JP2007114357A - Projection exposure equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a projection exposure apparatus that can form adjoining conductor patterns in an equidistant layout on a film even when an alignment mark formed on the film is displaced from an originally assumed position. <P>SOLUTION: The relative positional relation between the position of a reticle reference mark and the position of a photoreceptor reference mark is kept before and after the photoreceptor is intermittently moved. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a projection exposure apparatus that intermittently forms at least two conductor patterns.

In conventional projection exposure equipment, when a conductor pattern is formed on a long film, the reticle alignment mark projection image is positioned so that it matches the film alignment mark, and the reticle pattern is projected onto the film. (For example, refer to Patent Document 1).
JP-A-6-45406

  As described above, in the conventional projection exposure apparatus, the position of the alignment mark on the reticle is positioned so as to coincide with the position of the alignment mark on the film, and a conductor pattern is formed on the film. In many cases, the alignment mark of the film generally uses a through hole formed by perforating the film as an alignment mark. However, there are cases where the positioning accuracy of a punching device for punching a film is not sufficiently high, and a through-hole that is an alignment mark may be formed at a position different from the originally assumed position.

  In addition, since many films are made of resin or the like as a base material, even if alignment marks can be formed accurately, the film expands and contracts due to heat generated from the light source and external force applied when the film is transported. In some cases, the alignment mark may be displaced.

  Thus, using the film in which the position of the alignment mark is displaced, as in the conventional projection exposure apparatus, the position of the alignment mark of the reticle is positioned so as to match the position of the alignment mark of the film, When the conductor pattern was formed on the film, the conductor pattern was sometimes formed on the film so that the intervals between the adjacent conductor patterns were different.

  On the other hand, when electronic components such as LSIs and transistors are mounted on the film after the conductor pattern is formed on the film, there is an operation of transporting the film at regular intervals and placing these electronic components on the film. Done. When this operation is performed, the position of the electronic component must be adapted to a predetermined position of the conductor pattern formed on the film. However, when conductor patterns are formed with different intervals between adjacent conductor patterns, the conductor pattern may be positioned at a position where electronic components can be accurately mounted even if the film is conveyed at regular intervals. However, the film has to be positioned according to the position of the formed conductor pattern, and the mounting work of the electronic components has to be complicated.

  From the viewpoint of such an electronic component mounting operation, there has been a demand for a projection exposure apparatus that can form a plurality of conductor patterns on a film so that the intervals between adjacent conductor patterns are equal.

  The present invention has been made in view of the above-mentioned points, and the object of the present invention is when the alignment mark formed on the film is displaced to a position different from the originally assumed position. Even so, an object of the present invention is to provide a projection exposure apparatus that can form adjacent conductor patterns on a film at equal intervals.

  In order to achieve the above object, in the present invention, the relative positional relationship between the position of the reticle reference mark and the position of the photoconductor reference mark is maintained before and after the photoconductor is moved intermittently. To.

Specifically, the projection exposure apparatus according to the present invention includes:
A projection exposure apparatus that moves a photosensitive member by a predetermined distance and forms at least two pattern images on the photosensitive member by exposure light,
A pattern for projecting the pattern image on the photoconductor to form the pattern image on the photoconductor, and a reference mark indicating a reference position of the pattern, and a first reticle reference having an interval corresponding to the predetermined distance A reticle formed with a mark and a second reticle reference mark, and
At least two first photoconductor reference marks and a second photoconductor reference mark having an interval based on the predetermined distance are formed on the photoconductor along the moving direction of the photoconductor, and
Transport means for moving the photosensitive member by the predetermined distance and positioning the photosensitive member at a desired position;
Position for detecting the position of the first reticle reference mark, the position of the first photoconductor reference mark, the position of the second reticle reference mark, and the position of the second photoconductor reference mark. Detection means;
When the position of the first reticle reference mark detected by the position detection means and the position of the first photoconductor reference mark satisfy a predetermined positional relationship, the first detection detected by the position detection means. Position storage means for storing a first relative positional relationship between the position of the second reticle reference mark and the position of the second photoconductor reference mark;
A second relative positional relationship between the position of the first reticle reference mark and the position of the second photoconductor reference mark when the transport means moves the photoconductor by the predetermined distance. Collating means for collating with the first relative positional relationship.

  The projection exposure apparatus according to the present invention forms at least two pattern images on the photosensitive member by exposure light by moving the photosensitive member by a predetermined distance. The photosensitive member is preferably moved intermittently by a certain distance. At least two pattern images are formed along the moving direction of the photoreceptor. Here, the pattern image formed on the photoconductor is not only a conductor pattern but also a cured portion (on the conductor pattern) formed by curing the photosensitive substance of the photoconductor by exposure to exposure light. (Resist to be formed) is also included in the pattern image, and includes an intermediate one formed to form a final conductor pattern by irradiating exposure light. A conductor pattern means the figure formed with a conductive material with a printed wiring body.

  The projection exposure apparatus according to the present invention includes a reticle. The reticle refers to a photomask used for forming a conductor pattern on a photoconductor when a printed wiring body or a semiconductor device wafer is manufactured. The photoreceptor is a sheet or film made of a sheet or film such as a copper clad laminate, and before the conductor pattern is formed, and its surface is covered with a photosensitive substance such as a resist. .

  In the above-described reticle, a pattern, a first reticle reference mark, and a second reticle reference mark are formed. The pattern is for forming a pattern image on the photosensitive member by being projected onto the photosensitive member by exposure light emitted from a light source. Both the first reticle reference mark and the second reticle reference mark are reference marks for indicating the reference position of the pattern. The first reticle reference mark and the second reticle reference mark are formed on the reticle so as to have an interval corresponding to the aforementioned “predetermined distance”.

  On the above-described photoconductor, at least two first photoconductor reference marks and a second photoconductor reference mark are formed. These at least two first photoconductor reference marks and second photoconductor reference marks are both formed along the moving direction of the photoconductor. Further, the at least two first photoconductor reference marks and the second photoconductor reference marks are formed on the photoconductor so as to have an interval based on the above-described predetermined distance. The “interval based on the predetermined distance” is ideally an interval that is equal to the “predetermined distance”, but may actually be an interval different from the “predetermined distance”. Means that. Accordingly, the “interval based on the predetermined distance” includes an interval approximate to the “predetermined distance” in addition to an interval equal to the “predetermined distance”. This approximate interval is, for example, an error caused when the positioning accuracy of the apparatus for forming the photoconductor reference mark such as the first photoconductor reference mark or the second photoconductor reference mark on the photoconductor is not sufficiently high. In addition, the amount is determined by the degree of deformation when the photosensitive member is deformed by heat or external force, and is determined by the formation process of the photosensitive member reference mark and the handling environment of the photosensitive member.

  The projection exposure apparatus according to the present invention further includes a transport unit, a position detection unit, a position storage unit, and a collation unit.

  The conveying means intermittently moves the photoconductor for each “predetermined distance” described above, and positions the photoconductor at a desired position.

  The position detection means detects the position of the first reticle reference mark, the position of the first photoconductor reference mark, the position of the second reticle reference mark, and the position of the second photoconductor reference mark. . These positions need not be detected all at the same time, and may be detected at different times. This position detection means preferably includes a plurality of detection units. For example, when the position detecting means is a microscope, it has a plurality of reticle reference marks, a plurality of photoconductor reference marks, a plurality of lenses for detecting, and a plurality of CCD cameras.

  The position storage means stores a first relative positional relationship between the position of the second reticle reference mark and the position of the second photoconductor reference mark detected by the position detection means. This “first relative positional relationship” can specify the position of the second photoconductor reference mark when the position of the second reticle reference mark is used as a reference, and the position of the second photoconductor reference mark. Is used as a reference, it only has to include information that can specify the position of the second reticle reference mark. The coordinate system to be used may be any system that can identify the positions of these reference marks. For example, it may be specified by coordinates based on an XY coordinate system or by coordinates based on a music coordinate system (r-θ).

  The position storage means stores the first relative positional relationship described above when the position of the first reticle reference mark and the position of the first photoconductor reference mark satisfy a predetermined positional relationship. This “predetermined positional relationship” is preferably based on the relative positional relationship between the position of the first reticle reference mark and the position of the first photoconductor reference mark. For example, the case where the position of the first reticle reference mark and the position of the first photoconductor reference mark coincide with each other is included, but the position of the first reticle reference mark and the position of the first photoconductor reference mark are included. As long as the positions of the first reticle reference mark and the position of the first photoconductor reference mark are not limited to each other, the relative position relation may be uniquely specified.

  The collating unit collates the first relative positional relationship and the second relative positional relationship described above when the photosensitive member is moved by a predetermined distance. This second relative positional relationship is a relative positional relationship between the position of the first reticle reference mark and the position of the second photoconductor reference mark.

  In other words, the first relative positional relationship described above indicates the relative positional relationship between the position of the second reticle reference mark and the position of the second photosensitive member reference mark before the movement of the photosensitive member. The second relative positional relationship is a relative positional relationship between the position of the first reticle reference mark and the position of the second photosensitive member reference mark after the movement of the photosensitive member. The collating unit collates the second relative positional relationship with the first relative positional relationship before moving the photosensitive member when the photosensitive member is moved by a predetermined distance.

  That is, attention is paid to the position of the second photoconductor reference mark before and after the movement of the photoconductor. Before the movement of the photosensitive member, the relative positional relationship of the second photosensitive member reference mark is defined as the first relative positional relationship with reference to the position of the second reticle reference mark. On the other hand, after the movement of the photosensitive member, the relative positional relationship of the second photosensitive member reference mark is set as the second relative positional relationship with reference to the position of the first reticle reference mark.

  Therefore, the collating means moves the photosensitive member by a predetermined distance before and after the movement of the photosensitive member to determine whether or not the relative positional relationship is maintained with respect to the position of the second photosensitive member reference mark. When moved, the first relative positional relationship and the second relative positional relationship described above are collated.

  If the relative positional relationship is maintained with respect to the position of the second photoconductor reference mark before and after the movement of the photoconductor by the collating means, the photoconductor is moved when the photoconductor is moved. It can be assured that it has actually moved by a predetermined distance along the moving direction, and the photoconductor reference mark formed on the photoconductor is displaced to a position different from the originally assumed position. Even in this case, adjacent conductor patterns can be formed on the photosensitive member at equal intervals.

The projection exposure apparatus according to the present invention includes:
When it is determined by the collation by the collating means that the second relative positional relationship does not satisfy the first relative positional relationship, the second relative positional relationship satisfies the first relative positional relationship. Those that adjust the position of the photoreceptor are preferred.

  There is a case where it is determined that the second relative positional relationship does not satisfy the first relative positional relationship by the verification of the verification unit described above. In such a case, the position of the photoconductor is adjusted by the transport unit so that the second relative positional relationship satisfies the first relative positional relationship. By doing so, the second relative positional relationship can always satisfy the first relative positional relationship, and the photoconductor reference mark formed on the photoconductor is the position assumed originally. Even in the case where they are displaced to different positions, adjacent conductor patterns can be formed on the photosensitive member at equal intervals.

Furthermore, the projection exposure apparatus according to the present invention provides:
When the position of the first reticle reference mark detected by the position detection means and the position of the first photoconductor reference mark satisfy a predetermined positional relationship, the pattern is projected onto the photoconductor to project the pattern. What forms a pattern image on the said photoreceptor is preferable.

  Before the photosensitive member is conveyed by the conveying means, it is necessary to position the photosensitive member at some reference position. For example, when a new photoconductor is mounted on the projection exposure apparatus, or when another photoconductor is mounted on the projection exposure apparatus after replacing the photoconductor, the first relative positional relationship is not stored. . In such a case, the position of the first reticle reference mark and the position of the first photosensitive member reference mark satisfy a predetermined positional relationship, and the pattern is transferred to the photosensitive member only when such a condition is satisfied. A pattern image is formed on the photoreceptor by projection. In this way, the first pattern image can be accurately formed on the photoconductor.

Furthermore, the projection exposure apparatus according to the present invention includes:
When the photosensitive member is moved by the predetermined distance, the second relative positional relationship between the position of the first reticle reference mark and the second photosensitive member reference mark satisfies the first relative positional relationship. It is preferable that the pattern is projected onto the photoconductor to form the pattern image on the photoconductor.

  After the photosensitive member is conveyed at least once by the conveying means, the first relative positional relationship is already stored. For this reason, the second relative positional relationship and the first relative positional relationship can be collated, and when the second relative positional relationship satisfies the first relative positional relationship, the pattern is projected onto the photoconductor. For example, even when the photoconductor reference mark formed on the photoconductor is displaced to a position different from the originally assumed position, adjacent conductor patterns are formed on the photoconductor at equal intervals. Can do.

The projection exposure apparatus according to the present invention includes:
The position detection means includes a first detection means and a second detection means, and
The position of the first reticle reference mark and the position of the first photoconductor reference mark are detected by the first detection means, and the position of the first reticle reference mark and the first photosensitive reference mark are detected. When the position of the body reference mark satisfies a predetermined positional relationship, the position of the second reticle reference mark and the position of the second photoconductor reference mark are detected by the second detection means. It is preferable that the position storage means store the first relative positional relationship between the position of the second reticle reference mark and the position of the second photoconductor reference mark.

  The position detection means includes a first detection means and a second detection means. The first detection means detects the position of the first reticle reference mark and the position of the first photoconductor reference mark. When the position of the first reticle reference mark detected by the first detection means and the position of the first photoconductor reference mark satisfy a predetermined positional relationship, the second reticle is detected by the second detection means. The position of the reference mark and the position of the second photoconductor reference mark are detected. Further, the first relative positional relationship between the position of the second reticle reference mark and the position of the second photoconductor reference mark is stored in the position storage means. Thus, by dividing the position detection means into the first detection means and the second detection means, it is possible to detect only the position of the reference mark required according to the process, and the process is simplified. can do.

Furthermore, the projection exposure apparatus according to the present invention provides:
When the transport unit moves the photoconductor by the predetermined distance, the first detection unit detects the position of the first reticle reference mark and the position of the second photoconductor reference mark by the first detection unit. What is detected is preferred.

  When the photoconductor is moved by a predetermined distance, the second photoconductor reference mark is also moved. At this time, the second photoconductor reference mark is moved to the position of the first photoconductor reference mark before the photoconductor is moved. For this reason, when the photoconductor is moved by a predetermined distance, the second photoconductor reference mark can be detected by the first detection means. By doing in this way, only the position of the reference mark required according to processing can be detected, and processing can be simplified.

