JP2003264046A - Socket for electric parts - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a socket for an electric parts in which the distance between a pair of elastic pieces of a contact pin becomes narrower and which enables them to make smooth movements. <P>SOLUTION: In an IC socket 11 in which a housing face part 19a to house an IC package 12 is installed on the socket main body 13, in which a plurality of the contact pins capable of contacting with and separating from a soldering ball 12b of the IC package 12 are arranged and installed in parallel at the socket main body 13, in which a moving board 17 is movably installed at the socket main body 13, and in which a contact part 15d installed at the tip end part of this elastic piece 15a is made to be separated from the side face part of the soldering ball 12b of the IC package 12 by elastically deforming the elastic piece 15a of the contact pin 15, a plate-formed pair of the elastic pieces 15a is opposedly installed at the contact pin 15, a protruding part 15f protruding to another elastic piece 15a side is installed at the opposed face side of these one elastic piece 15a, and the movements in a direction that the distance between both opposed faces of the pair of the elastic pieces 15a are regulated. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric component socket for detachably holding an electric component such as a semiconductor device (hereinafter referred to as an "IC package"), and more particularly to an improvement of a contact pin which is connected to and detached from a terminal of the electric component. It is about.

[0002]

2. Description of the Related Art Conventionally, as this type of "electrical component socket", there is an IC socket that detachably holds an "electrical component" IC package.

This IC package has a BGA (Ball Gr
id array) type, which has a large number of solder balls as terminals provided on the lower surface of a rectangular package body.

A contact pin is arranged in the IC socket, and a pair of plate-shaped elastic pieces are formed on the contact pin so as to face each other. A contact portion is formed on the side surface portion of the solder ball so as to be brought into contact with and separated from the side surface portion, and the elastic piece is elastically deformed by being pressed by a moving plate which moves in the vertical direction.

By moving the moving plate to elastically deform the elastic piece, the gap between both contact portions of both elastic pieces is widened, the solder balls are inserted between them, and then the moving plate returns to its original position. By doing so, the contact portion of the elastic piece also returns to the original position, and the solder ball is sandwiched between both contact portions and electrically connected.

In this state, for example, a burn-in test is performed, and then, similarly to the above, the moving plate is moved to displace the contact portions of both elastic pieces to widen the distance between the both contact portions and separate them from the solder balls. Then, the IC package is taken out from the IC socket by an automatic machine.

In this way, the IC package can be attached and detached without sliding force simply by sliding the moving plate, so that the working efficiency can be remarkably improved.

[0008]

However, in such a conventional one, since the plate material punched by press working is folded back to form a pair of opposing elastic pieces, the contact pins are opposed to each other. When the pair of elastic pieces are opened, a twisting force is applied to both elastic pieces, and the distance between the opposing surfaces becomes narrower than a predetermined amount, which may prevent smooth movement. In particular, in the case where a plurality of contact pins are arranged close to each other and the elastic pieces of the adjacent contact pins pass each other, there is a possibility that interference may occur due to the narrowing of the interval.

Therefore, it is an object of the present invention to provide a socket for electric parts which can be smoothly moved without narrowing the distance between the pair of elastic pieces of the contact pin.

[0010]

In order to achieve the above object, the invention according to claim 1 is characterized in that an accommodating surface portion for accommodating an electric component is provided on the socket body, and the socket body has a terminal for the electric component. A plurality of contact pins that can be brought into and out of contact with each other are arranged side by side, and a moving plate is movably provided with respect to the socket body. By moving the moving plate, the elastic piece of the contact pin is elastically deformed. A socket for electric parts in which a contact portion provided at a tip end portion of the elastic piece is displaced so as to be separated from a side surface portion of a terminal of the electric part, wherein the contact pin has a pair of plate-shaped elastic pieces. Are provided so as to face each other, and a projecting portion that projects toward the other elastic piece side is provided on the opposing surface side of the one elastic piece, and the projecting portion reduces the distance between both facing surfaces of the pair of elastic pieces. Regulate movement And characterized in that a socket for electrical parts.

According to a second aspect of the present invention, in addition to the structure of the first aspect, the movable plate is provided so as to be vertically movable with respect to the socket body, and the movable plate is moved in the vertical direction. According to this, the both elastic pieces are elastically deformed, and the contact portions of the both elastic pieces are displaced.

