[go: up one dir, main page]

JP2006313868A - Solid-state imaging device, its manufacturing method, and semiconductor storage package - Google Patents

Solid-state imaging device, its manufacturing method, and semiconductor storage package Download PDF

Info

Publication number
JP2006313868A
JP2006313868A JP2005177656A JP2005177656A JP2006313868A JP 2006313868 A JP2006313868 A JP 2006313868A JP 2005177656 A JP2005177656 A JP 2005177656A JP 2005177656 A JP2005177656 A JP 2005177656A JP 2006313868 A JP2006313868 A JP 2006313868A
Authority
JP
Japan
Prior art keywords
seal
panel
imaging device
solid
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005177656A
Other languages
Japanese (ja)
Other versions
JP4882286B2 (en
Inventor
Naoki Matsushita
直樹 松下
Masahiko Yugawa
昌彦 湯川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2005177656A priority Critical patent/JP4882286B2/en
Publication of JP2006313868A publication Critical patent/JP2006313868A/en
Application granted granted Critical
Publication of JP4882286B2 publication Critical patent/JP4882286B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solid-state imaging device capable of being downsized. <P>SOLUTION: An external extraction terminal 24 is provided at portions 222a and 222b corresponding to one of pairs of two opposite sides of a rectangular seal surface 222 extending to surround an imaging element storage 221 provided on a rectangular package body 22. A spacer 223 for determining a distance between the seal surface 222 and a seal panel 23 is provided at portions 222c and 222d corresponding to the other pair of two opposite sides of the seal surface 222. A bonding pad 212 of an imaging element 21 stored in the storage 221 and the external extraction terminal 24 are connected via a bonding wire 25. In this state, an adhesive 26 is applied on the seal surface 222 and the upper surface of the spacer 223 including the terminal 24 and the bonding wire 25 connected with it, and the seal panel 23 is airtightly stuck to the package body 22 via the adhesive 26. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、ＣＭＯＳイメージセンサのような撮像素子をパッケージ内に収容し、シールパネルにより気密に封止してなる固体撮像装置及びその製造方法並びにイメージセンサを含めたＬＳＩなどの半導体素子を封止状態に収容する半導体収容パッケージに関し、特にパッケージの小型化を可能にした固体撮像装置及びその製造方法並びに半導体収容パッケージに関する。   The present invention encapsulates an image sensor such as a CMOS image sensor in a package and hermetically seals it with a seal panel, a manufacturing method thereof, and a semiconductor element such as an LSI including the image sensor. More particularly, the present invention relates to a solid-state imaging device that enables downsizing of the package, a method for manufacturing the same, and a semiconductor housing package.

従来の固体撮像装置について、図１４〜図１７を参照して説明する。
図１４〜図１６において、固体撮像装置１は撮像素子２とパッケージからなり、撮像素子２は矩形状を呈し撮像面2ａを有しており、パッケージは、撮像素子２を収容するパッケージ本体３と、このパッケージ本体３内の撮像素子２を気密状態に封じ込める透明なシールパネル４とを備えている(特許文献１参照)。 A conventional solid-state imaging device will be described with reference to FIGS.
14 to 16, the solid-state imaging device 1 includes an imaging element 2 and a package. The imaging element 2 has a rectangular shape and has an imaging surface 2a. The package includes a package body 3 that accommodates the imaging element 2. And a transparent seal panel 4 that encloses the image sensor 2 in the package body 3 in an airtight state (see Patent Document 1).

パッケージ本体３は、図１４〜図１７に示すように、撮像素子２の外周形状に対応する矩形状を呈するとともに撮像素子２の厚さに相当する深さを有する上面が開放された凹状の収容部３ａを有し、この収容部３ａ内には撮像素子２が埋没状態に収容されている。また、収容部３ａの開放側に位置するパッケージ本体３の上面周縁部には所定の高さと所定の幅を有する接着用突部３ｂがパッケージ本体３の全周に亘り形成されている。この接着用突部３ｂは撮像素子２と透明なシールパネル４との間の間隔を決定するものである。また、接着用突部３ｂの上面にはシールパネル４が接着剤８により気密に接着されている。また、接着用突部３ｂと収容部３ａとの間に位置するパッケージ本体３の上面箇所には、接着用突部３ｂの高さより低くした所定の幅を有する端子配設部３ｃが収容部３ａの周囲を囲むように形成され、この端子配設部３ｃの上面には、多数の外部引出し用端子（例えば、インナーリード）５が端子配設部３ｃの長手方向に沿って所定の間隔で設けられている。また、各外部引出し用端子５とこれに相対向するようにして撮像素子２の撮像面２ａの周囲箇所に設けられた各ボンディングパッド６との間はボンディングワイヤ７によりそれぞれ接続されている。
特開２００２−５７３１１ As shown in FIGS. 14 to 17, the package main body 3 has a rectangular shape corresponding to the outer peripheral shape of the image pickup device 2 and has a concave shape with an open upper surface having a depth corresponding to the thickness of the image pickup device 2. The image pickup device 2 is housed in an embedded state in the housing portion 3a. In addition, bonding protrusions 3b having a predetermined height and a predetermined width are formed over the entire periphery of the package body 3 at the peripheral edge of the upper surface of the package body 3 located on the open side of the housing portion 3a. The bonding projection 3b determines the distance between the image sensor 2 and the transparent seal panel 4. In addition, the seal panel 4 is hermetically bonded to the upper surface of the bonding projection 3 b with an adhesive 8. Further, a terminal arrangement portion 3c having a predetermined width lower than the height of the bonding projection 3b is provided on the upper surface portion of the package body 3 located between the bonding projection 3b and the housing 3a. A large number of external lead terminals (for example, inner leads) 5 are provided on the upper surface of the terminal arrangement portion 3c at predetermined intervals along the longitudinal direction of the terminal arrangement portion 3c. It has been. Further, each external lead-out terminal 5 is connected to each bonding pad 6 provided around the image pickup surface 2a of the image pickup device 2 so as to face each other by a bonding wire 7.
JP 2002-57311 A

このような従来の固体撮像装置においては、シールパネル４が撮像素子２の撮像面２ａなどに接触しないように撮像素子２に対するシールパネル４の離間間隔を一定に保持するため、及びシールパネル４によるパッケージの気密性を確保するために収容部３ａの開放側であるパッケージ本体３の上面周縁箇所に所定の高さと所定の幅を有する接着用突部３ｂを設け、この接着用突部３ｂによりシール幅ｄ１を確保し、かつ接着剤８の厚さｄ２を適性に設定することでパッケージ本体３及びシールパネル４のヒートサイクルや耐湿性、気密性などの信頼性を満足させている。   In such a conventional solid-state imaging device, the separation distance of the seal panel 4 from the image sensor 2 is kept constant so that the seal panel 4 does not contact the imaging surface 2a of the image sensor 2, and the like. In order to ensure the hermeticity of the package, a bonding protrusion 3b having a predetermined height and a predetermined width is provided at a peripheral portion of the upper surface of the package main body 3 on the open side of the housing portion 3a, and the bonding protrusion 3b is used to seal the package. By ensuring the width d1 and setting the thickness d2 of the adhesive 8 appropriately, the package body 3 and the seal panel 4 are satisfied with reliability such as heat cycle, moisture resistance, and airtightness.

しかしながら、上述する従来の固体撮像装置では、外部引出し用端子５を設けるための端子配設部３ｃが接着用突部３ｂと収容部３ａとの間に位置するパッケージ本体３の上面箇所に設けられているため、この接着用突部３ｂの幅寸法に相当する分パッケージ本体３の外形寸法が大きくなり、コスト高になるほか、固体撮像装置自体の小型化が望めない。その結果、小型携帯機器などへの実装に支障を来たすという問題がある。   However, in the above-described conventional solid-state imaging device, the terminal arrangement portion 3c for providing the external lead-out terminal 5 is provided on the upper surface portion of the package body 3 located between the bonding projection 3b and the accommodating portion 3a. Therefore, the outer dimension of the package body 3 corresponding to the width dimension of the bonding projection 3b is increased, the cost is increased, and the solid-state imaging device itself cannot be reduced in size. As a result, there is a problem that the mounting on a small portable device or the like is hindered.

本発明は、このような事情に鑑みなされたものであり、その目的は、小型化を可能にした固体撮像装置及びその製造方法並びに半導体収容パッケージを提供することにある。   The present invention has been made in view of such circumstances, and an object of the present invention is to provide a solid-state imaging device, a manufacturing method thereof, and a semiconductor housing package that can be reduced in size.

