JP2003304052A - Method and device for removing moisture from substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that moisture is hardly removed surely from minute sections and holes of a substrate having a complicated shape. <P>SOLUTION: A moisture removing device is constituted to remove moisture adhering to a substrate by vibrating the moisture by blowing oscillating compressed air (oscillating compressed dry air) upon the substrate. In order to remove the moisture, the moisture removing device is provided with a compressed air generator, a blowing-out jig for blowing out the compressed air generated by means of the generator, and a vibrating apparatus which vibrates the compressed air blown out from the blowing-out jig at a prescribed frequency by vibrating the jig. The device is also provided with an oscillating compressed air generating section having an oscillator which outputs electric signals for driving the vibrating apparatus at the prescribed frequency. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention can remove moisture adhering to various substrates such as a printed circuit board and a laminated substrate, especially moisture adhering to holes in the substrate and fine dust adhering to the substrate. The present invention relates to a water removal method that can be removed and a water removal apparatus used for the method.

[0002]

2. Description of the Related Art A printed circuit board produced is usually washed (washed) with water, and then dried to remove water. In the past, it was general to remove the water by hot air drying as shown in FIG. 7 or spin as shown in FIG. The hot air drying of FIG. 7 is to dry the printed board A conveyed by the conveyor D with dry hot air of 40 to 100 ° C. to evaporate the water adhering to the board A. The printed circuit board A is set on a rotating plate C which rotates at high speed and rotated at high speed, and water adhering to the printed circuit board A is blown off by centrifugal force.

In the hot air drying of FIG. 7, there is a problem that water stains remain after the water is dried. In the water removal by spin in FIG. 8, as shown in FIGS. 9A and 9B, the water adhering to the insides of the holes B of the printed circuit board A and the concavo-convex portion is hardly splashed, and it is difficult to completely remove the water. There was a problem. In addition, it is difficult to remove fine dust adhering to the inside of the holes of the printed circuit board by these methods. Furthermore, since the printed circuit board A must be set on the rotating plate C, it was not possible to remove water as part of the flow work.

The present inventor has developed a water removing device as shown in FIG. 6 in order to solve the above problems. This is the drying room 2
3, the carrier 21 that carries the printed circuit board 22 and passes through the drying chamber 23, and the printed circuit board 22 carried by the carrier 21 is applied with a sound wave of 20 kHz to 100 kHz to adhere to the surface of the printed circuit board 22. And a speaker 24 that vibrates and removes the existing water.

Although the invention of FIG. 6 has no particular drawback, it is desired to develop a method and apparatus for removing water capable of removing water more efficiently.

[0005]

SUMMARY OF THE INVENTION In order to meet the above demands, the present invention provides a water removing method and a water removing apparatus which can remove the water on a substrate reliably and efficiently in a short time.

In the method of removing moisture from a substrate according to claim 1 of the present application, the wave compressed air obtained by vibrating the compressed air at a predetermined frequency is applied to the substrate being conveyed by the carrier from above and below the substrate.
Alternatively, it is a method of spraying the moisture from above in the moisture removing portion and vibrating the moisture adhering to the substrate to remove the moisture.

According to a second aspect of the present invention, in the method of removing moisture of a substrate according to the first aspect of the present invention, the wave compressed air is jetted from the jetting jig, and the jetting jig is set in the carrying direction of the carrier. This is a method of reciprocating in the direction of intersecting and blowing the wave compressed air over a wide area of the substrate.

A method for removing water from a substrate according to claim 3 of the present application is the method for removing moisture from a substrate according to claim 1 or 2, wherein the inside of the moisture removing portion is dehumidified.

According to a fourth aspect of the present invention, there is provided a method of removing moisture from a substrate according to any one of the first to third aspects, wherein the substrate, which has been moisture-removed with wave compressed air, is heated by infrared rays. This is a method of removing water from the substrate.

The method for removing water from a substrate according to claim 5 of the present application is the method for removing water from a substrate according to any one of claims 1 to 4, wherein the substrate from which water is removed by wave compressed air is cluster water. The method is characterized by being washed and then drained.

