JP2003308938A - Socket for electrical component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a socket for an electrical component wherein a protruding amount toward the upper side of a guide pin can be shortened and wherein a driving force by a coil spring can be secured within a range of a long vertical stroke of an operating member, even if the vertical stroke of the operating member is made longer. <P>SOLUTION: This socket has the socket body 13 having a housing face part 16d in which the electrical component is housed, a contact pin 14 arranged and installed at the socket body 13 and electrically connected with a terminal of the electrical component, and the operating member 20 vertically and movably arranged at the socket body 13. The operating member 20 is vertically and movably guided by the guide pin 38 installed at the socket main body 13 and driven upward by the coil spring 41 installed between the operating member 20 and the socket body 13, and the upper end of the coil spring 41 is set at a higher position than that of the upper end of the guide pin 38. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric component socket for detachably holding an electric component such as a semiconductor device (hereinafter referred to as "IC package").

[0002]

2. Description of the Related Art Conventionally, as this type of "electrical component socket", there is an IC socket that detachably holds an "electrical component" IC package.

This IC socket is provided with a socket body having an accommodating surface portion for accommodating an IC package, and a contact pin arranged in the socket body and electrically connected to a terminal of the IC package. An opening / closing member for pressing the IC package is rotatably arranged, and an operation member for opening / closing the opening / closing member is arranged on the socket body so as to be vertically movable.

The operating member is vertically movably arranged by a plurality of guide pins erected on the socket body and is urged upward by a coil spring.

[0005]

However, in such a conventional device, the upper end of the coil spring is always lower than the upper end of the guide pin.
When the guide pin is short, since the coil spring is also short, the urging force of the coil spring cannot be ensured in a long range, so that the vertical stroke of the operating member cannot be lengthened so much. Also, if the guide pin and the coil spring are set to be long in order to lengthen the vertical stroke of the operating member, the guide pin will greatly project upward from the operating member when the operating member is lowered, and therefore the guide pin and the coil spring will rotate upward. There is a risk that it may interfere with the opened / closed opening / closing member.

Therefore, according to the present invention, even when the vertical stroke of the operating member is lengthened, the upward protrusion amount of the guide pin can be shortened, and the biasing force of the coil spring is secured within the range of the long vertical stroke of the operating member. An object is to provide a socket for electric parts that can be used.

[0007]

In order to achieve the above object, the present invention according to claim 1 provides a socket main body having an accommodating surface portion for accommodating an electric component, and the socket main body. A contact pin that is electrically connected to a terminal of a component; and an operating member that is vertically movable with respect to the socket body, and the operating member is a guide pin that is erected on the socket body. While being guided to move up and down, it is urged upward by a coil spring provided between the operating member and the socket body,
The electrical component socket is characterized in that the upper end of the coil spring is set higher than the upper end of the guide pin at the highest position of the operating member.

According to a second aspect of the present invention, in addition to the structure of the first aspect, the operating member is moved up and down to
It is characterized in that an opening / closing member for pressing the electric component is opened / closed.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below.

1 to 19 show an embodiment of the present invention.

First, the structure will be described.
The IC socket 11 is an “electrical component socket”, and the IC socket 11 is used to perform a performance test of the IC package 12 which is an “electrical component”.
The second plate-shaped terminal 12b and the printed wiring board (not shown) of the measuring device (tester) are electrically connected.

As shown in FIG. 19, this IC package 12 is a so-called LGA (Land Grid Array), in which plate-like terminals 12b are arranged in a matrix on the lower surface of a rectangular package body 12a. There is. A die 12c protruding upward is formed in the center of the upper surface of the package body 12a.

On the other hand, as shown in FIG. 3, the IC socket 11 has a socket body 13 arranged on a printed wiring board (not shown), and the socket body 13 contacts the terminals 12b of the IC package 12. Base portion 15 in which a large number of contact pins 14 to be arranged are provided, and the base portion 1
5 and a floating plate 16 disposed on the upper side of

A pair of opening / closing members 19 for pressing the IC package 12 are rotatably provided on the socket body 13, and a rectangular frame-shaped operation member 20 for opening / closing the opening / closing members 19 is vertically moved. It is arranged freely.