上記目的を達成するために本発明の固体撮像装置は、撮像素子と、パッケージ本体と、シールパネルとを備え、前記撮像素子は、扁平板状を呈し、かつ撮像面が設けられた上面と、前記上面の周縁部に設けられた複数のボンディングパッドとを有し、前記パッケージ本体は、前記撮像面を上に向けて前記撮像素子が収容される収容部と、前記収容部を囲むように延在するシールパネル接合用のシール面とを有し、前記シールパネルは前記シール面に接合可能で前記撮像素子の上面を覆うように形成され、前記撮像素子と外部との電気的接続を行う複数の外部引出し用端子が前記シール面に設けられ、前記ボンディングパッドと前記外部引出し用端子とが導体により接続され、前記シール面と前記シールパネルとの間に接着剤を介して両者が気密に接着されることで前記撮像素子は前記パッケージ本体内に封入されていることを特徴とする。   In order to achieve the above object, a solid-state imaging device of the present invention includes an imaging device, a package body, and a seal panel, and the imaging device has a flat plate shape and is provided with an imaging surface. A plurality of bonding pads provided on a peripheral edge of the upper surface, and the package body extends so as to surround the housing portion with a housing portion for housing the imaging element with the imaging surface facing upward. A plurality of sealing panels for joining the sealing panel, the sealing panel being formed so as to be able to be joined to the sealing surface and covering the upper surface of the imaging device, and for making an electrical connection between the imaging device and the outside. The external lead terminal is provided on the seal surface, the bonding pad and the external lead terminal are connected by a conductor, and both are connected via an adhesive between the seal surface and the seal panel. The imaging device by being adhered to is characterized in that it is encapsulated in the package body.

また、本発明にかかる固体撮像装置の製造方法は、撮像素子と、パッケージ本体と、シールパネルとを備え、前記撮像素子は、扁平板状を呈し、かつ撮像面が設けられた上面と、前記上面の周縁部に設けられた複数のボンディングパッドとを有し、前記パッケージ本体は、前記撮像面を上に向けて前記撮像素子が収容される収容部と、前記収容部を囲むように延在するシールパネル接合用のシール面とを有し、前記シールパネルは前記シール面に接合可能で前記撮像素子の上面を覆うように形成され、前記撮像素子と外部との電気的接続を行う複数の外部引出し用端子が前記シール面に設けられ、前記収容部に前記撮像素子を収容し、前記ボンディングパッドと前記外部引出し用端子とを導体により接続し、前記シール面と前記シールパネルとの間の間隔をスペーサにより決定した状態で前記シール面と前記シールパネルとの間に接着剤を介して両者を気密に接着し、前記撮像素子を前記パッケージ本体内に封入するようにしたことを特徴とする。   In addition, a method for manufacturing a solid-state imaging device according to the present invention includes an imaging element, a package body, and a seal panel. The imaging element has a flat plate shape and is provided with an imaging surface. A plurality of bonding pads provided on a peripheral edge portion of the upper surface, and the package body extends to surround the housing portion, a housing portion for housing the imaging element with the imaging surface facing upward A sealing surface for joining the sealing panel, and the sealing panel is formed to cover the top surface of the imaging element so that the sealing panel can be joined to the sealing surface, and a plurality of electrical connections are made between the imaging element and the outside. An external lead terminal is provided on the seal surface, the image pickup device is housed in the housing portion, the bonding pad and the external lead terminal are connected by a conductor, and the seal surface and the seal panel In a state where the distance between the two is determined by a spacer, both of the sealing surface and the sealing panel are hermetically bonded via an adhesive, and the imaging element is sealed in the package body. Features.

また、本発明にかかる半導体収容パッケージは、パッケージ本体と、シールパネルとを備え、前記パッケージ本体は、半導体素子が収容される収容部と、前記収容部を囲むように延在するシールパネル接合用のシール面とを有し、前記シールパネルは前記シール面に接合可能で前記撮像素子の上面を覆うように形成され、前記半導体素子と外部との電気的接続を行う複数の外部引出し用端子が前記シール面に設けられ、前記シールパネルを前記シール面に接着剤を介して気密に接着することにより前記収容部を封止するように構成されていることを特徴とする。   According to another aspect of the present invention, there is provided a semiconductor housing package including a package body and a seal panel, the package body for housing a semiconductor element and a seal panel extending so as to surround the housing portion. The seal panel is formed so as to be able to be joined to the seal surface and cover the upper surface of the imaging element, and a plurality of external lead terminals for electrical connection between the semiconductor element and the outside. It is provided on the sealing surface, and is configured to seal the accommodating portion by airtightly bonding the sealing panel to the sealing surface via an adhesive.

本発明の固体撮像装置によれば、撮像素子の収容部を囲むように延在するシール面に設けた外部引出し用端子と撮像素子のボンディングパッドとを導体により接続し、このシール面とシールパネルとの間に接着剤を介して両者を気密に接着するように構成したので、シール面がシールパネルとパッケージ本体との接着部位及び撮像素子との電気的接合部位を兼ねることになり、専用の撮像素子との電気的接合スペースを削減できる。これにより、パッケージのサイズが減少し、固体撮像装置を小型化できる。   According to the solid-state imaging device of the present invention, the external lead-out terminal provided on the seal surface extending so as to surround the image sensor housing portion and the bonding pad of the image sensor are connected by the conductor, and the seal surface and the seal panel Since the two are hermetically bonded to each other via an adhesive, the sealing surface also serves as an adhesion site between the seal panel and the package body and an electrical junction site with the image sensor. The space for electrical connection with the image sensor can be reduced. Thereby, the size of the package is reduced, and the solid-state imaging device can be miniaturized.

また、本発明にかかる固体撮像装置の製造方法によれば、撮像素子の収容部を囲むように延在するシール面に設けた外部引出し用端子と撮像素子のボンディングパッドとを導体により接続し、シール面と前記シールパネルとの間の間隔をスペーサにより決定した状態でシール面とシールパネルとの間に接着剤を介して両者を気密に接着するように構成したので、シール面がシールパネルとパッケージ本体との接着部位及び撮像素子との電気的接合部位を兼ねることになり、専用の撮像素子との電気的接合スペースを削減できる。これにより、パッケージのサイズが減少し、固体撮像装置を小型化できる。   Further, according to the method for manufacturing a solid-state imaging device according to the present invention, the external lead-out terminal provided on the seal surface extending so as to surround the image sensor housing portion and the bonding pad of the image sensor are connected by a conductor, Since the gap between the seal surface and the seal panel is determined by the spacer and the seal surface and the seal panel are configured to be air-tightly bonded to each other via an adhesive, the seal surface is separated from the seal panel. It also serves as an adhesion site with the package body and an electrical junction site with the image sensor, and an electrical junction space with a dedicated image sensor can be reduced. Thereby, the size of the package is reduced, and the solid-state imaging device can be miniaturized.

また、本発明の半導体収容パッケージによれば、半導体素子が収容される収容部を囲むように延在してパッケージ本体に設けたシール面に半導体素子と外部との電気的接続を行う外部引出し用端子を設け、かつシール面にシールパネルを接着剤により気密に接着して収容部を封止するように構成したので、シール面がシールパネルとパッケージとの接着部位及び撮像素子との電気的接合部位を兼ねることになり、専用の半導体素子との電気的接合スペースを削減できる。これにより、パッケージのサイズが減少し、半導体装置を小型化できる。   Further, according to the semiconductor housing package of the present invention, the external lead for electrically connecting the semiconductor element and the outside to the seal surface provided on the package body extending so as to surround the housing portion for housing the semiconductor element. Since the terminal is provided and the sealing panel is hermetically bonded to the sealing surface with an adhesive to seal the housing portion, the sealing surface is an electrical connection between the sealing panel and the package and the image sensor. It also serves as a part, and the space for electrical connection with a dedicated semiconductor element can be reduced. Thereby, the size of the package is reduced, and the semiconductor device can be miniaturized.

（実施の形態１）
以下、本発明の実施の形態１について図面を参照して説明する。
図１は本実施の形態１における固体撮像装置の平面図であり、図２は図１のＡ−Ａ線に沿う断面図であり、図３は図１のＢ−Ｂ線に沿う断面図である。 (Embodiment 1)
Embodiment 1 of the present invention will be described below with reference to the drawings.
1 is a plan view of the solid-state imaging device according to the first embodiment, FIG. 2 is a cross-sectional view taken along line AA in FIG. 1, and FIG. 3 is a cross-sectional view taken along line BB in FIG. is there.

実施の形態１に示す固体撮像装置２０は、図１〜図３に示すように、撮像素子２１とパッケージからなり、パッケージは、パッケージ本体２２とシールパネル２３を備える。
撮像素子２１は、矩形でかつ扁平な板状を呈し、その上面には矩形状の撮像面２１１が設けられている。また、撮像素子２１の上面の矩形状四周縁部、すなわち互いに向かい合う一方の２辺に対応する周縁部２１ａ，２１ｂには、複数のボンディングパッド２１２が所定の間隔をおいてそれぞれ設けられている。 The solid-state imaging device 20 shown in Embodiment 1 includes an imaging element 21 and a package as shown in FIGS. 1 to 3, and the package includes a package body 22 and a seal panel 23.
The imaging element 21 has a rectangular and flat plate shape, and a rectangular imaging surface 211 is provided on the upper surface thereof. In addition, a plurality of bonding pads 212 are provided at predetermined intervals on the four rectangular peripheral portions on the upper surface of the imaging element 21, that is, peripheral portions 21a and 21b corresponding to one of the two opposing sides.

