JP2007042786A - Microdevice and packaging method thereof - Google Patents

Abstract

A device substrate having a functional element having a vibrator or a movable portion on a functional surface such as MEMS and a 0-level package having caps of different sizes are packaged in a form that can be mounted on a mounting substrate via solder. A micro device and a method for manufacturing the same are provided.
A connection pad 15 connected to a functional element is formed on one main surface of a device substrate 11 on which a functional element 12 having a movable portion or a vibrator is formed on one main surface. Protective members 13 and 14 constituting a cavity C that protects the functional element formation region except for the connection pad formation region are provided, and the connection pad 22 and the plate-like electrode 21a are connected by the connection portion 22. An insulating resin layer 23 that is electrically connected and exposes a part of the surface of the plate electrode to seal at least the contact between the connection portion and the plate electrode, the connection portion, the connection pad, and the protective member is formed and exposed. The package is configured to be externally connected from the surface of the plate electrode.
[Selection] Figure 1

Description

  The present invention relates to a microdevice and a packaging method thereof, and in particular, a movable portion on a functional surface such as a micro electro mechanical system (MEMS), a surface acoustic wave (SAW) element, or a thin film bulk acoustic wave resonator (F-BAR). Alternatively, the present invention relates to a microdevice having a functional element having a vibrator and a packaging method thereof.

  In recent years, mobile devices typified by mobile phones and personal computers have been reduced in size and weight, and have increased functionality and functionality, and the components and substrates that make up these devices have been similarly reduced in size, thickness, and weight. High-density mounting is progressing. As for the mounting of devices such as semiconductors, as the mounting area is reduced and the transmission signal speed is increased, the bare chip of the device is mounted directly on the substrate by the so-called flip chip mounting technology from the mounting by the mold or the ceramic package, and sealed. Attempts have been made to stop.

  However, this flip chip direct mounting method uses, for example, a movable part or a functional part such as a MEMS (Micro Electro Mechanical Systems), a SAW (Surface Acoustic Wave) element, or an F-BAR (Thin Film Bulk Acoustic Wave Resonators). In the case of a microdevice having a vibrator, since the functional surface cannot be covered with a sealing material or the like, a package structure is adopted that is hermetically sealed using a substrate such as ceramic, metal, or glass.

Conventionally, the above-mentioned SAW element and MEMS are mounted and packaged in a cavity substrate, so that a mounting area larger than the original device size has been required.
Further, since the movable part of the device is floated and handled separately, there has been a problem of breaking the device during the manufacturing process.
Therefore, wafer level packaging has been proposed as a method for facilitating miniaturization and handling.

  As a package structure such as a SAW element that can be packaged at a wafer level, Patent Document 1 discloses that a SAW element is formed with an IDT pattern on a piezoelectric substrate, and a cap is formed so that a cavity is formed on the IDT pattern. A structure and a manufacturing method are disclosed in which a recess is provided in a cap and a through hole for introducing an electric signal into a SAW element is provided in a cap.

  However, in the method described in Patent Document 1, a cavity structure is formed by bonding a device substrate and a cap part together in the state of a wafer that is an assembly when packaging at a wafer level. The wafer serving as the substrate and the wafer serving as the cap are simultaneously cut into the same size by dicing, and it is difficult to cut into different sizes. This is because it is difficult to cut the cap without cutting the wafer of the substrate because the thickness of the bonded portion of the substrate and the cap is very thin.

In the configuration in which the device substrate and the cap have the same size, since the device is sealed to surround the device in order to maintain hermeticity, the electrical wiring from the device is connected to the device as described above. It is necessary to pull out the substrate or cap so as to cause problems such as new technical problems and cost increase due to the addition of a manufacturing process.
JP 2004-80221 A

  The object of the present invention is to package a microdevice having a functional element having a vibrator or a movable part on a functional surface such as a MEMS, SAW element, or F-BAR, and packaging the substrate and the cap with different sizes. To provide a microdevice in which a level package is packaged in a form that can be mounted on a mounting substrate or the like via solder, and a packaging method thereof.

