JP2004079811A - Chip electronics component and its fabricating process - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide chip electronics components capable of preventing electrical conductivity between a surface electrode layer and a circuit on a substrate from lowering even if a couple of additional electrode layers are provided. <P>SOLUTION: A couple of the additional electrode layers 15, 15 with smaller electrical conductivity than that of a couple of the surface electrode layers 5, 5 are formed using conductive paste on the surface electrode layer 5, 5 so as to embed a pair of recess portions each formed between part of a couple of side face electrodes 13, 13 and both ends of over coats 9, 11. Each of the couple of the additional electrode layers 15, 15 is formed so that contact surfaces 5a, 5a with which a pair of thin film covered electrodes 21, 21 contact are made to remain on a surface of the couple of the surface electrode layers 5, 5. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a chip electronic component and a method for manufacturing the same.
[0002]
[Prior art]
As a chip electronic component such as a chip resistor, an insulating substrate, a pair of surface electrode layers formed at both ends of the substrate surface of the insulating substrate, and along both side surfaces of the insulating substrate so that a part thereof overlaps the pair of surface electrode layers. A pair of side-surface electrode layers, an electric element such as a resistor formed so that an end thereof overlaps the pair of surface electrode layers, and an overcoat made of an insulating material covering the surface of the electric element. Things are known. In such a chip electronic component, a recess or a step is formed between the end of the side electrode layer and the end of the overcoat. Therefore, when mounting the chip electronic component on the circuit board by sucking the chip electronic component with the suction nozzle of the vacuum suction device, the presence of the concave portion or the step portion hinders the suction by the suction nozzle, and the chip electronic component drops before mounting. There was a problem. Further, when such a chip electronic component is arranged on an inner layer substrate of a multilayer circuit board to form a multilayer circuit board, a pressing force applied when a plurality of boards constituting the multilayer circuit board are stacked and compressed is increased. The overcoat protruding in the thickness direction of the chip electronic component is intensively added to the chip electronic component, causing cracks at the center of the insulating substrate of the chip electronic component, and in the worst case, the insulating substrate is broken.
[0003]
Therefore, as shown in Japanese Patent No. 2535441 and International Publication WO97 / 50095, a pair of recesses or steps formed between a part of the pair of side electrode layers and both ends of the overcoat may be filled. It has been proposed to form a pair of additional electrode layers on the surface thick film electrode layer using a conductive paste. Accordingly, the surface of the component formed on the substrate surface side is flattened by the surface of the thin film-coated electrode layer and the surface of the overcoat, and the above-described problem can be solved.
[0004]
[Problems to be solved by the invention]
In recent years, in such chip electronic components, a pair of surface electrode layers is formed using Ag, Pd-glass paste, and the side electrode layer and the additional electrode layer are often formed using Ag-resin paste. . By adopting such a material, the firing temperature applied when firing the side electrode layer and the additional electrode layer can be reduced, so that a change in electrical characteristics of the electric element due to heating can be prevented. . Usually, this type of chip electronic component is formed by forming a pair of thin-film coated electrode layers such as solder plating so as to cover the side electrode layer and the additional electrode layer, and the thin-film coated electrode layer and the circuit pattern on the circuit board are formed. Are connected by soldering, and the chip electronic component is arranged on the circuit board. However, in such a material, the conductivity of the Ag-resin paste is lower than that of the Ag, Pd-glass paste, and thus the conductivity between the surface electrode layer and the circuit on the substrate is reduced by the presence of the additional electrode layer. There was a problem of lowering.
[0005]
An object of the present invention is to provide a chip electronic component and a method for manufacturing the same, which can prevent a decrease in conductivity between a surface electrode layer and a circuit on a substrate even if a pair of additional electrode layers are provided. .
