JP2001102289A - Device and method for substrate processing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processor which can prevent a dewatering roller and rinse liquid from being contaminated, and has high processing capability. SOLUTION: A slit nozzle 5, which supplies a developer to a substrate surface to form a liquid layer 20 of the developer, is provided above a substrate carry-in opening of a processing part 2. The slit nozzle 5 has a processing liquid supply opening at right angles to a conveying direction and is arranged obliquely, so that its processing liquid supply opening faces in the conveying direction of a substrate A. A slit nozzle 6, which supplies a developer toward the liquid layer 20 of the developer to replace the developer on the substrate A, is provided at a position which is downstream from the slit nozzle 5 by the length of the substrate A in the conveying direction. The slit nozzle 6 has a processing liquid supply opening at right angles to the conveying direction and is arranged obliquely, so that the processing liquid supply opening faces the conveying direction of the substrate A. A dewatering roller 15, which removes the developer remaining on the liquid-replaced substrate A, is provided on the downstream side of the slit nozzle 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plate-like substrate (hereinafter, referred to as a substrate) such as a rectangular glass substrate for a liquid crystal display device, a printed substrate, a substrate for a plasma display, etc. More specifically, a processing solution such as a developing solution, an etching solution, a stripping solution, and a rinsing solution is supplied to the surface of the substrate to form a liquid layer on the substrate, and the formed liquid layer is processed. The present invention relates to a substrate processing apparatus for processing a substrate with a liquid.

[0002]

2. Description of the Related Art Conventionally, as an apparatus for processing a substrate by forming a liquid layer of a processing liquid on a substrate surface, a processing liquid is supplied to a conveyed substrate by using a spray to form a liquid layer on the substrate. When the substrate processing is completed,
2. Description of the Related Art There has been known a substrate processing apparatus which carries out rinsing by transporting a processing liquid on a substrate to a rinsing section while removing the processing liquid with a draining roller.

In such an apparatus that performs processing while transporting a substrate in the horizontal direction, the substrate processing can be performed continuously, so that the processing capability is high. When the cutting is performed, there is a problem that the fatigue liquid attached to the draining roller is concentrated or solidified, adheres to the surface of the substrate to be processed next, and the processing quality is deteriorated.
In addition, the substrate surface transported to the rinsing part contains the fatigued processing solution, and the rinsing treatment of the fatigued processing solution contaminates the rinsing solution in a short time. was there.

[0004] As means for solving such problems,
On the surface of the substrate placed on the turntable, a processing liquid is supplied while moving the slit nozzle in parallel to form a paddle, and after the processing of the substrate is completed, the turntable is rotated to perform liquid drainage. A substrate processing apparatus has been proposed in which a rinsing liquid is supplied onto a substrate to perform cleaning while the table is being rotated. FIG. 5 is a schematic view showing such a conventional apparatus.

In FIG. 5, a substrate W is mounted on a turntable 40 by a transfer means such as a robot and fixed on the turntable 40 by a suction mechanism (not shown). Next, the slit nozzle 42 moves in parallel from right to left in the drawing while supplying the processing liquid to the surface of the substrate W, and forms a liquid layer 43 of the processing liquid on the surface of the substrate W.

When the processing of the substrate W is completed by the processing liquid layer 43 formed on the substrate W, the rotating shaft 41 rotates at a high speed to remove the processing liquid on the substrate W by centrifugal force. When the rotation of the rotary shaft 41 is stopped after the drainage is completed, the rinse nozzle 4
4 moves from the solid line position to the broken line position,
The rinsing liquid is supplied to the surface of the substrate W from the processing liquid supply port 4. Simultaneously with the supply of the rinsing liquid, the rotation shaft 41 starts rotating at a low speed, and the surface of the substrate W is rinsed. When the rinsing process is completed, the rinsing nozzle 44 stops supplying the rinsing liquid, the rinsing nozzle 44 retreats from the position indicated by the broken line to the position indicated by the solid line, and the rotating shaft 41 rotates at a high speed, and the rinsing liquid remaining on the surface of the substrate W Is removed by centrifugal force. When the draining is completed, the rotation shaft 41 stops rotating, the substrate W is transported to a subsequent process by a robot (not shown), and the substrate processing ends.

As described above, in the above conventional apparatus, the substrate W
It is possible to save the amount of the processing liquid and the rinsing liquid supplied to the apparatus and to achieve an excellent effect that the processing liquid fatigued by the processing can be removed cleanly by rotating the turntable.