  In order to solve the above-described problems, a microdevice of the present invention includes a device substrate on which a functional element having a movable portion or a vibrator is formed on one main surface, and the one of the device substrates connected to the functional element. A connection pad formed on the main surface and a step shape protruding at a predetermined height from the one main surface, and forming a cavity that protects the functional element formation region except for the connection pad formation region A protective member provided on the one main surface; a plate-like electrode provided so as to be electrically connected to the connection pad; a connection portion for connecting the connection pad and the plate-like electrode; A part of the surface of the electrode is exposed, and at least an insulating resin layer formed so as to seal the connection portion and the contact of the plate electrode, the connection portion, the connection pad, and the protection member is provided. And exposed A packaged configured to be externally connected from the surface of the plate-shaped electrode.

In the above-described microdevice of the present invention, in the device substrate in which the functional element having the movable portion or the vibrator is formed on one main surface, the connection pad is formed on the one main surface so as to be connected to the functional element. A protective member is provided on one main surface so as to form a step shape projecting from the one main surface at a predetermined height and to form a cavity that protects the functional element formation region except for the connection pad formation region.
Further, a plate-like electrode electrically connected to the connection pad, and a connection portion for connecting the connection pad and the plate-like electrode are provided, a part of the surface of the plate-like electrode is exposed, and at least connected An insulating resin layer is formed so as to seal the contact between the part and the plate electrode, the connection part, the connection pad, and the protective member.
Furthermore, it is packaged so as to be externally connected from the exposed surface of the plate electrode.

  Further, in order to solve the above-described problem, the microdevice packaging method of the present invention is such that a functional element having a movable portion or a vibrator is formed on one main surface, and the one main surface is connected to the functional element. The device substrate on which the connection pad is formed has a stepped shape protruding at a predetermined height from the one main surface, and forms a cavity that protects the functional element formation region except for the connection pad formation region. A step of providing a protective member on the one main surface, and a lead frame in which a plate-like electrode is formed integrally with the frame is disposed at a predetermined position with respect to the device substrate, and the plate-like electrode is connected via a connecting portion. Electrically connecting the connection pad, exposing a part of the surface of the plate electrode, and at least a contact point between the connection portion and the plate electrode, the connection portion, the connection pad, and A package having a step of forming an insulating resin layer so as to seal the protective member, and a step of cutting the plate electrode from the frame, and being externally connected from the exposed surface of the plate electrode Turn into.

In the above-described microdevice packaging method of the present invention, a functional substrate having a movable part or a vibrator is formed on one main surface, and a connection pad is formed on one main surface so as to be connected to the functional device. A protective member is provided on the one main surface so as to form a cavity that protrudes from the one main surface at a predetermined height and forms a cavity that protects the functional element formation region excluding the connection pad formation region.
Next, a lead frame in which the plate electrode is integrally formed with the frame is disposed at a predetermined position with respect to the device substrate, and the plate electrode and the connection pad are electrically connected through the connection portion.
Next, an insulating resin layer is formed so that a part of the surface of the plate electrode is exposed and at least the contact point between the connection portion and the plate electrode, the connection portion, the connection pad, and the protective member are sealed.
Further, the plate electrode is cut from the frame.
As described above, it is packaged so as to be externally connected from the exposed surface of the plate electrode.

  The microdevice of the present invention is used as an inexpensive plate-like electrode that can be manufactured from a lead frame as a microdevice having a functional element having a vibrator or a movable part on a functional surface such as MEMS, SAW element or F-BAR, It can be easily flattened by configuring the surface of the exposed plate-like electrode on the surface of the insulating resin layer or the other main surface of the device substrate. It is a package form that can be mounted on.

  In addition, the microdevice packaging method of the present invention provides an inexpensive lead frame for packaging a microdevice having a functional element having a vibrator or a movable portion on a functional surface such as a MEMS, SAW element, or F-BAR. It can be easily flattened by using the surface of the insulating resin layer and the other main surface of the device substrate on the exposed surface of the plate electrode. Thus, it can be manufactured inexpensively in a package form that can be easily mounted.

