JP4324606B2 - Alignment apparatus and exposure apparatus - Google Patents

Description

  The present invention relates to an alignment apparatus that aligns a large substrate and an exposure apparatus that exposes a predetermined pattern on a pattern area of the substrate, and in particular, a non-circuit pattern portion of a substrate is irradiated with a laser beam to identify identification marks such as symbols and characters. Is suitable for an exposure apparatus that performs peripheral exposure of a non-circuit pattern region by irradiating ultraviolet rays.

  For example, an exposure apparatus for a liquid crystal substrate had a size of about 500 mm × 500 mm several years ago, but now, a substrate enlarged to 2160 mm × 2460 mm has been handled. A substrate to be mounted on an image receiving device or a broadcasting device is manufactured by cutting and separating the large substrate from the individual pieces set in advance. When a substrate is cut and separated from a large state, it is necessary to manage the substrate and the manufacturing process. For this purpose, a process control index is formed by marking an identification symbol made up of characters, symbols or figures, or a combination thereof on the individual substrates by a laser beam or the like in a non-circuit pattern area of the substrate. Furthermore, the substrate is exposed to a cutting position identification code for identifying the position to be separated, or various alignment marks, etc. to form a substrate cutting or alignment index. Hereinafter, the identification symbol, the cutting position identification code, the alignment mark, and the like are collectively referred to as an identification mark.

  In addition, a non-circuit pattern area where a circuit pattern is not formed is set to a predetermined width around the pattern area of the substrate. Unnecessary photoresist ink present in the non-circuit pattern region has a problem in a later process, and therefore needs to be exposed in advance. On the other hand, it is necessary to display the identification mark in the non-circuit pattern area as described above. For example, as shown in Patent Document 1, the position where the identification mark is formed in the non-circuit pattern region is not only in the central portion of the non-circuit pattern region, but close to the end portion of the substrate when provided near the circuit pattern region. There are various cases.

  In this substrate manufacturing process, there are various exposure devices on the production line, such as an exposure device that exposes circuit pattern regions, a peripheral exposure device that exposes photoresist ink in non-circuit pattern regions, and an exposure device that marks identification marks. ing. For example, as disclosed in Patent Document 2, an exposure apparatus that marks an identification mark by irradiating a laser in a non-circuit pattern area is used to mark an identification mark formed in a non-circuit pattern area of a substrate. Then, a laser beam is irradiated from an exposure unit arranged above the stage on which the substrate is placed. Then, the stage on which the substrate is placed and the exposure unit are moved relative to each other, and the laser beam is sequentially scanned in the stage moving direction and the direction orthogonal to the moving direction, while the irradiation position is shifted in the opposite moving direction to The identification mark is marked by aligning the irradiation point on the substrate with a plane serving as coordinates.

In addition, in the manufacturing process of exposing an unnecessary resist in the peripheral portion, as in Patent Document 3, a method for detecting the periphery with an optical sensor that moves the periphery of the substrate in synchronization with the exposure light irradiation unit, as in Patent Document 4 In addition, information on the peripheral edge of the substrate is secured by a method of detecting the peripheral edge of the substrate by information of a position sensor that detects a position when the pin contacts the substrate.
Japanese Patent No. 2910867 Japanese Patent No. 3547418 JP 2000-306794 A Japanese Patent No. 34139947

  However, the conventional exposure apparatus that marks the identification mark or the peripheral exposure apparatus that exposes the identification mark and the non-circuit pattern area has the following problems.

In these exposure apparatuses, a mechanism unit for transporting a substrate is a stage with a long axis (X axis), a stage with an axis orthogonal to this axis (Y axis), and a stage with an axis that rotates the substrate (θ axis). It is configured. For this reason, the three stages are overlapped, and the entire transport system constitutes a tall mechanism part, and the cost is high due to an increase in the number of mechanism parts. Further, since the three stages overlap and the center of gravity becomes high, there is a problem that the displacement of the substrate mounting surface becomes large and the exposure performance is likely to be adversely affected.

In the invention disclosed in Patent Document 3, only the peripheral edge of one side of the square substrate is optically detected, and then the non-circuit pattern portion is exposed along the peripheral edge, so that the substrate is correctly positioned on the stage. Otherwise, there is a problem that accurate peripheral exposure cannot be performed.
Further, in the invention disclosed in Patent Document 4, an invention of a mechanism for positioning two orthogonal sides of a square substrate is proposed. Such an invention requires many mechanical elements such as springs and contacts for positioning, so that the peripheral portion of the substrate is deformed and damaged, and not only the mechanism becomes complicated, but also a lot of time is required for maintenance and inspection. There was a problem.

  The present invention has been developed in view of the above-described problems, and is an exposure apparatus that eliminates deformation and breakage of a substrate due to alignment. The exposure apparatus of the present invention is an exposure apparatus in which the positioning detection mechanism unit can be configured simply and a unit for irradiating a laser beam and a non-circuit pattern region with ultraviolet rays can be easily installed. This ensures stable production.