[0008] However, while the above-described conventional apparatus has such excellent effects, it can process only one substrate W at a time, so that a plurality of processing apparatuses must be prepared to increase the number of processed wafers. There was a problem.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a substrate processing apparatus which can prevent contamination of a liquid removing roller and a rinsing liquid and has a high processing capability. And

[0010]

According to a first aspect of the present invention, there is provided a substrate processing apparatus for performing processing by transporting a substrate in a predetermined direction, comprising: transport means for transporting the substrate; A liquid layer forming means for supplying a liquid to form a liquid layer of the processing liquid on the substrate surface, and a liquid replacement for further supplying the processing liquid to the substrate surface treated with the processing liquid and replacing the liquid layer of the processing liquid Means, and a processing liquid removing means for removing the processing liquid from the substrate surface after the liquid replacement.

According to a second aspect of the present invention, in the liquid layer forming means, the processing liquid supply port extends in a direction orthogonal to the substrate transport direction, and the processing liquid supply port extends in the substrate transport direction. It is a slit nozzle that is inclined and arranged to face.

According to a third aspect of the present invention, the liquid replacement means comprises:
The processing liquid supply port extends in a direction orthogonal to the substrate transport direction, and the processing liquid supply port is a slit nozzle that is inclined and disposed in a direction opposite to the substrate transport direction.

According to a fourth aspect of the present invention, the liquid replacement means comprises:
A posture changing means for changing the substrate conveyed by the substrate conveyance means from a horizontal posture to an inclined posture, and a processing liquid supply port is formed along the conveyance direction while being disposed above the substrate conveyed in the inclined posture. And a slit nozzle.

According to a fifth aspect of the present invention, the processing liquid removing means comprises a liquid removing roller disposed in a direction orthogonal to the substrate transport direction.

According to a sixth aspect of the present invention, the processing liquid removing means includes a processing liquid supply means for supplying a processing liquid to the surface of the draining roller after draining.

According to a seventh aspect of the present invention, there is provided a substrate processing method for performing a process by forming a liquid layer of a processing liquid on a surface of a substrate conveyed in a predetermined direction. Forming a liquid layer and processing the substrate; supplying the processing liquid further to the substrate surface processed by the liquid layer of the processing liquid to replace the liquid layer of the processing liquid formed on the substrate surface; Removing the treatment liquid from the surface of the replaced substrate.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the present invention will be described below with reference to the drawings, taking as an example the case where the present invention is applied to a substrate processing apparatus for developing a rectangular glass substrate for liquid crystal.

FIG. 1 is a schematic configuration diagram showing one embodiment of a substrate processing apparatus 1 according to the present invention. In FIG. 1, a substrate processing apparatus 100 supplies a developing solution to a substrate introduction unit 1 that receives a substrate A transported from a previous process and a surface of the substrate A transported from the substrate introduction unit 1 in a horizontal posture. A processing unit 2 for performing a developing process, a rinsing unit 3 for performing a rinsing process by supplying a rinsing liquid from a shower nozzle 8 to the surface of the developed substrate, and a high-pressure air (or nitrogen gas) ) And a drying unit 4 for performing a drying process by spraying the drying unit.

The substrate processing apparatus 1 includes a substrate introduction unit 1,
The processing unit 2, the rinsing unit 3, and the drying unit 4 perform predetermined processing on the substrate A while transporting the substrate A in this order.

A developing solution tank 9 is disposed below the processing section 2, and the developing solution stored in the developing solution tank 9 is sent to a slit nozzle 5 serving as a liquid layer forming means by a liquid sending pump 11. The developer is supplied to the surface of the substrate A from the processing liquid supply port provided in the slit nozzle 5 to form a liquid layer 20. Further, another liquid feed pump 13 is provided in the developer tank 9.
The developing solution sent by the solution sending pump 13 is supplied with a slit nozzle 6 for solution replacement by a three-way solenoid valve.
Alternatively, a pair of upper and lower liquid removal rollers 1 as processing liquid removing means
The developing solution is configured to be selectively supplied to one of the processing solution supply nozzles 7 having the processing solution supply ports formed therein. In the processing section 2, the developer supplied to the substrate A or the liquid removal roller 15 is collected from a drain 12 provided at the bottom of the processing section 2 to the developer tank 9 and is circulated and used. .

