JP2002228684A - Contact probe - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a contact probe which has a high heat emissivity. SOLUTION: A heat radiation plate 31 is stuck almost entirely on the top surface of a film 22 with adhered pattern wires 21. The film 22 has a power supply layer which supplies a current to a wire 21p for a power source. The adhesives used to manufacture the contact probe 20 have high heat conductivity.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
The present invention relates to a contact probe for performing an electrical test by bringing a contact pin into contact with each electrode terminal of a CD (liquid crystal display) or the like.

[0002]

2. Description of the Related Art In general, a contact probe provided with contact pins is used for mechanically testing a semiconductor chip such as an IC chip or an LSI chip or a member to be inspected such as an LCD (liquid crystal display). A probe device mounted on a printed circuit board is used.

Here, as a prior art, there is a contact probe 1 as shown in FIGS. FIG. 4 is a plan view of the contact probe 1 viewed from the front side, and FIG.
FIG. 5 is a sectional view taken along line BB in FIG. 4. Note that the front side of the contact probe 1 in FIG. 4 is illustrated as being below the contact probe 1 in FIG. In such a contact probe 1, a plurality of pattern wirings 2 made of, for example, a Ni alloy are adhered to the surface of a film 4 via an adhesive 3, and the film 4 is made of a resin film 5 made of, for example, a polyimide resin. For example, a ground layer 6 of a metal film made of Cu or the like is laminated. The tips of the pattern wirings 2 are arranged at a narrow pitch in a substantially parallel manner and protrude from the tip of the film 4 to form contact pins 2a.

As shown in FIG. 4, the film 4 has, for example, a substantially home base shape in a plan view, and has a tip portion 1 from which a contact pin 2a projects from the tip of a narrow portion whose width gradually decreases.
a, and a base 1b formed with the maximum width at the end opposite to the tip 1a. The base 1b has a substantially rectangular window 7 extending in a direction crossing the pattern wiring 2. ing. In the window 7, each wiring lead portion 2b of the pattern wiring 2 is connected to an electrode of a printed circuit board described later.

As shown in FIGS. 6 and 7, such a contact probe 1 is incorporated into a mechanical part 9 together with a printed circuit board 8 to form a probe device 10, and a contact pin 2a is provided with a member to be inspected such as a semiconductor IC chip or an LCD. Terminals are brought into contact with each other.

That is, in the probe device 10 shown in FIGS. 6 and 7, for example, a top clamp 12 is mounted on a printed circuit board 8 having a substantially disk shape and having a central window portion 8a, and the contact probe 1 is attached to the lower surface thereof. Is fixed to the top clamp 12 with bolts or the like. Then, the base 1 b of the contact probe 1 is pressed by the substantially frame-shaped bottom clamp 15, and the base 1 b is pressed and fixed to the lower surface of the printed circuit board 8 by the elastic body 16 of the bottom clamp 15. In this state, the distal end portion 1a of the contact probe 1 is held in an inclined state downward in FIG.

As a result, the wiring lead portion 2b of the pattern wiring 2 is pressed through the window portion 7 against the substrate-side electrode 8b on the lower surface of the printed circuit board 8 and is kept in contact. In such a state, terminals 18a such as pads and bumps of a member to be inspected such as the semiconductor IC chip 18 are pressed into contact with the contact pins 2a to perform an electrical test.

[0008]

The film 4
A part of the plurality of pattern wirings 2 attached to the surface of the semiconductor device is a power supply wiring 2p for supplying a drive current to a member to be inspected such as the semiconductor IC chip 18. When a large current flows through such a power supply wiring 2p, heat is generated and the resistance is increased, so that a voltage drop may occur and power supply to a member to be inspected may not be accurately performed. In some cases, the power supply wiring 2p may be damaged by burning.
The current capacity that can flow through p is limited. Such a tendency becomes remarkable in the vicinity of the leading end 1b of the film 4 where the pattern wirings 2 are arranged at a narrow pitch and the width of the power supply wiring 2p cannot be increased.

When the power supply wiring 2p generates heat and the contact probe 1 itself is burned and damaged,
Each time it had to be repaired or remanufactured. Further, if the contact probe 1 is damaged, a current may flow also in a non-predetermined circuit on the inspected member,
There is also a possibility that the member to be inspected may be damaged by the contact pin 2a. Another problem is that the pattern wiring 2
The pattern wirings 2 leak from each other due to the adhesion of foreign matter to the substrate, the occurrence of moisture, and the like, and the contact probe 1 itself may be damaged when the contact probe 1 is handled.