According to a sixth aspect of the present invention, there is provided a substrate water removing apparatus which generates a wave carrier compressed air to be blown onto a carrier for carrying the substrate and a substrate being carried by the carrier from above and / or below. And a wave compressed air generating section
The wave compressed air generator is a compressed air generator, a jetting jig for jetting compressed air generated from the generator, and a vibrating device for vibrating the jetting jig to vibrate the compressed air jetted from the jetting jig at a predetermined frequency. And an oscillator that outputs an electric signal for driving the vibrating device at a predetermined frequency.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a water removing method and a water removing apparatus of the present invention will be described with reference to the drawings. The water removal method of the present invention can be carried out in a work line as shown in FIG. The work line shown in FIG. 1 is a carrier 1 capable of carrying various substrates 2 such as a printed circuit board and a laminated substrate.
And a cleaning unit 3 for cleaning the substrate 2 on the carrier 1 sequentially on the carrier path of the carrier 1 from the front to the rear in the carrier direction, and the moisture adhering to the cleaned substrate 2 on the carrier. 1. Draining portion 4 for draining water on 1, drainage portion 5 for removing moisture adhering to the surface (including inside the hole) of drained substrate 2, for drying substrate 2 after moisture removal The drying unit 6 is provided. In this work line,
While the substrate 2 is being transported by the transporting body 1, various operations such as the cleaning, draining, removing water and drying can be continuously performed.

The carrier 1 is a roller conveyor,
Various conveyors such as a belt conveyor can be used. In the case of a roller conveyor, it is possible to clean and remove water from the gap between adjacent rollers, but in the case of a belt conveyor, the cleaning liquid from below is normally blocked and cannot pass through, so it is necessary to prevent water from being blocked. Holes for water,
It has a mouth and a groove. The transport speed of the carrier 1 can be set to any speed suitable for removing moisture,
When it is about m, the water removal is surely performed and the transportation efficiency is improved.

The substrate 2 carried by the carrier 1 of FIG.
Is first carried into the cleaning unit 3, and ultrasonic bubble cleaning is performed in the cleaning unit 3. Here, the ultrasonic bubble cleaning is an existing cleaning method in which the cleaning liquid is vibrated by ultrasonic waves to clean the substrate. In this ultrasonic bubble cleaning, cluster water is used as cleaning water, ultrasonic waves are applied to the cluster water from an ultrasonic bubble nozzle, and the substrate 2 is cleaned with the ultrasonic bubble cluster water. By cleaning the substrate 2 by this cleaning method, it is possible to clean the dirt in the fine holes of the substrate 2. The use of cluster water for cleaning weakens the surface tension of the water, making it difficult for water to adhere to the inside of the hole and facilitating removal of water from the hole.

The substrate 2 that has been cleaned by the cleaning unit 3 is the carrier 1.
It is carried into the water draining section 4. In the water draining section 4, most of the water adhering to the substrate 2 is blown off and removed by the high pressure air ejected from the air cutter 15. A plurality of air cutters 15 may be installed at intervals in the transport direction of the transport body 1. The wind speed of the high-pressure air ejected from the air cutter 15 can be arbitrarily selected, but is 10 per second.
If it is about m, water will be easily removed. Draining can also be done by other methods. Instead of the air cutter 15, another material such as a water absorption roll may be used, which is rotated while being in contact with the substrate 2 to absorb water and drain water.

The substrate 2 which has been drained by the draining section 4 is shown in FIG.
As shown in FIG. 3, the carrier 1 carries the water into the water removing section 5. The moisture removing section 5 of FIG. 2 has a moisture removing chamber 17 having a carry-in port 7 for carrying in the substrate 2 that has been drained by the carrier 1, and a carry-out port 8 for carrying out the substrate 2 after moisture removal by the carrier 1. Two or more jetting jigs 9 and a dehumidifier 10 for jetting wave compressed air are provided therein. If the suction port of the dehumidifier 10 is in the moisture removing chamber 17, the dehumidifier 10 itself can be installed outside the moisture removing chamber 17.