The alignment apparatus according to the first aspect of the present invention corrects a slight deviation of a square substrate on a two-dimensional plane, transports the square substrate to an exposure apparatus, and holds the pre-aligned square substrate. And a stage that rotates about an axis orthogonal to the two-dimensional plane and moves in the first direction in the two-dimensional plane, and two places that are arranged at positions separated from each other on the peripheral edge of one side of the square substrate. A first imaging device that picks up an image and outputs two peripheral images; a second imaging device that picks up one edge of the other edge that intersects one side and outputs the other peripheral image; and a peripheral image And an image processing circuit for confirming whether or not each of the other peripheral images matches a prestored image,
When the peripheral image and the corresponding pre-stored image do not match, the stage is rotated, and when the other peripheral image does not match the corresponding pre-stored image, the stage is moved in the first direction. An alignment apparatus comprising: a control unit that moves the control unit .
With this configuration, the square substrate does not have a contact with a mechanical pin or the like for alignment, and the substrate is not deformed by the alignment and is not damaged due to the deformation. In addition, the mechanism of the alignment apparatus can have a simple configuration. This facilitates maintenance and inspection of the alignment apparatus.

Further, with this configuration, unidirectional alignment of the square substrate can be achieved. In addition, with this configuration, alignment can be performed simply by comparing an image captured by the image capturing apparatus with an image stored in advance, so that arithmetic software for detecting the alignment position can be handled with a simple one.

Furthermore, with this configuration, alignment in the other direction of the square substrate can be achieved.

In the alignment apparatus according to the second aspect of the present invention, a reflecting table for reflecting light is provided at two positions arranged at spaced positions and at one position on the periphery of the other side.
For example, when the square substrate is a glass substrate, the imaging device may not obtain sufficient contrast between the portion with and without the glass substrate. However, by providing the reflecting table, the imaging apparatus can obtain a sufficient contrast even with a glass substrate. For this reason, alignment accuracy can be improved.

In the alignment apparatus of the third aspect of the present invention, in the second aspect , the reflecting table is movable according to the size of the square substrate.
With this configuration, even when the square substrate carried into the apparatus has a plurality of sizes, it can be appropriately handled.

The alignment apparatus of the 4th viewpoint of this invention is equipped with the illuminating device which irradiates light in the position of two places distribute | arranged to the position spaced apart, and the position of one place of the periphery of the other side.
For example, the imaging device may not be able to obtain sufficient contrast. However, by providing the illumination device, a sufficient contrast can be obtained without increasing the photographing sensitivity of the imaging device. For this reason, alignment accuracy can be improved.

An illumination device of an alignment apparatus according to a fifth aspect of the present invention includes a light source having a first wavelength and a light source having a second wavelength different from the first wavelength, and the light source having the first wavelength according to a photoresist ink. And the light of the second wavelength.
With this configuration, the wavelength of the illumination light is changed according to the type of the photoresist ink, and a good image can be obtained without being greatly affected by the performance of the imaging device. For this reason, alignment accuracy can be improved.

An exposure apparatus according to a sixth aspect of the present invention is the exposure apparatus for moving a square substrate along a movement path to form a circuit pattern in a pattern region of the square substrate . The alignment apparatus of the viewpoint , a laser beam unit that is provided above the rectangular substrate and that irradiates a non-circuit pattern area where a circuit pattern is not formed, and marks an identification mark, and a position adjacent to the laser beam unit And an ultraviolet irradiation unit that is provided above the square substrate and irradiates the non-circuit pattern region with ultraviolet light, and a moving means that moves the ultraviolet irradiation unit in a direction perpendicular to the first direction , After the square substrate is moved to a predetermined position by the control of the alignment device, the periphery of the square substrate is the bottom surface of the laser beam unit and the ultraviolet rays. Morphism move the unit the lower surface.
With this configuration, the square substrate with improved alignment accuracy can be moved to the lower surface of the laser beam unit and the lower surface of the ultraviolet irradiation unit. For this reason, the identification mark can be marked with high accuracy, and the non-circuit pattern region can be irradiated with ultraviolet light with high accuracy.

In the alignment apparatus or exposure apparatus according to the present invention, two sides of the square substrate are imaged, and the other side that intersects with the one side is imaged at one location, thereby guiding the position of the square substrate to a predetermined position. . For this reason, a mechanical pin and the periphery of a square substrate do not contact. That is, the square substrate is not deformed by the alignment and is not damaged by the deformation, and the positioning detection mechanism can be simply configured. Therefore, maintenance / inspection becomes easy.
Furthermore, after the substrate is accurately positioned, the stage may be transported in a linear direction (for example, the X direction), and thus a mechanism that drives the stage in a direction (for example, the Y direction) orthogonal to the linear direction for substrate alignment. Therefore, the entire apparatus can be designed compactly.

  Hereinafter, the non-circuit pattern area is irradiated with a laser beam to mark an identification mark, and light containing ultraviolet light having a predetermined wavelength (hereinafter referred to as “ultraviolet light”) is applied to remove unnecessary photoresist ink. A best mode for carrying out a mark / periphery exposure apparatus and method will be described.

