JP2005348121A - Piezoelectric oscillator and electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a piezoelectric oscillator capable of easily writing information.
A piezoelectric oscillator 10 includes a piezoelectric vibrator 14, an electronic component 16 electrically connected to the piezoelectric vibrator 14 and capable of storing information, and the electronic component 16 and the piezoelectric vibrator 14. A sealed mold package, a plurality of mounting terminals 44 that are exposed on the bottom surface of the mold package and electrically connected to the electronic component 16, and a surface that is exposed on the top surface of the mold package; The control unit is electrically connected to the electronic component 16 and has a control terminal for writing the information to the electronic component 16.
[Selection] Figure 1

Description

  The present invention relates to a piezoelectric oscillator, and more particularly to a piezoelectric oscillator capable of easily writing information to a programmable piezoelectric oscillator or a temperature-compensated piezoelectric oscillator, and an electronic apparatus having the piezoelectric oscillator.

  Piezoelectric oscillators are mounted on various electronic devices. Some piezoelectric oscillators have a voltage control function, a temperature compensation function, and the like in accordance with the use of electronic equipment. In order to make this piezoelectric oscillator highly accurate and multifunctional, the piezoelectric oscillator has an oscillation inverter, phase synchronization function, memory function to store temperature compensation data for a given temperature, voltage conversion function, varicap diode function, control function Etc. are mounted electronic parts (IC chip). Each function of the piezoelectric oscillator is adjusted to desired characteristics by using this IC chip.

  For this reason, the piezoelectric oscillator needs to be provided with a write terminal in addition to the basic function terminal of the piezoelectric oscillator. The basic function terminal is a terminal used for operating the piezoelectric oscillator, and includes, for example, a terminal for supplying a power supply voltage, a ground terminal, an output terminal of the oscillator, and a control terminal of the oscillator, and is formed on the back surface of the piezoelectric oscillator. Yes. The write terminal is a terminal for inputting frequency adjustment and setting of a phase synchronization circuit from the outside to an electronic component mounted on the piezoelectric oscillator, and is formed on the side surface or the back surface of the piezoelectric oscillator.

An example of a piezoelectric oscillator having a mold package structure is disclosed in Patent Document 1. A piezoelectric oscillator according to Patent Document 1 electrically connects a piezoelectric vibrator and a semiconductor, wire bonding is performed from the semiconductor to a write terminal and a basic function terminal, and the periphery of the semiconductor and the piezoelectric vibrator is made of resin. A mold package is formed by sealing, and the writing terminal and the basic function terminal protruding from the side surface of the mold package are bent downward.
Japanese Patent No. 2621828

When the write terminal is formed so as to protrude from the side surface of the piezoelectric oscillator having the mold package structure, it is necessary to bend or cut an unnecessary frame portion after sealing with the mold material in order to complete the outer shape of the piezoelectric oscillator. However, when cutting an unnecessary frame, there is a problem that writing cannot be performed again after writing information to the piezoelectric oscillator and cutting the unnecessary frame. Therefore, after the user mounts the piezoelectric oscillator on the mounting board, information cannot be written after the piezoelectric oscillator is completed, so products cannot be shipped from locations close to the user, such as sales offices and distributors. There is a problem that requires more lead time.
Also, if the frame that has the function of the writing terminal is left on the side by bending, etc., the solder between the mounting board and the mounting terminal of the piezoelectric oscillator will come into contact with the side terminal, and the piezoelectric oscillator will operate normally. May not work. In addition, when writing is desired after mounting on a high-density mounting board, the piezoelectric oscillator and other electronic components are mounted adjacent to each other, so it is impossible to contact the writing terminal with an information writing probe. There is a problem that it is.

  In recent years, along with the downsizing of electronic devices, the piezoelectric oscillators mounted on electronic devices are also miniaturized, so the size of the write terminal is reduced, and the probe for writing information is brought into contact with the write terminal. Has become difficult. If the probe does not come into contact with the write terminal, information is not written to the piezoelectric oscillator, which causes a write error. And since the process of inspecting the electrical characteristics of the piezoelectric oscillator is provided after the process of cutting the lead from the frame, it could not be rewritten, or it was not rewritten in consideration of mass production. There was a risk that the process yield would decrease.

