JP2006186465A - Method for manufacturing piezoelectric oscillator - Google Patents

Abstract

Provided is a method for manufacturing a piezoelectric oscillator capable of obtaining a small piezoelectric oscillator that is easy to handle and excellent in productivity.
A piezoelectric vibrator in which a piezoelectric base plate is mounted in a sealed container having a cavity structure using a sheet-like circuit board and hermetically sealed, and a piezoelectric oscillator in which a semiconductor component is combined with the piezoelectric vibrator are provided in a sheet-like board. It fixes to 18 predetermined parts. Of the terminals constituting the piezoelectric oscillator, the temperature compensation data writing terminal is connected to the electrode pad 12 formed in the abandoned area of the sheet-like substrate 18. Hole processing exposed on the inner wall of the via hole formed in the sheet-like substrate 18 is performed, the conductive material 16 is injected into the hole portion 15, and the electrode pad 12 and the piezoelectric oscillator are made conductive by the conductive material 16 injected into the via hole, After the adjustment, the piezoelectric oscillator is separated into pieces by a cutting process. As a result, workability can be improved.
[Selection] Figure 2

Description

The present invention relates to a method for manufacturing a piezoelectric oscillator used in an electronic device such as a portable communication device.

Conventionally, piezoelectric oscillators have been used in electronic devices such as portable communication devices.

As such a conventional piezoelectric oscillator, for example, as shown in FIG. 4, the first container 23 in which a piezoelectric element plate is housed is disposed in the cavity portion 25, although not shown in the drawing. A piezoelectric oscillator having a structure attached to a second container 21 in which an electronic component element such as a semiconductor component 26 or a capacitor for controlling an oscillation output based on vibration of a base plate is accommodated is known. Is mounted on the external wiring board by soldering an external terminal provided on the lower surface of the second container 21 to the wiring of the external wiring board.

The first container 23 and the second container 21 are usually formed of a ceramic material, and a wiring conductor is formed inside or on the surface, and a conventionally known ceramic green sheet lamination method or the like is adopted. It is manufactured by.

The semiconductor component 26 is provided with a temperature compensation circuit for correcting the oscillation frequency of the crystal oscillator based on the temperature compensation data created according to the temperature characteristics of the piezoelectric element plate. In order to store the temperature compensation data in the memory of the semiconductor component 26, a write control terminal 27 for writing temperature compensation data is provided on the lower surface and the outer surface of the second container 21. It was. The temperature compensation data is stored in the memory of the semiconductor component 26 by applying the probe needle of the temperature compensation data writing device to the write control terminal 27 and inputting the temperature compensation data into the memory in the semiconductor component 26.
In addition to the prior art documents specified by the prior art document information described above, the applicant has discovered prior art documents related to the present invention by the time of filing of the present application. There wasn't.

  However, when the write control terminal 27 of the conventional piezoelectric oscillator described above is arranged on the outer side surface of the second container 21, the writing is performed on the outer side surface of the second container 21 as the size of the piezoelectric oscillator is reduced. The space for disposing the insertion control terminal 27 is eliminated, and a complicated machining process is required to form the writing control terminal 27, and the productivity of the piezoelectric oscillator is significantly reduced.

  On the other hand, when the write control terminal 27 is arranged on the lower surface of the second container 21, a large space for arranging the write control terminal 27 is required on the lower surface of the second container 21. In addition, the size of the container 21 may be increased, and when the piezoelectric oscillator is mounted on an external wiring board such as a mother board, a part of solder or the like used for joining the two may easily adhere to the write control terminal 27. As a result, there is a risk of inducing a short-circuit between the write control terminal 27 and the external terminal via such solder.

  Further, in the above-described conventional piezoelectric oscillator, usually, only the first container 23 and the second container 21 are manufactured by the “multiple picking” technique, and the pieces (first container 23) obtained after the division are obtained. In addition, the piezoelectric element plate and the semiconductor component 26 are individually mounted on the second container 21), and both are joined to assemble the product. However, when the semiconductor component 26, the first container 23, and the like are mounted on the second container 21 after the second container 21 is divided into individual pieces, the second container 21 is used until the operation is completed. It is necessary to hold the containers 21 individually with a carrier and the like, and the assembling work is complicated, and a manufacturing facility such as a carrier is additionally required, which also reduces the productivity of the piezoelectric oscillator. Had.

  The present invention has been conceived in view of the above-described drawbacks. Therefore, the object of the present invention is to provide a method for manufacturing a piezoelectric oscillator capable of obtaining a small piezoelectric oscillator that is easy to handle and excellent in productivity. There is.

