JP2002261439A - INSULATING SHEET AND ITS MANUFACTURING METHOD, WIRING BOARD AND ITS MANUFACTURING METHOD - Google Patents
INSULATING SHEET AND ITS MANUFACTURING METHOD, WIRING BOARD AND ITS MANUFACTURING METHODInfo
- Publication number
- JP2002261439A JP2002261439A JP2001055327A JP2001055327A JP2002261439A JP 2002261439 A JP2002261439 A JP 2002261439A JP 2001055327 A JP2001055327 A JP 2001055327A JP 2001055327 A JP2001055327 A JP 2001055327A JP 2002261439 A JP2002261439 A JP 2002261439A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- sheet
- insulating sheet
- insulating
- via conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 239000002184 metal Substances 0.000 claims abstract description 106
- 229910052751 metal Inorganic materials 0.000 claims abstract description 106
- 239000004020 conductor Substances 0.000 claims abstract description 70
- 239000011347 resin Substances 0.000 claims abstract description 31
- 229920005989 resin Polymers 0.000 claims abstract description 31
- 239000000843 powder Substances 0.000 claims abstract description 12
- 229910052737 gold Inorganic materials 0.000 claims abstract description 7
- 229910052709 silver Inorganic materials 0.000 claims abstract description 7
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 34
- 239000011888 foil Substances 0.000 claims description 15
- 229920001187 thermosetting polymer Polymers 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000008023 solidification Effects 0.000 abstract 1
- 238000007711 solidification Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 230000008569 process Effects 0.000 description 7
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229920001955 polyphenylene ether Polymers 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- -1 for example Polymers 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】
【課題】金属粉末および有機樹脂を含む導体ペーストを
充填したビア導体は抵抗が高いものであった。
【解決手段】有機樹脂を含有する絶縁シート２と、Ｃ
ｕ、Ａｇ、ＡｕおよびＡｌの群から選ばれる少なくとも
１種の金属からなり、金属箔か、もしくは導電性粉末を
含むペーストをシート化した金属製シート１との積層体
に対して、金属製シート１側からレーザー光を照射し
て、照射部の金属を加熱溶融させるとともに、その熱に
よって絶縁シート２の照射部と対向する箇所を熱分解さ
せて貫通孔３を形成し、溶融金属を冷却、凝固させて金
属体４を充填したビア導体５を形成する。
(57) Abstract: A via conductor filled with a conductor paste containing a metal powder and an organic resin has high resistance. An insulating sheet (2) containing an organic resin, C
a metal sheet made of at least one metal selected from the group consisting of u, Ag, Au, and Al, and a metal sheet or a metal sheet 1 laminated with a metal sheet 1 formed of a paste containing conductive powder. Laser light is irradiated from one side to heat and melt the metal in the irradiated portion, and the heat causes the portion of the insulating sheet 2 facing the irradiated portion to be thermally decomposed to form a through-hole 3 and cool the molten metal. The via conductor 5 filled with the metal body 4 is formed by solidification.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、絶縁シート、配線
基板、およびそれらの製造方法に関するものであり、こ
れらに形成するビア導体の低抵抗化の改良に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an insulating sheet, a wiring board, and a method of manufacturing the same, and more particularly, to an improvement in lowering resistance of a via conductor formed thereon.
【０００２】[0002]
【従来技術】近年、エポキシ樹脂、フェノール樹脂等の
熱硬化性樹脂を含む絶縁基板の表面に導体配線層を形成
した、いわゆるプリント基板が回路基板や半導体素子を
搭載したパッケージ等に適用されている。このようなプ
リント基板において導体配線層は、絶縁基板の表面に銅
箔を接着した後、これをエッチングして配線パターンを
形成する方法、または配線パターンに形成された銅箔を
絶縁基板に転写する方法、絶縁基板の表面に金属メッキ
法によって配線パターンを形成する方法等によって形成
されている。2. Description of the Related Art In recent years, a so-called printed circuit board having a conductor wiring layer formed on the surface of an insulating board containing a thermosetting resin such as an epoxy resin or a phenol resin has been applied to a package or the like on which a circuit board or a semiconductor element is mounted. . In such a printed circuit board, a conductor wiring layer is formed by bonding a copper foil to the surface of an insulating substrate and then etching the copper foil to form a wiring pattern, or transferring the copper foil formed on the wiring pattern to the insulating substrate. It is formed by a method, a method of forming a wiring pattern on a surface of an insulating substrate by a metal plating method, or the like.
【０００３】また、導体配線層の多層化に伴い、異なる
層の導体配線層同士をビア導体によって電気的に接続す
ることも行われているが、このビア導体は多層配線基板
の絶縁基板の所定の箇所にドリル等で貫通孔を開けた後
に、貫通孔内の内壁にメッキ等を施して形成されるのが
一般的である。[0003] In addition, with the increase in the number of conductor wiring layers, different conductor wiring layers are electrically connected to each other by via conductors. Is generally formed by drilling a through-hole at the location (1) with a drill or the like, and then plating the inner wall of the through-hole.
【０００４】ところが、上記のような方法では化学的な
メッキ処理を施すのに用いられる薬品が高価であり、処
理時間も長いなど生産性と経済性に難がある。また、貫
通孔内壁にメッキを施したビア導体は、多層構造におけ
る任意の層間に形成することが難しく、導体配線層の密
度を向上できないという問題がある。[0004] However, in the above-mentioned method, the chemicals used for performing the chemical plating treatment are expensive and the processing time is long. Further, it is difficult to form a via conductor in which plating is applied to the inner wall of the through hole between arbitrary layers in the multilayer structure, and there is a problem that the density of the conductor wiring layer cannot be improved.