  Further, when the writing terminal is formed to be bent downward from the piezoelectric oscillator, a terminal that the user must be disconnected from is formed on the back surface of the piezoelectric oscillator. That is, since the user uses only the basic function terminal and does not use the write terminal, the write terminal is not connected. However, since the piezoelectric oscillator is miniaturized, the area that can be mounted on the board is small especially in a small package, and the basic function terminal must be made thin for unnecessary write terminals, or the mounting area must be reduced There is a point.

  The present invention has been made to solve the above problems, and provides a piezoelectric oscillator capable of easily writing information to a piezoelectric oscillator and ensuring the mounting strength of the piezoelectric oscillator, and an electronic device using the piezoelectric oscillator. With the goal.

In order to achieve the above object, a piezoelectric oscillator according to the present invention includes a piezoelectric vibrator and a terminal that is electrically connected to the piezoelectric vibrator and that inputs a signal from the outside and / or outputs a signal to the outside. An electronic component, a mold package in which the electronic component and the piezoelectric vibrator are sealed, and an exposed surface on the lower surface of the mold package (mounting surface on the mounting substrate) are electrically connected to the electronic component. A plurality of mounting terminals and exposed on the upper surface of the mold package (the surface opposite to the mounting surface on the mounting substrate), and inputs signals from and / or outputs signals to the outside of the electronic component And a terminal electrically connected to the terminal.
Since there are external signal input / output terminals on the upper surface of the mold package, the number of terminals on the mounting surface or side surface can be reduced, and the mounting area can be reduced. Further, since the input / output probe from the outside can be brought into contact with the upper surface of the mold package, it is possible to effectively prevent a writing failure due to a contact error between the terminal and the probe. Further, even after cutting unnecessary lead frames, signals can be input / output from / to the outside of the piezoelectric oscillator.

  The electronic component can store information, and a terminal exposed on the upper surface of the mold package is a control terminal for writing the information to the electronic component. Since the control terminal for writing information on the upper surface of the mold package is provided, the number of write terminals on the mounting surface or side surface of the mold package can be reduced, and contact failure with the probe for writing information can be effectively prevented. Even after the unnecessary lead frame is cut, information can be written.

  Further, a part of the plurality of mounting terminals is a second control terminal for writing the information to the electronic component. Since the mounting terminals are the basic function terminal and the second control terminal for writing, the number of terminals can be reduced as compared with the piezoelectric oscillator according to the related art. Therefore, the size of the mounting terminal can be made large enough to ensure sufficient bonding strength between the piezoelectric oscillator and the mounting substrate.

  The write control terminal is a conductive cap of the piezoelectric vibrator. This facilitates probing to the conductive cap, eliminates writing defects due to contact mistakes between the control terminal and the probe, and facilitates probing from the upper surface of the mold package. It becomes possible to eliminate writing defects due to contact mistakes.

  The writing control terminal is a lead of a lead frame in which the piezoelectric vibrator and the electronic component are electrically connected. Thus, a piezoelectric oscillator can be formed from a single lead frame.

  An electronic apparatus according to the present invention is characterized by mounting the above-described piezoelectric oscillator. Thus, an electronic device can be configured using the piezoelectric oscillator having the above-described characteristics.

  Hereinafter, preferred embodiments of the piezoelectric oscillator and the electronic device according to the present invention will be described. First, the first embodiment will be described. FIG. 1 is an exploded perspective view of the piezoelectric oscillator according to the first embodiment. FIG. 2 is a sectional view taken along line AA in FIG. In FIG. 1, the mold package is omitted. The piezoelectric oscillator 10 according to the first embodiment has a configuration in which a piezoelectric vibrator 14 and an electronic component 16 are mounted on a laminated lead frame 12.

  FIG. 3 shows a plan view of the lead frame. 3A is a plan view of the upper lead frame, and FIG. 3B is a plan view of the lower lead frame. In the first embodiment, the upper lead frame 20 and the lower lead frame 40 are overlapped to form the laminated lead frame 12. Each lead frame 20, 40 is formed by providing a cross-shaped frame 18 (18 a, 18 b) on a conductive metal sheet and repeatedly forming the same pattern inside each frame 18.

  In the upper lead frame 20, leads 22 for connection to the piezoelectric vibrator 14 are formed at four corners inside the frame portion 18a. The connection lead 22 is formed of a connection terminal 24, an inclined portion 26 and a pad 28. A wire bonding pad 28 extends along the short side 30 of the frame portion 18a from the inner end of the long side 29 of the frame portion 18a. An inclined portion 26 is provided outside the pad 28, and a connection terminal 24 is provided outside the inclined portion 26. The inclined portion 26 is bent upward, and the connection terminals 24 are arranged in parallel at a predetermined distance from the upper lead frame 20. Here, the predetermined distance is a distance larger than the maximum height of the wire 32 bonded to the electronic component 16 and the lead frames 20 and 40. Note that at least three connecting leads 22 may be formed in each frame portion 18a. Further, the connecting lead 22 may be connected not only to the long side 29 of the frame portion 18 a but also to the short side 30.