パッケージ本体２２は、その上面に撮像素子２１が収容されるように矩形状に形成された有底の収容部２２１と、この収容部２２１を一重に囲むように延在する矩形枠状に形成された一定幅を有するシール面２２２とを有している。また、この矩形枠状シール面２２２の互いに向かい合う一方の２辺に対応する箇所、すなわち撮像素子２１のボンディングパッド２１２と対向する箇所２２２ａ，２２２ｂには複数の外部引出し用端子（例えば、インナーリード）２４が所定の間隔をおいてそれぞれ設けられている。さらに、上記矩形状シール面２２２の互いに向かい合う他方の２辺に対応する箇所２２２ｃ，２２２ｄ上には、シール面２２２とシールパネル２３との間にそれらの間隔を決定するスペーサ２２３がシール面２２２上にそれぞれ設けられている。このスペーサ２２３は、シールパネル２３を収容部２２１内の撮像素子２１から所望の間隔離した位置に位置決めするためのものであり、シール面２２２よりも高い高さで形成されている。   The package main body 22 is formed in a rectangular-shaped housing portion 221 formed in a rectangular shape so that the imaging element 21 is housed on the upper surface thereof, and a rectangular frame extending so as to surround the housing portion 221 in a single layer. And a sealing surface 222 having a certain width. In addition, a plurality of external lead terminals (for example, inner leads) are provided at locations corresponding to two opposite sides of the rectangular frame-shaped sealing surface 222, that is, locations 222a and 222b facing the bonding pad 212 of the image sensor 21. 24 are provided at predetermined intervals. Further, spacers 223 for determining the interval between the seal surface 222 and the seal panel 23 are provided on the seal surface 222 on the portions 222 c and 222 d corresponding to the other two sides facing each other of the rectangular seal surface 222. Are provided respectively. The spacer 223 is for positioning the seal panel 23 at a desired distance from the image sensor 21 in the housing portion 221, and is formed at a height higher than the seal surface 222.

上記撮像素子２１は、その撮像面２１１を上に向けて収容部２２１内に収容される。この場合、収容部２２１に収容された撮像素子２１の上面とシール面２２２とはほぼ同一平面上に位置している。また、撮像素子２１の各周縁部２１ａ，２１ｂにおけるボンディングパッド２１２と、これらに対向するパッケージ本体２２の外部引出し用端子２４との間は金線や銅線などのボンディングワイヤ（請求項に記載の導体に相当）２５によってそれぞれ接続されている。
シールパネル２３は、パッケージ本体２２の収容部２２１内に収容された撮像素子２１を密閉状態に封止するためのもので、光が透過できる透明なガラス板材などから構成されている。また、このシールパネル２３は、シール面２２２上の外部引出し用端子２４及びこれに接続されたボンディングワイヤ２５を含むシール面２２２及びスペーサ２２３の上面に塗布した接着剤２６によりパッケージ本体２２に気密にかつ一体に接着されている。この場合、シール面２２２上に位置する外部引出し用端子２４を含むボンディングワイヤ２５の部分は接着剤２６中に埋設されている。これにより、ボンディングワイヤ部分における接着剤の塗布面積を大きくしてシール性能を確実にする。 The imaging element 21 is accommodated in the accommodating portion 221 with the imaging surface 211 facing upward. In this case, the upper surface of the image sensor 21 accommodated in the accommodating portion 221 and the seal surface 222 are located on substantially the same plane. Further, a bonding wire (such as a gold wire or a copper wire) is provided between the bonding pad 212 in each of the peripheral portions 21a and 21b of the image pickup device 21 and the external lead terminal 24 of the package body 22 opposed thereto. (Corresponding to conductors) 25, respectively.
The seal panel 23 is for sealing the image pickup device 21 accommodated in the accommodating portion 221 of the package body 22 in a hermetically sealed state, and is made of a transparent glass plate material that can transmit light. The seal panel 23 is hermetically sealed to the package body 22 by the adhesive 26 applied to the seal surface 222 including the external lead terminals 24 on the seal surface 222 and the bonding wires 25 connected thereto and the spacer 223. And they are bonded together. In this case, the portion of the bonding wire 25 including the external lead terminal 24 located on the seal surface 222 is embedded in the adhesive 26. Thereby, the application area of the adhesive in the bonding wire portion is increased to ensure the sealing performance.

このような本実施の形態１においては、矩形状パッケージ本体２２に設けた収容部２２１を囲むように延在する矩形状シール面２２２の互いに向かい合う一方の２辺に対応する箇所２２２ａ，２２２ｂに外部引出し用端子２４を設けるとともに、シール面２２２とシールパネル２３との間の間隔を決定するスペーサ２２３をシール面２２２の互いに向かい合う他方の２辺に対応する箇所２２２ｃ，２２２ｄ上に設け、収容部２２１に収容された撮像素子２１のボンディングパッド２１２と外部引出し用端子２４とをワイヤボンディング２５により接続し、この状態で、外部引出し用端子２４及びこれに接続されたボンディングワイヤ２５の接続部位を含むシール面２２２及びスペーサ２２３の上面に接着剤２６を塗布し、この接着剤２６によりシールパネル２３をパッケージ本体２２に気密に接着するようにしたので、シール面２２２がシールパネル２３とパッケージ本体２２との接着部位及び撮像素子２１との電気的接合部位を兼ねることになり、従来のような専用の撮像素子との電気的接合スペースを削減できる。これにより、パッケージ本体２２のサイズが減少し、固体撮像装置２０を小型化することができる。   In the first embodiment as described above, the portions 222 a and 222 b corresponding to the two opposite sides of the rectangular seal surface 222 extending so as to surround the accommodating portion 221 provided in the rectangular package body 22 are externally provided. The lead-out terminal 24 is provided, and a spacer 223 for determining the distance between the seal surface 222 and the seal panel 23 is provided on the portions 222c and 222d corresponding to the other two sides of the seal surface 222 facing each other, and the accommodating portion 221 is provided. The bonding pad 212 of the image pickup device 21 accommodated in the terminal and the external lead terminal 24 are connected by wire bonding 25. In this state, the seal including the connection part of the external lead terminal 24 and the bonding wire 25 connected thereto is provided. An adhesive 26 is applied to the upper surface of the surface 222 and the spacer 223, and the adhesive 26 Since the seal panel 23 is hermetically bonded to the package body 22, the seal surface 222 also serves as an adhesion site between the seal panel 23 and the package body 22 and an electrical connection site between the imaging element 21. It is possible to reduce the space for electrical connection with such a dedicated image sensor. Thereby, the size of the package main body 22 is reduced, and the solid-state imaging device 20 can be miniaturized.

（実施の形態２）
次に、本発明の実施の形態２について図面を参照して説明する。
図４は本実施の形態２における固体撮像装置の平面図であり、図５は図４のＣ−Ｃ線に沿う断面図であり、図６は図４のＤ−Ｄ線に沿う断面図である。 (Embodiment 2)
Next, a second embodiment of the present invention will be described with reference to the drawings.
4 is a plan view of the solid-state imaging device according to the second embodiment, FIG. 5 is a cross-sectional view taken along the line CC in FIG. 4, and FIG. 6 is a cross-sectional view taken along the line DD in FIG. is there.

実施の形態２に示す固体撮像装置３０は、図４〜図６に示すように、撮像素子３１とパッケージからなり、パッケージはパッケージ本体３２とシールパネル３３を備える。
撮像素子３１は、矩形でかつ扁平な板状を呈し、その上面には矩形状の撮像面３１１が設けられている。また、撮像素子３１の上面の矩形状四周縁部、すなわち矩形状四周縁部のうち、互いに向かい合う一方の２辺の一方に対応する周縁部３１ｃと、互いに向かい合う他方の２辺に対応する周縁部３１ａ，３１ｂには、複数のボンディングパッド３１２が所定の間隔をおいてそれぞれ設けられている。 As shown in FIGS. 4 to 6, the solid-state imaging device 30 shown in the second embodiment includes an imaging element 31 and a package, and the package includes a package body 32 and a seal panel 33.
The imaging element 31 has a rectangular and flat plate shape, and a rectangular imaging surface 311 is provided on the upper surface thereof. In addition, among the four rectangular peripheral portions on the upper surface of the image sensor 31, that is, the peripheral portion 31c corresponding to one of the two sides facing each other and the peripheral portion corresponding to the other two sides facing each other. A plurality of bonding pads 312 are provided at predetermined intervals in 31a and 31b, respectively.