<Configuration of glass substrate>
FIG. 1 is an example of a liquid crystal glass substrate used in the present invention. For example, a glass substrate W of 2160 mm × 2460 mm or 2400 mm × 2800 mm is adopted as the glass substrate size for liquid crystal. As shown in FIG. 1, the glass substrate W has a square shape, and a photoresist ink is applied to the entire surface of the square glass substrate W. The circuit pattern to be exposed on the square glass substrate W is designed in advance. For example, a pattern region Wp of 2 rows and 3 columns is formed, and a non-peripheral region is formed around each pattern region Wp. A circuit pattern region Wc is formed. The non-circuit pattern region Wc of the square glass substrate W serves as a cutting allowance when the pattern regions Wp are cut and separated, and symbols, characters, figures, or combinations thereof (hereinafter, identification) This is a non-circuit pattern region where a mark is formed. Here, in the non-circuit pattern region Wc of the square glass substrate W, identification marks M (vertical identification marks M1 and horizontal identification marks M2) are formed in the vertical and horizontal directions, respectively.

  Here, a pattern and an identification mark formed on the surface of the square glass substrate W will be described slightly. Photoresist ink is applied to the surface of the square glass substrate W, and it is put into the exposure process. In the exposure process, the square glass substrate W is formed with the circuit pattern portion Wp and the identification mark M shown in FIG. The circuit pattern portion Wp is irradiated with ultraviolet rays through a mask corresponding to the corresponding circuit, a circuit pattern is directly drawn with a laser, or fine particles corresponding to a fine circuit such as an ink jet are irradiated. , Forming a circuit. A portion other than the circuit pattern region in which the circuit pattern Wp is formed, that is, the non-circuit pattern region Wc becomes an obstacle to the subsequent process. Therefore, it is necessary to expose a region other than the identification mark M formed in the non-circuit pattern region Wc. Therefore, the ultraviolet irradiation unit 9 (see FIG. 2) for exposing the non-circuit pattern region Wc moves in a direction orthogonal to the moving direction in synchronization with the movement of the glass substrate W. Then, the ultraviolet irradiation unit 9 controls the irradiation width to a necessary width by the operation of a shutter (not shown) and irradiates the ultraviolet light. As a result, a desired non-circuit pattern region Wc is exposed. However, in the region of the identification mark M, the identification mark M is left exposed to the square glass substrate W by shielding ultraviolet light.

  The identification mark M formed in the non-circuit pattern region Wc is formed for the purpose of providing information serving as an index in a subsequent process in which alphabets, various numbers, symbols, and the like are represented by barcodes and two-dimensional codes. . Therefore, the resolution as high as that of the original circuit pattern Wp is not required, and a laser beam is used so that the identification mark M can be expressed by superimposing dots having a small diameter of φ30 micrometers or less through a mask capable of expressing the identification mark M. And the identification mark M is formed on the surface of the square glass substrate W in the vicinity of the circuit pattern region Wp.

<Configuration of identification mark / peripheral exposure device>
2 is a cross-sectional view schematically showing the inside of the apparatus from the side direction with a part of the identification mark / peripheral exposure apparatus (hereinafter referred to as “this apparatus”) omitted, and FIG. 3 is a part of this apparatus omitted. FIG. 2 is a cross-sectional view schematically showing the inside of the apparatus from the back side.

  As shown in FIG. 2, the apparatus 1 includes a stage 2 that holds a pre-aligned square glass substrate W, a moving transfer mechanism 3 that transfers or moves the glass substrate W held on the stage 2, and a stage 2. And an imaging device 4 for imaging a predetermined position of the square glass substrate W and the stage 2. Furthermore, this apparatus includes a laser beam unit 5 that exposes the identification mark M in the peripheral region Wc that is the periphery of the pattern region Wp of the square glass substrate W that has been transported by the movable transport mechanism 3, and a non-circuit of the square glass substrate W. It is divided into an ultraviolet irradiation unit 9 that shields the identification mark M exposed on the pattern area Wc and irradiates the other peripheral area Wc with ultraviolet light. This apparatus includes a control mechanism 20 that controls the moving conveyance mechanism 3, the laser beam unit 5, and the ultraviolet irradiation unit 9.

  As shown in FIGS. 2 and 3, the stage 2 is substantially the same size as the square glass substrate W and is made of aluminum or a light steel material. The support columns 2b are for contacting the square glass substrate W to hold the substrate horizontally (XY plane), and a plurality of support columns 2b are installed on the base 2a at a predetermined height from the base 2a. . Carrying in the square glass substrate W is assumed to be a robot hand (not shown). For this reason, the interval between the support pillars 2b is arranged in a linear space that can be transferred by the fork when the square glass substrate W is carried in with the back surface held by the two forks of the robot hand. Has been. Further, if the spacing between the support pillars 2b is too wide, the square glass substrate W will bend by its own weight, so that the square glass substrate W is arranged in a plurality of lines at a pitch of 100 mm, for example, so that the square glass substrate W can be kept horizontal. ing. Further, the support pillar 2b is formed in a chamfered planar shape at the tip position that contacts the square glass substrate W. The planar portion at the tip position of the support column 2b has a suction opening (not shown) for holding the square glass substrate W by vacuum suction.