  The lower lead frame 40 has mounting leads 42 for mounting on a mounting board (not shown) at the inner four corners of the frame portion 18b. The mounting lead 42 is formed of a mounting terminal 44, an inclined portion 46 and a pad 48. A wire bonding pad 48 is extended along the long side 50 of the frame 18b from the inner end of the short side 52 of the frame 18b. An inclined portion 46 is provided outside the pad 48, and a mounting terminal 44 is formed outside the inclined portion 46. The inclined portion 46 is bent downward, and the mounting terminals 44 are arranged in parallel at a predetermined distance from the lower lead frame 40. A die pad 54 is formed at the center of the frame portion 18 b in the lower lead frame 40. The die pad 54 is connected to the long side 50 of the frame portion 18 b and is supported in the same plane as the lower lead frame 40. The die pad 54 may be formed on the upper lead frame 20. Further, the position where the mounting lead 42 or the die pad 54 is connected to the frame portion 18 b is not limited to the short side 52 or the long side 50. For example, the mounting lead 42 may be connected to the long side 50, and the die pad 54 may be connected to the short side 52. Further, the mounting lead 42 and the die pad 54 may be connected to the long side 50.

  The laminated lead frame 12 is formed by overlapping the upper lead frame 20 and the lower lead frame 40. That is, the upper lead frame 20 and the lower lead frame 40 are fixed to each frame portion 18 by spot welding or the like. In addition, inside the frame portion 18, connection leads 22, mounting leads 42, and a die pad 54 are formed so that the upper lead frame 20 and the lower lead frame 40 do not come into contact with each other. Thus, the laminated lead frame 12 is formed with the mounting terminal 44 and the connection terminal 24 spaced apart from each other in the vertical direction.

  The electronic component 16 is mounted on the upper surface of the die pad 54 via an adhesive. The electronic component 16 is a circuit that oscillates the piezoelectric vibrator 14 and is integrated. The circuit may be formed discretely. A temperature compensation circuit, a voltage control circuit, a memory, etc. are added to the circuit as necessary. Note that the electronic component 16 may be mounted on the lower surface of the die pad 54. In this case, the height of the inclined portion 46 in the mounting lead 42 may be set to a distance larger than the maximum height of the wire bonded to the electronic component 16 and the lead frames 20 and 40.

  Then, wire bonding is applied to the pad 28 formed on the connection lead 22, the pad 48 formed on the mounting lead 42, and the electrode formed on the upper surface of the electronic component 16, thereby mounting the mounting lead 42 and the electronic component 16. And the connecting lead 22 and the electronic component 16 are electrically connected. It is sufficient that at least three connection leads 22 and the electronic component 16 are electrically connected. Further, if the operation check of the electronic component 16 is performed before the electronic component 16 is mounted on the laminated lead frame 12, it can be confirmed whether or not the electronic component 16 operates normally. As a result, the malfunction of the electronic component 16 is discovered after the piezoelectric oscillator 10 is formed, and the non-defective piezoelectric vibrator 14 is not discarded together with the defective electronic component 16, so that the manufacturing cost can be reduced.

  The piezoelectric vibrator 14 has a piezoelectric vibrating piece 62 mounted in a package 60. The package 60 has a package base 64. The package base 64 is made of a ceramic material and has a bowl-shaped structure. A mount electrode 65 to be joined to the piezoelectric vibrating piece 62 is formed on the bottom surface of the package base 64. A plurality of external electrodes 66 are formed on the back surface of the package base 64. The two external electrodes 66 are electrically connected to the mount electrode 65 via a via hole, a through hole, or a castellation (not shown) formed on a side surface. One external electrode 66 is formed on the side portion 68 of the package base 64 and is connected to a via hole 70 that electrically connects the upper surface and the back surface.

