JP2006095799A - Method and apparatus for recovering substrate material from optical disk - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method which can exactly recover a substrate material from a lamination type optical disk. <P>SOLUTION: Bending stress M is applied to the optical disk 1-1 in which a data layer 1b is formed between upper and lower substrate layers 1a and 1d from its peripheral edge toward the center to break the data layer 1b. A data layer breaking disk 1-2 is separated into two with the broken data layer 1b made a boundary, and unnecessary materials including the ruin of the data layer 1b are removed by cutting from each separated disk 1-3 or 1-4 including the substrate layers. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method and an apparatus for recovering a substrate material from an optical disc that has been treated as a defective product.

  In connection with the above, the re-published patent publication of International Publication No. WO 00/58957 by the present applicant describes a gap between layers having weak adhesion by cutting the outer peripheral surface of an optical disc such as CD, CD-R, CD-RW. And a method of recovering the substrate material by peeling off the non-substrate layer side by forcibly injecting gas such as air into the gap and removing residual unnecessary material from the substrate layer side by cutting. Has been.

Compared with the previous method of recovering the substrate material by chemically removing the layers other than the substrate layer from the optical disc, this method can recover a high-quality substrate material that does not change its chemical properties and is recyclable. There is an advantage that can be improved significantly.
Republished patent gazette of International Publication No. WO00 / 58957

  By the way, optical disks are roughly classified into those called single substrate type and those called bonded type, and single substrate type optical disks have a structure in which a data layer and a cover layer are sequentially formed on one substrate layer. The optical disk on the bonding side has a structure in which a data layer is formed on one of the two upper and lower substrate layers, and the other substrate layer is bonded to this through an adhesive layer.

  There are DVD ± R, DVD ± RW, DVD-RAM, DVD-ROM, and the like as the types of the bonded optical discs of the latter type. Etc., and the layer structure of the data layer differs depending on the type and type of the optical disc.

  Since this bonded optical disk has two substrate layers that are substantially equal in thickness and strength across the data layer, the processing method mainly for single-substrate optical disks described in the background art. It is difficult to efficiently recover the substrate material from the upper and lower substrate layers.

  The present invention was created in view of the above circumstances, and an object of the present invention is to provide a method and an apparatus for recovering a substrate material from an optical disc that can accurately recover the substrate material from a bonded optical disc. Is to provide.

  In order to achieve the above object, a recovery method according to the present invention is a method for recovering a substrate material from a bonded optical disc having a structure in which a data layer is interposed between two upper and lower substrate layers, A bending stress applying step for applying a bending stress from the outer periphery to the center of the disk to break the data layer, and a substrate layer separating step for separating the data layer breaking disk into two parts by separating the broken data layer as a boundary. And an unnecessary object removing step of removing unnecessary objects including the remnants of the data layer from each separation disk including the substrate layer by cutting.

  The recovery device according to the present invention is a device for recovering a substrate material from a bonded optical disk having a structure in which a data layer is interposed between two upper and lower substrate layers. A bending stress applying device for applying a bending stress toward the center to break the data layer, a substrate layer separating device for separating the data layer breaking disk from the broken data layer as a boundary, and a substrate layer It is characterized by comprising an unnecessary object removing device that removes unnecessary objects including remnants of the data layer from each of the included separation disks by cutting.

  ADVANTAGE OF THE INVENTION According to this invention, the method and apparatus which collect | recovers board | substrate materials from an optical disk which can collect | recover board | substrate materials effectively from a bonded optical disk can be provided.

  The above object and other objects, structural features, and operational effects of the present invention will become apparent from the following description and the accompanying drawings.

  First, with reference to FIGS. 1 and 2, a bonded optical disk that is a target for collecting substrate material will be described.