パッケージ本体３２は、その上面に撮像素子３１が収容されるように矩形状に形成された有底の収容部３２１と、この収容部３２１を囲むように延在して形成された一定幅を有する矩形枠状のシール面３２２と、このシール面３２２の互いに向かい合う他方の２辺うちの一方の辺に対応する箇所３２２ｃの外側に位置してシール面３２２と一体に設けられた仮のスペーサ３２３を有している。仮のスペーサ３２３は、シール面３２２とシールパネル３３との間の間隔を決定するものである。また、シール面３２２の互いに向かい合う他方の２辺に対応する箇所３２２ａ，３２２ｂと、スペーサ３２３に相対向する一方の辺に対応した箇所３２２ｃには、複数の外部引出し用端子（例えば、インナーリード）３４が所定の間隔をおいてそれぞれ設けられている。さらに、上記シール面３２２のスペーサ３２３と反対の辺に対応する箇所３２２ｄには、シール面３２２とシールパネル３３との間にそれらの間隔を決定するスペーサ３２４がシール面３２２上に一体に設けられている。このスペーサ３２４は、上記スペーサ３２３と協働してシールパネル２３を収容部２２１内の撮像素子２１から所望の間隔離された位置に位置決めするものである。   The package body 32 has a bottomed housing part 321 formed in a rectangular shape so that the image pickup device 31 is housed on the upper surface thereof, and a constant width formed so as to surround the housing part 321. A rectangular frame-shaped sealing surface 322 and a temporary spacer 323 provided integrally with the sealing surface 322 located outside the portion 322c corresponding to one of the other two sides of the sealing surface 322 facing each other. Have. The temporary spacer 323 determines an interval between the seal surface 322 and the seal panel 33. A plurality of external lead terminals (for example, inner leads) are provided at locations 322a and 322b corresponding to the other two sides of the seal surface 322 facing each other and a location 322c corresponding to one side facing the spacer 323. 34 are provided at predetermined intervals. Further, a spacer 324 for determining the distance between the seal surface 322 and the seal panel 33 is integrally provided on the seal surface 322 at a position 322 d corresponding to the side opposite to the spacer 323 of the seal surface 322. ing. The spacer 324 cooperates with the spacer 323 to position the seal panel 23 at a desired position separated from the image sensor 21 in the housing portion 221.

上記撮像素子３１は、その撮像面３１１を上に向けて収容部３２１内に収容される。この場合、収容部３２１に収容された撮像素子３１の上面とシール面３２２とはほぼ同一平面上に位置している。また、撮像素子３１の各ボンディングパッド３１２と、これらに対向する外部引出し用端子３４との間は金線や銅線などのボンディングワイヤ（請求項に記載の導体に相当）３５によってそれぞれ接続されている。
シールパネル３３は、パッケージ本体３２の収容部３２１内に収容された撮像素子３１を密閉状態に封止するもので、光が透過できる透明なガラス板材などから構成されている。また、このシールパネル３３は、シール面３２２上の外部引出し用端子３４及びこれに接続されたボンディングワイヤ３５の接続部位を含むシール面３２２とペーサ３２３及びスペーサ３２４の上面に塗布した接着剤３６によりパッケージ本体３２に気密にかつ一体に接着されている。この場合、シール面３２２上に位置するボンディングワイヤ３５の部分は接着剤３６中に埋設されている。これにより、ボンディングワイヤ部分における接着剤の塗布面積を大きくしてシール性能を確実にする。
そして、パッケージ本体３２への撮像素子３１の組み込み、ワイヤボンディングおよびシールパネル３３の接着が終了した後は、互いに接着されたスペーサ３２３と該スペーサ部３２３に対応するシールパネル３３の部位３３ａが図４及び図５に示すカットライン３７から切除されるように構成されている。 The imaging element 31 is accommodated in the accommodating portion 321 with the imaging surface 311 facing upward. In this case, the upper surface of the image sensor 31 housed in the housing portion 321 and the seal surface 322 are located on substantially the same plane. Further, the bonding pads 312 of the image pickup device 31 and the external lead-out terminals 34 facing the bonding pads 312 are respectively connected by bonding wires 35 (equivalent to conductors described in claims) such as gold wires and copper wires. Yes.
The seal panel 33 seals the image sensor 31 housed in the housing portion 321 of the package body 32 in a hermetically sealed state, and is made of a transparent glass plate material that can transmit light. Further, the seal panel 33 is formed by a seal surface 322 including a connection portion of an external lead terminal 34 on the seal surface 322 and a bonding wire 35 connected thereto, and an adhesive 36 applied to the upper surfaces of the pacer 323 and the spacer 324. The package body 32 is airtightly and integrally bonded. In this case, the portion of the bonding wire 35 located on the seal surface 322 is embedded in the adhesive 36. Thereby, the application area of the adhesive in the bonding wire portion is increased to ensure the sealing performance.
After the incorporation of the image sensor 31 into the package body 32, wire bonding, and adhesion of the seal panel 33 are completed, the spacer 323 adhered to each other and the portion 33a of the seal panel 33 corresponding to the spacer portion 323 are shown in FIG. And it is comprised so that it may cut out from the cut line 37 shown in FIG.

上記のような固体撮像装置３０の製造に際しては、収容部３２１に撮像素子３１を収容し、この撮像素子３１のボンディングパッド３１２とこれに相対向する外部引出し用端子３４とをボンディングワイヤ３５により接続する。しかる後、外部引出し用端子３４とのボンディングワイヤ３５の接続部位を含むシール面３２２とスペーサ３２３及びスペーサ３２４の上面に接着剤３６を塗布し、この接着剤３６上にシールパネル３３を重ね合わせて押圧する。これにより、シールパネル３３をパッケージ本体３２に気密に接着し、撮像素子３１をパッケージ本体３２内に封入する。その後、スペーサ３２３と該スペーサ部３２３に対応するシールパネル３３の部位３３ａをカットライン３７から切除する。これにより、固体撮像装置３０を製作できる。   When manufacturing the solid-state imaging device 30 as described above, the imaging element 31 is accommodated in the accommodating portion 321, and the bonding pad 312 of the imaging element 31 and the external lead-out terminal 34 facing each other are connected by the bonding wire 35. To do. Thereafter, an adhesive 36 is applied to the seal surface 322 including the connection portion of the bonding wire 35 to the external lead-out terminal 34 and the upper surfaces of the spacer 323 and the spacer 324, and the seal panel 33 is overlaid on the adhesive 36. Press. As a result, the seal panel 33 is hermetically bonded to the package body 32, and the image sensor 31 is enclosed in the package body 32. Thereafter, the spacer 323 and the portion 33 a of the seal panel 33 corresponding to the spacer portion 323 are cut out from the cut line 37. Thereby, the solid-state imaging device 30 can be manufactured.

このような本実施の形態２においては、矩形状パッケージ本体３２に設けた収容部３２１を囲むように延在する矩形状シール面３２２の３辺に対応する箇所３２２ａ，３２２ｃ，３２２ｄに外部引出し用端子３４を設けるとともに、シール面３２２の残りの１辺に対応する箇所３２２ｂ上に、シール面３２２とシールパネル２３との間の間隔を決定するスペーサ３２４を設け、さらに、矩形状シール面３２２の１辺に対応する箇所３２２ａの外側に位置してスペーサ部３２３を設け、収容部３２１に収容された撮像素子３１のボンディングパッド３１２と外部引出し用端子３４とをワイヤボンディング３５により接続し、この状態で、外部引出し用端子３４及びこれに接続されたボンディングワイヤ３５の接続部位を含むシール面３２２及びスペーサ３２３の上面に接着剤３６を塗布し、この接着剤３６によりシールパネル３３をパッケージ本体３２に気密に接着するようにしたので、シール面３２２がシールパネル２３とパッケージ本体３２との接着部位及び撮像素子３１との電気的接合部位を兼ねることになり、従来のような専用の撮像素子との電気的接合スペースを削減でき、パッケージ本体３２のサイズを減少できる。しかも、パッケージ本体３２への撮像素子３１の組み込み、ワイヤボンディングおよびシールパネル３３の接着が終了した後は、互いに接着されたスペーサ３２３とこれに対応するシールパネル３３の部位３３ａを切除するようにしたので、パッケージ本体３２のサイズが更に減少し、固体撮像装置３０を更に小型化できる。   In the second embodiment as described above, the portions 322a, 322c, and 322d corresponding to the three sides of the rectangular seal surface 322 extending so as to surround the accommodating portion 321 provided in the rectangular package body 32 are used for external drawing. In addition to providing the terminal 34, a spacer 324 for determining the distance between the seal surface 322 and the seal panel 23 is provided on a portion 322 b corresponding to the remaining one side of the seal surface 322, and further, the rectangular seal surface 322 is formed. A spacer portion 323 is provided outside the portion 322a corresponding to one side, and the bonding pad 312 of the image sensor 31 housed in the housing portion 321 is connected to the external lead-out terminal 34 by wire bonding 35. The sealing surface 322 including the connection portion of the external lead-out terminal 34 and the bonding wire 35 connected thereto, and Since the adhesive 36 is applied to the upper surface of the pacer 323 and the seal panel 33 is hermetically bonded to the package body 32 by the adhesive 36, the seal surface 322 is bonded to the seal panel 23 and the package body 32. This also serves as an electrical junction with the image sensor 31, can reduce a space for electrical connection with a dedicated image sensor as in the prior art, and reduce the size of the package body 32. In addition, after the incorporation of the image sensor 31 into the package body 32, the wire bonding, and the adhesion of the seal panel 33 are completed, the spacer 323 adhered to each other and the portion 33a of the seal panel 33 corresponding thereto are cut off. Therefore, the size of the package body 32 is further reduced, and the solid-state imaging device 30 can be further reduced in size.