  The piezoelectric vibrating piece 62 has a configuration in which excitation electrodes 72 are formed on the upper and lower surfaces of a substrate made of a piezoelectric material, and connection electrodes 74 that are electrically connected to the excitation electrode 72 are formed on the ends of the substrate. The piezoelectric vibrating piece 62 may be a tuning fork type piezoelectric vibrating piece that performs bending vibration or a surface acoustic wave resonance piece that excites a surface acoustic wave. The connection electrode 74 of the piezoelectric vibrating piece 62 and the mount electrode 65 formed on the package base 64 are electrically and mechanically connected via the conductive adhesive 76. 1 and 2, the piezoelectric vibrating piece 62 is described as being mounted in a cantilevered manner, but the piezoelectric vibrating piece 62 may be mounted in a cantilevered manner.

  A conductive cap 78 is joined to the upper surface of the package base 64 on which the piezoelectric vibrating piece 62 is mounted. The conductive cap 78 is first placed on the upper surface of the package base 64 via the seal ring 80, and then the conductive cap 78 is electrically heated to provide a plating layer provided on the surface of the conductive cap 78 or the seal ring 80. It is joined on the package base 64 by melting. The plating layer may be melted by a method that does not perform electric heating, for example, resistance heating. That is, for example, gold tin plating can be used. Further, the inside of the package 60 is hermetically sealed in an inert gas atmosphere such as nitrogen or in a vacuum. The conductive cap 78 is a flat substrate made of Kovar. This conductive cap 78 serves as a control terminal. The conductive cap 78 is electrically connected to the external electrode 66 through the via hole 70 formed in the side portion 68 of the package base 64. A through hole may be formed instead of the via hole 70, and the conductive cap 78 and the external electrode 66 may be electrically connected through the through hole. Alternatively, a castellation may be formed on the side surface of the package base 64, and the conductive cap 78 and the external electrode 66 may be electrically connected via the castellation.

  If the frequency of the piezoelectric vibrator 14 is adjusted before the piezoelectric vibrator 14 is mounted on the laminated lead frame 12, it can be confirmed whether the piezoelectric vibrator 14 operates normally. Thereby, after the piezoelectric oscillator 10 is formed, the malfunction of the piezoelectric vibrator 14 is discovered, and the non-defective electronic component 16 is not discarded together with the defective piezoelectric vibrator 14, so that the manufacturing cost can be reduced.

  The piezoelectric vibrator 14 is mounted on the laminated lead frame 12. That is, the external electrode 66 of the piezoelectric vibrator 14 and the connection terminal 24 of the connection lead 22 are electrically and mechanically connected via solder, conductive adhesive, or the like. At this time, the external electrode 66 electrically connected to the piezoelectric vibrating piece 62 and the external electrode 66 electrically connected to the conductive cap 78 are joined on the connection terminal 24 where the electronic component 16 and the connection lead 22 are electrically connected. The Thereafter, the laminated lead frame 12 on which the piezoelectric vibrator 14 is mounted is placed in a resin molding die, and a mold package 82 is formed by injection molding a thermosetting resin in the die. The mold package 82 is formed inside each frame portion 18 of the lead frames 20 and 40. At this time, the main surface of the conductive cap 78 (control terminal) of the piezoelectric vibrator 14 and the mounting surface of the mounting terminal 44 connected on the electrode pattern of the mounting substrate are exposed on the surface of the mold package 82. In order to expose the main surface of the conductive cap 78 and the mounting surface of the mounting terminal 44 on the surface of the mold package 82, the resin may be injection-molded while being in surface contact with the upper and lower surfaces of the resin molding die. By the way, resin may enter between the main surface of the conductive cap 78 and the mounting surface of the mounting terminal 44 and the resin molding die due to the injection pressure of the resin, and the resin may adhere to the main surface and the mounting surface. . In this case, a liquid containing an abrasive may be sprayed toward the main surface and the mounting surface to remove the adhered resin. Further, it may be removed by irradiating the main surface and the mounting surface with laser light, or may be removed by applying a chemical.