[0006]
[Means for Solving the Problems]
A chip electronic component to be improved by the present invention includes an insulating substrate made of an insulating material, a pair of thick-film electrodes and an electric element formed on the insulating substrate, and an overcoat made of an insulating material covering the surface of the electric element. A coat, a pair of additional electrode layers, and a pair of thin-film covering electrode layers covering the pair of additional electrode layers and the pair of side electrode layers. The pair of thick film electrodes are formed along both side surfaces of the insulating substrate so as to partially overlap the pair of surface electrode layers and the pair of surface electrode layers formed at both ends of the substrate surface of the insulating substrate, and It is formed using a conductive paste including at least a pair of side electrode layers having a lower conductivity than the surface electrode layer. The electric element is formed on the surface of the substrate by a thick film forming technique so as to overlap one end of each of the pair of surface electrode layers. The pair of additional electrode layers is formed using a conductive paste on the surface electrode layer so as to fill a pair of concave portions formed between a part of the pair of side electrode layers and both ends of the overcoat. In addition, it has lower conductivity than the pair of surface electrode layers. Here, the thin film-coated electrode layer is an electrode layer formed by using a thin film forming technique, and includes plating, sputtering, vacuum deposition, and the like. In the present invention, the pair of additional electrode layers are formed on the pair of surface electrode layers such that the contact surfaces of the pair of thin film-covered electrode layers contact each other on the surfaces of the pair of surface electrode layers. As in the present invention, if a pair of additional electrode layers is formed so as to leave a contact surface where the pair of thin film-coated electrode layers are in contact with the surface of the pair of surface electrode layers, the side surface electrode layer and the additional electrode layer are formed as surface electrode layers Even when formed using a material having lower conductivity, the contact between the surface electrode layer and the thin film-coated electrode layer can prevent a decrease in conductivity between the surface electrode layer and the circuit on the substrate. . For example, a surface electrode layer is formed using an Ag, Pd-glass paste, and an Ag-resin paste having a lower conductivity than the Ag, Pd-glass paste is used in order to prevent a change in electrical characteristics of the electric element due to firing. Even if the side electrode layer and the additional electrode layer are formed by using this, it is possible to effectively prevent a decrease in conductivity between the surface electrode layer and the circuit on the substrate.
[0007]
The thick film electrode may further include a pair of back surface electrode layers formed using a conductive paste at positions on the back surface of the insulating substrate facing the pair of front surface electrode layers. In this case, the pair of side electrode layers may be formed so as to partially overlap the corresponding front surface electrode layer and back surface electrode layer. With this configuration, the chip electronic component can be firmly and reliably mounted on the circuit board.
[0008]
The contact surface is preferably formed on the side electrode layer side on the pair of surface electrode layers. In this case, the additional electrode layer can be formed in contact with the overcoat, and the additional electrode layer can be easily formed.
[0009]
The thick film electrode may be composed of only a pair of surface electrode layers. In this case, the pair of additional electrode layers is formed so as to reduce the pair of steps formed between the pair of surface electrode layers and both ends of the overcoat. The pair of additional electrode layers are also formed on the pair of surface electrode layers such that the contact surfaces of the pair of thin film-covered electrode layers contact each other on the surfaces of the pair of surface electrode layers. Further, the contact surface may be formed on the other end side of the pair of surface electrode layers. In this case, the formation of the thick film electrode becomes easy, and the manufacturing cost of the chip electronic component can be reduced.
[0010]
When forming the additional electrode layer, if the surface of the component formed on the substrate surface side by the surface of the thin film coated electrode layer and the surface of the overcoat is made as flat as possible, the chip electronic component is sucked by the suction nozzle In this case, the adsorbing property can be further improved.
[0011]
In addition, if the additional electrode layer is formed so that the surface of the thin-film covered electrode layer protrudes from the surface of the overcoat, the force applied to the chip electronic component when forming the multilayer circuit board is distributed to both ends of the insulating substrate. Thus, the force applied to the portion where the electric element is formed can be reduced, and the change in the characteristics of the chip electronic component can be reliably suppressed.