  Hereinafter, a micro device and a packaging method thereof according to an embodiment of the present invention will be described with reference to the drawings.

First Embodiment FIG. 1A is a perspective view of a packaged microdevice according to this embodiment, and FIG. 1B is a cross-sectional view taken along the line XX ′ in FIG.
The microdevice shown in FIGS. 1A and 1B is a microdevice 20 including a functional element having a movable part or a vibrator such as a MEMS, a SAW element, or an F-BAR.

For example, a functional element 12 having a movable portion or a vibrator such as a MEMS, SAW element, or F-BAR is formed on one main surface of a device substrate 11 made of a semiconductor, and is mainly connected to the functional element 12. The connection pad 15 is formed on the surface, and further has a step shape protruding at a predetermined height from one main surface, thereby forming a cavity C that protects the formation region of the functional element 12 except for the formation region of the connection pad 15. Thus, a protective member configured by bonding a cap 13 made of glass or the like with an adhesive layer 14 such as a resin is provided on one main surface of the device substrate 11.
The cavity C composed of the one main surface and the inner surface of the protective member is maintained in, for example, a vacuum, a reduced pressure, a reducing atmosphere, or an inert gas atmosphere.

For example, the contacts of a plurality of plate-like electrodes 21a configured by cutting from the lead frame are arranged so as to face the connection pads 15, and bumps (projection electrodes) 22 formed on the connection pads 15 as connection portions. Thus, the connection pad 15 and the plate electrode 21a are electrically connected. The bumps 22 may be formed on the plate electrode 21a side.
Here, for example, in the above-described configuration, the plurality of plate-like electrodes 21a are spaced apart by a predetermined distance, and a protective member having a step shape between the plurality of separated plate-like electrodes 21a ( 13, 14).

  Further, for example, a part of the surface of the plate electrode 21a is exposed, and at least the contact between the bump 22 and the plate electrode 21a as the connection portion, the bump 22, the connection pad 15, and the protective member (13, 14) are sealed. An insulating resin layer 23 is formed so as to stop.

Here, for example, on the surface side of the exposed plate-like electrode 21a, the surface of the insulating resin layer and the exposed surface of the plate-like electrode 21a are formed to be substantially the same surface. “Substantially the same surface” allows a slight level difference that does not hinder the solder connection when the surface of the plate-like electrode 21a is mounted on the mounting substrate by soldering.
The packaged microdevice 20 is configured as described above, and is externally connected from the exposed surface of the plate electrode 21a.

  The configuration of the device substrate 11 on which the functional element 12 is formed, the connection pad 15 and the protection members (13, 14) is processed up to this form by a process at the wafer level, for example. Be called.

FIG. 2A is a perspective view of the above-described 0-level package 10, and FIG. 2B is a cross-sectional view taken along the line XX ′ in FIG.
For example, a functional element 12 having a movable portion or a vibrator is formed on one main surface of the device substrate 11, and a connection pad 15 connected to the functional element 12 is formed on one main surface.
Further, a cap made of glass or the like is formed in a stepped shape protruding at a predetermined height from the one main surface, and constitutes a cavity C that protects the formation region of the functional element 12 except for the formation region of the connection pad 15. A protective member is formed by bonding 13 with an adhesive layer 14 such as a resin.
The 0-level package has a structure that can prevent the active area from being damaged during the packaging or mounting process. In this state, airtightness is ensured and the movable part is protected, and the same handling as a package component can be performed.

FIG. 3A is a schematic plan view showing a layout of the plate-like electrodes 21a and the bumps 22 in the insulating resin layer of the microdevice shown in FIGS. 1A and 1B.
A protective member such as a cap 13 constituting the cavity C is disposed at the center of the package, and a plurality (18 in the drawing) of plate-like electrodes 21a are disposed so as to surround the outer peripheral portion, and bumps are provided on each of them. 22 are connected.