  In the present embodiment, the main surface of the conductive cap 78 is covered with a molding material, and a part of the conductive cap 78 is exposed. In order to expose only a part of the conductive cap 78, a convex portion that comes into contact with the conductive cap 78 is provided on the resin mold, and the mold package 82 is formed by injection molding the resin into the mold. . Alternatively, the entire surface of the conductive cap 78 may be covered with a resin, and then the molding material at a portion where only a part of the conductive cap 78 is exposed may be scraped off. Instead of scraping the mold material later, a mold is formed so that a hole is formed in advance, and resin is injected into the mold to reduce the load on the work process and prevent the conductive cap 78 from being damaged. be able to. The exposed portion only needs to have a size with which a probe used when writing information to the electronic component 16 can contact. And the part to expose should just be provided in the upper part of the said mounting terminal 44 used as a position reference. Thereby, the direction and position of the piezoelectric oscillator 10 can be detected from the position of the portion where the conductive cap 78 is exposed to the outside. The hole 84 eliminates the need for forming a positioning recess conventionally provided in the package of the piezoelectric oscillator, thereby simplifying the package structure. Depending on the embodiment, the entire surface or the central portion of the conductive cap 78 may be exposed. By the way, when it is desired to keep the conductive cap 78 at the ground potential during the oscillation of the piezoelectric oscillator 10, a resistor having a large resistance value is connected in parallel to the electrode connected to the conductive cap 78 in the electronic component 16 and pulled down to the ground potential. Good.

  After the mold package 82 is formed, the connection portion between the frame portion 18 of each lead frame 20, 40 and each lead is cut. The cutting position is preferably near the surface of the mold package 82.

  The mounting terminal 44 of the piezoelectric oscillator 10 thus formed serves as a basic function terminal and also serves as an information writing terminal (second control terminal). The conductive cap 78 serves as a control terminal, and the conductive cap 78 (control terminal) serves as an information writing terminal. The basic function terminals are terminals used to operate the piezoelectric oscillator 10, and are, for example, a terminal for supplying a power supply voltage, a ground terminal, an output terminal of the oscillator, and a control terminal of the oscillator. Therefore, the user who uses the piezoelectric oscillator 10 uses only the basic function terminals. The write terminals (control terminal and second control terminal) are terminals for allowing the electronic component 16 to input information such as frequency adjustment and phase synchronization circuit settings from the outside. Therefore, the manufacturer of the piezoelectric oscillator 10 uses the write terminal.

FIG. 4 shows an example when the functions are allocated to the mounting terminals 44 and the conductive cap 78. In FIG. 4, terminals # 1 to # 4 are numbers assigned to the mounting terminals 44. The user use means when the user uses the piezoelectric oscillator 10, that is, when the piezoelectric oscillator 10 is operated. Further, writing use means when the manufacturer writes information in the piezoelectric oscillator 10. Each function is assigned to # 1 to # 4 of the mounting terminal 44 and the conductive cap 78 (control terminal). That is, when the user uses the piezoelectric oscillator 10, # 1 of the mounting terminal 44 is a terminal (ST) that controls whether or not a signal is output from the piezoelectric oscillator 10. # 2 of the mounting terminal 44 is a ground terminal (GND) of the piezoelectric oscillator 10. # 3 of the mounting terminal 44 is a terminal (OUT) for outputting a signal from the piezoelectric oscillator 10. # 4 of the mounting terminal 44 is a terminal (V _DD ) for supplying a power supply voltage to the piezoelectric oscillator 10. The conductive cap 78 is not used. When the manufacturer writes information in the piezoelectric oscillator 10, # 1 of the mounting terminal 44 is a terminal (CLK) to which a clock signal is input. # 2 of the mounting terminal 44 is a ground terminal (GND) of the piezoelectric oscillator 10. # 3 of the mounting terminal 44 is a terminal (DATA) to which data is input in synchronization with the clock signal. # 4 of the mounting terminal 44 is a terminal (V _DD ) for supplying a power supply voltage to the piezoelectric oscillator 10. The conductive cap 78 becomes a terminal (PE) to which a signal that enables writing of information to the piezoelectric oscillator 10 is input. The allocation of each function to each terminal is not limited to that described above.

  Next, an operation when information is written to the piezoelectric oscillator 10 described above will be described. First, a device for writing information to the piezoelectric oscillator 10 will be described. FIG. 5 is an explanatory diagram of the writing device. The writing device 90 has a socket 92 that houses the piezoelectric oscillator 10. A probe 94 that contacts the mounting terminal 44 is provided on the lower surface of the socket 92 corresponding to the position of the mounting terminal 44 of the piezoelectric oscillator 10 housed in the socket 92. The probe 94 is used to operate the piezoelectric oscillator 10 and is used to write information into the piezoelectric oscillator 10. The writing device 90 is provided with a writing probe 96 that comes into contact with the conductive cap 78 (control terminal) of the piezoelectric oscillator 10 housed in the socket 92. The writing probe 96 is used for writing information to the piezoelectric oscillator 10. Further, the writing device 90 is provided with a suction nozzle 98 for storing and removing the piezoelectric oscillator 10 in the socket 92.