Furthermore, the projection exposure apparatus according to the present invention includes:
The photoconductor preferably has a long shape extending along the direction in which the photoconductor moves.

  By making the photoconductor in this way, the photoconductor can be moved intermittently by a predetermined distance, and a pattern image can be formed on the photoconductor for each movement. It can be formed smoothly along the moving direction.

The projection exposure apparatus according to the present invention includes:
Mounting means for projecting the pattern onto the photosensitive member and mounting the photosensitive member at a position where the pattern image is formed on the photosensitive member;
More preferably, the conveying means includes a sending means for sending the photoconductor toward the placing means, and a take-up means for taking the photoconductor from the placing means.

  By doing so, the photoconductor can be accurately moved to position the photoconductor at a position where the pattern image is to be formed, and the pattern image can be accurately formed on the photoconductor.

Furthermore, the projection exposure apparatus according to the present invention provides:
More preferably, each of the at least two first photoconductor reference marks and the second photoconductor reference marks is a through hole or a recess formed in the photoconductor.

  By making each of at least two first photoconductor reference marks and second photoconductor reference marks into through holes or recesses, these reference marks can be easily formed by a punching device or a pressing device. it can. Further, when the position detecting means is optically detected, for example, a microscope or the like, it is preferable that the end of the through hole or the recess can be clearly formed. By forming in this way, a through-hole and a recessed part can be detected accurately, and the position of a through-hole and a recessed part can be specified easily.

  Even when the photoconductor reference mark formed on the photoconductor is displaced to a position different from the originally assumed position, adjacent conductor patterns can be formed on the photoconductor at equal intervals. .

  Embodiments of the present invention will be described below with reference to the drawings.

<<<< first embodiment >>>>
In the first embodiment, the projection exposure apparatus 100 is shown for manufacturing a printed wiring sheet or a printed wiring film. However, a pattern can be formed by exposure light exposure, for example, a semiconductor device wafer or the like is manufactured. It may be a projection exposure apparatus.

<< Configuration >>
<Optical system>
[Light source 110]
On the upper part of the projection exposure apparatus 100, a light source 110 is supported by a support member (not shown). The light source 110 is installed on the support member so as to emit exposure light of a predetermined wavelength, for example, ultraviolet rays in the + Y direction shown in the drawing. The exposure light emitted from the light source 110 only needs to have a wavelength that can sensitize a photosensitive substance constituting a resist layer of the photosensitive film 180 described later.

[Reflection mirror 112]
A reflection mirror 112 is provided in the traveling direction of the exposure light emitted from the light source 110. The reflection mirror 112 is provided to be supported by a support member (not shown) so that the exposure light emitted from the light source 110 travels downward (−Z direction). By doing so, the reflection mirror 112 changes the traveling direction of the exposure light so that the exposure light emitted from the light source 110 and traveling in the + Y direction travels in the −Z direction.

[Projection lens 114]
A projection lens 114 is provided below the reflection mirror 112 described above. The outer shape of the projection lens 114 has a substantially cylindrical shape as shown in FIG. The projection lens 114 has an entrance surface 114a and an exit surface (not shown). The projection lens 114 is attached to a support member (not shown) so that the entrance surface 114a is located on the upper side and the exit surface is located on the lower side. It is supported and provided.

  The exposure light emitted from the light source 110 described above is incident on the incident surface 114 a of the projection lens 114. The projection lens 114 is composed of at least one or more kinds of lenses, and inside the projection lens 114, these lenses convert the size of the cross section of the light beam of the incident exposure light to a desired size. Then, the converted exposure light is emitted from the emission surface. By doing so, the projection lens 114 changes the size of the image of the pattern 166 formed on the reticle 160, which will be described later, and the image of the pattern 166 is projected onto the photosensitive film 180, which will be described later, on the photosensitive film 180. It is possible to form a conductor pattern having a size as large as possible.

<Stage>
[Reticle mounted stage 116]
A reticle mounting stage 116 is provided between the reflection mirror 112 and the projection lens 114 described above. The reticle mounting stage 116 includes a reticle mounting table 118 that can move in the X direction, the Y direction, and the θ direction, and is supported by a support member (not shown). The reticle mounting table 118 has a horizontal plane (XY plane), and a reticle 160 described later is mounted on the horizontal plane. The reticle mounting table 118 has a through hole (not shown) where the reticle 160 is located. The exposure light emitted from the light source 110 described above can be made incident on the incident surface 114a of the projection lens 114 through this through hole.

  The reticle mounting stage 116 is provided with a motor (not shown) for driving in each of the X direction, the Y direction, and the θ direction (rotation direction in the XY plane). These motors are electrically connected to a control device (not shown). The control device issues a drive signal to the motor to move the reticle mounting table 118 to a desired position. By doing in this way, the reticle 160 mounted on the reticle mounting table 118 can be positioned at a desired position in the XY plane.

[Reticle 160]
The reticle 160 is a photomask used for forming a conductor pattern on a photosensitive film 180 described later when a printed wiring film, a printed wiring board, or a semiconductor device wafer is manufactured. The reticle 160 corresponds to a negative for transferring the pattern formed on the reticle 160 to the photosensitive film 180 by the exposure light emitted from the light source 110 and transferring the conductor pattern to the photosensitive film 180.

  As will be described later, the photosensitive film 180 is made of a film such as a copper-clad laminated film, and is a film before a conductor pattern is formed, and the film is covered with a photosensitive substance such as a resist. Say. A conductor pattern means the figure formed with a conductive material with a printed wiring film. In this specification, the printed wiring film refers to a film in which a conductor pattern is formed on a film such as a copper clad laminated film, and corresponds to a normal printed wiring board. The reticle 160 in the present embodiment is for manufacturing a printed wiring film, and is used for forming a conductor pattern on the photosensitive film 180.

  FIG. 2A is a plan view showing one example of the reticle 160. The reticle 160 has a portion where the exposure light emitted from the light source 110 can pass and a portion where the exposure light cannot pass. In FIG. 2 (a), in order to clearly show the portion through which the exposure light can be transmitted and the portion through which the exposure light cannot be transmitted, the portions through which the exposure light cannot be transmitted are indicated by hatching.

  The reticle 160 includes a flat glass substrate 162. The glass substrate 162 is made of a transparent material that can transmit the exposure light emitted from the light source 110.

  As shown in FIG. 2, a pattern forming portion 164 is formed at a substantially central portion of the glass substrate 162. In FIG. 2, the outer periphery of the pattern forming unit 164 is indicated by a rectangular broken line. A pattern 166 corresponding to a conductor pattern formed on the photosensitive film 180 described later is formed on the glass substrate 162 in the pattern forming portion 164. In the pattern 166, the transparent state of the glass substrate 162 is maintained so that the exposure light emitted from the light source 110 can pass through. An area where the pattern 166 is not formed by the pattern forming unit 164 is covered with a material that blocks exposure light emitted from the light source 110. The material that blocks the exposure light is preferably made of a metal such as chromium.

  Four reticle reference marks 168 a, 168 b, 168 c, and 168 d for indicating the reference position of the pattern 166 are formed at four locations in the peripheral area that goes around the pattern forming portion 164. In these four reticle reference marks 168a, 168b, 168c and 168d, the transparent state of the glass substrate 162 is maintained, and the exposure light emitted from the light source 110 can be transmitted. The reticle reference mark 168a corresponds to the “first reticle reference mark”, and the reticle reference mark 168c corresponds to the “second reticle reference mark”. Further, when the reticle reference mark 168b is the “first reticle reference mark”, the reticle reference mark 168d corresponds to the “second reticle reference mark”.

  A peripheral area that circulates around the pattern forming portion 164 and is covered with a material that blocks exposure light, except for the areas where the four reticle reference marks 168a, 168b, 168c, and 168d are formed.

  In the present embodiment, as shown in FIG. 2A, each of these reticle reference marks 168a, 168b, 168c, and 168d has a plus (+) shape. In FIG. 1, FIG. 8, FIG. 10, FIG. 11 and FIG. 13, reticle reference marks 168a, 168b, 168c and 168d are shown in a round shape for simplification. Four reticle reference marks are set such that the interval P between the reticle reference marks 168a and 168c or the interval P between the reticle reference marks 168b and 168d corresponds to a feed pitch P ′ that is a distance for conveying a photosensitive film 180 described later. 168a, 168b, 168c and 168d are formed.

  As described above, in this embodiment, each of reticle reference marks 168a, 168b, 168c, and 168d has a plus (+) shape, and therefore pitch P is a vertical line of reticle reference mark 168a. And the intersection of the vertical line and the horizontal line of the reticle reference mark 168c, or the intersection of the vertical line and the horizontal line of the reticle reference mark 168b and the intersection of the vertical line and the horizontal line of the reticle reference mark 168d. is there.

  Further, the relationship between the interval P and the feed pitch P ′ can be determined according to the magnification of the projection lens 114. For example, when projecting the pattern 166 formed on the reticle 160 onto the photosensitive film 180 at an equal magnification to form a conductor pattern on the photosensitive film 180, P = P ′ may be satisfied. As will be described later, the feed pitch P ′ corresponds to a “predetermined distance”. The interval P between the reticle reference marks 168a and 168c or the interval P between the reticle reference marks 168b and 168d corresponds to “an interval based on a predetermined distance”. “Based on a predetermined distance” means that in the present embodiment, the interval P may be determined based on the feed pitch P ′. For example, the interval P can be determined from the magnification of the projection lens 114 and the feed pitch P ′.

  The reticle 160 is placed on the horizontal plane of the reticle mounting stage 116 described above. The exposure light emitted from the light source 110 is applied to the reticle 160 placed on the horizontal surface of the reticle placement table 118. As described above, the transparent state of the glass substrate 162 is maintained in the pattern 166 formed on the reticle 160 and the four reticle reference marks 168a, 168b, 168c, and 168d. Therefore, the exposure light applied to the reticle 160 can pass through the place where the pattern 166 is formed and the place where the four reticle reference marks 168a, 168b, 168c and 168d are formed. The transmitted exposure light can enter the incident surface 114 a of the projection lens 114.

[Work placement stage 130]
As shown in FIG. 1, a workpiece placement stage 130 is provided below the projection lens 114. The workpiece placement stage 130 includes an X-direction moving stage (not shown), a Y-direction moving stage (not shown), and a θ-direction moving stage (not shown). Further, a table 138 is provided on the upper part of the θ-direction moving stage. The table 138 has a horizontal plane (XY plane), and a photosensitive film 180 (see FIGS. 8, 10, 11, and 13) is placed on the horizontal plane, as will be described later.

  The above-described X direction moving stage is provided with a driving motor (not shown) for moving in the X direction. The Y direction moving stage is provided with a driving motor (not shown) for moving in the Y direction. The θ-direction moving stage is provided with a driving motor (not shown) for moving in the θ direction. Each of these drive motors is electrically connected to position control means 198 described later. The position control means 198 issues a drive signal for moving the table 138 to a predetermined position to these drive motors. In response to the drive signal, the driving motors in the X direction, the Y direction, and the θ direction move the table 138 on which the photosensitive film 180 is placed to a desired position in the XY plane.

  Around the table 138, four table reference marks (physical marks) 136a, 136b, 136c and 136d are formed. The four table reference marks 136a, 136b, 136c, and 136d are formed of a material different from that of the table 138 so that the image can be clearly captured by a microscope 150 described later. The four table reference marks 136a, 136b, 136c, and 136d are arranged so as to be positioned at the four vertices of the rectangle.

  When the reticle reference mark 168a formed on the reticle 160 is projected onto the table 138, a projected image of the reticle reference mark 168a can be formed on the table 138. The table reference mark 136a is arranged so as to be positioned in the vicinity of the projection image of the reticle reference mark 168a. When the reticle reference mark 168b formed on the reticle 160 is projected onto the table 138, a projected image of the reticle reference mark 168b can be formed on the table 138. The table reference mark 136b is arranged so as to be positioned in the vicinity of the projection image of the reticle reference mark 168b. When the reticle reference mark 168c formed on the reticle 160 is projected onto the table 138, a projected image of the reticle reference mark 168c is formed on the table 138. The table reference mark 136c is arranged so as to be positioned in the vicinity of the projection image of the reticle reference mark 168c. When the reticle reference mark 168d formed on the reticle 160 is projected onto the table 138, a projected image of the reticle reference mark 168d can be formed on the table 138. The table reference mark 136d is arranged so as to be positioned in the vicinity of the projection image of the reticle reference mark 168d.

  In the processing of the first step described later, the position of the projection image of the table reference mark 136a is made to coincide with the position of the reticle reference mark 168a, the position of the projection image of the table reference mark 136b is made to coincide with the position of the reticle reference mark 168b, The position of the projection image of the table reference mark 136c is made to coincide with the position of the reticle reference mark 168c, and the position of the projection image of the table reference mark 136d is made to coincide with the position of the reticle reference mark 168d. The position can be adjusted.

  The four table reference marks 136a, 136b, 136c, and 136d shown in FIGS. 1, 8, 10, 11, and 13 are simply rounded, but the four reticle reference marks 168a, Like 168b, 168c, and 168d, it has a plus (+) shape (see FIG. 4).

[Microscope stage 140]
A microscope stage 140 (not shown) is provided on the side of the workpiece placement stage 130. The microscope stage 140 supports a microscope 150 described later so as to be movable. The microscope stage 140 is provided with a motor (not shown) for moving the microscope 150 in the ± Y direction. This motor is electrically connected to a control device (not shown). The control device issues a drive signal for moving the microscope 150 to a desired position to the motor. Specifically, the motor of the microscope stage 140 is driven so that the microscope 150 is positioned at a retraction position and a measurement position described later.

  The retracted position of the microscope 150 is a position where the microscope 150 is retracted so that the microscope 150 does not become an obstacle to exposure of the photosensitive film 180 and various operations. For example, it is a position where the microscope 150 is positioned when exposure light is emitted from the light source 110 to form a conductor pattern on the photosensitive film 180. The retracted position of the microscope 150 is preferably the home position of the microscope 150.