The invention according to claim 3 is the invention according to claim 1 or 2.
In addition to the configuration described in 1, the contact pin, both contact portions of the pair of elastic pieces, in plan view, are opposite to each other with a center line passing through the center of the solder ball and along the displacement direction of the elastic piece as a boundary. It is arranged in.

The invention according to a fourth aspect is the first to the third aspects.
In addition to the configuration described in any one of 1 above, in the contact pin, when a pair of elastic pieces are opened, a contact portion of one elastic piece passes over a contact portion of the other elastic piece of an adjacent contact pin. It is characterized by being arranged as follows.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below.

1 to 8 show an embodiment of the present invention.

First, the structure will be described.
The IC socket 11 is an “electrical component socket”, and the IC socket 11 is used to perform a performance test of the IC package 12 which is an “electrical component”.
It is intended to electrically connect the solder ball 12b, which is the second terminal, to a printed wiring board (not shown) of the measuring device (tester).

The IC package 12 is of a so-called BGA (Ball Grid Array) type as shown in FIG. 8, for example, and a large number of substantially spherical solder balls 12b are projected on the lower surface of a rectangular package body 12a. They are arranged in a matrix.

As shown in FIG. 2, the IC socket 11 has a socket main body 13 mounted on a printed wiring board (not shown), and the socket main body 13 separates from and contacts each solder ball 12b. The contact pin 15 is arranged, and the moving plate 17 for displacing the contact pin 15 is arranged. Further, the top plate 19 is fixed to the socket body 13 on the upper side of the moving plate 17. It is set up. Furthermore, an operating member 21 for moving the moving plate 17 up and down is provided.

The contact pin 15 is made of a plate material having a spring property and excellent conductivity, which is formed into a shape as shown in FIG.

More specifically, the contact pin 15 has a pair of plate-shaped elastic pieces 15a formed in approximately the upper half thereof, and one solder tail portion 15b formed in the substantially lower half thereof. The pair of elastic pieces 15a are formed so as to face each other by bending the lower end side base portion 15c into a substantially U shape. Also, the elastic pieces 15a
A contact portion 15d is formed on the upper end portion (tip portion) of the IC package 12 so as to come into contact with and separate from the side surface portion of the solder ball 12b of the IC package 12. As shown in FIG. 7, the two contact portions 15d are arranged on opposite sides of a center line O passing through the center of the solder ball 12b and extending along the displacement direction of the elastic piece 15a.

Further, the pair of elastic pieces 15a of the contact pin 15 are formed with pressed portions 15e so as to be convex outward in the displacement direction of the elastic pieces 15a, and these pressed portions 15e will be described later. Cam part 17a of moving plate 17
The contact portions 15d are opened by being pressed by.

The opening amounts of the both contact portions 15d are configured such that, when they are opened to the maximum extent, they pass each other by passing the side of the contact portions 15d of the contact pins 15 adjacent to each other ((b) of FIG. 7). reference).

Further, a protruding portion 15f protruding toward the pressed portion 15e side of the other elastic piece 15a is formed on the surface of the one elastic piece 15a facing the pressed portion 15e, and by this protruding portion 15f, Movement of the pair of elastic pieces 15a, 15a in a direction in which the distance between the opposing surfaces is narrowed is restricted.

The solder tail portion 15b and the base portion 15c of the contact pin 15 are press-fitted into the press-fitting hole 13a formed in the socket body 13 as shown in FIG. 3, and the biting portion formed in the base portion 15c. When 15 g bites into the socket body 13, the contact pin 15 is prevented from slipping upward.

The solder tail portion 15b protruding downward from the socket body 13 is further protruded downward via the locate board 26, and is inserted into each through hole of a printed wiring board (not shown) and soldered. It is supposed to be connected.

On the other hand, the moving plate 17 is, as shown in FIG.
It is arranged in the socket body 13 so as to be vertically movable, and is biased upward by a spring 22. Then, the moving plate 17
A pair of arms 23 for moving the up and down (one is omitted in the drawing)
It is arranged. The arm 23 is rotatably attached to the socket body 13 by the shaft 24 and to the movable plate 17 by the shaft 25, and the upper end portion 23a is in sliding contact with the cam surface 21c of the operation member 21. As a result, when the operating member 21 is lowered, the arm 23 is pushed by the cam surface 21c and rotates about the shaft 24 in the counterclockwise direction as shown in FIGS. It is supposed to be done.