The two or more jetting jigs 9 are attached to a nozzle mounting block 16 as shown in FIG. 3, and compressed air (compressed dry air) sent from a compressor (compressed air generator) 12 is used for the nozzles. When the compressed air is supplied to the mounting block 16, the compressed air is supplied to each of the ejection jigs 9.
And is jetted from each jetting jig 9. In FIG. 3, an air nozzle is used for the ejection jig 9. The nozzle mounting block 16 is connected to a piston rod of a vibrating device such as the air cylinder 14, and is reciprocally moved by the piston rod in a predetermined cycle in the direction of arrow aa ′ in FIG. 4 (intersecting the conveying direction of the carrier 1). Direction)
It reciprocates to. Specifically, the oscillator 1
The electromagnetic signal of the piston of the air cylinder 14 is opened / closed by the oscillation signal (electrical signal) output from No. 3, and the piston rod of the air cylinder 14 is reciprocated at the frequency of the oscillation signal. 4 is reciprocated in the direction of arrow aa ′ in FIG. 4 to vibrate the dry air jetted from each jetting jig 9, and the compressed air jetted from each jetting jig 9 is oscillated at the oscillation frequency. It is vibrated by and becomes wave compressed air (wave compressed dry air) of that frequency. By changing the oscillation frequency of the oscillator 13, the reciprocating frequency of the nozzle mounting block 16 can be changed, and the wave (frequency) of the wave compressed air can be changed.

As described above, the wave-compressed air is jetted from the jetting jig 9 and blown onto the substrate 2, as shown in FIG.
As shown in (b), the water remaining on the surface of the substrate 2, through holes (through holes), non-through holes, concave portions, etc. is vibrated and removed. Wave The frequency (frequency) of compressed air is 1
About 10 Hz to 10 Hz is suitable, and about 7.83 Hz is effective for removing water. It is desirable to use a plurality of jetting jigs 9 and arrange them in a staggered arrangement as shown in FIG. 4 so that the waved compressed air is jetted from the jetting jig 9 in a wide range. An air cutter can be used instead of the air nozzle. The distance between the ejection port of the ejection jig 9 such as an air nozzle or an air cutter and the substrate 2 can be arbitrarily selected, but it is effective to remove water from the substrate 2 by setting it to about 2 mm to 8 mm. The jetting jig 9 can be installed only above or below the carrier, or both above and below the carrier. When the hole of the substrate is a through hole, wave compressed air is jetted from both upper and lower jetting jigs 9 and blows onto the substrate. When the hole of the substrate 2 is an upward non-through hole, a concave portion or the like, the upper jetting jig 9 is formed. Moisture can be surely removed by ejecting wave-compressed air from the nozzle and spraying it onto the substrate. Board 2
When the substrate 2 is placed on the carrier 1 with the holes facing downward, the water can be reliably removed by ejecting the wave-compressed air from below and blowing it onto the substrate. Moisture removal chamber 17
The inside is dehumidified by recovering moisture by the dehumidifier 10 so that the humidity can be maintained at a low humidity of 20% to 50%.

The substrate 2 which has completed the removal of the moisture in the moisture removing section 5.
Is carried by the carrier 1 from the moisture removing section 5 to the heating / drying section 6 shown in FIG. The substrate 2 is heated and dried in the heating and drying unit 6. An infrared heater 1 such as a far-infrared heater or a near-infrared heater installed on the conveyance path in the heating / drying section 6
It is heated by 8 and dried. The substrate 2 after heating and drying is cooled by the cooling fan 19 installed on the transport path and returned to the room temperature state. As a result, the temperature of the substrate 2 can be quickly brought close to the room temperature, and the substrate 2 can be touched immediately after the completion of drying, so that the subsequent work can be performed quickly and the work efficiency is improved. The step of heating and drying with the infrared heater 18 may be omitted.

[0020]

The method of removing water according to claim 1 of the present application has the following effects. (1) Since wave-compressed air (wave-compressed dry air) is blown onto the substrate to vibrate the water adhering to the substrate, the water adhering to the holes or recesses of the substrate is surely removed.
Further, not only moisture but also fine powder and dust adhering to the substrate are removed. (2) Since the moisture is removed by blowing the waved compressed air instead of heat, the moisture can be safely removed even by a substrate that is weak against heat. Further, since the work is performed in a room temperature environment, the work is easy. Further, when water is removed by heat, water marks remain as stains on the substrate surface, but this does not occur in the present invention. (3) Since water is removed while the substrate is being transported by the transport body, it is possible to perform the work from cleaning to drying in a linked operation. Further, the line for carrying out the present invention can be incorporated as a part of another manufacturing line or other system.