FIG. 3B is a schematic plan view showing the layout of the 0-level package constituting the microdevice shown in FIGS. 1A and 1B.
A protective member such as a cap 13 that constitutes the cavity C is disposed at the center of the device substrate 11, and a number of connection pads 15 corresponding to the plate-like electrodes 21a are disposed so as to surround the outer peripheral portion. Bumps 22 are connected and formed.

FIG. 4 is a cross-sectional view showing a mounting form of the packaged microdevice 20 according to the present embodiment.
The mounting substrate 30 has, for example, three resin layers (31, 32, 33) and patterned wirings (34, 35, 36, 37) alternately stacked, and the resin layer (31, 32, 33). Vertical wirings (38, 39, 40) that connect the wirings (34, 35, 36, 37) through one layer or a plurality of layers are formed.
On the wiring 37 formed on the surface of the mounting substrate 30 as described above, the side of the packaged microdevice 20 of the present embodiment exposed on the surface of the plate electrode 21 a faces the mounting substrate 30. The solder 50 is connected and mounted.

In the microdevice according to the present embodiment, the total thickness of the packaged microdevice is preferably 400 μm or less.
As described above, the total thickness of the package corresponds to the sum of the thickness of the 0-level package and the thickness of the insulating resin layer covering the protective member or the like. The total thickness can be 400 μm or less.

  The packaged micro device 20 of the present embodiment is an inexpensive plate-like device that can be manufactured from a lead frame as a micro device having a functional element having a vibrator or a movable part on a functional surface such as a MEMS, SAW element, or F-BAR. It is used as an electrode, and the surface side of the exposed plate-like electrode is constituted by the surface of the insulating resin layer and is easily flattened, and has a package form that can be easily mounted on a normal mounting board with solder.

Next, a packaging method for packaged microdevices according to the present embodiment will be described.
FIG. 5 is a plan view of a lead frame used in the present embodiment.
For example, a metal plate having a predetermined thickness is patterned by punching or the like, and the plate-like electrodes 21 are arranged at a predetermined interval and are formed integrally with the frame F.
A portion for supporting a built-in component, which is provided in the central portion of a normal lead frame, is not provided.

A process of packaging a microdevice using the lead frame shown in FIG. 5 will be described with reference to FIGS. 6A to 6C which are cross-sectional views of the process.
FIG. 6A corresponds to a cross-sectional view taken along the line XX ′ of FIG. 5, and shows, for example, a state in which a plurality of plate-like electrodes 21 in the lead frame are arranged with a predetermined gap.

  On the other hand, for example, on the device substrate 11 in which the functional element 12 having a movable part or a vibrator is formed on one main surface and the connection pad 15 is formed on one main surface so as to be connected to the functional element 12, A protective member (13, 14) is provided on one main surface so as to form a cavity C that protrudes at a predetermined height from the surface and forms a cavity C that protects the formation region of the functional element 12 except for the connection pad formation region. Further, bumps 22 such as solder ball bumps and stud bumps are provided on the connection pads 15 to form the 0-level package 10 having the configuration shown in FIGS. 2 (a) and 2 (b).

Next, as shown in FIG. 6B, for example, the lead frame in which the plate-like electrode 21 is formed integrally with the frame F is connected to the device substrate 11 of the 0-level package 10 with the connection pad 15 and the plate-like shape. The electrodes 21 are arranged to face each other at a predetermined position, and the plate-like electrodes 21 and the connection pads 15 are electrically connected via the bumps 22 to mount the 0-level package on the lead frame.
Here, for example, when the plate-like electrode 21 of the lead frame is arranged at a predetermined position with respect to the device substrate 11 and the plate-like electrode 21 and the connection pad 15 are electrically connected via the bumps 22, It arrange | positions so that the protection member (13,14) used as a level | step difference may enter between the several plate-shaped electrodes 21 spaced apart, and it mounts.