  Information is written to the piezoelectric oscillator 10 as follows. FIG. 6 shows a flow for writing information to the piezoelectric oscillator 10. First, the piezoelectric oscillator 10 is chucked by the suction nozzle 98 and stored in the socket 92 with the mounting terminal 44 facing downward (S100). At this time, since the piezoelectric oscillator 10 is sucked up by using the suction nozzle 98, a force such as mechanical chucking is not applied to the piezoelectric oscillator 10, and a failure such as breakage of the mold package 82 due to the application of force is generated. Can be suppressed. When the piezoelectric oscillator 10 is housed in the socket 92, the probe 94 provided on the lower surface of the socket 92 and the mounting terminal 44 come into contact with each other. Then, the writing probe 96 moves to the top of the piezoelectric oscillator 10 and comes into contact with the conductive cap 78 (S102).

  Thereafter, information is written into the piezoelectric oscillator 10 via the probe 94 and the writing probe 96 (S104). If each terminal of the piezoelectric oscillator 10 is assigned a function as shown in FIG. 4 for example, information is first written from the writing probe 96 to a signal for switching the piezoelectric oscillator 10 from the basic mode to the programming mode. Entered. Thereby, each terminal of the piezoelectric oscillator 10 becomes a writing terminal. In order to enter the programming mode, information can be written by inputting a specific voltage signal to the piezoelectric oscillator 10, or information can be written by inputting a pulse signal according to a certain rule. What is necessary. After the piezoelectric oscillator 10 is set to the programming mode, a clock signal is input to the piezoelectric oscillator 10 from # 1 of the mounting terminal 44, and information is input in synchronization with the clock signal from # 3 of the mounting terminal 44. Information may be written into the piezoelectric oscillator 10. When the writing of information is completed, the writing is completed by stopping the voltage signal input from the writing probe 96 or inputting a signal for ending writing.

  Thereafter, the information stored in the piezoelectric oscillator 10 is read back to check whether the information is correctly written (S106). Then, the writing probe 96 is separated from the conductive cap 78 (S108), and the electrical characteristics of the piezoelectric oscillator 10 are inspected by the probe 94 provided in the socket 92 (S110). At this time, the piezoelectric oscillator 10 is not in a writing state but in a user use state because a signal enabling writing of information is not input. That is, each terminal of the piezoelectric oscillator 10 is a basic function terminal. When this inspection is completed, the piezoelectric oscillator 10 is chucked by the suction nozzle 98 and removed from the socket 92. If a plurality of writing devices 90 are provided, a plurality of information writing operations to the piezoelectric oscillator 10 can be processed simultaneously.

  As described above, the piezoelectric oscillator 10 uses the conductive cap 78 as an information writing terminal and uses the mounting terminal 44 as a basic function terminal and a writing terminal, so that the writing used in the piezoelectric oscillator according to the prior art is used. There is no need to provide a terminal. That is, since the number of terminals provided in the piezoelectric oscillator 10 can be reduced, the size of the mounting terminal 44 provided on the back surface of the piezoelectric oscillator 10 can be increased, and a sufficient board mounting area of the piezoelectric oscillator 10 can be ensured. . Also, it is not necessary to make the basic function terminals thinner. Therefore, the mounting strength between the circuit pattern of the mounting substrate and the mounting terminals 44 can be improved.

  Further, since the conductive cap 78 is exposed from the mold package 82 in the piezoelectric oscillator 10, the writing probe 96 can be directly applied to the conductive cap 78 from the upper part of the piezoelectric oscillator 10. Therefore, probing to the conductive cap 78 is facilitated, and a decrease in yield due to poor contact between the writing probe 96 and the conductive cap 78 can be avoided.

  Since the conductive cap 78 is provided on the upper surface, information can be written even after the piezoelectric oscillator 10 is cut from the lead frame. Accordingly, the piezoelectric oscillator 10 can be shipped from a base closer to the user, such as a sales base or an agency, and the lead time can be shortened. In the piezoelectric oscillator according to the related art, information cannot be written after the writing lead unnecessary for the user is cut.

  In addition, since the conductive cap 78 is on the upper surface of the piezoelectric oscillator 10, information can be written again after the piezoelectric oscillator 10 is mounted on the mounting substrate. FIG. 7 is an explanatory diagram when writing is performed after the piezoelectric oscillator 10 is mounted on the mounting substrate. In this case, writing can be performed by bringing the writing probe 96 into contact with the conductive cap 78 and bringing the probe 94 into contact with the circuit pattern 99 on the mounting substrate.