Similarly, a rinsing liquid tank 1 is provided below the rinsing section 3.
The rinsing liquid stored in the rinsing liquid tank 16 is supplied to the surface of the substrate A by the rinsing liquid feed pump 17 via the shower nozzle 8, and the surface of the substrate A is rinsed. The rinsing liquid supplied to the surface of the substrate A is collected from a drain 18 provided at the bottom of the rinsing section 3 to a rinsing liquid tank 16 and used for circulation. In the present embodiment, the shower nozzle 8 is connected to the substrate A
Is provided only on the upper surface side of the substrate A, but may also be provided on the lower surface side of the substrate A so that both surfaces of the substrate A are rinsed.

Next, in the present embodiment, a roller conveyor is applied as a substrate transport means for transporting the substrate A. This roller conveyor moves the substrate A in the transport direction (FIG. 1).
A plurality of transport rollers 10 having support shafts arranged in a direction orthogonal to the direction from the left to the right) are arranged side by side in the transport direction at an equal pitch.

Then, the substrate A is placed on the plurality of transport rollers 10 that are being driven to rotate, so that the substrate A is oriented in the transport direction (rightward in FIG. 1) with the synchronous rotation of each transport roller 10. Transported.

The substrate A is transferred from the preceding process to the substrate introduction unit 1 via an upstream transfer means such as a conveyor or a robot, and then transferred from the substrate introduction unit 1 to the processing unit 2 by driving the transport roller 10. You. In the processing unit 2, after a developing solution is supplied from the slit nozzle 5 to the surface of the substrate A and subjected to a predetermined process, the developing solution transferred to the rinsing unit 3 and adhered to the substrate A is rinsed. The rinsed substrate A is transferred to the drying unit 4, and while the substrate A is being transported by the transport roller 10 in the drying unit 4, the rinsing attached to the surface of the substrate A is performed by the air knife 19 provided in the drying unit 4. Allow the liquid to dry. Then, on the downstream side of the drying unit 4,
It is drawn out to the next step via downstream transfer means such as a conveyor or a robot.

Next, FIG. 2 shows a substrate processing apparatus 1 according to the present invention.
FIG. 2 is a schematic diagram for explaining details of the processing unit 2 of FIG.
2A shows a state in which a liquid layer 20 of a developing solution is formed on the surface of the substrate A, and FIG.
0 shows that the liquid replacement is performed by further supplying a developing solution.

In FIG. 2A, a plurality of conveying rollers 10 are arranged in the processing section 2 in a direction perpendicular to the conveying direction. The substrate A transported from the substrate introduction unit 1 to the processing unit 2 is placed on the transport roller 10 and transported in the processing unit 2 by the synchronous rotation of the transport roller 10. A slit nozzle 5 for supplying a developing solution to the surface of the substrate and forming a liquid layer 20 of the developing solution is provided above the substrate loading port of the processing unit 2. In the slit nozzle 5,
A processing liquid supply port is provided along a direction orthogonal to the transport direction.
Are arranged in an inclined manner so as to face the transport direction.

At the downstream position of the slit nozzle 5 and downstream of the length of the substrate A in the transport direction, a developing solution is supplied to the liquid layer 20 on the surface of the developed substrate A,
Slit nozzle 6 for replacing the developing solution on substrate A
Is provided. The slit nozzle 6 is provided with a processing liquid supply port along a direction orthogonal to the transport direction,
The slit nozzle 6 is arranged to be inclined in a direction in which the processing liquid supply port is opposed to the transport direction of the substrate A.

Downstream of the slit nozzle 6, there is provided a draining roller 15 for removing the developing solution remaining on the substrate A on which the liquid has been replaced. Drain roller 15
Is composed of a pair of upper and lower liquid drainage rollers 15a and 15b provided in a direction perpendicular to the transport direction. The substrate A transported by the transport roller 10 is transported between the liquid drainage rollers 15. Thus, the developing solution remaining on the surface of the substrate A is removed.

After removing the developing solution from the surface of the substrate A, the developing solution is supplied to the upper portions of the draining rollers 15a and 15b and then to the draining rollers 15a and 15b. Processing solution nozzles 7a and 7b for washing away the developing solution that has adhered to and have become fatigued on 15a and 15b are arranged. The processing liquid nozzles 7a and 7b are disposed along a direction perpendicular to the direction in which the substrate A is transported.
15b, the drainage rollers 15a, 15b are provided through processing liquid supply ports provided in the pipes.
It is configured to supply the processing liquid toward b.