  Next, as shown in FIG. 6C, a part of the surface of the plate-like electrode 21 is exposed by, for example, injection molding, and at least the contact between the bump 22 and the plate-like electrode 21, the bump 22, and the connection pad 15 The insulating resin layer 23 is formed so as to seal the protective members (13, 14).

In the step of forming the insulating resin layer 23 in the above injection molding, for example, the surface of the insulating resin layer 23 and the surface of the exposed plate electrode 21 are substantially the same on the surface side of the exposed plate electrode 21. It forms so that it may become the surface.
Next, the plate electrode 21 is cut from the frame F. Thereby, the plate-like electrode 21a is independent of the frame, and is configured as a block-like conductor connected to the bump 22 and embedded in the insulating resin layer 23.

  As described above, the microdevice according to this embodiment can be packaged so as to be externally connected from the exposed surface of the plate electrode 21a.

  The microdevice packaging method according to the present embodiment uses an inexpensive lead frame in the form of a plate when packaging a microdevice having a functional element having a vibrator or a movable part on a functional surface such as a MEMS, SAW element, or F-BAR. It is used as an electrode, and on the exposed surface of the plate-like electrode, it can be easily flattened with the surface of the insulating resin layer and the other main surface of the device substrate. It can be manufactured inexpensively in a package form that can be easily mounted.

Second Embodiment FIG. 7A is a perspective view of a packaged microdevice according to this embodiment, and FIG. 7B is a cross-sectional view taken along line XX ′ in FIG. 7A.
The microdevice shown in FIGS. 7A and 7B is a microdevice 20 ′ having a functional element having a movable part or a vibrator such as a MEMS, SAW element, or F-BAR.

  In the same manner as in the first embodiment, a plurality of plates are provided on the outer periphery of the device substrate 11 of the 0-level package 10 including the device substrate 11 on which the functional elements 12 are formed, the connection pads 15 and the protective members (13, 14). The electrode 21a is spaced apart by a predetermined distance, and the device substrate 11 is placed between the spaced apart plate electrodes 21a.

Further, the contact point between the connection pad 15 of the device substrate 11 and the connection part of the plate electrode 21a is arranged to face the same side, and the connection pad 15 and the plate electrode 21a are electrically connected by the bonding wire 24 as the connection part. It is connected to the.
Further, for example, a part of the surface of the plate-like electrode 21a is exposed, and at least the contact between the bonding wire 24 and the plate-like electrode 21a as the connection portion, the bonding wire 24, the connection pad 15, and the protective member (13, 14). An insulating resin layer 23 is formed so as to seal.

Here, for example, on the surface side of the exposed plate-like electrode 21a, the surface of the insulating resin layer 23 and the other main surface of the device substrate 11 and the surface of the exposed plate-like electrode 21a are substantially the same surface. It is formed as follows. “Substantially the same surface” allows a slight level difference that does not hinder the solder connection when the surface of the plate-like electrode 21a is mounted on the mounting substrate by soldering.
The packaged microdevice 20 ′ is configured as described above, and is configured to be externally connected from the exposed surface of the plate electrode 21a.

FIG. 8 is a schematic plan view showing the layout of the plate-like electrode 21a, the connection pad 15, and the bonding wire 24 that connects them in the insulating resin layer of the microdevice shown in FIGS. 7 (a) and 7 (b).
A protective member such as a cap 13 constituting the cavity C is disposed at the center of the package, and a plurality (18 in the drawing) of connection pads 15 are disposed on the device substrate 11 so as to surround the outer peripheral portion. Yes.
Plate electrodes 21 a are arranged on the outer peripheral portion so as to correspond to the connection pads 15, and are connected by bonding wires 24.

FIG. 9 is a cross-sectional view showing a mounting form of the packaged microdevice 20 ′ according to the present embodiment.
As in the first embodiment, the mounting substrate 30 includes, for example, three resin layers (31, 32, 33), patterned wiring (34, 35, 36, 37), and vertical wiring (38, 39, 40). ) Etc.
On the wiring 37 formed on the surface of the mounting substrate 30 as described above, the side of the packaged microdevice 20 ′ of the present embodiment exposed on the surface of the plate electrode 21a faces the mounting substrate 30. The solder 50 is connected and mounted.