  The optical disc 1 has a disk shape having a center hole (no reference), and has a structure in which a data layer 1b is interposed between two upper and lower substrate layers 1a and 1d, specifically a data layer 1b. It has a structure in which the substrate layer 1a and the upper substrate layer 1d are bonded together through an adhesive layer 1c. The adhesive layer 1c slightly protrudes outside the outer peripheral edges of the lower substrate layer 1a and the upper substrate layer 1d due to the bonding process, and the protruding portion 1c1 is formed on the outer peripheral edges of the lower substrate layer 1a and the upper substrate layer 1d. Wrap around.

  The lower substrate layer 1a and the upper substrate layer 1d, which are materials recovery partners, are made of optical plastic such as PC (polycarbonate), PMMA (polymethyl methacrylate), COP (cycloolefin polymer), and the adhesive layer 1c is made of ultraviolet curable plastic or the like. Become.

  The layer structure of the data layer 1b differs depending on the disc type. For example, in the case of a single layer DVD ± R, the dye layer and the reflective layer correspond to this, and in the case of a single layer DVD ± R, the dye layer. , Transflective layers, dye layers and reflective layers, and in the case of single-layer DVD ± RW and DVD-RAM, dielectric layers, phase change layers, dielectric layers and reflective layers In the case of a single-sided DVD-ROM, the concavo-convex layer and the reflective layer correspond to this.

  Next, a collection | recovery apparatus is demonstrated with reference to FIGS.

  This recovery device includes an outer peripheral cutting device 100, a bending stress applying device 200, a substrate layer separating device 300, and an unnecessary material removing device 400. The outer peripheral cutting device 100, the bending stress applying device 200, and the substrate layer separating device 300 are common tables. The unnecessary object removing device 400 is arranged on T1 and arranged on another table T2.

  The outer peripheral cutting device 100 shown in FIG. 3 includes a rotary table 101 having a support protrusion 101a at the center of the upper surface, and a rotary drive source such as a motor with a speed reducer, and a rotary shaft (not shown) connected to the center of the lower surface of the rotary table 101. The rotary table driving unit 102, the cutting tool 103 for cutting the outer peripheral edge of the optical disc 1, the cutting tool holder 104 to which the cutting tool 103 is attached, and a linear driving source such as a motor-driven ball screw. And a tool holder driving unit 105 coupled to the tool holder 104. The rotary table 101 can rotate in the direction of the arrow (see FIG. 3), and the tool holder 104 (tool 103) can move linearly in the direction of the arrow (see FIG. 3).

  The bending stress applying device 200 shown in FIGS. 3 and 5 includes a rotary table 201 having a support protrusion 201a at the center of the upper surface, and a rotary drive source such as a motor with a speed reducer, and the rotary shaft 202a at the center of the lower surface of the rotary table 201. The connected rotary table driving unit 202, the holding unit 203 having the concave portion 203a in which the support protrusion 201a of the rotary table 201 can be fitted on the lower surface and the shaft supporting portion 203b made of a bearing or the like on the upper side, and a linear drive source such as a cylinder A holding unit driving unit 204 having the linear moving unit 204a coupled to the holding unit 203, and a support base 205 for supporting the holding unit driving unit 204 so that the center of the holding unit 203 coincides with the center of the rotary table 201. The first roller 206, the first roller holder 207 that rotatably supports the first roller 206, and the first roller 20. The second roller 208 located farther away from the rotary table 201, the second roller holder 209 that rotatably supports the second roller 208 in an inclined state, and a linear drive source such as a cylinder. 210a is connected to the second roller holder 209, the second roller holder driving unit 210, the main roller holder 211 to which the first roller holder 207 and the second roller holder driving unit 210 are attached, and a straight line such as a motor driving ball screw. A main roller holder driving unit 212 including a driving source and having a linear moving unit (not shown) coupled to the main roller holder 211 is provided. The rotary table 201 can rotate in the arrow direction (see FIG. 3), the holding unit 203 can move linearly in the arrow direction (see FIG. 5), and the second roller holder 209 (second roller 208) can move in the arrow direction (see FIG. 5). The main roller holder 211 (first roller 206 and second roller 208) can be moved in the arrow direction (see FIG. 3).