When the substrate A is carried into the substrate introduction part 1, the liquid supply pump 11 (see FIG. 1) of the processing part 2 starts operating,
The developer in the developer tank 9 is supplied to the slit nozzle 5. The substrate A is transferred from the substrate introduction unit 1 to the processing unit 2 by the transport roller 10.
Is transported from the leading edge to the trailing edge of the substrate A in the transport direction from the slit nozzle 5, and a liquid layer 20 of the developer is formed on the surface of the substrate A.

At this time, since the slit nozzle 5 is disposed in an inclined posture in the transport direction of the substrate A, the developer supplied from the slit nozzle 5 to the surface of the substrate A
In the transport direction and the flow rate of the developing solution supplied from the slit nozzle 5 are synchronously supplied to the surface of the substrate A statically. As a result, the developer hardly spills off from the surface of the substrate A, and a uniform developer liquid layer 20 is formed on the surface of the substrate A by the surface tension of the developer.

When the developer liquid layer 20 is formed on the surface of the substrate A, the liquid supply pump 11 is stopped by control means (not shown), and the supply of the developer from the slit nozzle 5 is stopped. Is stopped, and the substrate A is subjected to the developing process by the liquid layer 20 of the developing solution formed on the surface thereof.

Next, referring to FIG. 2B, after the development processing,
The manner in which the liquid layer 20 formed on the substrate surface is replaced with a liquid will be described. When a predetermined processing time elapses and the development processing of the substrate A ends, the control means starts the operation of the liquid supply pump 13 and the electromagnetic valve 14 is switched, so that the developer in the developer tank 9 is supplied to the slit nozzle 6. Start supplying to. At the same time, the driving of the transport roller 10 is started by the control means, and the substrate A is transported toward the slit nozzle 6. When the leading end of the substrate A reaches the developing solution supply position of the slit nozzle 6, the developing solution supplied from the slit nozzle 6 causes the developing solution layer 20 formed on the surface of the substrate A to be washed off from the surface of the substrate A. Then, the developing solution that has been fatigued by the developing process is replaced with the developing solution stored in the developing solution tank 9.

At this time, since the slit nozzle 6 is arranged to be inclined in the direction opposite to the transport direction of the substrate A, the flow of the developing solution supplied from the slit nozzle 6 and the substrate A
Of the substrate A, the fatigued developer is washed away and replaced on the surface of the substrate A in a short time.

When the liquid replacement on the surface of the substrate A is completed,
Is transported to the draining roller 15 by the transport roller 10, and the developer remaining on the surface of the substrate A is removed by the draining rollers 15a and 15b. The developer remaining on the surface of the substrate A at the time when the developer is conveyed to the draining roller 15 has been replaced by a non-fatigued developer stored in the developing tank 9, so that the contamination of the draining roller can be prevented. Can be considerably reduced. Further, since the developing solution remaining on the substrate surface after draining is also replaced with a developing solution that is not fatigued, contamination of the rinsing solution in the rinsing section 3 is reduced, and the life of the rinsing solution can be extended.

Next, FIG. 3 is a schematic view showing a state in which the liquid removal roller 15 is being cleaned. In FIG. 3, when the removal of the developing solution remaining on the substrate A is completed by the draining roller 15, the control unit (not shown) controls the liquid feeding pump 13
Starts the operation, the electromagnetic valve 14 is switched, and the supply of the developing solution in the developing solution tank 9 to the processing solution nozzles 7a and 7b is started. When the developer is supplied for a predetermined time and the surface of the liquid drain roller 15 is cleaned, the liquid pump 13 is stopped by the control means, and the cleaning process of the liquid drain roller 15 is completed. By this cleaning process, the developer is concentrated on the surface of the liquid drain roller 15 and solidified, and it is possible to prevent the occurrence of unevenness and scratches at the time of liquid drain on the surface of the substrate A.

Next, FIG. 4 is a schematic diagram for explaining another embodiment of the processing liquid replacement means in this embodiment.

In the embodiment shown in FIG. 4, the latter half of the plurality of transport rollers 10 for placing and transporting the substrate A in the processing section 2,
That is, a portion for performing liquid replacement after the development processing is provided so as to be changeable from a horizontal position to a tilt position by a driving unit (not shown), and is orthogonal to the transfer direction of the substrate A transferred in the tilt position after the change in position. This embodiment is different from the above-described embodiment in that a slit nozzle 6 having a processing liquid supply port formed along the transport direction is disposed at an upper position in the direction of the transfer. In the present embodiment, only differences from the above-described embodiment will be described.