In this embodiment, the switching between the programming mode and the basic mode is performed by the PE terminal. While operating as the programming mode, the clock mode is synchronized with the clock signal distributed from the outside of the piezoelectric oscillator to the CLK terminal of the piezoelectric oscillator. The write data is input to the DATA terminal of the piezoelectric oscillator. However, the data can be written as follows. In other words, the program write mode and the basic mode are switched by inputting a specific pattern signal to the PE terminal, and in synchronization with the oscillation signal output from the piezoelectric oscillator following the specific pattern signal. A signal such as write data may be input from the PE terminal. In other words, on the mounting terminal 20 side, the function at the time of user use is used as it is, and a signal having PE and DATA information is input from the conductive cap 78.
In this way, in a state where the piezoelectric oscillator is operated in the basic mode, information is written to the electronic component 18 of the piezoelectric oscillator 10 only by inputting a signal by bringing one probe into contact with only the conductive cap 78. In order to input a clock signal, a DATA signal, a PE signal, etc. to the mounting terminal 20 of the piezoelectric oscillator 10, there is no need to contact a plurality of probes on the mounting board side as shown in FIG. Writing can be performed easily.

  Next, a second embodiment will be described. FIG. 8 is an explanatory diagram of the piezoelectric oscillator according to the second embodiment. FIG. 8A is a plan view of the piezoelectric oscillator, and FIG. 8B is a cross-sectional view taken along line BB in FIG. 8A. In FIG. 8, external electrodes provided on the back surface of the piezoelectric oscillator are omitted. A piezoelectric oscillator 100 according to the second embodiment has a configuration in which a piezoelectric vibrator 102 and an electronic component 104 are sealed with a molding material. The piezoelectric vibrator 102 has a piezoelectric vibrating piece 106 mounted in a cavity 110 formed on a package base 108 and a lid body 112 joined to the upper surface of the package base 108 to hermetically seal the inside of the cavity 110. is there. An external electrode (not shown) that is electrically connected to the piezoelectric vibrating piece 106 is formed on the back surface of the piezoelectric vibrator 102. A mounting lead 114 is joined to the external electrode, and the external electrode and the mounting lead 114 are electrically and mechanically connected. An electronic component 104 is bonded to the back surface of the piezoelectric vibrator 102. The electronic component 104 may be the same as the electronic component 16 according to the first embodiment. Further, a control terminal 116 made of a lead is joined to the back surface of the piezoelectric vibrator 102, and an intermediate portion of the control terminal 116 is bent upward. This control terminal 116 serves as an information writing terminal. Then, wire bonding is applied to the electronic component 104, the mounting lead 114, and the control terminal 116, and the electronic component 104 and the piezoelectric vibrator 102 are electrically connected via the electronic component 104, the control terminal 116, and the mounting lead 114. Connected to.

  The periphery of the piezoelectric vibrator 102 and the electronic component 104 arranged above and below in this way is sealed with a molding material to form a mold package 118. In the upper part of the mold package 118, a hole 120 is provided so that the main surface of the control terminal 116 is exposed to the outside. The mounting lead 114 protruding from the mold package 118 is bent to the lower side of the mold package 118 toward the piezoelectric vibrator 102 side. A mounting terminal 122 is formed at the tip of the mounting lead 114. The mounting terminal 122 serves as a basic function terminal and an information writing terminal (second control terminal). When the control terminal 116 is disposed in the vicinity of the mounting terminal 122 serving as a position reference and the main surface of the control terminal 116 is exposed to form the mold package 118, the orientation and position of the piezoelectric oscillator 100 can be detected. .

  By configuring the piezoelectric oscillator 100 in this manner, the same effects as those of the piezoelectric oscillator 10 according to the first embodiment can be obtained. Further, when the piezoelectric oscillator 100 is provided with a temperature compensation function, since the distance between the piezoelectric vibrator 102 and the electronic component 104 is short, a more accurate temperature of the piezoelectric vibrator 102 can be measured, and a frequency with a smaller frequency deviation. Temperature characteristics can be obtained.