また、スペーサ３２３をシール面３２２の外側に位置して設けることにより、このスペーサ３２３の内側であるシール面３２２に外部引出し用端子３４を設けることができる。これにより、３辺にボンディングパッド３１２を有する撮像素子用のパッケージ本体３２を簡便に成形できる。   Further, by providing the spacer 323 outside the seal surface 322, the external lead-out terminal 34 can be provided on the seal surface 322 inside the spacer 323. Thereby, the package body 32 for the image sensor having the bonding pads 312 on the three sides can be easily formed.

（実施の形態３）
本発明の固体撮像装置に使用されるパッケージが樹脂成形されたパッケージ集成体から成形する場合の実施の形態について、図７〜図９を参照して説明する。
図７は上記実施の形態１に示したパッケージを成形する場合の例を示すパッケージ集成体の平面図であり、図８は図７のＥ−Ｅ線に沿う断面図であり、図９は図７のＦ−Ｆ線に沿う断面図である。 (Embodiment 3)
An embodiment in which a package used in the solid-state imaging device of the present invention is molded from a resin-molded package assembly will be described with reference to FIGS.
7 is a plan view of a package assembly showing an example of molding the package shown in the first embodiment, FIG. 8 is a cross-sectional view taken along line EE of FIG. 7, and FIG. It is sectional drawing which follows the FF line of 7. FIG.

図７〜図９において、パッケージ集成体４０は、撮像素子を収容する収容部４１ａを有する矩形状のパッケージ素体４１（パッケージ本体）が行方向Ｘと列方向Ｙに所定幅、例えば上記図１に示すシール面２２２の幅の２倍に相当する幅の行連結代４２及び列連結代４３を介してマトリクス状に連結された一体構造になっている。そして、パッケージ集成体４０の四周囲には行連結代４２及び列連結代４３の幅より大きい幅の矩形状の枠部４７が一体に設けられている。   7 to 9, the package assembly 40 is configured such that a rectangular package body 41 (package body) having a receiving portion 41a for receiving an image sensor has a predetermined width in the row direction X and the column direction Y, for example, FIG. Are integrated in a matrix through row connection allowances 42 and column connection allowances 43 having a width corresponding to twice the width of the seal surface 222 shown in FIG. A rectangular frame 47 having a width larger than the width of the row coupling allowance 42 and the column coupling allowance 43 is integrally provided around the four periphery of the package assembly 40.

列方向Ｙの各パッケージ素体４１間に位置する各列連結代４３には、図７〜図９に示すように、列連結代４３の幅と等しい幅と所定の高さを有するスペーサ４４が収容部４１ａの行方向Ｘの寸法より短い長さに設けられ、さらにパッケージ集成体４０の列方向Ｙの両端に位置する枠部４７の左右の列部分４７ａにも行方向Ｘの各収容部４１ａに対応して、スペーサ４４と同一高さのスペーサ４５が設けられている。   As shown in FIGS. 7 to 9, spacers 44 having a width equal to the width of the row connection allowance 43 and a predetermined height are provided in each row connection allowance 43 positioned between the package elements 41 in the row direction Y. Each of the accommodating portions 41a in the row direction X is also provided in the left and right column portions 47a of the frame portion 47 which is provided with a length shorter than the dimension in the row direction X of the accommodating portion 41a and is located at both ends in the column direction Y of the package assembly 40. The spacer 45 having the same height as the spacer 44 is provided.

スペーサ４４を含む行方向Ｘの各列連結代４３は、その幅方向の中心を通って行方向Ｘに伸びるカットライン５１に沿ってカットできるように構成されているとともに、スペーサ４５を含む枠部４７の左右の列部分４７ａは行方向Ｘに伸びるカットライン５２に沿ってカットできるように構成されている。また、行方向Ｘの各パッケージ素体４１間に位置する各行連結代４２は、その幅方向の中心を通って列方向Ｙに伸びるカットライン５３に沿ってカットできるように構成されているとともに、枠部４７の前後の行部分４７ｂは、列方向Ｙに伸びるカットライン５４に沿ってカットできるように構成されている。
したがって、このようなパッケージ集成体４０を図７に示す各カットライン５１〜５４に沿ってカットすることにより、図１に示すような形状のパッケージを成形することができる。 Each column connection allowance 43 in the row direction X including the spacer 44 is configured to be cut along a cut line 51 extending in the row direction X through the center in the width direction, and includes a frame portion including the spacer 45. The left and right column portions 47a of 47 are configured to be cut along a cut line 52 extending in the row direction X. Further, each row coupling allowance 42 located between each package element 41 in the row direction X is configured to be cut along a cut line 53 extending in the column direction Y through the center in the width direction, and The row portions 47b before and after the frame portion 47 are configured to be cut along a cut line 54 extending in the column direction Y.
Therefore, by cutting such a package assembly 40 along the respective cut lines 51 to 54 shown in FIG. 7, a package having a shape as shown in FIG. 1 can be formed.

また、行方向Ｘの各パッケージ素体４１間に位置する各行連結代４２には、カットライン５３を線対称にして複数の外部引出し用端子４６が設けられている。さらに枠部４７の前後の行部分４７ｂには、カットライン５４の内側に位置して複数の外部引出し用端子４６が列方向Ｙの各収容部４１ａ毎に設けられている。   Further, each row connection allowance 42 located between each package element 41 in the row direction X is provided with a plurality of external lead terminals 46 with the cut line 53 being axisymmetric. Further, a plurality of external lead terminals 46 are provided for each of the accommodating portions 41 a in the column direction Y, located inside the cut line 54, in the row portions 47 b before and after the frame portion 47.

このようなパッケージ集成体４０を用いて固体撮像装置を製造する場合は、各パッケージ素体４１の収容部４１ａ内に図１に示すように撮像素子を収容した後、撮像素子のボンディングパッドと外部引出し用端子４６とをワイヤボンディングにより接続し、さらに行連結代４２と列連結代４３及び枠部４７の各表面に接着剤を塗布した後、この接着剤上にパッケージ集成体４０と同一面積のシールパネルを重ね合わせて押し付ける。これにより、シールパネルをパッケージ集成体４０に接着剤により気密に接着して撮像素子を封入する。その後、シールパネルを含むパッケージ集成体４０を図７に示す各カットライン５１〜５４に沿ってカットする。これにより、図１に示すような形状の固体撮像装置を製造することができる。
したがって、このような製造方法においては、固体撮像装置の小型化を容易に実現できるとともに、固体撮像装置の生産性が向上し、固体撮像装置の低コスト化が可能になる。 In the case of manufacturing a solid-state imaging device using such a package assembly 40, after the imaging element is accommodated in the accommodating portion 41a of each package element 41 as shown in FIG. The lead terminals 46 are connected to each other by wire bonding, and an adhesive is applied to each surface of the row coupling allowance 42, the column coupling allowance 43, and the frame portion 47, and then the same area as the package assembly 40 is formed on the adhesive. Push the seal panel on top of each other. As a result, the seal panel is hermetically adhered to the package assembly 40 with an adhesive, and the imaging element is sealed. Thereafter, the package assembly 40 including the seal panel is cut along the respective cut lines 51 to 54 shown in FIG. Thereby, a solid-state imaging device having a shape as shown in FIG. 1 can be manufactured.
Therefore, in such a manufacturing method, the solid-state imaging device can be easily downsized, the productivity of the solid-state imaging device is improved, and the cost of the solid-state imaging device can be reduced.

（実施の形態４）
本発明の固体撮像装置に使用されるパッケージが樹脂成形されたパッケージ集成体から成形する場合の他の実施の形態について、図１０〜図１２を参照して説明する。
図１０は上記実施の形態２に示したパッケージを成形する場合の例を示すパッケージ集成体の平面図であり、図１１は図１０のＧ−Ｇ線に沿う断面図であり、図１２は図１０のＨ−Ｈ線に沿う断面図である。 (Embodiment 4)
Another embodiment in which a package used in the solid-state imaging device of the present invention is molded from a resin-molded package assembly will be described with reference to FIGS.
FIG. 10 is a plan view of a package assembly showing an example of molding the package shown in the second embodiment, FIG. 11 is a cross-sectional view taken along the line GG of FIG. 10, and FIG. It is sectional drawing which follows the 10 HH line.

図１０〜図１２において、パッケージ集成体６０は、撮像素子を収容する収容部６１ａを有する矩形状のパッケージ素体６１（パッケージ本体）が行方向Ｘと列方向Ｙに所定幅、例えば上記図２に示すシール面３２２の幅の２倍に相当する幅の行連結代６２及び３倍に相当する幅の列連結代６３を介してマトリクス状に連結された一体構造になっている。そして、パッケージ集成体６０の四周囲にはシール面３２２の幅の２倍に相当する幅の矩形状の枠部６７が一体に設けられている。   10 to 12, a package assembly 60 has a rectangular package body 61 (package main body) having a receiving portion 61a for receiving an image pickup element having a predetermined width in the row direction X and the column direction Y, for example, FIG. It has an integrated structure connected in a matrix via a row connection allowance 62 having a width corresponding to twice the width of the sealing surface 322 and a column connection allowance 63 having a width corresponding to three times. A rectangular frame 67 having a width corresponding to twice the width of the seal surface 322 is integrally provided around the four periphery of the package assembly 60.