As in the above-described embodiment, the slit nozzle 6 receives the developing solution stored in the developing solution tank 9 and feeds the developing solution to the feed pump 11.
Is supplied by The substrate A is placed on the central support roller 130 provided on the transport roller 10, and is supported on the peripheral surface of the support roller 150 that supports the lower edge of the substrate A while supporting the lower edge of the substrate P. The processing unit 2 is configured to be transported.

When the development processing of the substrate A transported in the horizontal position is completed and the substrate A reaches the latter half of the processing unit 2,
The transport is stopped once, and the attitude of the transport roller 10 is changed from the horizontal attitude to the inclined attitude by control means (not shown).
When the posture change is completed, the conveyance by the conveyance roller 10 is started by a control unit (not shown), and the supply of the developing solution is started from the slit nozzle 6 arranged above the substrate A. As a result, the fatigue developing solution remaining on the substrate A flows down from the substrate, and the liquid on the substrate surface is replaced. As described above, in the present embodiment, the substrate A is inclined at the time of liquid replacement, so that liquid replacement can be performed in a shorter time.

Further, in the present embodiment, the draining roller 15 is also disposed in an inclined posture, and the rinsing unit 3 is also configured to perform the rinsing process in the inclined posture.
After the rinsing, the substrate A is changed to a horizontal position, and the drying process is performed by the air knife 19.

The present invention is not limited to the above embodiment, but includes the following contents.

(1) In this embodiment, after the liquid layer 20 is formed on the surface of the substrate A, the transport roller 10 is stopped and the developing process is performed, but in the transport direction between the slit nozzle 5 and the slit nozzle 6 Increase the spacing between the two
If the transport speed of the transport roller 10 is switched to a low speed when the developer liquid layer 20 is formed on the surface of the substrate A, the developing process is completed before the substrate A reaches the position where the slit nozzle 6 is arranged. Processing can be performed without stopping transfer of the substrate A.

(2) In the present embodiment, the developer tank 9
The developing solution stored in the slit nozzle 5, the slit nozzle 6, and the processing liquid nozzles 7 a, 7 are supplied by the liquid feeding pump 11 and the combination of the liquid feeding pump 13 and the electromagnetic valve 14.
Although the configuration is such that the supply is made to the b, the supply may be made by switching the electromagnetic valve using a single liquid feed pump and three sets of electromagnetic valves. Further, the supply may be performed by three sets of liquid feed pumps without using the electromagnetic valve.

(3) In this embodiment, each time the substrate A is drained, the developing solution is supplied to the processing liquid nozzles 7a and 7b to wash the drain roller 15, but the substrate A is Cleaning may be performed every time a plurality of substrates are processed, or may be cleaned only before the continuous processing of the substrate A is completed and before the substrate processing apparatus 100 is stopped and before the continuous processing of the substrate A is started. good.

(4) In the present embodiment, the supply of the developing solution to the slit nozzle 5 and the slit nozzle 6 is stopped every time the processing of the substrate A is completed. Instead of stopping the supply, the supply of the developer may be stopped when the continuous processing is completed.

(5) In the present embodiment, the development processing using a developing solution has been described as an example of the processing liquid for processing the substrate A. However, the present invention can also be applied to substrate processing using a stripping liquid, an etching liquid, a rinsing liquid, or the like. .

[0048]

According to the first aspect of the present invention, the processing liquid is further supplied to the liquid layer of the processing liquid which has been processed and fatigued by the liquid replacement means, and the processing liquid on the substrate is replaced. At the same time, the processing liquid having undergone the liquid replacement is configured to be removed by the processing liquid removing means, so that contamination of the rinsing liquid in the processing liquid removing means and the rinsing section can be prevented.

According to the second aspect of the present invention, since the processing liquid supply port of the liquid layer forming means is arranged in the direction of transport of the substrate, the processing liquid can be statically supplied on the substrate. A uniform processing liquid layer can be formed on the substrate in a short time.

According to the third aspect of the present invention, since the processing liquid supply port of the liquid replacement means is arranged in the direction opposite to the substrate transfer direction, the liquid layer of the fatigued processing liquid on the substrate can be removed. It can be flushed in a short time to replace the liquid.

According to the fourth aspect of the present invention, the substrate is transported in an inclined posture during liquid replacement, so that liquid replacement can be performed in a shorter time.