  The substrate layer separation apparatus 300 shown in FIGS. 3 and 6 includes a first suction part 301 having a support protrusion 301a at the center of the upper surface and a plurality of suction pads 302 disposed on the upper surface, and a surface facing the first suction part 301. A plurality of suction pads 304 arranged on the same, a rotary arm 305 that supports the second suction portion 303, and a rotary drive source such as a rotary cylinder. The rotary shaft 306a is connected to the end of the rotary arm 305. And a support base 307 that supports the rotary arm drive unit 306. The rotating arm 305 (second suction portion 303) can rotate in the direction of the arrow (see FIGS. 3 and 6). Further, the height position of the first suction portion 301 is set so that the second suction portion 303 faces the first suction portion 301 when the rotary arm 305 rotates 180 degrees counterclockwise from the standby position in FIG. It is adjusted by the leg 301b.

  4 includes a rotary table 401 having a support protrusion 401a at the center of the upper surface and a rotary drive source such as a motor with a speed reducer, and a rotary shaft (not shown) at the center of the lower surface of the rotary table 401. The connected rotary table drive unit 402, a cutting tool 403 for cutting unnecessary objects existing on the surfaces of the separation disks 1-3 and 1-4 (see FIGS. 13C and 14), and a cutting tool 403 And a tool holder driving unit 405 including a linear driving source (not shown) composed of a linear driving source such as a motor driven ball screw and connected to the tool holder 404. The rotary table 401 can rotate in the direction of the arrow (see FIG. 4), and the tool holder 404 (the tool 403) can move linearly in the direction of the arrow (see FIG. 4). Further, the height position of the cutting tool 403 is arbitrarily set by a height adjusting mechanism (not shown) arranged between the cutting tool CL 403 so that the cutting depths CL2 and CL3 (see FIGS. 16 and 17) described later can be adjusted. It can be changed.

  Next, a collection method realized by the above-described collection apparatus will be described with reference to FIGS.

  When recovering the substrate material from the optical disc 1 shown in FIGS. 1 and 2, as shown in FIG. 7, the uppermost layer stacked on the stocker (not shown) in the upside down direction (the lower substrate layer 1a faces up). The optical disk 1 can be transported by a transport device (not shown) and placed on the rotary table 101 of the outer peripheral cutting device 100 so that the center hole (not shown) fits into the support protrusion 101a, and can fit into the support protrusion 101a. The optical disk 1 placed using a suitable disk presser (not shown) or the like is prevented from moving with respect to the rotary table 101. Then, the rotary table 101 is rotated in the direction of the arrow, and the tool holder 104 is moved at a constant speed in the direction of the arrow, and the outer peripheral edge of the optical disc 1 is cut by the tool 103.

  CL1 in FIG. 8A indicates a cutting completion position. Here, a position where the protruding portion 1c1 of the adhesive layer 1c is completely removed and the data layer 1b is exposed from the outer peripheral edge is defined as a cutting completion position. After completion of cutting, the tool holder 104 is returned and the rotation of the rotary table 101 is stopped. Thus, the outer peripheral cutting disc 1-1 as shown in FIG. 8B is obtained.

  Subsequently, as shown in FIG. 9, the outer peripheral cutting disc 1-1 on the rotary table 101 of the outer peripheral cutting device 100 is transported by a transport device (not shown), and a center hole ( (No reference) is placed so as to fit into the support protrusion 201a. Then, as shown in FIG. 10, the holding part 203 is lowered so that the recess 203 a is fitted to the support protrusion 201 a, and the outer peripheral cutting disk 1 placed on the lower surface of the holding part 203 by pressing with the outer peripheral cutting disk 1-1. -1 is prevented from moving with respect to the rotary table 201. Then, as shown in FIGS. 10 and 11, the main roller holder 211 is moved in the direction of the arrow to move the first roller 206 to the lower side of the outer peripheral cutting disc 1-1, and the second roller 208 is outer peripheral cut. Move to the upper side of the disk 1-1. Then, as shown in FIG. 11, the rotary table 201 is rotated and the second roller 208 is lowered to a predetermined height position so that the second roller 208 and the second roller 208 having different positions in the radial direction of the outer peripheral cutting disc 1-1 are arranged. While maintaining the state in which the outer peripheral cutting disc 1-1 is bent downward by one roller 206, the second roller 208 and the first roller 206 are further moved at a constant speed toward the center of the outer peripheral cutting disc 1-1 to cause bending stress. Is granted.