  The measurement position of the microscope 150 is a position where the microscope 150 is positioned when the reference mark is imaged. For example, it is a position where the microscope 150 is positioned when the projected images of the reticle reference marks 168a, 168b, 168c and 168d of the reticle 160 are captured in the first step described later. In the first step and the third step described later, the photoconductor reference marks 188a (1) and 188b (1) and 188a (2) and 188b (2) formed on the photosensitive film 180 are imaged. It is also a position to position the microscope 150 when

  Note that the microscope 150 does not directly capture the projected images of the four reticle reference marks 168a, 168b, 168c, and 168d projected onto the table 138 of the workpiece placement stage 130. As will be described later, in the present embodiment, the four table reference marks 136a, 136b, 136c, and 136d are handled as projection images of the four reticle reference marks 168a, 168b, 168c, and 168d. Four table reference marks 136a, 136b, 136c, and 136d are imaged as projection images of the reticle reference marks 168a, 168b, 168c, and 168d.

  It is only necessary to ensure that the measurement position of the microscope 150 described above is a fixed position, and it is not necessary to detect the position of the microscope 150 using the position detection device. That is, it is only necessary that the microscope 150 can be always positioned at a certain position when the microscope 150 is positioned from the retracted position to the measurement position.

<Measurement system and control system>
[Microscope 150]
As described above, the microscope stage 140 is provided with the microscope 150. The microscope 150 includes four imaging units 152a, 152b, 152c, and 152d (see FIGS. 1, 8, 10, 11, and 13). These imaging units 152a, 152b, 152c, and 152d are made of an imaging element such as a CCD camera, for example. 1, 8, 10, 11, and 13, only four imaging units 152 a, 152 b, 152 c, and 152 d are shown as the microscope 150.

  In the first embodiment, the first imaging element assembly 154 is configured by the two imaging units 152a and 152c. The first image sensor assembly 154 is supported by a support member (not shown) of the microscope 150 so as to be movable in the ± Y direction. By doing in this way, the two image pick-up parts 152a and 152c of the 1st image pick-up element assembly 154 can move to +/- Y direction integrally. The retracted position of the microscope 150 described above is the retracted position of the first image sensor assembly 154, and is the retracted position of the two imaging units 152a and 152c. In other words, the two imaging units 152a and 152c can move together to the retracted position. The measurement position of the microscope 150 is the measurement position of the first image sensor assembly 154, and is the measurement position of the two imaging units 152a and 152c. That is, the two imaging units 152a and 152c can move to the measurement position as a unit.

  In the first embodiment, the second imaging element assembly 156 is configured by the two imaging units 152b and 152d. The second image sensor assembly 156 is also supported by a support member (not shown) of the microscope 150 so as to be movable in the ± Y direction. By doing in this way, the two image pick-up parts 152b and 152d of the 2nd image pick-up element aggregate | assembly 156 can also move to +/- Y direction integrally. The retracted position of the microscope 150 described above is the retracted position of the second image sensor assembly 156, and is the retracted position of the two imaging units 152b and 152d. In other words, the two imaging units 152b and 152d can move together to the retracted position. The measurement position of the microscope 150 is the measurement position of the second imaging element assembly 156, and is the measurement position of the two imaging units 152b and 152d. That is, the two imaging units 152b and 152d can be moved together to the measurement position.

  These retracted positions and measurement positions will be described below.

  The retracted position of the first imaging element assembly 154 composed of the two imaging units 152a and 152c is such that when the exposure light is emitted from the light source 110 and the conductor pattern is formed on the photosensitive film 180, the two imaging units 152a and 152c. The position is moved in the + Y direction so that 152c does not become an obstacle (see FIGS. 10 and 13). The retreat position of the second image sensor assembly 156 composed of the two image pickup units 152b and 152d also emits exposure light from the light source 110 to form the two image pickup units when the conductor pattern is formed on the photosensitive film 180. The positions are moved in the −Y direction so that 152b and 152d do not become obstacles (see FIGS. 10 and 13).

  The measurement position of the first image sensor assembly 154 is such that the projected images of the reticle reference marks 168a and 168c formed on the table 138 are taken, and the photoconductor reference mark 188a (1) formed on the photosensitive film 180. And 188a (2) and the like so that they can be imaged (see FIGS. 8 and 11). The measurement position of the second image sensor assembly 156 is such that the projected images of the reticle reference marks 168b and 168d formed on the reticle 160 are taken, and the photoconductor reference mark 188b (1) formed on the photosensitive film 180. And 188b (2), etc., are moved in the + Y direction (see FIGS. 8 and 11).

  Note that the imaging unit 152a does not directly capture the projection image of the reticle reference mark 168a projected on the table 138 of the workpiece placement stage 130. As will be described later, in the present embodiment, the table reference mark 136a is handled as a projection image of the reticle reference mark 168a, so the imaging unit 152a images the table reference mark 136a as a projection image of the reticle reference mark 168a. The imaging unit 152b does not directly capture the projection image of the reticle reference mark 168b projected onto the table 138 of the workpiece placement stage 130. In the present embodiment, the table reference mark 136b is handled as a projection image of the reticle reference mark 168b, so the imaging unit 152b images the table reference mark 136b as a projection image of the reticle reference mark 168b. The imaging unit 152c does not directly capture the projection image of the reticle reference mark 168c projected onto the table 138 of the workpiece placement stage 130. In the present embodiment, the table reference mark 136c is handled as a projection image of the reticle reference mark 168c, so the imaging unit 152c images the table reference mark 136c as a projection image of the reticle reference mark 168c. The imaging unit 152d does not directly capture the projection image of the reticle reference mark 168d projected on the table 138 of the workpiece placement stage 130. In the present embodiment, since the table reference mark 136d is handled as a projection image of the reticle reference mark 168d, the imaging unit 152d images the table reference mark 136d as a projection image of the reticle reference mark 168d.

  In addition, the measurement position of the first image sensor assembly 154 described above may be a fixed position, and the positions of the imaging units 152a and 152c need not be detected using the position detection device. It is only necessary that when the first image sensor assembly 154 is moved from the retracted position to the measurement position, the imaging units 152a and 152c constituting the first image sensor assembly 154 can always be positioned at a fixed measurement position. . When these imaging units 152a and 152c are positioned at the measurement position, it is not necessary to obtain specific coordinates of the imaging units 152a and 152c. In other words, when the two imaging units 152a and 152c are positioned at the measurement position, it is only necessary to always capture a certain range of the photosensitive film 180.

  For example, when the motor for moving the first image sensor assembly 154 is a stepping motor, a predetermined pulse signal is supplied to the stepping motor (motor driver (not shown)). By doing so, the first image sensor assembly 154 can be moved. When this stepping motor is used, the moving distance of the first image sensor assembly 154 is determined by the number of pulse signals supplied to the stepping motor. Therefore, the number of pulse signals corresponding to the distance from the home position (retracted position) to the measurement position is stored in advance in the control means for controlling the motor, and is stored when positioning from the home position to the measurement position. By supplying as many pulse signals as the number of pulse signals from the control means to the motor, it is possible to always position from the home position to a fixed measurement position. With this configuration, the imaging units 152a and 152c can be positioned at fixed measurement positions without using a measuring device that measures the positions of the imaging units 152a and 152c, and a certain range of the photosensitive film 180 can be obtained. An image can be taken.

  As will be described later, when the first image sensor assembly 154 is positioned at the measurement position, the image pickup unit 152a projects the projected image of the reticle reference mark 168a of the reticle 160 or the photoconductor reference mark formed on the photosensitive film 180. 188a (1) and the like are imaged. Similarly, when the first image sensor assembly 154 is positioned at the measurement position, the image capturing unit 152c projects the projected image of the reticle reference mark 168c on the reticle 160, or the photoreceptor reference mark 188a (formed on the photosensitive film 180). 2) Take an image. At this time, the imaging regions of the imaging units 152a and 152c are sufficiently large and the resolution is high enough that the positions of the projection bodies imaged by the imaging unit 152a and the imaging unit 152c can be sufficiently specified in the imaging region. As long as the image can be captured.

  By doing so, it is possible to specify the position of the projection of the reticle reference mark and the position of the photoconductor reference mark in the imaging region imaged by the imaging units 152a and 152c. The position of the projection of the reticle reference mark and the position of the photoconductor reference mark in this imaging area may be any coordinate system position in units of pixels (pixels), and may be of a commonly used length such as millimeters. There is no need for position information using units.

  Similarly, when the second image sensor assembly 156 is also moved from the retracted position to the measurement position, the imaging units 152b and 152d that constitute the second image sensor assembly 156 can be positioned at a fixed measurement position. I can do it. The method of positioning at a certain measurement position can be performed in the same manner as the first image sensor assembly 154. The imaging units 152b and 152d of the second imaging element assembly 156 only need to be able to capture an image with a sufficiently large imaging area and high resolution so that the position of the reference mark can be specified sufficiently within the imaging area. .

[Imaging Data Processing Unit 190]
As shown in FIG. 3, each of the four imaging units 152a, 152b, 152c, and 152d is electrically connected to an imaging data processing unit 190 that performs imaging processing and arithmetic processing. The imaging data processing unit 190 includes a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), and the like. The imaging data processing unit 190 includes an imaging processing unit 192 and an arithmetic processing unit 194.

  The four imaging units 152a, 152b, 152c, and 152d convert captured images into electrical signals, and supply the electrical signals to the imaging processing unit 192. The imaging processing unit 192 converts the images captured by the four imaging units 152a, 152b, 152c, and 152d into data based on the supplied electrical signals. The arithmetic processing unit 194 performs image processing using the imaging data converted into data by the imaging processing unit 192, and positions of projection images of the reticle reference marks 168a, 168b, 168c and 168d (table reference) formed on the reticle 160. The positions of the marks 136a, 136b, 136c, and 136d) and the photoreceptor reference marks 188a (1) and 188b (1) formed on the photosensitive film 180, and the values are stored in the position storage unit 196. Let The position obtained by the arithmetic processing unit 194 may be a position in the imaging region captured by each of the four imaging units 152a, 152b, 152c, and 152d. For example, it may be a position using an XY coordinate system in units of pixels (pixels) of image data. As described above, since the measurement positions of the four imaging units 152a, 152b, 152c, and 152d are constant, if the position in the imaging region can be specified, a commonly used unit of length such as millimeters is used. The position of the imaged reference mark can be specified without converting it to the existing position.

  The arithmetic processing unit 194 also includes the 0th relative positional relationship a between the table reference mark 136a and the photoreceptor reference mark 188a (1) and the 0th relative position between the table reference mark 136b and the photoreceptor reference mark 188b (1). The relationship b is calculated (see steps S12 and S13 in FIG. 6 described later). Further, the arithmetic processing unit 194 performs a first relative positional relationship a between the table reference mark 136c and the photosensitive member reference mark 188a (2) and a first relative position between the table reference mark 136d and the photosensitive member reference mark 188b (2). The relationship b is calculated (see steps S14 and S15 in FIG. 6 described later). Furthermore, the arithmetic processing unit 194 transports the photosensitive film 180 by the feed pitch P ′, and then calculates the second relative positional relationship a between the table reference mark 136a and the photosensitive member reference mark 188a (2), the table reference mark 136b, A second relative positional relationship b with the photoconductor reference mark 188b (2) is calculated (see steps S21 and S22 in FIG. 7 described later).

  In addition to the processing of calculating the relative positional relationship, the arithmetic processing unit 194 determines whether or not the above-described 0th relative positional relationship a and 0th relative positional relationship b satisfy a predetermined relationship. When the positional relationship satisfies the predetermined relationship, the first relative positional relationship a and the first relative positional relationship b described above are stored in the position storage unit 196.

  Note that any one of the 0th relative positional relationship a, the 0th relative positional relationship b, the first relative positional relationship a, the first relative positional relationship b, the second relative positional relationship a, and the second relative positional relationship b is X−. Any information that can specify the positional relationship between the table reference mark and the photoreceptor reference mark in the Y plane may be used. Therefore, for example, it may be specified using the X, Y coordinate system or may be specified using the music coordinate system (r, θ). The first relative positional relationship a and the first relative positional relationship b described above correspond to the “first relative positional relationship”, and the second relative positional relationship a and the second relative positional relationship b are “the second relative positional relationship”. This corresponds to “relative positional relationship”. As described above, the position obtained by the arithmetic processing unit 194 may be a position in the imaging region captured by each of the four imaging units 152a, 152b, 152c, and 152d, and a unit of pixel (pixel) of the image data. It is possible to set the position using the XY coordinate system. Therefore, all of the 0th relative positional relationship a, the 0th relative positional relationship b, the first relative positional relationship a, the first relative positional relationship b, the second relative positional relationship a, and the second relative positional relationship b are images. Data pixels (pixels) can be expressed as a unit.

  Further, as described above, the four imaging units 152a, 152b, 152c, and 152d directly capture the projected images of the four reticle reference marks 168a, 168b, 168c, and 168d projected onto the table 138 of the workpiece placement stage 130. The image is taken through the four table reference marks 136a, 136b, 136c, and 136d. Accordingly, the positions of the projected images of the reticle reference marks 168a, 168b, 168c and 168d obtained by performing the image processing are the positions obtained by imaging the table reference marks 136a, 136b, 136c and 136d. This process will be described in detail in the first step described later.

  The arithmetic processing unit 194 also includes a matching unit 197. When the photosensitive film 180 is moved by the feed pitch P ′, the collating means 197 determines the second relative positional relationship a between the table reference mark 136a and the photosensitive member reference mark 188a (2) as described above. and the second relative positional relationship b between the table reference mark 136b and the photoreceptor reference mark 188b (2) is compared with the first relative positional relationship b described above.

  For example, the collating means 197 moves the photosensitive film 180 in the second relative positional relationship a between the table reference mark 136a and the photosensitive member reference mark 188a (2) when the photosensitive film 180 is moved by the feed pitch P ′. The table reference mark 136b and the photosensitive member when the photosensitive film 180 is moved by the feed pitch P ′ while collating with the first relative positional relationship a between the previous table reference mark 136c and the photosensitive member reference mark 188a (2). The second relative positional relationship b with the reference mark 188b (2) is collated with the first relative positional relationship b between the table reference mark 136d and the photosensitive member reference mark 188b (2) before the photosensitive film 180 is moved. As a result of this collation, it is determined whether or not the second relative positional relationship a matches the first relative positional relationship a and the second relative positional relationship b matches the first relative positional relationship b. The processing performed by the collating unit 197 will be described in detail in a fourth step described later.