According to the fifth aspect of the present invention, since the processing liquid removing means for removing the processing liquid remaining on the substrate is provided, the amount of the processing liquid brought into the rinsing section is reduced, and the life of the rinsing liquid is reduced. Can be extended.

According to the sixth aspect of the present invention, the processing liquid removing means is provided with the processing liquid supply means for supplying the processing liquid, so that the processing liquid remaining on the surface of the processing liquid removing means can be concentrated or solidified. By doing so, it is possible to prevent the substrate from being stained or damaged when the liquid is drained.

According to the seventh aspect of the present invention, the processing liquid is further supplied to the liquid layer of the processing liquid that has been processed and fatigued to replace the processing liquid on the substrate and to perform the liquid replacement. Since the processing liquid is configured to be removed from above the substrate, it is possible to prevent contamination of the processing liquid by a fatigued processing liquid in a step of removing the processing liquid or in a rinsing step.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram illustrating an embodiment of a substrate processing apparatus according to the present invention.

FIG. 2 is a schematic diagram for explaining details of a processing unit 2 of the substrate processing apparatus 1 according to the present invention.

FIG. 3 is a diagram illustrating a liquid removal roller 15 of the substrate processing apparatus according to the present invention.
FIG. 5 is a schematic view showing a state in which is washed.

FIG. 4 is a schematic diagram for explaining another embodiment of the processing liquid replacement unit in the present embodiment.

FIG. 5 is a schematic view showing a conventional device.

[Explanation of symbols]

 A Substrate 100 Substrate processing apparatus 1 Substrate introduction unit 2 Processing unit 3 Rinse unit 4 Drying unit 5 Slit nozzle 6 Slit nozzle 7 Processing liquid nozzle 9 Developing solution tank 10 Transport roller 11 Liquid feed pump 13 Liquid feed pump 14 Solenoid valve 15 Liquid drain Roller 16 Rinse liquid tank 130 Center support roller 150 Support roller

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/306 H01L 21/30 569D 21/68 569E 21/306 R (72) Inventor Kenji Usui Kamigyo, Kyoto 4-chome Tenjin, Horikawa-dori-Terauchi-ku, Tenjin Kita-machi 1 Dai-Nihon Screen Manufacturing Co., Ltd. F term (reference) 3B201 AA02 AB14 BA08 BB21 BB92 CB15 CC01 CC12 CC14 CD22 5F031 CA05 CA20 GA53 MA23 MA24 NA04 5F043 BB27 CC12 DD13 EE07 EE36 EE40 5F046 LA11

Claims (7)

[Claims] 1. A substrate processing apparatus for performing processing by transporting a substrate in a predetermined direction, comprising: transport means for transporting the substrate; supplying a processing liquid to the surface of the substrate to be transported; A liquid layer forming means for forming a layer; a liquid replacement means for further supplying a processing liquid to the substrate surface treated with the processing liquid to replace the liquid layer of the processing liquid; A substrate processing apparatus, comprising: a processing liquid removing means for removing. 2. The liquid layer forming means includes a slit having a processing liquid supply port extending along a direction perpendicular to the substrate transport direction, and a processing liquid supply port inclined with respect to the substrate transport direction. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is a nozzle. 3. The liquid replacement means has a processing liquid supply port extending along a direction orthogonal to the substrate transfer direction, and the processing liquid supply port is inclinedly disposed in a direction opposite to the substrate transfer direction. 3. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is a slit nozzle. 4. A liquid replacement means, comprising: a posture changing means for changing a substrate conveyed by a substrate conveyance means from a horizontal posture to an inclined posture; 3. The substrate processing apparatus according to claim 1, further comprising a slit nozzle having a processing liquid supply port formed along the slit. 5. The substrate processing apparatus according to claim 1, wherein said processing liquid removing means comprises a liquid removing roller disposed in a direction orthogonal to a direction in which the substrate is transported. 6. The substrate processing apparatus according to claim 5, wherein the processing liquid removing unit includes a processing liquid supply unit that supplies a processing liquid to the surface of the liquid draining roller after draining. 7. A substrate processing method for forming a liquid layer of a processing liquid on a surface of a substrate conveyed in a predetermined direction and performing processing by supplying a processing liquid to the surface of the conveyed substrate to form a liquid layer. A step of processing, a step of supplying a processing liquid further to the substrate surface treated with the liquid layer of the processing liquid, and replacing the liquid layer of the processing liquid formed on the surface of the substrate, and a processing of the surface of the liquid-substituted substrate Removing the liquid; and a substrate processing method.