JP2003203965A - Detection method for supporting position of substrate- supporting pin, detecting method for its inclination, and teaching device and teaching jig therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To teach a supporting position of a substrate-supporting pin to a transport arm by automatically detecting it, and to detect inclination of the supporting position. <P>SOLUTION: A composite plate, in which a center disc 6 can be separated relatively upward from a doughnut-shaped plate 7 surrounding it, is prepared as a teaching jig 5. The doughnut-shaped plate 7 is provided with optical sensors 8 and 9 that detect the presence of the center disc 6. A transfer arm 28 holds a peripheral part of the teaching jig 5 to transfer it to the upper part of a mounting pedestal. The transfer arm 28 and a supporting pin 80 are relatively moved, to mount the disc 6 on the supporting pin 80. Further, the disc 6 is moved for the optical sensors 8 and 9 by an amount which exceeds the thickness of the disc. Based on the change in the output signal of the optical sensors 8 and 9 at this time, the supporting positions and the inclinations of three supporting pins 80 are detected. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention receives a thin plate-like substrate (hereinafter simply referred to as a substrate) such as a semiconductor wafer or a glass substrate for liquid crystal from a transfer arm by a plurality of support pins on a mounting table such as a heat treatment apparatus. The present invention relates to a method for detecting a support position of a substrate support pin, a method for detecting the inclination of the board support pin, a teaching device therefor, and a teaching jig.

[0002]

2. Description of the Related Art Generally, in a manufacturing process of a semiconductor wafer, a photolithography technique is used to form a resist pattern on the surface of a substrate such as a semiconductor wafer or an LCD substrate. This photolithography technology includes a resist coating step of coating a resist solution on the surface of a substrate, an exposure processing step of exposing a circuit pattern on the formed resist film, and a development processing step of supplying a developing solution to the substrate after the exposure processing. And have.

Further, between the above processing steps, for example, between the resist coating step and the exposure processing step, the residual solvent in the resist film is evaporated to improve the adhesion between the substrate and the resist film. Heat treatment (prebake)
Or a heat treatment (post-exposure) performed between the exposure processing step and the development processing step to prevent the occurrence of fringes or to induce an acid-catalyzed reaction in a chemically amplified resist (CAR). Baking (PEB) or a heat treatment (post-treatment) that is performed after the development processing step to remove the residual solvent in the resist and the rinse solution taken into the resist during development, and improve the penetration during wet etching. Bake)
Etc., various heat treatments are performed.

As a heat treatment apparatus used for heat treatment, as shown in FIGS.
A mounting table 25 which has a semiconductor wafer W as a substrate to be processed and which can be heated to a predetermined temperature; a gap pin 70 which supports the wafer W with a slight gap to the mounting table 25 during the heating process; A plurality of support pins 80, e.g., three support pins 80 that can move up and down through concentric circles of the mounting table 25, for example, through support pin guide through-holes provided at three equal intervals, and here, the wafer W is the support pin tip. The support pin 8 which is supported on the mounting table 25 and, more precisely, is transferred onto the gap pin 70.
Those having 0 and 0 are used.

The substrate transfer device in this heat treatment apparatus is
The periphery of the substrate to be processed (wafer W) is held by the arm of the substrate transfer mechanism 21, that is, the transfer arm 28, and the substrate is placed on the mounting table 2.
5, the substrate is placed on, for example, three support pins 80 that can move up and down and penetrates the mounting table 25, the transport arm 28 is returned to the outside of the mounting table 25, and then the support pins 80 are lowered. The substrate is mounted on the mounting table 25.

In this substrate transfer apparatus, for example, the transfer arm 28 based on the height position when the tip ends of the three support pins 80 contact the substrate, that is, the support position of the substrate of the support pins 80 is used as the substrate transfer device. It is necessary not to interfere in the delivery process. If the substrate support position is not clear, for example, the transfer arm 28 is lowered to support pins 80.
In the case of the type of transferring the substrate to the substrate, the lower limit for lowering the transfer arm 28, that is, the timing for returning the transfer arm 28 becomes improper, and the transfer arm 28 in a state where the substrate is placed
Will be returned. Further, in the case of the type in which the support pin 80 is raised and the substrate is transferred to the support pin 80,
The upper limit of raising the support pin 80, that is, the transfer arm 28
The timing of returning the wafer is inappropriate, and the carrier arm 28 on which the substrate is placed is returned.

For this reason, conventionally, an operator performs a teaching (transport teaching) operation on the substrate transport apparatus before actually transporting the substrate. Specifically, the operator measures the gap between the tip ends of the three support pins 80 and the back surface of the substrate mounted on the transfer arm 28 with a gauge, and the gap has a predetermined width, for example, 1.5 mm.
The position of the transfer arm 28 is adjusted so that the position becomes, and the position is manually taught to the transfer arm 28.

[0008]

However, the method of teaching the transfer arm 28 by measuring with a gauge requires delicate and high precision, which makes it difficult for humans to work and also poses a safety problem. there were. Therefore, it is desired to provide a method capable of automatically detecting the support position of the substrate support pin and teaching the transfer arm.

Further, in the above-described substrate transfer apparatus, the tips of the three support pins 80 are at the same height, that is, the tips of the support pins 80 are positioned so as to contact the same horizontal surface of the substrate. Are required to be even. If the height positions of the tips of the respective support pins 80 are not aligned, the substrate tilts when it is placed, so that when the substrate is transferred to the transport arm 28, displacement and dropout due to contact with the transport arm 28 occur. This is because a transport error will occur. Therefore, it is desired to provide a method of detecting the inclination of the support position of the substrate support pin on the assumption that the substrate is supported horizontally.

Therefore, an object of the present invention is to solve the above problems, to provide a technique for automatically detecting the support position of a substrate support pin and teaching the transfer arm, and further to provide a technique for supporting the support position of the substrate support pin. It is to provide a technique for detecting a tilt.

[0011]

In order to achieve the above object, the first method of detecting the support position of a substrate support pin according to the present invention conveys a substrate above a mounting table while holding a peripheral portion by a conveyance arm. Then, the substrate is placed on a plurality of vertically movable support pins that pass through the mounting table, and the transfer arm is returned to the outside of the mounting table, while the supporting pins are lowered to place the substrate on the mounting table. A composite plate of the same size as the above-mentioned substrate, in which the first circular plate in the central part is relatively upwardly separable with respect to the surrounding donut-shaped second circular plate, is prepared as a jig. The second disc is provided with a detecting means capable of detecting the presence or absence of the first disc in the central part, and the peripheral part of the composite plate is held by the transfer arm and transferred above the mounting table to support the transfer arm. By moving the pins relative to each other so that the first circular plate in the central portion of the composite plate is moved to the plurality of support pins. And the relative movement of the carrier arm and the support pin to move the first circular plate with respect to the detecting means by at least an amount exceeding the thickness thereof, and from the change in the output signal of the detecting means at this time, The support positions of the plurality of support pins are detected (Claim 1).

In this case, as the detecting means, it is preferable to use two sets of transmissive optical sensors whose optical axes run in the hole at the center of the second disk in a direction substantially orthogonal to each other (claim 2). Further, the support positions of the plurality of support pins are preferably determined with reference to the surface of the composite plate, taking into consideration the difference between the position of the detection means and the surface position of the second disc (claim) 3).

Furthermore, when a pulse width longer than a permissible value than the pulse width corresponding to the thickness of the first disc is detected by receiving the output signal of the detecting means, the tip ends of the plurality of support pins are detected. By determining that there is an inclination, a method for detecting an inclination of the support position of the substrate support pin can be constructed (claim 4).

A second substrate support pin support position detecting method according to the present invention conveys a substrate above a mounting table while holding a peripheral portion by a transfer arm, and raises and lowers a plurality of support pins penetrating the mounting table. In a substrate transfer device that places a substrate on top of it and returns the transfer arm to the outside of the mounting table while lowering the support pins to place the substrate on the mounting table, the first circle in the center that can emit light in the side direction Prepare a jig as a composite plate of the same size as the above-mentioned substrate, which is relatively upwardly separable from the surrounding donut-shaped second disc. The detection means capable of detecting the light emitted from the side surface of the first disk is provided, and the peripheral portion of the composite plate is held by the transfer arm and transferred above the mounting table, and the transfer arm and the support pin are relatively moved. Then, the first circular plate at the center of the composite plate is placed on the plurality of support pins, By relatively moving the feed arm and the support pin, the first disc is moved with respect to the detection means by at least an amount exceeding the thickness thereof, and from the change of the output signal of the detection means at this time, the plurality of the plurality of discs are detected. The support position of the support pin is detected (Claim 5).

A third substrate support pin support position detecting method of the present invention conveys a substrate above a mounting table while holding a peripheral portion by a transfer arm, and raises and lowers a plurality of supporting pins penetrating the mounting table. In the substrate transfer device in which the substrate is placed on the top and the transfer arm is returned to the outside of the mounting table, and the supporting pins are lowered to place the substrate on the mounting table, the first circular plate in the central portion has a donut shape around it. As a jig, prepare a composite plate of the same size as the above-mentioned substrate that can be separated upward relative to the second disc, and at that time, detect the posture of the first disc on the second disc. A possible state detecting means is provided, the peripheral portion of the composite plate is held by the transfer arm and is transferred above the mounting table, the transfer arm and the support pin are relatively moved, and the first circle of the central part of the composite plate is moved. Place the plate on the above-mentioned plurality of support pins, and move the transfer arm and the support pin relatively. , The first disc is moved with respect to the state detecting means by an amount exceeding at least the thickness thereof, and the support positions of the plurality of support pins are detected from the change of the output signal of the state detecting means at this time. It is characterized in that (claim 6).

In this case, as the first circular plate, the one whose side has a color lightness different from that of the upper surface and the lower surface is prepared, and the state detecting means uses the side lightness of the side surface of the first circular plate. When the boundary between the side surface and the upper surface or the lower surface is detected due to the difference in the color brightness of the upper surface or the lower surface, it is determined that the tips of the plurality of supporting pins are inclined, and thus the supporting position of the substrate supporting pin is determined. It is possible to construct a method for detecting the inclination of (claim 7).