【０００５】このような問題に対して、最近では、銀、
銅、ハンダなどの金属粉末と熱硬化性樹脂や活性剤とを
混合した導体ペーストを用い、これを絶縁基板の表面に
塗布したり、貫通孔内に充填し、積層して多層化する方
法が、特許第２６０３０５３号公報、特公平５−３９３
６０号公報、特開昭５５−１６００７２号公報等にて開
示されている。In response to such problems, recently, silver,
A method of using a conductive paste in which a metal powder such as copper and solder is mixed with a thermosetting resin or an activator and applying it to the surface of an insulating substrate or filling the through-hole and laminating to form a multilayer. Japanese Patent No. 2603053, Japanese Patent Publication No. 5-393
No. 60, JP-A-55-160072 and the like.
【０００６】さらに特開２０００−１９６２３５号公報
では、ポンチを用いて、金属シートと絶縁シートとを重
ねて同時にプレス加工することで貫通孔形成と貫通孔へ
の金属の充填が同時に行え、製造工程が簡略化でき、コ
ストの削減が図れることを開示している。Further, in Japanese Patent Application Laid-Open No. 2000-196235, a metal sheet and an insulating sheet are stacked and pressed simultaneously using a punch to form a through hole and fill a metal into the through hole at the same time. Can be simplified and cost can be reduced.
【０００７】[0007]
【発明が解決しようとする課題】しかしながら、従来の
導体ペーストの充填によるビア導体を形成する方法で
は、導電性ペースト中の熱硬化性樹脂成分の量が多く、
またビア導体中において金属粉末間の接触性が充分でな
いために、ビア導体の抵抗が高いという問題があった。However, in the conventional method of forming a via conductor by filling a conductive paste, the amount of the thermosetting resin component in the conductive paste is large,
Further, there is a problem that the resistance of the via conductor is high due to insufficient contact between the metal powders in the via conductor.
【０００８】また、ペースト中に銅などの粉末ととも
に、Ｐｂ−Ｓｎなどの低融点半田を含有させて銅粉末間
を半田によって接続させてビア導体の導電率を高めるこ
とも提案されているが、ビア導体中に半田が存在する
と、リフロー工程や信頼性試験時に高温に加熱された
時、ビア導体中の半田が溶融して配線層との接続状態が
変化し導電性が劣化するという問題があった。[0008] It has also been proposed that the paste contains a low melting point solder such as Pb-Sn together with a powder such as copper so that the copper powders are connected by solder to increase the conductivity of the via conductor. If solder is present in the via conductor, when heated to a high temperature during the reflow process or reliability test, the solder in the via conductor will melt and the connection state with the wiring layer will change, resulting in a problem that the conductivity will deteriorate. Was.
【０００９】さらに、特開２０００−１９６２３５号の
方法では、ポンチで金属シートを打ち抜く場合の径には
限界があり、これらの方法で製造された絶縁シートは高
密度の配線基板への使用は困難であった。Further, in the method disclosed in Japanese Patent Application Laid-Open No. 2000-196235, there is a limit in the diameter when a metal sheet is punched with a punch, and it is difficult to use an insulating sheet manufactured by these methods on a high-density wiring board. Met.
【００１０】従って、本発明はこのような欠点を解消
し、低抵抗のビア導体を有する絶縁シートとその製造方
法、さらに、少なくとも有機樹脂を含有する絶縁基板
と、導体材料を充填してなる低抵抗のビア導体を具備す
る配線基板とその製造方法にを提供することを目的とす
るものである。Therefore, the present invention solves such a drawback, and provides an insulating sheet having a low-resistance via conductor and a method of manufacturing the same. Furthermore, the present invention provides an insulating substrate containing at least an organic resin and a low-filled conductive material. It is an object of the present invention to provide a wiring board having a via conductor of resistance and a method for manufacturing the same.
【００１１】[0011]
【課題を解決するための手段】本発明者は、ビア導体の
低抵抗化を図るための方法について検討を重ねた結果、
レーザー光によって局部的な加熱が可能であることか
ら、このレーザー光を用いて絶縁シートと金属シートの
積層体にレーザー光を照射すると、金属シートの局部的
な溶融とともに絶縁シートの局部的な熱分解によって貫
通孔が形成され、溶融金属が貫通孔内に充填されること
からビア導体が形成されることを見いだし、本発明に至
った。The inventor of the present invention has studied a method for reducing the resistance of a via conductor, and as a result,
Since local heating is possible with the laser light, when the laser light is used to irradiate the laminate of the insulating sheet and the metal sheet with the laser light, the local melting of the metal sheet and the local heat of the insulating sheet occur. The present inventors have found that a through-hole is formed by decomposition, and a via conductor is formed because the molten metal is filled in the through-hole.
【００１２】即ち、本発明の絶縁シートは、少なくとも
有機樹脂を含むものであって、貫通孔内に、溶融後、凝
固した金属体が充填されたビア導体を具備することを特
徴とするものである。That is, the insulating sheet of the present invention contains at least an organic resin, and is provided with a via conductor filled with a molten and solidified metal body in a through hole. is there.