  In addition, a moving transport mechanism 3 is provided below the square stage 2 in order to drive the stage 2. The moving conveyance mechanism 3 performs the alignment operation of the rectangular glass substrate W and conveys the rectangular glass substrate W along the movement path L. In addition, the moving transport mechanism 3 moves the square glass substrate W at the time of exposure at a predetermined speed at the time of laser beam irradiation and ultraviolet light irradiation. The moving transport mechanism 3 includes a first moving guide mechanism 3A that moves the stage 2 in the X linear direction, which is one linear direction, and a rotational direction that is around a perpendicular line perpendicular to the substrate surface held by the stage 2 ( and a third movement guide mechanism 3C that moves the stage 2 in the θ direction). The first movement guide mechanism 3A includes a linear motor 3a and a movement rail 3b (see FIG. 5). However, as long as the movement can be controlled with a certain degree of accuracy, a movement mechanism using a servo motor and a feed screw may be used, and there is no particular limitation. The third movement guide mechanism 3C is configured by a stepping motor and a feed screw.

  The ultraviolet irradiation unit 9 for exposing the non-circuit pattern region Wc uses, as a light source, a mercury lamp (not shown) that can irradiate ultraviolet light having a wavelength for exposing the photoresist ink applied to the surface of the square glass substrate W. Consists of an elliptical reflector, fly-eye lens, reflector, shutter, etc., attached to a movable mechanism that can move smoothly in a direction perpendicular to the direction of movement of the square glass substrate W, and formed on the square glass substrate W The complicated non-circuit pattern area Wc to be exposed is exposed.

  Next, the laser beam unit 5 will be described. FIG. 4 is a diagram showing an outline of the laser beam unit 5. As described with reference to FIGS. 1 to 3, the laser beam unit 5 exposes the identification mark M to the non-circuit pattern region Wc of the square glass substrate W with the laser beam. The laser beam unit 5 is supported and fixed by the support frame A1, and has three laser irradiation units 5A. The laser beam irradiated from one laser beam light source is branched, and each of the laser irradiation units 5A is configured to irradiate the three portions of the non-circuit pattern region Wc of the square glass substrate W.

  The laser beam unit 5 is provided with a galvanometer 7c and an F-θ lens 7d capable of changing the angle so that the laser beam output part can irradiate the beam over a wide range, and the laser beam oscillates over a wide range of irradiation. be able to. Therefore, the position and size of the square glass substrate W are compared with preset processing information, and the rectangular glass substrate W is conveyed in the X linear direction by the moving conveyance mechanism 3 while the laser is orthogonal to the conveyance direction. The identification mark M is exposed to the non-circuit pattern area of the square glass substrate W by swinging the beam.

<Configuration of Imaging Device 4 and Reflecting Table XX>
FIG. 5 is a perspective view showing an example of the stage 2 and the imaging device 4 used in the present apparatus. The stage 2 receives imaging illumination light transmitted through the base 2a supported by the moving conveyance mechanism 3, the support pillar 2b erected on the base 2a, and the square glass substrate W and its periphery. Reflecting tables XXa, XXb, and XXc are provided. Since the stage 2 is approximately the same size as the square glass substrate W, the reflecting tables XXa, XXb, and XXc are provided on the outer surface of the stage 2. Two reflecting stands XXa and XXb are provided at a predetermined interval on one side 2aa of the base 2a, and one reflecting stand XXc is provided on a side 2bb orthogonal to the one side 2aa. The longer the interval between the reflectors XXa and XXb, the better the alignment. However, when the size of the square glass substrate W is 2160 mm × 2460 mm or 2400 mm × 2800 mm, the interval between the reflectors XXa and XXb is set to a smaller interval of 2460 mm or less, for example, an interval of 2000 mm.

  The reflecting tables XXa, XXb, and XXc are made by attaching an aluminum plate having a mirror-finished surface to a steel material. Moreover, you may affix the board which vapor-deposited aluminum on the glass surface to steel materials. Both are configured to reflect the irradiated light well.

  As shown in FIG. 2, above the reflecting tables XXa, XXb, and XXc, at the position facing the reflecting tables XXa and XXb and from the upper side of the rectangular glass substrate W, the edge of one side of the rectangular glass substrate W The first imaging devices 4a and 4b are installed in order to image the two positions. In addition, the second imaging device 4c is installed in order to image one position of the edge of the other side of the square glass substrate W from the upper side of the square glass substrate W at a position facing the reflection table XXc. Yes. In other words, the reflectors XXa, XXb, and XXc are arranged on the outer peripheral side surface of the base 2a of the stage 2 so as to correspond to the positions of the imaging devices 4a, 4b, and 4c. A right angle is added on the extension axis.