A support position teaching device for a first substrate support pin according to the present invention embodies a first support position detection method. A support arm holds a peripheral portion to transfer a substrate above a mounting table. Then, the substrate is placed on and supported by a plurality of vertically movable support pins that pass through the mounting table, and the transfer arm is returned to the outside of the mounting table, while the supporting pins are lowered to place the substrate on the mounting table. Assuming a device for teaching the support position of the support pin of the device, a first disc that can be placed on the support pin and a donut-shaped disc that is the same size as the substrate that can be held by the transfer arm. A second disk having an insertion hole for accommodating and supporting the first disk, a detection means provided on the second disk and capable of detecting the presence or absence of the first disk, and the detection means Output due to the relative movement of the first and second discs when receiving the output signal From a change in the items, detecting the support position of said plurality of support pins, characterized by comprising a control means for teaching the position to the transport arm (claim 8).

In this case, as the detecting means, it is preferable to provide two sets of optical sensors whose optical axes run in the holes of the second disk in a substantially orthogonal direction (claim 9). Further, the detection means is provided on the surface of the second disk, the control means, with the surface of the first disk as a reference, the difference between the position of the detection means and the surface position of the first disk. In consideration of the above, it is preferable to have a function of determining the support positions of the plurality of support pins (claim 10).

The second substrate support pin teaching device for supporting position according to the present invention embodies the second supporting position detecting method, in which the substrate is conveyed above the mounting table while the peripheral portion is held by the conveying arm. Then, the substrate is placed on and supported by a plurality of vertically movable support pins that pass through the mounting table, and the transfer arm is returned to the outside of the mounting table, while the supporting pins are lowered to place the substrate on the mounting table. Based on a device for teaching a support position of a support pin of the device, it is possible to emit light in a lateral direction by a light emitting element, and a first disk mountable on the support pin and the substrate which can be held by the transfer arm. A doughnut-shaped disc having the same size as that of the second disc having an insertion hole for accommodating and supporting the first disc, and the first disc provided on the second disc. Detecting means capable of detecting light emitted from the side surface of the Receiving the output signal of the step, the support position of the plurality of support pins is detected from the change of the output signal due to the relative movement of the first disk and the second disk, and the position is taught to the transfer arm. And a control means (claim 11).

A third substrate support pin support position teaching device according to the present invention embodies a third support position detection method, in which a peripheral portion is held by a transfer arm and a substrate is transferred above a mounting table. Then, the substrate is placed on and supported by a plurality of vertically movable support pins that pass through the mounting table, and the transfer arm is returned to the outside of the mounting table, while the supporting pins are lowered to place the substrate on the mounting table. Assuming a device for teaching the support position of the support pin of the device, a first disc that can be placed on the support pin and a donut-shaped disc that is the same size as the substrate that can be held by the transfer arm. A second disc having an insertion hole for accommodating and supporting the first disc, and a state detecting means provided on the second disc and capable of detecting the posture of the first disc,
The support position of the plurality of support pins is detected from the change in the output signal due to the relative movement of the first disk and the second disk upon receiving the output signal of the state detection means, and the position of the support arm is detected by the position. And a control means for teaching the above (claim 12).

In this case, the first circular plate is formed so that the lightness of the color on the side surface is different from the lightness of the color on the upper surface and the lower surface, and the state detecting means is provided on the side surface of the first disk. Depending on the difference between the lightness of the color and the lightness of the color on the top or bottom,
It is preferable to form the boundary between the side surface and the upper surface or the lower surface in a detectable manner (claim 13).

A jig for supporting position teaching of a first substrate supporting pin according to the present invention conveys a substrate above a mounting table while holding a peripheral portion by a transfer arm, and a plurality of vertically movable penetrating the mounting table. When teaching a support position of a support pin in a substrate transfer device in which a substrate is placed and supported on a support pin and the transfer arm is returned to the outside of the mounting table while the support pin is lowered to place the substrate on the mounting table Assuming that the jig used for the above is a first disk that can be mounted on the support pin, and a donut-shaped disk that is approximately the same size as the substrate that can be held by the transfer arm, A second disc having an insertion hole for accommodating and supporting the one disc; and a detection means provided on the second disc and capable of detecting the presence or absence of the first disc. (Claim 14).

In this case, it is preferable to provide, as the detecting means, two sets of optical sensors whose optical axes run in the holes of the second disk in a substantially orthogonal direction (claim 15).

The jig for teaching the supporting position of the second substrate support pin according to the present invention conveys the substrate above the mounting table while holding the peripheral portion by the transfer arm, and a plurality of vertically movable penetrating the mounting table. When teaching a support position of a support pin in a substrate transfer device in which a substrate is placed and supported on a support pin and the transfer arm is returned to the outside of the mounting table while the support pin is lowered to place the substrate on the mounting table Assuming that the jig used for the above, it is possible to emit light in the side direction by the light emitting element, and to the same extent as the first disk that can be mounted on the support pin and the substrate that can be held by the transfer arm. A donut-shaped disk of a size, a second disk having an insertion hole for accommodating and supporting the first disk, and a light provided from the side surface of the first disk provided on the second disk. And a detection unit capable of detecting the emitted light. To (claim 16).

A third jig for teaching the supporting position of a substrate supporting pin according to the present invention conveys a substrate above a mounting table while holding a peripheral portion by a transfer arm, and moves up and down through the mounting table. When teaching a support position of a support pin in a substrate transfer device in which a substrate is placed and supported on a support pin and the transfer arm is returned to the outside of the mounting table while the support pin is lowered to place the substrate on the mounting table Assuming that the jig used for the above is a first disk that can be mounted on the support pin, and a donut-shaped disk that is approximately the same size as the substrate that can be held by the transfer arm, A second disc having an insertion hole for accommodating and supporting the one disc; and a state detecting means provided on the second disc and capable of detecting the posture of the first disc. (Claim 17).

In this case, the first disc is formed so that the lightness of the color on the side surface is different from the lightness of the color on the upper surface and the lower surface, and the state detecting means is provided on the side surface of the first disk. Depending on the difference between the lightness of the color and the lightness of the color on the top or bottom,
It is preferable that the boundary between the side surface and the upper surface or the lower surface is formed so that it can be detected.

Claims 1, 2, 3, 8, 9, 10, 14,
According to the invention described in 15, the position of the first circular plate in the central portion of the composite plate serving as the teaching jig is directly known from the change in the detection signal, and the supporting position of the substrate supporting pin is automatically detected indirectly. Can be detected and the transfer arm can be instructed.

According to the invention described in claims 4, 8, 9, 14 and 15, it is possible to know the inclination of the first circular plate in the central portion of the composite plate as the teaching jig directly from the change of the detection signal. The inclination of the support position of the substrate support pin can be indirectly detected automatically.

According to the present invention, the light emitted from the side surface of the first disk is detected by the detecting means provided on the second disk, so that the light can be reliably detected. Then, the position of the first circular plate in the center of the composite plate, which is the teaching jig, is directly known from the change in the detection signal, and indirectly, the supporting position of the substrate supporting pin is automatically detected, and the transfer arm is detected. Can be taught.

According to the present invention as defined in claims 6, 12 and 17, the position of the first disc is surely detected by the state detecting means, and the composite plate as a teaching jig is directly detected from the change of the detection signal. It is possible to know the position of the first circular plate in the central part of the table, automatically detect the supporting position of the substrate supporting pin indirectly, and teach it to the transfer arm.

According to the seventh, thirteenth and eighteenth aspects of the present invention, the state detecting means can detect the side surface and the upper surface or the lower surface of the first disk by the brightness of the color. It is possible to directly know the inclination of the first circular plate in the central portion of the composite plate which is the teaching jig, and indirectly indirectly detect the inclination of the support position of the substrate support pin.

[0032]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. In this embodiment, a substrate transfer device in a heat treatment device (hot plate unit) that heats a semiconductor wafer as a substrate will be described as an example.

FIG. 17 is a schematic plan view of an embodiment of the resist solution coating / developing system, FIG. 18 is a front view of FIG. 17, and FIG. 19 is a rear view of FIG.

In the above processing system, a plurality of semiconductor wafers W (hereinafter referred to as wafers W) as objects to be processed (hereinafter referred to as wafers W) are transferred into or out of the system from the outside in units of a plurality of wafer cassettes, for example, 25 wafers. A cassette station 10 (conveying unit) for unloading and loading the wafer W into and from the cassette 1, and various single-wafer processing units for performing a predetermined process on the wafer W one by one in the coating and developing process. An interface for transferring a wafer W between a processing station 20 including the processing apparatus of the present invention arranged in multiple stages at predetermined positions and an exposure apparatus (not shown) provided adjacent to the processing station 20. The main part is constituted by the face part 30.

The cassette station 10 is shown in FIG.
As shown in FIG. 2, a plurality of wafer cassettes 1, for example, up to four wafer cassettes 1 are provided at the positions of the projections 3 on the cassette mounting table 2 with the respective wafer entrances / outlets directed toward the processing station 20 side in a horizontal X direction.
The wafer transfer tweezers 4 that are placed in a row along the direction and are movable in the cassette arrangement direction (X direction) and in the wafer arrangement direction (Z direction) of the wafers W accommodated in the wafer cassette 1 along the vertical direction. Are configured to be selectively transferred to each wafer cassette 1. The wafer transfer tweezers 4 is configured to be rotatable in the θ direction, and is included in the alignment unit (ALI) belonging to the multi-stage unit section of the third set G3 on the processing station 20 side described later.
M) and the extension unit (EXT).

As shown in FIG. 17, the processing station 20 is provided with a vertical transfer type main wafer transfer mechanism (substrate transfer mechanism, substrate transfer device) 21 at the center thereof, and accommodates this main wafer transfer mechanism 21. All the processing units are arranged around the chamber 22 in multiple stages in one set or in a plurality of sets. In this example, 5 sets G1, G2, G3, G4 and G
5 is a multi-stage arrangement configuration of the first and second sets G1 and G2.
The multi-stage unit is the front of the system (front side in Fig. 17)
Side-by-side, the multistage unit of the third set G3 is arranged adjacent to the cassette station 10, the multistage unit of the fourth set G4 is arranged adjacent to the interface portion 30, and the fifth set G5. The multi-stage unit of is arranged on the back side.