  Next, a third embodiment will be described. In the third embodiment, an example of an electronic apparatus using the piezoelectric oscillators 10 and 100 described in the first and second embodiments will be described. FIG. 9 shows a schematic configuration diagram of a digital cellular phone. The digital cellular phone 130 includes a transmission / reception signal transmission unit 132 and a reception unit 134, and a central processing unit (CPU) 136 that controls them is connected to the transmission unit 132 and the reception unit 134. In addition to modulation and demodulation of transmission / reception signals, the CPU 136 controls an information input / output unit 138 including a display unit and operation keys for inputting information, and a memory 140 including a RAM, a ROM, and the like. For this reason, the piezoelectric device 142 is attached to the CPU 136, and its output frequency is used as a clock signal suitable for the control contents by a predetermined frequency dividing circuit (not shown) incorporated in the CPU 136. The CPU 136 is connected to a temperature compensated piezoelectric oscillator 144, and the temperature compensated piezoelectric oscillator 144 is connected to the transmitter 132 and the receiver 134. Thus, even if the basic clock from the CPU 136 fluctuates when the environmental temperature changes, it is corrected by the temperature compensated piezoelectric oscillator 144 and supplied to the transmission unit 132 and the reception unit 134.

  As an example to which the piezoelectric oscillators 10 and 100 according to the embodiment of the present invention are applied, there is a temperature compensated crystal oscillator (TCXO), for example. The TCXO is a piezoelectric oscillator in which frequency fluctuation due to ambient temperature change is reduced, and is widely used as a frequency reference source for a receiving unit and a transmitting unit. This TCXO has been increasingly demanded for downsizing of mobile phone devices in recent years, and downsizing of the piezoelectric oscillators 10 and 100 according to the embodiments of the present invention is extremely useful. The piezoelectric oscillators 10 and 100 according to the embodiment of the present invention can also be applied to a real-time clock that supplies date and time information to, for example, a mobile phone device including a CPU.

  Piezoelectric oscillators 10 and 100 according to an embodiment of the present invention are not limited to the above-described digital cellular phone device 130, but are piezoelectric oscillators such as personal computers, workstations, PDAs (Personal Digital [Data] Assistants). Thus, the present invention can be applied to an electronic device that obtains a control clock signal. As described above, by using the piezoelectric oscillator according to the above-described embodiment for an electronic device, a smaller and more reliable electronic device can be realized.

1 is an exploded perspective view of a piezoelectric oscillator according to a first embodiment. It is sectional drawing in the AA line. It is a top view of a lead frame. It is an example when each function is allocated to each mounting terminal and a conductive cap. It is explanatory drawing of the writing apparatus of information. This is a flow for writing information to the piezoelectric oscillator. It is explanatory drawing when writing information after mounting a piezoelectric oscillator on a mounting board. It is explanatory drawing of the piezoelectric oscillator which concerns on 2nd Embodiment. It is a schematic block diagram of a digital mobile phone.

Explanation of symbols

10 ......... Piezoelectric oscillator, 14 ......... Piezoelectric vibrator, 16 ......... Electronic components, 20 ...... Upper lead frame, 24 ... Connecting terminal, 40 ... Lower lead frame, 44 ......... Mounting terminal, 54... Die pad, 70... Via hole, 78... Conductive cap, 90... Writing device, 100 Piezoelectric oscillator, 102 Piezoelectric vibrator, 104 Electron Components 114... Mounting lead 116... Control terminal 130.

Claims (6)

A piezoelectric vibrator;
An electronic component electrically connected to the piezoelectric vibrator and provided with a terminal for inputting and / or outputting a signal from the outside;
A mold package encapsulating the electronic component and the piezoelectric vibrator;
A plurality of mounting terminals that are exposed on the lower surface of the mold package and are electrically connected to the electronic component;
A terminal exposed on the upper surface of the mold package and electrically connected to a terminal for inputting and / or outputting a signal from the outside of the electronic component; and
A piezoelectric oscillator comprising: The electronic component can store information;
2. The piezoelectric oscillator according to claim 1, wherein a terminal exposed on the upper surface of the mold package is a control terminal for writing the information to the electronic component.   3. The piezoelectric oscillator according to claim 2, wherein a part of the plurality of mounting terminals is a second control terminal for writing the information to the electronic component.   4. The piezoelectric oscillator according to claim 1, wherein the control terminal is a conductive cap of the piezoelectric vibrator.   4. The piezoelectric oscillator according to claim 1, wherein the control terminal is a lead of a lead frame in which the piezoelectric vibrator and the electronic component are electrically connected. 5. An electronic apparatus comprising the piezoelectric oscillator according to claim 1.

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