  The first imaging devices 4a and 4b and the second imaging device 4c are appropriately movable in the X direction and the Y direction by a guide rail (not shown) on the support frame A1. This is because it can be changed in accordance with the substrate size. The first imaging devices 4a and 4b and the second imaging device 4c incorporate a CCD camera or the like as an imaging unit and an illumination device.

  The lighting device mainly uses red light. Since the wavelength at which the illumination device is lit is related to the sensitivity of the photoresist ink, it may be a green light or a yellow light depending on the type of the photoresist ink. Therefore, when two or more types of photoresist ink are used, a light source having two or more wavelengths is prepared for each of the first imaging devices 4a and 4b and the second imaging device 4c. It is also possible to switch between three colors of red light, green light and yellow light according to the type of photoresist ink. By doing so, it is possible to improve the image processing accuracy of the first imaging devices 4a, 4b and the second imaging device 4c in accordance with the photoresist ink. Of course, if only the square glass substrate W coated with one kind of photoresist ink is carried into the apparatus, a light source having a predetermined wavelength is prepared.

  In addition, the image processing accuracy of the first imaging devices 4a and 4b and the second imaging device 4c is improved by changing the shape of the light source according to the type of the photoresist ink instead of changing the wavelength of the light source. Can do. For example, there are three types of light source shapes for irradiating a ring-shaped light beam, a linear (line-shaped) light, or a spot-shaped (spot-shaped) light. Switch the lamp. In order to irradiate a circular light beam, a lamp is attached in a ring shape so as to be in close contact with the periphery of the lens system of the imaging devices 4a, 4b, and 4c. Further, a lamp is attached to the outer frame of the lens system of the imaging devices 4a, 4b, and 4c in order to irradiate linear light or dot light. Thereby, the wavelength of the irradiation light and the shape of the irradiation light can easily cope with the kind of the photoresist ink, the variation in the dimensional accuracy of the square glass substrate W, and the like. The arrangement positions of the imaging devices 4a, 4b, and 4c are set according to the shape of the square glass substrate W to be placed. Of course, if only the square glass substrate W coated with one kind of photoresist ink is carried into the apparatus, a predetermined light source shape is prepared.

  Note that various combinations of a plurality of wavelengths and a plurality of light source shapes are possible depending on the photoresist ink. For example, in the case of a process using two types of photoresist ink, a red lamp-shaped illumination and a green lamp linear illumination are prepared.

<Control of identification mark / peripheral exposure device>
FIG. 6 is a block diagram showing the control mechanism 20 of the present apparatus. The configuration of the control mechanism 20 will be described with reference to FIG. The apparatus includes image processing circuit units 100A and 100B, an image pickup apparatus 4, a laser beam unit 5, an ultraviolet irradiation unit 9, various processors 108 for controlling the moving conveyance mechanism 3, a storage unit 31 (ROM), and the like. Yes.

  The input means 21 to the control mechanism 20 is for inputting product type data and the like of the square glass substrate W. The type data input here includes the size of the square glass substrate W, the size and position of the pattern region Wp, the size and position of the peripheral region Wc, the type, size, and exposure of the identification mark M (character, symbol, figure, etc.). Position, exposure illuminance and exposure speed, exposure illuminance (laser beam and ultraviolet light) in the peripheral area Wc (one linear direction and the other linear direction), and the like. These product type data are inputted in advance from the input means 21 and stored in the storage means 31. In the apparatus 1, necessary data such as the exposure position, exposure speed, and exposure illuminance of the laser beam unit 5 are input in advance from the input unit 21 and stored in the storage unit 31. Further, data necessary for the peripheral exposure work of the non-circuit pattern region Wc, such as exposure illuminance per unit area of the ultraviolet irradiation unit 9, is input in advance from the input unit 21 and stored in the storage unit 31. In addition, a predetermined pattern is stored in the storage unit 31 as data in advance through the input unit for comparison with an image pattern captured from the imaging apparatus.

  The position detection means 24 is a general term for position sensors that detect the position of the substrate, the position of the imaging device, the position of the laser beam unit 5, the ultraviolet irradiation unit 9, the movable transport mechanism 3, the stage 2, and the like. The position detection unit 24 detects the positions of these parts and inputs them to the control mechanism 20. Image patterns captured by the imaging devices 4a and 4b are input to the control mechanism 20 via the image processing circuit unit 100A, and image patterns captured by the imaging device 4c are input to the control mechanism 20 via the image processing circuit 100B. The image processing circuit unit 100A performs digital image processing including a comparison circuit that compares the image pattern captured by the imaging device 4a with the image pattern captured by the imaging device 4b, and the image processing circuit 100B is captured by the imaging device 4c. Digital image processing is performed on the obtained image pattern. The image data captured by the CCD camera of the imaging device 4 is 30 μm / pixel, and this data is decomposed into 1/10 by the image processing circuit units 100A and 100B.