More specifically, as shown in FIGS. 8 and 9, the contact pin 14 is formed of a plate material having spring properties and excellent conductivity, and is press-fitted and fixed in the press-fitting hole 15a of the base portion 15, The lead portion 14 extends downward from the base portion 15.
a is projected, and the lead portion 14a is electrically connected to the printed wiring board. In addition, the contact pin 14 has a substantially S-shape on the upper side of the lead portion 14a.
A contact portion 1 is formed in which an elastic portion 14b having a character shape and elastically deformable is formed, and an upper end portion of the elastic portion 14b is brought into contact with the IC package terminal 12b from below to be electrically connected.
4c is formed.

The contact pin 14 is inserted into the through hole 16a of the floating plate 16.

This floating plate 16 is shown in FIG.
As shown in FIG. 5, the IC package 12 is formed in a rectangular shape and is accommodated on the upper side of the accommodation surface portion 16d, and the guide portion 16b that guides the IC package 12 when it is accommodated is provided in each of the package main bodies 12a. A mounting protrusion 16c that is formed to correspond to the corners and that abuts the peripheral edge of the package body 12a to support the IC package 12 around the area where a large number of through holes 16a are formed in a matrix. Are formed at a total of 6 places (see FIGS. 1, 8 and 9).

The floating plate 16
Is arranged so as to be movable up and down with respect to the base portion 15.
As shown in FIG.
As shown in FIG. 3, the stopper portion 15b formed by extending upward from the base portion 15 is configured to be stopped at the highest position. This stopper 15
The b is adapted to come into contact with the upper surface of a guide portion 16a of the floating plate 16 described later.

8 shows the IC package 12 in the non-housed state, and FIG. 9 shows the IC package 12 in the housed state. The through hole 16a of the floating plate 16 is shown.
The contact pin 16 inserted into the contact portion 16 is inserted upward from the through hole 16a in both the accommodation state and the non-accommodation state of the IC package 12 in the accommodation surface portion 16d.
4c is configured to project.

When the IC package 12 is not accommodated, that is, when the floating plate 16 is at the highest position, as shown in FIG.
The protrusion amount H2 of the mounting protrusion 16c provided on the floating plate housing surface portion 16d is set to be larger than the protrusion amount H1 of c from the floating plate through hole 16a. With this, at the highest position, the contact pin contact portion 14c with the IC package 12 placed on the placing projection 16c of the floating plate 16 is placed.
The IC package terminal 12b and the IC package terminal 12b are not in contact with each other. Floating plate 1 from this highest position
When 6 is pushed down, as shown in FIG.
Contact pin contact portion 14c and IC package terminal 12
b is contacted with a predetermined contact pressure.

On the other hand, as shown in FIG. 5, the pair of opening / closing members 19 are rotatably provided so that the so-called double door can be opened.
Each opening / closing member 19 has a heat sink 23 as a “pressing portion” attached to a base plate 22, and these are supported by the socket body 13 so as to be openable and closable via a link mechanism 27.
It is configured to be displaced from the pressing position for pressing to the retracted position.

The heat sink 23 is made of, for example, aluminum die-cast and has a good thermal conductivity, and as shown in FIGS. 1, 10 and 11, one surface side (lower surface side) of the IC Contact protrusion 23a that contacts the package 12
Is formed, and a large number of heat radiation fins 23b for efficiently radiating heat are formed on the other surface side (upper surface side).

The heat sink 23 is guided by the total of four mounting screws 29 screwed into the base plate 22, and is provided so as to be vertically movable in parallel with the flat surface portion 22a of the base plate 22. 29
The heat sink 23 is biased by the coil springs 30 provided around the base plate in a direction in which the heat sink 23 is brought into contact with the flat surface portion 22a of the base plate.

The link mechanism 27 includes a pair of first link outer members 24 and a pair of first inner link members 25 as "first link members" provided on both sides of the base plate 22, respectively.
And a second link member 26.

