solder S1. For example, a pulse heater can be used for these soldering processes.

  By adopting such a structure, the heating location during the soldering process between the ground pattern of the ground bar 20 and the substrate 3 is away from the soldered portion (solder S3) between the outer conductor 1c and the ground bar 20 (grounding). Therefore, it is difficult for heat to be transmitted to the solder portion (solder S3) between the outer conductor 1c and the ground bar 20, and the solder from the outer conductor 1c can be prevented from being sucked up. As a result, it is possible to perform soldering, which has been performed manually until now, using a pulse heater.

  By using the pulse heater described above, soldering can be performed under uniform processing conditions, so that stable soldering processing without processing variations and the like can be performed. For this reason, as shown in FIG. 5B described above, due to manual work, the solder protrudes and rises by a height H from the ground bar, or the quality becomes unstable due to variations in heating time. The problem can be solved.

  For example, when the height of the ground bar including the wiring member is about 0.5 mm, according to the conventional manual work, the solder rises about 0.1 to 0.2 mm with respect to the ground bar. According to the heater, the solder thickness can be made uniform below the height of the ground bar, in this case about 0.5 mm or less.

  In addition, since the solder thickness can be made uniform in this way, the height of the connecting portion can be made below the ground bar. For this reason, it becomes possible to let the wiring member pass through the hinge part of the meniscus in a small device such as a portable terminal, the degree of freedom in product design is improved, and further miniaturization can be achieved.

  In addition, the soldering of the ground bar and the ground pattern of the board, which has been performed manually, can be performed using a pulse heater, leading to a reduction in work time and further reduction in production costs. Is also connected.

  Here, as shown in FIG. 1, the ground bar 20 may be formed such that the width W1 of the extension portion 21b is narrower than the width W2 of the ground portion 21a. This is because by reducing the width of the extension portion 21b, the heat conduction of that portion becomes low, and the heat from the pulse heater to the grounding portion 21a is hardly transmitted to other portions (main body portion 22 to solder S3). Therefore, it becomes difficult for heat to be transmitted to the solder portion (solder S3) between the outer conductor 1c and the main body 22, and it is possible to more effectively prevent the solder from sucking up from the outer conductor 1c.

  Further, as shown in FIG. 2C, the protrusion 21 may be formed stepwise toward the ground pattern of the substrate 3. As a result, the amount of solder S4 applied to the grounding portion 21a can be reduced, so that the heating conditions by the pulse heater for the grounding portion 21a can be relaxed (heating time is shortened, heating temperature is lowered, etc.). Therefore, it becomes difficult for heat to be transmitted to the solder portion (solder S3) between the outer conductor 1c and the main body 22, and it is possible to more effectively prevent the solder from sucking up from the outer conductor 1c.

  Moreover, in FIG. 2, although the width W1 of the extension part 21b was made thin and the shape of the projection part 21 formed in the step shape was shown, you may process into any one shape. That is, the shape of the protruding portion 21 may be either a shape in which the width W1 of the extension portion 21b is narrowed or a shape formed in a staircase shape.

  Further, the soldering (solder S4) between the ground bar 20 and the ground pattern of the substrate 3 and the soldering (solder S3) between the external conductor 1c and the ground bar 20 may be simultaneously performed using a pulse heater. . In this case, after the soldering process, the central conductor 1a of each coaxial cable 1 may be soldered to the substrate 3 with the solder S1 using a pulse heater. Alternatively, the above three soldering processes may be performed simultaneously using a pulse heater. As a result, the number of work steps is reduced, leading to a reduction in work time, and further to a reduction in production cost.

  The ground bar 20 is desirably provided on the upper and lower surfaces of the outer conductor 1c. The ground bar 20 may be provided only on the upper surface or the lower surface of the outer conductor 1c. However, as shown in FIG. 2, the ground bar 20 is provided on the upper and lower surfaces of the outer conductor 1c to sandwich the coaxial cable 1. As a result, the fixing strength of the plurality of coaxial cables 1 can be improved. In this case, the lower ground bar 20 ′ may be soldered to the ground pattern of the substrate 3 as shown in FIG.

  FIG. 3 is a view showing another example of the wiring member according to the present invention. In the figure, 3 is a connector terminal which is an example of a substrate, and 4 is an adhesive tape.

  In this wiring member, a connector terminal as a substrate 3 is connected to a terminal portion of the wiring member (coaxial wire 1 and ground bar 20). A plurality of coaxial electric wires 1 are arranged in a parallel example at a predetermined pitch, and are bonded with adhesive tape 4 from both sides. The adhesive tape 4 may be used as a tape-like wiring member left as needed, but may be used after being peeled off after the connector is connected. In addition, as a board | substrate, not only the said connector terminal but a hard board | substrate and FPC may be sufficient, for example.

  As described above, according to the present invention, the heating location during the soldering process between the ground bar and the ground pattern of the substrate is a location (projection) away from the soldered portion between the external conductor and the ground bar. It becomes difficult for heat to be transmitted to the solder part between the ground bars, and it is possible to prevent the solder from sucking up from the external conductor. Therefore, since the soldering that has been performed manually can be performed using a pulse heater or the like, the soldering can be performed under uniform processing conditions, and variations in processing can be eliminated.

It is a figure which shows the structural example of the ground bar which concerns on this invention. It is a figure which shows the wiring member which concerns on one Embodiment of this invention. It is a figure which shows another example of the wiring member which concerns on this invention. It is a figure which shows an example of the coaxial electric wire used for a wiring member. It is a figure which shows the conventional wiring member.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Coaxial electric wire, 1a ... Center conductor, 1b ... Internal insulator, 1c ... Outer conductor, 1d ... Outer coat, 2, 2 ', 20, 20' ... Ground bar, 3 ... Substrate, 4 ... Adhesive tape, 21 ... Projection part, 21a ... grounding part, 21b ... extension part, 22 ... main body part.

Claims (3)

A wiring member comprising a plurality of coaxial wires,
A substrate for connecting the plurality of coaxial cables, and a ground bar connected to the outer conductor of each of the coaxial cables;
A wiring member, wherein protrusions are provided in the vicinity of both ends of the ground bar along the longitudinal direction of the coaxial cable, and the protrusions are soldered to a ground pattern of the substrate. The protrusion has a grounding portion soldered to the grounding pattern, and an extension extending from the grounding portion to the ground bar.
The wiring member according to claim 1, wherein a width of the extension portion is narrower than a width of the grounding portion.   The wiring member according to claim 1, wherein the protrusion is formed in a stepped shape toward the ground pattern.

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