The present invention has been made in view of the above problems, and has as its object to provide a contact probe that can efficiently release heat generated by flowing a current through a power supply wiring.

[0011]

Means for Solving the Problems To solve the above problems,
In order to achieve such an object, the present invention provides a contact probe in which a plurality of pattern wirings are adhered to a surface of a film, and each end of the pattern wirings is a contact pin. A heat radiating member having high thermal conductivity is attached to at least one of them. With such a configuration, the heat-radiating member having high thermal conductivity attached to the film functions to efficiently release heat generated in the power supply wiring. As a result, it is possible to reduce adverse effects caused by the heat generation of the contact probe, for example, a voltage drop due to an increase in resistance, burning of the contact probe itself, and the like, and increase a current capacity flowing through the power supply wiring. Further, at the time of handling the contact probe, at least one of the front surface and the back surface of the film is protected by the heat radiation member, so that it is possible to prevent the contact probe itself from being damaged. In addition, when a heat radiating member is attached to at least the surface of the film, that is, the surface on which the pattern wiring is adhered, it is possible to prevent the adhesion of foreign substances and the generation of moisture to the pattern wiring, and to prevent leakage of the pattern wiring. Can be prevented. When the heat radiating member is attached only to the back surface of the film, the heat radiating member does not become an obstacle and does not disturb the contact state when the contact pin is brought into contact with the member to be inspected.

Further, the present invention provides a contact probe in which a plurality of pattern wirings are adhered to the surface of a film, and each of the pattern wirings has a contact pin as a contact pin. A heat radiation member having high heat conductivity is attached. Even in such a configuration, the heat dissipating member having high thermal conductivity has a function of releasing heat generated in the power supply wiring, and the adverse effect caused by the heat generated by the contact probe can be reduced.

Further, the film is provided with a power supply layer for supplying a current to a power supply wiring among the plurality of pattern wirings on the back surface side. In the contact probe having such a power supply layer, it is possible to cope with the narrowing of the pitch of the contact pins and to effectively solve the above-mentioned problem of heat generation of the power supply wiring caused by this. Can be.

Further, the heat radiation member is stuck on at least one of the front and back surfaces of the film. With such a configuration, the effect of suppressing heat generation of the power supply wiring and the effect of preventing foreign matter from adhering to the film and generation of moisture can be kept higher.

Further, according to the present invention, there is provided a contact probe in which a plurality of pattern wirings are adhered to the surface of a film, and the respective tips of the pattern wirings are arranged so as to protrude from the leading end of the film to be contact pins. It is characterized in that a highly conductive adhesive is used. As described above, by using the adhesive having high thermal conductivity, heat generated in the power supply wiring can be efficiently released. Moreover, since the adhesive used for manufacturing the contact probe only needs to be replaced with a material having high thermal conductivity, the contact probe can be easily manufactured in the same process as the conventional method without increasing the number of manufacturing processes.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a plan view of the contact probe according to the present embodiment viewed from the front side, and FIG. 2 is a cross-sectional view taken along line AA in FIG. The front side of the contact probe in FIG.
Are shown below the contact probe in FIG.

As shown in FIGS. 1 and 2, the contact probe 20 according to the present embodiment
It has a structure in which a plurality of pattern wirings 21 formed of a metal made of i or Ni alloy or the like are adhered by an adhesive 27, and each end of the pattern wiring 21 projects from the front end 20a of the film 22. The protruding portion is a contact pin 21a.

At this time, the pattern wiring 21 is
2 (first resin film 23 to be described later) is used as the adhesive 27, for example, a resin-based adhesive mixed with aluminum nitride (ALN) is used, and has high thermal conductivity. It has the property of having high heat dissipation. The film 22 has, for example, a substantially home-base shape in plan view as shown in FIG. 1 and has the same shape as that of the above-described prior art, and has a minimum width and has a tip portion 20a from which a contact pin 21a projects from the tip. And the tip 20
a at the opposite end to the base 20b formed with a maximum width.