<Operation of this device>
Next, the operation of the above-described apparatus will be described with reference to FIGS. A square glass substrate W is placed on a support column 2 b erected on the base 2 a of the stage 2. This square glass substrate W is transported in advance while controlling the posture and position in the second half of the transport path leading to this apparatus. When the apparatus finally reaches the apparatus, the square glass substrate W is pre-aligned with respect to the stage 2 so that both the angle and the stop position are in a range of slight deviation. Therefore, the square glass substrate W is placed on the stage 2 with a very slight displacement with respect to the normal placement position by a robot hand (not shown). When placed on the stage 2, the square glass substrate W is fixed by vacuum suction at the suction opening of the support column 2 b of the stage 2.

  When the square glass substrate W is vacuum-sucked on the stage 2, the sensor of the position detection unit 24 detects the position of the square glass substrate W and drives the movement guide mechanism 3 </ b> A via the control mechanism 20. When the square glass substrate W arrives at the specified position, the movement guide mechanism 3A stops the movement of the stage 2. In the control mechanism 20, each illumination attached to the imaging devices 4a, 4b, and 4c is turned on.

  When the illumination light for imaging is irradiated onto the square glass substrate W, the reflectors XXa, XXb, and XXc are divided into an area where the square glass substrate W is attached above the stage 2 and an area where the square glass substrate W is not attached. The amount of light that arrives is different. That is, the amount of light that reaches the reflectors XXa, XXb, and XXc through the square glass substrate W is attenuated by the presence of the square glass substrate W. In addition, the illumination light that is reflected by the reflecting tables XXa, XXb, and XXc and reaches the imaging devices 4a, 4b, and 4c is transmitted through the square glass substrate W again. For this reason, the amount of light is attenuated in the region where the square glass substrate W is mounted, and the amount of light is not attenuated in the region where the square glass substrate W is not mounted.

  FIG. 7 is a view of the rectangular glass substrate W placed on the stage 2 with an angle θ on the XY plane as viewed from above. FIG. 8 is a schematic diagram showing an image pattern of the square glass substrate W and the reflection table XX captured by the imaging device 4 in the state of FIG. FIG. 9 is a schematic diagram showing an image pattern in a state in which the square glass substrate W has arrived at a regular position from the state of FIG.

  As shown in FIG. 7, when the square glass substrate W is displaced from the stage 2 by a small angle θ, the image pattern of FIG. 8A is captured by the imaging device 4b. That is, the illumination light directly reaching the reflecting table XXb is reflected there and returns to the imaging device 4b. The captured pattern is schematically shown as an image R11. On the other hand, the illumination light transmitted through the edge of the square glass substrate W and reflected by the reflecting table XXb is further attenuated by the square glass substrate W and returns to the imaging device 4b. The captured pattern is schematically shown as an image R12. It can be seen that the ratio of the reflected light and transmitted light from the square glass substrate W and the distribution of the received light are nonuniform patterns.

  Further, the illumination light directly reaching the reflecting table XXa is reflected there and returns to the imaging device 4a. The pattern imaged in FIG. 8B is schematically shown as an image R21. On the other hand, the illumination light transmitted through the edge of the square glass substrate W and reflected by the reflecting table XXa is further attenuated by the square glass substrate W and returns to the imaging device 4a. The captured pattern is schematically shown as an image R22. The overall pattern of the imaging result is also determined as a non-uniform result. Here, an image of the side WAA at the edge of the square glass substrate W is defined as a peripheral image.

  Furthermore, the illumination light directly reaching the reflecting table XXc is reflected there and returns to the imaging device 4c. FIG. 8C schematically shows the imaged pattern as an image R31. On the other hand, the illumination light transmitted through the edge of the square glass substrate W and reflected by the reflecting table XXc is further attenuated by the square glass substrate W and returns to the imaging device 4c. The imaged pattern is schematically shown as an image R32. Here, the image of the side WBB at the edge of the square glass substrate W is set as the other peripheral image.

  The image patterns of the imaging device 4a and the imaging device 4b are compared with the ideal image pattern input in advance by the image processing circuit 100A, and the comparison result is transmitted to the control mechanism 20. In this control mechanism 20, the built-in processor 108 calculates information for driving the rotation direction (θ direction) in the horizontal plane of the square glass substrate W via the movement guide mechanism 3C based on the comparison result. The calculated result is sent to the third movement guide mechanism 3C to drive the third movement guide mechanism 3C. By this driving, the square glass substrate W rotates, and an image corresponding to this rotation is taken into the imaging device 4a and the imaging device 4b. The frequency of capturing an image ranges from 10 msec / screen to 60 msec / screen. Then, as shown in FIGS. 9A and 9B, the square glass substrate W is driven in the horizontal plane by the moving guide mechanism 3C until the image R11, the image R1, the image R21, and the image 22 substantially coincide with the previously input information. Is done. When both the images match the reference information input in advance, the image processing circuit 100A detects the match, and the control mechanism 20 stops the rotation drive of the movement guide mechanism 3C. In this state, the edge WAA at the edge of the square glass substrate W arrives at a specified position, and the square glass substrate W is aligned at least in the Y direction in FIG.