The method of manufacturing a piezoelectric oscillator according to the present invention includes a piezoelectric vibrator in which a piezoelectric base plate is mounted in a sealed container having a cavity structure using a sheet-like circuit board and hermetically sealed, and a semiconductor component is combined with the piezoelectric vibrator. In the manufacturing method of the piezoelectric oscillator,
Any one of the terminals constituting the piezoelectric oscillator performs a hole processing exposed on the inner wall of the via hole formed in the sheet-like substrate, and a conductive material is injected into the hole, and the conductive material injected into the via hole is After adjusting the piezoelectric oscillator via the piezoelectric oscillator, a piezoelectric oscillator is obtained by a cutting process for dividing the piezoelectric oscillator into individual pieces.

  In the piezoelectric oscillator manufacturing method of the present invention, in the above-described configuration, the via hole formed in the sheet-like substrate is formed at the boundary between the separated piezoelectric oscillator and the separation region, and the inner wall of the via hole is subjected to a conductive treatment. However, it is characterized in that it is electrically connected to any of the terminals included in the piezoelectric oscillator only by a conductive material to be injected later.

  The method for manufacturing a piezoelectric oscillator according to the present invention is characterized in that, in the above-described configuration, the terminal constituting the piezoelectric oscillator is a write control terminal, and is connected to an electrode pad formed in one of the surplus areas. .

According to the method for manufacturing a piezoelectric oscillator of the present invention, a piezoelectric vibrator in which a piezoelectric base plate is mounted on a sealed container having a cavity structure using a sheet-like circuit board and hermetically sealed, and a semiconductor component is mounted on the piezoelectric vibrator. In the manufacturing method of the combined piezoelectric oscillator,
Any one of the terminals constituting the piezoelectric oscillator performs a hole processing exposed on the inner wall of the via hole formed in the sheet-like substrate, and a conductive material is injected into the hole, and the conductive material injected into the via hole is After adjusting the piezoelectric oscillator via the piezoelectric oscillator, the piezoelectric oscillator is obtained by a cutting process for dividing the piezoelectric oscillator into individual pieces. Therefore, workability can be improved.

  According to the method for manufacturing a piezoelectric oscillator of the present invention, the via hole formed in the sheet-like substrate is formed at the boundary between the separated piezoelectric oscillator and the separation region, and the inner wall of the via hole is subjected to a conductive treatment. However, since conduction with any of the terminals included in the piezoelectric oscillator is achieved only by a conductive material to be injected later, it is advantageous for miniaturization of the piezoelectric oscillator and further productivity can be improved.

  Further, according to the method for manufacturing a piezoelectric oscillator of the present invention, the terminals constituting the piezoelectric oscillator are write control terminals, and are connected to electrode pads formed in any of the replacement areas. Since the electrical characteristics of the piezoelectric oscillator can be measured and adjusted with the electrode pads formed in the region, workability can be improved.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In addition, the same code | symbol in each figure shall show the same object. FIG. 1 is a cross-sectional view of a piezoelectric oscillator manufactured using the method for manufacturing a piezoelectric oscillator according to the present invention, and FIG. 2 shows one substrate region A cut from a sheet-like substrate 18 and an abandoned region B at one end thereof. It is a bottom view of the mounting substrate 6 showing. FIG. 3 is a bottom view of the sheet-like substrate 18. The piezoelectric oscillator shown in FIG. 1 has a mounting substrate 6 on which an external terminal 10 is provided on the lower surface, and a plurality of spacer members 13, a plurality of write control terminals 11, and a semiconductor component 7 are mounted on the upper surface. It has a structure in which the container 1 in which the piezoelectric element plate 5 is accommodated is placed and fixed.

In addition, on the upper surface of the substrate region A shown in FIG. 2, a spacer member 13 is formed at the four corners of the substrate region A, and a plurality of write control terminals 11 are formed at the boundary between the substrate region A and the separation region B. The write control terminal 11 is formed by filling the hole 15 with a conductive material 16, and the write control terminal 11 and the write electrode pad 12 formed in the separation region B are connected to the inner layer wiring. 17 is connected.

  In FIG. 1, the container 1 includes, for example, a substrate 2 made of a ceramic material such as glass & ceramics, alumina ceramics, a seal ring 3 made of a metal such as 42 alloy, Kovar, phosphor bronze, and the like. The container 1 is formed by attaching the seal ring 3 to the upper surface of the substrate 2 and mounting and fixing the lid body 4 on the upper surface of the substrate 2. The piezoelectric element plate 5 is mounted on the upper surface of the substrate 2 located inside the substrate 3.