Further, the film 22 is formed of the pattern wiring 2
A first resin film 23 made of a polyimide resin or the like disposed on the surface side on which the first resin film 1 is attached;
3. Ground layer 24 of metal film arranged on the back of
And a second resin film 25 made of a polyimide resin or the like attached to the ground layer 24 with an adhesive 28.
And a power supply layer 2 of a metal film disposed on the back side of the second resin film 25 (that is, on the back side of the film 22).
6 are provided in a stacked manner. That is, the film 22 is a four-layer tape in which a resin film and a metal film are integrally provided.

Here, the adhesive 28 used for bonding the ground layer 24 and the second resin film 25 is as follows.
It is the same as the adhesive 27 used to adhere the pattern wiring 21 to the first resin film 23, has high thermal conductivity, and has a high heat radiation effect. Each of the above metal films (ground layer 24, power supply layer 26)
Is preferably not easily deformed by heat and moisture. For example, any one of Ni, Ni alloy, Cu (copper foil), and Cu alloy is preferable.

A part of the plurality of pattern wirings 21 attached to the surface of the film 22 is a power supply wiring 21p for supplying a driving current to the member to be inspected.
The power supply wiring 21p is electrically connected to the power supply layer 26 via a conductive material 30 (for example, silver) filled in a via hole 29 penetrating the film 22. A current is supplied from the power supply layer 26 to the power supply wiring 21p.

Although not shown, a part of the pattern wiring 21 except the power supply wiring 21p is a ground wiring, and like the power supply wiring 21p, is connected to a ground layer via a via hole. 24. In this embodiment, the power supply wiring 21 is used.
p and power supply layer 26 (ground wiring and ground layer 2)
4) is connected via a via hole 29,
Means for connection by bumps and means for connection by wire bonding are also conceivable.

Further, a heat radiating plate 31 cut out in the same shape as the film 22 is adhered as a heat radiating member in the present embodiment over substantially the entire surface of the film 22, that is, the surface on which the pattern wiring 21 is adhered. Affixed with agent 32. That is, the contact pin 21a
The heat sink 31 is attached to the pattern wiring 21 so as to remove the (contact portion of the pattern wiring 21), and the contact property of the contact pin 21a is not impaired. Here, the adhesive 32 used for bonding the pattern wiring 21 and the heat sink 31 is also the adhesive 2 used for bonding the pattern wiring 21 and the first resin film 23.
The same material as that of No. 7 is used, which has high thermal conductivity and high heat dissipation.

The radiator plate 31 has a thickness of, for example, 0.1 to 0.1 mm.
It is about 0.7 mm and is made of a material having high thermal conductivity such as ALN (aluminum nitride). In addition, C
A metal such as u may be substituted. The heat sink 31
Is attached to the pattern wiring 21 on the surface of the film 22 via the adhesive 32,
The heat sink 31 is preferably formed of an insulating material just in case. Further, the heat dissipation plate 31 is provided with a window portion 7 provided for connection with a substrate-side electrode of a printed board and a window portion or a hole at a position corresponding to a hole used for fixing to a mechanical part. It does not impair the mountability to mechanical parts. Further, a device for further improving the heat radiation effect may be provided by extending a water faucet or an air tube around the heat radiation plate 31.

Next, an example of a method of manufacturing the above-described contact probe 20 will be described in the order of steps with reference to FIG. [Base Metal Layer Forming Step] First, as shown in FIG.
The base metal layer 41 is formed by (copper) plating. The base metal layer 41 is formed on the upper surface of the supporting metal plate 40 with a uniform thickness.

[Pattern Forming Step] Next, a photoresist layer (mask) 42 having a thickness of about 16 to 100 μm is formed on the base metal layer 41.
As shown in FIG. 3, a photomask M having a predetermined pattern is applied to the photoresist layer 42 by photolithography to expose the photoresist layer 42, and as shown in FIG.
Is developed to remove the portion that will become the pattern wiring 21 to form an opening 42a in the remaining photoresist layer 42.
The width of the opening 42a is, for example, about 50 μm. Further, in the present embodiment, the photoresist layer 42 is formed of a negative photoresist, but a desired opening 42a may be formed by employing a positive photoresist. Further, the present invention is not limited to the one in which the opening 42a is formed through the exposure and development processes using the photomask M. For example, a hole is formed in advance in a portion to be plated (that is, reference numeral 4 in FIG.
2) may be used.

[Electroplating Step] Then, FIG.
As shown in FIG. 7, a Ni or Ni alloy layer N serving as the pattern wiring 21 is formed in the opening 42a by plating.
After the plating process, the photoresist layer 42 is removed as shown in FIG.