  With the square glass substrate W aligned in the Y direction, the image processing circuit 100B moves the first movement guide mechanism 3A in the X direction until the image captured by the imaging device 4c matches the reference information input in advance. To drive. That is, as shown in FIG. 9c, the recognition of whether or not the image R31 and the image R32 match can be compared and determined by referring to data preset in the control mechanism 20. The alignment accuracy depends on the magnification of the imaging device 4 and the control accuracy of the third movement guide mechanism 3C, but is about 0.05 μm in this device.

  In this manner, the square glass substrate is obtained by a command from the control mechanism 20 based on the position of the square glass substrate W obtained by calculating the image data acquired by the imaging device 4 and the external dimensions of the square glass substrate W. Alignment work of the rotation direction in the horizontal plane of W and the position in the same X direction as the attachment of the square glass substrate W is relatively performed.

  Up to now, the reflectors XXa, XXb, and XXc have been attached to the outer surface of the stage 2. However, when the square glass substrate W is smaller than the stage 2, for example, 2160 mm × 2460 mm, the fixed columns 2 d are placed on the surface of the stage 2 on the reflection table XXa, XXb, XXc and near the outer periphery of the square glass substrate W. At the same time, the imaging devices 4a, 4b, and 4c are moved to corresponding positions to obtain the same information as described above, and the alignment operation can be executed.

  In addition, a moving mechanism that moves the reflecting tables XXa, XXb, and XXc from a position that matches the small square glass substrate W to the outside of the stage 2 may be provided. The reflectors XXa and XXb are movable in the Y direction by linear motors extending in the Y direction. The reflecting table XXc is movable in the X direction by a linear motor extending in the X direction. The imaging devices 4a, 4b, and 4c can be moved in the same manner to perform alignment work.

  Next, the moving transport mechanism 3 that has completed the alignment work of the square glass substrate W confirms the position from the end of the stroke of the moving transport mechanism 3 from the position information of the first moving guide mechanism 3A, and the non-circuit pattern region. Move to the position to mark the identification mark of Wc. At this time, the square glass substrate W is moved in the X direction after being put into the apparatus 1, and the distance from the reference position of the square glass substrate W and the moving conveyance position of the first movement guide mechanism 3A are set. While comparing, the position where the identification mark of the square glass substrate W is marked is confirmed.

  The square glass substrate W conveyed to the position for marking the identification mark by the first movement guide mechanism 3A is transferred to the galvanometer described above by the laser beam unit 5 while conveying the square glass substrate W in the uniaxial direction of the conveyance mechanism 3. The laser beam is oscillated in the direction orthogonal to the transport direction by 7c and the F-θ lens 7d. Thereby, the identification mark M1 of the non-circuit pattern region Wc of the square glass substrate W is marked. In FIG. 4, three laser irradiation units 5A are provided. When there are only two rows of the identification marks M1 in the vertical direction as shown in FIG. 1, the central laser irradiation unit 5A is stopped.

  Further, the control mechanism 20 controls the control shutter mechanism 10 so that the identification mark M1 is not exposed to the ultraviolet light from the ultraviolet irradiation unit 9. The control is performed by the control mechanism 20 confirming that the square glass substrate W has reached the specified position by the output of the position sensor 200. On the other hand, the non-circuit pattern area Wc other than the identification mark M <b> 1 is exposed with ultraviolet light from the ultraviolet irradiation unit 9. This exposure is performed by the control output of the control mechanism 20 driven by the output of the position sensor 200. When the marking of the identification mark M1 in the X linear direction of the square glass substrate W and the non-circuit pattern region Wc are exposed, the square glass substrate W is moved to the third movement guide at either the movement end or the movement start end. It is rotated 90 degrees by mechanism 3C. Similarly, the identification mark M2 is marked in the non-circuit pattern region Wc of the square glass substrate W, and the remaining non-circuit pattern region Wc is exposed. As shown in FIG. 1, since there are three rows of identification marks M2 in the horizontal direction, all three laser irradiation units 5A are operated. In this way, the exposure for all the non-circuit pattern areas Wc of the square glass substrate W is completed.

  The moving position (laser beam irradiation start position) and moving speed in the laser beam irradiation of the square glass substrate W based on the received position data of the square glass substrate W and the type data of the square glass substrate W. Further, the calculation of the moving position and the moving speed when the square glass substrate W is rotated 90 degrees is appropriately performed under the control of the control mechanism 20. For example, it conveys to the head position of the identification mark in the non-circuit pattern area Wc of the square glass substrate W. This leading position is a position corresponding to the position immediately below the laser beam unit 5. When the square glass substrate W is transported to the head position, the square glass substrate W is moved at a predetermined speed, and the laser beam unit 5 is operated to irradiate the laser beam from each laser beam head 5A to thereby identify the identification mark M. Shall be marked sequentially.