  FIG. 12 (A) shows the bending stress applied to the peripheral cutting disc 1-1 by the above operation. A bending stress proportional to the distance from the neutral plane NF is generated in the cross section of the outer peripheral cutting disc 1-1 to which the bending stress M is applied as shown in FIG. For example, when the distance Lf from the neutral plane NF to the boundary between the data layer 1b and the lower substrate layer 1a is 20 μm and the distance Lp from the neutral plane NF to the surface of the lower substrate layer 1a is 600 μm, the lower substrate layer 1a ( The ratio of the stress σp generated in the upper substrate layer 1d) and the stress σf generated in the data layer 1b is σp: σf = Lp: Lf = 600: 20 = 30: 1. Therefore, if the strength JK of the lower substrate layer 1a (upper substrate layer 1d) is higher than 30 times the strength SK of the data layer 1b, the data layer 1b is first destroyed by the applied bending stress M. Will do. Taking the case of a typical single-sided single layer bonded DVD ± R as an example, the strength of the lower substrate layer 1a (upper substrate layer 1d) made of optical plastic is 100 times the strength of the data layer 1b. As described above, only the data layer 1b is surely destroyed by the above operation. Incidentally, the destruction here includes cracks, delamination, and the like generated in any of the layers constituting the data layer 1b.

  After the bending stress is applied (after destruction of the data layer), the second roller 208 and the main roller holder 211 are returned, the rotation of the rotary table 201 is stopped, and the holding unit 203 is returned. Thus, the data layer destruction disk 1-2 in which the destruction part CR is formed in almost the entire area of the data layer 1b as shown in FIG. 12B is obtained.

  Subsequently, as shown in FIG. 13A, the data layer destruction disk 1-2 on the rotary table 201 of the bending stress applying device 200 is transported by a transport device (not shown) and the first adsorption of the substrate layer separation device 300 is performed. The center hole (no reference) is placed on the portion 301 so as to fit into the support protrusion 301a, and the upper substrate layer 1d side is sucked and held by the first suction portion 301. Then, as shown in FIG. 13B, the rotary arm 305 is rotated 180 degrees from the standby position, and the lower substrate layer 1a side of the data layer destruction disk 1-2 is sucked and held by the second suction portion 303. Then, as shown in FIG. 13C, the rotary arm 305 is returned from the 180-degree rotation position to the standby position, and the data layer destruction disk 1-2 is separated into two pieces with the destroyed data layer 1b as a boundary. To separate. Thus, two separation disks 1-3 (upper substrate layer 1d side) and 1-4 (lower substrate layer 1a side) as shown in FIG. 14 are obtained.

  Subsequently, as shown in FIG. 15, the separation disc 1-3 (upper substrate layer 1 d side) on the first adsorption unit 301 of the substrate layer separation apparatus 300 is conveyed by a conveyance device (not shown) to remove the unnecessary material removal apparatus 400. The separation disk 1 is placed on the rotary table 401 so that the center hole (not shown) is fitted to the support protrusion 401a and is placed using a disk presser (not shown) that can be fitted to the support protrusion 401a. -3 is prevented from moving with respect to the rotary table 401. Then, the rotary table 401 is rotated in the direction of the arrow, and the tool holder 404 is moved at a constant speed in the direction of the arrow, and the surface of the separation disk 1-3 is cut by the tool 403.

  CL2 in FIG. 16A indicates the cutting depth. Here, the depth at which the debris of the data layer 1b remaining on the separation disk 1-3 and the adhesive layer 1c are completely removed is defined as the cutting depth. Yes. After the cutting is completed, the tool holder 404 is returned and the rotation of the rotary table 401 is stopped. Thus, a recovery disk 1-5 made only of the substrate material as shown in FIG. 16B is obtained.