In the method of removing moisture of a substrate according to claim 2 of the present application, the jetting jig for jetting the waved compressed air is reciprocated in a direction intersecting the conveying direction of the conveyer so that the waved compressed air is spread over a wide area of the substrate. Since it is blown, the wave compressed air can be blown to a wide range of the substrate with one jetting jig, and the moisture removal efficiency is improved.

In the method of removing moisture from the substrate according to claim 3 of the present application, the moisture in the moisture removing section is dehumidified, so that the moisture in the moisture removing section is reduced, and the moisture is efficiently removed from the substrate.

In the method for removing moisture from a substrate according to claim 4 of the present application, since the substrate from which moisture has been removed by wave compressed air is heated by infrared rays, it is possible to reliably remove the moisture that cannot be completely removed from the substrate.

In the method of removing moisture from a substrate according to claim 5 of the present application, since the substrate to be moisture-removed by the wave compressed air is washed with cluster water, the surface tension of the moisture is weak and the moisture adhering to the substrate is weakened. Especially, the water remaining in the holes can be easily removed. Furthermore, by reducing the surface tension,
It can also accelerate the drying speed of water. Also, by using cluster water or activated water, there is almost no adverse effect on the natural environment even if drained after use.

In the apparatus for removing moisture of a substrate according to claim 6 of the present application, since the undulating compressed air generating section includes a compressed air generator, a vibrating device, and an oscillator, the apparatus removes a wave (frequency) suitable for removing moisture. Wave-compressed air can be generated and blown onto the substrate, and efficient water removal of the substrate can be realized.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing an example of an embodiment of a process for carrying out the water removal method of the present invention.

FIG. 2 is an explanatory diagram showing a configuration of a moisture removing unit which blows wave compressed air.

FIG. 3 is an explanatory diagram showing a configuration of a mechanism for applying a wave to and blowing the compressed air in the moisture removing unit.

FIG. 4 is a plan view showing how wave compressed air is blown to the substrate in the moisture removing unit.

5A and 5B are explanatory views showing a state of water removal according to the present invention.

FIG. 6 is a schematic view showing an example of a conventional water removal method.

FIG. 7 is a schematic view showing another example of a conventional water removal method.

FIG. 8 is a schematic view showing another example of a conventional water removal method.

9A and 9B are explanatory views showing problems in the conventional water removal method.

[Explanation of symbols]

1 carrier 2 substrates 3 cleaning section 4 Drainer 5 Moisture removal section 6 Drying section 7 entrance 8 exits 9 Spouting jig 10 Dehumidifier 11 pumps 12 compressor 13 oscillators 14 Air cylinder 15 Air cutter 16 nozzle mounting block 17 Moisture removal chamber 18 infrared heater 19 Cooling fan

Claims (6)

[Claims] 1. A wave-compressed air obtained by vibrating compressed air at a predetermined frequency is sprayed onto a substrate being conveyed by a carrier from above and below, or from above in a moisture removing section, and adheres to the substrate. A method of removing water from a substrate, which comprises removing water by vibrating the water. 2. The method for removing water from a substrate according to claim 1, wherein wave compressed air is ejected from the ejection jig, and the ejection jig is reciprocated in a direction intersecting the conveyance direction of the carrier to widen the substrate. A method for removing moisture from a substrate, which comprises spraying wave-compressed air onto the area. 3. A method for removing moisture from a substrate according to claim 1 or 2, wherein the moisture removing section is dehumidified. 4. The method for removing moisture from a substrate according to claim 1, wherein the substrate from which moisture has been removed by wave compressed air is heated by infrared rays to remove moisture from the substrate. Method for removing water from a substrate. 5. The method for removing moisture from a substrate according to claim 1, wherein the substrate to be moisture-removed with wave compressed air is washed with cluster water and then drained. A method for removing water from a substrate, comprising: 6. A wave compression apparatus comprising: a carrier for transferring a substrate; and a wave-compressed air generating section for generating wave-compressed air blown onto the substrate being transferred by the carrier from above and / or below. The air generator is a compressed air generator, a jetting jig for jetting compressed air generated from the generator, a vibrating device for vibrating the jetting jig to vibrate the compressed air jetted from the jetting jig at a predetermined frequency, A water removing device comprising an oscillator that outputs an electric signal for driving a vibrating device at a predetermined frequency.