JP2003045952A5 - - Google Patents
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- Publication number
- JP2003045952A5 JP2003045952A5 JP2002142168A JP2002142168A JP2003045952A5 JP 2003045952 A5 JP2003045952 A5 JP 2003045952A5 JP 2002142168 A JP2002142168 A JP 2002142168A JP 2002142168 A JP2002142168 A JP 2002142168A JP 2003045952 A5 JP2003045952 A5 JP 2003045952A5
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- layer
- ceramic sprayed
- mounting apparatus
- sprayed layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims 11
- 239000000113 methacrylic resin Substances 0.000 claims 7
- 238000000034 method Methods 0.000 claims 7
- 238000004519 manufacturing process Methods 0.000 claims 6
- 239000007788 liquid Substances 0.000 claims 4
- 239000002994 raw material Substances 0.000 claims 4
- 230000002093 peripheral effect Effects 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims 1
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 1
- 229910010293 ceramic material Inorganic materials 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims 1
Claims (14)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002142168A JP2003045952A (en) | 2001-05-25 | 2002-05-16 | Holding apparatus, method of manufacturing same, and plasma processing apparatus |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001156489 | 2001-05-25 | ||
JP2001-156489 | 2001-05-25 | ||
JP2002142168A JP2003045952A (en) | 2001-05-25 | 2002-05-16 | Holding apparatus, method of manufacturing same, and plasma processing apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2003045952A JP2003045952A (en) | 2003-02-14 |
JP2003045952A5 true JP2003045952A5 (en) | 2005-09-15 |
Family
ID=26615694
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002142168A Pending JP2003045952A (en) | 2001-05-25 | 2002-05-16 | Holding apparatus, method of manufacturing same, and plasma processing apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2003045952A (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004082007A1 (en) | 2003-03-12 | 2004-09-23 | Tokyo Electron Limited | Substrate holding structure for semiconductor processing, and plasma processing device |
CN1310285C (en) * | 2003-05-12 | 2007-04-11 | 东京毅力科创株式会社 | Processing device |
JP4369765B2 (en) * | 2003-07-24 | 2009-11-25 | 京セラ株式会社 | Electrostatic chuck |
JP4421874B2 (en) * | 2003-10-31 | 2010-02-24 | 東京エレクトロン株式会社 | Plasma processing apparatus and plasma processing method |
KR100697557B1 (en) * | 2005-02-24 | 2007-03-21 | 주식회사 에이디피엔지니어링 | Plasma treatment device and temperature control plate manufacturing method |
JP2007005740A (en) * | 2005-06-23 | 2007-01-11 | Creative Technology:Kk | Structure for electrostatic chuck potential supply part and its manufacturing and reproduction method |
JP4942471B2 (en) * | 2005-12-22 | 2012-05-30 | 京セラ株式会社 | Susceptor and wafer processing method using the same |
CN102124820B (en) * | 2008-08-19 | 2014-09-10 | 朗姆研究公司 | Edge rings for electrostatic chucks |
JP6497248B2 (en) * | 2015-07-13 | 2019-04-10 | 住友電気工業株式会社 | Wafer holder |
US11911863B2 (en) | 2019-09-11 | 2024-02-27 | Creative Technology Corporation | Attachment and detachment device |
KR102387231B1 (en) * | 2020-07-17 | 2022-04-15 | 와이엠씨 주식회사 | Sealing method of dielectric of electrostatic chuck |
CN114981949A (en) * | 2020-12-24 | 2022-08-30 | 东华隆股份有限公司 | Electrostatic chuck and processing device |
JP7619862B2 (en) | 2021-03-30 | 2025-01-22 | 東京エレクトロン株式会社 | Method for polishing substrate placement table and substrate processing apparatus |
CN115295459A (en) * | 2022-08-26 | 2022-11-04 | 苏州众芯联电子材料有限公司 | Electrostatic chuck heating member manufacturing process, electrostatic chuck manufacturing process, and electrostatic chuck |
-
2002
- 2002-05-16 JP JP2002142168A patent/JP2003045952A/en active Pending
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