[0012]
The idea of the present invention can naturally be applied to a chip resistor in which an electrode portion is formed by a thick film electrode. The present invention can also be specified as a method for manufacturing a chip electronic component.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an example of an embodiment of a chip electronic component and a method of manufacturing the same according to the present invention will be described in detail with reference to the drawings. FIG. 1 is a sectional view of an embodiment in which the chip electronic component of the present invention is applied to a chip resistor. FIG. 2 is a process chart showing each process when manufacturing the embodiment of FIG. Although only one component is shown in the process diagram of FIG. 2 for easy understanding, a large number of components are actually manufactured in one manufacturing process using a large insulating substrate. Further, in the process diagram of FIG. 2, hatching is given only to a portion formed in the process without hatching notation indicating a cross section. Here, the structure of the chip resistor of FIG. 1 will be described while describing the method of manufacturing the chip resistor with reference to the process chart of FIG.
[0014]
1 and 2, the member denoted by reference numeral 1 is an insulating substrate made of a ceramic substrate. Actually, the insulating substrate 1 shown in FIG. 2 forms a part of a large-sized multi-cavity substrate in which a V-shaped groove is formed in a square shape on the front surface or the back surface of the substrate.
[0015]
First, as shown in FIG. 2B, a pair of back electrode layers 3 and 3 are formed on both ends of the back surface 1a of the insulating substrate 1 by screen printing using a pair of conductive pastes. The width dimensions of the pair of back electrode layers 3 and 3 along the longitudinal direction of the insulating substrate 1 are substantially equal. As the conductive paste, a glass paste (metal glaze paste) containing Ag powder is used. In order to form the back electrode layers 3 and 3, a pattern of the back electrode layers 3 and 3 is printed on the back surface 1a of the insulating substrate 1 using the conductive paste, and baked at a temperature of about 850 ° C.
[0016]
Next, a pair of surface electrode layers 5 and 5 are formed at both ends of the substrate surface 1b of the insulating substrate 1. The front surface electrode layers 5 and 5 are formed under the same conditions as the back surface electrode layers 3 and 3 using an Ag / Pd-glass paste (metal glaze paste) prepared by kneading a mixed powder of Ag and Pd into a glass paste. Have been.
[0017]
Next, as shown in FIG. 2C, the resistor 7 is formed so as to overlap the ends 5b, 5b of the surface electrode layers 5, 5 formed on both ends of the substrate surface 1b. The resistor 7 serves as an electric element of the chip resistor. The resistor 7 is formed by using a thick film forming technique such as a screen printing method. Specifically, the resistor 7 was formed using a resistor glass paste containing glass as a binder and a metal oxide such as ruthenium oxide as a main component. The resistor 7 was formed by firing a resistor glass paste at an average temperature of 850 ° C. after printing.
[0018]
Next, as shown in FIG. 2D, a first overcoat 9 is formed on the surface of the resistor 7. The first overcoat 9 is formed using an insulating paste material made of a glass material. The first overcoat entirely covers the resistor 7 and is formed by firing at a temperature of about 650 ° C. after printing of the paste. Next, in order to adjust the resistance value, a predetermined position of the resistor 7 is irradiated with a laser from above the first overcoat, and a trimming groove (not shown) is formed in a part of the resistor 7. If the adjustment of the resistance value is unnecessary, it is not particularly necessary to form the trimming groove. In that case, the second overcoat described later is not required. The thickness of the first overcoat 9 was 5 μm to 8 μm.
[0019]
Next, as shown in FIG. 2E, a second overcoat 11 is formed on the first overcoat 9 using an insulating paste material made of a thermosetting resin such as an epoxy resin or an epoxy phenol resin. I do. The second overcoat 11 is formed so as to entirely cover the first overcoat 9. The curing temperature of this insulating paste material is about 280 ° C. The thickness of the second overcoat 11 was 10 μm to 15 μm. In this embodiment, the first and second overcoats 9 and 11 form an overcoat made of an insulating material.