列方向Ｙの各パッケージ素体６１間に位置する各列連結代６３の幅方向の２／３に相当する領域には、図１０〜図１２に示すように、所定の高さを有するスペーサ６４が収容部６１ａの行方向Ｘの寸法より短い長さに設けられている。また、パッケージ集成体６０の列方向Ｙの両端に位置する枠部６７の左列部分６７ａ１にその幅方向の１／２に相当する幅のスペーサ６５ａが行方向Ｘの各収容部６１ａに対応してスペーサ６４と同一の高さに設けられ、さらに、枠部６７の右列部分６７ａ２にはスペーサ６５ｂが行方向Ｘの各収容部６１ａに対応してスペーサ６４と同一高さに設けられている。   As shown in FIGS. 10 to 12, a spacer 64 having a predetermined height is formed in an area corresponding to 2/3 of the row coupling allowances 63 positioned between the package bodies 61 in the row direction Y. Is provided with a length shorter than the dimension in the row direction X of the accommodating portion 61a. In addition, spacers 65 a having a width corresponding to ½ of the width direction of the left column portion 67 a 1 of the frame portion 67 located at both ends in the column direction Y of the package assembly 60 correspond to the respective receiving portions 61 a in the row direction X. Further, the spacer 65b is provided at the same height as the spacer 64 in the right column portion 67a2 of the frame portion 67 so as to correspond to the accommodating portions 61a in the row direction X. .

各列連結代６３は、これを幅方向に３等分するように行方向Ｘに伸びる２本カットライン７１ａ，７１ｂに沿ってカットできるように構成されているとともに、枠部６７の左右の列部分６７ａ１と６７ａ２は行方向Ｘに伸びるカットライン７２に沿ってカットできるように構成されている。また、行方向Ｘの各パッケージ素体６１間に位置する各行連結代６２は、その幅方向の中心を通って列方向Ｙに伸びるカットライン７３に沿ってカットできるように構成されているとともに、枠部６７の前後の行部分６７ｂは、列方向Ｙに伸びるカットライン７４に沿ってカットできるように構成されている。
したがって、このようなパッケージ集成体６０を図７に示す各カットライン７１ａ，７１ｂ〜７４に沿ってカットすることにより、図４に示すような形状のパッケージを成形することができる。 Each column coupling allowance 63 is configured so as to be cut along two cut lines 71a and 71b extending in the row direction X so as to be divided into three equal parts in the width direction, and to the left and right columns of the frame portion 67. The portions 67a1 and 67a2 are configured so as to be cut along a cut line 72 extending in the row direction X. In addition, each row coupling allowance 62 located between each package element 61 in the row direction X is configured to be cut along a cut line 73 extending in the column direction Y through the center in the width direction, The row portions 67b before and after the frame portion 67 are configured to be cut along a cut line 74 extending in the column direction Y.
Therefore, by cutting such a package assembly 60 along the cut lines 71a and 71b to 74 shown in FIG. 7, a package having a shape as shown in FIG. 4 can be formed.

行方向Ｘの各パッケージ素体６１間に位置する各行連結代６２には、図１０に示すように、カットライン７３を線対称にして複数の外部引出し用端子６６が設けられている。さらに、枠部６７の前後の行部分６７ｂには、カットライン７４の内側に位置して複数の外部引出し用端子６６が列方向Ｙの各収容部６１ａ毎に設けられている。また、各列連結代６３の幅方向の１／３に相当する領域、すなわちスペーサ６４が設けられていない収容部６１ａとの近接部分には、図１０に示すように、複数の外部引出し用端子６６が行方向Ｘの各収容部６１ａ毎に設けられている。また、枠部６７の一方の列部分６７ａ１の幅方向の１／２に相当する領域、すなわちスペーサ６５ａが設けられていない収容部６１ａとの近接領域には、図１０に示すように、複数の外部引出し用端子６６が行方向Ｘの各収容部６１ａ毎に設けられている。   As shown in FIG. 10, a plurality of external lead-out terminals 66 are provided with the cut lines 73 being symmetric with respect to each row coupling allowance 62 positioned between the package elements 61 in the row direction X. Further, a plurality of external lead-out terminals 66 are provided for each of the accommodating portions 61 a in the column direction Y, located inside the cut line 74, in the row portions 67 b before and after the frame portion 67. Further, as shown in FIG. 10, a plurality of external lead terminals are provided in a region corresponding to 1/3 in the width direction of each row coupling allowance 63, that is, in the vicinity of the accommodating portion 61a where the spacer 64 is not provided. 66 is provided for each accommodating portion 61a in the row direction X. Further, as shown in FIG. 10, a region corresponding to ½ of the width direction of one row portion 67 a 1 of the frame portion 67, that is, a region close to the accommodating portion 61 a where the spacer 65 a is not provided, An external lead terminal 66 is provided for each accommodating portion 61a in the row direction X.

このようなパッケージ集成体６０を用いて固体撮像装置を製造する場合は、各パッケージ素体６１の収容部６１ａ内に図４に示すように撮像素子を収容した後、撮像素子のボンディングパッドと外部引出し用端子とをワイヤボンディングにより接続し、さらに行連結代６２と列連結代６３及び枠部６７の各表面に接着剤を塗布した後、この接着剤上にパッケージ集成体６０と同一面積のシールパネルを重ね合わせて押し付ける。これにより、シールパネルをパッケージ集成体６０に接着剤により気密に接着して撮像素子を封入する。その後、シールパネルを含むパッケージ集成体６０を図１０に示す各カットライン７１ａ，７１ｂ〜７４に沿ってカットする。これにより、図４に示すような形状の固体撮像装置を製造することができる。
したがって、このような製造方法においては、固体撮像装置の小型化を容易に実現できるとともに、固体撮像装置の生産性が向上し、固体撮像装置の低コスト化が可能になる。 When a solid-state imaging device is manufactured using such a package assembly 60, after the imaging element is accommodated in the accommodating portion 61a of each package element 61 as shown in FIG. The lead terminals are connected by wire bonding, and an adhesive is applied to each surface of the row coupling allowance 62, the column coupling allowance 63, and the frame portion 67, and then a seal having the same area as the package assembly 60 is formed on the adhesive. Press the panels together. As a result, the seal panel is hermetically bonded to the package assembly 60 with an adhesive, and the image pickup device is sealed. Thereafter, the package assembly 60 including the seal panel is cut along the cut lines 71a and 71b to 74 shown in FIG. Thereby, a solid-state imaging device having a shape as shown in FIG. 4 can be manufactured.
Therefore, in such a manufacturing method, the solid-state imaging device can be easily downsized, the productivity of the solid-state imaging device is improved, and the cost of the solid-state imaging device can be reduced.

本発明においては、ボンディングワイヤ部分での接着剤によるシール性能が十分に確保できれば、上記実施の形態１に示すように、外部引出し用端子２４を含むボンディングワイヤ２５の部分を接着剤２６中に埋設する必要がなく、また、上記実施の形態２に示すように外部引出し用端子３４を含むボンディングワイヤ３５の部分を接着剤３６中に埋設する必要がない。例えば、ボンディングワイヤ２５を除く外部引出し用端子２４のみが接着剤２６中に埋設されている構成してもよい。   In the present invention, if the sealing performance by the adhesive at the bonding wire portion can be sufficiently secured, the portion of the bonding wire 25 including the external lead terminal 24 is embedded in the adhesive 26 as shown in the first embodiment. In addition, as shown in the second embodiment, it is not necessary to embed a portion of the bonding wire 35 including the external lead-out terminal 34 in the adhesive 36. For example, only the external lead terminal 24 excluding the bonding wire 25 may be embedded in the adhesive 26.

あるいは、図１３に示すように、パッケージ本体２２のシール面２２２とシールパネル２３とが接着剤２６により接着された状態で、接着剤２６の内側に沿ってシール面２２２とシールパネル２３との間に接着剤２６が存在していない空間２８が形成され、外部引出し用端子２４を含むボンディングワイヤ２５が前記空間２８に位置されるように構成してもよい。   Alternatively, as shown in FIG. 13, the seal surface 222 and the seal panel 23 of the package body 22 are bonded to each other with the adhesive 26, and the gap between the seal surface 222 and the seal panel 23 is along the inner side of the adhesive 26. A space 28 in which the adhesive 26 is not present may be formed, and the bonding wire 25 including the external lead terminal 24 may be positioned in the space 28.