The first link outer member 24 is shown in FIG.
The first link inner member 25 is formed in a plate shape as shown in FIG. 13, and as shown in FIG.
a and 25a are supported by a support post 15c protruding from the base portion 15 of the socket body 13 via a support shaft 32 so as to be vertically rotatable. The first link outer member 24 and the first link inner member 25 are provided on both sides of the base plate 22 and the like and have a symmetrical shape.
2 and FIG. 13 show one of them.

Then, as shown in FIGS. 2 and 3, the first link outer member 24 and the first link inner member 25.
The vicinity of the other ends 24b, 25b of the above is rotatably attached to the vertical piece 22b of the base plate 22 via the attachment shaft 33. However, in the first link inner member 25,
The locking piece 25c is formed by being bent, and the locking piece 25c is formed.
However, as shown in FIG. 1, the vertical piece 2 of the base plate 22 is
This base plate 22 is locked by 2b.
Is the first link outer member 24 and the first link inner member 2
Rotation in one direction about the mounting shaft 33 with respect to 5 is prevented.

Further, the second link member 26 has, as shown in FIG. 14, a pair of side plate portions 26a provided on both sides of the heat sink 23 and the like, and a long plate-shaped connecting bridge portion 26b for connecting them. ing. These side plate portions 26a are
By being sandwiched between the link outer member 24 and the first link inner member 25, the first link outer member 24 and the first link outer member 24
The link inner member 25 is arranged in parallel at a predetermined interval.

Then, one end portion 26c of the side plate portion 26a is formed.
Is rotatably attached to the operation member 20 via a force point shaft 36, and the other end 26d of the side plate 26a is
The first link outer member 24 and the other ends 24b, 25b of the first link inner member 25 are rotatably connected via a connecting shaft 34.

As a result, when the operating member 20 is lowered from the highest position shown in FIG. 3 as shown in FIG.
The position of 6 is lowered, and the side plate portion 26a of the second link member 26 is
The lower edge recessed portion 26e abuts the support shaft 32,
2 serves as a lever fulcrum, and the connecting shaft 34, which is the point of action, is rotated upward, so that the first link outer member 24 and the first link inner member 25 are supported by the support shaft 3 via the mounting shaft 33.
By rotating upward about 2, the base plate 22 and the heat sink 23 are opened upward.

On the other hand, as shown in FIG. 15, the operating member 20 has an opening 20 having a size into which the IC package 12 can be inserted.
It has a quadrangular frame shape having a and is vertically movable with respect to the socket body 13.

That is, as shown in FIG. 3, screw portions 38a of a total of four guide pins 38 are screwed and attached to a nut 39 provided on the socket body 13, and the guide pins 38 are operated. The operation member 20 is guided by the guide pin 38 by being inserted into the guide hole 20b of the above, and is arranged to be vertically movable. Then, the operating member 20 is urged upward by the coil spring 41 arranged around each guide pin 38, and at the uppermost position, the operating member 20 is attached to the upper end flange portion 38b of the guide pin 38.
By contacting the peripheral edge portion 20c of the guide hole 20b of
The raising of the operating member 20 is restricted.

The guide hole 20b of the operating member 20 is formed on the bottom surface of the guide pin recess 20d having an opening at the upper side. At the highest position of the operating member 20, the guide pin 38 extends from the upper surface of the operating member 20. The upper end flange portion 38 of is set at a position lower by the distance L1.

Around the guide pin recess 20d, a spring recess 2 having a substantially annular shape with a downward opening is formed.
0c is formed, and the upper side of the coil spring 41 is inserted into the spring recess 20c. Operation member 20
The uppermost flange of the guide pin 38,
The upper end of the coil spring 41 is located higher than 8b (see FIG. 3).