[Position control means 198]
As shown in FIG. 3, the imaging data processing unit 190 is electrically connected to the position control means 198. In the processing of the second step to be described later, the position control means 198 makes the position of the photoconductor reference mark 188a (1) and the position of the table reference mark 136a coincide with each other and the photoconductor reference mark 188b (1). The X-direction moving stage, the Y-direction moving stage, and the θ-direction moving stage are moved, and the feed roller 172 and the take-up roller 174 are rotated so that the position of the table reference mark 136b coincides with the position of the table reference mark 136b. Then, the position of the photosensitive film 180 is adjusted. Further, in the process of the third step described later, the position control means 198 makes the first relative positional relationship a and the second relative positional relationship a the same, and the first relative positional relationship b and the second relative positional relationship b. The position of the photosensitive film 180 is moved by moving the X-direction moving stage, the Y-direction moving stage, and the θ-direction moving stage, or by rotating the feed roller 172 and the take-up roller 174. Adjust.

[Positioning means 199]
Further, as shown in FIG. 3, the position control means 198 is electrically connected to the positioning means 199. The positioning unit 199 includes the workpiece placement stage 130. As described above, the workpiece placement stage 130 includes the X-direction movement stage, the Y-direction movement stage, and the θ-direction movement stage. Further, the positioning means 199 includes a feed roller 172 and a take-up roller 174.

  Depending on the control signal issued from the position control means 198, the X-direction moving stage, the Y-direction moving stage, and the θ-direction moving stage move, and the feed roller 172 and the take-up roller 174 rotate. Thus, the position of the photosensitive film 180 can be adjusted.

<Photosensitive film 180>
As shown in FIG. 1, the photosensitive film 180 can be placed on a table 138 of the work placement stage 130. In the present embodiment, the photosensitive film 180 has a long shape. The photosensitive film 180 may be any film that can be placed on the table 138 of the work placement stage 130 and irradiated with exposure light. This photosensitive film 180 corresponds to a “photosensitive member”.

  The photosensitive film 180 includes an insulating film, a conductor layer, and a resist layer made of a photosensitive substance. The insulating film is made of an insulating resin film or the like. The conductor layer is a thin sheet-like film of a conductive material for forming a conductor pattern of a printed wiring film, and is made of a conductive material such as copper. When the material of the conductor layer is copper, the above-described copper-clad laminate film is constituted by the insulating film and the conductor layer. In this specification, it demonstrates as a case where this copper clad laminated film is used as an example.

  The resist layer is for covering a portion of the mask left by the etching process when manufacturing the printed wiring film, an unnecessary portion of solder, and the like, and is made of a photosensitive substance that is cured by exposure light. This photosensitive substance is cured when exposed to exposure light. That is, when the exposure processing is performed by the projection exposure apparatus 100 of the present invention, the photosensitive material in the portion irradiated with the exposure light of the photosensitive film 180 is cured, and the photosensitive material in the portion not irradiated with the exposure light. Does not cure.

  A process of converting the photosensitive film 180 into a printed wiring film after the exposure processing by the projection exposure apparatus 100 will be briefly described.

  First, the photosensitive film 180 that has been exposed by the projection exposure apparatus 100 is developed with an alkaline solution. Since the photosensitive substance in the portion not irradiated with the exposure light is not cured, the resist layer can be removed from the surface of the photosensitive film 180 with an alkaline solution. In the place where the resist layer is removed from the surface of the photosensitive film 180, the copper of the copper-clad laminate film is exposed. On the other hand, since the photosensitive substance in the portion irradiated with the exposure light is cured, the resist layer is not removed and remains on the surface of the photosensitive film 180. Hereinafter, the photosensitive material that remains on the surface of the photosensitive film 180 and is cured is simply referred to as a resist. The portion that remains on the surface of the photosensitive film 180 after the photosensitive substance is cured is also included in the “pattern image”.

  Next, copper of the conductor layer not covered with the resist is dissolved with a solution such as a cupric chloride solution, and the conductor layer is removed from the insulating film. On the other hand, since the resist functions as a protective material in the portion covered with the resist, the conductor layer is not removed from the insulating film with a solution such as a cupric chloride solution.

  Further, the resist covering the conductor layer is removed with a strong alkali solution. By removing the resist, the copper of the conductor layer located under the resist is exposed, and the exposed copper becomes a conductor pattern. As described above, the conductor pattern is a figure formed on the insulating film by a conductive material such as copper. Thus, what formed the conductor pattern in the insulating film is a printed wiring film, and is equivalent to a normal printed wiring board. A printed circuit film is a component in which electronic components such as LSI, IC, and transistors are mounted on a printed wiring film and soldered to form an electrical connection, and is equivalent to a normal printed circuit board. To do.

  FIG. 2B is a plan view showing an example of the photosensitive film 180 used in the present embodiment. Note that the conductor pattern 186 is not yet formed on the photosensitive film 180, and in FIG. 2B, the conductor pattern and the region where the conductor pattern is formed are indicated by broken lines as virtual ones. This photosensitive film 180 has a long shape capable of forming at least two conductor patterns, and FIG. 2B shows a part thereof.

  As shown in FIG. 2B, the photosensitive film 180 includes photosensitive member reference marks 188a (1) and 188b (1), and 188a (2) and 188b (2) for indicating the reference position of the photosensitive film 180. Is formed. In the present embodiment, these photoreceptor reference marks 188a (1) and 188b (1), and 188a (2) and 188b (2) are formed as circular through holes in the photosensitive film 180. In FIG. 2B, four typical photoreceptor reference marks are shown. However, the photoreceptor reference marks are sent to the vicinity of the edge of the photosensitive film 180 along the longitudinal direction of the photosensitive film 180. A plurality of layers are formed based on the pitch P ′ (see FIGS. 8, 10, 11 and 13). As will be described later, it is ideal that a plurality of photoreceptor reference marks are formed in the photosensitive film 180 for each feed pitch P ′, but through holes are formed in the photosensitive film 180 as the photoreceptor reference marks. In some cases, the positioning accuracy of the apparatus for doing so is low, or the photosensitive film 180 expands and contracts. Therefore, a plurality of photoreceptor reference marks are not necessarily formed on the photosensitive film 180 at every feed pitch P ′, that is, at regular intervals. The photoconductor reference mark is formed in the vicinity of a position based on the feed pitch P ′. The vicinity means an area determined by an error in positioning accuracy of the apparatus for forming the photoreceptor reference mark, the degree of expansion / contraction of the photosensitive film 180, and the like.

  As will be described later, the photoreceptor reference mark 188a (1) corresponds to the reticle reference mark 168a, the photoreceptor reference mark 188b (1) corresponds to the reticle reference mark 168b, and the photoreceptor reference mark 188a (2) corresponds to the reticle reference. The photoconductor reference mark 188b (2) corresponds to the mark 168c, and the reticle reference mark 168d.

  The size of the conductor pattern 186 formed on the photosensitive film 180 may be different from the size of the pattern 166 formed on the reticle 160. For this reason, the interval P ′ between the photoconductor reference marks 188 a and 188 b may be different from the interval P between the reticle reference marks 168 a and 168 b of the reticle 160. As described above, the size of the conductor pattern 186 can be determined by the magnification of the projection lens 114 described above. For example, when projecting the pattern 166 formed on the reticle 160 onto the photosensitive film 180 at an equal magnification to form a conductor pattern on the photosensitive film 180, P = P ′ may be satisfied.

  In the present embodiment, it is preferable that the photosensitive film 180 can form at least two conductor patterns along the longitudinal direction. By forming the photosensitive film 180 in this way and transporting the photosensitive film 180 at every feed pitch P ′, two or more conductor patterns are formed smoothly and sequentially along the longitudinal direction of the photosensitive film 180. can do. The photosensitive film 180 is preferably flexible. As described above, the photosensitive film 180 can be fed out and wound up, and the photosensitive film 180 can be easily transported and the handling of the photosensitive film 180 can be simplified.

  In the example described above, the case where the photosensitive film 180 is used as the “photosensitive member” has been described. However, a copper-clad laminated substrate having normal rigidity may be used. Even in such a case, the copper-clad multilayer substrate can be moved on the table 138 of the workpiece mounting stage 130, and two or more conductor patterns can be formed on the copper-clad multilayer substrate along the moving direction.

<Photosensitive film conveyance system 170>
The photosensitive film transport system 170 includes a feed roller 172 and a take-up roller 174. The feed roller 172 is disposed at a position separated in the + X direction from the workpiece placement stage 130, and the take-up roller 174 is disposed at a position separated from the workpiece placement stage 130 in the −X direction.

  The feed roller 172 includes two long rollers 172a and 172b. These two rollers 172a and 172b are made of an elastic member and are provided so as to press each other along the longitudinal direction. When one of the two rollers 172a and 172b rotates, the other can rotate accordingly. The photosensitive film 180 can be sandwiched between the two rollers 172a and 172b (see FIGS. 8, 10, 11 and 13), and the photosensitive film 180 is placed on the workpiece by rotating the two rollers 172a and 172b. It can be sent out toward the stage 130.

  The take-up roller 174 includes two long rollers 174a and 174b. These two rollers 174a and 174b are provided so as to press each other. When one of the two rollers 174a and 174b rotates, the other can rotate accordingly. The photosensitive film 180 can be sandwiched between the two rollers 174a and 174b (see FIGS. 8, 10, 11, and 13). By rotating the two rollers 174a and 174b, the photosensitive film 180 is It can be taken out from the workpiece mounting stage 130.

  The surface on which the two rollers 172a and 172b of the feed roller 172 press each other, the surface on which the two rollers 174a and 174b of the take-off roller 174 press each other, and the horizontal surface of the table 138 are substantially the same surface. It is provided and the photosensitive film 180 can be arranged in a planar shape (see FIGS. 8, 10, 11 and 13).

  A motor (not shown) is mechanically connected to the feed roller 172 and the take-up roller 174. Control means (not shown) is electrically connected to the motor. The motor can be rotated in accordance with a control signal issued from the control means, and the two rollers 172a and 172b of the feed roller 172 and the two rollers 174a and 174b of the take-up roller 174 are rotated by a predetermined rotation amount or rotation. By rotating only the angle, the photosensitive film 180 can be conveyed in the −X direction by the feed pitch P ′.

<< Processing procedure >>
As a pre-process for performing the first to fourth steps described below, the reticle 160 is placed at a predetermined position on the reticle placement table 118 of the reticle placement stage 116, and the table of the workpiece placement stage 130 is placed. It is assumed that the photosensitive film 180 is placed at a predetermined position 138.

<First step>
In this first step, the four reticle reference marks 168a, 168b, 168c and 168d formed on the reticle 160 are projected onto the table 138 of the workpiece placement stage 130, and the reference position of the reticle 160 and the workpiece placement are projected. This is a process for storing the positions at which the reticle reference marks 168a, 168b, 168c and 168d of the reticle 160 are projected by matching the reference position of the table 138 of the stage 130. This process is necessary for accurately projecting the pattern 166 formed on the reticle 160 onto the photosensitive film 180 and forming a conductor pattern on the photosensitive film 180 at a desired position on the photosensitive film 180. The process of this first step is the process of step S11 shown in FIG. In the process of the first step, light such as white light that is not sensitized by the photosensitive film 180 using a light source (not shown) other than the light source 110 is applied to the reticle 160 or the table 138 of the workpiece mounting stage 130. Irradiate.

  As described above, when the pattern 166 formed on the reticle 160 is projected onto the photosensitive film 180, the reference position of the reticle and the reference position of the photosensitive film 180 must be matched in advance. However, when the position is measured by using a position detection device such as a laser interferometer and the alignment is performed, the projection exposure apparatus has to be expensive. Further, when an optical element such as a half mirror is interposed in the optical system for detecting the reference position of the reticle and the reference position of the photosensitive film 180, the optical path may change depending on the optical element, and the reference position In some cases, it was not possible to measure accurately.

  For this reason, in the process of the first step, as a pre-process for making the reference position of the reticle and the reference position of the photosensitive film 180 coincide with each other, the reference position of the reticle and the table 138 of the workpiece mounting stage 130 are set. A process of matching the reference position and storing the reference position of the table 138 at that time is performed. As will be described later, once the processing in the first step is performed, it is not necessary to perform processing for matching the reference position of the reticle and the reference position of the photosensitive film 180. That is, only the reference mark of the photosensitive film 180 is detected, and is detected at the position where the reticle reference mark of the reticle 160 stored in the processing of the first step is projected (the position of the reference mark of the table 138). It is sufficient to perform the process of matching the reference marks of the photosensitive film 180, and the above-described problems can be avoided, and the process for forming a conductor pattern on the photosensitive film 180 by exposure can be simplified.

  In the following, a process for storing the positions at which the reticle reference marks 168a, 168b, 168c, and 168d of the reticle 160 are projected by matching the reference position of the reticle 160 with the reference position of the table 138 of the workpiece mounting stage 130. An example of

First, a rough procedure will be described.
(A) The position of the table reference mark 136a is made to coincide with the position of the projected image of the reticle reference mark 168a that is generated when the reticle reference mark 168a of the reticle 160 is projected onto the table 138 of the workpiece mounting stage 130. The table reference mark 136a at this time is imaged by the imaging unit 152a of the microscope 150 and imaged to obtain the position of the table reference mark 136a in the imaging region, and information indicating the position is stored.
(B) Similarly, the position of the table reference mark 136b is made to coincide with the position of the projection image of the reticle reference mark 168b, the table reference mark 136b at this time is imaged by the imaging unit 152b of the microscope 150, and the table reference mark 136b Information indicating the position is stored.
(C) Further, the position of the table reference mark 136c is made to coincide with the position of the projection image of the reticle reference mark 168c, and the table reference mark 136c at this time is imaged by the imaging unit 152c of the microscope 150, and the position of the table reference mark 136c. Is stored.
(D) Further, the position of the table reference mark 136d is made to coincide with the position of the projected image of the reticle reference mark 168d, and the table reference mark 136d at this time is imaged by the imaging unit 152d of the microscope 150, and the position of the table reference mark 136d Is stored.

  In the first embodiment, the steps (a) to (d) for aligning the reticle reference mark and the table reference mark described above are performed using a reticle microscope (not shown) disposed above the reticle mounting stage 116. Do by. Hereinafter, the reticle microscope will be briefly described.