【００１３】また、本発明の絶縁シートの製造方法は、
有機樹脂を含有する絶縁シートと金属製シートとの積層
体に対して、金属製シート側からレーザー光を照射し
て、照射部の金属を加熱溶融させるとともに、その熱に
よって前記絶縁シートの照射部と対向する箇所を熱分解
させて貫通孔を形成し、該貫通孔に前記溶融金属を充填
させた後、溶融金属を冷却、凝固させることを特徴とす
るものである。[0013] The method for producing an insulating sheet according to the present invention comprises:
The laminated body of the insulating sheet and the metal sheet containing the organic resin is irradiated with laser light from the metal sheet side to heat and melt the metal of the irradiated portion, and the heat is applied to the irradiated portion of the insulating sheet. A through hole is formed by thermally decomposing a portion opposed to the above, and after filling the molten metal into the through hole, the molten metal is cooled and solidified.
【００１４】さらに、本発明の配線基板は、有機樹脂を
含む絶縁層と、該絶縁層の表面に形成された導体配線層
と、少なくとも２つの導体配線層間を電気的に接続する
ために、前記絶縁層を貫通して形成されたビア導体とを
具備し、前記ビア導体が、溶融後、凝固した金属体が充
填されてなることを特徴とするものである。Further, in order to electrically connect the insulating layer containing an organic resin, the conductive wiring layer formed on the surface of the insulating layer, and at least two conductive wiring layers, the wiring board according to the present invention is provided. And a via conductor formed through the insulating layer, wherein the via conductor is filled with a solidified metal body after melting.
【００１５】かかる配線基板を製造する方法として、熱
硬化性樹脂を含有するＢステージの絶縁シートと金属製
シートとの積層体に対して、金属製シート側からレーザ
ー光を照射して、照射部の金属を溶融させるとともに、
その熱によって前記絶縁シートの照射部と対向する箇所
を熱分解させて貫通孔を形成し、該貫通孔に前記溶融金
属を充填させた後、溶融金属を冷却、凝固させてビア導
体を有する絶縁シートを作製する工程と、該ビア導体を
有するＢステージ状態の絶縁シートの表面に導体配線層
を形成する工程と、該ビア導体および導体配線層を形成
した絶縁シートを熱硬化する工程と、を具備することを
特徴とするものである。As a method of manufacturing such a wiring board, a laminated body of a B-stage insulating sheet containing a thermosetting resin and a metal sheet is irradiated with a laser beam from the metal sheet side. While melting the metal of
The heat causes the portion of the insulating sheet facing the irradiated portion to be thermally decomposed to form a through-hole. After filling the through-hole with the molten metal, the molten metal is cooled and solidified to form an insulation having a via conductor. A step of producing a sheet, a step of forming a conductor wiring layer on the surface of the insulating sheet in a B-stage state having the via conductor, and a step of thermosetting the insulating sheet having the via conductor and the conductor wiring layer formed thereon. It is characterized by having.
【００１６】上記の金属製シートとしては、金属箔か、
もしくは導電性粉末を含むペーストをシート化したもの
が用いられ、前記金属製シートの厚みは、絶縁シートの
厚みの１．５倍以上であることが望ましい。The metal sheet may be a metal foil,
Alternatively, a sheet made of a paste containing conductive powder is used, and the thickness of the metal sheet is desirably 1.5 times or more the thickness of the insulating sheet.
【００１７】またビア導体を形成する金属としては、Ｃ
ｕ、Ａｇ、ＡｕおよびＡｌの群から選ばれる少なくとも
１種であることが望ましい。The metal forming the via conductor may be C
It is desirable that at least one selected from the group consisting of u, Ag, Au and Al.
【００１８】[0018]
【発明の実施の形態】本発明のビア導体を有する絶縁シ
ートの製造方法の一例を図１に示した。図１に示すよう
に、所定の厚みの金属シート１と未硬化または半硬化し
た絶縁シート２を重ね合わせる（ａ）。次に、金属シー
ト１側からレーザ光を金属シート１が局所的に加熱溶融
するようなエネルギーで照射する（ｂ）。この照射によ
って照射部の金属を加熱溶融させるとともに、その熱に
よって絶縁シート２の照射部と対向する箇所を熱分解さ
せて貫通孔３を形成し、貫通孔３に溶融し、凝固して金
属体４を充填した後（ｃ）、金属シート１を剥がすこと
によってビア導体５を有する絶縁シート２を形成するこ
とができる（ｄ）。FIG. 1 shows an example of a method for manufacturing an insulating sheet having via conductors according to the present invention. As shown in FIG. 1, a metal sheet 1 having a predetermined thickness and an uncured or semi-cured insulating sheet 2 are overlaid (a). Next, a laser beam is irradiated from the side of the metal sheet 1 with energy such that the metal sheet 1 is locally heated and melted (b). The irradiation heats and melts the metal of the irradiated portion, and the heat causes the portion of the insulating sheet 2 facing the irradiated portion to be thermally decomposed to form the through-hole 3, which is melted and solidified to form the metal body. After filling the metal sheet 4, the insulating sheet 2 having the via conductor 5 can be formed by peeling off the metal sheet 1 (d).
【００１９】なお、この金属充填状態で、充填金属体４
と絶縁シート２間に隙間が発生する場合、絶縁シート２
を加熱硬化して絶縁シート２中の樹脂を移動させつつ硬
化収縮させることによって隙間を埋めることもできる。In this state of metal filling, the filled metal body 4
If there is a gap between the insulating sheet 2 and the insulating sheet 2,
Can be filled by subjecting the resin in the insulating sheet 2 to cure and shrink while being heated and cured.