[0020]
Next, as shown in FIG. 2F, additional electrode layers 15 are formed on the surface electrode layer 5. The additional electrode layers 15 and 15 are formed by partially kneading resin-based resin silver (Ag-resin paste) prepared by kneading Ag powder with a thermosetting resin such as an epoxy resin or an epoxyphenol resin by a printing method. Were formed so as to overlap with each other, and then fired at a temperature of about 200 ° C. to form a pattern. As a result, the additional electrode layer 15 has a lower conductivity than the surface electrode layer 5. The viscosity of the Ag-resin paste used to form the additional electrode layers 15 or the thickness of the additional electrode layers 15 is formed between the surface of the overcoat 11 and the surface of the additional electrode layers 15. The level difference is set to such an extent that the step is substantially eliminated or falls within a range of ± 5 μm to ± 15 μm based on the surface of the overcoat 11. If necessary, the additional electrode layers 15 may have a multi-layer structure of two or more layers. In this case, after the resin silver is dried by heating in the first filling operation, the resin silver is further applied thereon to form a layer. Then, the plurality of layers may be fired in one firing operation. In particular, as shown in FIG. 3, if the thickness of the additional electrode layer is set to slightly protrude from the surface of the overcoat 11, even when this chip resistor is arranged in the inner layer of the multilayer circuit board, The pressing force applied at the time of manufacturing the multilayer circuit board is distributed to both ends of the chip resistor, so that the force applied from outside does not concentrate on the portion where the resistor 7 is formed, and the resistor 7 Can be prevented from significantly changing. The protrusion dimensions of the additional electrode layers 15, 15 necessary for obtaining this effect without affecting the attraction by the attraction nozzle of the chip resistor are about 5 μm to 15 μm.
[0021]
Further, the additional electrode layers 15, 15 are formed on the pair of front surface electrode layers 5, 5 so as to expose portions of the side electrode layers 13, 13 to be formed later. The exposed portion has such a size that the exposed portion remains even after the side electrode layer 13 is formed.
[0022]
Next, as shown in FIG. 2 (G), an Ag-resin paste prepared by kneading Ag powder into an epoxy resin or an epoxy phenol resin is applied to the end surface of the insulating substrate 1 and then baked to form a pair. The side electrode layers 13 are formed. The side electrode layer 13 also has a lower conductivity than the surface electrode layer 5 like the additional electrode layer 15. When the side electrode layer 13 and the additional electrode layer 15 are formed of the Ag-resin paste in this manner, the firing temperature applied during firing can be reduced, so that a change in the electrical characteristics of the resistor 7 due to heating is prevented. can do. One end 13a of the pair of side electrode layers 13, 13 partially overlaps the exposed portions on the surface electrode layers 5, 5 formed on the surface of the insulating substrate 1, and does not contact the additional electrode layers 15, 15. The other end 13 b is formed so as to partially overlap the back electrode layers 3, 3 formed on the back surface of the insulating substrate 1. As a result, a contact surface 5a that comes into contact with the thin film-coated electrode layer 21 formed in a later step is formed on the surface electrode layers 5 and 5. In other words, the pair of additional electrode layers 15, 15 are formed on the pair of surface electrode layers 5, 5 such that the contact surfaces 5 a, 5 a with which the pair of thin film-coated electrode layers 21, 21 are in contact are left. It will be formed on the electrode layers 5 and 5. The end portions 13a and 13b of the side electrode layer 13 overlapping the electrode layers 13 and 15 have a thickness of about 20 μm. In the present embodiment, a pair of thick film electrodes are respectively formed by the pair of front surface electrode layers 5 and 5, the pair of back surface electrode layers 3 and 3, and the pair of side electrode layers 13 and 13.