In this case, as shown in FIG. 18, in the first group G1, two spinner type processings are performed in which the wafer W is placed on the spin chuck (not shown) in the cup 23 and a predetermined processing is performed. Unit eg resist coating unit (COT)
And a developing unit for developing the resist pattern (DE
V) are vertically stacked in two stages from the bottom. Similarly, in the second group G2, two spinner type processing units, for example, a resist coating unit (COT) and a developing unit (DEV) are stacked in two stages in order from the bottom in the vertical direction. The reason for arranging the resist coating unit (COT) on the lower side in this way is that draining of the resist solution is troublesome both mechanically and in terms of maintenance. However, it is also possible to arrange the resist coating unit (COT) on the upper stage if necessary.

As shown in FIG. 19, in the third set G3,
An oven-type processing unit that mounts the wafer W on the wafer mounting table 24 to perform a predetermined process, such as a cooling unit (COL) that cools the wafer W, an adhesion unit (AD) that performs a hydrophobic process on the wafer W, An alignment unit (ALIM) for aligning the wafer W and an extension unit (EX for loading / unloading the wafer W).
T), four hot plate units (HP) for baking the wafer W are sequentially stacked from the bottom in the vertical direction in eight stages, for example. Similarly, the fourth set G4 is also an oven type processing unit such as a cooling unit (COL), an extension cooling unit (EXTCOL), an extension unit (EXT), a cooling unit (COL), and two chilling hot plate units having a quenching function. (CHP) and two hot plate units (HP) are stacked, for example, in eight stages from the bottom in the vertical direction.

As described above, the cooling unit (COL) having a low processing temperature and the extension cooling unit (EXTCOL) are arranged in the lower stage, and the hot plate unit (HP), the chilling hot plate unit (CHP) and the add unit having a high processing temperature are arranged. By arranging the fusion unit (AD) in the upper stage, it is possible to reduce thermal mutual interference between the units. Of course, it is also possible to make a random multi-stage arrangement.

As shown in FIG. 17, in the processing station 20, the third and fourth groups G3 and G4 adjacent to the multistage unit (spinner type processing unit) of the first and second groups G1 and G2 are arranged. Ducts 65 and 66 are vertically provided in the side wall of the multi-stage unit (oven type processing unit). These ducts 6
Downflow clean air or specially temperature-controlled air is made to flow through the valves 5, 66. With this duct structure, the heat generated in the oven type processing units of the third and fourth groups G3 and G4 is blocked and does not reach the spinner type processing units of the first and second groups G1 and G2. ing.

In addition, in this processing system, the back side of the main wafer transfer mechanism 21 is provided with the fifth wafer as shown by the dotted line in FIG.
The multi-stage unit of the group G5 can be arranged. This multi-stage unit of the fifth set G5 includes guide rails 6
It is possible to move laterally along the line 7 when viewed from the main wafer transfer mechanism 21. Therefore, even when the multi-stage unit of the fifth group G5 is provided, the space is secured by sliding the units, so that the maintenance work can be easily performed from the back of the main wafer transfer mechanism 21.

The interface section 30 has the same dimensions as the processing station 20 in the depth direction,
It is made small in the width direction. A portable pickup cassette 31 and a stationary buffer cassette 32 are arranged in two stages on the front surface of the interface portion 30, a peripheral exposure device 33 is arranged on the rear surface, and a wafer is formed in the central portion. The transfer arm 34 is provided. The transfer arm 34 is configured to move in the X and Z directions and transfer to both cassettes 31 and 32 and the peripheral exposure device 33. Further, the transfer arm 34 is configured to be rotatable in the θ direction, and has a fourth group G4 on the processing station 20 side.
Extension unit (E
XT) and an adjacent wafer delivery table (not shown) on the side of the exposure apparatus.

The processing system configured as described above is
Although it is installed in the clean room 40, the cleanliness of each part is enhanced by an efficient vertical laminar flow system in the system.

Next, the operation of the above processing system will be described.

First, in the cassette station 10, the wafer transfer tweezers 4 access the cassette 1 containing the unprocessed wafer W on the cassette mounting table 2 and take out one wafer W from the cassette 1. .
The wafer transfer tweezers 4 are mounted on the wafer W from the cassette 1.
Is taken out, the third group G3 on the side of the processing station 20
The wafer W is mounted on the wafer mounting table 24 in the unit (ALIM) by moving to the alignment unit (ALIM) arranged in the multi-stage unit. The wafer W is
Orientation flat alignment and centering are performed on the wafer mounting table 24. Then, the main wafer transfer mechanism 21 accesses the alignment unit (ALIM) from the opposite side and receives the wafer W from the wafer mounting table 24.

In the processing station 20, the main wafer transfer mechanism 21 first carries the wafer W into the adhesion unit (AD) belonging to the multistage unit of the third group G3. The wafer W is subjected to a hydrophobizing process in this adhesion unit (AD). When the hydrophobic treatment is completed, the main wafer transfer mechanism 21 carries the wafer W out of the adhesion unit (AD), and then the third group G3 or the fourth group G3.
It is carried into the cooling unit (COL) belonging to the multi-stage unit of the group G4. This cooling unit (CO
In L), the wafer W is cooled to a set temperature before the resist coating process, for example, 23 ° C. When the cooling process is completed, the main wafer transfer mechanism 21 carries the wafer W out of the cooling unit (COL), and then the resist coating unit (C) belonging to the multistage unit of the first group G1 or the second group G2.
OT). This resist coating unit (CO
In T), the wafer W is coated with a resist having a uniform film thickness on the wafer surface by a spin coating method.

When the resist coating process is completed, the main wafer transfer mechanism 21 applies the wafer W to the resist coating unit (C).
OT), then the hot plate unit (H
P). The wafer W is mounted on the mounting table in the hot plate unit (HP) and kept at a predetermined temperature, for example, 10
Prebaking is performed at 0 ° C. for a predetermined time. by this,
The residual solvent can be removed by evaporation from the coating film on the wafer W. When the pre-baking is completed, the main wafer transfer mechanism 2
1, the wafer W is unloaded from the hot plate unit (HP) and then transferred to the extension cooling unit (EXTCOL) belonging to the multi-stage unit of the fourth group G4. In this unit (COL), the wafer W is cooled to a temperature suitable for the next step, that is, the peripheral exposure processing in the peripheral exposure apparatus 33, for example, 24 ° C. After this cooling, the main wafer transfer mechanism 21 transfers the wafer W to the extension unit (EXT) immediately above, and this unit (E
The wafer W is mounted on a mounting table (not shown) in the XT). When the wafer W is mounted on the mounting table of the extension unit (EXT), the interface unit 3
The transfer arm 34 of 0 accesses from the opposite side to receive the wafer W. Then, the transfer arm 34 carries the wafer W into the peripheral exposure apparatus 33 in the interface section 30. Here, the wafer W is exposed to the edge portion.

When the peripheral exposure is completed, the transfer arm 34
Removes the wafer W from the peripheral exposure apparatus 33 and transfers it to a wafer receiving table (not shown) on the adjacent exposure apparatus side.
In this case, the wafer W may be temporarily stored in the buffer cassette 32 before being transferred to the exposure apparatus.

When the entire surface of the wafer is exposed by the exposure apparatus and the wafer W is returned to the wafer receiving table on the exposure apparatus side,
The transfer arm 34 of the face unit 30 accesses the wafer receiving table to receive the wafer W, and carries the received wafer W into the extension unit (EXT) belonging to the multistage unit of the fourth group G4 on the processing station 20 side, Place on a wafer receiving table. Also in this case, the wafer W may be temporarily stored in the buffer cassette 32 in the interface unit 30 before being transferred to the processing station 20 side.

Wafer W placed on the wafer receiving table
Is transferred to the chilling hot plate unit (CHP) by the main wafer transfer mechanism 21 to prevent the generation of fringes, or is chemically amplified resist (CAR).
A post-exposure bake treatment is performed to induce the acid-catalyzed reaction in.

After that, the wafer W is transferred to the developing unit (DE) belonging to the multistage unit of the first group G1 or the second group G2.
V). In this developing unit (DEV), the wafer W is placed on a spin chuck, and the developing solution is evenly applied to the resist on the surface of the wafer W by, for example, a spray method. When the development is completed, the rinse liquid is applied to the surface of the wafer W and the developer is washed off.

When the developing process is completed, the main wafer transfer mechanism 21 carries the wafer W out of the developing unit (DEV), and then the hot plate unit belonging to the multistage unit of the third group G3 or the fourth group G4. Carry in to (HP).
In this unit (HP), the wafer W is post-baked at 100 ° C. for a predetermined time. As a result, the resist swollen by development is cured and chemical resistance is improved.

After the post-baking is completed, the main wafer transfer mechanism 21 transfers the wafer W to the hot plate unit (H
P) and then to any cooling unit (COL). Here, after the wafer W has returned to room temperature, the main wafer transfer mechanism 21 then transfers the wafer W to the extension unit (EXT) belonging to the third set G3. When the wafer W is mounted on the mounting table (not shown) of the extension unit (EXT), the wafer transfer tweezers 4 on the cassette station 10 side is accessed from the opposite side to receive the wafer W. And
The wafer transfer tweezers 4 inserts the received wafer W into a predetermined wafer accommodation groove of the cassette 1 for accommodating the processed wafer on the cassette mounting table, and the processing is completed.

Next, the hot plate unit (HP) will be described with reference to the sectional view of FIG.

The hot plate unit (HP) is provided with a processing chamber 50 for heating the wafer W loaded by the main wafer transfer mechanism 21. In this processing chamber 50, a shutter 51 for shutting off from the outside air is formed. And a mounting table 25 on which the wafer W is mounted, and support pins 80 capable of moving the wafer W up and down on the mounting table 25.