  When the peripheral exposure of the non-circuit pattern region Wc of the square glass substrate W is completed, the square glass substrate W is the unillustrated unloading side formed on the moving terminal side of the square glass substrate W or the square glass substrate. It is carried out by the robot hand from the carry-in side where W is carried. Then, a new square glass substrate W is carried in, and by repeating the steps described so far, the marking of the identification mark M in the non-circuit pattern area of the square glass substrate W and the peripheral exposure of the non-circuit pattern area are performed. .

  Although the description has been made on the assumption that the rectangular glass substrate W is rectangular, the present invention can be applied to any rectangular substrate having a linear portion such as a trapezoid or a hexagon. Further, a plastic substrate may be used instead of the glass substrate. Furthermore, in the alignment, the three reflecting tables XX and the three imaging devices 4 are used, but it is possible to provide four or more. Further, various methods can be adopted for the digital image processing by the image processing circuit.

It is a top view which shows an example of the board | substrate used with this apparatus which concerns on this invention. It is sectional drawing which abbreviate | omits a part of this apparatus which concerns on this invention, and shows the inside of an apparatus typically from a side surface direction. It is sectional drawing which abbreviate | omits a part of this apparatus which concerns on this invention, and shows the inside of an apparatus from a back direction typically. It is a block diagram which shows the laser control mechanism of the laser beam unit of this apparatus which concerns on this invention. It is a perspective view which shows a part of board | substrate and stage of this apparatus which concerns on this invention, and a moving mechanism. It is a block diagram which shows the control mechanism of this apparatus which concerns on this invention. It is a top view which shows the board | substrate mounted in the stage with the angle of (theta). It is the schematic diagram by which the image pattern of the board | substrate and reflection stand which were taken in with the imaging device in the state of FIG. 7 was shown. FIG. 8 is a schematic diagram illustrating an image pattern of a substrate and a reflection table captured by the imaging apparatus in a state where the substrate has arrived at a proper position from the state of FIG. 7.

Explanation of symbols

1. Identification mark / peripheral exposure device (this device)
2 ... Stage 2a ... Base 2b ... Support pillar
3 ... Moving conveyance mechanism 3A ... 1st movement guide mechanism 3A ... 3rd movement guide mechanism
3C ... 3rd movement guide mechanism 3a ... Linear motor 3b ... Moving rail 4 ... Imaging device 5 ... Laser beam unit 5A ... Laser irradiation unit 9 ... Ultraviolet irradiation unit 10 ... Irradiation area adjustment shutter mechanism 12 ... Movement mechanism 15 ... Laser beam unit 20 ... Control mechanism 21 ... Input means
24. Position detecting means
31 ... Storage means 100A, 100B ... Image processing circuit 108 ... Processor A1 ... Support frame B1 ... Second frame body M ... Identification mark W ... Substrate Wp ... Pattern area Wc ... Non-circuit pattern area

Claims (6)

An alignment device that corrects a small misalignment of a square substrate on a two-dimensional plane and transports the square substrate to an exposure apparatus,
A stage that holds the pre-aligned square substrate, rotates about an axis orthogonal to the two-dimensional plane, and moves in a first direction in the two-dimensional plane;
A first imaging device that images two locations arranged at positions apart from each other on the periphery of one side of the square substrate and outputs peripheral images of the two locations;
A second imaging device that captures an image of one edge of the other side that intersects the one side, and outputs an image of the other edge of the one point;
An image processing circuit for confirming whether or not the peripheral image and the other peripheral image coincide with images stored in advance ;
The stage is rotated when the peripheral image and the corresponding pre-stored image do not match, and the stage is rotated when the other peripheral image does not match the corresponding pre-stored image A control unit for moving the device in the first direction;
An alignment apparatus comprising: 2. The alignment apparatus according to claim 1, wherein a reflecting stand for reflecting light is provided at two positions arranged at the separated positions and one position at a peripheral edge of the other side. The exposure apparatus according to claim 2, wherein the reflecting table is movable according to the size of the square substrate. 4. The lighting device according to claim 1, further comprising: an illumination device that irradiates light at two positions arranged at the separated positions and at one position of the peripheral edge of the other side. The alignment apparatus according to one item.
The illumination device includes a light source having a first wavelength and a light source having a second wavelength different from the first wavelength,
The alignment apparatus according to claim 4, wherein the light source having the first wavelength and the light having the second wavelength are switched according to a photoresist ink. In an exposure apparatus for moving the square substrate along a movement path and forming a circuit pattern in a pattern region of the square substrate,
An alignment apparatus according to any one of claims 1 to 5,
A laser beam unit that is provided above the square substrate and that irradiates a non-circuit pattern area that does not form the circuit pattern with a laser beam and marks an identification mark;
An ultraviolet irradiation unit provided at a position adjacent to the laser beam unit and above the square substrate and irradiating the non-circuit pattern region with ultraviolet light;
Moving means for moving the ultraviolet irradiation unit in a direction perpendicular to the first direction;
With
An exposure apparatus characterized in that, after the square substrate is moved to a predetermined position by the control of the alignment apparatus, the periphery of the square substrate is moved to the lower surface of the laser beam unit and the lower surface of the ultraviolet irradiation unit.