【００２０】ここで用いる金属シート１は、金属箔もし
くは導電性粉末を含むペーストをシート化したものが用
いられる。金属箔および導電性粉末を構成する金属とし
ては、Ａｕ、Ａｇ、ＣｕおよびＡｌの群から選ばれる少
なくとも１種の低抵抗金属が望ましい。具体的には、上
記の純な金属およびそれらの合金あるいは混合物、さら
には上記から選ばれる金属に他の金属を被覆したものを
用いることができる。コスト、抵抗値の観点から銅箔が
最も好適である。The metal sheet 1 used here is a sheet made of a paste containing a metal foil or a conductive powder. As the metal constituting the metal foil and the conductive powder, at least one low-resistance metal selected from the group consisting of Au, Ag, Cu and Al is desirable. Specifically, the above-mentioned pure metals and their alloys or mixtures, and those obtained by coating a metal selected from the above with another metal can be used. Copper foil is most preferred from the viewpoint of cost and resistance value.
【００２１】なお、導電性粉末を含むペーストをシート
化する場合、バインダー成分としてペースト中に樹脂な
どを配合する場合があり、金属シート中にこの樹脂分が
含まれているが、レーザー照射によってこの樹脂分は分
解されるために、ビア導体中に樹脂分が混入することは
ない。When the paste containing the conductive powder is formed into a sheet, a resin or the like may be blended in the paste as a binder component, and the resin is contained in the metal sheet. Since the resin component is decomposed, the resin component does not mix into the via conductor.
【００２２】また、絶縁シート２は、少なくとも熱硬化
性樹脂を含む絶縁材料から構成され、具体的には、熱硬
化性樹脂としては、例えば、ＰＰＥ（熱硬化型ポリフェ
ニレンエーテル）、ＢＴレジン（ビスマレイミドトリア
ジン）、エポキシ樹脂、ポリイミド樹脂、フッ素樹脂、
フェノール樹脂等の樹脂が望ましく、とりわけ原料とし
てガラス転移点が１８０℃以上の熱硬化性樹脂であるこ
とが望ましい。また、この有機樹脂中には、基板全体の
強度を高めるために、フィラー成分を複合化させること
もできる。フィラーとしては、ＳｉＯ2、Ａｌ2Ｏ3、Ｚ
ｒＯ2、ＴｉＯ2、ＡｌＮ、ＳｉＣ、ＢａＴｉＯ3、Ｓｒ
ＴｉＯ3、ゼオライト、ＣａＴｉＯ3等の無機質フィラー
が好適に使用される。また、ガラスやアラミド樹脂から
なる不織布、織布などに上記樹脂を含浸させて用いても
よい。このようにフィラー成分と複合化する場合、有機
樹脂とフィラーとは体積比率で３０：７０〜７０：３０
の比率で複合化することが望ましい。The insulating sheet 2 is made of an insulating material containing at least a thermosetting resin. Specifically, as the thermosetting resin, for example, PPE (thermosetting polyphenylene ether), BT resin (bis Maleimide triazine), epoxy resin, polyimide resin, fluororesin,
A resin such as a phenol resin is desirable, and in particular, a thermosetting resin having a glass transition point of 180 ° C. or more is desirable as a raw material. In addition, a filler component can be compounded in the organic resin in order to increase the strength of the entire substrate. As the filler, SiO 2 , Al 2 O 3 , Z
rO 2 , TiO 2 , AlN, SiC, BaTiO 3 , Sr
Inorganic fillers such as TiO 3 , zeolite and CaTiO 3 are preferably used. Further, a nonwoven fabric or a woven fabric made of glass or aramid resin may be used by impregnating the above resin. When compounding with the filler component as described above, the organic resin and the filler are in a volume ratio of 30:70 to 70:30.
It is desirable to compound at a ratio of
【００２３】また、絶縁シート２の厚みｔに対して、金
属シート１の厚みが１．５倍以上であることが望まし
い。これは、金属シート１の厚みが１．５倍よりも薄い
とビア導体５を形成する程の金属体が得られにくい。つ
まり、金属はレーザー光照射により溶融だけでなく昇華
する分があるためにすべてを満たすには足りなくなるた
めである。レーザー照射するレーザー装置としては、通
常に使われているＣＯ2レーザーやＹＡＧレーザーが使
用できる。レーザー光によっては、金属シート１表面で
反射して溶融しにくい場合もあるが、その場合には金属
シート１上に絶縁膜つけて、加工しやすくすることもで
きる。It is desirable that the thickness of the metal sheet 1 is 1.5 times or more the thickness t of the insulating sheet 2. If the thickness of the metal sheet 1 is smaller than 1.5 times, it is difficult to obtain a metal body enough to form the via conductor 5. In other words, the metal is not sufficient to satisfy all of the conditions because the metal is not only melted but also sublimated by the laser beam irradiation. As a laser device for laser irradiation, a commonly used CO 2 laser or YAG laser can be used. Depending on the laser light, there are cases where the laser light is reflected on the surface of the metal sheet 1 and hardly melted. In such a case, an insulating film may be provided on the metal sheet 1 to facilitate processing.
【００２４】なお、レーザー照射条件としては、金属シ
ート２を金属が溶融する程度に加熱できる条件であれ
ば、特にその条件を限定するものではないが、例えば、
レーザーエネルギー３〜５０ｍｊ、パルス幅２５〜１０
０μｓｅｃのレーザー光を２ショット以上照射するのが
適当である。The laser irradiation condition is not particularly limited as long as the metal sheet 2 can be heated to such an extent that the metal is melted.
Laser energy 3-50mj, pulse width 25-10
It is appropriate to irradiate two or more shots of 0 μsec laser light.