  Similar to the microscope 150, the reticle microscope includes four imaging elements (not shown) such as a CCD camera. The first image sensor images the table reference mark 136a and the reticle reference mark 168a. The second image sensor images the table reference mark 136b and the reticle reference mark 168b. The third image sensor images the table reference mark 136c and the reticle reference mark 168c. The fourth image sensor images the table reference mark 136d and the reticle reference mark 168d. As described above, the reticle microscope is disposed above the reticle mounting stage 116, and the table reference marks 136a, 136b, 136c, and 136d are imaged by the reticle microscope via the projection lens 114 and the reticle 160. . In contrast, reticle reference marks 168a, 168b, 168c and 168d are directly imaged by a reticle microscope.

  Thus, in the first embodiment, the reticle reference mark 168a and the table reference mark 136a are imaged by the reticle microscope, and the table reference mark 136a is positioned at the position of the reticle reference mark 168a formed on the reticle 160. By matching the positions, the same processing as that of matching the position of the table reference mark 136a with the position of the projected image of the reticle reference mark 168a projected on the table 138 is performed. Similarly, by aligning the positions of the reticle reference mark 168b and the table reference mark 136b imaged with the reticle microscope, the position of the table reference mark 136b is made to coincide with the position of the projected image of the reticle reference mark 168b. Further, by aligning the positions of the reticle reference mark 168c and the table reference mark 136c captured by the reticle microscope, the position of the table reference mark 136c is made to coincide with the position of the projected image of the reticle reference mark 168c. Further, by aligning the positions of the reticle reference mark 168d and the table reference mark 136d imaged by the reticle microscope, the position of the table reference mark 136d is made to coincide with the position of the projected image of the reticle reference mark 168d.

  Like the microscope 150, the reticle microscope is provided on a microscope stage (not shown), and this microscope stage is provided with a motor (not shown) for moving in the ± Y direction. By driving this motor by a control device (not shown), the reticle microscope can be positioned at the retracted position and the measurement position. Here, the retracted position is a position where the reticle microscope is retracted so that the reticle microscope does not become an obstacle to various operations such as reticle replacement operation and various operations such as exposure to the photosensitive film 180. is there. Further, the measurement position is for imaging four reticle reference marks 168a, 168b, 168c and 168d formed on the reticle 160 and four table reference marks 136a, 136b, 136c and 136d formed on the table 138. The position where the reticle microscope is positioned. Similar to the measurement position of the microscope 150, the measurement position may be a fixed position. That is, it is only necessary that each of the first to fourth imaging elements of the reticle microscope can be positioned at a fixed measurement position. For this reason, when each of the first to fourth image sensors of the reticle microscope is positioned at the measurement position, it is not necessary to obtain specific coordinates of each of the four image sensors.

  The first imaging device has a sufficiently large imaging area so that the reticle reference mark 168a and the table reference mark 136a can be clearly imaged when the first imaging device is positioned at the measurement position. It suffices if the image is picked up with a resolution high enough to sufficiently identify the position of the mark within the image pickup region. The second image sensor is for reticle reference mark 168b and table reference mark 136b, the third image sensor is for reticle reference mark 168c and table reference mark 136c, and the fourth image sensor is for reticle reference mark 168d. The table reference mark 136d only needs to be able to capture an image equivalent to the first image sensor.

  Specific processing will be described below. Note that the squares shown in FIGS. 4A-1 to 4A-4 described below indicate areas imaged by four imaging elements. Further, black plus-shaped images indicate reticle reference marks 168a, 168b, 168c and 168d, and white plus-shaped images indicate table reference marks 136a, 136b, 136c and 136d.

  (A) First, the reticle microscope is positioned from the retracted position to the measurement position, and the reticle reference mark 168a and the table reference mark 136a are imaged by the first image sensor. One example at this time is shown in FIG. When an image is captured by the first image sensor, the position of the reticle reference mark 168a and the position of the table reference mark 136a often do not coincide as shown in FIG. 4 (a-1). For this reason, the driving motor for the workpiece placement stage 130 described above is driven to move the table 138 so that the position of the reticle reference mark 168a matches the position of the table reference mark 136a.

  The position of the reticle reference mark 168a and the position of the table reference mark 136a can be calculated by the processing of the imaging processing unit 192 and the arithmetic processing unit 194 of the imaging data processing unit 190 described above. Based on the calculated position, the table 138 can be moved by issuing a control signal to the drive motor of the workpiece placement stage 130. In addition, the images of the reticle reference mark 168a and the table reference mark 136a imaged by the first image sensor are displayed on a display device such as a display device, and the alignment of the table 138 is performed while viewing the displayed image. You may do. In any case, it is sufficient that the position of the reticle reference mark 168a and the position of the table reference mark 136a can be matched.

  One example at this time is shown in FIG. This state corresponds to a state in which the position of the projection image of the reticle reference mark 168a generated by the projection of the reticle reference mark 168a of the reticle 160 onto the table 138 of the workpiece placement stage 130 coincides with the position of the table reference mark 136a.

  Next, in this state, the table reference mark 136a is imaged by the imaging unit 152a of the microscope 150. One example at this time is shown in FIG. After imaging the table reference mark 136a, the processing of the imaging processing unit 192 and the arithmetic processing unit 194 of the imaging data processing unit 190 obtains the position of the table reference mark 136a in the imaging region imaged by the imaging unit 152a. be able to. Thereafter, information indicating the position of the obtained table reference mark 136a is stored in the position storage unit 196.

  By performing the above-described processing, the position of the obtained table reference mark 136a can be set as the position of the projected image of the reticle reference mark 168a generated by being projected on the table 138. As described above, since the measurement position of the imaging unit 152a is always a constant position, the imaging region imaged by the imaging unit 152a is always constant. Therefore, the position of the projected image of the reticle reference mark 168a can be specified as long as the position of the table reference mark 136a in the imaging region imaged by the imaging unit 152a can be specified. For example, the position of the table reference mark 136a in this imaging region can be indicated by coordinates in units of pixels (pixels).

  (B) Similarly, the reticle reference mark 168b and the table reference mark 136b are imaged by the second image sensor (FIG. 4A-2), and the position of the reticle reference mark 168b and the position of the table reference mark 136b are determined. (FIG. 4B-2), and information indicating the position of the table reference mark 136b at this time is stored in the position storage unit 196. The position of the table reference mark 136b obtained in this way can be the position of the projected image of the reticle reference mark 168b that is generated by being projected on the table 138.

  (C) Further, the reticle reference mark 168c and the table reference mark 136c are imaged by the third image sensor (FIG. 4 (a-3)), and the position of the reticle reference mark 168c and the position of the table reference mark 136c are determined. The position storage means 196 stores information indicating the position of the table reference mark 136c at this time (FIG. 4B-3). The position of the table reference mark 136c thus obtained can be set as the position of the projection image of the reticle reference mark 168c generated by being projected on the table 138.

  (D) Finally, the reticle reference mark 168d and the table reference mark 136d are imaged by the fourth image sensor (FIG. 4A-4), and the position of the reticle reference mark 168d and the position of the table reference mark 136d are determined. (FIG. 4B-4), and information indicating the position of the table reference mark 136d at this time is stored in the position storage means 196. The position of the table reference mark 136d thus obtained can be set as the position of the projected image of the reticle reference mark 168d generated by being projected on the table 138.

  Note that the positions of the table reference marks 136b, 136c, and 136d obtained by calculation can be indicated by coordinates in units of pixels (pixels), similarly to the table reference mark 136a.

  In FIGS. 4A-1 to 4A-4 and FIGS. 4B-1 to 4B-4, the reticle reference marks 168a, 168b, 168c, and 168d are positioned at the center of the imaging region. It is located away from the center. As described above, when each of the first to fourth image sensors of the reticle microscope is positioned at the measurement position, it is not necessary to obtain specific coordinates of each of these four image sensors. It is sufficient that each of the first to fourth imaging elements can be positioned at a fixed measurement position. With this configuration, it is sufficient that the four reticle reference marks 168a, 168b, 168c, and 168d can be matched with the four table reference marks 136a, 136b, 136c, and 136d. 168a, 168b, 168c and 168d are not necessarily located at the center of the imaging region.

  In the first step, the reticle reference position and the reference position of the table 138 of the workpiece mounting stage 130 are matched as pre-processing for matching the reticle reference position and the photosensitive film 180 reference position. It is only necessary to be able to do this, and it is not limited to the procedure and method of the processing described above.

  As described above, this first step process is performed as a pre-process for matching the reticle reference position and the photosensitive film 180 reference position, and the reticle 160 reference position and the table 138 of the workpiece placement stage 130. In this process, the positions where the reticle reference marks 168a, 168b, 168c, and 168d of the reticle 160 are projected are stored by matching with the reference position. Once the processing of the first step is performed, as will be described later, when the pattern formed on the reticle 160 is projected onto the photosensitive film 180, only the reference position of the photosensitive film 180 is detected, and A process of matching the reference position of the detected photosensitive film 180 with the position where the reticle reference marks 168a, 168b, 168c and 168d are projected may be performed. Thereby, the pattern formed on the reticle 160 can be projected as a pattern image on a desired position of the photosensitive film 180. Below, these processes are demonstrated in detail along the flowchart shown in FIG.6 and FIG.7.

<Second step>
In this second step, the position of the photoreceptor reference mark 188a (1) formed on the photosensitive film 180 is made to coincide with the position of the table reference mark 136a stored in the first step, and the photosensitive film 180 is formed on the photosensitive film 180. Processing is performed to match the position of the photoconductor reference mark 188b (1) thus made with the position of the table reference mark 136b stored in the first step. By performing this process, the reference position of the reticle and the reference position of the photosensitive film 180 can be matched. Even in the processing of the second step, the reticle 160 and the photosensitive film 180 are irradiated with light such as white light that the photosensitive film 180 does not expose using a light source (not shown) other than the light source 110.

  First, the photosensitive film 180 is placed on the table 138 of the work placement stage 130. As shown in FIG. 8, the photosensitive film 180 is sandwiched between the rollers 172a and 172b of the feed roller 172 toward the table 138, passed through the table 138, and then between the rollers 174a and 174b of the take-up roller 174. Between.

  As described above, a plurality of photoreceptor reference marks are formed on the photosensitive film 180 in the vicinity of each of the two edges along the longitudinal direction based on the feed pitch P ′. In the example shown in FIG. 8, the photoconductor reference marks 188a (1) and 188b (1), the photoconductor reference marks 188a (2) and 188b (2), the photoconductor reference marks 188a (3) and 188b (3), Photoconductor reference marks 188a (4) and 188b (4) are formed. As described above, it is ideal that a plurality of photoreceptor reference marks are formed on the photosensitive film 180 for each feed pitch P ′, but for forming the photoreceptor reference marks on the photosensitive film 180. In some cases, the positioning accuracy of the apparatus is low, or the photosensitive film 180 expands and contracts. Therefore, a plurality of photoreceptor reference marks are not necessarily formed on the photosensitive film 180 at every feed pitch P ′, that is, at regular intervals. For this reason, the photoconductor reference mark is formed in the vicinity of a position based on the feed pitch P ′. The vicinity means an area determined by an error in positioning accuracy of the apparatus for forming the photoreceptor reference mark, the degree of expansion / contraction of the photosensitive film 180, and the like.

  Thereafter, the processes of steps S12 and S13 of FIG. 6 are performed.

  By driving the microscope stage 140, the imaging units 152a and 152b of the first imaging element assembly 154 and the imaging units 152c and 152d of the second imaging element assembly 156 are positioned at the measurement positions, and the imaging unit 152a The photoconductor reference mark 188a (1) is imaged, and the photoconductor reference mark 188b (1) is imaged by the imaging unit 152b. One example of the image of the photoreceptor reference mark 188a (1) imaged by the imaging unit 152a is shown in FIG. 9A-1, and the image of the photoreceptor reference mark 188b (1) imaged by the imaging unit 152b is shown. One example is shown in FIG. FIGS. 9A-1 and 9A-2 show images captured by the two imaging units 152a and 152b displayed on a display device (not shown) such as a display. The photoconductor reference marks 188a (1) and 188b (1) are formed as circular through holes. In FIGS. 9A-1 and 9A-2, photoconductors imaged by the imaging units 152a and 152b. Reference marks 188a (1) and 188b (1) are indicated by white circles. In FIGS. 9A-1 and 9A-2, the images of the two table reference marks 136a and 136b stored in the first step are also displayed in an overlapping manner. As described above, these two table reference marks 136 a and 136 b indicate the positions of the projected images when the reticle reference marks 168 a and 168 b of the reticle 160 are projected onto the table 138 of the workpiece placement stage 130.

  Initially, the photosensitive film 180 is disposed on the table 138 of the workpiece placement stage 130. The photosensitive member reference mark 188a (1) and the table reference mark 136a, and the photosensitive member reference mark 188b (1) and the table reference mark 136b are The positions do not match. For this reason, the position control means 198 moves the table 138 of the workpiece placement stage 130 or rotates the feed roller 172 and the take-up roller 174 to thereby adjust the position and table of the photoconductor reference mark 188a (1). The position of the photosensitive film 180 is adjusted so that the position of the reference mark 136a matches the position of the photoconductor reference mark 188b (1) and the position of the table reference mark 136b. FIGS. 9A-1 and 9A-2 are images taken after this adjustment, and the position of the photoconductor reference mark 188a (1) and the position of the table reference mark 136a coincide with each other. The position of the reference mark 188b (1) matches the position of the table reference mark 136b. In this way, the position of the photoconductor reference mark 188a (1) is made to coincide with the position where the reticle reference mark 168a of the reticle 160 is projected onto the table 138 of the workpiece placement stage 130, and the reticle reference of the reticle 160 is also set. The position of the photoconductor reference mark 188b (1) can be made to coincide with the position where the mark 168b is projected onto the table 138 of the workpiece placement stage 130.

  The adjustment of the position of the photosensitive film 180 is performed by displaying the photoreceptor reference mark 188a (1) and the table reference mark 136a on a display device (not shown) such as a display and visually confirming these displayed reference marks. The position of the photosensitive film 180 is adjusted so as to coincide with each other, and similarly, the photoreceptor reference mark 188b (1) and the table reference mark 136b are displayed on the display device, and the displayed reference marks are visually recognized. The position of the photosensitive film 180 can be adjusted to match.