Further, as shown in FIGS. 2 and 16, the operating member 20 is provided with two ventilation passages 20f on opposite side portions 20j. The pair of ventilation passages 20f on each of the side portions 20j has a pair of guide pin recesses 20d.
The outer opening 20g is formed on the outer edge side of each side 20j, and the inner opening 20h is formed on the inner edge side. These outer openings 20g are
The width W1 is formed wider than the width W2 of the inner opening 20h.

Now, with the opening / closing member 19 closed,
The outside air that has entered from the outside opening 20g of the ventilation path 20f passes through the inside, is blown from the inside opening 20h toward the heat sink 23 inside the frame shape, and is discharged from the inside to the outside.

In the IC socket 11 having such a structure,
The IC package 12 is housed as follows.

First, the operating member 20 is pushed downward by an automatic machine against the biasing force of the spring 41 or the like.
As a result, from the state shown in FIG. 3, the force application shaft 36 of the operating member 20 descends and the second link member 26 rotates downward, whereby the lower edge recessed portion 26e of the second link member 26.
Contacts the support shaft 32 (see FIG. 4).

When further pushed down from this state, the second link member 26 is centered on the support shaft 32 by the principle of leverage.
Rotates, the connecting shaft 34 side moves upward, the first link outer member 24 and the first link inner member 25 rotate upward about the support shaft 32, and the base plate 22 and the heat sink via the mounting shaft 33. 23 is lifted and opened (see FIG. 5).

At this time, the pressing force of the operating member 20 is the same as the pressing force of the coil spring 41.
Since it is sufficient to add a weight such as, the force against the urging force of the torsion coil spring for securing the pressing force of the heat sink unlike the conventional case is not required, and therefore the opening / closing member 19 is opened with a smaller force than the conventional case. be able to.

The base plate 22 and the heat sink 23 are mounted on the mounting shaft 33 and the first link inner member 2.
Since it is supported by the locking piece 25c such as 5, the mounting shaft 3
There is no possibility of making a large rotation about 3 and causing a blur.

When the opening / closing member 19 is fully opened, as shown in FIGS. 5 and 6, the opening / closing member 19 is substantially along the vertical direction and is retracted from the insertion range of the IC package 12.

In this state, as shown in FIG. 8, the IC package 12 is guided by the guide portions 16b on the floating plate 16 and placed on the placing projection 16c.
During this placement, the protrusion amount H2 of the placement protrusion 16c is
Since the protrusion amount H1 of the contact portion 14c of the contact pin 14 is larger than that, the terminal 12b of the IC package 12 does not collide with the contact portion 14c of the contact pin 14 and damage can be prevented.

Further, since the contact pin contact portion 14c always projects upward from the through hole 16a of the floating plate 16, dust is not accumulated in the through hole 16a. Therefore, the contact pin contact portion 14
It is possible to prevent the contact failure between the c and the IC package terminal 12b, and to smoothly move the contact pin 14 relative to the floating plate through hole 16a.

Next, when the pressing force applied to the operating member 20 is released, the operating member 20 rises by the urging force of the coil spring 41, and the opening / closing member 19 is closed by the operation opposite to the above. Then, as shown in FIG. 9, the abutting protrusion 23a of the heat sink 23 is moved to the IC package 12
Of the die 12c.

At this time, the base plate 22 is slightly rotated about the mounting shaft 33, and the heat sink 23 is vertically movable with respect to the base plate 22 via the mounting screws 29, the coil springs 30 and the like. Since the contact protrusion 23a of the heat sink 23
When pressing the package body 12a of the package 12, it is possible to perform delicate angle adjustment, and distribute the force to act in a well-balanced manner.

Then, the floating plate 16 is lowered against the biasing force of the spring 17, so that the amount of protrusion of the contact portion 14c of the contact pin 14 from the floating plate 16 is increased, and the contact portion 14c is formed in the IC package. It contacts the terminal 12b of 12 (refer to FIG. 9). In this contact state, the contact pin 14
The elastic portion 14b is elastically deformed, and this elastic force ensures a predetermined contact pressure.

At this time, as shown in FIG. 8, the contact portion 14c side on the tip side of the contact pin 14 and the lead portion 14a side on the root side are displaced by a half pitch P. Therefore, even when the tip of the contact portion 14c is pushed downward, the tip is displaced downward without falling, so that the displacement operation can be smoothly performed.