なお、上記実施の形態１に示す固体撮像装置では、シール面２２２とシールパネル２３との間の間隔をシール面２２２上に設けたスペーサ２２３で決定する場合について説明したが、本発明はこれに限らず、スペーサをシールパネルに設けてもよいほか、シールパネルやパッケージ本体とは独立した別部材で構成されたスペーサを用いてもよい。この場合も実施の形態１と同様な作用効果が得られる。
また、上記実施の形態２に示す固体撮像装置では、シール面３２２とシールパネル３３との間の間隔をシール面３２２上に設けたスペーサ３２４とシール面３２２の外側に位置して設けたスペーサ部３２３とにより決定する場合について説明したが、本発明はこれに限らず、スペーサをシールパネルに設けてもよいほか、シール面３２２上のスペーサをなくし、これに代えてシール面３２２の外側に位置する周囲箇所にスペーサを設け、固体撮像装置の組立完了後は、スペーサ部分をカットする方式を用いてもよい。この場合も実施の形態２と同様な作用効果が得られる。
また、本発明にかかるパッケージは、上記実施の形態に示した固体撮像素子の収容するものに限らず、イメージセンサを含むＬＳＩなどを半導体装置を封止状態に収容するパッケージにも適用できることは勿論である。
また、本発明は上記実施の形態に限定されるものではなく、その要旨を逸脱しない範囲において、具体的な構成、機能、作用効果において、他の種々の形態によっても実施することができる。 In the solid-state imaging device shown in the first embodiment, the case in which the distance between the seal surface 222 and the seal panel 23 is determined by the spacer 223 provided on the seal surface 222 has been described. However, the spacer may be provided on the seal panel, or a spacer formed of a separate member independent of the seal panel and the package body may be used. In this case, the same effect as that of the first embodiment can be obtained.
In the solid-state imaging device shown in the second embodiment, the spacer 324 provided on the seal surface 322 and the spacer portion provided on the outer side of the seal surface 322 are provided between the seal surface 322 and the seal panel 33. However, the present invention is not limited to this, and the spacer may be provided on the seal panel, or the spacer on the seal surface 322 may be eliminated, and instead, the spacer may be positioned outside the seal surface 322. A method may be used in which spacers are provided in the surrounding locations and the spacer portions are cut after assembly of the solid-state imaging device is completed. In this case, the same effect as that of the second embodiment can be obtained.
In addition, the package according to the present invention is not limited to the one accommodated in the solid-state imaging device described in the above embodiment, but can be applied to a package that accommodates an LSI including an image sensor in a sealed state. It is.
In addition, the present invention is not limited to the above-described embodiment, and can be implemented in various other forms in specific configurations, functions, and effects without departing from the spirit of the present invention.

本実施の形態１における固体撮像装置の平面図である。1 is a plan view of a solid-state imaging device in Embodiment 1. FIG. 図１のＡ−Ａ線に沿う断面図である。It is sectional drawing which follows the AA line of FIG. 図１のＢ−Ｂ線に沿う断面図である。It is sectional drawing which follows the BB line of FIG. 本実施の形態２における固体撮像装置の平面図である。It is a top view of the solid-state imaging device in this Embodiment 2. 図４のＣ−Ｃ線に沿う断面図である。It is sectional drawing which follows the CC line of FIG. 図４のＤ−Ｄ線に沿う断面図である。It is sectional drawing which follows the DD line | wire of FIG. 実施の形態１に示したパッケージを成形する場合の例を示すパッケージ集成体の平面図である。It is a top view of the package assembly which shows the example in the case of shape | molding the package shown in Embodiment 1. FIG. 図７のＥ−Ｅ線に沿う断面図である。It is sectional drawing which follows the EE line | wire of FIG. 図７のＦ−Ｆ線に沿う断面図である。It is sectional drawing which follows the FF line | wire of FIG. 実施の形態２に示したパッケージを成形する場合の例を示すパッケージ集成体の平面図である。It is a top view of the package assembly | assembly which shows the example in the case of shape | molding the package shown in Embodiment 2. FIG. 図１０のＧ−Ｇ線に沿う断面図である。It is sectional drawing which follows the GG line of FIG. 図１０のＨ−Ｈ線に沿う断面図である。It is sectional drawing which follows the HH line of FIG. 本発明におけるパッケージ本体のシール面とシールパネルとの接着剤による接合形態の他の例を示す要部の拡大断面図である。It is an expanded sectional view of the principal part which shows the other example of the joining form by the adhesive agent of the sealing surface of a package main body in this invention, and a sealing panel. 従来における固体撮像装置の平面図である。It is a top view of the conventional solid-state imaging device. 図１４のＩ−Ｉ線に沿う断面図である。It is sectional drawing which follows the II line | wire of FIG. 図１４のＪ−Ｊ線に沿う断面図である。It is sectional drawing which follows the JJ line of FIG. 図１４のＫ部の拡大断面図である。It is an expanded sectional view of the K section of FIG.

符号の説明Explanation of symbols

２０，３０……固体撮像装置、２１，３１……撮像素子、２２，３２……パッケージ本体、２３，３３……シールパネル、２４，３４……外部引出し用端子、２５，３５……ボンディングワイヤ、２６，３６……接着剤、２１２，３１２……ボンディングパッド、２２１，３２１……収容部、２２２，３２２……シール面、２２３，３２４……スペーサ、３２３……スペーサ。
20, 30 ... Solid-state imaging device, 21, 31 ... Imaging element, 22, 32 ... Package body, 23, 33 ... Seal panel, 24, 34 ... External lead-out terminal, 25, 35 ... Bonding wire , 26, 36... Adhesive, 212, 312... Bonding pad, 221, 321... Housing, 222, 322... Sealing surface, 223, 324.

Claims (13)