【００２５】次に、上記のビア導体５を有する絶縁シー
ト２の製造方法に基づき、配線基板を製造する方法につ
いて説明する。図２（ａ）に示す未硬化または半硬化状
態の軟質の絶縁シート１１には、上記の方法によって溶
融、凝固された金属体を充填されたビア導体１２が形成
されている。Next, a method of manufacturing a wiring board based on the method of manufacturing the insulating sheet 2 having the via conductors 5 will be described. In the uncured or semi-cured soft insulating sheet 11 shown in FIG. 2A, a via conductor 12 filled with a metal body melted and solidified by the above-described method is formed.
【００２６】次に、この絶縁シート１１の表面に、導体
配線層１３を形成する。この導体配線層１３の形成は、
絶縁シート１１の表面に金属箔を貼り付けた後、エッチ
ング処理して回路パターンを形成する方法、絶縁シート
１１表面にレジストを形成して、メッキにより金属層を
形成する方法、転写シート表面に金属箔を貼り付けた
後、エッチング処理して回路パターンを形成した後、こ
の金属箔の回路パターンを絶縁シート１１表面に転写さ
せる方法、等が挙げられるが、この中でも、絶縁シート
１１をエッチングやメッキ液などに浸漬する必要がな
く、ビア導体１２内への薬品の侵入を防止する上では、
転写法が最も望ましい。Next, a conductor wiring layer 13 is formed on the surface of the insulating sheet 11. The formation of the conductor wiring layer 13 is as follows.
A method of forming a circuit pattern by attaching a metal foil to the surface of the insulating sheet 11 and then performing an etching process; a method of forming a resist on the surface of the insulating sheet 11 and forming a metal layer by plating; After the foil is attached, a circuit pattern is formed by performing an etching process, and then the circuit pattern of the metal foil is transferred to the surface of the insulating sheet 11. Among these methods, the insulating sheet 11 is etched or plated. It is not necessary to immerse the via conductor 12 in a liquid or the like.
The transfer method is most desirable.
【００２７】そこで、転写法による導体配線層１３を例
にして以下に説明する。図２（ｂ）に示すように、転写
シート１４の表面に、金属箔からなる導体配線層１３を
形成する。この導体配線層１３は、転写シート１４の表
面に金属箔を接着剤によって接着した後、この金属箔の
表面にレジストを回路パターン状に塗布した後、エッチ
ング処理およびレジスト除去を行って形成される。この
時、金属箔からなる導体配線層１３露出面は、エッチン
グ等により表面粗さ（Ｒａ）０．１〜５μｍ、特に０．
２〜４μｍ程度に粗化されていることが望ましい。The following is an explanation of the conductor wiring layer 13 formed by the transfer method as an example. As shown in FIG. 2B, on the surface of the transfer sheet 14, the conductor wiring layer 13 made of a metal foil is formed. The conductor wiring layer 13 is formed by bonding a metal foil to the surface of the transfer sheet 14 with an adhesive, applying a resist on the surface of the metal foil in a circuit pattern, and performing an etching process and a resist removal. . At this time, the exposed surface of the conductor wiring layer 13 made of a metal foil has a surface roughness (Ra) of 0.1 to 5 μm, particularly 0.1 μm by etching or the like.
It is desirable that the surface is roughened to about 2 to 4 μm.
【００２８】次に、図２（ｃ）に示すように、導体配線
層１３が形成された転写シート１４をビア導体１２が形
成された軟質の絶縁シート１１の表面に位置合わせして
加圧積層した後、転写シート１４を剥がして導体配線層
１３を絶縁シート１１に転写させることにより一単位の
配線シートａが形成される。Next, as shown in FIG. 2C, the transfer sheet 14 on which the conductor wiring layer 13 has been formed is positioned on the surface of the soft insulating sheet 11 on which the via conductor 12 has been formed, and pressure-laminated. After that, the transfer sheet 14 is peeled off, and the conductor wiring layer 13 is transferred to the insulating sheet 11, whereby one unit of the wiring sheet a is formed.
【００２９】図２（ｄ）に示すように、絶縁シート１１
が軟質状態であることから、導体配線層１３は、絶縁シ
ート１１の表面に埋設され、実質的に絶縁シート１１表
面と導体配線層１３の表面が同一平面となるように加圧
積層する。この時の加圧積層条件としては、圧力２０ｋ
ｇ／ｃｍ2以上、温度６０〜１４０℃が適当である。As shown in FIG. 2D, the insulating sheet 11
Is in a soft state, the conductor wiring layer 13 is buried in the surface of the insulating sheet 11 and is laminated under pressure such that the surface of the insulating sheet 11 and the surface of the conductor wiring layer 13 are substantially coplanar. The pressure laminating condition at this time is a pressure of 20 k.
g / cm 2 or more and a temperature of 60 to 140 ° C. are suitable.
【００３０】そして、上記のようにして作製された一単
位の配線シートａおよび同様にして作製された配線シー
トｂ、ｃを図２（ｅ）に示すように積層圧着し、所定の
温度に加熱することにより絶縁シート中の熱硬化性樹脂
を完全硬化させることにより多層化された配線基板を作
製することができる。Then, one unit of the wiring sheet a produced as described above and the wiring sheets b and c produced in the same manner are laminated and pressed as shown in FIG. 2E, and heated to a predetermined temperature. By doing so, the thermosetting resin in the insulating sheet is completely cured, whereby a multilayered wiring board can be manufactured.
【００３１】上記の製造方法によれば、絶縁シートへの
貫通孔形成や積層化と、導体配線層の形成工程を並列的
に行うことができるために、配線基板における製造時間
を大幅に短縮することができる。According to the above-described manufacturing method, since the process of forming and laminating through holes in the insulating sheet and the process of forming the conductor wiring layer can be performed in parallel, the manufacturing time in the wiring board is greatly reduced. be able to.