[Film Adhering Step] Next, FIG.
As shown in the figure, on the Ni or Ni alloy layer N,
The film 22 is adhered to the adhesive 27 except for the tip portion of the pattern wiring 21, that is, other than the portion serving as the contact pin 21 a.
To adhere. The film 22 is a four-layer tape in which a ground layer 24 of a metal film, a second resin film layer 25, and a power layer 26 of a metal film are integrally provided on a resin film layer 23. Before this film deposition step, a copper layer is formed on the first resin film 23 of the four-layer tape and subjected to copper etching using a photoengraving technique to form a ground layer 24, After attaching the second resin film layer 25 to the ground layer 24 with the adhesive 28, the power supply layer 26 is formed on the second resin film layer 25 in the same manner as the ground layer 24.

[Separation Step] Then, as shown in FIG. 3 (g), after the portion consisting of the film 22, the pattern wiring 21, and the base metal layer 41 is separated from the supporting metal plate 40, Cu etching is performed. Then, only the pattern wiring 21 is adhered to the film 22.

[Gold Coating Step] Next, as shown in FIG.
An Au plating layer AU is formed on the surface by plating. At this time, the Au layer AU is formed on the entire surface of the contact pins 21a protruding from the film 22 over the entire circumference.

[Heat radiating plate attaching step]
Is cut into a predetermined shape, and the surface of the film 22 is
That is, the heat sink 31 similarly cut out into a predetermined shape is attached to almost the entire surface where the pattern wiring 21 is exposed, using an adhesive 32 having high thermal conductivity. After attaching the heat sink 31 to the surface of the film 22, the film 22 may be cut into a predetermined shape. Through the above steps, the contact probe 20 as in the present embodiment is manufactured.

In the contact probe 20 of the present embodiment having the above-described structure, a heat radiating plate 31 is attached to the surface of the film 22, and adhesives 27 and 28 having high heat conductivity are used for manufacturing the contact probe 20. , 32 are used, it is possible to obtain the contact probe 20 having high heat dissipation, and it is possible to effectively suppress the heat generated when a current flows through the power supply wiring 21p. For this reason, the adverse effects caused by the heat generation of the contact probe 20, that is, the resistance increases and the voltage drops, so that accurate power supply to the member to be inspected cannot be performed, or the contact probe 20 is burned and damaged. In addition to reducing the possibility that the current will flow, it is possible to increase the current capacity flowing through the power supply wiring 21p, and it is possible to cope with various members to be inspected.

Further, since the surface of the film 22 is protected by the heat radiating plate 31, it is possible to prevent foreign matter from adhering to the pattern wiring 21 and generation of moisture, and to prevent leakage of the pattern wiring 21 from each other. In addition, the contact probe 20 itself is not damaged during handling of the contact probe 20. further,
Since the heat radiating plate 31 is attached to the surface of the film 22, that is, adhered to the pattern wiring 21, it is possible to prevent the pattern wiring 21 from being displaced in the extending direction of the pattern wiring 21, and to improve the contact property. The expected effect can be expected.

Further, since the heat radiating plate 31 is attached over substantially the entire surface of the film 22, the heat radiating plate 31 has an effect of suppressing heat generation of the power supply wiring 21p and a foreign substance adherence to the film 22 and generation of moisture. The effect of preventing can be kept higher. In addition, the film 22 includes the power supply wiring 21p.
Is provided with a power supply layer 26 for supplying a current to the contact pins 21a.
Of the heat generated by the heat sink 31 and the adhesives 27 and 2
8, 32 can be effectively solved.

In the present embodiment, the heat radiating plate 31 is used as the heat radiating member. However, the heat radiating member is not limited to this, and any other heat radiating member may be used as long as it has a heat radiating effect. . In the present embodiment, the heat radiating plate 31 is attached only to the front surface of the film 22. However, the heat radiating plate 31 is attached to the back surface of the film 22, or both the front and back surfaces of the film 22. You may. When the heat radiating plate 31 is adhered only to the back surface of the film 22, there is an advantage that the obstruction disappears on the surface of the film 22 and does not hinder the contact of the member to be inspected with the pad. In the case where the heat radiating plates 31 are attached to both surfaces of the substrate 22, there is an advantage that a higher heat radiating effect can be obtained.