  Further, the separation disk 1-4 (on the lower substrate layer 1a side) on the second adsorption unit 303 of the substrate layer separation apparatus 300 is conveyed by a conveyance device (not shown), and the unnecessary material removal apparatus 400 or a separate device is unnecessary. The center hole (no reference) is placed on the turntable 401 of the object removing device 400 so as to be fitted to the support protrusion 401a, and placed using a disk presser (not shown) that can be fitted to the support protrusion 401a. The separated disc 1-4 is prevented from moving with respect to the rotary table 401. Then, the rotary table 401 is rotated in the direction of the arrow, and the tool holder 404 is moved at a constant speed in the direction of the arrow, and the surface of the separation disk 1-4 is cut by the tool 403.

  CL3 in FIG. 17A indicates the cutting depth. Here, the depth at which the debris of the data layer 1b remaining on the separation disk 1-4 is completely removed is the cutting depth. After the cutting is completed, the tool holder 404 is returned and the rotation of the rotary table 401 is stopped. As described above, the recovery disk 1-6 made of only the substrate material as shown in FIG.

  Thus, according to the above-described recovery apparatus and recovery method, the outer peripheral cutting process by the outer peripheral cutting apparatus 100 and the bending stress applying process by the bending stress applying apparatus 200 are performed on the bonded optical disk 1 to be recovered from the substrate material. , The substrate layer separation step by the substrate layer separation device 300 and the unnecessary material removal step by the unnecessary material removal device 400 are sequentially performed, so that the recovery disks 1-5 and 1-6 containing only the substrate material from the bonded optical disk 1 are obtained. Thus, the substrate material can be collected accurately.

  This effect is not limited to the single-sided single-layer type or single-sided double-layer type as long as it is a bonded type optical disc, and can also be obtained in the same way even in a double-sided single-layer type or double-sided double-layer type optical disc. Regardless of the type of ± R, DVD ± RW, DVD-RAM, DVD-ROM, etc., it can be obtained similarly.

  In the above description, the peripheral cutting process is performed by the peripheral cutting apparatus 100. However, in the case of an optical disk in which the data layer can be sufficiently destroyed by the bending stress applying process without cutting the outer peripheral edge of the optical disk. The outer periphery cutting process by the outer periphery cutting device 100 is not necessarily required.

  In the above description, the bending stress applying device 200 using the first roller 206 and the second roller 208 is shown, but a rotatable sphere may be used instead of both rollers. Of course, even if there are some scratches on the surface of the rotating optical disk (peripheral cutting disk 1-1), the purpose of collecting the substrate material can be achieved. The pressing device may be used instead of both rollers.

  Further, in the above description, the bending stress applying step is shown after the outer peripheral cutting step. However, in the case of an optical disc in which the data layer cannot be sufficiently destroyed in the bending stress applying step after the outer peripheral cutting step, the outer peripheral cutting is performed. It is good to implement the crevice formation process mentioned below between a process and a bending stress provision process.

  FIG. 18 shows a tear forming apparatus suitable for carrying out this tear forming process. The tear forming device 500 includes a shaft 501 having flanges 501a and 501b at the upper and lower ends, a disc-like cutter 502 attached to substantially the center of the shaft 501, and a truncated cone-like portion 503a on the outer peripheral surface. The lower guide 503 is provided at the lower position of the cylindrical cutter 502 so as to be movable up and down, and has an inverted frustoconical portion 504a on the outer peripheral surface thereof. An upper guide 504, a coil spring 506 that biases the lower guide 503 upward, and a coil spring 507 that biases the upper guide 504 downward are provided.