【００３２】[0032]
【実施例】実施例１ 絶縁シートとして、熱硬化型ポリフェニレンエーテル樹
脂４０体積％と、シリカを６０体積％からなるＢステー
ジの厚さ３０μｍの絶縁シートを準備した。また、金属
シートとして厚さ５０μｍの銅箔シートを準備した。Example 1 As an insulating sheet, a 30-μm-thick B-stage insulating sheet composed of 40% by volume of a thermosetting polyphenylene ether resin and 60% by volume of silica was prepared. Further, a copper foil sheet having a thickness of 50 μm was prepared as a metal sheet.
【００３３】そして、上記絶縁シートに上記金属シート
を重ね合わせて、レーザーエネルギー２５ｍｊ、パルス
幅、５０μｓｅｃのレーザー光を１５ショット照射し
た。その結果、金属シートが溶融し絶縁シートの一部の
熱分解によって形成された貫通孔内に、溶融した金属が
充填された。形成されたビア導体の表裏面に金属箔から
なる配線回路層を形成した後、２００℃で２時間加熱硬
化して単層の配線基板を作製した。配線基板の両配線回
路層間の抵抗を測定した結果、２．５×１０−６Ω・ｃ
ｍと非常に低抵抗のビア導体を形成することができた。Then, the metal sheet was superimposed on the insulating sheet, and 15 shots of a laser beam having a laser energy of 25 mj, a pulse width of 50 μsec were irradiated. As a result, the molten metal was filled in the through holes formed by melting the metal sheet and thermally decomposing a part of the insulating sheet. After forming a wiring circuit layer made of metal foil on the front and back surfaces of the formed via conductor, the wiring conductor layer was cured by heating at 200 ° C. for 2 hours to produce a single-layer wiring board. As a result of measuring the resistance between both wiring circuit layers of the wiring board, 2.5 × 10 −6 Ω · c
Thus, a via conductor having a very low resistance of m was formed.
【００３４】実施例２ 絶縁シートとして、熱硬化型ポリフェニレンエーテル樹
脂４０体積％と、シリカを６０体積％からなるＢステー
ジの厚さ５０μｍの絶縁シートを準備した。金属シート
として平均粒径３．８μｍの銅粉にエポキシ樹脂を１０
重量％添加したスラリーをドクターブレード法によって
厚さ１００μｍに成形し、乾燥したものを準備した。Example 2 As the insulating sheet, a B-stage 50 μm-thick insulating sheet composed of 40% by volume of a thermosetting polyphenylene ether resin and 60% by volume of silica was prepared. Epoxy resin is added to copper powder having an average particle size of 3.8 μm as a metal sheet.
The slurry to which 100 wt% was added was formed into a thickness of 100 μm by a doctor blade method, and a dried product was prepared.
【００３５】そして、上記絶縁シートに上記金属シート
を重ね合わせて、レーザーエネルギー１０ｍｊ、パルス
幅、５０μｓｅｃのレーザー光を８ショット照射した。
その結果、金属シートが溶融し絶縁シートの一部の熱分
解によって形成された貫通孔内に、溶融した金属が充填
された。形成されたビア導体の表裏面に金属箔からなる
配線回路層を形成した後、２００℃で２時間加熱硬化し
て単層の配線基板を作製した。配線基板の両配線回路層
間の抵抗を測定した結果、５．１×１０−６Ω・ｃｍと
低抵抗のビア導体を形成することができた。Then, the metal sheet was overlaid on the insulating sheet, and a laser beam having a laser energy of 10 mj, a pulse width of 50 μsec and eight shots was irradiated.
As a result, the molten metal was filled in the through holes formed by melting the metal sheet and thermally decomposing a part of the insulating sheet. After forming a wiring circuit layer made of metal foil on the front and back surfaces of the formed via conductor, the wiring conductor layer was cured by heating at 200 ° C. for 2 hours to produce a single-layer wiring board. As a result of measuring the resistance between both wiring circuit layers of the wiring board, a via conductor having a low resistance of 5.1 × 10 −6 Ω · cm was able to be formed.
【００３６】比較例 実施例１で使用した絶縁シートにレーザー比較によって
貫通孔を形成し、この貫通孔に、平均粒径３．８μｍの
銅粉にエポキシ樹脂を１０重量％添加した導体ペースト
をスクリーン印刷法によって充填した。その後、形成さ
れたビア導体の表裏面に金属箔からなる配線回路層を形
成した後、２００℃で２時間加熱硬化して単層の配線基
板を作製した。配線基板の両配線回路層間の抵抗を測定
した結果、８．６×１０-6Ω・ｃｍと本発明に比較して
ビア導体の抵抗が高いものであった。Comparative Example A through hole was formed in the insulating sheet used in Example 1 by laser comparison, and a conductive paste obtained by adding 10% by weight of an epoxy resin to copper powder having an average particle size of 3.8 μm was screened in the through hole. Filled by printing method. Thereafter, a wiring circuit layer made of metal foil was formed on the front and back surfaces of the formed via conductor, and then heated and cured at 200 ° C. for 2 hours to produce a single-layer wiring board. As a result of measuring the resistance between both wiring circuit layers of the wiring board, the resistance of the via conductor was 8.6 × 10 −6 Ω · cm, which was higher than that of the present invention.