  Further, the position of the photosensitive film 180 may be adjusted by the arithmetic processing unit 194 described above. For example, each of the position of the photoconductor reference mark 188a (1), the position of the table reference mark 136a, the position of the photoconductor reference mark 188b (1), and the position of the table reference mark 136b is, for example, a pixel (pixel) of image data. ), The amount of deviation between the position of the photoreceptor reference mark 188a (1) and the position of the table reference mark 136a, the position of the photoreceptor reference mark 188b (1), and the position of the table reference mark 136b. The amount of deviation from the position is calculated. Next, the number of pulse signals corresponding to the amount of deviation is calculated, and the number of pulse signals is supplied to the positioning means 199. The pulse signal supplied to the positioning means 199 is used for driving the X-direction moving stage, the Y-direction moving stage and the θ-direction moving stage driving motor of the workpiece mounting stage 130, and the feed roller 172 and take-up roller 174. The photosensitive film is generated by the motor, and the X-direction moving stage, the Y-direction moving stage, and the θ-direction moving stage are moved according to the pulse signal, and the feed roller 172 and the take-up roller 174 are rotated. The position of 180 can be adjusted. By doing so, the photoreceptor reference mark 188a (1) and the table reference mark 136a can be matched, and the photoreceptor reference mark 188b (1) and the table reference mark 136b can be matched.

  By processing the position of the photosensitive film 180, the 0th relative positional relationship a between the table reference mark 136a and the photoreceptor reference mark 188a (1), the table reference mark 136b and the photoreceptor reference mark 188b (1), and The 0th relative positional relationship b can satisfy the “predetermined relationship”. In the present embodiment, the “predetermined relationship” means that the position of the photoconductor reference mark 188a (1) and the position of the table reference mark 136a coincide, and the position of the photoconductor reference mark 188b (1) and the table reference. The relationship between the positions of the marks 136b coincides with the 0th relative positional relationship a between the table reference mark 136a and the photoreceptor reference mark 188a (1), and the table reference mark 136b and the photoreceptor reference mark 188b (1). As long as the zeroth relative positional relationship b can be specified, the positions are not necessarily matched. By this processing, “the position of the first reticle reference mark detected by the position detection unit and the position of the first photoconductor reference mark satisfy a predetermined positional relationship” can be achieved.

  Next, the processes of steps S14 and S15 in FIG. 6 are executed.

  As described above, by driving the microscope stage 140, the imaging units 152a and 152b of the first imaging element assembly 154 and the imaging units 152c and 152d of the second imaging element assembly 156 are placed at the measurement positions. It is positioned. Here, the photoconductor reference mark 188a (2) is imaged by the imaging unit 152c, and the photoconductor reference mark 188b (2) is imaged by the imaging unit 152d. One example of the image of the photoreceptor reference mark 188a (2) imaged by the imaging unit 152c is shown in FIG. 9B-1, and the image of the photoreceptor reference mark 188b (2) imaged by the imaging unit 152d is shown. One example is shown in FIG. 9B-1 and 9B-2 show images displayed by two imaging units 152c and 152d on a display device (not shown) such as a display. Similar to the photoconductor reference marks 188a (1) and 188b (1), the photoconductor reference marks 188a (2) and 188b (2) are formed as circular through holes, and FIG. 9 (b-1) and FIG. In (b-2), the photoreceptor reference marks 188a (2) and 188b (2) imaged by the imaging units 152c and 152d are indicated by white circles. In FIGS. 9B-1 and 9B-2, the images of the two table reference marks 136c and 136d stored in the first step described above are also displayed in an overlapping manner. As described above, these two table reference marks 136c and 136d indicate the positions of the projected images when the reticle reference marks 168c and 168d of the reticle 160 are projected onto the table 138 of the workpiece placement stage 130.

  The position of the photoconductor reference mark 188a (1) and the position of the table reference mark 136a coincide with each other by the processing of steps S12 and S13 in FIG. 6 described above, and the position of the photoconductor reference mark 188b (1) and the table reference mark 136b. The position of the photosensitive film 180 is adjusted so that the positions of the two coincide with each other. However, even if the position is adjusted in this way, the position of the photoconductor reference mark 188a (2) does not match the position of the table reference mark 136c, or the position of the photoconductor reference mark 188b (2) and the table reference mark The position of 136d may not match. As described above, when the positioning accuracy of a device for forming a through hole as a photoreceptor reference mark in the photosensitive film 180 is low, or when the photosensitive film 180 is made of a flexible material, the photosensitive film 180 expands and contracts. There is a case. In such a case, as shown in FIGS. 9B-1 and 9B-2, the position of the photoconductor reference mark 188a (2) does not coincide with the position of the table reference mark 136c, and the photoconductor. The position of the reference mark 188b (2) does not match the position of the table reference mark 136d.

  Thus, the position of the photoconductor reference mark 188a (2) and the position of the table reference mark 136c do not match, and the position of the photoconductor reference mark 188b (2) and the position of the table reference mark 136d do not match. Even in this case, the imaging unit 152c images the photoconductor reference mark 188a (2) and the table reference mark 136c, and the imaging unit 152d images the photoconductor reference mark 188b (2) and the table reference mark 136d. The imaging data obtained by imaging in this manner is processed by the imaging data processing unit 190 described above. Specifically, the arithmetic processing unit 194 calculates the first relative positional relationship a from the position of the photoconductor reference mark 188a (2) and the position of the table reference mark 136c, and sets the photoconductor reference mark 188b (2). The first relative positional relationship b is calculated from the position and the position of the table reference mark 136d, and the first relative positional relationship a and the first relative positional relationship b are stored in the position storage unit 196.

  Even when the above-described processing is performed, the position of the photoconductor reference mark 188a (2), the position of the table reference mark 136c, the position of the photoconductor reference mark 188b (2), and the position of the table reference mark 136d are captured. For example, it is only necessary that the position of these reference marks can be specified by coordinates in units of pixels (pixels). For example, the image data may be stored as image data and the image data stored in a display device such as a display may be displayed.

  The first relative positional relationship a and the first relative positional relationship b described above may be information that can specify the positional relationship between the table reference mark and the photoreceptor reference mark in the XY plane. Therefore, for example, it may be specified using the X and Y coordinates or may be specified using the music coordinates (r, θ).

<Third step>
The process of the third step is the process of step S16 in FIG.

  As shown in FIG. 10, the microscope stage 140 is driven to bring the imaging units 152a and 152b of the first imaging element assembly 154 and the imaging units 152c and 152d of the second imaging element assembly 156 into the retracted position. Position it. In this state, exposure light is emitted from the light source 110 to project the pattern 166 formed on the reticle 160 onto the photosensitive film 180, thereby forming a pattern image on the photosensitive film 180. A conductor pattern 182 (1) is formed on the photosensitive film 180 by this pattern image.

<Fourth Step>
As shown in FIG. 11, the feed roller 172 and the take-up roller 174 are rotated to convey the photosensitive film 180 in the −X direction by the feed pitch P ′ (see step S17 in FIG. 6). As a result, the conductor pattern 182 (1) formed in the third step moves in the −X direction by the feed pitch P ′. Even in the processing of the second step, the reticle 160 and the photosensitive film 180 are irradiated with light such as white light that the photosensitive film 180 does not expose using a light source (not shown) other than the light source 110.

  The microscope stage 140 is driven again, and the imaging units 152a and 152b of the first imaging element assembly 154 and the imaging units 152c and 152d of the second imaging element assembly 156 are positioned at the measurement positions. By doing so, the photosensitive member reference mark 188a (2) is positioned below the imaging unit 152a, the photosensitive member reference mark 188b (2) is positioned below the imaging unit 152b, and below the imaging unit 152c. The photosensitive member reference mark 188a (3) is positioned at the bottom, and the photosensitive member reference mark 188b (3) is positioned below the imaging unit 152d.

  Next, the photoconductor reference mark 188a (2) is imaged by the imaging unit 152a, and the photoconductor reference mark 188b (2) is imaged by the imaging unit 152b. One example of the image of the photoreceptor reference mark 188a (2) imaged by the imaging unit 152a is shown in FIG. 12 (a-1), and the image of the photoreceptor reference mark 188b (2) imaged by the imaging unit 152b is shown. One example is shown in FIG. 12A-1 and 12A-2, like FIGS. 9A-1 and 9A-2, display images captured by the two imaging units 152a and 152b on a display or the like. It shows what is displayed on the device (not shown). The photoconductor reference marks 188a (2) and 188b (2) are formed as circular through holes. In FIGS. 12A-1 and 12A-2, the photoconductors imaged by the imaging units 152a and 152b. The fiducial marks 188a (2) and 188b (2) are indicated by white circles. Further, in FIGS. 12A-1 and 12A-2, the two table reference marks stored in the first step are stored as in FIGS. 9A-1 and 9A-2. The images 136a and 136b are also displayed in an overlapping manner. As described above, these two table reference marks 136 a and 136 b indicate the positions of the projected images when the reticle reference marks 168 a and 168 b of the reticle 160 are projected onto the table 138 of the workpiece placement stage 130.

  As described above, the photoconductor reference mark 188a (2) is imaged by the imaging unit 152a, and the photoconductor reference mark 188b (2) is imaged by the imaging unit 152b. The imaging data obtained by imaging in this manner is processed by the imaging data processing unit 190 described above. Specifically, the arithmetic processing unit 194 calculates the second relative positional relationship a from the position of the photoconductor reference mark 188a (2) and the position of the table reference mark 136a, and sets the photoconductor reference mark 188b (2). The second relative positional relationship b is calculated from the position and the position of the table reference mark 136b, and the second relative positional relationship a and the second relative positional relationship b are stored in the position storage unit 196 (step in FIG. 7). (See S21 and S22).

  Next, the first relative positional relationship a obtained by the process of step S14 of FIG. 7 described above is collated with the second relative positional relationship a obtained by the process of step S21 of FIG. 7, and step S15 of FIG. The first relative positional relationship b obtained by the process is collated with the second relative positional relation b obtained by the process of step S22 of FIG.

  When the photosensitive film 180 is conveyed in the −X direction by the feed pitch P ′, in principle, the first relative positional relationship a and the second relative positional relationship a are the same, and the first relative positional relationship b and the second relative position are the same. The relationship b is the same. That is, as a result of collating the relative positional relationship, the second relative positional relationship a between the table reference mark 136a and the photoreceptor reference mark 188a (2) shown in FIG. 12A-1 is shown in FIG. 9B-1. The same as the first relative positional relationship a between the table reference mark 136c and the photoreceptor reference mark 188a (2) shown, and the table reference mark 136b and the photoreceptor reference mark 188b (2) shown in FIG. Is the same as the first relative positional relationship b between the table reference mark 136d and the photoreceptor reference mark 188b (2) shown in FIG. 9B-2 (step in FIG. 7). (When it is determined “YES” in the determination process of S23).

  However, if a feed error between the feed roller 172 and the take-up roller 174 occurs or the photosensitive film 180 expands or contracts, the relative position may be maintained even if the photosensitive film 180 is transported in the −X direction by the feed pitch P ′. As a result of collating the relationship, the second relative positional relationship a between the table reference mark 136a and the photosensitive member reference mark 188a (2) is the first relative positional relationship a between the table reference mark 136c and the photosensitive member reference mark 188a (2). Or the second relative positional relationship b between the table reference mark 136b and the photoreceptor reference mark 188b (2) is different from the first relative positional relationship b between the table reference mark 136d and the photoreceptor reference mark 188b (2). May occur (in the case where “NO” is determined in the determination process in step S23 of FIG. 7).

  In such a case, the arithmetic processing unit 194 calculates the amount of deviation of the second relative positional relationship a with respect to the first relative positional relationship a and the amount of deviation of the second relative positional relationship b with respect to the first relative positional relationship b. Then, the number of pulse signals corresponding to the amount of deviation is calculated, and the number of pulse signals is supplied to the positioning means 199. The pulse signal supplied to the positioning means 199 is used for driving the X-direction moving stage, the Y-direction moving stage and the θ-direction moving stage driving motor of the workpiece mounting stage 130, and the feed roller 172 and the take-up roller 174. The photosensitive film is generated by the motor, and the X-direction moving stage, the Y-direction moving stage, and the θ-direction moving stage are moved according to the pulse signal, and the feed roller 172 and the take-up roller 174 are rotated. The position of 180 can be adjusted (see step S24 in FIG. 7). By doing so, the first relative positional relationship a and the second relative positional relationship a become the same, and the first relative positional relationship b and the second relative positional relationship b become the same (FIG. 7). ("YES" is determined in the determination process of step S23).

  In the second step, the position of the photoconductor reference mark 188a (2), the position of the table reference mark 136c, the position of the photoconductor reference mark 188b (2), and the position of the table reference mark 136d are used as image data. If stored, the stored image data is displayed on the display device, and further, the table reference mark 136a and the photosensitive member reference mark 188a (2), the table reference mark 136b and the photosensitive member reference mark 188b (2) are displayed. By overlapping and displaying, the position of the photosensitive film 180 can be adjusted while visually recognizing the first relative positional relationship a, the second relative positional relationship a, the first relative positional relationship b, and the second relative positional relationship b. .

  That is, when the photosensitive film 180 is conveyed in the −X direction by the feed pitch P ′, the second relative positional relationship a between the table reference mark 136a and the photosensitive member reference mark 188a (2) maintains the first relative positional relationship a. In addition, the second relative positional relationship b between the table reference mark 136b and the photoconductor reference mark 188b (2) is maintained at the first relative positional relationship b.

<Fifth step>
The process of the fifth step is the process of step S25 in FIG.

  Next, as shown in FIG. 13, the microscope stage 140 is driven, and the imaging units 152a and 152b of the first imaging element assembly 154 and the imaging units 152c and 152d of the second imaging element assembly 156 are connected. Position it in the retracted position. In this state, exposure light is emitted from the light source 110 to project the pattern 166 formed on the reticle 160 onto the photosensitive film 180, thereby forming a pattern image on the photosensitive film 180. A conductor pattern 182 (2) is formed on the photosensitive film 180 by this pattern image.