In the microdevice according to the present embodiment, the total thickness of the packaged microdevice is preferably 400 μm or less.
As described above, the total thickness of the package corresponds to the sum of the thickness of the 0-level package and the thickness of the insulating resin layer covering the protective member. However, the thickness can be 400 μm or less.

  The packaged micro device 20 ′ of this embodiment is an inexpensive plate that can be manufactured from a lead frame as a micro device having a functional element having a vibrator or a movable part on a functional surface such as a MEMS, SAW element, or F-BAR. The surface side of the exposed plate electrode is composed of the surface of the insulating resin layer and the other main surface of the device substrate and is easily flattened, and can be easily mounted on a normal mounting board with solder. It can be packaged.

Next, a packaging method for packaged microdevices according to the present embodiment will be described.
A lead frame similar to that of the first embodiment is used.
That is, for example, a metal plate having a predetermined thickness is patterned by punching or the like, and the plate-like electrodes 21 are arranged at a predetermined interval and are formed integrally with the frame F.

A process of packaging a microdevice using the above lead frame will be described with reference to FIGS. 10A to 10C and FIGS. 11A and 11B which are cross-sectional views of the process.
First, as shown in FIG. 10A, a mold sheet 25 is bonded to the lead frame. FIG. 10A shows a state in which a plurality of plate electrodes 21 in the lead frame are arranged with a predetermined gap.

  On the other hand, as in the first embodiment, the 0-level package 10 having the form shown in FIGS. 2A and 2B is formed.

  Next, as shown in FIG. 10B, for example, the device substrate 11 of the 0-level package 10 enters between the plurality of spaced apart plate-like electrodes 21 of the lead frame, and the connection pads 15 The 0-level package 10 is arranged on the mold sheet 25 so that the contact point between the contact point and the connecting portion of the plate electrode 21 faces the same side.

Next, as shown in FIG. 10C, a bonding wire 24 is formed to electrically connect the plate electrode 21 and the connection pad 15.
As described above, the 0-level package and the lead frame are connected.

  Next, as shown in FIG. 11A, a part of the surface of the plate electrode 21 is exposed by, for example, injection molding, and at least the contact between the bonding wire 24 and the plate electrode 21, the bonding wire 24, and the connection An insulating resin layer 23 is formed so as to seal the pad 15 and the protective members (13, 14).

  Since the mold sheet 25 is used as described above in the step of forming the insulating resin layer 23 in the injection molding, the surface of the insulating resin layer 23 and the surface of the device substrate are exposed on the exposed surface side of the plate electrode 21. The other main surface and the exposed surface of the plate-like electrode 21 are substantially the same surface.

  Next, as shown in FIG. 11B, the mold sheet 25 is peeled off, and the plate electrode 21 is cut from the frame F. Thereby, the plate-like electrode 21 a is configured as a block-like conductor that is independent of the frame and is connected to the bonding wire 24 and embedded in the insulating resin layer 23.

  As described above, the microdevice according to this embodiment can be packaged so as to be externally connected from the exposed surface of the plate electrode 21a.

  The microdevice packaging method according to the present embodiment uses an inexpensive lead frame in the form of a plate when packaging a microdevice having a functional element having a vibrator or a movable part on a functional surface such as a MEMS, SAW element, or F-BAR. It is used as an electrode, and on the exposed surface of the plate-like electrode, it can be easily flattened with the surface of the insulating resin layer and the other main surface of the device substrate. It can be manufactured inexpensively in a package form that can be easily mounted.

According to the micro device of the present embodiment described above, the following effects can be enjoyed.
By packaging a component hermetically sealed with a 0-level package using a lead frame, a component requiring a hollow structure can be packaged in a thin chip size, close to the chip size, In addition, it can be mounted on an inexpensive flat substrate. As a result, higher-density mounting is possible, and the product can be downsized.
If the 0-level package is to be mounted as it is, it may be necessary to provide a recess for the cap on the mounting substrate, or the mounting height and area may increase due to the resin layer sealing the cap on the mounting substrate. However, by packaging as in the present embodiment, mounting on a normal mounting board is possible with a small mounting area.