  2, the conductive material 16 is made of a metal material such as silver, copper, or gold, and the hole 15 formed on the side surface of the sheet-like substrate 18 in the state of the sheet-like substrate 18 has the above-described structure. The write control terminal 11 is formed by filling the metal material.

  The container 1 is hermetically sealed by accommodating the piezoelectric element plate 5 therein, specifically, in a space surrounded by the upper surface of the substrate 2, the inner surface of the seal ring 3, and the lower surface of the lid 4. A pair of mounting pads connected to the vibration electrode of the piezoelectric element plate 5 is connected to the upper surface of the substrate 2, and a spacer member 13 on the mounting substrate 6 described later is connected to the lower surface of the substrate 2. A plurality of bonding electrodes are provided, and the corresponding pads and electrodes are electrically connected to each other via wiring patterns on the substrate surface, via holes embedded in the substrate, and the like.

  On the other hand, the piezoelectric element plate 5 accommodated in the container 1 is formed by attaching and forming a pair of vibration electrodes on both main surfaces of a crystal piece cut along a predetermined crystal axis, and an AC voltage from the outside is applied. When applied to a quartz crystal piece via a pair of vibrating electrodes, a thickness shear vibration occurs at a predetermined frequency.

  If the lid 4 of the container 1 is connected to an external terminal 10 for a ground terminal described later via the wiring conductor 8 of the container 1 or the wiring conductor 9 of the mounting substrate 6, it is made of metal at the time of use. Since the lid 4 is connected to the reference potential to provide a shielding function, the piezoelectric base plate 5 and the semiconductor component 7 can be well protected from unnecessary electrical action from the outside. Accordingly, the lid 4 of the container 1 is preferably connected to the external terminal 10 for the ground terminal via the wiring conductor 8 of the container 1 and the wiring conductor 9 of the mounting substrate 6.

  The mounting substrate 6 to which the above-described container 1 is attached has a substantially rectangular shape, and is made of a resin material such as a glass cloth base epoxy resin, polycarbonate, epoxy resin, polyimide resin or glass − ceramic. The plate is formed of a ceramic material such as alumina ceramic.

  The mounting substrate 6 has four external terminals 10 (a power supply voltage terminal, a ground terminal, an oscillation output terminal, and an oscillation control terminal) formed at the four corners on the lower surface of the substrate region A, and on the periphery surrounding the four corners on the upper surface. The spacer member 13 is provided, the flip chip type semiconductor component 7 is provided in the central area of the upper surface, and the write control terminal 11 is provided on the side surface of the spacer member 13 between the four corners. A write electrode pad 12 is formed on the lower surface of the abandoned region B of the mounting substrate 6, and the write electrode pad 12 and the write control terminal 11 are connected by an inner layer wiring 17. Further, the writing electrode pad 12 is an electrode for writing data to the semiconductor component 7 via the write control terminal 11 in the state of the sheet-like substrate 18 and temperature correction data. Depending on the workability, it is formed on the lower surface or upper surface of the surplus area B depending on the case.

  The four external terminals 10 provided on the lower surface of the mounting board 6 function as terminals for connecting the piezoelectric oscillator to an external wiring board such as a mother board, and the piezoelectric oscillator is mounted on the external wiring board. In this case, the circuit wiring of the external wiring board is electrically connected via a conductive bonding material such as solder.

  In addition, the spacer member 13 provided on the upper surface of the mounting substrate 6 secures a predetermined interval necessary for disposing the semiconductor component 7 between the mounting substrate 6 and the container 1, while mounting the mounting substrate 6. 6 wiring conductors 9 are connected to the wiring conductor 8 of the container 1.

  Further, a plurality of electrode pads are provided in the central area of the mounting substrate 6 described above, and the connection pads of the semiconductor component 7 are connected to these electrode pads by conductive materials such as Au bumps, solder, and anisotropic conductive adhesive. The semiconductor component 7 is attached to a predetermined position on the mounting substrate 6 by being electrically and mechanically connected through the adhesive bonding material.

  The semiconductor component 7 includes, on its circuit forming surface (lower surface), a temperature sensing element such as a thermistor for detecting the ambient temperature state, a memory for storing temperature compensation data for compensating the temperature characteristics of the piezoelectric element plate 5, and a memory in the memory. A temperature compensation circuit that corrects the vibration characteristics of the piezoelectric element plate 5 according to temperature changes based on temperature compensation data, an oscillation circuit that is connected to the previous temperature compensation circuit and generates a predetermined oscillation output, and the like are provided. The oscillation output generated by the oscillation circuit is used as a reference signal such as a clock signal after being output to the outside.