Moreover, by providing the link members 24, 25, 26, the contact pressure between the IC package terminal 12b and the contact pin contact portion 14c can be secured without using a torsion coil spring having a large biasing force. .

That is, as shown in FIG. 3, when the upward force F1 from the contact pin 14 and the floating plate 16 acts on the heat sink 23, this force F1 acts on the connecting shaft 34 via the mounting shaft 33. Becomes Then, the component force F2 of the force F1 acts as a force for rotating the first link outer member 24 and the first link inner member 25 about the support shaft 32. However, when the first link outer member 24 and the first link inner member 25 are attempted to be rotated in the component force F2 direction from the state shown in FIG. 3, the second link member 26 becomes so-called bulging, and the force point shaft 3
An outwardly acting force F3 acts on 6.

The force F3 along the substantially horizontal direction acts as a force for deforming the operating member 20 to the outside, but does not act as a force for lowering the operating member 20. Therefore, since the second link member 26 does not rotate and acts as a strut, a contact pressure between the IC package terminal 12b and the contact portion 14c of the contact pin 14 can be secured.

As a result, each link member 24, 25, 2
By providing 6, the pressing force of the operating member 20 when opening the opening / closing member 19 can be reduced, and the opening / closing member 19
The terminal 12b of the IC package 12 in the closed state,
It is possible to secure the contact pressure between the contact pin 14 and the contact portion 14c.

Further, in the second link member 26, as shown in FIG. 1, since the side plate portions 26a provided on both sides are connected by the connecting bridge portions 26b, the operation member 20 is partially pushed. However, it is possible to integrate the operations of the first link outer member 24 and the first link inner member 25, which are provided in a pair on the left and right, and to greatly reduce the inclination of the base plate 22 due to one-sided pressing.

Further, as shown in FIG. 5, the guide pin 3
By shortening 8, the operating member 20 is lowered and the opening / closing member 19 is rotated by about 90 ° so that the upper end flange portion 38b of the guide pin 38 has the heat sink 23 or the like even when the guide pin 38 is in a state of being substantially vertical. It is possible to reduce the size of the IC socket 11 without interfering with the.

Furthermore, the coil spring 41 arranged around this short guide pin 38 is shown in FIG.
Since it is set to be long as shown in FIG. 5, the vertical stroke of the operating member 20 can be lengthened, and the coil spring 41 can secure upward biasing force in the range of the long vertical stroke.

Moreover, when the IC package 12 is set in the IC socket 11 and a burn-in test is performed, it is necessary to test the IC package 12 under a predetermined temperature condition. However, when the IC package 12 is accommodated, the periphery of the IC package 12 is covered with the frame-shaped operation member 20, so that the heat sink 23 radiates heat. The heat inside 20 is difficult to escape, and the temperature may rise above the outside of the IC socket 11.

However, here, since the ventilation member 20f is formed in each of the operation member 20 at two places, the air is circulated between the inside and outside of the operation member 20 through the ventilation passages 20f. . Therefore, the IC package 12 can be inspected at a predetermined temperature.

Moreover, as shown in FIG. 16, since each ventilation passage 20f is formed on a side 20j of the operating member 20 facing each other and is arranged in a straight line, for example, from the left ventilation passage 20f to the operating member. The air introduced inside 20 is
Perform heat exchange in the part where the C package 12 is stored,
As it is, it is discharged to the outside of the IC socket 11 from the right ventilation passage 20f. Therefore, since the air flow is good, the heat dissipation of the IC package 12 can be performed more effectively.

In the above embodiment, the present invention is applied to the IC socket 11 as the "electrical component socket", but the present invention is not limited to this and can be applied to other devices. Further, in the above-mentioned embodiment, "electrical component"
As an IC socket that accommodates LGA type,
Although the present invention is applied, the present invention is not limited to this, and BGA (BallGri
The present invention can be applied to an IC socket that accommodates an IC package such as d Array) or PGA (Pin Grid Array). In the above embodiment, the opening / closing member is opened / closed by the operating member, but not limited to this, the operating member is moved downward to move the moving plate to elastically deform the contact pin, and thereby the electric component terminal. It can also be separated and contacted.