As shown in FIGS. 7A and 7B, the moving plate 17 is provided with cam portions 17a located between the contact pins 15 and formed on both sides of the cam portions 17a. The formed sliding surface 17b presses the pressed portion 15e of the elastic piece 15a of the contact pin 15 adjacent on both sides. That is, this one cam portion 1
The pressed portions 15e of the elastic pieces 15a of the contact pins 15 on both sides can be pressed by the 7a, and both pressed portions 15e of the pair of elastic pieces 15a of the contact pin 15 can be pressed by the contact pin 15a. Both contact portions 15d are configured to open by being pressed by the pair of cam portions 17a arranged on both sides of the two in a direction in which they approach each other.

Further, the top plate 19 has an accommodation surface portion 19a for accommodating the IC package 12 on the upper side, and a guide portion 19b for positioning the IC package 12 at a predetermined position, as shown in FIG.
It is provided corresponding to each corner of a. Further, the top plate 19 is formed with a positioning rib 19c to be inserted between the pair of contact portions 15d of each contact pin 15, so that no external force acts on both elastic pieces 15a of the contact pin 15 (both When the contact portion 15d is closed), the positioning rib 19c is sandwiched between the elastic pieces 15a (see FIG. 7A).

Further, as shown in FIG. 2, the operating member 21 has an opening 21 having a size into which the IC package 12 can be inserted.
a, and the IC package 12 through the opening 21a
Is inserted and accommodated in a predetermined position on the accommodation surface portion 19a of the top plate 19. Further, as shown in FIGS. 2 and 3, the operating member 21 is arranged so as to be movable up and down with respect to the socket body 13, and the spring 2
While being urged upward by 7, the locking claw 21b is locked to the locked portion of the socket body 13 at the highest position to prevent the operation member 21 from coming off.

Further, the operating member 21 includes an arm 2
As shown in FIG. 10, in addition to the cam surface 21c for rotating the lever 3, an operating portion 21d for rotating the latch 28 is formed.

This latch 28, as shown in FIG.
It is attached to the socket body 13 so as to be rotatable about a shaft 28a, is urged counterclockwise in FIG. 2 by a spring 29, and holds down the peripheral edge of the IC package 12 by a holding portion 28b provided at the tip. It is set.

Further, the operating member 21 is attached to the latch 28.
A pressed portion 28c on which the operating portion 21d of
When the operating member 21 is lowered, the pressed portion 28c slides on the operating portion 21d, the latch 28 is rotated clockwise as shown in FIG. 5, and the holding portion 28b is moved to the IC package 12.
It is designed to be retracted from the installation position.

Next, the operation of this embodiment will be described.

To set the IC package 12 in the IC socket 11, the operating member 21 is pushed downward. Then, the cam surface 21c of the operating member 21 causes the arm 23 to rotate counterclockwise as shown in FIG. 4, and the moving plate 17 is lowered. By lowering the moving plate 17, as shown in FIG.
As shown in (a) to (b), the cam portion 17a descends, and the sliding surface 17b of the cam portion 17a pushes the pressed portion 15e of the contact pin 15 to form a pair of contact portions.
15d is opened as shown in FIG. 7 (b).

At this time, since the protrusion 15f is formed on one elastic piece 15a toward the other elastic piece 15a, a force in the twisting direction is applied to both elastic pieces 15a, so that a pair of elastic pieces 15a is formed. When the gap between the opposing surfaces of the elastic pieces 15a, 15a is narrowed, the protrusion 15f abuts the other elastic piece 15a, so that the elastic pieces 15a, 1a
The interval of 5a is regulated, and it is not narrower than the protrusion amount of the protrusion 15f.

Then, as shown in FIG. 7, it is possible to secure the opening amount of the contact portion 15d without contacting the back surface of the contact portion 15d of the adjacent contact pin 15, and
A smooth operation can be performed.