  After this processing, the photosensitive film 180 is conveyed in the −X direction by the feed pitch P ′ (step S26 in FIG. 7), and it is determined whether or not the end of the photosensitive film 180 has been reached (step S27 in FIG. 7). When it is determined that the end of the film 180 has not been reached, the process returns to the process of step S21 in FIG. Returning to the process of step S21 of FIG. 7, when the processes of steps S21 to S23 are executed again, the relative positions of the table reference mark 136c and the photoreceptor reference mark 188a (3) shown in FIG. The relationship is a new first relative positional relationship a, and the relative positional relationship between the table reference mark 136d and the photoreceptor reference mark 188b (3) shown in FIG. 12B-2 is a new first relative positional relationship b. . Further, the relative positional relationship between the table reference mark 136a and the photosensitive member reference mark 188a (2) is set as a new second relative positional relationship a, and the relative positional relationship between the table reference mark 136b and the photosensitive member reference mark 188b (2) is changed. A new second relative positional relationship b is assumed. Thus, every time the photosensitive film 180 is conveyed by the feed pitch P ′, the first relative positional relationship a, the first relative positional relationship b, the second relative positional relationship a, and the second relative positional relationship b are updated. Each time these relative positional relationships are updated, the new first relative positional relationship a and the new second relative positional relationship a become the same, and the new first relative positional relationship b and new Pattern positions are sequentially formed on the photosensitive film 180 by adjusting the position of the photosensitive film 180 so that the second relative positional relationship b is the same. By repeating such processing, at least two conductor patterns can be sequentially formed on the photosensitive film 180.

  On the other hand, when it is determined in step S27 in FIG. 7 that the end of the photosensitive film 180 has been reached, the process ends.

<< Outline of First Embodiment >>
The photosensitive film 180 is preferably formed with a plurality of photoreceptor reference marks for each feed pitch P ′. However, as described above, an apparatus for forming through holes as photoreceptor reference marks in the photosensitive film 180. When the positioning accuracy is low or the photosensitive film 180 is made of a flexible material, the photosensitive film 180 may expand and contract. In such a case, a plurality of photoreceptor reference marks may be formed on the photosensitive film 180 at intervals different from the feed pitch P ′.

  The projection exposure apparatus 100 is configured as described above, and the conductor pattern is formed on the photosensitive film 180 by the processing from the first step to the fifth step, so that the conductor pattern is formed on the photosensitive film 180 at every feed pitch P ′. Can do.

  For example, as shown in FIG. 14, when a plurality of photoconductor reference marks are formed on the photosensitive film 180 at intervals different from the feed pitch P ′, the photosensitive film 180 is conveyed by the feed pitch P ′ to be photosensitive. Consider the case of forming a conductor pattern on the film 180. In FIG. 14, in order to clearly show the positions of the projected images of the reticle reference marks 168a and 168b projected on the table 138, the projected images of the reticle reference marks 168a and 168b are virtually represented by a plus sign (+) symbol. Expressed.

  FIG. 14A shows the position of the reticle reference mark and the position of the photoreceptor reference mark when alignment is performed for each reticle reference mark, that is, every time the photosensitive film 180 is conveyed by the feed pitch P ′. An example in the case where the values always match is shown.

  As shown in FIG. 14A, when the conductor pattern 182 (1) is formed on the photosensitive film 180, the position of the photoconductor reference mark 188a (1) is made to coincide with the position of the reticle reference mark 168a, and the reticle reference mark 168b. The position of the photoconductor reference mark 188b (1) is made to coincide with the position. Further, when the conductor pattern 182 (2) is formed on the photosensitive film 180, the position of the photoconductor reference mark 188a (2) is aligned with the position of the reticle reference mark 168a, and the position of the photoconductor reference mark 188b is aligned with the position of the reticle reference mark 168b. Match the positions of (2). Further, when the conductor pattern 182 (3) is formed on the photosensitive film 180, the position of the photoconductor reference mark 188a (3) is aligned with the position of the reticle reference mark 168a, and the position of the photoconductor reference mark 188b is aligned with the position of the reticle reference mark 168b. Match the position of (3).

  Thus, when the photosensitive film 180 is aligned and the conductor patterns 182 (1) to 182 (3) are formed, the distance between the conductor pattern 182 (1) and the conductor pattern 182 (2). L1 is longer than the feed pitch P ′. Further, the distance L2 between the conductor pattern 182 (2) and the conductor pattern 182 (3) is shorter than the feed pitch P '.

  As described above, when the conductive film is formed on the photosensitive film 180 so that the position of the reticle reference mark always coincides with the position of the photosensitive element reference mark every time the photosensitive film 180 is conveyed by the feed pitch P ′, The interval between adjacent conductor patterns is different.

  On the other hand, the position of the reticle reference mark and the position of the photoconductor reference mark do not coincide with each other by the projection exposure apparatus 100 and the processing procedure shown in the first embodiment, and the positional relationship is shifted. Even in some cases, the photosensitive film 180 is transported by the feed pitch P ′ and the conductive pattern is formed on the photosensitive film 180 so that the relative positional relationship between the reticle reference mark and the photosensitive member reference mark is maintained. As shown in FIG. 14B, the interval L1 ′ between the conductor pattern 182 (1) and the conductor pattern 182 (2) is equal to the feed pitch P ′, and the conductor pattern 182 (2) and the conductor pattern The distance L2 ′ between the pattern 182 (3) is also equal to the feed pitch P ′.

  As described above, when the relative positional relationship between the table reference mark and the photoreceptor reference mark is maintained when the photosensitive film 180 is conveyed by the feed pitch P ′, the conductor pattern is directly applied to the photosensitive film 180. What is necessary is just to form. Further, when the relative positional relationship between the table reference mark and the photosensitive member reference mark is not maintained when the photosensitive film 180 is conveyed by the feed pitch P ′, the relative relationship between the table reference mark and the photosensitive member reference mark is determined. The conductive pattern may be formed on the photosensitive film 180 by adjusting the position of the photosensitive film 180 so that a specific positional relationship is maintained.

  As described above, by conveying the photosensitive film 180 so as to maintain the relative positional relationship between the position of the photoconductor reference mark and the position of the table reference mark, the interval between the adjacent conductor patterns can be always equalized.

  In the first embodiment, the photosensitive film 180 corresponds to a “photosensitive member”. Further, the feed pitch P ′ corresponds to “predetermined distance”. The conductor pattern 182 (1), the conductor pattern 182 (2), the conductor pattern 182 (3), and the like correspond to “at least two pattern images”. The projection exposure apparatus 100 corresponds to a “projection exposure apparatus”. The pattern 166 corresponds to a “pattern”. The reticle reference mark 168a or 168b corresponds to the “first reticle reference mark”. The reticle reference mark 168c or 168d corresponds to the “second reticle reference mark”. The reticle 160 corresponds to “reticle”. The interval P between the reticle reference marks 168a and 168c or the interval P between the reticle reference marks 168b and 168d corresponds to the “interval based on the predetermined distance”.

  The photoconductor reference mark 188a (1), 188a (2), 188a (3), and the like correspond to the “first photoconductor reference mark”. The photoreceptor reference marks 188b (1), 188b (2), 188b (3), etc. correspond to the “second photoreceptor reference mark”.

  The moving direction (± X direction) of the photosensitive film 180 corresponds to the “moving direction of the photosensitive member”. The table 138, the feed roller 172, and the take-up roller 174 of the workpiece placement stage 130 correspond to “conveying means”.

  The four imaging units 152a, 152b, 152c, and 152d correspond to “position detection means”. In particular, the imaging unit 152a or 152b corresponds to the “first detection unit”. The imaging unit 152c or 152d corresponds to the “second detection unit”. The position storage unit 196 corresponds to a “position storage unit”.

  The first relative positional relationship a between the table reference mark 136c and the photosensitive member reference mark 188a (2) and the first relative positional relationship b between the table reference mark 136d and the photosensitive member reference mark 188b (2) are “the first relative relationship”. This corresponds to “relative positional relationship”. In addition, the second relative positional relationship a between the table reference mark 136a and the photosensitive member reference mark 188a (2) and the second relative positional relationship b between the table reference mark 136b and the photosensitive member reference mark 188b (2) are “first”. 2 relative positional relationship ”.

  The collating means 197 corresponds to “collating means”. The table 138 of the workpiece placement stage 130 corresponds to “placement means”. The feed roller 172 corresponds to “sending means”. The take-up roller 174 corresponds to “take-out means”.

<<< Second Embodiment >>>
15 and 14 are perspective views showing a projection exposure apparatus 200 according to the second embodiment of the present invention. A configuration in which the projection exposure apparatus 200 according to the second embodiment is different from the projection exposure apparatus 100 according to the first embodiment is a microscope 158. In FIG. 15 and FIG. 16, constituent elements common to the projection exposure apparatus 100 according to the other first embodiment are denoted by the same reference numerals.

  The microscope 158 in the second embodiment includes two imaging units 152e and 152f. These imaging units 152e and 152f are made of an imaging element such as a CCD camera, for example. 15 and 16, only the two imaging units 152e and 152f are shown as the microscope 158. The microscope 158 includes a support member (not shown) that supports the two imaging units 152e and 152f. The two imaging units 152e and 152f are supported by a support member so that the table 138 of the workpiece placement stage 130 and the photosensitive film 180 placed on the table 138 can be imaged.

  Each of the two imaging units 152e and 152f is supported by a support member (not shown) of the microscope 150 so as to be integrally movable in the ± X direction and separately movable in the ± Y direction. .

  The retracted position of the imaging unit 152e is a position moved in the + Y direction so as not to obstruct the exposure of the photosensitive film. The retracted position of the imaging unit 152f is a position moved in the −Y direction so as not to obstruct the exposure of the photosensitive film.

  In addition, the measurement position of the imaging unit 152e includes a first measurement position and a second measurement position. The first measurement position of the imaging unit 152e is a position moved so that the projected image of the reticle reference mark 168a formed on the reticle 160 or the photoreceptor reference mark 188a (1) formed on the photosensitive film 180 can be captured. (See FIG. 15). On the other hand, the second measurement position of the imaging unit 152e is moved so that the projected image of the reticle reference mark 168c formed on the reticle 160, the photoreceptor reference mark 188a (2) formed on the photosensitive film 180, or the like can be captured. (See FIG. 16).

  Similarly to the imaging unit 152e, the imaging unit 152f includes a first measurement position and a second measurement position. The first measurement position of the imaging unit 152f is a position moved so that the projected image of the reticle reference mark 168b formed on the reticle 160 or the photoreceptor reference mark 188a (1) formed on the photosensitive film 180 can be captured. (See FIG. 15). On the other hand, the second measurement position of the imaging unit 152f is moved so that the projected image of the reticle reference mark 168d formed on the reticle 160, the photoreceptor reference mark 188a (2) formed on the photosensitive film 180, or the like can be captured. (See FIG. 16).

  Note that as in the first embodiment, the imaging unit 152e does not directly capture the projection images of the reticle reference marks 168a and 168c formed on the reticle 160, and captures images via the table reference marks 136a and 136c. Will do. Similarly, the imaging unit 152f does not directly capture the images of the reticle reference marks 168b and 168d formed on the reticle 160, but captures the images via the table reference marks 136b and 136d.

  Further, the measurement position of the microscope 158 may be a fixed position. That is, when the imaging unit 152e is moved from the retracted position to the first measurement position or the second measurement position, the imaging unit 152e can be positioned at the constant first measurement position or the constant second measurement position. I can do it. When the imaging unit 152e is positioned at the first measurement position or the second measurement position, it is not necessary to obtain specific coordinates of the imaging unit 152e. When the imaging unit 152e is positioned at the first measurement position or the second measurement position, the projected images of the reticle reference marks 168a and 168c formed on the reticle 160 and the photoreceptor reference marks 188a ( 1), 188a (2), etc., to an extent that the image pickup area 152e can be clearly imaged, and the position of the image of the reticle reference mark 168a, 168c, the photoconductor reference mark 188a (1), It is only necessary that the position of 188a (2) or the like can be imaged with a resolution high enough to be sufficiently specified in the imaging region.

  Similarly, when the imaging unit 152f is moved from the retracted position to the first measurement position or the second measurement position, the imaging unit 152f is positioned at the constant first measurement position or the constant second measurement position. If you can. When the imaging unit 152f is positioned at the first measurement position or the second measurement position, it is not necessary to obtain specific coordinates of the imaging unit 152f. When the imaging unit 152f is positioned at the first measurement position or the second measurement position, the projected images of the reticle reference marks 168b and 168d formed on the reticle 160 and the photoreceptor reference marks 188b ( 1), 188b (2), etc., to an extent that the imaging area of the imaging unit 152f is sufficiently large, and the position of the image of the reticle reference mark 168b, 168d, the photoconductor reference mark 188b (1), It is only necessary that the position of 188b (2) or the like can be imaged with a resolution high enough to be sufficiently specified in the imaging region.

  As in FIG. 3 shown in the first embodiment, each of the imaging units 152e and 152f is electrically connected to an imaging data processing unit 190 that performs imaging processing and arithmetic processing. The imaging data processing unit 190 includes a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), and the like. The imaging data processing unit 190 includes an imaging processing unit 192 and an arithmetic processing unit 194. The processing of the imaging processing unit 192 and the arithmetic processing unit 194 of the imaging data processing unit 190 is the same as that in the first embodiment.

  By performing the same process as the first to fifth steps of the first embodiment except for the process of imaging the photoconductor reference mark and the table reference mark, the position and table of the photoconductor reference mark are executed. By transporting the photosensitive film 180 so as to maintain a relative positional relationship with the position of the reference mark, it is possible to always make the intervals between adjacent conductor patterns equal.

  In the second embodiment described above, the microscope 158 is configured to include the two imaging units 152e and 152f. However, if the imaging unit can be moved in the ± X direction and the ± Y direction, the imaging unit is moved. The configuration can be further simplified by using only one.

  Thus, in the second embodiment, since the microscope 158 includes only the two imaging units 152e and 152f, the configuration can be simplified and the projection exposure apparatus 200 can be made inexpensive.

<<< Third Embodiment >>>
FIG. 17 is a perspective view showing a projection exposure apparatus 300 according to the third embodiment of the present invention. The projection exposure apparatus 300 according to the third embodiment is different from the projection exposure apparatus 100 according to the first embodiment in that the microscope is only the reticle microscope 120. In FIG. 17, the same reference numerals are given to the components common to the projection exposure apparatus 100 according to the other first embodiment. In FIG. 17, the light source 110 and the reflection mirror 112 are omitted, but the light source 110 and the reflection mirror are disposed above the projection exposure apparatus 300 as in the first or second embodiment. 112 is provided.