  When the tear forming device 500 performs the tear forming process, as shown in FIG. 19, at least one of the shaft 501 (disc-shaped cutter 502) and the outer peripheral cutting disk 1-1 of the tear forming device 500 is rotated about the axis. Then, the outer peripheral cutting disc 1-1 is pushed into the upper and lower guides 503 and 504 so that the exposed edge of the data layer 1b of the outer peripheral cutting disc 1-1 is in contact with the disc-shaped cutter 502. By this pushing, the upper and lower guides 503 and 504 are retracted in the direction of the arrow against the urging force of the upper and lower coil springs 506 and 507, respectively, and the disc-like cutter 502 bites into the exposed edge of the data layer 1b to form a tear CF.

  If the tear CF is formed in advance as described above on the exposed edge of the data layer 1b of the outer peripheral cutting disk 1-1 before the bending stress applying step, stress concentration occurs in the tear CF in the bending stress applying step. This makes it possible to reliably start the destruction of the data layer 1b and the destruction itself.

It is a perspective view of the optical disk used as a process target. It is principal part sectional drawing of the optical disk shown in FIG. It is a top view of a recovery device. It is a top view of a recovery device. It is a side view of the bending stress application apparatus shown in FIG. FIG. 4 is a side view of the substrate layer separation device shown in FIG. 3. It is explanatory drawing of an outer periphery cutting process. It is explanatory drawing of an outer periphery cutting process. It is explanatory drawing of a bending stress provision process. It is explanatory drawing of a bending stress provision process. It is explanatory drawing of a bending stress provision process. It is explanatory drawing of a bending stress provision process. It is explanatory drawing of a substrate layer separation process. It is explanatory drawing of a substrate layer separation process. It is explanatory drawing of an unnecessary thing removal process. It is explanatory drawing of an unnecessary thing removal process. It is explanatory drawing of an unnecessary thing removal process. It is a side view of a tear formation apparatus. It is description of a crack formation process.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Optical disk, 1a ... Lower board | substrate layer, 1b ... Data layer, 1d ... Upper board | substrate layer, 100 ... Perimeter cutting apparatus, 200 ... Bending stress application apparatus, 300 ... Substrate layer separation apparatus, 400 ... Unnecessary substance removal apparatus, 500 ... Rip forming device.

Claims (6)

A method of recovering a substrate material from a bonded optical disc having a structure in which a data layer is interposed between two upper and lower substrate layers,
A bending stress applying step for applying a bending stress from the outer periphery to the center of the optical disc to destroy the data layer;
A substrate layer separation step of separating the data layer destruction disk into two by separating the destroyed data layer as a boundary;
An unnecessary object removal step of removing unnecessary objects including the remnants of the data layer by cutting from each separation disk including the substrate layer,
A method for recovering a substrate material from an optical disc. Before the bending stress application step, further comprising a peripheral cutting step of cutting the outer peripheral edge of the optical disc to expose the data layer from the outer peripheral edge,
A method for recovering a substrate material from an optical disc according to claim 1. Further comprising a tear forming step for forming a tear at the exposed edge of the data layer of the peripheral cutting disc between the peripheral cutting step and the bending stress applying step,
A method for recovering a substrate material from an optical disc according to claim 2. An apparatus for recovering a substrate material from a bonded optical disc having a structure in which a data layer is interposed between two upper and lower substrate layers,
A bending stress applying device for applying a bending stress from the outer peripheral edge to the center of the optical disc to destroy the data layer;
A substrate layer separation device that separates the data layer destruction disk into two parts by separating the destroyed data layer as a boundary;
An unneeded matter removing device that removes unneeded items including the debris of the data layer from each separation disk including the substrate layer by cutting,
An apparatus for recovering a substrate material from an optical disc. Before the bending stress is applied by the bending stress applying device, further comprising an outer peripheral cutting device for cutting the outer peripheral edge of the optical disc and exposing the data layer from the outer peripheral edge,
An apparatus for recovering a substrate material from an optical disk according to claim 4. A tear forming device for forming a tear on the exposed edge of the data layer of the peripheral cutting disc between the peripheral cutting by the peripheral cutting device and the bending stress by the bending stress applying device;
An apparatus for recovering a substrate material from an optical disc according to claim 5.

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