The shutter 51 is movable up and down by the operation of the elevating cylinder 52, and when the shutter 51 rises, the shutter 51 and the stopper 55 hanging from the cover 54 having the exhaust port 53 at the center of the upper part come into contact with each other. Thus, the inside of the processing chamber 50 is configured to be kept airtight. Further, the stopper 55 is provided with an air supply port (not shown), and the air flowing into the processing chamber 50 through the air supply port is exhausted from the exhaust port 53. The air introduced from the air supply port is configured not to directly contact the wafer W in the processing chamber 50, and the wafer W can be heated at a predetermined processing temperature.

The mounting table 25 is formed in a disk shape larger than the wafer W, and has a built-in heat source, such as a heater 26, for heating the wafer W. Further, on the mounting table 25, a gap pin 70 that supports the wafer W with a gap from the mounting table 25 is attached to prevent particles and the like from adhering to the wafer W. Further, on the concentric circle of the mounting table 25, a plurality of through-holes 27 for guiding the support pins 80 for allowing the support pins 80 to move in and out are provided at equal intervals, three here. The mounting table 25 configured in this manner is formed of a material having good thermal conductivity such as an aluminum alloy.

As shown in FIG. 20, the lower portion of the support pin 80 is fixed to the connecting guide 89, and the connecting guide 89 is connected to the timing belt 88. The timing belt 88 is stretched around a drive pulley 86 driven by the stepping motor 81 and a driven pulley 87 disposed above the drive pulley 86, and by the forward and reverse rotation of the stepping motor 81, the support pin 88 is supported. 80
And the mounting table 25 are formed so as to be movable up and down relatively. Therefore, the support pin 80 can support the wafer W at the position indicated by the chain double-dashed line, and when the support pin 80 is lowered from this state, the wafer W is placed on the mounting table 25 as indicated by the solid line. can do. Like the gap pin 70 described above, the support pin 80 is also formed so that the difference between the heat applied to the wafer W from the support pin 80 and the heat applied from the surface of the mounting table 25 is as small as possible.

By the way, according to the present invention, with respect to the support pins in various processing units such as the hot plate unit (HP), a substrate is provided between the support pins and the transfer arm 28 (FIG. 21) of the main wafer transfer mechanism 21. The target is the portion of the substrate transfer device that transfers the wafer W.

The main wafer transfer mechanism 21 has a transfer arm 28 as described with reference to FIG. 21, which holds the peripheral portion of the wafer W and transfers the wafer W above the mounting table 25. The wafer W is delivered to and from the support pins 80 (FIG. 22) of the book. In such an operation, it is necessary to know the height position when the tips of the three support pins 80 contact the substrate, that is, the support position of the support pins 80 with respect to the wafer W. This is because, in order to avoid the inconvenience of returning the transfer arm 28 while the wafer W is still placed, the lower limit position for lowering the transfer arm 28 or the upper limit position for raising the support pin 80 is known, and the transfer arm 28 is detected. This is because it is necessary to find an appropriate timing for returning 28 and teach it to the transfer arm side.

First Embodiment Therefore, in the first embodiment of the present invention, as shown in FIG. 1, the height position (support position) when the tips of the three support pins 80 contact the wafer W is shown. ) Is automatically detected, and a teaching device that automatically teaches the teaching jig 5 and its position to the main wafer transfer mechanism 21 is used.

As shown in FIG. 1, the teaching jig 5 has the same size as the central disk 6 (first disk) that can be mounted on the support pins 80 (FIG. 2) and the wafer W as a substrate. A doughnut-shaped disc having a size, and a donut plate 7 (second disc) having an insertion hole 7a for accommodating and supporting the disc 6, and a disc in the central portion provided on the donut plate 7. It is composed of detection means for detecting the presence or absence of 6, for example, two sets of optical sensors 8 and 9.

In other words, the teaching jig 5 has the same size as the wafer W which is the above-mentioned substrate in which the disc 6 at the central portion is separable upward relative to the donut plate 7 around it. The donut plate 7 of the composite plate is provided with optical sensors 8 and 9 capable of detecting the presence or absence of the central disk 6.

The donut plate 7 is provided with a step portion 7b at the lower part of the circumference of the insertion hole 7a, and the disc 6 is hooked and supported on the step portion 7b. Further, the step portion 7b is formed so that the position of the upper surface of the circular plate 6 and the position of the upper surface of the donut plate 7 coincide with each other.

The optical sensors 8 and 9 are the donut plates 7 respectively.
On one side, the light emitting elements 8a and 9a and the light receiving elements 8b and 9b are arranged so as to face each other with the insertion hole 7a interposed therebetween. In this case, the light emitting elements 8a and 9a and the light receiving element 8b,
9b is provided on the outer circumference circle of the donut plate 7. The two sets of optical sensors 8 and 9 are provided so as to be displaced in the circumferential direction so that the optical axes 71 and 71 that cross the insertion hole 7a intersect.

The optical sensors 8 and 9 are the light emitting elements 8
Whether the disc 6 exists between the light emitting elements 8a and 9a and the light receiving elements 8b and 9b, depending on whether or not the light 72 is received by the light receiving elements 8b and 9b. A transmissive optical sensor for detecting whether or not it is configured.

The support position of the support pin 80 detected by the teaching jig 5 configured as described above is set at the main wafer transfer mechanism 2
1 may be taught by the operator, but the teaching jig 5 further receives the output signals of the optical sensors 8 and 9,
The main wafer transfer mechanism 21 is provided with a control means, such as a CPU 60, which detects the support position of the three support pins 80 from the change in the output signal due to the relative movement of the disk 6 and the donut plate 7. If the support position teaching device that automatically teaches the support position is configured, the teaching work can be further facilitated.

In this case, the CPU 60 controls the light receiving element 8b,
From the change in the output signal sent from 9b, the transfer arm 28
The support position of the support pin 80 with respect to is configured to be calculated.

Next, the Z-axis position data of the transfer arm 28 when the tips of the three support pins 80 come into contact with the substrate at the upper limit position of the support pin 80, which is the position where the transfer arm 28 and the substrate are transferred. At a certain height position, that is, the support pin 80
3 shows a method of detecting the supporting position of the wafer W with respect to FIG.
Will be described with reference to. As a premise, it is assumed that the three support pins 80 have the same height position at their tip portions.

First, the operator manually or automatically operates the main wafer transfer mechanism 21, holds the peripheral portion of the composite plate, which is the teaching jig 5, by the transfer arm 28 of the main wafer transfer mechanism 21, and mounts it on the mounting table. The wafer W is conveyed above 25 (the position of the wafer W shown by the chain double-dashed line in FIG. 20) (FIG. 3A). In this case, the donut plate 7 includes the transfer arm 28 and the support pin 8.
The optical axes 71 of the optical sensors 8 and 9 are placed in such a direction that they are not blocked by the support pins 80 when the optical sensor 8 and 9 are moved relative to each other.

At this point, the light 7 of the light emitting element 8a (9a) is emitted.
2 is received by the light receiving element 8b (9b), and the optical sensors 8 and 9 are in the ON state as shown at time ta in FIG. 4 (a). Although only the optical sensor 8 is shown in FIG. 3 as a representative, the operation is the same for the optical sensor 9.

Next, the transfer arm 28 and the support pin 80 are moved relative to each other, in this case, the transfer arm 28 is slowly moved downward so that the disk 6 at the center of the teaching jig 5 is supported by the above-mentioned three pieces. Place it on the pin 80 (FIG. 3B).

Even at this time, the light emitting element 8a (9
The light 72 of a) is received by the light receiving element, and the optical sensors 8 and 9 are in the ON state as shown at time tb in FIG.

Further, the transfer arm 28 and the support pin 80 are moved relative to each other, and the disc 6 in the central portion of the teaching jig 5 is attached to the donut plate 7 of the optical sensors 8 and 9 at a height (disc 6).
(The height from the upper surface of the disk 6 to the optical sensors 8 and 9 when being supported by the stepped portion 7b) H).
When the light-emitting element 8a (9) is moved (FIG. 3C),
The light 72 of a) is blocked by the disc 6 at the center of the teaching jig 5. Therefore, the light 72 does not enter the light receiving element 8b (9b), and the photosensors 8 and 9 show the time tc in FIG.
The state changes to the OFF state as shown by.

When the transfer arm 28 and the support pin 80 are further moved relative to each other, the disk 6 at the central portion of the teaching jig 5 is moved with respect to the optical sensors 8 and 9 by at least the thickness thereof. (FIGS. 3D and 3E) From the moment when the thickness of the disc 6 is exceeded, the light 72 of the light emitting element 8a (9a) is received by the light receiving element 8b (9b). Therefore, the optical sensors 8 and 9 return to the ON state as shown at time td in FIG. In FIG. 4A, it appears as a pulse interval D1.

Therefore, the CPU 60 monitors the output signals of the optical sensors 8 and 9 and detects the signal (detection signal, OFF signal) at the time tc when the output state changes to OFF.
Using the position of the FF signal as a calculation reference, the mounting height of the optical sensors 8 and 9 at a known distance from the position of the FF signal to the donut plate 7 (the disk 6 when the disk 6 is supported by the stepped portion 7b).
The height (the height from the upper surface to the optical sensors 8 and 9) H added (position at time tb) is calculated,
This is detected as the support position of the support pin 80, stored in a controller of the transfer arm 28, for example, a controller (not shown), and the teaching work is completed. After the completion of the automatic teaching work, the teaching jig 5 can be used as it is for detecting and teaching the supporting position of another processing unit, and is removed from the transport arm 28 after the necessary teaching work is completed.

Thus, the detection of the support position of the support pin 80 on the substrate and the teaching of the support position on the transfer arm 28 are automatically performed.

In the actual transfer of the wafer W,
The controller determines a position higher than the stored support position by a predetermined amount, for example, 1.5 mm, as the upper transfer position of the transfer arm 28. Further, when the transfer arm 28 transfers the substrate onto the support pins 80, or when the support pins 80 are used.
The vertical movement amount (stroke) when receiving the upper substrate is determined by a predetermined value that differs depending on the thickness of the transfer arm and the type of the processing unit, and the lower transfer position of the transfer arm 28 is determined by this value. .

Specifically, from the above supporting position, for example, 1.
Insert the transfer arm from the upper transfer position which is 5mm higher, and move a predetermined stroke from this upper transfer position, eg 1.5mm above.
By moving the transfer arm 28 to the lower transfer position by 11.5 mm, which is obtained by adding 10 mm to the transfer arm thickness, and then performing the returning operation, the transfer arm 28 transfers the substrate to the three support pins 80. Safe delivery will be carried out. On the other hand, when the wafer W is unloaded, the transfer arm 28 is inserted from the lower transfer position, the transfer arm 28 is moved upward to the upper transfer position to receive the wafer W, and then the wafer W is transferred to the outside of the apparatus.

Next, the case where the height positions of the tips of the three support pins 80 are not uniform will be described.

When the height positions of the tips of the three support pins 80 are not uniform, the teaching jig 5 supported by the height positions is not uniform.
The disc 6 in the central part of is tilted.

First, even if the disk 6 at the central portion of the teaching jig 5 is tilted, the extent (that is, the degree of unevenness of the support positions of the three support pins 80) does not hinder the transfer of the wafer W. Within the allowable range of, for example, within 2 mm, the pulse interval D1 (FIG. 4 (a)) of the outputs of the optical sensors 8 and 9 only slightly expands to D2 as shown in FIG. 4 (b), The support position can be obtained in the same manner as above.

However, when the degree of inclination of the disk 6 at the center of the teaching jig 5 exceeds a predetermined allowable range (2 mm),
Even if the transfer arm 28 is moved upward or downward, the wafer W
Part of the wafer W may interfere with the transfer arm 28, or the wafer W on the support pin 80 may be displaced or dropped due to the inclination, and the processing must be stopped as a transfer failure. At this time, the outputs of the optical sensors 8 and 9 are such that the pulse intervals thereof are greatly expanded as indicated by D3 in FIG. 4 (c).

FIG. 5 shows a case where the tilt is detected in the disk 6 at the central portion of the teaching jig 5 supported by the above three support pins 80. There are various tilt directions,
For convenience of explanation, FIG. 5 shows a case where the light sensor 8 is representatively detected.

First, the peripheral portion of the composite plate, which is the teaching jig 5, is held by the transfer arm 28 of the main wafer transfer mechanism 21 and transferred above the mounting table 25 (FIG. 5A). Then, the transfer arm 28 is slowly moved downward,
The disc 6 at the center of the teaching jig 5 is placed on the three support pins 80 (FIG. 5B).

At this time, the light 72 of the light emitting element 8a is received by the light receiving element 8b, and therefore the optical sensor 8 is in the ON state as shown at time ta in FIG. 4 (c).

Further, the transfer arm 28 is slowly moved downward so that the center disk 6 of the teaching jig 5 is attached to the doughnut plate 7 of the optical sensors 8 and 9 by the height H of the optical sensor 8. , 9 (FIG. 5 (c)),
The light 72 of the light emitting element 8a is blocked by the disc 6 at the center of the teaching jig 5, and the light 72 does not enter the light receiving element 8b, and the optical sensor 8 shows at time tc in FIG. 4 (c). Like O
Change to FF state. However, at this time, the heights of the three support pins 80 are not uniform, and for example, in FIG.
Since the support position is lower in the order of 0a, 80b, 80c, the disc 6 at the center of the teaching jig 5 is inclined downward to the right as shown in FIG. 5C.

In this state, the transfer arm 28 is further moved slowly downward so that the disk 6 at the center of the teaching jig 5 is moved.
Are moved with respect to the optical sensors 8 and 9. Since the disc 6 has an inclination, the light-shielding state of the optical sensor 8 does not end by the movement of the thickness of the disc 6, and the inclination of the disc 6 is further projected as shown in FIG. 5D. The light 72 of the light emitting element 8a is first received by the light receiving element 8b after moving the distance by the amount (FIG. 5 (e)).
The state returns to the ON state as shown at time td in (c). In FIG. 4 (c), the above change shows an abnormally long pulse interval D3, that is, the maximum allowable pulse interval D _max calculated in consideration of the tilt direction in the allowable range (2 mm) in which the transfer arm moves. It appears as a pulse interval D3 that exceeds (hereinafter referred to as the maximum allowable pulse interval D _max ).

Therefore, the CPU 60 monitors the output signals of the optical sensors 8 and 9, detects the pulse interval D of the signal (detection signal, OFF signal) whose output state has changed to OFF, and allows this maximum. When the actually measured pulse interval D is within the maximum allowable pulse interval D _max as compared with the pulse interval D _max (when D ≦ D _max ), the existence of the inclination of the support position is ignored.

The measured pulse interval D is the maximum allowable
Lus interval D_maxIf longer (D _max<For D)
The CPU 60 has three support pins 80a, 80b, 8
A warning signal indicating that the support positions of 0c are not uniform is output,
The operator has three support pins 80a, 80b, 80c
Encourage the tips to be evenly aligned.

In the above description, the case where the transmissive optical sensor is used as the detecting means has been described.
Other materials may be used as long as they can detect the presence or absence of the light. For example, it is also possible to use a reflective optical sensor including a pair of a light emitting element and a light receiving element. In this case, it is possible to arrange the reflection type photosensors in the circumferential direction on the donut plate 7, irradiate the light from the light emitting element to the side surface of the central disk 6 and receive the reflected light by the light receiving element. Good.

Further, as still another configuration of the detecting means,
It is also possible to provide two sets of optical fiber pairs so that the optical axis connecting the output end and the input end thereof runs in the hole in the central portion of the donut plate of the composite plate in the intersecting direction.

Second Embodiment A second embodiment of the present invention, as shown in FIGS. 6 and 7,
The light emitting element 109 can emit light in the side direction, and the disc 106 (first disc) that can be mounted on the support pin 80 and a detection unit that can detect the light emitted from the side face of the disc 106. The height position (support position) when the tip ends of the three support pins 80 contact the wafer W by the teaching jig 105 including, for example, a donut plate 107 (second disc) having the light receiving element 108. Is automatically detected.

The disk 106 has a light emitting element 109 capable of emitting light by electric power in the center thereof, and a light guide material capable of guiding the light of the light emitting element 109 in the side direction, for example, polycarbonate or acrylic. , Quartz, or the like.

Similar to the first embodiment, the donut plate 107 is provided with a stepped portion at the lower portion of the circumference of the insertion hole 107a, and the disc 106 is hooked and supported on this stepped portion. It Further, the step portion is formed so that the position of the upper surface of the disc 106 and the position of the upper surface of the donut plate 7 coincide with each other. Further, at a plurality of positions of the insertion hole 107a, in this embodiment, at the upper end of the position where the inner peripheral surface is divided into four equal parts, four detecting means capable of detecting the light of the light emitting element 109, for example, four light receiving elements 108 are provided. There is.

The light receiving element 108 is formed so as to be able to detect only the light parallel to the optical axis from the central direction of the donut plate 107. For example, the donut plate 107 is made of an opaque material. In this case, as shown in FIG. 8D, it is desirable to cover the upper surface side of the donut plate 107 including the light receiving element 108 with the light shielding material 110. The reason is that by covering the upper surface of the light-receiving element 108 with the light-shielding material 110, the reception of light that is not parallel to the optical axis of the light of the light-emitting element 109 is blocked and the position of the disc 106 is accurately detected. is there. It is of course possible to cover the entire surface of the light receiving element 108 except the insertion hole 107a side with a light shielding material.

Further, the light receiving element 108 is electrically connected to the CPU 60, and when detecting light, the output signal thereof can be sent to the CPU 60.

The size of the teaching jig 105 is 300 m, which is about the same size as a 12-inch wafer.
a donut plate 107 with a thickness of 5 mm and a thickness of 5 mm and a diameter of 150
and a circular disk 106 having a thickness of 5 mm and a thickness of 5 mm. As the light receiving element 108, a light receiving portion having a diameter of about 2 mm is used.

The teaching jig 105 configured as described above.
The operator may teach the support position of the support pin 80 detected by the operator to the main wafer transfer mechanism 21. However, the teaching jig 105 further receives the output signal of the light receiving element 108 and the disc 106 and the disc 106. The main wafer transfer mechanism 21 is provided with a control unit, such as a CPU 60, which detects the support positions of the three support pins 80 from the change in the output signal due to the relative movement of the donut plate 107, and automatically. If the support position teaching device that teaches the support position is configured, the teaching work can be further facilitated.

In this case, the CPU 60 controls the light receiving element 108
The position of the transfer arm 28 when the position of the lower surface of the disk 106 and the position of the upper surface of the donut plate 107 coincide with each other is detected from the change in the output signal sent from the disk 106, and the disk 106 is detected from this position.
It is configured to detect that the position above the thickness of is the support position of the support pin 80.

Next, a method of detecting the support position when the substrate transfer arm 28 transfers the wafer W to the support pin 80 using the teaching jig 105 will be described with reference to FIGS. 8 and 9. As a premise, it is assumed that the three support pins 80 have the same height position at their tip portions.

First, similarly to the supporting position detecting method of the first embodiment, the operator manually or the main wafer transfer mechanism 21.
By the automatic operation of, the peripheral portion of the composite plate, which is the teaching jig 105, is held by the transfer arm 28 of the main wafer transfer mechanism 21 and transferred above the mounting table 25 (FIG. 8A).

At this time, the light 72 of the light emitting element 109 is received by the light receiving element 108, and is in the ON state as shown at time ta in FIG.

Next, the transfer arm 28 and the support pin 80 are moved relative to each other, in this case, the transfer arm 28 is slowly moved downward so that the disc 106 at the center of the teaching jig 105 is moved to three support pins. 80 (FIG. 8 (b)).

Even at this time, the light 72 of the light emitting element 109 is received by the light receiving element 108, and the time t is shown in FIG.
It is in the ON state as indicated by b.

Further, the transfer arm 28 and the support pin 80 are moved relative to each other, and the donut plate 107 of the teaching jig 105 is moved.
Is moved downward by the thickness of the disc 106 (see FIG. 8).
(C)), the light 72 of the light emitting element 109 is the light shielding material 11
It is blocked by 0 and does not enter the light receiving element 108 (see FIG. 8).
(D)), the state changes to the OFF state as shown at time tc in FIG.

Therefore, the CPU 60 monitors the output signal of the light receiving element 108, detects the signal (detection signal, OFF signal) at time tc when the output state changes to OFF, and this O
Using the position of the FF signal as a calculation reference, a position (position at time tb) obtained by adding only the thickness of the donut plate 107, which is a known distance from the position, is calculated, and this is detected as the support position of the support pin 80. Then, the teaching work is completed by storing it in a controller of the transfer arm 28, for example, a controller (not shown). After completing this automatic teaching work,
The teaching jig 105 can be used as it is for detecting and teaching the supporting position of another processing unit, and is removed from the transport arm 28 after the necessary teaching work is completed.

Thus, the detection of the support position of the support pin 80 on the substrate and the teaching of the support position on the transfer arm 28 are automatically performed.

In the actual transfer of the wafer W,
A position higher by a predetermined amount than the support position is determined as the upper transfer position, and when the transfer arm 28 transfers the substrate onto the support pin 80 from this upper transfer position, or the support pin 80.
As in the first embodiment, the lower transfer position of the transfer arm 28 is determined based on the vertical movement amount (stroke) when receiving the upper substrate.

Next, the case where the height positions of the tips of the three support pins 80 are not uniform will be described.

When the height positions of the tip portions of the three support pins 80 are not uniform, the teaching jig 1 supported by this is provided.
Since the circular disk 106 in the central portion of 05 is inclined, the positions of the transport arms 28 when the four light receiving elements 108 detect light are different. Here, as shown in FIG. 10, the center point of the disk 106 is O, and the light receiving elements 108a, 10
The points on the surface of the disk 106 detected by 8b, 108c and 108d are A, B, C and D, and the light receiving elements 108a to 108.
The direction of c is the x direction, the direction of the light receiving elements 108b to 108d is the y direction, the moving direction of the disc 106 is the z direction, and the disc 10
6, the radius of 6 is L, the difference in position of the transfer arm 28 detected by the light receiving elements 108a and 108c is 2a, the light receiving element 108b,
Assuming that the position difference of the transfer arm 28 detected by 108d is 2b, the vector OA and the vector OB are

[Equation 1]

[Equation 2] Can be expressed as Further, a vector perpendicular to the vector OA and the vector OB, that is, the normal vector OM of the disc 106.
Is the cross product of the vector OA and the vector OB,

[Equation 3] Can be expressed as Here, the unit vector in the z direction is OZ = (0,
0, 1), the inclination θ of the disk is calculated from the inner product of the vector OM and the vector OZ.

[Equation 4] Can be calculated. Therefore, when the CPU 60 stores the maximum angle θmax in which the inclination of the support pins is allowable and the inclination of the disc 106 is θ> θmax, the support positions of the three support pins 80a, 80b, and 80c are not uniform. A warning signal to that effect is output to prompt the operator to evenly align the tips of the three support pins 80a, 80b, 80c. If the inclination of the disc is θ ≦ θmax, CP
U60 ignores the existence of the inclination of the support position, and the transport arm 2 when the light is first detected by the four light receiving elements
Using the position of 8 as a calculation reference, a position obtained by adding only the thickness of the donut plate 107, which is a known distance from the position, is calculated and detected as the support position of the support pin 80, and the control device of the transfer arm 28 is detected. For example, it may be stored in a controller (not shown).

In the above description, the case where four light receiving elements 108 are provided at positions that divide the inner peripheral surface of the disk 106 into four equal parts has been described. However, if at least three light receiving elements 108 are provided, inclination can be detected. can do.

Further, in the above description, the case where the light receiving element 108 is provided at the upper end portion of the inner peripheral surface of the insertion hole 107a has been described, but the position of the light receiving element 108 need not be provided at the upper end portion of the inner peripheral surface. A light-receiving element 1 sized to be provided at the middle portion or the lower end portion or to occupy from the upper end portion to the lower end portion
It is of course possible to provide 08. In this case, the distance from the lower surface of the donut plate 7 to the upper end of the light receiving element 108, which is a known distance from the position where the light 72 does not enter the light receiving element 108 and the output state is changed to OFF, is used as a calculation reference. The added position (position at time tb) may be calculated and used as the support position of the support pin 80.

The light receiving element 108 has an insertion hole 107a.
Plural at each position on the inner peripheral surface of, for example, 2 at the upper end and the lower end.
Individual pieces may be provided. If the light receiving element 108 is arranged in this way, the supporting position can be obtained by the two light receiving elements 108, so that the transport arm 2 can be more accurately.
8 positionings are possible.

In the above description, the case where a plurality of light receiving elements 108 are provided has been described. However, when it is clear that the support position of the support pin 80 is not inclined, the light receiving element 1
It is also possible to provide only one 08.

Since the other parts of the second embodiment are the same as those of the first embodiment, the same parts are:
The same reference numerals are given and the description is omitted.

Third Embodiment In the third embodiment of the present invention, as shown in FIGS. 11 and 12, a disc 116 (first disc) which can be mounted on the support pin 80.
And a doughnut-shaped disc having a size similar to that of the wafer W that can be held by the transfer arm 28 and having an insertion hole 117a for accommodating and supporting the disc 116.
17 (second disc) and a donut plate 117, and a state detection means capable of detecting the posture of the disc 116, for example, CC
By the teaching jig 115 including the D camera 118,
The height position (support position) when the tips of the three support pins 80 contact the wafer W is automatically detected.

In this case, the circular plate 116 is formed so that at least the color brightness of the side surface and the color brightness of the upper surface and the lower surface are different. For example, as shown in FIG. 12, the side surface is formed in white and the upper surface and the lower surface are formed in black. Of course,
It is also possible to make the color of the upper surface and the color of the lower surface different.

Similar to the first embodiment, the donut plate 117 is provided with a stepped portion at the lower part of the circumference of the insertion opening 117a, and the disc 116 is hooked and supported on this stepped portion. It Further, the step portion is formed so that the position of the upper surface of the disc 116 and the position of the upper surface of the donut plate 117 coincide with each other. Further, on the upper surface side of the donut plate 117, two state detecting means capable of detecting the state of the disc 116, for example, CCD cameras 118a and 118b are provided at a position of 90 ° when viewed from the center of the donut plate 117. Is provided.

The CCD camera 118 can detect the position of the upper end and the position of the lower end of the side surface of the disc 116 based on the difference in lightness between the color of the side surface of the disc 116 and the color of the upper surface or the lower surface. Further, the CCD camera 118 has a CPU 60.
Is electrically connected to the output signal of the CPU 60.
Can be sent to.

The support position of the support pins 80 may be taught to the main wafer transfer mechanism 21 by an operator.
The teaching jig 115 further receives the output signal of the CCD camera 118, and from the change in the output signal due to the relative movement of the disc 116 and the donut plate 117, three support pins 80 are provided.
Further, the teaching work can be further facilitated by detecting the supporting position of the main wafer transfer mechanism 21 and providing the main wafer transfer mechanism 21 with a control unit, for example, a CPU 60, for automatically teaching the supporting position. Can be

In this case, the CPU 60 is so constructed as to be able to calculate the support position of the support pin 80 with respect to the transfer arm 28 from the change in the output signal sent from the CCD 118.

A monitor 119 is electrically connected to the CPU 60, and is formed so that the image data output from the CCD 118 can be displayed.

Next, a method of detecting the support position when the substrate transfer arm 28 transfers the wafer W to the support pin 80 using the teaching jig 115 will be described with reference to FIGS. 13 and 14. As a premise, it is assumed that the three support pins 80 have the same height position at their tip portions.

First, similarly to the supporting position detecting method of the first embodiment, the operator manually or the main wafer transfer mechanism 21.
By the automatic operation, the peripheral portion of the composite plate, which is the teaching jig 115, is held by the transfer arm 28 of the main wafer transfer mechanism 21 and is transferred above the mounting table 25 (FIG. 13A).

Next, the transfer arm 28 and the support pin 80 are moved relative to each other, in this case, the transfer arm 28 is slowly moved downward so that the disc 106 at the center of the teaching jig 105 is moved to three support pins. It is placed on 80 (FIG. 13B).

At this point, there is no disk 116 in the horizontal direction of the CCD camera 118a, and the disk 116 is not displayed on the monitor 119 (FIG. 14 (a)).

Further, the transfer arm 28 and the support pin 80 are moved relative to each other, and the donut plate 117 of the teaching jig 115 is moved.
Is moved downward by the distance (hereinafter referred to as mounting height) between the surface of the donut plate 117 and the CCD camera 118a (FIG. 13C), the CCD camera 118a moves to the disk 11
The boundary line 121 at the upper end of the six side surfaces is detected, and the boundary line 121 is projected at the center of the monitor 119 (FIG. 14).
(B)).

Therefore, the CPU 60 uses the position of the transfer arm 28 when the boundary line 121 coincides with the center of the monitor 119 as a reference for calculation, and adds only the mounting height of the CCD camera, which is a known distance from the position. Is calculated, and this is detected as the support position of the support pin 80, and is stored in a control device of the transfer arm 28, for example, a controller (not shown).

Although the teaching work may be ended here, the transfer arm 28 is further moved downward relative to the support pin 80 by the thickness of the disk 116 (FIG. 13D), and the CCD
By the camera 118, the boundary line 12 at the lower end of the disc 116 is
2 may be detected. In this case, the monitor 11
A boundary line 122 is projected at the center of 9 (FIG. 14).
(C)). Further, the CPU 60 uses the position of the transfer arm 28 when the boundary line 122 coincides with the center of the monitor 119 as a calculation reference, and the CCD is a known distance from the position.
A position obtained by adding the mounting height of the camera and the thickness of the disc 116 can be obtained by calculation, and this can be detected as the support position of the support pin 80. Therefore, a more accurate support position can be detected.

After the completion of the automatic teaching work, the teaching jig 115 can be used as it is for detecting and teaching the supporting position of another processing unit. Removed.

In the actual transfer of the wafer W,
A position higher by a predetermined amount than the support position is determined as the upper transfer position, and when the transfer arm 28 transfers the substrate onto the support pin 80 from this upper transfer position, or the support pin 80.
As in the first embodiment, the lower transfer position of the transfer arm 28 is determined by the amount of vertical movement (stroke) when receiving the upper substrate.

Next, the case where the height positions of the tips of the three support pins 80 are not uniform will be described with reference to FIGS. 15 and 16. FIG. 16 is an image taken by the CCD camera 118a shown in FIG. The support pins 80 are 80a, 80b, and 80c in order from the left side.
Let a be the highest.

When the height positions of the tip portions of the three support pins 80 are not uniform, the teaching jig 1 supported by this is provided.
The disk 116 at the center of 15 will tilt.

First, the peripheral portion of the composite plate serving as the teaching jig 115 is held by the transfer arm 28 of the main wafer transfer mechanism 21 and transferred above the mounting table 25 (FIG. 15A).

Next, the transfer arm 28 and the support pin 80 are relatively moved, in this case, the transfer arm 28 is slowly moved downward so that the disk 106 at the central portion of the teaching jig 105 is placed on the support pin 80a. Place it (Fig. 15 (b)).

At this point, there is no disk 116 in the horizontal direction of the CCD camera 118a, and the disk 116 is not displayed on the monitor 119 (FIG. 16 (a)).

Further, the transfer arm 28 and the support pin 80 are moved relative to each other, and the donut plate 117 of the teaching jig 115 is moved.
Is moved downward by the mounting height (see FIG. 15).
(C)), the CCD camera 118a detects the boundary line 121 at the upper end of the side surface of the disk 116, and the boundary line 121 is projected at the center of the monitor 119 (FIG. 16 (b)). The position of the transfer arm 28 at this time is stored in the CPU 60.

Further, when the transfer arm 28 is moved downward by the thickness of the disc 116 (FIG. 15 (d)), the CCD camera 118a becomes the CCD camera 118 on the side of the disc 116.
The boundary line 122 at the lower end on the side closer to a is detected, and the monitor 11
A boundary line 122 is projected at the center of 9 (FIG. 16).
(C)). The position of the transfer arm 28 at this time is also the CPU 60.
Memorized in.

Further, when the transfer arm 28 is moved downward (FIG. 15 (e)), the CCD camera 118a moves to the disk 1
The boundary line 123 at the lower end on the side farther from the CCD camera 118a on the 16th side is detected, and the boundary line 12 is placed at the center of the monitor 119.
3 is displayed (FIG. 16 (d)). The position of the transfer arm at this time is also stored in the CPU 60.

In this way, the boundary lines 121, 122,
From the position of the transport arm when 123 is detected by the CCD camera 118a, the support position is taught as follows.

First, the CPU 60 determines which of the two areas surrounded by the three boundary lines 121, 122, 123 depending on the brightness is the side surface and which is the front surface or the back surface. That is, the CPU 60 determines from the image data of the CCD camera 118a that the upper white area is the side surface and the lower black area is the back surface.

Next, the difference 2a between the positions of the transfer arm 28 when the boundary lines 122 and 123 on the back side are detected is calculated. Similarly, from the image data of the CCD camera 118b, the difference 2b between the positions of the transport arm 28 when two boundary lines on the front surface side or the back surface side are detected is obtained. Then, for the same reason as described in the second embodiment, the inclination θ of the disc 116 is set such that the radius of the disc 116 is L.

[Equation 5] Can be calculated. Therefore, when the CPU 60 stores the maximum angle θmax in which the inclination of the support pins is allowable and the inclination of the disc 106 is θ> θmax, the support positions of the three support pins 80a, 80b, and 80c are not uniform. A warning signal to that effect is output to prompt the operator to evenly align the tips of the three support pins 80a, 80b, 80c. When θ ≦ θmax, the CPU 60 ignores the inclination and uses the highest position of the transfer arm 28 corresponding to the boundary line on the front surface side of the disk 116 detected by the CCD cameras 118a and 118b as a calculation reference. From the above, a position obtained by adding the mounting height of the CCD camera, which is a known distance, is calculated, and this is detected as the support position of the support pin 80, and stored in a control device of the transfer arm 28, for example, a controller (not shown). Good.

It is not necessary to provide two CCD cameras 118 at the opposite positions on the upper surface side of the donut plate 117, and only one CCD camera 118 can be provided at an arbitrary position on the upper surface side of the donut plate 117. In this case, the inclination θ ₁ of the donut plate 117 in the direction orthogonal to the direction in which the CCD camera 118 detects the donut plate 117 is set so that an arbitrary boundary line of the donut plate 117 detected by the CCD camera 118 becomes the center point of the monitor 119. detected by the tilt of the boundary line when matched theta ₁ {FIG. 16 (e) see}, as b = Lsinθ _1, it is sufficient to teach the supporting position of the support pin 80.

It is also possible to provide two pieces at arbitrary positions on the upper surface side of the donut plate 117, for example, at opposite positions of the donut plate 117, or to provide four pieces in a cross shape with respect to the center of the donut plate 117. is there. With this structure, the support position and the inclination of the support pin 80 can be obtained more accurately.

The other parts of the third embodiment are the same as those of the first embodiment.
The same reference numerals are given and the description is omitted.

In the above description, the case where the substrate support position of the support pin 80 in the hot plate unit (HP) is detected and the substrate support position is taught to the transfer arm 28 has been described. It is of course possible to apply the teaching of the supporting position between other processing units as long as the teaching of the supporting position between them is possible, for example, in the extension unit (EXT). It is also possible to teach the support position between the support pins of the above and the transfer arm 34.

[0148]

As described above, according to the method for detecting the support position of the substrate support pin, the method for detecting the inclination, the teaching device and the teaching jig of the present invention, the teaching jig previously held by the carrying arm is provided. The position and inclination of the central disk (first disk) in the teaching jig can be known directly from the change in the output signal of the optical sensor of the tool, and indirectly the support position of the board support pin and the board support. Automatically detects the inclination between pins,
Since the transfer arm can be taught, the teaching work can be performed safely and with high accuracy.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing a configuration of a substrate support position teaching jig according to a first embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view showing the configuration of a substrate support position teaching jig according to the first embodiment of the present invention.

FIG. 3 is an explanatory diagram illustrating a method for detecting a support position of a substrate support pin according to the first embodiment of the present invention.

FIG. 4 is an explanatory diagram showing a detection signal in the method for detecting the support position of the substrate support pin according to the first embodiment of the present invention.

FIG. 5 is an explanatory diagram illustrating a method for detecting an inclination of a support position of a substrate support pin according to the first embodiment of this invention.

FIG. 6 is a schematic perspective view showing the configuration of a substrate support position teaching jig according to a second embodiment of the present invention.

FIG. 7 is a schematic sectional perspective view showing the configuration of a substrate support position teaching jig according to a second embodiment of the present invention.

FIG. 8 is an explanatory diagram illustrating a method for detecting a support position of a substrate support pin according to the second embodiment of the present invention.

FIG. 9 is an explanatory diagram showing a detection signal in the method for detecting the support position of the substrate support pin according to the second embodiment of the present invention.

FIG. 10 is an explanatory diagram illustrating a method for detecting an inclination of a support position of a substrate support pin according to the second embodiment of the present invention.

FIG. 11 is a schematic perspective view showing a configuration of a substrate support position teaching jig according to a third embodiment of the present invention.

FIG. 12 is a schematic perspective view showing the configuration of a first disc of a jig for teaching a substrate support position according to a third embodiment of the present invention.

FIG. 13 is an explanatory diagram illustrating a method for detecting a support position of a board support pin according to a third embodiment of the present invention.

FIG. 14 is an explanatory diagram illustrating a method for detecting a support position of a board support pin according to a third embodiment of the present invention by using an image obtained by a jig for teaching a board support position.

FIG. 15 is an explanatory diagram illustrating a method for detecting an inclination of a support position of a substrate support pin according to a third embodiment of the present invention.

FIG. 16 is an explanatory diagram for explaining a method for detecting the inclination of the support position of the board support pin according to the third embodiment of the present invention, using an image obtained by a jig for teaching a board support position.

FIG. 17 is a schematic plan view showing an example of a resist solution coating / developing processing system to which the invention is applied.

FIG. 18 is a schematic front view of the resist solution coating / developing system.

FIG. 19 is a schematic rear view of the resist solution coating / developing system.

FIG. 20 is a schematic sectional view showing the structure of a heat treatment apparatus to which the present invention is applied.

FIG. 21 is a schematic plan view showing the configuration of a transfer device of the heat treatment apparatus.

FIG. 22 is a schematic cross-sectional view showing a configuration of a transfer device of a heat treatment apparatus.

[Explanation of symbols]

W semiconductor wafer (substrate) 5 teaching jig (composite plate) 6 circular plate (first circular plate) 7 donut plate (second circular plate) 7a insertion hole 8, 9 optical sensor (detection means) 8a, 9a light emitting element 8b, 9b Light receiving element 25 Mounting table 28 Transfer arm 60 CPU (control device) 71 Optical axis 72 Light 80, 80a, 80b, 80c Support pin 105 Teaching jig (composite plate) 106 Disc (first disc) 107 Donut plate (second disc) 107a Insertion holes 108, 108a, 108b, 108c, 108d Light receiving element (detecting means) 109 Light emitting element 115 Teaching jig (composite plate) 116 Disc (first disc) 117 Donut plate (Second disk) 117a Insertion holes 118, 118a, 118b CCD camera (state detecting means)

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Seiji Ozawa             TBS broadcasting, 5-3-6 Akasaka, Minato-ku, Tokyo             Inside Center Tokyo Electron Ltd. F-term (reference) 5F031 CA02 CA05 DA01 FA01 FA02                       FA07 FA11 FA12 FA15 GA06                       GA47 GA48 GA49 HA33 HA37                       HA38 JA04 JA05 JA14 JA17                       JA22 JA30 JA32 KA11 KA13                       LA09 LA13 LA15 MA24 MA26                       MA27 MA30 NA02                 5F046 KA04 KA10

Claims (18)

[Claims] 1. A transfer arm holds a peripheral portion to transfer a substrate above a mounting table, mounts the substrate on a plurality of vertically movable support pins passing through the mounting table, and returns the transfer arm to the outside of the mounting table. On the other hand, in the substrate transfer device that lowers the support pins and places the substrate on the mounting table, the first disc in the center can be separated upward relative to the surrounding donut-shaped second disc. A composite plate having the same size as the above substrate is prepared as a jig, and at that time, the second disc is provided with a detection means capable of detecting the presence or absence of the first disc in the central portion, The peripheral part is held by the transfer arm and transferred above the mounting table, the transfer arm and the support pin are moved relative to each other, and the first circular plate in the central part of the composite plate is placed on the support pins and transferred. By moving the arm and the support pin relative to each other, the first circular plate is moved over at least its thickness. The support position of the plurality of support pins is detected from the change of the output signal of the detection means at this time, and the support position detection method of the substrate support pin. 2. The support position detecting method according to claim 1, wherein the detecting means includes two sets of transmissive optical sensors whose optical axes run in a hole at a central portion of the second disk in a substantially orthogonal direction. A method for detecting a support position of a substrate support pin, comprising: 3. The support position detecting method according to claim 1, wherein the support positions of the plurality of support pins are based on the surface of the composite plate, and the position of the detection means and the second disc. A method for detecting a support position of a substrate support pin, characterized in that it is determined in consideration of a difference from a surface position. 4. The support position detecting method according to claim 1 or 2, wherein a pulse width longer than a pulse width corresponding to a thickness of the first disc is received by receiving an output signal from the detecting means. When it is performed, it is determined that the tips of the plurality of support pins are tilted. 5. A transfer arm holds a peripheral portion to transfer a substrate above a mounting table, mounts the substrate on a plurality of vertically movable support pins passing through the mounting table, and returns the transfer arm to the outside of the mounting table. On the other hand, in a substrate transfer device that lowers a support pin to place a substrate on a mounting table, the first circular plate in the center that can emit light in the side direction is different from the donut-shaped second circular plate around it. As a jig, we prepared a composite plate of the same size as the above-mentioned substrate, which is relatively separable upward, and at that time, the light emitted from the side surface of the first disc can be detected on the second disc. The detecting means is provided, the peripheral portion of the composite plate is held by the transfer arm and is transferred above the mounting table, and the transfer arm and the support pin are relatively moved to move the first circular plate in the central part of the composite plate. The first arm is placed on the plurality of support pins, and the transfer arm and the support pins are relatively moved to A substrate characterized in that the disc is moved with respect to the detecting means by an amount exceeding at least the thickness thereof, and the supporting positions of the plurality of supporting pins are detected from the change in the output signal of the detecting means at this time. Support pin support position detection method. 6. A transfer arm holds a peripheral portion to transfer a substrate above a mounting table, mounts the substrate on a plurality of vertically movable support pins passing through the mounting table, and returns the transfer arm to the outside of the mounting table. On the other hand, in the substrate transfer device that lowers the support pins and places the substrate on the mounting table, the first disc in the center can be separated upward relative to the surrounding donut-shaped second disc. A composite plate having the same size as the above substrate is prepared as a jig. At this time, the second disc is provided with a state detecting means capable of detecting the posture of the first disc, and the peripheral portion of the composite plate is provided. Is carried by the carrying arm and carried above the mounting table, and the carrying arm and the support pin are moved relative to each other so that the first circular plate in the central portion of the composite plate is placed on the plurality of support pins, By moving the support pin relatively, the first disc is moved over at least the thickness thereof. A method for detecting the support position of the substrate support pin, wherein the support position of the plurality of support pins is detected from the change of the output signal of the state detection means at this time. 7. The support position detecting method according to claim 6, wherein the first circular plate has a side surface whose color lightness is different from the lightness of the upper surface and the lower surface, and the state detecting means is the above-mentioned. When the boundary between the side surface and the upper surface or the lower surface is detected due to the difference between the color brightness of the side surface of the first disc and the color brightness of the upper surface or the lower surface, it is determined that the tips of the plurality of support pins are inclined. A method for detecting inclination of a support position of a substrate support pin, comprising: 8. A transfer arm holds a peripheral portion to transfer a substrate above a mounting table, and mounts and supports the substrate on a plurality of vertically movable support pins that pass through the mounting table to support the transfer arm. A support position teaching device for a substrate support pin of a substrate transfer device that lowers a support pin to place a substrate on a mounting table while returning it to the outside, and a first disc mountable on the support pin, A doughnut-shaped disc having a size similar to that of the substrate that can be held by the transfer arm, the second disc having an insertion hole for accommodating and supporting the first disc; and the second circle. The detection means provided on the plate and capable of detecting the presence or absence of the first disc, and receiving the output signal of the detection means, the change of the output signal due to the relative movement of the first disc and the second disc , A control for detecting the support positions of the plurality of support pins and teaching the positions to the transfer arm. Supporting position teaching apparatus of the substrate support pins, characterized by comprising a means. 9. The support position teaching device for a substrate support pin according to claim 8, wherein as the detecting means, two sets of optical sensors whose optical axes run in the holes of the second disk in a substantially orthogonal direction are provided. A support position teaching device for a substrate support pin, characterized in that: 10. The support position teaching device for a substrate support pin according to claim 8 or 9, wherein the detection means is provided on the surface of the second disk, and the control means uses the surface of the first disk as a reference. The support position of the substrate support pin is characterized by having a function of determining the support position of the plurality of support pins in consideration of the difference between the position of the detection means and the surface position of the first disk. Teaching device. 11. A transfer arm holds a peripheral portion to transfer a substrate above a mounting table, and the substrate is mounted and supported on a plurality of vertically movable support pins passing through the mounting table to support the transfer arm. A support position teaching device for a substrate support pin of a substrate transfer device that lowers a support pin to place a substrate on a mounting table while returning it to the outside, and is capable of emitting light in a lateral direction by a light emitting element, A first disc that can be placed on the support pin, and a donut-shaped disc that is approximately the same size as the substrate that can be held by the transfer arm, and stores and supports the first disc. A second disc having an insertion hole, a detection unit provided on the second disc and capable of detecting light emitted from the side surface of the first disc, and an output signal of the detection unit for receiving the first signal. From the change in the output signal due to the relative movement of the disc and the second disc, Serial plurality of detecting the support position of the support pin, the support position teaching apparatus of the substrate support pins, characterized by comprising a control means for teaching the position to the transport arm. 12. A transfer arm holds a peripheral portion to transfer a substrate above a mounting table, and the substrate is mounted and supported on a plurality of vertically movable support pins passing through the mounting table to support the transfer arm. A support position teaching device for a substrate support pin of a substrate transfer device that lowers a support pin to place a substrate on a mounting table while returning it to the outside, and a first disc mountable on the support pin, A doughnut-shaped disc having a size similar to that of the substrate that can be held by the transfer arm, the second disc having an insertion hole for accommodating and supporting the first disc; and the second circle. An output signal associated with the relative movement of the first disc and the second disc, which is provided on the plate and receives the output signal of the state detection unit capable of detecting the posture of the first disc and the state detection unit. Of the above-mentioned multiple support pins from the change in the Supporting position teaching apparatus of the substrate support pins, characterized by comprising a control unit for teaching. 13. The support position teaching device according to claim 12, wherein the first circular plate is formed so that the lightness of the color of the side surface is different from the lightness of the color of the upper surface and the lower surface, and the state detecting means is provided. The substrate support pin is characterized in that the boundary between the side surface and the upper surface or the lower surface is detectably formed by the difference between the color brightness of the side surface of the first disk and the color brightness of the upper surface or the lower surface. Support position teaching device. 14. A transfer arm holds a peripheral portion to transfer a substrate above a mounting table, and mounts and supports the substrate on a plurality of vertically movable support pins passing through the mounting table to support the transfer arm. A jig used to teach the support position of the support pin in a substrate transfer device that lowers the support pin while lowering the support pin to place the substrate on the mounting table, and can be mounted on the support pin. A first circular plate and a doughnut-shaped circular plate having a size similar to that of the substrate that can be held by the transfer arm, and a second circular plate having an insertion hole for accommodating and supporting the first circular plate. A jig for supporting position teaching of a substrate supporting pin, comprising: a plate; and a detection means provided on the second circular plate and capable of detecting the presence or absence of the first circular plate. 15. The jig for supporting position teaching according to claim 14, wherein as the detecting means, two sets of optical sensors whose optical axes run in the holes of the second disc in a substantially orthogonal direction are provided. A jig for teaching the support position of the characteristic board support pin. 16. A transfer arm holds a peripheral portion to transfer a substrate above a mounting table, and the substrate is mounted and supported on a plurality of vertically movable support pins passing through the mounting table to support the transfer arm. A jig used to teach the support position of the support pin in a substrate transfer device that lowers the support pin and lowers the support pin to place the substrate on the mounting table. Is a doughnut-shaped disc that is capable of emitting light and that can be placed on the support pin, and that is the same size as the substrate that can be held by the transfer arm. A second disc having an insertion hole for accommodating and supporting the plate; and a detection means provided on the second disc and capable of detecting light emitted from the side surface of the first disc. A jig for teaching the support position of the characteristic board support pin. 17. A transfer arm holds a peripheral portion to transfer a substrate above a mounting table, and mounts and supports the substrate on a plurality of vertically movable support pins passing through the mounting table to support the transfer arm. A jig used to teach the support position of the support pin in a substrate transfer device that lowers the support pin while lowering the support pin to place the substrate on the mounting table, and can be mounted on the support pin. A first circular plate and a doughnut-shaped circular plate having a size similar to that of the substrate that can be held by the transfer arm, and a second circular plate having an insertion hole for accommodating and supporting the first circular plate. A support position teaching jig for a substrate support pin, comprising: a plate; and a state detection means provided on the second disc and capable of detecting the posture of the first disc. 18. The jig for supporting position teaching according to claim 17, wherein the first circular plate is formed such that the lightness of the color of the side surface and the lightness of the color of the upper surface and the lower surface are different, and The detection means is formed such that the boundary between the side surface and the upper surface or the lower surface can be detected by the difference between the lightness of the color of the side surface of the first circular plate and the lightness of the color of the upper surface or the lower surface. Jig for teaching support position of support pin.