  As described above, in the projection exposure apparatus 300 according to the third embodiment, only the reticle microscope 120 is used as the microscope for imaging the reference mark. The reticle microscope 120 includes four imaging units 122a, 122b, 122c, and 122d. These imaging units 122a, 122b, 122c, and 122d are made of an imaging element such as a CCD camera, for example. In FIG. 17, only four imaging units 122a, 122b, 122c, and 122d are shown as the reticle microscope 120.

The imaging unit 122a not only captures the reticle reference mark 168a but also the photoreceptor reference mark 188a (1) and the like. That is, the imaging unit 122a images the photoconductor reference mark 188a (1) and the like via the projection lens 114. The imaging unit 122b captures not only the reticle reference mark 168b but also the photoreceptor reference mark 188b (1) and the like. That is, the imaging unit 122b images the photoconductor reference mark 188b (1) and the like via the projection lens 114. The imaging unit 122c not only images the reticle reference mark 168c, but also images the photoreceptor reference mark 188a (2) and the like. That is, the imaging unit 122c images the photoreceptor reference mark 188a (2) and the like via the projection lens 114. The imaging unit 122d not only images the reticle reference mark 168d, but also images the photoreceptor reference mark 188b (2) and the like. That is, the imaging unit 122d images the photoconductor reference mark 188b (2) and the like via the projection lens 114.
As described above, the four imaging units 122a to 122d may be made of a material that can clearly image the photoconductor reference marks so that the photoconductor reference marks 188a (1) and 188b (1) can be imaged. The illumination light for illuminating the photoconductor reference mark is changed from below.

  Thus, since the reticle microscope 120 can image the photoconductor reference marks 188a (1), 188b (1), etc., the position of the reticle reference mark and the position of the photoconductor reference mark can be detected, and the table reference mark 136a. ˜136d can be omitted, and the process of the first step of the first embodiment can also be omitted.

  As in FIG. 3 shown in the first embodiment, each of the four imaging units 122a to 122d is electrically connected to an imaging data processing unit 190 that performs imaging processing and arithmetic processing. The imaging data processing unit 190 includes a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), and the like. The imaging data processing unit 190 includes an imaging processing unit 192 and an arithmetic processing unit 194. The processing of the imaging processing unit 192 and the arithmetic processing unit 194 of the imaging data processing unit 190 is the same as that in the first embodiment.

  By performing the same process as the second to fifth steps of the first embodiment except for the process of imaging the photoconductor reference mark and the table reference mark, the position and table of the photoconductor reference mark are executed. By transporting the photosensitive film 180 so as to maintain a relative positional relationship with the position of the reference mark, it is possible to always make the intervals between adjacent conductor patterns equal.

  In the third embodiment described above, the number of imaging units of the reticle microscope 120 is four. However, the imaging unit can be moved by moving the imaging unit in the ± X direction and the ± Y direction. It is possible to simplify the configuration by using two or one.

  As described above, in the third embodiment, since only the reticle microscope 120 is used as the microscope for imaging the reference mark, the alignment microscope (microscope 150) can be omitted, and the table reference marks 136a to 136 are provided on the table 138. And the first step of the first embodiment can be omitted, and not only can the projection exposure apparatus 300 be made inexpensive, but also the handling and processing can be simplified. it can.

<<< Fourth embodiment >>>>
FIG. 18 is a perspective view showing a projection exposure apparatus 400 according to the fourth embodiment of the present invention. The projection exposure apparatus 400 according to the fourth embodiment is different from the projection exposure apparatus 100 according to the first embodiment in that the microscope 125 is disposed below the workpiece placement stage 130. In FIG. 18, the same reference numerals are given to components common to the projection exposure apparatus 100 according to the other first embodiment.

  In the projection exposure apparatus 400 according to the fourth embodiment, only the microscope 125 is used as the microscope for imaging the reference mark. As described above, the microscope 125 is disposed below the workpiece placement stage 130. The microscope 125 includes four imaging units 124a, 124b, 124c, and 124d. These imaging units 124a, 124b, 124c, and 124d are formed of an imaging element such as a CCD camera, for example. In FIG. 18, only four imaging units 124a, 124b, 124c, and 124d are shown as the microscope 125. Further, in FIG. 18, in order to clarify the four imaging units 124a, 124b, 124c, and 124d, these imaging units are shown at positions separated from the workpiece placement stage 130 ′, but the workpiece placement stage 130 ′. It is assumed that it is arranged directly under.

  A through-hole 132 is formed in the central portion of the workpiece placement stage 130 'and the central portion of the table 138'. By doing in this way, the photosensitive film 180 arrange | positioned on table 138 'can be imaged from the lower side of workpiece | work mounting stage 130' by the four imaging parts 124a, 124b, 124c, and 124d. In addition, it is preferable that a flat transparent member (not shown) such as a glass plate for covering the through hole 132 is placed on the upper surface of the table 138 '. By covering the through hole 132 with such a member, the photosensitive film 180 can be disposed on the table 138 ′ without being bent.

  The imaging unit 124a not only captures the photoconductor reference mark 188a (1) and the like, but also captures a projected image of the reticle reference mark 168a. That is, the imaging unit 124 a captures the projected image of the reticle reference mark 168 a through the through hole 132. The imaging unit 124b captures not only the photoconductor reference mark 188b (1) and the like but also a projected image of the reticle reference mark 168b. That is, the imaging unit 124 b captures the projection image of the reticle reference mark 168 b through the through hole 132. The imaging unit 124c captures not only the photoconductor reference mark 188a (2) and the like, but also a projected image of the reticle reference mark 168c. That is, the imaging unit 124 c captures the projection image of the reticle reference mark 168 c through the through hole 132. The imaging unit 124d captures not only the photoconductor reference mark 188b (2) and the like, but also a projected image of the reticle reference mark 168d. That is, the imaging unit 124d captures the projected image of the reticle reference mark 168d through the through hole 132.

  As described above, the four image pickup units 124a to 124d can capture not only the photoconductor reference marks 188a (1) and 188b (1) but also the reticle reference marks 168a to 168d. Preferably, the reference mark is made of a material that can be clearly imaged, or the illumination light that illuminates the photoreceptor reference mark is from above.

  In this way, since the microscope 125 can also capture the reticle reference marks 168a to 168d, the position of the reticle reference mark and the position of the photoconductor reference mark can be detected only by the microscope 125, and the table reference is stored in the table 138 ′. It is not necessary to form the marks 136a to 136, and the processing of the first step of the first embodiment can be omitted.

  In the first to fourth embodiments described above, the case where the photoconductor reference marks 188a (1) and 188b (1) are through holes formed in the photosensitive film 180 has been described. 188a (1), 188b (1), and the like may be anything that can be imaged by the microscope 150, and may be a recess or a depression that can be formed by pressing the photosensitive film 180 with a pressing device or the like. When the photoconductor reference marks 188a (1), 188b (1), etc. are formed as recesses or depressions, in order to facilitate imaging with the microscope 150, the end portions that form the outlines of the depressions and depressions can be clearly formed. Is preferred. By forming in this way, it is possible to easily identify the positions of the recesses and depressions.

1 is a perspective view showing a projection exposure apparatus 100 according to a first embodiment of the present invention. FIG. 4 is a plan view (a) showing an example of a reticle 160 and a plan view (b) showing an example of a photosensitive film 180. It is a functional block diagram which shows the outline of the main main functions of position detection and imaging data processing of the projection exposure apparatus 100 by 1st Embodiment. Using a reticle microscope, the four reticle reference marks 168a, 168b, 168c and 168d formed on the reticle 160 are projected onto the table 138 of the workpiece placement stage 130, and the reference position of the reticle 160 and the workpiece placement stage 130 are measured. It is a figure which shows the example of the process which makes the reference position of the table 138 correspond. It is a figure which shows the example which imaged the table reference marks 136a, 136b, 136c, and 136d using the microscope 150. FIG. It is a flowchart which shows the procedure which forms a conductor pattern in the photosensitive film 180 using the projection exposure apparatus 100 by 1st Embodiment. It is a flowchart which shows the continuation of the procedure shown in FIG. It is a perspective view which shows the procedure which forms a conductor pattern in the photosensitive film 180 using the projection exposure apparatus 100 by the 1st Embodiment of this invention. Table reference marks 136a, 136b, 136c, and 136d imaged by the microscope 150 of the projection exposure apparatus 100 according to the first embodiment, the photoreceptor reference marks 188a (1) and 188b (1), and 188a (2). And 188b (2). It is a perspective view which shows the procedure which forms a conductor pattern in the photosensitive film 180 using the projection exposure apparatus 100 by the 1st Embodiment of this invention. It is a perspective view which shows the procedure which forms a conductor pattern in the photosensitive film 180 using the projection exposure apparatus 100 by the 1st Embodiment of this invention. Table reference marks 136a, 136b, 136c, and 136d imaged by the microscope 150 of the projection exposure apparatus 100 according to the first embodiment, the photoreceptor reference marks 188a (2) and 188b (2), and 188a (3). And 188b (3). It is a perspective view which shows the procedure which forms a conductor pattern in the photosensitive film 180 using the projection exposure apparatus 100 by the 1st Embodiment of this invention. It is a figure which shows one example when a conductor pattern is formed in the photosensitive film 180 using the projection exposure apparatus 100 by the 1st Embodiment of this invention. It is a perspective view which shows the projection exposure apparatus 200 by the 2nd Embodiment of this invention. It is a perspective view which shows a state when the two imaging parts 152e and 152f are located in the 2nd measurement position with the projection exposure apparatus 200 by the 2nd Embodiment of this invention. It is a perspective view which shows the projection exposure apparatus 300 by the 3rd Embodiment of this invention. It is a perspective view which shows the projection exposure apparatus 400 by the 4th Embodiment of this invention.

Explanation of symbols

100 Projection exposure apparatus 138 Table (conveying means, mounting means)
152a, 152b Imaging unit (position detecting means, first detecting means)
152c, 152d Imaging unit (position detecting means, second detecting means)
160 reticle 166 pattern 168a, 168b reticle reference mark (first reticle reference mark)
168c, 168d reticle reference mark (second reticle reference mark)
172 Feed roller (conveyance means, delivery means)
174 Take-up roller (conveying means, take-up means)
180 Photosensitive film (photoconductor)
182 (1), 182 (2), 182 (3) Conductor pattern (pattern image)
188a (1), 188a (2), 188a (3) Photoconductor reference mark (first photoconductor reference mark)
188b (1), 188b (2), 188b (3) Photoconductor reference mark (second photoconductor reference mark)
196 Position storage means 197 Verification means 198 Position control means 199 Positioning means P ′ Feeding pitch (predetermined distance)
P interval between reticle reference marks 168a and 168c, interval between reticle reference marks 168b and 168d (interval based on the predetermined distance)

Claims (9)

A projection exposure apparatus that moves a photosensitive member by a predetermined distance and forms at least two pattern images on the photosensitive member by exposure light,
A pattern for projecting the pattern image on the photoconductor to form the pattern image on the photoconductor, and a reference mark indicating a reference position of the pattern, and a first reticle reference having an interval corresponding to the predetermined distance A reticle formed with a mark and a second reticle reference mark, and
At least two first photoconductor reference marks and a second photoconductor reference mark having an interval based on the predetermined distance are formed on the photoconductor along the moving direction of the photoconductor, and
Transport means for moving the photosensitive member by the predetermined distance and positioning the photosensitive member at a desired position;
Position for detecting the position of the first reticle reference mark, the position of the first photoconductor reference mark, the position of the second reticle reference mark, and the position of the second photoconductor reference mark. Detection means;
When the position of the first reticle reference mark detected by the position detection means and the position of the first photoconductor reference mark satisfy a predetermined positional relationship, the first detection detected by the position detection means. Position storage means for storing a first relative positional relationship between the position of the second reticle reference mark and the position of the second photoconductor reference mark;
A second relative positional relationship between the position of the first reticle reference mark and the position of the second photoconductor reference mark when the transport means moves the photoconductor by the predetermined distance. A projection exposure apparatus comprising: collation means for collation with the first relative positional relationship.   When it is determined by the collation by the collating means that the second relative positional relationship does not satisfy the first relative positional relationship, the second relative positional relationship satisfies the first relative positional relationship. The projection exposure apparatus according to claim 1, wherein the position of the photosensitive member is adjusted.   When the position of the first reticle reference mark detected by the position detection means and the position of the first photoconductor reference mark satisfy a predetermined positional relationship, the pattern is projected onto the photoconductor to project the pattern. The projection exposure apparatus according to claim 1, wherein a pattern image is formed on the photoconductor.   When the photosensitive member is moved by the predetermined distance, the second relative positional relationship between the position of the first reticle reference mark and the second photosensitive member reference mark satisfies the first relative positional relationship. The projection exposure apparatus according to claim 1, wherein the pattern is projected onto the photoconductor to form the pattern image on the photoconductor. The position detection means includes a first detection means and a second detection means, and
The position of the first reticle reference mark and the position of the first photoconductor reference mark are detected by the first detection means, and the position of the first reticle reference mark and the first photosensitive reference mark are detected. When the position of the body reference mark satisfies a predetermined positional relationship, the position of the second reticle reference mark and the position of the second photoconductor reference mark are detected by the second detection means. 2. The projection exposure apparatus according to claim 1, wherein a relative positional relationship between the position of the second reticle reference mark and the position of the second photoconductor reference mark is stored in the position storage means.   When the transport unit moves the photoconductor by the predetermined distance, the first detection unit detects the position of the first reticle reference mark and the position of the second photoconductor reference mark by the first detection unit. The projection exposure apparatus according to claim 3, wherein the projection exposure apparatus is detected.   The projection exposure apparatus according to claim 1, wherein the photoconductor has a long shape extending along a direction in which the photoconductor moves. Mounting means for projecting the pattern onto the photosensitive member and mounting the photosensitive member at a position where the pattern image is formed on the photosensitive member;
The projection exposure apparatus according to claim 1, wherein the conveying unit includes a sending unit that sends the photoconductor toward the mounting unit, and a take-up unit that takes the photoconductor from the mounting unit.   2. The projection exposure apparatus according to claim 1, wherein each of the at least two first photoconductor reference marks and second photoconductor reference marks is a through-hole or a recess formed in the photoconductor.

Images