[0023]
Next, as shown in FIG. 2H, a nickel plating layer 17 covering the back electrode layer 3, the front electrode layer 5, the side electrode layer 13, and the additional electrode layer 15, and a solder covering the nickel plating layer 17 as a whole. The plating layer 19 is formed by a plating technique (thin film forming technique). The nickel-plated layer 17 and the solder-plated layer 19 form a thin-film covered electrode layer 21. As a result, the thin-film-coated electrode layer 21 comes into contact with the contact surface 5a of the surface electrode layer 5. Further, an electrode portion is constituted by the thin-film covering electrode layer 21 and the thick-film electrode. Since the thickness of the thin-film electrode layer is 1/100 or less than that of the thick-film electrode layer, the presence of the thin-film covered electrode layer 21 substantially impairs the effect obtained by providing the additional electrode layers 15 and 15. It does not become. Since the additional electrode layers 15 and 15 fill the recess formed between the end of the side electrode layer 13 and the end of the overcoats 9 and 11, the plating liquid may enter the recess. To prevent the resistance value of the resistor 7 from changing due to the effect of the plating solution.
[0024]
In the chip resistor formed by the above-described forming method, the surface of the component formed on the substrate surface 1b is substantially flat due to the surface of the thin film-coated electrode layer 21 and the surface of the second overcoat 11. Thereby, when the chip resistor is suctioned by the suction nozzle of the suction machine and mounted on the circuit board, the suction is improved, and the chip resistor does not drop before mounting the chip resistor on the circuit board. In the present embodiment, a pair of additional electrode layers 15 and 15 are formed on the surfaces of the pair of front electrode layers 5 and 5 so as to leave the contact surfaces 5a and 5a where the pair of thin film coated electrode layers 21 and 21 are in contact. Therefore, the surface electrode layers 5, 5 are formed using Ag, Pd-glass paste, and the side electrode layers 13, 13 and the additional electrodes are formed using Ag-resin paste having lower conductivity than Ag, Pd-glass paste. Even when the electrode layers 15 and 15 are formed, the pair of surface electrode layers 5 and 5 and the pair of thin film-coated electrode layers 21 and 21 are in direct contact with each other. Can be effectively prevented from lowering in conductivity.
[0025]
FIG. 3 is a sectional view of another embodiment corresponding to a modification of the chip resistor of FIG. In the chip resistor shown in FIG. 3, the thickness of the additional electrode layer 35 is larger than the thickness of the additional electrode layer 15 of the chip resistor shown in FIG. The thickness of the additional electrode layer 15 shown in FIG. 1 is determined so that the surface of the component formed on the substrate surface is substantially flat by the surface of the thin-film coated electrode layer 21 and the surface of the second overcoat 11. Was. On the other hand, the thickness of the additional electrode layer 35 of the chip resistor shown in FIG. 3 is determined so that the thin-film coated electrode layer 41 protrudes from the surface of the second overcoat 11.
[0026]
4 and 5 are sectional views of a chip resistor according to another embodiment. The same members as those shown in FIG. 1 are denoted by the same reference numerals as those shown in FIG. 4 and 5 are different from the chip resistor shown in FIG. 1 in the structure and forming method of the side electrode layer. The side electrode layer 13 of the chip resistor shown in FIG. 1 is formed using a metal-resin paste. On the other hand, the side electrode layers 43 of the chip resistor shown in FIGS. 4 and 5 are formed by forming a nichrome layer 43a and a copper layer 43b by a thin film forming technique such as sputtering or vapor deposition. The nichrome layer 43a is used to increase the fixing force between the side surface 1c of the insulating substrate 1, the back electrode layer 33, and the front electrode layer 35, and the copper layer 43b is used to increase conductivity. The side electrode layers 43 shown in FIG. 4 are formed so as to completely cover the back electrode layer 33 and partially cover the exposed portion of the front electrode layer 35. As a result, the pair of additional electrode layers 45, 45 are formed so as to reduce the pair of steps formed between the pair of surface electrode layers 35, 35 and both ends of the overcoats 11, 19. . Further, the pair of additional electrode layers 45, 45 leave contact surfaces 35a, 35a on the surfaces of the pair of surface electrode layers 35, 35, respectively, where the thin-film covering electrode layers 21, 21 formed of a pair of solder plating layers are in contact. It is formed on a pair of surface electrode layers 35, 35. The method for forming the additional electrode layer 45 is the same as in the previous embodiment.