  A resin material 14 made of epoxy resin or the like is interposed between the semiconductor component 7 and the mounting substrate 6 described above, and this resin material 14 covers a part of the lower surface and side surface of the semiconductor component 7. It is attached to.

  Thereby, the attachment strength of the semiconductor component 7 to the mounting substrate 6 is improved, the circuit forming surface of the semiconductor component 7 is satisfactorily covered with the resin material 14, and the electronic circuit on the circuit forming surface is exposed to moisture in the atmosphere. It is possible to effectively prevent corrosion.

  Here, as shown in FIG. 2, the characteristic part of the present invention is that any one of the terminals constituting the piezoelectric oscillator is subjected to a hole processing that is exposed on the inner wall of the via hole formed in the sheet-like substrate 18, and the hole 15 is electrically conductive. Piezoelectric Oscillator Manufacturing Method for Obtaining Piezoelectric Oscillator by Cutting Step for Dividing Piezoelectric Oscillator after Injecting Conductive Material 16 and Adjusting Piezoelectric Oscillator via Conductive Material 16 Injected into Via Hole It is in. Thereby, adjustment work such as temperature compensation data of the piezoelectric oscillator in the state of the sheet-like substrate 18 can be performed by the writing electrode pad 12 formed in the surrogate area B, so that workability can be improved.

Further, according to the method for manufacturing a piezoelectric oscillator of the present invention, the via hole formed in the sheet-like substrate 18 is formed at the boundary between the piezoelectric oscillator after separation and the separation region B, and the conductive treatment is applied to the inner wall of the via hole. It is not applied, and conduction with any of the terminals constituting the piezoelectric oscillator is achieved only by the conductive material 16 to be injected later, which is advantageous for miniaturization of the piezoelectric oscillator and further improves productivity.

  The present invention is not limited to the above-described embodiment, and various changes and improvements can be made without departing from the gist of the present invention.

  For example, in the above-described embodiment, the writing electrode pad 12 is provided in the spare area B as shown in FIGS. 2 and 3, but the spare area B is not formed and writing is performed in the substrate area A. The electrode pad 12 may be formed. Needless to say, this case is also included in the technical scope of the present invention.

1 is a schematic cross-sectional view of a piezoelectric oscillator according to an embodiment of the present invention. FIG. 3 is a bottom view of the mounting board of the piezoelectric oscillator according to the embodiment of the present invention. It is a schematic bottom view of the sheet-like board | substrate used for the piezoelectric oscillator concerning embodiment of this invention. It is a schematic perspective view of a conventional piezoelectric oscillator.

Explanation of symbols

1 ... Container
2 ... Board
3 ... Seal ring
4 ... Lid
5 ... Piezoelectric substrate
6 ... Mounting board
7 ... Semiconductor parts
8 ... Wiring conductor of container
9: Wiring conductor of mounting board
10 ... External terminal
11: Write control terminal
12... Electrode pad for writing
13 ... Spacer member
14 ... Resin
15 ... hole
16: Conductive material
17 ... Inner layer wiring
18 ... Sheet substrate
A ... Board area
B ... Disposal area

Claims (3)

In a piezoelectric vibrator in which a piezoelectric base plate is mounted on a sealed container having a cavity structure using a sheet-like circuit board and hermetically sealed, and a piezoelectric oscillator manufacturing method in which a semiconductor component is combined with the piezoelectric vibrator,
Any one of the terminals constituting the piezoelectric oscillator performs a hole processing exposed on the inner wall of the via hole formed in the sheet-like substrate, and a conductive material is injected into the hole, and the conductive material injected into the via hole is A method of manufacturing a piezoelectric oscillator, comprising: adjusting a piezoelectric oscillator through a cutting step for separating the piezoelectric oscillator into individual pieces. The via hole formed in the sheet-like substrate according to claim 1 is formed at a boundary between the piezoelectric oscillator after separation and the abandoned region, and the inner wall of the via hole is not subjected to conductive treatment and is injected later. A method for manufacturing a piezoelectric oscillator, characterized in that electrical connection is established with any of the terminals constituting the piezoelectric oscillator using only a conductive material. The terminal constituting the piezoelectric oscillator according to claim 1 or 2 is a write control terminal, and is connected to a write electrode pad formed in any of the surplus areas. A method for manufacturing a piezoelectric oscillator.

Images