Incidentally, as shown in FIG. 9B, in the case where the projection 15f is not formed, both elastic pieces 15a are formed.
The contact portion 15d moves diagonally due to a force in the twisting direction, and the back surface portions of the contact portions 15d of the adjacent contact pins 15 interfere with each other, which may make it impossible to secure the opening amount of the contact portion 15d.

Further, since the contact portions 15d of the adjacent contact pins 15 pass to the side of the mating contact portion 15d and spread to a position where both contact portions 15d pass each other, the arrangement pitch of the contact pins 15 is narrow. Even in the case where the two contact portions 15d are opened, the opening amount of both contact portions 15d can be secured.

At the same time, the actuating portion 21d of the operating member 21 pushes the pressed portion 28c of the latch 28 to resist the urging force of the spring 29 from the state shown in FIG. 2 to the state shown in FIG. Then, it is rotated clockwise, and the holding portion 28b is displaced to the retracted position.

In this state, the IC package 12 is accommodated in a predetermined position on the accommodation surface portion 19a of the top plate 19 by being guided by the guide portion 19b.
The respective solder balls 12b are inserted in a non-contact state between the pair of opened contact portions 15d of the respective contact pins 15 (see (b) of FIG. 7).

After that, when the downward pressing force of the operating member 21 is released, the operating member 21 is lifted by the urging force of the spring 27 and the like, so that the moving plate 17 is lifted by the spring 22 and at the same time the latch is latched. 28 is rotated counterclockwise from the state shown in FIG. 5 by the urging force of the spring 29.

When the moving plate 17 is raised, the cam portion 17a
The pressing force of the contact pin 15 on the pressed portion 15e is released, the pair of contact portions 15d move in the direction of closing (narrowing) with each other, and the solder ball 12 is moved at both contact portions 15d.
b is clamped.

As a result, the solder balls 12b of the IC package 12 and the printed wiring board contact the contact pins 15.
The IC package 12 is electrically connected to the IC package 12 in this state, and a burn-in test or the like of the IC package 12 is performed.

On the other hand, in order to remove the IC package 12 from the mounted state, similarly, the operating member 21 is lowered to open the pair of contact portions 15d of the contact pin 15 and open the pair of solder balls 12b of the IC package 12. By separating the contact portion 15d from this state,
The IC package 12 can be removed from the IC socket 11 with no force by an automatic machine.

Although the present invention is applied to the IC socket 11 as the "electrical component socket" in the above embodiment, the present invention is not limited to this and can be applied to other devices. Further, in the above embodiment, both of the pair of elastic pieces 15a are elastically deformed to open and close, but the invention is not limited to this, and only one elastically deformable. In the case of elastically deforming only one of the pair of elastic pieces, the moving plate may be elastically deformed by moving in the lateral direction. Further, although the protrusion is provided only on one of the pair of elastic pieces, the present invention is not limited to this, and the protrusions are provided on both elastic pieces so that both protrusions abut on the elastic pieces facing each other and the distance between the elastic pieces is increased. May be secured. Further, although one protrusion is provided on each elastic piece, a plurality of protrusions may be provided on each elastic piece.

[0046]

As described above, according to the invention described in each claim, the contact pin is provided with the pair of elastic pieces, and the elastic surface of the one elastic piece is opposed to the elastic piece of the other elastic piece. A protrusion protruding to one side is provided, and the protrusion restricts the movement of the pair of elastic pieces in the direction in which the distance between the opposing surfaces decreases. By contacting the other elastic piece,
The elastic pieces can be operated smoothly without the distance between both elastic pieces being restricted and becoming smaller than the protruding amount of the protrusion.

According to the invention described in claim 4, in the contact pin, when the pair of elastic pieces are opened, the contact portion of one elastic piece is the contact portion of the other elastic piece of the adjacent contact pin. Since they are arranged so as to pass each other, it is possible to secure the opening amount even if the arrangement pitch of the adjacent contact pins is narrow.

[Brief description of drawings]

FIG. 1 is a plan view of an IC socket according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG. 1 according to the same embodiment.

FIG. 3 is a sectional view taken along line BB of FIG. 1 according to the same embodiment.

FIG. 4 is a cross-sectional view of the IC socket according to the same embodiment with the operating member lowered.