[0027]
The chip resistor shown in FIG. 5 has no back electrode layer, and the side electrode layers 43 of the chip resistor shown in FIG. 4 are formed directly on the edge of the back surface 1 a of the substrate 1.
[0028]
In the above embodiment, the present invention is applied to a chip resistor. However, the present invention relates to a chip composite electronic component or the like in which a plurality of types of electric elements such as a chip capacitor, a chip inductor, a resistor, and a capacitor are formed. Of course, it is applied.
[0029]
【The invention's effect】
According to the present invention, since the pair of additional electrode layers is formed so as to leave a contact surface where the pair of thin film-coated electrode layers are in contact with the surface of the pair of surface electrode layers, the pair of additional electrode layers is more conductive than the surface electrode layer. Even when formed by using a material having a low conductivity, the contact between the pair of surface electrode layers and the pair of thin-film covered electrode layers prevents a decrease in conductivity between the surface electrode layer and the circuit on the substrate. Can be.
[Brief description of the drawings]
FIG. 1 is a sectional view of an embodiment in which a chip electronic component of the present invention is applied to a chip resistor.
FIGS. 2 (A) to 2 (H) are process diagrams showing steps in manufacturing the embodiment of FIG.
FIG. 3 is a cross-sectional view of another embodiment in which the chip electronic component of the present invention is applied to a chip resistor.
FIG. 4 is a cross-sectional view of another embodiment in which the chip electronic component of the present invention is applied to a chip resistor.
FIG. 5 is a sectional view of still another embodiment in which the chip electronic component of the present invention is applied to a chip resistor.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Insulating substrate 3 Back electrode layer 5 Front electrode layer 5a Contact surface 9, 11 Overcoat 13 Side electrode layer 15 Additional electrode layer

Claims (12)

An insulating substrate made of an insulating material;
A pair of surface electrode layers formed at both ends of the substrate surface of the insulating substrate and formed along both side surfaces of the insulating substrate so as to partially overlap the pair of surface electrode layers, and At least including a pair of side electrode layers having a low conductivity, a pair of thick film electrodes formed using a conductive paste,
An electric element formed by a thick film forming technique on the substrate surface so as to overlap one end of each of the pair of surface electrode layers,
An overcoat made of an insulating material covering the surface of the electric element,
The pair of side electrode layers are formed using a conductive paste on the surface electrode layer so as to fill a pair of concave portions formed between the part of the pair of side electrode layers and both end portions of the overcoat. A pair of additional electrode layers having a lower conductivity than the surface electrode layer of
In a chip electronic component comprising a pair of thin-film coated electrode layers covering the pair of additional electrode layers and the pair of side electrode layers,
The chip electronic component, wherein the pair of additional electrode layers are formed on the pair of surface electrode layers such that contact surfaces of the pair of thin film-covered electrode layers contact each other on the surfaces of the pair of surface electrode layers. The thick film electrode further includes a pair of back surface electrode layers formed using a conductive paste at positions on the back surface of the insulating substrate facing the pair of front surface electrode layers, and the pair of side surface electrode layers are The chip electronic component according to claim 1, wherein the chip electronic component is formed so as to partially overlap each of the corresponding front surface electrode layer and back surface electrode layer. The chip electronic component according to claim 1, wherein the contact surface is formed on the side surface electrode layer side on the pair of surface electrode layers. An insulating substrate made of an insulating material;
A pair of surface electrode layers formed using a conductive paste at both ends of the substrate surface of the insulating substrate,
An electric element formed by a thick film forming technique on the substrate surface so as to overlap one end of each of the pair of surface electrode layers,
An overcoat made of an insulating material covering the surface of the electric element,
In a chip electronic component comprising a pair of thin film-coated electrode layers covering the pair of surface electrode layers,
A pair of additional electrode layers formed using a conductive paste on the surface of the surface electrode layer so as to reduce a pair of steps formed between the pair of surface electrode layers and both ends of the overcoat. A chip electronic component further comprising: The pair of additional electrode layers has a lower conductivity than the pair of surface electrode layers,