【００３７】[0037]
【発明の効果】以上詳述したように、本発明によれば、
ビア導体の形成を簡略化することができ、さらに低抵抗
のビア導体を任意の箇所に形成できることから高密度で
信頼性の高い配線基板を提供することができる。As described in detail above, according to the present invention,
Since the formation of the via conductor can be simplified and the low-resistance via conductor can be formed at an arbitrary position, a high-density and highly reliable wiring board can be provided.
【図１】本発明におけるビア導体を含有する絶縁シート
の製造工程の概略断面図である。FIG. 1 is a schematic cross-sectional view of a manufacturing process of an insulating sheet containing a via conductor according to the present invention.
【図２】本発明における配線基板の製造方法を説明する
ための工程図である。FIG. 2 is a process diagram illustrating a method for manufacturing a wiring board according to the present invention.
１ 金属シート ２ 絶縁シート ３ 貫通孔 ４ 金属体 ５ ビア導体 DESCRIPTION OF SYMBOLS 1 Metal sheet 2 Insulation sheet 3 Through hole 4 Metal body 5 Via conductor
フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｂ２３Ｋ 101:42 Ｂ２３Ｋ 101:42 Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat II (reference) B23K 101: 42 B23K 101: 42
Claims (12)
縁シートを貫通する貫通孔内に、溶融後、凝固した金属
体が充填されたビア導体を具備することを特徴とする絶
縁シート。1. An insulating sheet containing an organic resin, comprising a via conductor filled with a molten and solidified metal body in a through-hole penetrating the insulating sheet.
ｌの群から選ばれる少なくとも１種であることを特徴と
する請求項１記載の絶縁シート。2. The method according to claim 1, wherein said metal body is Cu, Ag, Au and A.
2. The insulating sheet according to claim 1, wherein the insulating sheet is at least one member selected from the group of l.
ートとの積層体に対して、金属製シート側からレーザー
光を照射して、照射部の金属を加熱溶融させるととも
に、その熱によって前記絶縁シートの照射部と対向する
箇所を熱分解させて貫通孔を形成し、該貫通孔に前記溶
融金属を充填させた後、溶融金属を冷却、凝固させるこ
とを特徴とする絶縁シートの製造方法。3. A laminate of an insulating sheet containing an organic resin and a metal sheet is irradiated with a laser beam from the metal sheet side to heat and melt the metal in the irradiated portion, and the heat causes the metal to melt. A method for producing an insulating sheet, comprising: thermally decomposing a portion of an insulating sheet facing an irradiation section to form a through-hole; filling the through-hole with the molten metal; and cooling and solidifying the molten metal. .
導電性粉末を含むペーストをシート化したものである請
求項３記載の絶縁シートの製造方法。4. The method for producing an insulating sheet according to claim 3, wherein the metal sheet is formed by sheeting a paste containing a metal foil or a conductive powder.
ＡｕおよびＡｌの群から選ばれる少なくとも１種である
ことを特徴とする請求項３または請求項２記載の絶縁シ
ートの製造方法。5. The method according to claim 1, wherein the metal of the metal sheet is Cu, Ag,
3. The method for producing an insulating sheet according to claim 3, wherein the method is at least one selected from the group consisting of Au and Al.
厚みの１．５倍以上であることを特徴とする請求項３乃
至請求項６のいずれか記載の絶縁シートの製造方法。6. The method of manufacturing an insulating sheet according to claim 3, wherein the thickness of the metal sheet is at least 1.5 times the thickness of the insulating sheet.
に形成された導体配線層と、少なくとも２つの導体配線
層間を電気的に接続するために、前記絶縁層を貫通して
形成されたビア導体とを具備する配線基板において、前
記ビア導体が、溶融後、凝固した金属体が充填されてな
ることを特徴とする配線基板。7. An insulating layer containing an organic resin, a conductive wiring layer formed on the surface of the insulating layer, and a conductive wiring layer formed on the surface of the insulating layer, the conductive wiring layer being formed through the insulating layer to electrically connect at least two conductive wiring layers. A wiring board, comprising: a via conductor that has been melted and then filled with a solidified metal body.
Ａｌ群から選ばれる少なくとも１種によって形成されて
なることを特徴とする請求項７記載の配線基板。8. The wiring board according to claim 7, wherein said via conductor is formed of at least one selected from the group consisting of Au, Ag, Cu and Al.
シートと金属製シートとの積層体に対して、金属製シー
ト側からレーザー光を照射して、照射部の金属を溶融さ
せるとともに、その熱によって前記絶縁シートの照射部
と対向する箇所を熱分解させて貫通孔を形成し、該貫通
孔に前記溶融金属を充填させた後、溶融金属を冷却、凝
固させてビア導体を有する絶縁シートを作製する工程
と、該ビア導体を有するＢステージ状態の絶縁シートの
表面に導体配線層を形成する工程と、前記ビア導体およ
び前記導体配線層を形成した絶縁シートを熱硬化する工
程と、を具備することを特徴とする配線基板の製造方
法。9. A laminated body of a B-stage insulating sheet containing a thermosetting resin and a metal sheet is irradiated with laser light from the metal sheet side to melt the metal in the irradiated portion. The heat causes the portion of the insulating sheet facing the irradiated portion to be thermally decomposed to form a through-hole. After filling the through-hole with the molten metal, the molten metal is cooled and solidified to form an insulation having a via conductor. A step of producing a sheet, a step of forming a conductor wiring layer on the surface of the insulating sheet in a B-stage state having the via conductor, and a step of thermosetting the insulating sheet formed with the via conductor and the conductor wiring layer, A method for manufacturing a wiring board, comprising:
は導電性粉末を含むペーストをシート化したものである
請求項９記載の配線基板の製造方法。10. The method for manufacturing a wiring board according to claim 9, wherein said metal sheet is a sheet made of a metal foil or a paste containing conductive powder.