In addition, this package can be soldered to the mounting board, improving connection reliability, and soldering to the mounting board can be mounted with other surface mounting components by batch reflow. In addition, the manufacturing cost can be reduced.
Furthermore, it is advantageous in terms of mounting reliability such as heat cycle as compared with direct mounting of a bare chip on a mounting substrate.
As a result, the cost of the product can be reduced as a whole.

The present invention is not limited to the above embodiment.
For example, a semiconductor device including a micro device having a functional element such as a SAW element or F-BAR in addition to the MEMS can be used.
The mounting board is only given as an example above, and can be mounted on mounting boards or chips such as various interposers.
There is no limitation on the manufacturing method of the 0-level package, and various methods can be applied.
In addition, various modifications can be made without departing from the scope of the present invention.

The packaged micro device of the present invention can be applied to a packaged micro device having a functional element having a movable part or a vibrator on a functional surface such as a MEMS, SAW element, or F-BAR.
The microdevice packaging method of the present invention can be applied to a method of packaging a microdevice having a functional element having a movable part or a vibrator on a functional surface such as a MEMS, SAW element, or F-BAR.

FIG. 1A is a perspective view of a packaged micro device according to a first embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along line X-X ′ in FIG. 2A is a perspective view of the 0-level package 10, and FIG. 2B is a cross-sectional view taken along line X-X ′ in FIG. 3A is a schematic plan view showing the layout of the plate-like electrodes and bumps in the insulating resin layer of the microdevice shown in FIGS. 1A and 1B. FIG. 3B is a plan view of FIG. It is a schematic top view which shows the layout of the 0-level package which comprises the microdevice shown to (a) and (b). FIG. 4 is a cross-sectional view showing a packaged microdevice mounting form according to the first embodiment of the present invention. FIG. 5 is a plan view of the lead frame used in the first embodiment of the present invention. 6A to 6C are cross-sectional views of the steps of the microdevice packaging method according to the first embodiment of the present invention. FIG. 7A is a perspective view of a packaged microdevice according to a second embodiment of the present invention, and FIG. 7B is a cross-sectional view taken along line X-X ′ in FIG. FIG. 8 is a schematic plan view showing a layout of connection pads, plate electrodes, and bonding wires in the insulating resin layer of the microdevice shown in FIGS. 7A and 7B. FIG. 6 is a cross-sectional view showing a packaged microdevice mounting form according to the second embodiment of the present invention. FIGS. 10A to 10C are cross-sectional views of the steps of the microdevice packaging method according to the second embodiment of the present invention. FIGS. 11A and 11B are cross-sectional views of the steps of the microdevice packaging method according to the second embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... 0-level package, 11 ... Device substrate, 12 ... Functional element, 13 ... Cap, 14 ... Adhesive layer, 15 ... Connection pad, 20, 20 '... Micro device, 21, 21a ... Plate electrode, 22 ... Bump (Projection electrode), 23 ... insulating resin layer, 24 ... bonding wire, 25 ... mold sheet, 30 ... mounting substrate, 31, 32, 33 ... resin layer, 34, 35, 36, 37 ... wiring, 38, 39, 40 ... Vertical wiring, 50 ... Solder, C ... Cavity, F ... Frame

Claims (12)