In the present embodiment, the heat sink 31
Is attached over substantially the entire surface of the film 22 on which the pattern wiring 22 is adhered except for the contact pins 21a, but is not limited thereto, and only the power supply wiring 21p of the pattern wiring 21 is attached. The same effect as described above can be obtained even if the heat radiating plate 31 is affixed to the heat sink. In the present embodiment, the power supply layer 26 is formed to supply a current to the power supply wiring 21p. However, the present invention is not limited to this, and the current is directly supplied to the power supply wiring 21p without forming the power supply layer 26. May flow.

In this embodiment, each end of the pattern wiring 21 is formed as a contact pin 21a so as to protrude from the film 22. However, the present invention is not limited to this. It does not matter if it does not protrude. In this case, the heat sink 31
May be attached to the film 22 excluding the contact pins 21a.

Furthermore, in the present embodiment, the present invention is applied to an IC contact probe, but may be applied to another probe. For example, an IC chip is held inside to protect
Contact probe and L for IC chip test socket mounted on chip burn-in test equipment, etc.
The present invention may be applied to a contact probe for a CD test probe device.

[0039]

As described above, according to the present invention, since the heat radiating member having high thermal conductivity is attached to the film, the heat generation of the power supply wiring can be suppressed efficiently. . For this reason, it is possible to eliminate the adverse effect caused by the heat generation of the contact probe, that is, the risk that the power supply to the member to be inspected cannot be accurately performed due to the voltage drop due to the increase in resistance, and the risk that the contact probe is burned and damaged. While being able to
It is possible to increase the current capacity that can be supplied to the power supply wiring, and it is possible to cope with various members to be inspected.
Further, the same effect can be obtained even if the heat radiating member is attached only to the power supply wiring.

Further, since at least one of the front surface and the back surface of the film is protected by the heat radiating member, it is possible to prevent foreign substances from adhering to the pattern wiring and generation of moisture, and to prevent leakage of the pattern wirings. In addition, the contact probe itself is not damaged during handling of the contact probe. Furthermore, since the adhesive used when manufacturing the contact probe is a material having high thermal conductivity,
Similarly, heat generation of the power supply wiring can be effectively suppressed.

[Brief description of the drawings]

FIG. 1 is a plan view of a contact probe according to an embodiment viewed from a front surface side.

FIG. 2 is a sectional view taken along line AA in FIG.

FIG. 3 is a fragmentary cross-sectional view of the method for manufacturing the contact probe according to the present embodiment in the order of steps;

FIG. 4 is a plan view of a conventional contact probe viewed from the front side.

FIG. 5 is a sectional view taken along line BB in FIG.

FIG. 6 is an exploded perspective view of a probe device equipped with a conventional contact probe.

7 is a longitudinal sectional view of the probe device shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 20 Contact probe 21 Pattern wiring 21a Contact pin 21p Power supply wiring 22 Film 23 First resin film 24 Ground layer 25 Second resin film 26 Power supply layer 27 Adhesive 28 Adhesive 31 Heat sink 32 Adhesive

Continued on the front page. (72) Inventor Toshinobu Ishii, Twelve-six, Techno Park, Mita-shi, Hyogo Mitsubishi Materials Corporation Mita Plant (72) Inventor Hideaki Yoshida Twelve-six, Techno Park, Mita-shi, Hyogo Mitsubishi Materials F term in Mita factory (reference) 2G003 AA07 AG03 AG07 AG08 AG12 AH05 AH07 AH08 2G011 AA15 AA21 AB06 AB08 AC00 AC14 AE01 AE22 4M106 BA01 DD30

Claims (5)

[Claims] 1. A contact probe in which a plurality of pattern wirings are attached to a surface of a film, and each of the pattern wirings has a contact pin as a contact pin. A contact probe to which a high heat radiation member is attached. 2. A contact probe in which a plurality of pattern wirings are attached to the surface of a film, and each of the pattern wirings has a contact pin as a contact pin. A contact probe to which a high heat radiation member is attached. 3. The contact probe according to claim 1, wherein the film includes a power supply layer on a back surface side for supplying a current to a power supply wiring among the plurality of pattern wirings. A contact probe, characterized in that: 4. The contact probe according to claim 1, wherein the heat radiation member is one of a front surface and a rear surface of the film.
A contact probe, which is attached over at least one substantially entire surface. 5. The contact probe according to claim 1, wherein an adhesive having high thermal conductivity is used.