ｇ、ＡｕおよびＡｌの群から選ばれる少なくとも１種で
あることを特徴とする請求項９または請求項１０記載の
配線基板の製造方法。11. The method according to claim 11, wherein the metal of the metal sheet is Cu, A
The method according to claim 9, wherein the method is at least one selected from the group consisting of g, Au, and Al.
の厚みの１．５倍以上であることを特徴とする請求項９
乃至請求項１１のいずれか記載の配線基板の製造方法。12. The method according to claim 9, wherein the thickness of the metal sheet is at least 1.5 times the thickness of the insulating sheet.
A method of manufacturing a wiring board according to claim 11.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001055327A JP4582938B2 (en) | 2001-02-28 | 2001-02-28 | Insulating sheet manufacturing method and wiring board manufacturing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001055327A JP4582938B2 (en) | 2001-02-28 | 2001-02-28 | Insulating sheet manufacturing method and wiring board manufacturing method |
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| Publication Number | Publication Date |
|---|---|
| JP2002261439A true JP2002261439A (en) | 2002-09-13 |
| JP4582938B2 JP4582938B2 (en) | 2010-11-17 |
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|---|---|---|---|
| JP2001055327A Expired - Fee Related JP4582938B2 (en) | 2001-02-28 | 2001-02-28 | Insulating sheet manufacturing method and wiring board manufacturing method |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1511367A3 (en) * | 2003-08-25 | 2005-12-21 | Shinko Electric Industries Co., Ltd. | Manufacturing a wiring board |
| JP2006093280A (en) * | 2004-09-22 | 2006-04-06 | Miyachi Technos Corp | Method for connecting between wiring layers of printed wiring board |
| JP2007073948A (en) * | 2005-08-12 | 2007-03-22 | Semiconductor Energy Lab Co Ltd | Method of fabricating semiconductor device |
| CN104661450A (en) * | 2015-02-16 | 2015-05-27 | 珠海元盛电子科技股份有限公司 | Direct hole metallization method based on laser drilling |
| CN108668428A (en) * | 2018-05-25 | 2018-10-16 | 深圳光韵达激光应用技术有限公司 | A manufacturing process of laser LDS 3D three-dimensional circuit thin circuit board |
| WO2021115921A1 (en) * | 2019-12-11 | 2021-06-17 | Rogers Germany Gmbh | Method for machining a metal-ceramic substrate, system for such a method and metal-ceramic substrates produced using such a method |
| CN114096063A (en) * | 2021-11-09 | 2022-02-25 | 沪士电子股份有限公司 | Method for processing any layer of interconnected circuit board by filling blind holes with molten copper |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103831539B (en) | 2014-01-10 | 2016-01-20 | 合肥鑫晟光电科技有限公司 | Laser boring method and laser drilling system |
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| JPH0350888A (en) * | 1989-07-19 | 1991-03-05 | Fujitsu Ltd | Restoration of conductor via |
| JPH0575253A (en) * | 1991-08-27 | 1993-03-26 | Hitachi Constr Mach Co Ltd | Method for forming circuit pattern by laser light and method for forming conductor in through hole |
| JPH05267849A (en) * | 1992-03-19 | 1993-10-15 | Fujitsu Ltd | Manufacture of ceramic multilayer circuit board |
| JPH11340600A (en) * | 1998-05-22 | 1999-12-10 | Toshiba Corp | Ceramic circuit board |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0350888A (en) * | 1989-07-19 | 1991-03-05 | Fujitsu Ltd | Restoration of conductor via |
| JPH0575253A (en) * | 1991-08-27 | 1993-03-26 | Hitachi Constr Mach Co Ltd | Method for forming circuit pattern by laser light and method for forming conductor in through hole |
| JPH05267849A (en) * | 1992-03-19 | 1993-10-15 | Fujitsu Ltd | Manufacture of ceramic multilayer circuit board |
| JPH11340600A (en) * | 1998-05-22 | 1999-12-10 | Toshiba Corp | Ceramic circuit board |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1511367A3 (en) * | 2003-08-25 | 2005-12-21 | Shinko Electric Industries Co., Ltd. | Manufacturing a wiring board |
| US7205230B2 (en) | 2003-08-25 | 2007-04-17 | Shinko Electric Industries Co., Ltd. | Process for manufacturing a wiring board having a via |
| JP2006093280A (en) * | 2004-09-22 | 2006-04-06 | Miyachi Technos Corp | Method for connecting between wiring layers of printed wiring board |
| JP2007073948A (en) * | 2005-08-12 | 2007-03-22 | Semiconductor Energy Lab Co Ltd | Method of fabricating semiconductor device |
| CN104661450A (en) * | 2015-02-16 | 2015-05-27 | 珠海元盛电子科技股份有限公司 | Direct hole metallization method based on laser drilling |
| CN108668428A (en) * | 2018-05-25 | 2018-10-16 | 深圳光韵达激光应用技术有限公司 | A manufacturing process of laser LDS 3D three-dimensional circuit thin circuit board |
| WO2021115921A1 (en) * | 2019-12-11 | 2021-06-17 | Rogers Germany Gmbh | Method for machining a metal-ceramic substrate, system for such a method and metal-ceramic substrates produced using such a method |
| CN114096063A (en) * | 2021-11-09 | 2022-02-25 | 沪士电子股份有限公司 | Method for processing any layer of interconnected circuit board by filling blind holes with molten copper |
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|---|---|
| JP4582938B2 (en) | 2010-11-17 |
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