The method according to claim 4, wherein the pair of additional electrode layers are formed on the pair of surface electrode layers so as to leave contact surfaces where the pair of thin film-coated electrode layers are in contact with the surfaces of the pair of surface electrode layers. The described chip electronic component. The chip electronic component according to claim 5, wherein the contact surface is formed on the other end side of the pair of surface electrode layers. The said surface electrode layer is formed using Ag, Pd-glass paste, The said side electrode layer and the additional electrode layer are formed using Ag-resin paste. Chip electronic components described in any one of the above. 8. The device according to claim 1, wherein the additional electrode layer is formed so as to make a component surface formed on the substrate surface side as flat as possible by a surface of the thin film-coated electrode layer and a surface of the overcoat. A chip electronic component according to any one of the preceding claims. The chip electronic component according to any one of claims 1 to 7, wherein the additional electrode layer is formed so that a surface of the thin film-coated electrode layer protrudes from a surface of the overcoat. An insulating substrate made of a ceramic material,
A pair of surface electrode layers formed at both ends of the substrate surface of the insulating substrate and formed along both side surfaces of the insulating substrate so as to partially overlap the pair of surface electrode layers, and At least including a pair of side electrode layers having a low conductivity, a pair of thick film electrodes formed using a conductive paste,
A resistor formed using a resistor paste on the substrate surface so as to overlap one end of each of the pair of surface electrode layers,
An overcoat made of an insulating material covering the surface of the resistor,
Formed using a conductive paste on the surface thick film electrode layer so as to fill a pair of recesses respectively formed between the part of the pair of side electrode layers and both ends of the overcoat; A pair of additional electrode layers having a lower conductivity than the pair of surface electrode layers,
In a chip resistor including a pair of plating layers covering the pair of additional electrode layers and the pair of side electrode layers,
The chip resistor, wherein the pair of additional electrode layers are formed on the pair of surface electrode layers such that the contact surfaces of the pair of plating layers contact each other on the surfaces of the pair of surface electrode layers. An insulating substrate made of a ceramic material,
A pair of surface electrode layers formed using a conductive paste at both ends of the substrate surface of the insulating substrate,
A resistor formed using a resistor paste on the substrate surface so as to overlap one end of each of the pair of surface electrode layers,
An overcoat made of an insulating material covering the surface of the resistor,
In a chip resistor comprising a pair of plating layers covering the pair of surface electrode layers,
The pair of surface electrodes formed using a conductive paste on the surface of the surface electrode layer so as to reduce a pair of steps formed between the pair of surface electrode layers and both ends of the overcoat. Further comprising a pair of additional electrode layers having a lower conductivity than the layer,
The chip resistor, wherein the pair of additional electrode layers are formed on the pair of surface electrode layers such that the contact surfaces of the pair of plating layers contact each other on the surfaces of the pair of surface electrode layers. Including at least a pair of surface electrode layers formed at both ends of the substrate surface of an insulating substrate made of an insulating material, forming a pair of thick film electrodes using a metal glass paste,
An electric element is formed on the surface of the substrate by a thick film forming technique so that an end portion overlaps with the pair of surface electrode layers,
Forming an overcoat made of an insulating material covering the surface of the electric element,
Using a metal resin paste on the surface thick film electrode layer so as to fill a pair of recesses or steps formed between the other end of the pair of surface electrode layers and the end of the overcoat. Forming a pair of additional electrode layers,
A method for manufacturing a chip electronic component, comprising: forming a pair of thin film-covered electrode layers respectively covering the pair of thick film electrodes;
A method of manufacturing a chip electronic component, wherein the pair of additional electrode layers are formed on the pair of surface electrode layers such that a contact surface where the pair of thin film-coated electrode layers is in contact with the surface of the pair of surface electrode layers is left. .

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