[0059]

As described above, according to the invention described in each claim, the upper end of the coil spring is set higher than the upper end of the guide pin at the highest position of the operating member. Even if the vertical stroke is lengthened, the upward protrusion amount of the guide pin can be shortened, and the biasing force of the coil spring can be secured within the long vertical stroke range of the operating member.

[Brief description of drawings]

FIG. 1 is a plan view of an IC socket according to an embodiment of the present invention, showing a state in which an upper half of a pair of opening / closing members is opened.

FIG. 2 is a right side view of FIG. 1 showing the IC socket according to the same embodiment.

FIG. 3 is a sectional view taken along line AA of FIG. 1 according to the same embodiment.

FIG. 4 is a cross-sectional view corresponding to FIG. 3, showing a state in which the operating member of the IC socket according to the same embodiment is being lowered.

FIG. 5 is a cross-sectional view corresponding to FIG. 4, showing the lowest position of the operating member of the IC socket according to the same embodiment.

FIG. 6 is a cross-sectional view taken along the line BB of FIG. 1 according to the same embodiment.

FIG. 7 is a cross-sectional view taken along the line CC of FIG. 1 according to the same embodiment.

FIG. 8 is a cross-sectional view showing the operation when the IC package according to the same embodiment is stored, and is a view showing a state in which the opening / closing member is opened.

FIG. 9 is a cross-sectional view showing the operation when the IC package according to the same embodiment is stored, and is a view showing a state in which the opening / closing member is closed and the IC package is stored.

FIG. 10 is a cross-sectional view showing a base plate and a heat sink according to the same embodiment.

FIG. 11 is a cross-sectional view showing an attached state of the base plate and the heat sink according to the same embodiment.

FIG. 12 is a view showing a first link outer member according to the same embodiment, (a) is a plan view, (b) is a front view, and (c) is a right side view of (b).

13A and 13B are views showing a first link inner member according to the embodiment, wherein FIG. 13A is a plan view, FIG. 13B is a front view, and FIG. 13C is a right side view of FIG. 13B.

FIG. 14 is a view showing a second link member according to the same embodiment, (a) is a plan view of the second link member, (b) is a front view, and (c) is a right side view of (a). is there.

FIG. 15 is a plan view of the operating member according to the embodiment.

FIG. 16 is a bottom view of the operating member according to the embodiment.

FIG. 17 is a cross-sectional view taken along the line DD of FIG. 15 according to the same embodiment.

FIG. 18 is a cross-sectional view taken along the line EE of FIG. 15 according to the same embodiment.

FIG. 19 is a view showing an IC package, (a) is a plan view of the IC package, (b) is a front view of the IC package,
(C) is a bottom view of the IC package.

[Explanation of symbols]

11 IC socket (socket for electric parts) 12 IC package (electrical parts) 12b terminal 14 Contact pin 14c contact part 15 Base 16 floating plate 19 Opening / closing member 20 Control members 20b guide hole 20c periphery 20d guide pin recess 20e spring recess 38 Guide pin 39 nuts 41 coil spring

Claims (2)

[Claims] 1. A socket main body having an accommodating surface portion for accommodating an electric component, a contact pin disposed in the socket main body and electrically connected to a terminal of the electric component, and a vertical movement with respect to the socket main body. An operation member disposed freely, the operation member being vertically movably guided by a guide pin erected on the socket body, and provided between the operation member and the socket body. The upper end of the coil spring is set to a position higher than the upper end of the guide pin at the most raised position of the operating member, and the socket for electrical parts is characterized in that the upper end of the coil spring is set higher than the upper end of the guide pin. 2. The socket for electric parts according to claim 1, wherein an opening / closing member for pressing the electric part is opened and closed by moving the operating member up and down.