A device substrate on which a functional element having a movable part or a vibrator is formed on one main surface;
A connection pad formed on the one main surface of the device substrate to connect to the functional element;
A protection provided on the one main surface so as to form a step that protrudes from the one main surface at a predetermined height and forms a cavity that protects the functional element formation region except for the connection pad formation region. A member,
A plate-like electrode provided to be electrically connected to the connection pad;
A connection part for connecting the connection pad and the plate electrode;
An insulating resin layer formed so as to expose a part of the surface of the plate electrode and seal at least the contact between the connection portion and the plate electrode, the connection portion, the connection pad, and the protection member And a microdevice packaged so as to be externally connected from the exposed surface of the plate electrode. Formed so that the surface of the insulating resin layer and / or the other main surface of the device substrate and the exposed surface of the plate electrode are substantially the same surface on the exposed surface side of the plate electrode. The micro device according to claim 1. Contact points between the connection pads and the connection portions of the plate-like electrodes are arranged to face each other,
The microdevice according to claim 1, wherein the connection portion is a protruding electrode. A plurality of the plate-like electrodes are arranged apart by a predetermined distance,
The microdevice according to claim 3, wherein the protection member having the step shape is interposed between the plurality of spaced apart plate-like electrodes. The contact point between the connection pad and the connection part of the plate electrode is arranged to face the same side,
The micro device according to claim 1, wherein the connection portion is a bonding wire. A plurality of the plate-like electrodes are arranged apart by a predetermined distance,
The microdevice according to claim 5, wherein the device substrate is disposed so as to enter between the plurality of plate-like electrodes spaced apart from each other. A functional substrate having a movable part or a vibrator is formed on one main surface, and a device substrate having a connection pad formed on the one main surface so as to be connected to the functional element is formed at a predetermined height from the one main surface. Providing a protective member on the one main surface so as to form a cavity that protrudes and forms a cavity that protects the formation region of the functional element except the formation region of the connection pad;
A step of arranging a lead frame in which a plate electrode is formed integrally with the frame at a predetermined position with respect to the device substrate, and electrically connecting the plate electrode and the connection pad via a connection portion;
An insulating resin layer is formed so that a part of the surface of the plate electrode is exposed and at least the contact between the connection portion and the plate electrode, the connection portion, the connection pad, and the protection member are sealed. Process,
Cutting the plate electrode from the frame, and
A method of packaging a microdevice, wherein packaging is performed so that external connection is made from the exposed surface of the plate electrode. In the step of electrically connecting the plate electrode and the connection pad and / or the step of forming the insulating resin layer, on the exposed surface side of the plate electrode, the surface of the insulating resin layer and / or the The method for packaging a microdevice according to claim 7, wherein the other main surface of the device substrate and the exposed surface of the plate electrode are formed to be substantially the same surface. And further forming a protruding electrode on the connection pad or the plate electrode,
In the step of electrically connecting the plate electrode and the connection pad, the connection pad and the plate electrode are opposed to each other, and the plate electrode and the connection pad are connected via the protruding electrode as the connection portion. The microdevice packaging method according to claim 7. As a lead frame in which plate electrodes are formed integrally with a frame, a lead frame having a configuration in which a plurality of the plate electrodes are arranged separated by a predetermined distance is used.
In the step of disposing the lead frame at a predetermined position with respect to the device substrate and electrically connecting the plate electrode and the connection pad via a connection portion, the plurality of plate electrodes separated from each other are connected. 10. The micro device packaging according to claim 9, wherein the step-shaped protective member is disposed so as to enter and the plate-like electrode and the connection pad are electrically connected via the protruding electrode. Method. In the step of disposing the lead frame at a predetermined position with respect to the device substrate and electrically connecting the plate electrode and the connection pad via a connection portion, the connection pad and the plate electrode The micro device packaging method according to claim 7, wherein the contact point with the connection portion is arranged so as to face the same side, and the plate electrode and the connection pad are connected as a connection portion via a bonding wire. As a lead frame in which plate electrodes are formed integrally with a frame, a lead frame having a configuration in which a plurality of the plate electrodes are arranged separated by a predetermined distance is used.
In the step of disposing the lead frame at a predetermined position with respect to the device substrate and electrically connecting the plate electrode and the connection pad via a connection portion, the plurality of plate electrodes separated from each other are connected. The method of packaging a microdevice according to claim 11, wherein the device substrate is disposed so as to be inserted into and electrically connected to the plate electrode and the connection pad via the bonding wire.

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