FIG. 5 is a cross-sectional view showing the movement of the latch of the IC socket according to the same embodiment, showing a state in which the operating member is in the lowered position.

FIG. 6 is a view showing an IC socket according to the same embodiment,
(A) is a front view of a contact pin, (b) is a left side view of (a), (c) is a plan view of a contact portion of the contact pin.

FIG. 7 is a view showing the movement of the contact pin according to the embodiment, (a) is a state in which the contact pin is closed, and (b) is a state.
FIG. 6 is a diagram showing a state in which a contact pin is opened.

FIG. 8 is a view showing an IC package according to the same embodiment, (a) is a front view and (b) is a bottom view.

9A and 9B are diagrams showing the movement of the elastic piece of the contact pin when no protrusion is provided, FIG. 9A is a state in which the contact pin is closed, and FIG. 9B is a diagram in which the contact pin is open. is there.

[Explanation of symbols]

11 IC socket (socket for electric parts) 12 IC package (electrical parts) 12a package body 12b Solder ball (terminal) 13 Socket body 15 contact pins 15a elastic piece 15d contact part 15f protrusion 17 Moving plate 19 top plate 19a Housing surface 21 Operation member

[Procedure amendment]

[Submission date] January 15, 2003 (2003.1.1
5)

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 1

[Correction method] Change

[Correction content]

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 3

[Correction method] Change

[Correction content]

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0010

[Correction method] Change

[Correction content]

[0010]

In order to achieve the above object, the invention according to claim 1 is characterized in that an accommodating surface portion for accommodating an electric component is provided on the socket body, and the socket body has a terminal for the electric component. A plurality of contact pins that can be brought into and out of contact with each other are arranged side by side, and a moving plate is movably provided with respect to the socket body. By moving the moving plate, the elastic piece of the contact pin is elastically deformed. In a socket for electric parts, in which a contact portion provided at a tip end portion of the elastic piece is displaced to be separated from a terminal of the electric part , a pair of elastic pieces are provided to face the contact pin. , On the opposite surface side of the one elastic piece,
Providing a protrusion that protrudes to the other elastic piece side, and by this protrusion,
It is characterized in that it is an electrical component socket in which the movement of the pair of elastic pieces in the direction in which the distance between the opposing surfaces is narrowed is restricted.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0012

[Correction method] Change

[Correction content]

The invention according to claim 3 is the invention according to claim 1 or 2.
In addition to the configuration described in, the electric component is a BGA package.
The contact portions of the pair of elastic pieces of the contact pin are arranged on opposite sides of a center line along the displacement direction of the elastic piece of the solder ball of the BGA package. .

Claims (4)

[Claims] 1. A housing surface portion for housing an electrical component is provided on the socket body, and a plurality of contact pins that can be connected to and detached from the terminals of the electrical component are arranged side by side on the socket body, with respect to the socket body. A movable plate is movably provided, and by moving the movable plate, the elastic piece of the contact pin is elastically deformed to displace the contact portion provided at the tip end of the elastic piece, and In the socket for electric parts, which is arranged to be separated from the side surface of the terminal, the contact pin is provided with a pair of plate-shaped elastic pieces facing each other, and the elastic surface of one of the elastic pieces is opposed to the other elastic piece. A socket for electric parts, characterized in that a protrusion projecting to one side is provided, and the protrusion restricts movement in a direction in which a gap between both facing surfaces of a pair of elastic pieces is narrowed. 2. The moving plate is provided so as to be movable up and down with respect to the socket body, and by moving the moving plate in the vertical direction, the elastic pieces are elastically deformed so that the elastic pieces of the elastic pieces are movable. The socket for electric parts according to claim 1, wherein the contact portion is displaced. 3. The two contact portions of the pair of elastic pieces of the contact pin are arranged on opposite sides of a center line passing through the center of the solder ball and extending along the displacement direction of the elastic piece as a boundary in plan view. The socket for electrical parts according to claim 1 or 2, wherein the socket is for electrical parts. 4. The contact pin is arranged such that when a pair of elastic pieces are opened, a contact portion of one elastic piece passes the contact portion of the other elastic piece of an adjacent contact pin. The socket for electrical parts according to any one of claims 1 to 3, which is characterized in that.