ITMI913385A0 - Procedimento per la realizzazione di strutture metrologiche particolarmente per la misura diretta di errori introdotti da sistemi di allineamento - Google Patents
Procedimento per la realizzazione di strutture metrologiche particolarmente per la misura diretta di errori introdotti da sistemi di allineamentoInfo
- Publication number
- ITMI913385A0 ITMI913385A0 IT91MI3385A ITMI913385A ITMI913385A0 IT MI913385 A0 ITMI913385 A0 IT MI913385A0 IT 91MI3385 A IT91MI3385 A IT 91MI3385A IT MI913385 A ITMI913385 A IT MI913385A IT MI913385 A0 ITMI913385 A0 IT MI913385A0
- Authority
- IT
- Italy
- Prior art keywords
- creation
- procedure
- direct measurement
- alignment systems
- errors introduced
- Prior art date
Links
- 238000005259 measurement Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITMI913385A IT1252539B (it) | 1991-12-18 | 1991-12-18 | Procedimento per la realizzazione di strutture metrologiche particolarmente per la misura diretta di errori introdotti da sistemi di allineamento. |
EP92121246A EP0547543A1 (en) | 1991-12-18 | 1992-12-14 | Process for producing metrological structures particularly for direct measurement of errors introduced by alignment systems |
JP4337430A JPH05267430A (ja) | 1991-12-18 | 1992-12-17 | アライメントシステムによって導入されたエラーの直接の測定に特定的に適した計測学的構造を生産するための方法 |
US08/363,231 US5622796A (en) | 1991-12-18 | 1994-12-22 | Process for producing metrological structures particularly for direct measurement of errors introduced by alignment systems |
US08/475,804 US5985494A (en) | 1991-12-18 | 1995-06-07 | Metrological structures particularly for direct measurement of errors introduced by alignment systems |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITMI913385A IT1252539B (it) | 1991-12-18 | 1991-12-18 | Procedimento per la realizzazione di strutture metrologiche particolarmente per la misura diretta di errori introdotti da sistemi di allineamento. |
Publications (3)
Publication Number | Publication Date |
---|---|
ITMI913385A0 true ITMI913385A0 (it) | 1991-12-18 |
ITMI913385A1 ITMI913385A1 (it) | 1993-06-18 |
IT1252539B IT1252539B (it) | 1995-06-19 |
Family
ID=11361359
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITMI913385A IT1252539B (it) | 1991-12-18 | 1991-12-18 | Procedimento per la realizzazione di strutture metrologiche particolarmente per la misura diretta di errori introdotti da sistemi di allineamento. |
Country Status (4)
Country | Link |
---|---|
US (2) | US5622796A (it) |
EP (1) | EP0547543A1 (it) |
JP (1) | JPH05267430A (it) |
IT (1) | IT1252539B (it) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6381013B1 (en) * | 1997-06-25 | 2002-04-30 | Northern Edge Associates | Test slide for microscopes and method for the production of such a slide |
DE19925831A1 (de) * | 1999-06-07 | 2000-12-14 | Inst Halbleiterphysik Gmbh | Verfahren zur Messung des Positionierungsfehlers von Strukturmustern |
DE10142316A1 (de) * | 2001-08-30 | 2003-04-17 | Advanced Micro Devices Inc | Halbleiterstruktur und Verfahren zur Bestimmung kritischer Dimensionen und Überlagerungsfehler |
US6772084B2 (en) * | 2002-01-31 | 2004-08-03 | Timbre Technologies, Inc. | Overlay measurements using periodic gratings |
US6804005B2 (en) * | 2002-05-02 | 2004-10-12 | Timbre Technologies, Inc. | Overlay measurements using zero-order cross polarization measurements |
DE10224164B4 (de) * | 2002-05-31 | 2007-05-10 | Advanced Micro Devices, Inc., Sunnyvale | Eine zweidimensionale Struktur zum Bestimmen einer Überlagerungsgenauigkeit mittels Streuungsmessung |
US7116519B2 (en) * | 2003-12-15 | 2006-10-03 | International Business Machines Corporation | Patterning of integrated closure for implementing pads connected to lapping elements |
US7368731B2 (en) * | 2005-09-30 | 2008-05-06 | Applied Materials, Inc. | Method and apparatus which enable high resolution particle beam profile measurement |
CN106842814A (zh) * | 2017-01-06 | 2017-06-13 | 中国科学院物理研究所 | 一种纳米间隙的制备方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4125427A (en) * | 1976-08-27 | 1978-11-14 | Ncr Corporation | Method of processing a semiconductor |
US4399205A (en) * | 1981-11-30 | 1983-08-16 | International Business Machines Corporation | Method and apparatus for determining photomask alignment |
JPH0669031B2 (ja) * | 1984-07-17 | 1994-08-31 | 日本電気株式会社 | 半導体装置 |
JPS641232A (en) * | 1987-06-23 | 1989-01-05 | Mitsubishi Electric Corp | Method of measuring pattern overlay accuracy |
US5025303A (en) * | 1988-02-26 | 1991-06-18 | Texas Instruments Incorporated | Product of pillar alignment and formation process |
IT1251393B (it) * | 1991-09-04 | 1995-05-09 | St Microelectronics Srl | Procedimento per la realizzazione di strutture metrologiche particolarmente per l'analisi dell'accuratezza di strumenti di misura di allineamento su substrati processati. |
US5407763A (en) * | 1992-05-28 | 1995-04-18 | Ceridian Corporation | Mask alignment mark system |
-
1991
- 1991-12-18 IT ITMI913385A patent/IT1252539B/it active IP Right Grant
-
1992
- 1992-12-14 EP EP92121246A patent/EP0547543A1/en not_active Ceased
- 1992-12-17 JP JP4337430A patent/JPH05267430A/ja not_active Withdrawn
-
1994
- 1994-12-22 US US08/363,231 patent/US5622796A/en not_active Expired - Lifetime
-
1995
- 1995-06-07 US US08/475,804 patent/US5985494A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0547543A1 (en) | 1993-06-23 |
JPH05267430A (ja) | 1993-10-15 |
US5985494A (en) | 1999-11-16 |
US5622796A (en) | 1997-04-22 |
ITMI913385A1 (it) | 1993-06-18 |
IT1252539B (it) | 1995-06-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
0001 | Granted | ||
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19961227 |