撮像素子と、パッケージ本体と、シールパネルとを備え、
前記撮像素子は、扁平板状を呈し、かつ撮像面が設けられた上面と、前記上面の周縁部に設けられた複数のボンディングパッドとを有し、
前記パッケージ本体は、前記撮像面を上に向けて前記撮像素子が収容される収容部と、前記収容部を囲むように延在するシールパネル接合用のシール面とを有し、
前記シールパネルは前記シール面に接合可能で前記撮像素子の上面を覆うように形成され、
前記撮像素子と外部との電気的接続を行う複数の外部引出し用端子が前記シール面に設けられ、
前記ボンディングパッドと前記外部引出し用端子とが導体により接続され、
前記シール面と前記シールパネルとの間に接着剤を介して両者が気密に接着されることで前記撮像素子は前記パッケージ本体内に封入されている、
ことを特徴とする固体撮像装置。 An image sensor, a package body, and a seal panel;
The imaging device has a flat plate shape and has an upper surface provided with an imaging surface, and a plurality of bonding pads provided on a peripheral portion of the upper surface,
The package main body has a storage portion in which the imaging element is stored with the imaging surface facing upward, and a seal surface for joining a seal panel extending so as to surround the storage portion,
The seal panel can be joined to the seal surface and is formed to cover the upper surface of the image sensor,
A plurality of external lead terminals for electrical connection between the image sensor and the outside are provided on the seal surface,
The bonding pad and the external lead terminal are connected by a conductor,
The image pickup device is sealed in the package body by air-tightly bonding both between the seal surface and the seal panel via an adhesive.
A solid-state imaging device. 前記複数の外部引出し用端子は前記接着剤中に埋設されていることを特徴とする請求１記載の固体撮像装置。   The solid-state imaging device according to claim 1, wherein the plurality of external lead-out terminals are embedded in the adhesive. 前記導体が前記シール面上に位置する部分及び複数の外部引出し用端子は前記接着剤中に埋設されていることを特徴とする請求１記載の固体撮像装置。   The solid-state imaging device according to claim 1, wherein a portion where the conductor is located on the sealing surface and a plurality of external lead-out terminals are embedded in the adhesive. 前記シール面と前記シールパネルとが前記接着剤により接着された状態で、前記接着剤の内側に沿って前記シール面と前記シールパネルとの間に前記接着剤が存在していない空間が形成され、前記複数の外部引出し用端子は前記空間に位置していることを特徴とする請求１記載の固体撮像装置。   In a state where the seal surface and the seal panel are bonded by the adhesive, a space where the adhesive does not exist is formed between the seal surface and the seal panel along the inside of the adhesive. The solid-state imaging device according to claim 1, wherein the plurality of external lead-out terminals are located in the space. 前記収容部に収容された前記撮像素子の上面と、前記シール面とは同一平面上に位置していることを特徴とする請求１記載の固体撮像装置。   The solid-state imaging device according to claim 1, wherein an upper surface of the imaging element housed in the housing portion and the seal surface are located on the same plane. 前記シール面と前記シールパネルとの間にそれらの間隔を決定する複数のスペーサが設けられていることを特徴とする請求１記載の固体撮像装置。   The solid-state imaging device according to claim 1, wherein a plurality of spacers are provided between the seal surface and the seal panel to determine a distance therebetween. 前記スペーサは前記シール面に前記パッケージ本体と一体に設けられていることを特徴とする請求６記載の固体撮像装置。   The solid-state imaging device according to claim 6, wherein the spacer is provided integrally with the package body on the seal surface. 前記撮像素子は矩形状に形成され、前記パッケージ本体及びシールパネルは前記撮像素子の形状に対応して矩形状を呈していることを特徴とする請求１記載の固体撮像装置。   The solid-state imaging device according to claim 1, wherein the imaging element is formed in a rectangular shape, and the package body and the seal panel have a rectangular shape corresponding to the shape of the imaging element. 撮像素子と、パッケージ本体と、シールパネルとを備え、
前記撮像素子は、扁平板状を呈し、かつ撮像面が設けられた上面と、前記上面の周縁部に設けられた複数のボンディングパッドとを有し、
前記パッケージ本体は、前記撮像面を上に向けて前記撮像素子が収容される収容部と、前記収容部を囲むように延在するシールパネル接合用のシール面とを有し、
前記シールパネルは前記シール面に接合可能で前記撮像素子の上面を覆うように形成され、
前記撮像素子と外部との電気的接続を行う複数の外部引出し用端子が前記シール面に設けられ、
前記収容部に前記撮像素子を収容し、
前記ボンディングパッドと前記外部引出し用端子とを導体により接続し、
前記シール面と前記シールパネルとの間の間隔をスペーサにより決定した状態で前記シール面と前記シールパネルとの間に接着剤を介して両者を気密に接着し、前記撮像素子を前記パッケージ本体内に封入するようにした、
ことを特徴とする固体撮像装置の製造方法。 An image sensor, a package body, and a seal panel;
The imaging device has a flat plate shape and has an upper surface provided with an imaging surface, and a plurality of bonding pads provided on a peripheral portion of the upper surface,
The package main body has a storage portion in which the imaging element is stored with the imaging surface facing upward, and a seal surface for joining a seal panel extending so as to surround the storage portion,
The seal panel can be joined to the seal surface and is formed to cover the upper surface of the image sensor,
A plurality of external lead terminals for electrical connection between the image sensor and the outside are provided on the seal surface,
Accommodating the imaging element in the accommodating portion;
Connecting the bonding pad and the external lead terminal by a conductor;
With the gap between the seal surface and the seal panel determined by a spacer, the seal surface and the seal panel are both airtightly bonded via an adhesive, and the imaging element is mounted inside the package body. To be sealed in,
A method of manufacturing a solid-state imaging device. 前記スペーサは、前記シール面の外側に該シール面と一体に設けられ、前記シール面と前記シールパネルとが前記接着剤により接着された後、前記スペーサを含む前記パッケージ本体の部位及びこの部位を覆う前記シールパネルの部位は切除されることを特徴とする請求項９記載の固体撮像装置の製造方法。   The spacer is provided integrally with the seal surface outside the seal surface, and after the seal surface and the seal panel are bonded by the adhesive, the package body including the spacer and the site The method for manufacturing a solid-state imaging device according to claim 9, wherein a portion of the sealing panel to be covered is cut off. パッケージ本体と、シールパネルとを備え、
前記パッケージ本体は、半導体素子が収容される収容部と、前記収容部を囲むように延在するシールパネル接合用のシール面とを有し、
前記シールパネルは前記シール面に接合可能で前記撮像素子の上面を覆うように形成され、
前記半導体素子と外部との電気的接続を行う複数の外部引出し用端子が前記シール面に設けられ、
前記シールパネルを前記シール面に接着剤を介して気密に接着することにより前記収容部を封止するように構成されている、
ことを特徴とする半導体収容パッケージ。 A package body and a seal panel;
The package body has a housing part for housing a semiconductor element, and a seal surface for joining a seal panel extending so as to surround the housing part,
The seal panel can be joined to the seal surface and is formed to cover the upper surface of the image sensor,
A plurality of external lead terminals for electrical connection between the semiconductor element and the outside are provided on the sealing surface,
It is configured to seal the housing portion by airtightly bonding the seal panel to the seal surface via an adhesive.
A semiconductor housing package. 前記シール面と前記シールパネルとの間にそれらの間隔を決定する複数のスペーサが設けられていることを特徴とする請求１１記載の半導体収容パッケージ。   The semiconductor accommodation package according to claim 11, wherein a plurality of spacers are provided between the sealing surface and the sealing panel to determine a distance therebetween. 前記スペーサは前記シール面に前記パッケージ本体と一体に設けられていることを特徴とする請求１２記載の半導体収容パッケージ。
13. The semiconductor housing package according to claim 12, wherein the spacer is provided integrally with the package body on the seal surface.
JP2005177656A 2005-04-08 2005-06-17 Method for manufacturing solid-state imaging device Expired - Fee Related JP4882286B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005177656A JP4882286B2 (en) 2005-04-08 2005-06-17 Method for manufacturing solid-state imaging device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005112177 2005-04-08
JP2005112177 2005-04-08
JP2005177656A JP4882286B2 (en) 2005-04-08 2005-06-17 Method for manufacturing solid-state imaging device

Publications (2)

Publication Number Publication Date
JP2006313868A true JP2006313868A (en) 2006-11-16
JP4882286B2 JP4882286B2 (en) 2012-02-22

Family

ID=37535222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005177656A Expired - Fee Related JP4882286B2 (en) 2005-04-08 2005-06-17 Method for manufacturing solid-state imaging device

Country Status (1)

Country Link
JP (1) JP4882286B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007053335A (en) * 2005-07-19 2007-03-01 Matsushita Electric Ind Co Ltd Semiconductor device and manufacturing method thereof
WO2008111302A1 (en) * 2007-03-14 2008-09-18 Panasonic Corporation Semiconductor device, its manufacturing method and optical pickup module
US8947591B2 (en) 2011-03-31 2015-02-03 Sony Corporation Solid-state imaging unit, method of manufacturing solid-state imaging unit, and electronic apparatus
US9025079B2 (en) 2011-04-07 2015-05-05 Sony Corporation Compact low-flare solid-state imaging apparatus and electronic system comprising a compact low-flare solid-state imaging apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6363425A (en) * 1986-09-02 1988-03-19 オリンパス光学工業株式会社 Electronic endoscope
JP2002164524A (en) * 2000-11-27 2002-06-07 Kyocera Corp Semiconductor device
JP2003243673A (en) * 2001-07-31 2003-08-29 Kyocera Corp Optical semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6363425A (en) * 1986-09-02 1988-03-19 オリンパス光学工業株式会社 Electronic endoscope
JP2002164524A (en) * 2000-11-27 2002-06-07 Kyocera Corp Semiconductor device
JP2003243673A (en) * 2001-07-31 2003-08-29 Kyocera Corp Optical semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007053335A (en) * 2005-07-19 2007-03-01 Matsushita Electric Ind Co Ltd Semiconductor device and manufacturing method thereof
WO2008111302A1 (en) * 2007-03-14 2008-09-18 Panasonic Corporation Semiconductor device, its manufacturing method and optical pickup module
JP2008226378A (en) * 2007-03-14 2008-09-25 Matsushita Electric Ind Co Ltd Semiconductor device, manufacturing method thereof, and optical pickup module
CN101606242B (en) * 2007-03-14 2011-12-21 松下电器产业株式会社 Semiconductor device, its manufacturing method and optical pickup module
US8947591B2 (en) 2011-03-31 2015-02-03 Sony Corporation Solid-state imaging unit, method of manufacturing solid-state imaging unit, and electronic apparatus
US9025079B2 (en) 2011-04-07 2015-05-05 Sony Corporation Compact low-flare solid-state imaging apparatus and electronic system comprising a compact low-flare solid-state imaging apparatus

Also Published As

Publication number Publication date
JP4882286B2 (en) 2012-02-22

Similar Documents

Publication Publication Date Title
JP3759131B2 (en) Leadless package semiconductor device and manufacturing method thereof
US7307285B2 (en) Optical semiconductor device and a method for manufacturing the same
US9165961B2 (en) Solid-state imaging device
US20070241451A1 (en) Electronic component device
JP3838572B2 (en) Solid-state imaging device and manufacturing method thereof
JP2006332680A (en) Method for packaging an image sensor and packaged image sensor
KR101579623B1 (en) Semiconductor package for image sensor and manufacturing method thereof
TW201229479A (en) Pressure sensor and method of assembling same
US11515220B2 (en) Semiconductor package structures and methods of manufacturing the same
JP3838571B2 (en) Method for manufacturing solid-state imaging device
JP6677616B2 (en) Method for manufacturing semiconductor device
US9029992B2 (en) Electronic package structure with insulated adhesion portion for affixing and isolating lands spaced apart from land connect bar within a leadframe
JP4933934B2 (en) Semiconductor device and manufacturing method of semiconductor device
US20230098224A1 (en) Semiconductor packages with reliable covers
JP4882286B2 (en) Method for manufacturing solid-state imaging device
JP4219943B2 (en) Solid-state imaging device
CN105300593A (en) Packaged semiconductor sensor device with lid
JP4466552B2 (en) Method for manufacturing solid-state imaging device
JP2006344902A (en) Semiconductor module
JP2007042786A (en) Micro device and its packaging method
CN1802086B (en) System and method for mounting electrical devices
JP2005129720A (en) Solid-state imaging device and manufacturing method thereof
JP4353935B2 (en) Leadless package semiconductor device
JP4175651B2 (en) Optical device
JP2006319130A (en) Semiconductor device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080509

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20090817

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20091014

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20101117

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101124

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110114

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110531

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110722

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20111108

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20111121

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20141216

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20141216

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees