JP2003165133A - Apparatus for discharging liquid material and method for resin sealing - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for discharging a liquid material capable of uniformly coating the liquid material for a compression mold in an optimum amount at each work in a high accuracy. <P>SOLUTION: The apparatus for discharging the liquid material discharges the liquid-like resin onto the base 2 by a dispenser 13 in a resin amount individually specified for each base 2 based on the base weight measured by a weight measuring unit 14 and/or the liquid-like resin amount. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid material discharge device for discharging a predetermined amount of a liquid material for compression molding onto a work, and a liquid resin is supplied to a molded product by using the liquid material discharge device to perform compression molding. The present invention relates to a resin sealing device.

[0002]

2. Description of the Related Art Various types of resin sealing devices for sealing a semiconductor package with a resin have been developed and put into practical use. For example, QFN (Quad / Flat / Non-1)
eaded) and SON (Small / Outline /
In the case of resin-sealing a single-sided mold type semiconductor package such as Non-leaded), a specified amount of a semiconductor chip is mounted on a substrate or a semiconductor wafer on which the semiconductor chips are mounted in a matrix on a silicon wafer. Liquid resin was applied. Specifically, the liquid resin is applied by potting, or the liquid resin is flown down and spin-coated to perform resin sealing. When the semiconductor package is a small and thin product, in order to obtain uniform molding quality, it is easy to cure by heating, and the sealing resin does not move as much as possible, and the resin amount is measured accurately before sealing. Is desired.

Therefore, there is a method in which a solid resin (resin tablet), a powder resin, a liquid resin, or the like is supplied onto a molded product such as a substrate or a wafer and clamped by an upper mold and a lower mold to perform compression molding. With this compression molding, the amount of resin required for the molded product can be measured and sealed, so there is no waste in the sealing resin and the range in which the resin flows is limited, so a thin package is sealed. Even if it does, uniform molding is possible.

[0004]

However, since the solid resin (resin tablet) is solid, it easily causes a wire sweep (wire sweep) of the wire provided on the substrate or the wafer, and the addition of the resin amount is difficult. There was a problem that it was difficult. Further, in the actual manufacturing process, a prescribed number of semiconductor chips may not be mounted on the substrate or silicon wafer that is the molded product. If a prescribed amount of liquid resin is applied to the molded product in this state, there is a risk of insufficient molding resin for the volume of the semiconductor chip that is insufficient, and the overall thickness of the package will become thin, resulting in defective molding. there were. Further, when the number of defective portions of the semiconductor chip increases, there is a possibility that a semiconductor chip portion that is not completely resin-sealed may occur. Further, in the compression molding, unlike the transfer molding, since there is no portion (unnecessary resin portion) that is a play of the resin amount like the mold cull, a high degree of liquid resin application precision (resin amount precision) is required. In particular, due to factors such as wear of nozzles or seals of dispensers (discharging devices) that discharge liquid resin, ambient temperature for resin sealing, air mixed in liquid resin, and dispersion of viscosity of liquid material itself, The discharge amount of resin easily varies.

An object of the present invention is to solve the above-mentioned problems of the prior art, and to provide a liquid material discharge device capable of applying an optimum amount of a liquid material for compression molding for each work with high precision, and a liquid material discharge device. It is to provide a resin sealing device with improved molding quality.

[0006]

In order to solve the above problems, the present invention has the following constitution. That is, in a liquid material discharge device that discharges a predetermined amount of a liquid material for compression molding onto a work, a discharge means capable of discharging the liquid material while scanning the work in the XYZ directions, the work weight and / or the work. A measuring means capable of measuring the amount of liquid material discharged to the work piece, and the amount of liquid material individually specified for each work based on the work weight and / or the amount of liquid material measured by the measuring means. It is characterized in that the liquid material is discharged onto the work. Further, it is characterized in that the number of defective semiconductor chips of the work is measured and the amount of liquid material corresponding to the defective portions of the semiconductor chips is increased and corrected.
In this case, the number of defects of the semiconductor chip is measured by any one of image processing performed by imaging the work, weight measurement of the work, chip height measurement, and reflectance change of light obtained by irradiating the work with light. It is characterized by In addition, the measuring means measures the weight of the work before and after discharging the liquid material,
It is characterized in that the variation of the discharge amount of the liquid material per work by the discharge means can be finely adjusted within the allowable tolerance range. In addition, it is possible to finely adjust the variation of the discharge amount of the liquid material per work by the discharge means within the allowable tolerance range based on the mold clamping movement information of the molding die and the plate thickness information of the work. To do. Further, it is characterized in that the plate thickness of the work is measured before the resin is sealed, and the liquid material amount in consideration of the variation of the plate thickness of the work is discharged. Further, the discharge means is characterized in that the central part of the work is applied so that the application height or the application amount of the liquid material is higher than the peripheral part. Further, when the liquid material is applied to the work by the discharging means, the work is vibrated while being applied. Further, when the liquid material is applied to the work by the discharging means, the liquid material is applied while being heated. Further, the discharging means is a dispenser having a single nozzle or a multi-nozzle. Further, the discharge means is a dispenser having a flat nozzle with a wide liquid material discharge port.

Further, the resin sealing device is characterized in that any one of the above-mentioned liquid material discharging devices is used to supply the liquid resin to the article to be molded to perform compression molding. A servo motor is provided as a drive source for opening and closing the mold, and the liquid material is based on the mold clamping movement information and the work thickness information obtained by measuring the amount of rotation of the servo motor during mold clamping. It is characterized in that compression molding is performed by finely adjusting the discharge amount of the liquid material of the discharge device.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of a liquid material discharging device and a resin sealing device according to the present invention will be described in detail below with reference to the accompanying drawings. In the present embodiment, a liquid material discharge device for discharging a liquid resin used in a compression molding method to a work and a resin sealing device including the liquid material discharge device will be described. 1 is a plan view of the liquid material discharging device, FIG. 2 is a front view of the liquid material discharging device of FIG. 1, FIGS. 3 to 5 are explanatory views of the liquid material discharging operation of the liquid material discharging device, and FIG. 6 is a liquid material discharging device. FIG. 7 is an explanatory diagram illustrating a liquid material application pattern on a work, and FIGS. 8A, 8B, and 8C are explanatory diagrams illustrating a nozzle shape of a dispenser and a liquid material application method. FIG. 9 is a block diagram showing a liquid material discharge amount adjusting mechanism according to another example, FIG. 10 is a plan view of a resin sealing device, FIG. 11 is a front view of the resin sealing device of FIG. 10, and FIG. ) (B) is an explanatory view of a work, and FIGS. 13 (a) and 13 (b) are explanatory views showing a coating pattern of a liquid material according to another example.

First, a schematic structure of the resin sealing device will be described with reference to FIGS. In FIGS. 10 and 11, reference numeral 1 denotes a work supply unit, which houses a plurality of works to be molded on one side. In this embodiment, a substrate (film substrate, lead frame, resin substrate, etc.) on which semiconductor chips are mounted in a matrix as an example of the work.
2 (see FIG. 12B) is housed in the magazine 3. Slits are formed on the side surface of the magazine 3 on the cutout side, and the cutout plates (pushers) 5 operated by the actuators 4 send the magazines one by one from the substrate 2 on the lowermost layer side. As shown in FIG. 11, the magazine 3 is supported by the elevator mechanism 6 and accommodated in a stack, and each time one substrate 2 is cut out, the magazine 3 is lowered by one pitch to prepare for the next cutting out of the substrate 2. Has become.
The work piece to be molded on one side may be, in addition to the substrate 2, a silicon wafer 7 having semiconductor chips shown in FIG. 12
The grid-like lines formed on the substrate 2 and the silicon wafer 7 in (a) and (b) show the partitions for one package.

Reference numeral 8 denotes a liquid material discharge device as an example of a resin supply unit, which quantitatively discharges and supplies the liquid material (liquid resin) to the work (substrate 2 and silicon wafer 7) supplied from the work supply unit 1. . The front end side of the substrate 2 sent out from the magazine 3 by the cutout plate 5 is transferred to the support rail 9. By moving the tip of the substrate 2 while being chucked by the chuck 10 while being guided by the guide rail 11 provided in parallel with the support rail 9,
The substrate 2 is transported to the ejection position P on the support rail 9.
Reference numeral 12 denotes a camera for picking up an image of the work, which is provided so that the substrate 2 can be picked up before the resin is supplied to check the defective portion of the semiconductor chip.

Reference numeral 13 is a dispenser as an example of a discharge means, and the dispenser 13 is provided so as to discharge the liquid resin while scanning the substrate 2 in the XYZ directions. The liquid resin is sent from a storage tank (not shown) to the dispenser 13 via a tube or the like, and the dispenser 13 scans the substrate 2 in the XYZ directions, and a predetermined amount of the liquid resin is supplied from the nozzle 13a to an arbitrary pattern. Discharge with.

Reference numeral 14 denotes a weight measuring device as an example of a measuring means, which is provided so that the weight of the work (substrate 2, silicon wafer 7) and / or the amount of liquid resin discharged to the work can be measured. In this weight measuring device 14, a measurement mounting plate 14b is provided on a measurement device main body 14a, and the measurement device main body 14a measures the weight by mounting the substrate 2 on the measurement mounting plate 14b. It is supposed to do. The weight measuring device 14 is provided below the discharge position P of the support rail 9. The measurement mounting plate 14 b is composed of an elongated plate along the support rail 9 and is arranged in a gap between the support rails 9. The measuring device main body 14a is placed on a measuring device supporting base 15, and the measuring device supporting base 15 is connected to an elevating cylinder 16 and can be moved up and down.

Reference numeral 17 denotes a compression molding device as a resin sealing portion, which is used for lowering a substrate 2 to which a liquid resin is supplied and a lower mold 18 and an upper mold 1.
9 and clamp and compression molding. The substrate 2 on which the liquid resin has been discharged by the liquid material discharging device 8 is transferred to the lower mold 18 which is held by the loader 20 and stands by at the take-out position Q. The lower mold 18 is movable between a clamp position R facing the upper mold 19 and a take-out position Q where the substrate 2 is transferred from the loader 20. A cavity (not shown) is formed in the upper mold 19, and a release film 21 is stretched on the parting surface thereof.

A long film is used as the release film 21, and the release film 21 is sent out from the supply reel 22a by the film transport mechanism 22 and is wound around the take-up reel 22b through the upper mold 19. The release film 21 has heat resistance to withstand the heating temperature of the molding die, is easily peeled from the upper mold surface, and has flexibility and extensibility.
TFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidene chloride and the like are preferably used. The release film 21 is stretched in close contact with the upper mold surface by sucking air through a suction hole (not shown) formed in the parting surface of the upper mold 19.

The upper die 19 of the molding die is supported by the upper movable platen 23a, and is vertically movable together with the film transport mechanism 22. The lower mold 18 is supported by the fixed platen 24. The lower movable platen 23b is connected to the screw shaft 25 via a nut 26, and
A pulley 27 is attached to the. The vertically movable platens 23a and 23b are integrally connected by a movable tie bar 50. . 28 is a servo motor which is a drive source,
A pulley 29 is provided on the motor shaft. Pulley 27
And the endless timing belt 30 between the pulley 29 and
Have been passed over. When the servo motor 28 is driven,
Timing belt 3 hung between pulleys 27 and 29
The screw shaft 25 rotates through 0 to move the vertically movable platen 23.
The a and 23b are adapted to move up or down.

When the mold is opened after compression molding, the release film 21 is easily separated from the resin, so that the release film 21 is separated from the substrate 2 while being adsorbed by the upper mold 19, and the substrate 2 is lower mold. Remain on side 18. The substrate 2 is taken out by moving the lower mold 18 from the clamp position R to the take-out position Q while being placed on the lower mold 18. Then, it is gripped by the unloader 31 standing by at the take-out position Q and transferred to the molded product storage section.

Reference numeral 32 is a molded product storage device as an example of a molded product storage unit. The molded product storage device 32 includes a moving table 33 that receives the substrate 2 after compression molding, a pickup device 34 that sucks and holds the substrate 2 from the moving table 33 to rotate and aligns the direction, and a suction holding device that holds the pickup device 34. A storage magazine 35 for storing the printed substrates 2 is provided.

The substrate 2 placed on the lower die 18 is gripped by the unloader 31 and transferred to the moving table 33 waiting at the receiving position U. The moving table 33 is
The substrate 2 is moved from the receiving position U to the storage position V with the substrate 2 still mounted, and is suction-held by the pickup device 34. The moving table 33 moves again from the storage position V to the receiving position U when the substrate 2 is transferred. The pickup device 34 stores the substrate 2 in the storage magazine 35 while adsorbing and holding the substrate 2 and rotating the substrate 90, for example, by aligning the directions.

Next, a specific structure of the liquid material discharge device 8 will be described with reference to FIGS. 1 and 2. Dispenser 1
3 is provided so that the liquid resin can be discharged while scanning the substrate 2 in the XYZ directions. In FIG. 1, the dispenser 13 is attached so as to be movable in the Z-axis direction along a Z-axis moving arm 36. The Z-axis moving arm 36 is attached so as to be movable in the X-axis direction along the X-axis moving arm 37. The X-axis moving arm 37 is attached so as to be movable in the Y-axis direction along the Y-axis moving arm 38.

The substrate 2 sent out from the work supply unit 1.
Are sent to the support rail 9, and the front end side of the substrate is chucked by the chuck 10. The chuck 10 is provided with an L-shaped claw portion 10b which can be opened and closed at the tip of an arm portion 10a. The claw 10b is opened and closed by an electromagnetic solenoid or the like. Further, the claw portion 10b may be provided with a vibrator for vibrating the substrate 2 when ejecting the liquid resin as described later. The arm portion 10a is supported by a guide rail 11 provided in parallel with the support rail 9, and a part thereof is fixed to an endless timing belt 39. The timing belt 39 is stretched between pulleys 40 and 41 provided on both ends of the guide rail 11, and is driven by the servomotor 42 to rotate in the forward and reverse directions. When the servo motor 42 is activated, the arm portion 10a linked to the timing belt 39 moves along the guide rail 11, and the substrate 2 chucked by the claw portion 10b is conveyed to the ejection position P on the support rail 9.

The weight measuring device 14 is arranged directly below the discharge position P of the support rail 9. The weight measuring device 14
It is mounted on the measuring device support base 15. The measuring device support base 15 is connected to a cylinder rod of a lifting cylinder (air cylinder) 16 supported by a cylinder base 43. When the lifting cylinder 16 is operated, the cylinder rod extends to move the measuring device supporting base 15 upward along the guide posts 44, and the measuring placing plate 14b provided on the measuring device main body 14a moves to the supporting rail 9. The measuring device main body 14a measures the substrate weight by placing the substrate 2 when moving upward.

The weight measuring device 14 may measure the weight of the substrate 2 before and after the liquid resin is discharged, or may measure the weight while the liquid resin is being discharged onto the substrate 2. Based on this measured value, the variation of the liquid material discharge amount per one work by the dispenser 13 is suppressed within the allowable tolerance range. By the way, since the thickness of the package is as thin as about 0.8 mm, the liquid resin is required to be accurately measured. Although it varies depending on the product, it is required to keep the variation in package thickness within a tolerance of ± 5% or less. In particular, the work (substrate 2, silicon wafer 7) in which semiconductor chips are arranged in a matrix may have defective portions 2a and 7a (see FIGS. 12A and 12B) of the semiconductor chips. It is necessary to correct the discharge amount of the liquid resin discharged to the work by measuring the number of semiconductor chips mounted on this work and comparing it with the number of semiconductor chips assumed to have no defective portion of the semiconductor chips. That is, it is necessary to increase the discharge amount of the liquid resin to fill the space of the chip defect portion.

As an example, an example of detecting the number of semiconductor chip defects by measuring the weight of the substrate 2 will be described. When the substrate 2 is conveyed to the discharge position P on the support rail 9 by the chuck 10, the claw portion 10b opens the substrate 2 and operates the lifting cylinder 16 to raise the measuring device support base 15 and raise the weight measuring device. When the measurement mounting plate 14 b of 14 rises from the gap between the support rails 9, the substrate 2 is received and the weight of the substrate 2 is measured. At this time, the resin discharge amount is corrected by the weight difference between the case where all the semiconductor chips are present and the case where there is a defect. This makes it possible to increase the amount of the liquid resin corresponding to the volume of the semiconductor chip, which is insufficient, according to the number of defective semiconductor chips, which varies depending on the substrate 2. Therefore, it is possible to supply the optimal amount of liquid resin for each substrate 2. In addition, it is possible to prevent the molding after molding from becoming thin and the sealing resin from becoming uneven, and to prevent defective molding, so that uniform molding can be performed.

Next, after the weight measuring device 14 is moved downward by the lifting cylinder 16 to mount the substrate 2 on the support rail 9 again, the dispenser 13 discharges the liquid resin. When the liquid resin is discharged onto the substrate 2 by the dispenser 13 and the chuck 10 opens the substrate 2, the lifting cylinder 16 operates to raise the measuring device supporting base 15 and the measuring placing plate 14b is placed between the supporting rails 9. The substrate 2 is received when the substrate 2 is lifted from the gap and the weight of the substrate 2 is measured. Then, the resin amount of the liquid resin is calculated from the weight of the substrate before and after the application of the liquid resin, and the resin amount can be finely adjusted by comparing the target discharge amount and an allowable value based on the target discharge amount.

The method of detecting the defective portion of the semiconductor chip based on the work weight measurement will be specifically described below. The regular number of chips that can be mounted on the substrate 2 is A, the number of chips actually mounted on the substrate 2 is A ', the amount of resin M applied to the regular number of substrates is M, and one chip is replenished. Let m be the amount of resin, w be the weight per chip, and T be the weight of the substrate alone. Since the regular work weight W when there is no chip omission is given by W = (T + Aw), let W ′ = (T + Aw), where W ′ is the work weight that takes into account the chip omission measured by the weight measuring device 14. It is represented by'w). When the number A'of chips mounted on the workpiece is calculated from this equation, A '= (W'-T) / w Next, the number C of chips missing in the substrate 2 is calculated. C =
A-A 'Finally, when the correction resin amount M'is obtained, M' = M +
Cm 2, and the liquid resin having the corrected resin amount M ′ is measured and discharged onto the substrate 2 by the dispenser 13.

As the means for detecting the number of defects of the semiconductor chips mounted on the work described above, various means other than the work weight measurement can be adopted. For example, the substrate 2 and the camera 1
2 may be corrected based on a measurement result using any one of image processing performed by capturing an image, measuring the height of a semiconductor chip, and changing the reflectance of light obtained by irradiating the substrate 2 with light. good.

The plate thickness of the work may be measured before the resin is sealed, and the liquid material amount may be discharged in consideration of the variation in the plate thickness of the work. For example, the plate thickness of the substrate 2 may be measured before resin sealing, and the liquid resin amount may be discharged in consideration of the variation in the plate thickness of the substrate 2 measured by the dispenser 13. As a result, the tolerance of the work thickness after resin sealing (thickness of the total work) can be narrowed, and if the variation amount of the work sheet thickness is less than the maximum variation amount, the allowable tolerance of the liquid material discharge amount is widened. It also becomes possible.

Further, it is desirable that the dispenser 13 apply the liquid material such that the central portion of the substrate 2 has a higher liquid material application height or a larger liquid material amount than the peripheral portion. That is, when the substrate 2 is clamped by the molding die, the liquid resin applied to the central portion of the substrate 2 spreads to the peripheral portion to expel air to the outside, effectively preventing the entrainment of air and the occurrence of voids. This is possible (see FIG. 7).

Further, when the semiconductor chip is connected to the substrate 2 by wire bonding, it is difficult to fill the liquid resin between the wires having a narrow gap and voids are likely to occur. Therefore, it is preferable to apply the liquid resin by the dispenser 13 while vibrating the substrate 2 by the vibrator provided on the chuck 10 that holds the substrate 2. Further, when the liquid resin is discharged onto the substrate 2 by the dispenser 13, the liquid resin may be applied while being heated to a temperature at which the liquid resin is not cured. As a result, the flowability of the resin at the time of application can be improved, and the resin can enter the narrow gap between the wires of the semiconductor chip.

Further, the nozzle 13a of the dispenser 13
May be a single nozzle or multiple nozzles. However, since the liquid resin 45 uses a resin having a relatively high viscosity, the liquid resin is formed in a single stroke on the substrate 2 in consideration of the fact that the out-of-liquid shape is likely to be unstable and the measurement is likely to vary. It is preferable to discharge 45. Specifically, a coating pattern using a single nozzle is shown in FIG.
7 (e) to (e) and coating patterns using a multi-nozzle are shown in FIGS. 7 (f) to 7 (j). In this way, by applying the liquid resin 45 in an arbitrary pattern, the amount of resin movement at the time of compression molding is reduced, and the wire flow and disconnection of the wire-bonded semiconductor chip and the semiconductor chip defective portions 2a, 7a It is possible to prevent the resin transfer from being hindered and resulting in defective molding. Further, the liquid resin application time can be shortened, and air can easily escape from between the resins.
Further, the liquid resin 45 applied to the substrate 2 from the dispenser 13 is applied such that the resin application height is higher or the application amount is larger in the central portion of the substrate than in the peripheral portion without entraining air. Desirable for rolling resin. For example, FIGS. 7 (k) and (l) and FIGS. 7 (h) to (j)
It is possible to apply the resin in any shape so that the height of application of the resin in the central portion is high or the amount of application is large as shown in FIG. When a multi-nozzle is used, it is desirable to adjust the pitch between nozzles and the nozzle diameter so that air is not entrained at the interface between the liquid resins 45 discharged from the nozzles.

Further, as shown in FIG. 8 (a), the dispenser 13 is a flat nozzle 13 having a wide liquid material discharge port 13c.
b may be provided. As an example, the liquid material discharge port 13c may include a wide flat nozzle 13b having a cross section substantially equal to the cross section of the package resin portion. When the wide flat nozzle 13b is used, there is an advantage that air entrapment is small and coating time is short (coating can be performed by one scanning). Further, as shown in FIGS. 8B and 8C, the dispenser 13 may discharge the liquid resin 45 in a range equivalent to the area of the package portion 2b and a height 2c equivalent to the package portion 2b. in this case,
Since the height of the liquid resin 45 at the time of compression molding is low, the flow amount becomes small. Further, since the height of the liquid resin 45 is low, the mold clamping speed can be reduced without increasing the time required to compress the liquid resin (without exceeding the resin curing time). That is, since the flow velocity of the liquid resin can be slowed down, the wire flow (wire sweep) of the semiconductor chip hardly occurs. Further, since the amount of heat that the liquid resin 45 receives after the substrate 2 is placed on the lower mold 18 is uniform, the viscosity change of the liquid resin 45 becomes uniform, and it is possible to make it difficult to cause the wire sweep.

Next, an example of the liquid material discharging operation of the liquid material discharging device 8 will be described with reference to FIGS. In FIG. 3, the claw portion 10b of the chuck 10 that stands by at the end of the support rail 9 for the tip of the substrate 2 sent out from the magazine 3
Then, it is chucked and conveyed on the support rail 9 to the discharge position.
At this time, the camera 12 images the substrate 2 to detect the defective portion 2a of the semiconductor chip. The result of imaging the surface of the substrate is image-processed to detect the number of chip defects and dispenser 1
The liquid resin discharge amount of 3 is corrected. If the camera 12 does not capture an image of the substrate 2, the weight measuring device 14
Alternatively, the number of chip defect portions 2a may be detected by measuring the weight of the substrate 2 before applying the liquid resin.

Then, in FIG. 4, while the chuck 10 holds the substrate 2 at the discharge position, the dispenser 13 is moved to the X position.
While scanning in the −YZ direction, the amount of the liquid resin 45 corrected according to the defective portion of the semiconductor chip is discharged onto the substrate 2 in an arbitrary pattern. At this time, the vibrator provided on the claw portion 10b is vibrated to apply vibration to the substrate 2 and the liquid resin 4
5 may be applied.

Next, in FIG. 5, the chuck of the substrate 2 by the chuck 10 is opened and the lifting cylinder 16 is operated. The measuring device support 15 rises and the support rail 9
The mounting plate 14b for measurement rises from the interval and receives the substrate 2, and the weight of the substrate is measured by the measuring device main body 14a.
As a result, it is determined whether the variation in the discharge amount of the liquid resin 45 is within the allowable range, and if it is within the allowable range, the process proceeds to the compression molding process. When the measurement of the substrate weight is completed, the measurement mounting plate 14b is lowered and the substrate 2 is mounted on the support rail 9. Next, the loader 20 of the compression molding device 17 moves to the discharge position, receives the substrate 2 placed on the support rail 9, and conveys it to the lower mold 18.

Here, the operation of discharging the liquid resin and the operation of adjusting the discharge amount by the dispenser 13 will be described with reference to the flowchart shown in FIG. It should be noted that the chip defect portion 2a of the work (substrate 2) is previously determined by being imaged by the camera 12, and the target discharge amount of the liquid resin 45 is set for each work. First, the weight of the substrate 2 is measured before the liquid resin is discharged. When the substrate 2 is transported to the discharge position P of the support rail 9, the lifting cylinder 16
Is operated to raise the measurement mounting plate 14b to receive the substrate 2, and the weight of the substrate is measured by the measuring device main body 14a (step S1). When the weight of the substrate is measured, the lifting cylinder 16 is actuated to lower the measurement mounting plate 14b and transfer the substrate 2 to the support rail 9 again.

Next, the control unit of the liquid material discharge device 8 calculates the target discharge amount of the liquid resin 45 in consideration of the defective portion 2a of the semiconductor chip (step S2). In addition, a discharge command aiming at the target discharge weight of the liquid resin 45 is sent to the dispenser 13, and the dispenser 13 scans in the XYZ directions while applying the liquid resin 45 to an arbitrary application pattern (FIG. 7). (A) to (l), see FIG. 8 (b)), the ink is discharged onto the substrate 2 (steps S3 and S4). Next, the weight of the substrate 2 after the liquid resin 45 is discharged is measured. That is,
The elevating cylinder 16 is operated to raise the measurement mounting plate 14b, receive the substrate 2 from the support rail 9, and measure the substrate weight by the measuring device main body 14a (step S).
5). Here, the current discharge resin weight is calculated from the substrate weight before and after the discharge of the liquid resin 45 (step S6). Here, the dispenser 1 is configured so that the discharge weight of the liquid resin actually discharged from the dispenser 13 becomes the target discharge weight.
The ejection coefficient of No. 3 is updated (step S7). The ejection coefficient is represented by the ratio of the target ejection weight and the ejection command amount aimed at the target ejection weight.

Next, the ejection weight actually ejected onto the substrate 2 is compared with the target ejection weight to judge whether it is within the allowable value range. As an example of the allowable value range, the dispersion of the actually discharged discharge weight with respect to the target discharge weight has a tolerance of ± 5%.
It is determined whether or not the following (step S8). If the discharge weight is out of the allowable value range, the process proceeds to step S9, the correction discharge amount (= target discharge weight-discharge weight) is calculated, and the dispenser 13 is instructed to discharge the resin with the correction discharge amount. The operations of S3 to S8 are repeated. If the weight of the discharged resin is within the allowable range in step S8, the substrate 2 on which the liquid resin 45 is discharged is transferred to the compression molding device 17 by the loader 20, and the next substrate 2 is transferred to the discharge position P of the support rail 9. Then, the same liquid resin discharge operation and discharge amount adjustment operation are performed.

By the above-described adjustment operation of the resin discharge amount, it is possible to maintain a high liquid resin application accuracy (resin amount accuracy). In particular, the discharge amount due to wear of the nozzle or seal part of the dispenser (discharging device) that discharges the liquid resin, ambient temperature for resin sealing, air mixed in the liquid resin, variation in the viscosity of the liquid material itself, etc. Even if there is a factor such as a change, the variation in the discharge amount of the liquid resin can be suppressed within the allowable tolerance range and the molding quality can be maintained.

Next, another means for finely adjusting the variation in the discharge amount of the liquid resin by the dispenser 13 will be described with reference to FIG.
Will be described with reference to. In the present embodiment, based on the mold clamping movement information of the molding die and the plate thickness information of the substrate 2, it is possible to adjust the variation of the resin discharge amount per work piece by the dispenser 13 within the allowable tolerance. It is assumed that the board thickness of the substrate 2 is measured in advance and input to the control unit 49. The compression molding device 17 includes a servo motor 28 that opens and closes a molding die. The rotation amount of the servo motor 28 when the mold is clamped is measured by the motor pulse measuring unit 46. The completion of clamping of the molding die is recognized by detecting the mold clamping pressure by the mold clamping pressure detector 47. Specifically, the mold clamping pressure is adjusted by the movable tie bar 5
It is detected by a pressure sensor (load cell) incorporated in 0. When the value detected by the mold clamping pressure detector 47 exceeds the specified value, the motor driver 48 causes the servo motor 28 to move.
It is designed to stop driving. As a result, the amount of discharged resin is converted from the amount of rotation of the servo motor 28 by calculation, and is input to the control unit 49 of the liquid material discharge device 8. The control unit 49 outputs a command to increase or decrease the resin discharge amount of the dispenser 13 to finely adjust the discharge amount of the liquid resin.

For example, the thickness of the substrate 2 (substrate thickness + resin thickness)
When the value is thin, the amount of rotation of the servo motor 28 increases, so fine adjustment is performed to increase the amount of liquid resin compared to the amount of rotation calculated in advance. In addition, the thickness of the substrate 2 (substrate thickness +
When the resin thickness) is thick, the amount of rotation of the servo motor 28 decreases, and therefore the liquid resin is finely adjusted to reduce the amount of liquid resin compared to the amount of rotation calculated in advance. In addition, the liquid material discharge device 8
Can measure the weight of the liquid resin after adjustment by the weight measuring device 14 and input it to the control unit 49, so that the resin amount after adjustment of the resin discharge amount can be appropriately maintained. Since the compression molding operation and the resin supply operation to the next substrate 2 are performed in parallel, the liquid is discharged to the next substrate 2 with the adjusted discharge amount based on the mold clamping movement information and the plate thickness information of the substrate 2. A resin can be applied.

Since the adjustment based on the final thickness of the package can be performed by measuring the mold clamping position of the mold in this way, the coating accuracy is adjusted so that the variation in the discharge amount is within the allowable tolerance range. Can be improved.

Although various preferred embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and means for correcting the amount of resin discharged by the dispenser 13 is, for example, weight measurement or image processing. Other various means can be adopted, the coating pattern of the liquid resin on the work is arbitrary, and the liquid material can be a powder resin, a granular resin, etc. in addition to the liquid resin. The type of liquid material (material, viscosity, curing temperature, etc.) can be appropriately changed. Further, when a lead frame is used as the work, even if a tape is attached to the bottom of the lead frame in order to prevent the low viscosity liquid resin 45 from flowing down from the hole formed in the lead frame. good. Further, in the case of the rectangular work (substrate 2), as shown in FIG. 13A, when the package portion 2b is formed at one place (when the cavity is formed at one place in the molding die).
However, as shown in FIG. 13B, in order to reduce the warp of the work (substrate 2), the package portion 2
Needless to say, many modifications can be made without departing from the spirit of the invention, for example, b may be provided at a plurality of locations in the longitudinal direction (cavities on the molding die).

[0043]

According to the liquid material discharge device of the present invention, the liquid material amount is individually specified for each work based on the work weight measured by the measuring means and / or the liquid material amount for compression molding. The liquid material can be discharged onto the work by the discharging means, and the amount of the liquid material for compression molding individually specified for each work can be accurately applied in an arbitrary pattern. In particular, measure the number of semiconductor chips mounted on the work,
By comparing with the number of semiconductor chips that are assumed to have no defects, it is possible to increase the amount of liquid material for the volume of the missing semiconductor chips depending on the defective parts of the semiconductor chips that differ depending on the work. Therefore, the optimum amount of liquid material can be supplied individually. Further, the measuring means is capable of finely adjusting the variation of the discharge amount of the liquid material per work by the discharging means within the allowable tolerance range by measuring the weight of the work before and after discharging the liquid material. High-precision fine adjustment of the liquid material discharge amount can be performed for each time, the liquid material application accuracy can be maintained with high accuracy, and fluctuations in the package thickness can be reduced to reduce the tolerance. In particular,
There are factors such as wear of the nozzle of the discharge means that discharges the liquid material or the seal part, the ambient temperature for sealing, the air mixed in the liquid material, and the change in the discharge amount due to variations in the viscosity of the liquid material itself. However, it is possible to suppress the variation in the discharge amount of the liquid material within the allowable tolerance range. Further, when adjusting the variation of the liquid material discharge amount per work piece by the discharge means within the allowable tolerance range based on the mold clamping position information of the mold die and the work thickness information, the final molded product is obtained. Since the discharge amount can be adjusted based on the thickness of the liquid material, it is possible to improve the discharge accuracy of the liquid material so that the dispersion of the discharge amount falls within the allowable tolerance range. Further, when the plate thickness of the work is measured before resin sealing and the liquid material amount in consideration of the variation of the plate thickness of the work is discharged, the tolerance of the thickness of the total work can be narrowed, and the plate of the work can be reduced. If the thickness variation amount is less than or equal to the maximum variation amount, it is possible to widen the tolerance of the liquid material discharge amount. Further, the liquid material ejection device of the present invention can be replaced with a liquid resin ejection device as a powder resin or granular resin ejection device, and the same effect can be obtained. In addition, in a resin sealing device using a liquid material discharge device, it is possible to prevent molding failure due to thinning of the entire package after compression molding or uneven sealing resin. It is possible to perform quality molding.

[Brief description of drawings]

FIG. 1 is a plan view of a liquid material discharge device.

FIG. 2 is a front view of the liquid material discharge device of FIG.

FIG. 3 is an explanatory diagram of a liquid material discharging operation of the liquid material discharging device.

FIG. 4 is an explanatory diagram of a liquid material discharging operation of the liquid material discharging device.

FIG. 5 is an explanatory diagram of a liquid material discharging operation of the liquid material discharging device.

FIG. 6 is a flowchart showing a liquid material discharge amount adjusting operation.

FIG. 7 is an explanatory diagram illustrating a coating pattern of a liquid material on a work.

FIG. 8 is an explanatory diagram illustrating a nozzle shape of a dispenser and a liquid material application method.

FIG. 9 is a block diagram illustrating a liquid material discharge amount adjustment mechanism according to another example.

FIG. 10 is a plan view of a resin sealing device.

11 is a front view of the resin sealing device of FIG.

FIG. 12 is an explanatory diagram of a work.

FIG. 13 is an explanatory diagram showing a coating pattern of a liquid material according to another example.

[Explanation of symbols]

1 Work supply department 2 substrates 3 magazines 4 actuators 5 cutting board 6 Elevator mechanism 7 Silicon wafer 8 Liquid material discharge device 9 Support rail 10 chuck 11 Guide rail 12 cameras 13 dispensers 13a nozzle 14 Weight measuring device 14a Measuring device body 14b Measuring plate 15 Measuring device support 16 Lifting cylinder 17 Compression molding equipment 18 Lower mold 19 Upper mold 20 loader 21 release film 22 Film transport mechanism 22a Supply reel 22b Take-up reel 23a Upper movable platen 23b Lower movable platen 24 Fixed platen 25 screw shaft 26 nuts 27, 29, 40, 41 pulleys 42 Servo motor 30, 39 Timing belt 31 unloader 32 Molded product storage device 33 Moving table 34 Pickup device 35 storage magazine 36 Z-axis movement arm 37 X-axis movement arm 38 Y-axis moving arm 43 cylinder base 44 Guide post 45 Liquid resin 46 Motor pulse measuring unit 47 Mold clamping pressure detector 48 motor driver 49 control unit 50 movable tie bars

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Tomokazu Asakura             90 Kamitokuma, Tokura-cho, Hanashina-gun, Nagano             Inside Pick Yamada Co., Ltd. (72) Inventor Shusaku Tagami             90 Kamitokuma, Tokura-cho, Hanashina-gun, Nagano             Inside Pick Yamada Co., Ltd. (72) Inventor Hideaki Nakazawa             90 Kamitokuma, Tokura-cho, Hanashina-gun, Nagano             Inside Pick Yamada Co., Ltd. (72) Inventor Naoya Goto             90 Kamitokuma, Tokura-cho, Hanashina-gun, Nagano             Inside Pick Yamada Co., Ltd. F term (reference) 4F204 FA01 FB01 FB11 FB17 FF01                       FF23 FF48 FN25 FQ40                 5F061 AA01 BA03 CA05

Claims (13)

[Claims] 1. A liquid material ejecting device for ejecting a predetermined amount of a liquid material for compression molding onto a work, an ejecting means capable of ejecting the liquid material while scanning the work in the X, Y, and Z directions; And / or a measuring means capable of measuring the amount of liquid material discharged to the work, and the amount of liquid material specified individually for each work based on the work weight and / or the amount of liquid material measured by the measuring means. ,
A liquid material discharge device, which discharges a liquid material onto a work by a discharge means. 2. The number of semiconductor chip defects in a work is measured,
2. The liquid material ejecting apparatus according to claim 1, wherein the liquid material amount corresponding to the defective portion of the semiconductor chip is increased and corrected. 3. The number of defects of the semiconductor chip is determined by any one of weight measurement of a work, image processing performed by imaging the work, chip height measurement, and change in reflectance of light obtained by irradiating the work with light. The liquid material ejection device according to claim 2, wherein the liquid material ejection device is measured. 4. The measuring means measures the weight of the work before and after the liquid material is discharged, so that the dispersion of the liquid material discharge amount per work by the discharging means can be finely adjusted within an allowable tolerance range. The liquid material discharge device according to claim 1, wherein 5. The variation of the discharge amount of the liquid material per one work by the discharging means can be finely adjusted within an allowable tolerance range based on the mold clamping movement information of the molding die and the plate thickness information of the work. The liquid material discharge device according to claim 1, wherein 6. The liquid material ejecting apparatus according to claim 1, wherein the plate thickness of the work is measured before resin sealing, and the liquid material amount is ejected in consideration of variations in the plate thickness of the work. 7. The liquid material discharge according to claim 1, wherein the discharge means applies the liquid material such that the central portion of the work has a higher application height or a larger coating amount of the liquid material than the peripheral portion. apparatus. 8. The liquid material ejecting apparatus according to claim 1, wherein the liquid material is applied while vibrating the work when the liquid material is applied to the work by the ejecting means. 9. The liquid material discharge device according to claim 1, wherein when the liquid material is applied to the work by the discharge means, the liquid material is applied while being heated. 10. The liquid material discharge device according to claim 1, wherein the discharge means is a dispenser having a single nozzle or a multi-nozzle. 11. The liquid material discharge device according to claim 1, wherein the discharge means is a dispenser having a flat nozzle with a wide liquid material discharge port. 12. The method according to any one of claims 1 to 11.
A resin encapsulation device, characterized in that a liquid resin is supplied to a molded product by using the liquid material discharge device described in the paragraph (3) to perform compression molding. 13. A servo motor is provided as a drive source for opening and closing a mold die, and based on mold clamping movement information and workpiece thickness information obtained by measuring the amount of rotation of the servo motor during mold clamping. 13. The resin sealing device according to claim 12, wherein compression molding is performed by finely adjusting a liquid material discharge amount of the liquid material discharge device.